Abstract: Examples of the present disclosure provide apparatuses and methods for performing shift operations in a memory. An example method comprises performing a shift operation a first element stored in a first group of memory cells coupled to a first access line and a number of sense lines of a memory array and a second element stored in a second group of memory cells coupled to a second access line and the number of sense lines of the memory array. The method can include shifting the first element by a number of bit positions defined by the second element by performing a number of AND operations, OR operations, SHIFT operations, and INVERT operations performed without transferring data via an input/output (I/O) line.

Abstract: Disclosed are various embodiments related to dual-gate transistors and associated calibration circuitry. In one embodiment, dual-gate transistors may be configured in a sense amplifier arrangement, and calibration circuitry can be used to adjust an input offset of the sense amplifier. In another embodiment, a reference level voltage utilized in an amplifier with dual-gate transistors can be adjusted during a calibration sequence, and may be substantially unchanged from its nominal value outside of the calibration sequence. In another embodiment, a calibration sequence can be utilized to determine circuit results from a circuit including dual-gate transistors, and to adjust control gates to more closely coincide with expected or desired results. In yet another embodiment, a semiconductor memory device can include a memory array with amplifiers that include dual-gate transistors, as well as associated calibration circuitry.

Abstract: A memory array contains a plurality of banks coupled to each other by a plurality of data lines. Each of the data lines is divided into a plurality of segments within the array. Respective bidirectional buffers couple read data from one of the segments to another in a first direction, and to couple write data from one of the segments to another in a second direction that is opposite the first direction. The data lines may be local data read/write lines that couple different banks of memory cells to each other and to respective data terminals, digit lines that couple memory cells in a respective column to respective sense amplifiers, word lines that activate memory cells in a respective row, or some other signal line within the array. The memory array also includes precharge circuits for precharging the segments of respective data lines to a precharge voltage.

Abstract: A semiconductor memory device includes a program and read unit suitable for programming program data in a memory cell array and for reading read data stored in the memory cell array, and a control unit suitable for generating a control signal for controlling the program and read unit in response to a command input from the outside of the semiconductor memory device, in which the control unit controls the program and read unit to read the read data in a state of storing a first bit data of the program data when a read command is input while programming the program data.

Abstract: Apparatuses and methods related to adjusting a delay of a command signal path are disclosed. An example apparatus includes: a command input buffer that receives command signals and further provides buffered command signals; a command decoder coupled to the command input buffer, that decodes the buffered command signals responsive to a first clock signal and further provides a decoded command signal; and a command extension circuit coupled to the command decoder, which receives the decoded command signal, the first clock signal and a second clock signal having a first delay relative to the first clock signal, and further provides a command extension signal having a pulse width longer than the pulse width of the decoded command signal.

Abstract: A storage device includes a nonvolatile memory, and a memory controller adapted to control the nonvolatile memory and to transmit a first timing signal to the nonvolatile memory at a read operation. The nonvolatile memory includes a nonvolatile memory device adapted to output read data and a second timing signal in response to the first timing signal, and a retiming circuit adapted to detect a locking delay according to the first timing signal, to produce a third timing signal from the second timing signal using the detected locking delay, to retime the read data by latching the read data in synchronization with the third timing signal and to output the third timing signal and the retimed read data to the memory controller.

Abstract: An address aligner includes a command address providing unit, an alignment signal providing unit and an alignment unit. The command address providing unit outputs a sync command address signal by delaying a command address signal in synchronization with a first clock signal. The sync command address signal is synchronized with the first clock signal. The alignment signal providing unit outputs alignment clock signals by delaying a chip select signal in synchronization with a second clock signal. The alignment clock signals are synchronized with the second clock signal. The alignment unit outputs a plurality of addresses in synchronization with the alignment clock signals. The plurality of addresses is included in the sync command address signal. If the address aligner according to example embodiments is used, the operation speed of the memory device may be increased by aligning a plurality of addresses in synchronization with the alignment clock signal that is generated based on a chip select signal.

Abstract: A semiconductor system includes a first clock channel and a second clock channel. The first clock channel transmits a first clock signal from a controller to a memory. The second clock channel transmits a second clock signal with a phase difference of 90° from the first clock signal, from the controller to the memory.

Abstract: A magnetoelectric device is provided. The magnetoelectric device includes a reference magnetic layer structure having a fixed magnetization orientation, and a synthetic antiferromagnetic layer structure including a free magnetic layer structure and a coupling magnetic layer structure antiferromagnetically coupled to each other, each of the free magnetic layer structure and the coupling magnetic layer structure having a magnetization orientation that is variable, wherein the reference magnetic layer structure and the synthetic antiferromagnetic layer structure are arranged one over the other. According to further embodiments of the present invention, a method for forming a magnetoelectric device and a writing method for a magnetoelectric device are also provided.

Abstract: In a spin-torque magnetic random access memory (MRAM) that includes local source lines, auto-booting of the word line is used to conserve power consumption by reusing charge already present from driving a plurality of bit lines during writing operations. Auto-booting is accomplished by first driving the word line to a first word line voltage. After such driving, the word line isolated. Subsequent driving of the plurality of bit lines that are capacitively coupled to the word line causes the word line voltage to be increased to a level desired to allow sufficient current to flow through a selected memory cell to write information into the selected memory cell. Additional embodiments include the use of a supplemental voltage provider that is able to further boost or hold the isolated word line at the needed voltage level.

Abstract: According to one embodiment, a nonvolatile memory includes a memory cell, a write circuit generating a write current to change the memory cell from a first resistance value to a second resistance value, a first current generating circuit generating a first current based on the write current flowing through the memory cell, a second current generating circuit generating a second current based on the write current flowing through the memory cell, a hold circuit holding a first value generated based on the second current when the memory cell stores the first resistance value, a comparator comparing the first value with a second value generated based on a change of the first current while the memory cell changes from the first resistance value to the second resistance value, and a write current control circuit cutting off the write current based on a result of comparison of the comparator.

Abstract: A data retention control circuit includes a data retention part having first and second logic circuits, a ferroelectric storage part having first and second ferroelectric device parts, first and second transmission control parts, and a test voltage supply control part. The first transmission control part has first and second transmission control circuits controlling first and second logic signals to the first and second ferroelectric device parts, respectively. The second transmission control part has third and fourth transmission control circuits controlling transmission of first and second storage data from the first and second ferroelectric device part to the second and first logic circuits, respectively. The test voltage supply control part has first and second test voltage supply control circuits controlling supplies of first and second test voltages to the second and first logic circuit, respectively.

Abstract: To provide a memory device which operates at high speed or a memory device in which the frequency of refresh operations is reduced. In a cell array, a potential is supplied from a driver circuit to a wiring connected to a memory cell. The cell array is provided over the driver circuit. Each of memory cells included in the cell array includes a switching element, and a capacitor in which supply, holding, and discharge of electric charge are controlled by the switching element. Further, a channel formation region of the transistor used as the switching element includes a semiconductor whose band gap is wider than that of silicon and whose intrinsic carrier density is lower than that of silicon.

Abstract: A semiconductor memory device may include a memory cell array, a first decoder and a second decoder. The memory cell array includes a plurality of memory cell rows. The first decoder is configured to select a first number of memory cell rows of the plurality of memory cell rows based on a selected refresh row address of a set of row addresses. The second decoder is configured to select a second number of memory cell rows of the plurality of memory cell rows based on the selected refresh row address. A total number of the first number and the second number is varied in response to the selected refresh row address.

Abstract: Methods of configuring dynamic memory associated with a processing system, are described. The dynamic memory is configured in a plurality of blocks, the method comprises: a) receiving information relating to a utilization status of the memory; b) processing the received information to determine at least one first block of the memory that is currently not in use for information storage; and c) configuring the at least one first block to be excluded from an information refresh process.

Abstract: An apparatus for data processing includes first and second functional units driven by corresponding first and second clock-signal sources, and a clock-retardation unit. The clock-retardation unit is configured to cause the second clock-signal to sustain a temporal offset that causes an offset between the first and second clock-signals to step toward a target time-domain offset between the first and second clock-signals.

Abstract: A memory channel including an internal clock circuit is disclosed. The clock circuit may synthesize an internal clock signal for use by one or more components of the memory channel. The internal clock signal may have a different frequency than an external clock frequency. The memory channel may include multiple clock circuits that generate multiple internal clock signals. Each portion of the memory channel associated with a different clock circuit may be phase and/or frequency independent of the other portions of the memory channel. The clock circuit may synthesize an internal clock signal based on an external clock signal. The clock circuit may use encoded timing data from an encoded I/O scheme to align the phase of the internal clock signal to a data signal.

Abstract: Apparatuses and methods for controlling word lines and sense amplifiers in a semiconductor device are described. An example apparatus includes: a sub word line selection signal decoder which activates at least one of a plurality of sub word selection signals responsive to row address signals; a column segment selection signal decoder which activates at least one of a plurality of column segment signals responsive to a portion of column address signals and a portion of the row address signals; a column segment selection circuit which activates at least one of a plurality of column-subword selection signals responsive to the activated column segment signal and the activated sub word selection signal; and a sub word line driver which activates at least one of a plurality of sub word lines responsive to an activated main word line and the activated sub word selection signal.

Abstract: A semiconductor memory may include: a storage unit suitable for storing a minimum operation interval between row command operations, a detection unit suitable for detecting whether row command signals inputted for the row command operations are activated at the minimum operation interval, a latching unit suitable for generating flag signals by latching the row command signals, and a shifting unit suitable for shifting the flag signals based on the minimum operation interval in response to an output signal of the detection unit, and generating an internal row command signals.

Abstract: An integrated circuit includes first and second circuit parts that may be arranged close to one another in a single semiconducting substrate. The circuit may use a deep doping well for reducing digital noise, and may implement a sleep mode for reducing power consumption. This circuit may have a random access memory, and may be a radio communication system-on-chip device. The integrated circuit may advantageously be used within a mobile communication apparatus.

Abstract: A bit line precharging circuit includes a first switch that connects a bit line to a first power source, a second switch that connects the bit line to a second power source whose voltage value is higher than voltage value of the first power source, and a control circuit including a delay element and configured to bring the second switch into conduction after a delay time by the delay element after bringing the first switch into conduction at the time of precharge of the bit line.

Abstract: We disclose methods, apparatus, and systems for improving semiconductor device yield and/or reliability through bias temperature instability (BTI). One device may comprise a plurality of cells of an array, wherein each of the cells comprises a pass gate and a latch; a plurality of word lines, wherein each word line controls access to each pass gate of a first number of cells; a word line driver electrically connected to each word line; and a control line configured to provide an operational write voltage or a first write voltage to each word line through the word line driver. By virtue of BTI, application of the first write voltage may lead to improved stability of data desired to be read from one or more cells of the device.

Abstract: We disclose methods, apparatus, and systems for improving semiconductor device yield and/or reliability through bias temperature instability (BTI). One device may comprise a plurality of cells of an array, wherein each of the cells comprises a pass gate and a latch; a plurality of word lines, wherein each word line controls access to each pass gate of a first number of cells; a word line driver electrically connected to each word line; a row decoder configured to authorize or deauthorize a write voltage to each word line through the word line driver, wherein the write voltage is selected from an operational write voltage or a first write voltage; and a control line configured to provide an operational write voltage or a first write voltage to each word line authorized by the row decoder, wherein the first write voltage is greater than an operational write voltage.

Abstract: A memory device includes a group or block of k-level memory cells, where k>2, and where each of the k-level memory cells has k programmable states represented by respective resistance levels.

Abstract: A semiconductor integrated circuit according to an embodiment includes: N (?1) input wiring lines; M (?1) output wiring lines; N first wiring lines corresponding to the N input wiring lines; K (>M) second wiring lines crossing the N first wiring lines; a plurality of first resistive change elements disposed at intersections of the first wiring lines and the second wiring lines, each of the first resistive change elements including a first electrode connecting to a corresponding one of the first wiring lines, a second electrode connecting to a corresponding one of the second wiring lines, and a first resistive change layer disposed between the first electrode and the second electrode; a first controller controlling a voltage applied to the first wiring lines; a second controller controlling a voltage applied to the second wiring lines; and a selection circuit selecting M second wiring lines from the K second wiring lines.

Abstract: To improve the write performance of PCM, the disclosed technology, in certain embodiments, provides a new write scheme, referred to herein as two-stage-write, which leverages the speed and power asymmetries of writing a zero bit and a one bit. Writing a data block to PCM is divided into two separated stages, i.e., write-0 stage and write-1 stage. Without violating power constraints, during the write-0 stage, all zero bits in this data block are written to PCM at an accelerated speed; during the write-1 stage, all one bits are written to PCM, with more bits being written concurrently. In certain embodiments, the disclosed technology provides a new coding scheme to improve the speed of the write-1 stage by further increasing the number of bits that can be written to PCM in parallel.

Abstract: According to one embodiment, a resistance-change memory includes a memory cell and a control circuit. The memory cell comprises first and second electrodes, and a variable resistance layer disposed between the first electrode and the second electrode. The control circuit applies a voltage between the first electrode and the second electrode to perform writing, erasing, and reading. During the writing, the control circuit applies a first voltage pulse between the first electrode and the second electrode, and then applies a second voltage pulse different in polarity from the first voltage pulse after applying the first voltage pulse.

Abstract: The present disclosure relates to phase change memory control. An apparatus includes a memory controller. The memory controller includes a word line (WL) control module and a bit line (BL) control module. The memory controller is to determine a WL address based, at least in part, on a received memory address. The memory controller is further to determine a BL address. The apparatus further includes a parameter selection module to select a value of a control parameter based, at least in part, on at least one of the WL address and/or the BL address.

Abstract: Providing for a high performance and efficiency NAND architecture is described herein. By way of example, a NAND array is disclosed comprising memory cells having a 1 transistor-1 two-terminal memory device (IT-1D) arrangement. Memory cells of the NAND array can be arranged electrically in serial with respect to each other, from source to drain. Moreover, respective memory cells comprise a transistor component connected in parallel to a two-terminal memory device. In some embodiments, a resistance of the activated transistor component is selected to be substantially less than that of the two-terminal memory device, and the resistance of the deactivated transistor component is selected to be substantially higher than the two-terminal memory device. Accordingly, by activating or deactivating the transistor component, a signal applied to the memory cell can be shorted past the two-terminal memory device, or directed through the two-terminal memory device, respectively.

Abstract: The present disclosure provides a memory cell that includes a resistive memory element disposed between a first conductor and a second conductor, the first conductor and the second conductor configured to activate the resistive memory element. The memory cell also includes a diode disposed in parallel with the memory element between the first conductor and the second conductor.

Abstract: A semiconductor integrated circuit includes: first and second wiring lines; resistive change memories disposed intersection regions of the first and second wiring lines; and a control circuit controlling the first and second drivers to select one of the first wiring lines and one of the second wiring lines, the control circuit changing a resistance of the selected one of the resistive change memories from the first resistive state to the third resistive state, and then changing the resistive state of the selected one of the resistive change memories from the third resistive state to the second resistive state.

Abstract: According to one embodiment, there is provided a memory system including a volatile memory and a controller. The volatile memory has 1st to Kth memory banks (K is a natural number equal to or larger than 2) that are kept in a power-on state and (K+1)th to Nthmemory banks (N is a natural number larger than K) whose power state is changed. The power state is the power-on state or a power-down state. The controller performs wake-up operation for the (K+1)th to Nth memory banks in parallel with access operation to the 1st to Kth memory banks. The wake-up operation changes the power state from the power-down state to the power-on state.

Abstract: A memory circuit includes: a bistable circuit (30) that stores data; nonvolatile elements (MTJ1, MTJ2) that store data written in the bistable circuit in a nonvolatile manner, and restore data stored in a nonvolatile manner into the bistable circuit; and a control unit that stores data written in the bistable circuit in a nonvolatile manner and cuts off a power supply to the bistable circuit when the period not to read data from or write data into the bistable circuit is longer than a predetermined time period, and does not store data written in the bistable circuit in a nonvolatile manner and makes the supply voltage for the bistable circuit lower than a voltage during the period to read data from or write data into the bistable circuit when the period not to read or write data is shorter than the predetermined time period.

Abstract: Loading data from a computer memory system is disclosed. A memory system is provided, wherein some or all data stored in the memory system is organized as one or more pointer-linked data structures. One or more iterator registers are provided. A first pointer chain is loaded, having two or more pointers leading to a first element of a selected pointer-linked data structure to a selected iterator register. A second pointer chain is loaded, having two or more pointers leading to a second element of the selected pointer-linked data structure to the selected iterator register. The loading of the second pointer chain reuses portions of the first pointer chain that are common with the second pointer chain. Modifying data stored in a computer memory system is disclosed. A memory system is provided. One or more iterator registers are provided, wherein the iterator registers each include two or more pointer fields for storing two or more pointers that form a pointer chain leading to a data element.

Abstract: A ternary content addressable memory (TCAM) structure may activate individual groups of subarrays in the TCAM structure, during a non-search mode, at configurable intervals of time. The activating causes the TCAM structure to select locations and sequences in which subarrays of the TCAM structure are activated or deactivated. When activating, the TCAM structure is configured to perform a dummy search within the particular subarray. The activating reduces a change in current during transition between a search mode and the non-search mode.

Abstract: An irreproducible and re-emergent unique structure or pattern identifier manufacturing and detection method, system, and apparatus are provided. A non-volatile floating gate charge storage device can include a block of floating gate transistors that can include a semiconductor region, a source region, a drain region, a floating gate region, a tunnel oxide region, an oxide-nitrite-oxide region, and a control gate region. A structure altering stress effect is applied to the block of transistors to create a passage region in a random number of floating gate regions of floating gate transistors which changes charge storage or electrical characteristics of random elements of the block of transistors. The passage region alters charges on a floating gate region to escape in a different manner than pre-alteration form causing the floating gate region to lose its charge. An apparatus for recording and detecting such differences in pre and post alteration can also be provided.

Abstract: The present invention discloses a low voltage difference-operated EEPROM and an operating method thereof, wherein at least one transistor structure is formed in a semiconductor substrate and each includes a first electric-conduction gate. Same type ions are implanted into a region of the semiconductor substrate, which is near interfaces of a source, a drain and the first electric-conduction gate, or ion-doped regions of the source and the drain, to increase the ion concentration thereof, whereby to reduce the voltage differences required for writing and erasing. The present invention also discloses an operating method for the low voltage difference-operated EEPROM, in addition to the EEPROM with a single gate transistor structure, the present invention also applies to the EEPROM with a single floating gate transistor structure.

Abstract: A solid-state non-volatile memory (NVM) device includes a memory bit cell. The memory bit cell includes a field effect transistor (FET) fabricated on a substrate and having a floating gate. The floating gate includes a thick oxide layer. The FET includes drain and source, each fabricated within the substrate and coupled to the floating gate and a channel region with native doping. The drain is fabricated to have a halo region. A method for fabricating a solid-state NVM device includes fabricating solid state device including NVM bit cell which provides multiple storage and includes an FET on substrate. The method also includes fabricating floating gate of the FET including thick gate oxide layer, and fabricating drain and source of FET within the substrate, drain and source coupled to the floating gate and channel region with native doping. Further, the method includes fabricating halo region within the substrate at the drain.

Abstract: A three-dimensional (3D) semiconductor memory device includes a CMOS circuit structure including a plurality of column blocks each comprising a plurality of page buffer circuits, and a lower wiring structure and a memory structure sequentially stacked over the CMOS circuit structure. The memory structure overlaps a first circuit region of the CMOS circuit structure and does not overlap a second circuit region of the CMOS circuit structure, and the plurality of column blocks are contained within the first circuit region of the CMOS circuit structure.

Abstract: A write method of a storage device including at least one nonvolatile memory device and a memory controller controlling the nonvolatile memory device includes dividing write data into a plurality of page data groups, each page data group including multiple bits of data; encoding the divided page data groups using different binary codes, respectively; mapping the encoded page data groups; programming, in first memory cells connected to one word line, programming states to which binary values of each of the mapped encoded page data groups are mapped, such that, the plurality of page data groups correspond respectively to a plurality of read voltage levels, and for each of the plurality of page data groups, the page data group can be read by performing a single read operation on the first memory cells using the read voltage level corresponding to the page data group.

Abstract: A communication line is connected to first and second chips, and held at a first signal level. A monitor circuit changes a signal level of the communication line from the first signal to a second signal level while one of the first and second chips uses a current larger than a reference current. When the signal level of the communication line is the second signal level, the other of the first and second chips is controlled to a wait state that does not transfer to an operating state of using a current larger than the reference current.

Abstract: A semiconductor memory device is operated by, inter alia, performing least significant bit programs for pages in a first page group, performing least significant bit programs for pages in a second page group, and performing most significant bit programs for the pages in the first page group. The distance between the second page group and the common source line is greater than that between the first page group and the common source line.

Abstract: According to example embodiments, a nonvolatile memory device includes a plurality of strings having a plurality of serially-connected selection transistors and a plurality of memory cells connected in series to one end of the serially-connected selection transistors. A control logic is configured to perform a program operation for setting a threshold voltage of at least one of the serially-connected selection transistors.

Abstract: A voltage generator includes a first trim unit and a second trim unit. The first trim unit generates a first voltage variable depending on temperature variation and a second voltage invariable irrespective of the temperature variation based on a power supply voltage, and performs a first trim operation by changing a level of the second voltage. The level of the second voltage at a first temperature becomes substantially the same as a level of the first voltage at the first temperature based on the first trim operation. The second trim unit generates an output voltage based on the power supply voltage, the first and second voltages, a reference voltage and a feedback voltage, and performs a second trim operation by adjusting variation of the output voltage depending on the temperature variation based on a result of the first trim operation.

Abstract: A semiconductor memory device includes a first stack of memory cells above a substrate, the first stack including a first memory cell and a second memory cell above the first memory cell, a second stack of memory cells above the substrate, the second stack including a third memory cell, a word line connected to the first, second, and third memory cells, and a controller configured to output data stored in the first memory cell and data stored in the third memory cell during a first cycle, and output data stored in the second memory cell during a second cycle that is different from the first cycle.

Abstract: A semiconductor memory device may include a memory cell array, two or more global word lines, and two or more path circuits. The two or more global word lines may be coupled to word lines in parallel. At least one of the two or more path circuits may be coupled between portions of each word line portions of each word line. Each path circuit may couple one of the global word lines to one of the word lines.

Abstract: A storage device and an information processing method are provided. The storage device has a first power supply unit and at least one first storage cell. The at least one first storage cell stores first data which are associated with a number of charges within the first storage cell. The first power supply unit is electrically connected to the at least one first storage cell. The storage device further has a first control unit configured for controlling the first power supply unit to supply power to the at least one first storage cell according to a predetermined policy, so that the number of charges within the first storage cell satisfies a first preset condition.

Abstract: A method of improving radiation tolerance of floating gate memories is provided herein. Floating gate memories can include a floating gate transistor or a block of floating gate transistors. A floating gate transistor can include a semiconductor region, a source region, a drain region, a floating gate region, a tunnel oxide region, an oxide-nitride-oxide region, and a control gate region. A floating gate transistor or block of floating gate transistors can be written to multiple times in order to accumulate charge on one or more floating gate regions in accordance with an embodiment of the invention. When exposed to radiation, a floating gate region can retain its charge above a certain voltage threshold. A block of floating gate transistors can communicate with an external device where the external device can read a state of the block of floating gate transistors in accordance with an embodiment of the invention.

Abstract: A holding circuit includes first to third input terminals, an output terminal, first to third switches, a capacitor, and a node. The first to third switches control conduction between the node and the first input terminal, conduction between the node and the output terminal, and conduction between the second input terminal and the output terminal, respectively. First and second terminals of the capacitor are electrically connected to the node and the third input terminal, respectively. The first to third switches are each a transistor comprising an oxide semiconductor layer comprising a semiconductor region. Owing to the structure, a potential change of the node in an electrically floating state can be suppressed; thus, the holding circuit can retain its state for a long time. The holding circuit can be used as a memory circuit for backup of a sequential circuit, for example.

Abstract: Provided is a semiconductor device and a manufacturing method thereof. The semiconductor device may include a first cell array, a first fuse circuit, a first spare cell array, a second spare cell array, and a redundancy select controller. The first fuse circuit may be configured to store a first failed address corresponding to one or more defective memory cells in the first cell array. Each of the first and second spare cell arrays may include a plurality of spare memory cells configured to replace first and second defective memory cells in the first cell array, respectively. For replacing the first and second defective memory cells, the redundancy select controller may be configured to selectively assign the first fuse circuit to either one or both of the first and second spare cell arrays.