Abstract: A method comprises depositing a first dielectric layer over a substrate, forming a first metal line and a second metal line in the first dielectric layer, wherein the first metal line and the second metal line are separated from each other by a width approximately equal to a width of the first metal line, applying an etching process to the first metal line and the second metal line to form a first trench and a second trench, depositing a liner layer over the first dielectric layer and forming a via over the first metal line, wherein a bottom of the via is in direct contact with a top surface of the first metal line and the bottom of the via is conformal to the first trench.

Abstract: A semiconductor device may include: a wiring layer formed over an interlayer dielectric layer; and one or more wiring characteristic control parts extended from the wiring layer into the interlayer dielectric layer. The bottom of the one or more wiring characteristic control parts may be positioned at a higher level than the bottom of the interlayer dielectric layer.

Abstract: Provided is a semiconductor device. A semiconductor chip is disposed on a substrate. A first magnetic substance, a second magnetic substance and a third magnetic substance which are spaced apart from one another are formed on the semiconductor chip. The first magnetic substance and the second magnetic substance can be adjacent an edge of the semiconductor chip. The third magnetic substance can be adjacent a center of the semiconductor chip. The third magnetic substance is between the first magnetic substance and the second magnetic substance.

Abstract: A semiconductor module of the present invention includes: a semiconductor element having a first main surface and a second main surface facing the first main surface, the semiconductor element including a front surface electrode and a back surface electrode on the first main surface and the second main surface, respectively; a metal plate electrically connected to the back surface electrode of the semiconductor element through a sintered bonding material including metal nanoparticles; and a plate-shaped conductor electrically connected to the front surface electrode of the semiconductor element through the sintered bonding material including the metal nanoparticles. The metal plate and the conductor include grooves communicating between a bonding region bonded to the semiconductor element and the outside of the bonding region.

Abstract: A method of fabricating a semiconductor assembly can include providing a semiconductor element having a front surface, a rear surface, and a plurality of conductive pads, forming at least one hole extending at least through a respective one of the conductive pads by processing applied to the respective conductive pad from above the front surface, forming an opening extending from the rear surface at least partially through a thickness of the semiconductor element, such that the at least one hole and the opening meet at a location between the front and rear surfaces, and forming at least one conductive element exposed at the rear surface for electrical connection to an external device, the at least one conductive element extending within the at least one hole and at least into the opening, the conductive element being electrically connected with the respective conductive pad.

Abstract: A semiconductor package of a POP structure includes first and second semiconductor packages, the second directly mounted on the first and containing a plurality of semiconductor chips. Chips in the second package are electrically connected via a through-electrode and the first and second packages are connected through a connection member disposed on the top surface of the first package.

Abstract: A multilayer device has a resin layer, a semiconductor device positioned in the resin layer and including an electronic component and a passivation layer having an opening exposing an electrode of the electronic component, an intermediate layer including metal layers and formed in the opening of the passivation layer such that the intermediate layer is connected to the electrode of the electronic component, and a buildup layer formed on the resin layer and including an insulating layer and a via conductor formed in the insulating layer such that the via conductor is connected to the intermediate layer. The resin layer includes one or more resin material selected from the group consisting of a thermosetting resin material and a thermoplastic resin material.

Abstract: A method and apparatus for providing a conductive structure adjacent to a damascene conductive structure in a semiconductor device structure. The semiconductor device structure includes an insulation layer with at least one damascene conductive structure formed therein, wherein the at least one damascene conductive structure includes an insulative, protective layer disposed thereon. The insulative material of the protective layer is able to resist removal by at least some suitable etchants for the insulative material of the insulation layer adjacent to the at least one damascene conductive structure. A self-aligned opening is formed by removing a portion of an insulation layer adjacent the at least one damascene conductive structure. The self-aligned opening is then filled with a conductive material to thereby provide another conductive structure adjacent to the at least one damascene conductive structure.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member, a first die attached to the support member, and a second die attached to the first die in a stacked configuration. The device can also include an attachment feature between the first and second dies. The attachment feature can be composed of a dielectric adhesive material. The attachment feature includes (a) a single, unitary structure covering at least approximately all of the back side of the second die, and (b) a plurality of interconnect structures electrically coupled to internal active features of both the first die and the second die.

Abstract: Various structures having a fuse and methods for forming those structures are described. An embodiment is a method. The method comprises attaching a first die to a first side of a component using first electrical connectors. After the attaching, at least one of (i) the first die comprises a first fuse, (ii) the first side of the component comprises a second fuse, (iii) a second side of the component comprises a third fuse, the second side being opposite the first side, or (iv) a combination thereof. The method further comprises after the attaching the first die to the first side of the component, blowing the first fuse, the second fuse, the third fuse, or a combination thereof.

Abstract: A semiconductor device and a method of fabricating the same includes providing a first semiconductor chip which has first connection terminals, providing a second semiconductor chip which comprises top and bottom surfaces facing each other and has second connection terminals and a film-type first underfill material formed on the bottom surface thereof, bonding the first semiconductor chip to a mounting substrate by using the first connection terminals, bonding the first semiconductor chip and the second semiconductor chip by using the first underfill material, and forming a second underfill material which fills a space between the mounting substrate and the first semiconductor chip and covers side surfaces of the first semiconductor chip and at least part of side surfaces of the second semiconductor chip.

Abstract: A fan-out package structure including a heat radiating side edge that includes a semiconductor substrate; a bond pad located on the semiconductor substrate; and a redistribution layer connected with the bond pad and located on the semiconductor substrate, wherein an end of the redistribution layer extends to a sidewall of the semiconductor substrate, and the end is coplanar with the sidewall.

Abstract: A manufacturing method of a semiconductor device according to the present invention includes the steps of (a) preparing an insulating or conductive substrate; (b) arranging a bonding material having sinterability in at least one bonding region of a principal surface of the substrate (i.e., insulating substrate); and (c) sintering the bonding material while a bonding surface to be subjected to bonding of at least one semiconductor element is brought into pressurized contact with the bonding material, and bonding the substrate (i.e., insulating substrate) and the semiconductor element together through the bonding material. The bonding region in the step (b) is inwardly positioned from the bonding surface (i.e., region) of the semiconductor element in plan view, and the bonding material is not protruded outwardly from the bonding surface of the semiconductor element in plan view even after the step (c).

Abstract: A gel has improved thermal stability and is the hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a hydrosilylation catalyst and (D) a phthalocyanine. The (D) phthalocyanine is present in an amount of from about 0.05 to about 30 weight percent based on a total weight of (A) and (B). The gel has a hardness of less than about 1500 grams as measured after heat ageing at 225° C. for 1000 hours that is calculated as a weight required to insert a TA-23 probe into the gel to a depth of 3 mm.

Abstract: A low dispersion scent sampler for point of sale display has a housing with a front panel to which a label advertising products sold at the point of sale may be affixed. Inside of the housing is a blower connected to a timer control circuit and battery through a pushbutton actuated switch. A scented material is provided in the air flow path from the blower to one or more exhaust ports. When the pushbutton is pressed by a consumer, the blower turns on for a brief period of time to force air over the scented material and then through the exhaust ports for sampling of the scent emitted by the scented material. The on time for the blower is brief to limit exposure to the scent to the space occupied by the consumer.

Abstract: A volatile substance delivery system includes a volatile substance container to contain a volatile substance, a volatile substance delivery structure, and a volatile substance drop delivery system to deliver a drop of the volatile substance to the volatile substance delivery structure for delivery to an ambient environment.

Abstract: A dispensing system includes a refill having a reservoir for containing a volatile material. A permeable membrane is disposed over the reservoir and allows the volatile material to be released therethrough. The dispensing system also includes a housing adapted to retain the refill and a manual drive mechanism, which is in communication with the refill. Actuation of the manual drive mechanism causes the refill to rotate more than 180° about a longitudinal axis.

Abstract: A jet array aeration apparatus includes a pump, an inlet pipe, an air inlet duct and an outlet pipe installed sequentially. The air inlet duct is a multi-way duct containing an aeration structure which includes a jet ring and a ring-shaped air inlet space formed between the outer wall of the jet ring and the inner wall of the air inlet duct and interconnected to the outlet pipe. The jet ring has plural array via holes for dividing a circular water column flowing through the jet ring into gear-shaped water columns and forming an array vacuum negative-pressure area, so that a large amount of air may be sucked through the air inlet duct to form a large quantity of air bubbles, so as to achieve the aeration effect.

Abstract: A foaming mechanism configured to receive a plurality of streams of gas and generate a foamed liquid, having an aerodynamic component and an aerodynamic housing disposed around at least a portion of the aerodynamic component. The aerodynamic housing includes a plurality of first channels and a plurality of second channels connected to the plurality of first channels at regular intervals on a distributed plane. The distributed plane is about perpendicular to the plurality of first channels, wherein the plurality of first channels and the plurality of second channels are configured to transform an axial stream of the gaseous working agent into a plurality of radial high-speed streams of the gaseous working agent by channeling the gaseous working agent through the plurality of first channels and into the plurality of second channels on the distributed plane.

Abstract: A fill in a rectilinear evaporative cooling tower includes a grid, grid support, module radial support, module column and module girts. The grid is to support a plurality of splash bars. The grid support is configured to provide support for the grid. The module support is configured to provide support for the grid support. The module column is configured to provide support for the module support. The module girts is configured to rest on a fill support frame of the rectilinear evaporative cooling tower and configured to provide support for the module columns.

Abstract: Condensing apparatuses and their use in various heat and mass exchange systems are generally described. The condensing apparatuses, such as bubble column condensers, may employ a heat exchanger positioned external to the condensing vessel to remove heat from a bubble column condenser outlet stream to produce a heat exchanger outlet stream. In certain cases, the condensing apparatus may also include a cooling device positioned external to the vessel configured and positioned to remove heat from the heat exchanger outlet stream to produce a cooling device outlet stream. The condensing apparatus may be configured to include various internal features, such as a vapor distribution region and/or a plurality of liquid flow control weirs and/or chambers within the apparatus having an aspect ratio of at least 1.5. A condensing apparatus may be coupled with a humidifier to form part of a desalination system, in certain cases.

Abstract: A fill in an evaporative cooling tower includes a grid, grid support, module radial support, module column and module radial girts. The grid is to support a plurality of splash bars. The grid support is configured to provide support for the grid. The module radial support is configured to provide support for the grid support. The module column is configured to provide support for the module radial support. The module radial girts is configured to rest on a fill support frame of the evaporative cooling tower and configured to provide support for the module columns.

Abstract: Device and method for producing a plurality of microlenses from a lens material. The method includes: applying lens material intended for the embossing of the microlenses to a plurality of first lens molds distributed on a first embossing side of a first die for embossing of the microlenses, moving the first die and a second die located essentially parallel, in an X-Y plane, and opposite the first die, on top of one another in a Z-direction running essentially perpendicular to the X-Y plane, embossing the microlenses by shaping and curing the lens material, the shaping taking place by moving the first and second embossing sides on top of one another, up to a thickness D1 of the lens material in the Z-direction, wherein the lens material of each microlens at least during curing is separate from the lens material of each microlens which is adjacent in the X-Y plane.

Abstract: The polarization of nuclear spins of a material may be enhanced by encapsulating the material within a reverse micelle.

Abstract: A method for manufacturing an antimicrobial filament fibre includes the following steps of: mixing diiodomethyl p-tolyl sulfone with a plastic mother particle so that the particle contains diiodomethyl p-tolyl sulfone; and melt-spinning the particle to form the antimicrobial filament fibre.

Abstract: Disclosed is a method of fabricating a graphite sheet, including: polymerizing diamines and a dianhydride to form a polyamic acid. The polyamic acid is solvent casted on a substrate and hot baked to form a polyamic acid film or gel film. The polyamic acid film or gel film is biaxially stretched at a high temperature imidization or chemical imidization to form the polyimide film. The polyimide film is then carbonized and graphitized to form a graphite sheet. The diamines include a diamine of Formula 1 and a diamine of Formula 2, and the dianhydride includes a dianhydride of Formulae 3, Formula 4, Formula 5, Formula 6, Formula 7, Formula 8, Formula 9, or combinations thereof.

Abstract: The process of preparing a middle ear prosthesis of polymeric material by injection moulding technology according to the presented invention is characterized by drying the thermoplastic polymer granules, preferably high density polyethylene or polyamide or polysulphone, at a temperature in the range of 60 to 150° C. for a period of 2 to 8 hours. Subsequently granules are plasticized and then injected at a temperature between 180 and 400° C. into the mold heated to a temperature between 60 and 150° C. Then obtained moulder is cooled and in the final stage it is hermetically packed in a vacuum and sterilized. In addition, the granules of the thermoplastic polymer composite are used, obtained by addition of bactericidal additive introduced into the thermoplastic polymer granules, preferably a silver powder with a particle size from 15 to 100 nm, in an amount of 0.1-3 wt %.

Abstract: This invention relates to a method and apparatus for leveling a three dimensional printing platform. In one embodiment of the invention, the printer assembly is provided with a sensor for determining the distance between the sensor and the printing platform or plate. Inasmuch as printer assembly is movable about an X-Y plane above the plate, printer assembly may move to determine the distance between the sensor and printing plate at several different areas of the plate. A control system then calculates the relative adjustments necessary to move the corners of the plate to make the plate horizontally level. A set of four threaded rods with attached motors may be provided to move the associated four corners of the plate vertically to adjust the overall level of the plate.

Abstract: This invention relates to providing a printing assembly having a small hopper and a heating element disposed therein. The small hopper is configured to receive a plurality of pellets therein and feed the pellets to the heating element. The heating element melts the pellets to form a molten material for use in three dimensional printing. A large hopper may be provided to store a large amount of pellets. The large hopper may include a door which may be automatically abuttably opened by the printer assembly when a sensor indicates the pellets are below a particular threshold and the printer assembly is in need of additional pellets.

Abstract: An insulator, especially a sound insulator, can be manufactured by introducing and mixing constituent compounds of a basis material for the insulator with masses to form an insulator mixture. The insulator mixture is formed into the insulator by a suitable mold or tool so that the masses are distributed within the insulator mixture. A catalyst can be included to control curing characteristics of the insulator.

Abstract: A method of making a foam manikin with a stand is provided. The method includes sculpting a sculpture of the manikin and forming the sculpture around a mating portion. Then a mold is formed using the sculpture. The mold may include an opening that is formed around the mating portion. The mold may be made in a plurality of pieces and may be taken apart and put back together. To form the manikin, the mold is secured around the mating portion and the mold is filled with a foam. Once filled with foam, the manikin is formed with at least a portion of the mating portion embedded within. The mating portion may be releasably attached to a stand so that the manikin may stand in an upright position.

Abstract: A method of fabricating a foamed, injection-molded component is provided. The method includes the step ofplasticizing pellets including a first polymeric material and a second polymeric material within an injection barrel to form an injection material. The first polymeric material defines a first phase of the injection material and the second polymeric material defines a second phase of the injection material. The first and second phases of the injection material are immiscible. The injection material is injected into a mold to fabricate the foamed injection-molded component having microscale, microcellular voids. Upon tensile loading, submicron, secondary phase cavities are formed in the injection-molded component, resulting in improved ductility and toughness.

Abstract: A method of making a sandwich-type, compression-molded, composite component having improved surface appearance is provided. Reinforced thermoplastic skins, first and second sheets of thermoplastic adhesive and a cellulose-based core of a blank or stack of sandwich materials are heated to a softening temperature of the thermoplastics. The heated blank or stack is allowed to cool in the mold cavity until inner surfaces of the skins are bonded to top and bottom surfaces of the core by the sheets to seal core cavities. Air in the sealed cavities urges softened portions of the sheets and portions of the core inwardly towards the cavities of the core as the air in the cavities cools to inhibit debossing and improve surface appearance of a first outer surface of the blank or stack.

Abstract: The present invention is related to a process of recycling fiber-reinforced polymeric material including the following steps: a) crushing the material so as to reduce it into fragments; b) mixing the material obtained in the previous step with a liquid adhesive; c) pouring the mixture obtained in step b) into a mold; d) applying a pressure. In particular, the mixing step b) is carried out by nebulizing some adhesive and simultaneously stirring the particles of the fiber-reinforced polymeric material so that a thin layer of adhesive will deposit on the surface of basically each particle of the fiber-reinforced polymeric material. Furthermore, the present invention relates to an apparatus for carrying out the process.

Abstract: A recycling method of waste fishnet is provided. The waste fishnet is processed with steps of cutting, removing impurities, cleaning, and drying to form fishnet chips. The recycling method of waste fishnet includes the following steps. The fishnet chips are mixed with nylon-66, wherein the fishnet chips are of 70% by weight, and nylon-66 is of 30% by weight. The mixture is heated and molten. The molten mixture is then processed with the step of granulation. The grains are then processed with the step of spinning. Thereby, the waste fishnet can be recycled and transferred into useful plastic materials.

Abstract: A manufacturing process for rice husk fiber synthetic resin powder includes grinding rice husks into rice husk powder, feeding the powder into a mixer, adding and uniformly mixing cellulose, starch, and water, removing and cooling the mixture into rice husk fiber powder; additionally putting natural resin and lignin into a reaction kettle, adding water and agitating uniformly into slurry, adding nano-silica and continuing agitating evenly, and after cooling, adding the rice husk fiber powder and continuing the agitation, cooling and removing the mixture, thus obtaining a paste material; and injecting the paste material into a flash drier to produce rice husk fiber synthetic resin powder. The rice husk fiber synthetic resin powder can be used to make rice husk fiber products such as tableware, toys, furniture and kitchenware that have good physical properties and are degradable into organic fertilizer, thereby being environmentally friendly and commercially promising.

Abstract: A method for producing a textile preform includes manufacturing a multi-layer fiber fabric, which includes a first flange portion and a web portion connected to the first flange portion, deforming a first fiber layer of the first flange portion with respect to the web portion, such that the first fiber layer is at a first flange portion angle to the web portion, a web height of the web portion being set in a variable manner during the deformation of the first fiber layer, and depositing a unidirectional fiber fabric only on the deformed first fiber layer of the first flange portion.

Abstract: Fit and finish methods using shape memory polymers (“SMP”) are disclosed herein. In an example of the fit and finish method, a first part and a second part are positioned adjacent to one another such that a shape memory polymer in a temporary shape is adjacent to a gap between the first part and the second part. The SMP is heated to a switching temperature of the SMP, which causes the SMP to initiate conversion to a permanent shape so that the SMP extends into the gap to close the gap between the first part and the second part.

Abstract: A mold includes a top portion, and an edge ring having a ring-shape. The edge ring is underlying and connected to edges of the top portion. The edge ring includes air vents. The edge ring further encircles the inner space under the top portion of the mold. A plurality of injection ports is connected to the inner space of the mold. The plurality of injection ports is substantially aligned to a straight line crossing a center of the top portion of the mold. The plurality of injection ports has different sizes.

Abstract: The present invention relates inter alia to an apparatus for providing a coiled collagen carrier. An apparatus according to the invention preferably comprises a device for applying moisture to a collagen carrier prior to coiling of the collagen carrier and a coiling device. The coiling device preferably comprises rotatable gripping means for gripping the collagen carrier along an edge and coiling the collagen carrier, and a support device supporting the collagen carrier while being coiled. In another aspect, the invention relates to a production facility wherein an apparatus according to invention is arranged.

Abstract: Disclosed herein, amongst other things, is a method of transferring a molded article from a moveable mold half of a mold into a receptacle of a post-mold tool. The method includes positioning the moveable mold half relative to the post-mold tool to position the molded article thereon closer to the receptacle and retracting the moveable mold half while simultaneously extending a stripping device to eject the molded article from the moveable mold half and to transfer it into the receptacle.

Abstract: Devices, systems, methods and computer program products are disclosed that facilitate part layer curing by an additive manufacturing device wherein each element of the part layer is exposed to light from a light source until the element receives sufficient energy to cure. In an aspect, received energy is calculated based on both the light received directly from the light source and light received from surrounding elements due to dispersion and other effects. The present disclosure enables consistent curing across a part layer, facilitate the creation of sharp outer structures, and allow fragile structures to be built alongside larger structures without a loss of quality, clarity, or resolution.

Abstract: A method for preparing a cubic phase Li7La3Zr2O12 (LLZ) includes dry-mixing Li2CO3, La2O3, ZrO2 and Al2O3. The mixture is fired at 800° C. to 1,000° C. for 5 to 7 hours, naturally cooled, and dry-mixed. A pellet having a size from 8 mm to 12 mm at 120 MPa to 150 MPa is manufactured using the mixture. Then, the pellet is fired at 1,000° C. to 1,250° C. for 20 to 36 hours.

Abstract: Provided are: a capsule for non-ferrous metal collection that can collect a non-ferrous metal; and a method for collecting a non-ferrous metal using same. The capsule for non-ferrous metal, collection comprises capsule contents and a covering section covering the capsule contents, and collects a non-ferrous metal within the capsule for non-ferrous metal collection by means of the capsule for non-ferrous metal collection being immersed in a solution containing a non-ferrous metal.

Abstract: An apparatus and method for multi-stage printing teaches means for removing and replacing a printed component during the printing process and accurately placing the component in the printer for continuation of the printing process. This can be accomplished through the use of a scanner, probe machine, or scanning Additionally, the present invention teaches the use of heating means in combination with a 3D printer to overcome additional issues with multi-sage printing.

Abstract: A powder shaping method comprises: providing a powder on a target surface; providing a laser beam to illuminate the powder so as to form a pre-treated powder; and providing an energy beam to illuminate the pre-treated powder for enabling a shaping process. In addition, a powder shaping apparatus comprises a base, a target surface, a powder supply unit and an energy beam source system. The target surface is disposed on the base and can be fixed or moved on the base. The powder supply unit provides a powder on the target surface. The energy beam source system has a laser source and an energy source, the laser source provides a laser beam to illuminate the powder to form a pre-treated powder, and the energy source provides an energy beam to further illuminate the pre-treated powder to make a shaping process.

Abstract: A device to measure a temperature of molten metal may include an infrared sensor effective to measure the temperature of the molten metal, a sheath having an open end, a sealed end, and a channel extending from the open end to the sealed end, and an infrared-transparent window disposed between the infrared sensor and the channel of the sheath. The open end of the sheath is disposed near the infrared sensor and the sealed end of the sheath extends into the molten metal. The infrared-transparent window or rod is disposed between the infrared sensor and the channel of the sheath such that the infrared sensor can measure the temperature through the infrared-transparent window or rod, the channel, and the sealed end. The infrared-transparent window or rod seals the infrared sensor from the channel in the sheath.

Abstract: The invention relates to a device having a bottom, side walls and a ceiling, which together define a channel, as well as transportation means, extending in an axial direction of said channel from an entry port of the channel to an exit port of said channel, for transferring a metallurgical material from said entry port to said exit port.

Abstract: A reaction vessel for making phlegmatized metal powder or alloy powder has a retort crucible with a heat-proof, coolable cover, a heatable reduction furnace into which the retort crucible may be inserted, and an inner crucible placed within the retort crucible and removable therefrom. At least one inlet is built into the coolable cover for adding a passivating gas. A heat-proof flange welded onto the retort crucible attaches the retort crucible to the heat-proof, coolable cover. A cooler welded onto a lower face of the heat-proof flange provides a cooling agent to the reaction vessel.

Abstract: A chattering vibration preventing jig is made of metal, and is L-shaped as viewed from the side. A horizontal plate portion has a pair of cuts extending in the short-side direction from an end of the horizontal plate portion. A vertical plate portion has a plurality of screw holes arranged in a line in the long-side direction. Screws slightly longer than lengths of the screw holes are screwed into the corresponding screw holes to abut onto a workpiece. Adhesive is applied to abutment surfaces of the screws that abut onto the workpiece.