Abstract: A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate.

Abstract: A heat-dissipating mobile terminal includes a main body, a heat dissipating member positioned in the main body, and a back cover detachably connected to the main body. The main body includes a heat-producing element and the heat dissipating member includes a heat radiator arranged above the heat-producing element. The back cover defines a perforated portion above the heat dissipating member. The heat radiator is integrated with the main body. The heat radiator is exposed to external cooler air by the perforated portion in the back cover. The mobile terminal of the present disclosure effectively improves heat radiating efficiency and reduces cost.

Abstract: A vehicle entertainment system includes a tablet unit and a cradle. The tablet unit includes a display and a touch screen input device disposed on a front surface, a first electrical connection, a first mounting mechanism, and a wireless receiver. The wireless receiver is configured to receive media data from a wireless network and the touch screen input device is configured to receive input from a user. The cradle is disposed in a headrest in a vehicle and includes a second electrical connection and a second mounting mechanism. The tablet unit is electrically connected to the cradle via the first and second electrical connections, and is physically coupled to the cradle via the first and second mounting mechanisms upon mounting the tablet unit to the cradle.

Abstract: An apparatus includes a frame forming a bay for receiving an electronic module having a blind mate connector for coupling with a chassis connector. An actuator is slidably secured to the frame and forms a push button, an intermediate actuation member, and a distal actuation member. A spring latch is biased to latch the module in place. An ejection lever is pivotally secured to one side of the bay, and has a first end aligned with the distal actuation member and a second end disposed to engage the module. Pushing the push button causes the intermediate actuation member to withdraw the spring latch from the bay and then causes the distal actuation member to pivot the ejection lever to unseat and eject the module.

Abstract: A heat exchange device that is coupled to an electronic device that includes an electronic component that generates heat, the heat exchange device includes: a first-channel through which a first-coolant that cools the electronic component flows; a heat-exchange-unit that performs heat exchange between the first-coolant and a second-coolant; a second-channel through which the second-coolant-flows; a first-coolant-detection-unit that detects leakage of the first-coolant from the first-channel; a collection-unit that collects the first-coolant that is leaked from the first-channel; a storage-unit that is provided in the first-channel and supplies the stored first-coolant to the first channel; a recovery-unit that is provided between the collection-unit and the storage-unit; and a control-unit that causes the recovery-unit to recover the first-coolant that is collected by the collection unit, into the storage-unit when the first-coolant-detection-unit detects leakage of the first-coolant.

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract: A module IC package structure for increasing heat-dissipating efficiency includes a substrate unit, an electronic unit, a package unit, a first heat-dissipating unit and a second heat-dissipating unit. The substrate unit includes a circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate for enclosing the electronic components. The first heat-dissipating unit includes a heat-dissipating base layer disposed on the top surface of the package gel body. The second heat-dissipating unit includes a plurality of heat-dissipating auxiliary layers disposed on the top surface of the heat-dissipating base layer. Whereby, the heat-dissipating efficiency of the module IC package structure can be increased by matching the heat-dissipating base layer and the heat-dissipating auxiliary layers.

Abstract: There are provided an electronic component module allowing for a circuit wiring to be disposed outside of a molded part by a plating process, and a manufacturing method thereof, the electronic component module including a substrate; at least one electronic component mounted on the substrate; a molded part sealing the electronic component; a plurality of conductive connectors having one ends bonded to the substrate or one surface of the electronic component and formed in the molded part to penetrate through the molded part; and at least one plane pattern formed on an outer surface of the molded part and electrically connected to at least one of the conductive connectors.

Abstract: In a semiconductor device, heat radiation plates are respectively disposed on a front surface side and a rear surface side of semiconductor chips in an upper arm and a lower arm. A lead-out conductor part includes a parallel conductor that includes a positive electrode terminal, a negative electrode terminal, and an insulating film disposed between the positive electrode terminal and the negative electrode terminal, and the positive electrode terminal and the negative electrode terminal are disposed oppositely while sandwiching the insulation film. The semiconductor chips are covered by a resin mold part, surfaces of the heat radiation plates opposite to the semiconductor chips, a part of the positive electrode terminal, and a part of the negative electrode terminal are exposed from the resin mold part, and at least a part of the parallel conductor in the lead-out conductor part enters the resin mold part.

Abstract: An inverter device includes a heat dissipation casing having a principal surface, heat dissipation fins arranged on an opposite side to the principal surface, a first concave portion provided adjacent to a region corresponding to the heat dissipation fins on the principal surface, and a second concave portion provided adjacent to the region corresponding to the heat dissipation fins on the principal surface, a semiconductor module arranged in the region corresponding to the heat dissipation fins on the principal surface and including a diode module and an inverter module, an inrush-current suppression resistor sealed by a sealing material in the first concave portion and electrically connected between the diode module and the inverter module, and a regenerative resistor sealed by the sealing material in the second concave portion and electrically connected between the diode module and the inverter module.

Abstract: A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device.

Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

Abstract: A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package.

Abstract: A foldable package structure including a first substrate, a second substrate, a plurality of adhesive layers and at least one environmental-sensitive electronic component is provided. At least one of the first and second laminated substrates comprises an ultra-thin glass plate. The foldable package structure comprises a predetermined folded region and the ultra-thin glass plate is disposed at one side of the predetermined folded region and stays away from the predetermined folded region.

Abstract: A flexible display device includes: a flexible display panel configured to display an image; a dielectric elastomer film disposed on a portion of the flexible display panel; a first electrode layer disposed on an upper portion of the dielectric elastomer film; and a second electrode layer disposed on a lower portion of the dielectric elastomer film, the first electrode layer includes a plurality of first electrodes, each of the plurality of first electrodes disposed apart from each other, the second electrode layer includes a plurality of second electrodes, each of the plurality of second electrodes disposed apart from each other.

Abstract: Disclosed herein are a three-dimensional stretchable electronic device and a manufacturing method comprising the same, wherein the three-dimensional stretchable electronic device is configured such that a connection line is positioned therein and thus can be protected from the outside, and the connection line is made of a liquid metal so there is no change in volume of the connection line upon stretching. Additionally, elements can be transferred to both sides of the substrate, thus increasing the degree of integration.

Abstract: The invention concerns a method for production of electronic assembly (1) with 1.1 Supply of an electrically-conducting film (3), especially a support film (3a), 1.2 Supply of at least one electrical component (5) with at least one electrical contact site (5c), 1.3 Application of an adhesive (20) between the electrical component and a surface (30) of the electrically-conducting film, 1.4 Arrangement of the at least one component (5) with the at least one electrical contact site (5c) on the surface (30) of the electrically-conducting film (3) and fastening of the at least one component by formation of an adhesive joint between the electrical component and the surface, 1.5 Supply of the support (9), especially from a flexible material, 1.

Abstract: An enclosure with a substantially continuous seal about its perimeter for protecting electronic components of a model vehicle, comprising a housing with one or more walls at least partially surrounding the electronic components, a cover having one or more walls surrounding the perimeter of the housing, and one or more seal members interposed between the housing perimeter walls and the cover perimeter walls, wherein the cover perimeter walls are configured to contact the seal members against the housing perimeter walls to create a watertight barrier configured to provide protection ranging from water-resistant to waterproof.

Abstract: Embodiments of the inventive concept include a semiconductor device having a circuit board including a first outer layer, a contact region in the first outer layer, a second layer formed on an opposite side of the first outer layer, a via-hole, and a plurality of inner layers formed to be stacked between the first layer and the second layer. A case may accommodate the circuit board. The case may have a projection portion that is configured to come in contact with the circuit board in the contact region. The plurality of inner layers may include a ground layer. The first outer layer may be connected to the ground layer through a via-hole. The case may be connected to the ground layer through the first outer layer.

Abstract: An electronic device includes a circuit board, a connector and a noise suppression assembly. The circuit board includes a substrate having a surface layer. The connector is disposed on the circuit board and has at least one electrical pin. The noise suppression assembly includes a wiring area located on the surface layer and adjacent to the connector and a conductive cover member. The wiring area includes at least one electrical contact, a transmission circuit and at least one ground contact, the electrical contact is used for being in electrical contact with the electrical pin of the connector. The transmission circuit is electrically connected to the electrical contact. The ground contact is located around the wiring area. The conductive cover member has a cover plate and at least one lateral plate. The lateral plate is connected to the cover plate for forming a shielded space.

Abstract: The electrical device (2, 202) according to the invention comprises a first electrical component (4) and a second electrical component (6) connected to each other via an electrical connection means (26) having an electrically insulating support plate (24), and a weld joint (22) deposited on the support plate (24). The weld joint (22) has a melting temperature (TO significantly lower than an ambient operating temperature (Ta) to which at least one of the two electrical components and the electrical connection means (26) are provided to be subjected. The electrical device (2) comprises a cement (28) that completely covers the exposed weld joint (22), the material of the cement (28) being chosen to maintain its adhesion and its tightness with respect to the weld joint (22) when the ambient operating temperature (Ta) is applied.

Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.

Abstract: A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area.

Abstract: A method which comprises arranging a plurality of electronic chips in a plurality of chip accommodation cavities each defined by a respective surface portion of a substrate and a wall delimited by a respective one of a plurality of holes in an electrically conductive frame arranged on the substrate, at least partially encapsulating the electronic chips in the chip accommodation cavities by an encapsulant, and forming electrically conductive contacts for electrically contacting the at least partially encapsulated electronic chips.

Abstract: An electronic module (20, 39, 60, 80, 132, 140, 144) includes a substrate (21), which includes a dielectric material having a cavity (40, 42, 134, 142) formed therein. First conductive contacts (44) within the cavity are configured for contact with at least one first electronic component (32) that is mounted in the cavity. Second conductive contacts (44) on a surface of the substrate that surrounds the cavity are configured for contact with at least a second electronic component (28, 30) that is mounted over the cavity. Conductive traces (36, 48) within the substrate are in electrical communication with the first and second conductive contacts.

Abstract: A board for mechanically supporting and electrically connecting electronic components includes a non-conductive substrate, a plurality of electrically conductive traces and pads disposed on the non-conductive substrate, and a solder mask applied to the non-conductive substrate and covering the traces. Metal lines are disposed on the non-conductive substrate under the solder mask and along at least two sides of the pads disposed in corners of the non-conductive substrate, so that a metal line is interposed between the pads in the corners of the non-conductive substrate and each adjacent pad. The metal lines form a raised region in the solder mask along the metal lines which prevents solder bridging in the corners of the non-conductive substrate during solder reflow. A corresponding semiconductor package and semiconductor assembly with such solder bridging prevention structures are also provided.

Abstract: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming a first through hole through the thermal pad, the second dielectric layer, the at least one conductive layer, and the first dielectric layer. The fabricating includes filling the first through hole with a conductive material to form a plated through hole. The fabricating includes topdrilling the plated through hole to remove a top portion of the conductive material from a top of the plated through hole, wherein a bottom portion of the conductive material remains in the plated through hole after removal of the top portion.

Abstract: This process for manufacturing an electrically conductive member for an electronic component comprises the following steps: providing a structure comprising at least one blind hole having a bottom and at least one internal lateral flank connected to said bottom via a base of said lateral flank; forming the member, this forming step comprising a step of growing an electrically conductive material in order to form at least one portion of the member in the blind hole, said growth being faster at the base of the lateral flank of the blind hole than on the rest of said lateral flank, said member when formed comprising a cavity arranged at that end of said member which is located opposite the bottom of the blind hole, said cavity being entirely or partially bordered by a rim.

Abstract: A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body, a plurality of first and second internal electrodes formed to be alternately exposed to both side surfaces of the ceramic body, having a dielectric layer therebetween, and first and second external electrodes connected to the first and second internal electrodes, respectively; and an interposer board including an insulation board coupled to the mounting surface of the multilayer ceramic capacitor and first and second connection terminals formed on the insulation board and connected to the first and second external electrodes, respectively.

Abstract: A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, a pair of first external electrodes and a pair of second external electrodes formed on both side surfaces of the ceramic body and extended to portions of a mounting surface of the ceramic body, and first and second internal electrodes alternately stacked, having the dielectric layer therebetween, exposed through at least one side surface of the ceramic body, and connected to the first and second external electrodes, respectively; and an interposer substrate including an insulation substrate bonded to the mounting surface of the multilayer ceramic capacitor, and first and second connection terminals formed on the insulation substrate and connected to the first and second external electrodes, respectively.

Abstract: The present invention discloses a printed circuit board, a semiconductor package having the same, and a method for manufacturing the same. A printed circuit board according to an aspect of the present invention includes: a package board including a mounting area and a peripheral area, the mounting area having a semiconductor chip mounted therein, the peripheral area surrounding the mounting area; a first central circuit pattern formed in the mounting area on one surface of the package board; a second central circuit pattern formed in the mounting area on the other surface of the package board and having a greater thickness than the first central circuit pattern; a first peripheral circuit pattern formed in the peripheral area on the one surface of the package board; and a second peripheral circuit pattern formed in the peripheral area on the other surface of the package board and having a greater thickness than the second peripheral circuit pattern.

Abstract: A semiconductor package may include: a substrate including a core layer having a first surface and a second surface which is opposite to the first surface, a wiring layer formed over the first and second surfaces and in an inside of the core layer, and having a first electrode disposed in the inside of the core layer and exposed from the core layer and a second electrode disposed over the first surface, and a passivation layer formed over the first and second surface of the core layer such that the first and the second electrodes are exposed; a first semiconductor chip disposed over the first surface of the core layer; a second semiconductor chip stacked over the first semiconductor chip; a first connection member for connecting the first semiconductor chip with the first electrode; and a second connection member for connecting the second semiconductor chip with the second electrode.

Abstract: The present invention is a backplane board including a first circuit board, a second circuit board, a first slot in which a first connector is connected with the first circuit board, and a second slot in which a second connector is connected with the second circuit board. The first connector and the second connector are arranged so that pin arrangement of the first connector may be shifted by at least one column in a longitudinal direction against pin arrangement of the second connector.

Abstract: A strobe device according to the present invention includes: a strobe main body; a light-emitting unit rotatably connected to the strobe main body; a variable mechanism capable of changing an angle of the light-emitting unit; a drive unit for driving the variable mechanism; and a control unit for controlling the drive unit, wherein the control unit has a mode of changing an illumination direction angle of the light-emitting unit at each shot in a continuous shooting operation. This realizes a strobe device that makes it possible to immediately obtain a favorite image.

Abstract: An illumination system defined a primary optical axis is provided. The illumination system comprises a light source, a first lens group, an integrator rod, and a second lens group successively located on the primary optical axis. The light source is configured to output a light. The first lens group is configured to reduce an aperture angle of the light to about 27 degrees. The integrator rod is configured to make the light uniformly. The second lens group is configured to amplify an illumination field of the light and reduce the aperture angle of the light to about 3 degrees.

Abstract: A light source suitable for general lighting applications combines at least one remote phosphor LED and at least one direct emitting LED in a single unit. Both the remote phosphor LED and the direct emitting LED are carried by a base and covered by a bulb or other suitable cover member, which may be light-diffusing. The remote phosphor LED includes a first LED, a phosphor layer, and a first dichroic reflector. Excitation light from the first LED is reflected by the first dichroic reflector onto the phosphor layer to generate phosphor light, which is substantially transmitted by the first dichroic reflector. At least some light from the direct emitting LED propagates to the cover member without passing through any dichroic reflector, including the first dichroic reflector. The light source may provide white light output using relatively small amounts of phosphor material.

Abstract: The present invention relates to a light-emitting device (11) comprising a hollow retro reflector (15) having a reflective internal surface comprising at least three surface segments (17a-c) connected at an apex (18); and a solid state light-source (16a-c) attached to said internal surface of the hollow retro reflector and arranged to emit light towards said apex of the hollow retro refector. Various embodiments of the present invention provide uniform light-output from a relatively simple and cheap light-emitting device.

Abstract: Embodiments described herein provide an optical system having a light source (e.g., LED) and a high numerical aperture multi-element optical stack. According to one embodiment, the optical stack can reimage an entrance aperture. The multi-element optical stack can include a number of optical elements forming a series of lenses. The series of lenses comprises, a first lens positioned to receive light emitted in a first beam angle and a second lens more distal from the LED than the first lens, the second lens defining a second lens exit aperture that has at least a minimum area necessary to conserve radiance for the emission beam angle in air. The lenses in said series of lenses are configured, in combination, to successively reduce a beam angle of light from the first beam angle to the emission beam angle.

Abstract: An illumination device for attachment to a hose has a housing coupled to the hose. The housing allows a substance from the hose to flow through the housing. An electronic circuit is stored in an interior of the housing to illuminate an area in front of the hose and to transmit data to and from the illumination device.

Abstract: An inflatable solar-powered light is disclosed. In some embodiments, the inflatable solar-powered light includes the following: an expandable bladder including a plurality of surfaces; a solar-powered light assembly positioned on at least one of the plurality of surfaces of the bladder; and one or more cover portions positioned over the assembly and joined with the at least one of the plurality of surfaces of the bladder around its edges, wherein at least a portion of at least one of the at least one or more cover portions is substantially transparent and each of the one or more cover portions forms a substantially waterproof envelope with the at least one of the plurality of surfaces of the bladder in which the solar-powered light assembly is contained.

Abstract: A display device includes a display panel, a rear face housing, a substrate, at least one light source, a reflective sheet, and a fixing member. The display panel is configured to display an image. The rear face housing is disposed rearward with respect to a rear face of the display panel. The substrate is disposed between the display panel and the rear face housing. The at least one light source is mounted on the substrate and configured to emit light toward the rear face of the display panel. The reflective sheet is partially sandwiched between the substrate and the rear face housing. The reflective sheet has an opening at a location where the substrate is disposed. The fixing member fixedly attaches the substrate to the rear face housing through the opening.

Abstract: Light flux controlling member (300) includes: first main surface (310) having first incidence surface (313) and second incidence surface (314); second main surface (320) having total reflection surface (321); and side surface (330) that outputs light reflected by total reflection surface (321). First incidence surface (313) is a recessed surface disposed at a center portion of first main surface (310). Second incidence surface (314) is a surface laterally extending from an opening edge of first incidence surface (313). Total reflection surface (321) is a substantially cone-shaped recessed surface having a vertex at a position that faces a vertex of first incidence surface (313).

Abstract: A light emitting device package including light emitting devices, and optical lenses respectively disposed over the light emitting devices. Further, a respective optical lens includes an extending member extending from a body of the respective optical lens, and including a first portion laterally extending in a first direction substantially perpendicular to the central axis of the respective light emitting device, and a second portion extending towards the substrate in a second direction substantially parallel with the central axis of the respective light emitting device. A vertical cross section of the second portion is substantially symmetrical with respect to an axis that is spaced apart in the first direction from and substantially parallel with the central axis of the respective light emitting device.

Abstract: A spa light fitting and method for blocking a portion of light emanating from the spa light fitting, the spa light fitting having a base component having a cylindrical body that is mounted through a spa shell, the body having a first end and second end; a lens or light diffuser at a first end of the body; a light source; and a decorative and functional cap having a decorative and functional design thereon, wherein the cap provides a shading or light blocking function to light transmitted by the light source through the lens or light diffuser.

Abstract: A light fitting and method for illuminating the exterior of spas, swimming pools, hot tubs, garden baths, and the like, the light fitting having a base component mounted through a spa wall; a lens or light diffuser on an exterior end of the base component; a light source on, in, or proximal to an interior end of the base component; a light clip for retaining the light source on, in, or proximal to the base component; a light shade located on or proximal to the exterior end of the base component; and an attachment plate for attaching the light shade onto the base component via a mounting support; the base component having a cylindrical hollow body having a hollow interior, a first end located within the spa wall, and a second end located proximal to the spa wall, with the mounting support being attached to the cylindrical hollow body.

Abstract: A magnetic gun barrel attachment is provided. The magnetic gun barrel attachment includes a body. The body includes an outer surface, a front end, and a rear end. A plurality of concave channels may be formed on the outer surface from the front end to the rear end. The concave channels each include a different radius of curvature. Therefore, each concave channel may be a different size, and may thereby fit on different sized barrels of a various amount of guns. A flashlight s attached to the body. The flashlight includes a flashlight head disposed at the front end of the body. At least one magnet is disposed within the body in between the plurality of channels to attract and attach to the barrel of the gun. The magnetic gun barrel attachment may further include a tactical rail.

Abstract: Generally, the present disclosure provides for a light engine, in particular a rack-mounted light engine that can be used in a lighting system. The rack mounted light engine can be positioned in an electronics component rack such a light distribution system using hollow light ducts may distribute the light over a large area, such as a data center. Such a light distribution can use a generated light more efficiently by directing the light to the fronts or backs of the electronics cabinet, rather than for general room illumination.

Abstract: A hanger bar assembly includes a first hanger bar member that includes a first rail segment. The first hanger bar member also includes a first channel segment that includes a first channel. The first hanger bar member also includes a first transitional middle segment extending between the first rail segment and the first channel segment. The hanger bar assembly further includes a second hanger bar member that includes a second rail segment. The second rail segment is positioned in the first channel of the first channel segment. The second hanger bar member further includes a second channel segment that includes a second channel. The first rail segment is positioned in the second channel. The second hanger bar member also includes a second transitional middle segment extending between the second rail segment and the second channel segment.

Abstract: A lighted cup holder and method for illuminating a cup holder, the cup holder having a base component having a cylindrical body for mounting through a spa shell, a first end, a second end, and a hollow interior; a lens or light diffuser at the first end of the body and located proximal to an exterior surface of the spa shell; a decorative or functional stencil or insert located within the hollow interior at or proximal to the first end of the body; a light source; and a light holder for retaining the light source on the base component at or proximal to the second end of the body.

Abstract: A device for illuminating bottles provides a housing with an upper casing and a lower casing that serve to enclose electrical components. The electrical components include a power source, illumination source, and a circuit which electrically connects said power source and illumination source. A three-way switch allows a user to configure the illumination source and circuit, selecting between three settings. The three-way switch is thus electrically connected between the power source and illumination source by means of the circuit. A secondary switch enables operation of a variable state, in which the illumination source turns off or on depending on if it is placed on a table or lifted from a table. The housing is coupled to a bottle by a bottle receiving portion on the upper casing, which is dome shaped in order to allow for an interference fit. The device is used to illuminate a secured bottle.