Abstract: In the wiring board of the present invention, the land pattern for power supply, connected to the semiconductor element connection pad for power supply through a via conductor and arranged below the segment region, includes a strip-shaped continued portion in the position corresponding to the outer peripheral portion except the outer peripheral side of the mounting portion in the segment region, and the strip-shaped continued portion and the power supply plane arranged therebelow are connected through a via conductor.

Abstract: Aspects of the disclosure provide a printed circuit board (PCB) structure. The PCB structure includes a plurality of dielectric layers including an outer layer, a second layer disposed immediately below the outer layer, at least one first power plane disposed on at least one first internal layer of the PCB structure, and at least one first ground plane disposed on at least one second internal layer of the PCB structure. The PCB structure further includes an array of buried vias passing through at least the second layer configured to respectively connect power pads disposed on the second layer to the at least one first power plane and to connect ground pads disposed on the second layer to the at least one first ground plane.

Abstract: A printed circuit board includes an inner layer having a supporting pattern and via pad patterns that are disposed to be spaced apart from each other in a lateral direction, an outer layer disposed over or below the inner layer and including a circuit pattern, a via plug connecting the circuit pattern layer to any one of the via pad patterns. The supporting pattern is stiffer than the via pad patterns, and at least two of the via pad patterns are electrically connected to each other by a via pad connecting pattern located at substantially the same level as the via pad patterns.

Abstract: An inductor includes a first coil, an input terminal electrically connected to an outermost portion of the first coil, a first insulating film on the first coil, a second coil on the first insulating film, a second insulating film on the second coil, a third coil on the second insulating film, connection conductors that connect the first coil to the second coil at locations so that a signal propagates through outside portions of the first coil and the second coil before propagating through other portions of the first coil and the second coil, a central portion connection conductor that connects a central portion of the first coil or a central portion of the second coil to a central portion of the third coil, and an output terminal electrically connected to an outermost portion of the third coil.

Abstract: A printed circuit board is disclosed. Pins of a plurality of resistors on the PCB are connected to the same input line. At least two out of the resistors are connected to the same input line with access pins overlapped. One shared bonding pad is located in every overlapped area, electrical components are bonded on the shared bonding pads. As at least two out of the resistors are connected to the same input line with the access pins overlapped, the utilization of space is maximized. In this way, not only the dimension of the PCB is reduced, but also the manufacturing cost is reduced at the same time.

Abstract: Techniques are disclosed for integrating capacitors among the metal interconnect for embedded DRAM applications. In some embodiments, the technique uses a wet etch to completely remove the interconnect metal (e.g., copper) that is exposed prior to the capacitor formation. This interconnect metal removal precludes that metal from contaminating the hi-k dielectric of the capacitor. Another benefit is increased height (surface area) of the capacitor, which allows for increased charge storage. In one example embodiment, an integrated circuit device is provided that includes a substrate having at least a portion of a DRAM bit cell circuitry, an interconnect layer on the substrate and including one or more metal-containing interconnect features, and a capacitor at least partly in the interconnect layer and occupying space from which a metal-containing interconnect feature was removed. The integrated circuit device can be, for example, a processor or a communications device.

Abstract: There is provided a wiring board including a stiffener bonded to a circuit board, and a laminate formed by laminating a plurality of insulating layers and a plurality of wiring layers on a face of the stiffener opposite to a face bonded to the circuit board. On both faces of the laminate in a laminating direction, terminal connection parts connected to the wiring layers and connected to a terminal part of an electronic component are formed. Further, a component disposition hole, in which the terminal connection parts formed on one of the faces of the laminate are positioned and the electronic component is disposed, and a through hole for connection to the circuit board are formed in the stiffener.

Abstract: A semiconductor package includes a semiconductor die comprising a control transistor and a sync transistor, an integrated output inductor comprising a winding 1 around a core, and coupled to the semiconductor die. The winding comprises a plurality of conductive clips situated above a printed circuit board (PCB) and connected to a plurality of conductive segments in the PCB. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound.

Abstract: An LED lighting kit comprises an extrusion (300), an LED strip (100), a tapered wedge (1500), and a mounting clip (1200). The extrusion itself may have a recessed linear groove of sufficient width and depth to seat the LED strip. The clip is sized and shaped to springably engage ledges (320) in a first channel (310) of the extrusion when the strip is mounted. In one aspect, two extrusions are butted end-to-end and are aligned by inserting the tapered wedge into the first channel of each extrusion prior to butting them together. The extrusion contains a second channel (315) that houses the LED strip. A translucent diffuser (900) is springably inserted into the second channel, thereby diffusing light that is emitted by the LED strip.

Abstract: In an embodiment, there is provided a method of creating a package, the method comprising: providing an initial substrate, wherein the initial substrate comprises a carrier foil, a functional copper foil, and an interface release layer between the carrier foil and the functional copper foil; building up copper portions on the functional copper foil; attaching a chip to a first copper portion; coupling the chip to a second copper portion; encapsulating at least the chip and the copper portions with a mold; and removing the carrier foil and interface release layer.

Abstract: A machine can include a conveyor that receives and conveys a circuit assembly treated with a UV curable coating material; a UV zone that includes LED-based UV radiation sources; a circuit assembly sensor; a heating zone; and a controller that controls power to at least one of the LED-based UV radiation sources based at least in part on information from the circuit assembly sensor.

Abstract: The present subject matter provides for a multi-layer conductive trace. The trace can be formed by digital printing the individual layers and firing. The individual layers each impart functional characteristics to the conductive trace and each layer has components that can be adjusted to affect the performance characteristics of that particular layer without detrimentally affecting the performance characteristics of the remaining layers.

Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.

Abstract: In one embodiment, a method for forming an embedded trace substrate includes forming a conductive layer on a carrier. A dielectric film is provided on the conductive layer. Vias are formed in the dielectric film and extend to portions of the conductive layer. A conductive pattern is formed on the dielectric layer and is electrically connected to the conductive layer through the vias. The carrier is removed and portions of the conductive layer are selectively removed to provide a plurality of bumps pads configured to protrude outwardly from the dielectric layer.

Abstract: A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and exposes a surface of the first wiring layer. A first via arranged in the first through hole includes an end surface exposed to the surface of the first insulating layer. A gap is formed between the first insulating layer and the first via in the first through hole. A second wiring layer is stacked on the surface of the first insulating layer and the end surface of the first via. The second wiring layer includes a pad filling the gap. The pad is greater in planar shape than the first through hole.

Abstract: The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 ? or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.

Abstract: A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

Abstract: A display device is provided, including a display panel, a back frame, a circuit board and a cover film. The display panel includes a first substrate and a second substrate, wherein the first substrate includes an upper surface. The back frame supports the display panel and includes an outer surface. The cover film includes a film base, a first adhesive and a second adhesive. The film base includes a first portion, a second portion and an intermediate portion located therebetween, wherein the film base covers an edge of the upper surface and a portion of the outer surface. The first adhesive is disposed on the first portion and is attached to the edge of the upper surface. The second adhesive is disposed on the second portion and is attached to the outer surface, wherein the intermediate portion and the outer surface define a receiving space receiving the circuit board.

Abstract: A display unit, an electronic device and an assembling method are provided. The electronic device includes a case and a display unit. The case includes a holding compartment. The display unit is accommodated in the holding compartment, and includes a display module, a transparent cover layer and a transparent adhesive tape. The transparent adhesive tape is configured between the display module and the transparent adhesive tape, and the transparent adhesive tape is adhered to the transparent cover layer. The transparent adhesive tape includes a flange portion extending beyond the display module, and the flange portion can be bent to secure the display unit to the case. The second surface is leaned against a back plate. The back plate comprises at least one hole. The flange portion passes through the hole and is bent to attach to a surface of the display module that is farther away from the back plate.

Abstract: Provided is an electronic circuit unit which includes a circuit board, a case for the circuit board and a connector for external connection and can be miniaturized and simplified in structure. This electronic circuit unit includes a circuit board (10) provided with a plurality of conductors for connection (14) on an edge part (12), a case (CS) configured to house the circuit board, and a plurality of terminals (30) provided on ends of a plurality of wires (W). The case (CS) integrally includes a board housing portion (20) and a terminal holding portion (40). The board housing portion (20) holds the circuit board (10) at a specific board holding position. The terminal holding portion (40) holds these terminals (30) in such an arrangement that each terminal (30) comes into contact with each conductor for connection (14) of the circuit board (10) at the board holding position.

Abstract: A holding apparatus includes a holding member that holds an electronic apparatus, a supporting member that is connected to the holding member and supports the holding member, and a first pushing member and a second pushing member which are disposed between the holding member and the supporting member. When the first pushing member is handled by the user, the first pushing member pushes the second pushing member in the first direction toward the holding member, and pushes the holding member in the second direction toward the supporting member and opposite to the first direction.

Abstract: A field replaceable power supply cartridge is provided for coupling with a socket. The cartridge has a latch mechanism that can be actuated by the user to couple the cartridge to the socket, such that latches of the cartridge releasably engage recessed portions in the socket. The cartridge has a key feature that corresponds to a key feature on the socket, allowing the cartridge to be coupled to the socket in only one orientation, thereby preventing the incorrect electrical connection between the cartridge and the socket. The cartridge can have a multi-pin electrical connector for coupling to a corresponding connector on the socket. The socket can be a relatively short socket, where the electrical wires are bottom fed, or can be a relatively tall socket, where the electrical wires are side fed via one or more openings in the body of the socket.

Abstract: Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center generally includes a modular computing module including an intermodal shipping container and computing systems mounted within the container and configured to be shipped and operated within the container and a temperature control system for maintaining the air temperature surrounding the computing systems. The intermodal shipping container may be configured in accordance to International Organization for Standardization (ISO) container manufacturing standards or otherwise configured with respect to height, length, width, weight, and/or lifting points of the container for transport via an intermodal transport infrastructure. The modular design enables the modules to be cost effectively built at a factory and easily transported to and deployed at a data center site.

Abstract: An electronic device includes a shell, a thermal element, a controller and a fan. The shell defines a first air outlet and a second air outlet. The controller controls the fan to rotate clockwise to generate a first air current to dissipate the heat generated by the thermal element out of the first air outlet in a first preset condition, and control the fan to rotate anticlockwise to generate a second air current to dissipate the heat generated by the thermal element out of the second air outlet in a second preset condition.

Abstract: A fan securing device includes first and second holders. The first holder includes a first holding frame that has two holding slots located in opposite sides of the first holding frame, and two first locking units respectively formed adjacent to the holding slots. The second holder includes a second holding frame that has two connecting arms located on opposite sides of the second holding frame and extending respectively into the holding slots. Each connecting arm has a plurality of second locking units. Each first locking unit engages a selected one of the second locking units of a respective one of the connecting arms so as to clamp at least one cooling fan between the first and second surfaces.

Abstract: A sheet-like heat pipe for a heat-generating element, which is intended to make an electronic device more compact, more lightweight, and thinner, while also reducing costs, is provided. A sheet-like heat pipe (10) of the present invention includes a container (17) in which the peripheries of the sheet-like members (11, 12) disposed facing each other are bonded to form a cavity inside, and a working liquid which is enclosed in a cavity (15) of the container (17). At least one of the sheet-like members (11, 12) disposed facing each other is formed with protruding pieces (12A, 12B) which project outwards from the bonded part with the other sheet-like member and have a spring structure which causes the container (17) to elastically abut a heat-generating element (5) of an electronic device.

Abstract: The present description relates to the field of microelectronic assemblies, wherein a heat dissipation device may be incorporated into the microelectronic assembly with a loading mechanism having at least one outrigger that is rotatable or pivotable between a first position and a second position to accommodate different heat dissipation device sizes or shapes.

Abstract: The present mobile processing data center comprises a support structure, which consisting in ISO standard containers of 10, 20, 40 or 53 feet, wherein the container comprises: a) automatic transfer switch; b) uninterruptible power system; c) precision air conditioners; d) cabinets having a bearing and rails system, and 42 RMS in order to install the IT equipment; f) two levels of trays ladder type installed on the top of the cabinets, one tray for data wiring and other for power wiring; g) removable floor panels; and h) additionally the mobile data center comprises a fire protection system “zero-footprint”.

Abstract: A method for determining regions of influence of a plurality of fluid moving devices in an infrastructure is provided. In the method, a plurality of clusters are generated, with each of the plurality of clusters containing a representation of fluid supply data pertaining to a fluid moving device and one or more of the plurality of sensors based upon collected sensor and fluid supply data. In addition, regions of influence of each of the plurality of fluid moving devices are identified from an analysis of the generated clusters.

Abstract: A system includes a first computing component and a second computing component. A first measurement indicative of a temperature of a first computing component is received. A second measurement indicative of a temperature of a second computing component is received. A thermal value is calculated for the first computing component based on the first measurement and the second measurement. In response to determining that the calculated thermal value exceeds the threshold, an operational or physical parameter of the system is modified.

Abstract: Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.

Abstract: Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to a first opening by a planar seal. Another end of the first connecting pipe is connected to one end of a second connecting pipe by a shaft seal. Another end of the second connecting pipe is connected to a second opening by a planar seal. An axial direction of a shaft seal is perpendicular to a plane that includes the first opening.

Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, at least one first side wall barrier structure, at least one thermal protrusion, and a first filler layer is provided. The second substrate is disposed above the first substrate. The environmental sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The first side wall barrier structure is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first side wall barrier structure is located on at least one side of the environmental sensitive electronic device. The thermal protrusion is located on the second substrate. The first filler layer is located between the first substrate and the second substrate and covers the environmental sensitive electronic device, the first side wall barrier structure, and the thermal protrusion.

Abstract: This wireless power transmission system includes: a power transmitting antenna and a power receiving antenna arranged to face each other and not to be in contact with each other; and an electromagnetic shield structure that includes a first shield and a second shield to house, in its inner space, the power transmitting and power receiving antennas facing each other. The first and second shields are configured to make first and second spaces to house the power transmitting and power receiving antennas, respectively. At least one of the first and second shields includes a protruding portion that is parallel to at least one of the power transmitting and power receiving antennas and that protrudes out of the shield sidewalls. Power is transmitted by a non-contact method through a radio frequency magnetic field from the power transmitting antenna to the power receiving antenna.

Abstract: In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector.