Abstract: A curved display device is provided. The curved display device includes: a curved display panel configured to have short sides and long sides; a printed circuit board (PCB) configured to provide signals for driving the curved display panel; and a flexible wiring board including a first portion, which is connected to a first area, a second portion, which is connected to the PCB, and a third portion, which is disposed between the first portion and the second portion and has curved sides, wherein a curvature radius of a first side of the curved sides differs from a curvature radius of a second side of the curved sides.

Abstract: In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, a flexible section of the printed circuit board is configured to have a non-linear portion that functions as a hinge when the flexible section is bent, flexed, twisted or otherwise subjected to a motion related force. The hinge configuration improves durability and flexibility while minimizing ripping and cracking of the printed circuit board, particularly interconnects within the flexible section and a transition region between the flexible section and a rigid section of the printed circuit board. The hinge is configured to have a non-linear shape, such as a serpentine or circuitous path that can include curved portions, different linear portions or some combination of curved and linear portions.

Abstract: An electronic circuit device having a circuit stack, such as an electronic display device with a display stack, includes a protective backing having multiple layers or with a graded layer that protects the electronic circuits from both low velocity impacts and high velocity impacts. The protective backing may have an elastic layer and a viscoelastic layer or have a graded layer with a graded structure that gradually transitions between an elastic region on a first side and a viscoelastic region on a second side. The elastic first layer or region protects the display stack from low velocity impacts while the viscoelastic layer or region protects the display stack from high velocity impacts. The elastic layer or region may be arranged such that it does not add substantial stiffness to the overall circuit stack when it is flexed relatively slowly under normal use.

Abstract: An anisotropic conductive film, which contains a crystalline resin, an amorphous resin, and conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a first electronic part and a terminal of a second electronic part, and wherein the crystalline resin contains a crystalline resin containing a bond characterizing a resin, which is identical to a bond characterizing a resin contained in the amorphous resin.

Abstract: According to various embodiments, a contact pad structure may be provided, the contact pad structure may include: a dielectric layer structure; at least one contact pad being in physical contact with the dielectric layer structure; the at least one contact pad including a metal structure and a liner structure, wherein the liner structure is disposed between the metal structure of the at least one contact pad and the dielectric layer structure, and wherein a surface of the at least one contact pad is at least partially free from the liner structure, and a contact structure including an electrically conductive material; the contact structure completely covering at least the surface being at least partially free from the liner structure of the at least one contact pad, wherein the liner structure and the contact structure form a diffusion barrier for a material of the metal structure of the at least one contact pad.

Abstract: A substrate structure, a semiconductor package and a manufacturing method of semiconductor package are provided. The substrate structure comprises a conductive structure, an electrical component, a package body and a ring-shaped conductive structure. The conductive structure comprises a first conductive layer and a second conductive layer. The first conductive layer has a lower surface. The second conductive layer and the electrical component are formed on the lower surface of the first conductive layer. The package body encapsulates the conductive structure and the electrical component and has an upper surface. The ring-shaped conductive structure surrounds the conductive structure and the electrical component and is disposed at the edge of the upper surface of the package body to expose the conductive structure.

Abstract: An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

Abstract: This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.

Abstract: In a device for producing and/or processing a workpiece, in particular circuit boards (1), in a work station (2), in particular for printing a corresponding blank or for checking finished circuit boards (1), at least one mark (15) is provided on the workpiece. In this arrangement, at least one reference (14), which can be brought into alignment with the mark (15), is provided in the work station (2).

Abstract: A method for printing on a substrate, the method may include determining actual locations of substrate holes; printing a first ink on an object at locations that correspond to the actual locations of the substrate holes and curing the first ink to provide a holes mask; and wherein after the substrate is positioned on the object so that holes mask seals bottoms of the substrate holes then printing the second ink on the substrate thereby forming a predefined pattern on the substrate.

Abstract: This disclosure provides systems, methods, and apparatus for tempering or chemically strengthening glass substrates having electrochromic devices fabricated thereon. In one aspect, an electrochromic device is fabricated on a glass substrate. The glass substrate is then tempered or chemically strengthened. The disclosed methods may reduce or prevent potential issues that the electrochromic device may experience during the tempering or the chemical strengthening processes, including the loss of charge carrying ions from the device, redistribution of charge carrying ions in the device, modification of the morphology of materials included in the device, modification of the oxidation state of materials included in the device, and the formation of an interfacial region between the electrochromic layer and the counter electrode layer of the device that impacts the performance of the device.

Abstract: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.

Abstract: In an example embodiment, a circuit interconnect includes a first printed circuit board (PCB), a second PCB, a spacer, and an electrically conductive solder joint. The first PCB includes a first electrically conductive pad. The second PCB includes a second electrically conductive pad. The spacer is configured to position the first PCB relative to the second PCB such that a space remains between the first PCB and the second PCB after the first electrically conductive pad and the second electrically conductive pad are conductively connected in a soldering process. The electrically conductive solder joint conductively connects the first electrically conductive pad and the second electrically conductive pad.

Abstract: A film composite with electrical functionality for application on a substrate includes at least one conductive structure, a first bonding coat, a film layer and a second bonding coat. The first bonding coat is disposed on an underside of the at least one conductive structure, wherein the first bonding coat has an adhesive effect for application of the at least one conductive structure on the substrate. The second bonding coat is disposed between an upper side of the at least one conductive structure and the film layer. The second bonding coat has an adhesive effect, by which the film layer adheres to the at least one conductive structure.

Abstract: The modular electronic instrumentation platform chassis is for use with a plurality of instrumentation modules and includes a frame defining a module area and a non-module area. The module area includes a plurality of slots open to a front of the frame and configured to receive instrumentation modules therein. A front panel may be carried by the front of the frame adjacent the plurality of slots. A chassis power unit is configured to provide power to the plurality of instrumentation modules received in the slots. A reference clock unit carried by the frame in the non-module area and is configured to provide a low phase-noise reference clock for the plurality of instrumentation modules received in the slots.

Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.

Abstract: A printed wiring board includes a substrate, a first conductor layer formed on first surface of the substrate, a second conductor layer formed on second surface of the substrate, a through-hole conductor penetrating through the substrate and connecting the first and second conductor layers, a build-up layer formed on the second surface of the substrate and including conductor layers, insulating layers and via conductors, and a first insulating layer formed on the first surface the substrate and covering the first conductor layer. The substrate has a cavity penetrating through the first insulating layer and substrate and exposing the build-up layer on the substrate, the via conductors include a lowermost via conductor having a bottom portion exposed at bottom of the cavity, and the bottom portion of the lowermost via conductor is recessed relative to surface of a lowermost insulating layer in the build-up layer at the bottom of the cavity.

Abstract: This is directed to a hook and receiving element combination for securing components forming the shell of an electronic device. The receiving element can include a beam connected to the outer shell component and operative to deflect as the hook element approaches the receiving element. To limit deflections of the outer shell component, the beam can be restrained at opposing ends in directions perpendicular to the beam length, but free to slide along the beam axis. In some embodiments, the receiving element can include a lip for guiding the deflection of the beam as the beam contacts the hook element. In particular, the lip can ensure that the beam deflects at an angle relative to the hook element motion such that a smaller hook element motion is required to engage the beam.

Abstract: A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.

Abstract: A suspended segmented display array in one embodiment includes multiple cables offset from a wall via standoff members. Adjacent display panels attach to cables via finger releasable clamps and present varied and unique visual displays. A versatile and cost-effective display system thus is established that accommodates a wide range of content which can readily be changed out.

Abstract: A telecommunications aggregator enclosure includes a housing and a cover movably connected thereto. The cover is movable between open and closed positions. A printed circuit board is disposed in the housing. At least one first optical termination is connected to the printed circuit board to receive cables from a base station router. At least one second optical termination is connected to the printed circuit board to receive cables from at least one metro cell. A power supply module is connected to the printed circuit board to supply power thereto.

Abstract: An object is to prevent a water-repellent filter, which performs ventilation between the interior and the exterior of a sealed casing and prevents entry of water, from being wetted directly with water. A circuit board is sealed and housed in a casing including a base and a cover, a connector housing including a partition wall is mounted on the circuit board, and an electrical connection between the interior and the exterior of the casing is established. A water-repellent filter is fixed to an inner surface of the partition wall, and an outer surface portion of the water-repellent filter is opened to atmosphere via first and second ventilation holes and first and second connection ventilation holes. Therefore, the water-repellent filter can be avoided from being wetted directly with water.

Abstract: A kickstand for an electronic device includes a standing leg, a base and an adhesive provided on a surface of the base so that the base can be attached to the protective case. The kickstand further includes a shaft and the standing leg is pivoted on the base. The base includes a first opening and a second opening to receive both ends of the shaft, and the shaft is substantially in a shape of a cylinder and includes a head, a body, and a bottom. The shaft further includes a cylindrical hole formed on the bottom and a metal pin is received in the cylindrical hole. The diameter of the head is greater than that of the body. Additionally, the diameter of the bottom is greater than that of the body.

Abstract: An electrical junction box has a main body provided with a circuit board, and a cover externally fitted to the main body. The electrical junction box is assembled in a state in which the main body is accommodated in the cover. The main body includes an opposing surface that opposes an inner surface of the cover. The opposing surface has a water capturing hole that is a recess that opens toward the inner surface of the cover. A first opposing distance between the inner surface of the cover and an upper opening edge of the water capturing hole is larger than a second opposing distance between the inner surface of the cover and a lower opening edge of the water capturing hole.

Abstract: An electronic device is provided. The electronic device includes an electronic component connected to a Printed Circuit Board (PCB), a housing comprising a recess configured to accommodate the electronic component and a hole formed in at least part of the recess to pass the PCB, and a sealing member disposed in at least part of the hole and configured to cover at least part of the PCB.

Abstract: An enclosure for electrical installations includes a bottom part and a cover hinged to the bottom part, the bottom part including a first top edge with a first fastener including a first recess and a first platform for receiving a hinge of the enclosure in a form-locked manner, and a second top edge with a second fastener including a second recess and a second platform that permits the receipt of the hinge of the enclosure in a form-locked manner, and the first fastener and second fastener are arranged on respective top edges of the enclosure to be diametrically opposite each other. In order to hinge the cover on the desired top edge of the bottom part of the enclosure and to provide the locking of the cover to the bottom part with a turnable latch, the first platform forms a first cavity on a first inner wall of the bottom part of the enclosure for receiving the latch, and the second platform forms a second cavity on a second inner wall of the bottom part of the enclosure for receiving the latch.

Abstract: An electronic control unit includes a control board, a battery pack, and a housing that accommodates the control board and the battery pack. The electronic control unit further includes a battery holder that has a bent shape and includes a bottom surface along a longitudinal direction of the battery pack, the battery holder clamping a main body of the battery pack, and a fixing frame that includes a juxtaposing and mounting part on which a plate surface of the control board and the bottom surface of the battery holder are mounted in a state of being adjacent to each other with a boundary line along the longitudinal direction therebetween, the control board and the battery holder being fixed to the juxtaposing and mounting part. The housing includes an opening portion into which the juxtaposing and mounting part of the fixing frame is inserted, and a back side holding portion that holds the juxtaposing and mounting part at an inner back side of the housing opposed to the opening portion.

Abstract: The present disclosure relates to an electronic control apparatus for a vehicle, and the electronic control apparatus of the present disclosure includes: an electronic control element which includes an electronic control board which electrically controls each part of a vehicle, and a heating element which is positioned on a surface of the electronic control board; a cover and a base which accommodate the electronic control element; and a connector which is coupled to the electronic control element, in which an edge part where the cover and the base come into contact with each other is configured in a multi-step bent shape.

Abstract: A housing arrangement of a power electronics device includes one power module or several identical power modules, each module with at least one part connected to a hazardous voltage, the arrangement further including a housing part having room for at least one power module. Each power module includes an enclosure part which essentially surrounds the power module and includes electrically insulating material. All the external connections of the power module are placed on one single wall of the enclosure part. The power modules and the enclosure part of the power modules are arranged such that when the power module is installed to the housing part the power module is electrically insulated from the housing part and external connections of the power module are directed to the front side of the housing part.

Abstract: An integrated power rack for use in a data center is provided. The integrated power rack includes a top, a base, a first side and a second side extending between the base and the top, a back member extending between the top, the base, the first side, and the second side, a divider extending from the top to the base, the divider positioned between the first side and the second side, a revenue sub-compartment defined between the first side and the divider, the revenue sub-compartment configured to receive a plurality of revenue producing devices, and a power sub-compartment defined between the second side and the divider, the power sub-compartment housing power equipment that is configured to provide direct-current (DC) power to the revenue sub-compartment.

Abstract: An electrical service interface system include an energy storage device and inverter mounted to a transformer tower, wherein each of the energy storage device and inverter include guide wheels configured to rollably mount the energy storage device and inverter to corresponding guide rails mounted to a support pad, and to align the energy storage device to the inverter, and the inverter to the transformer tower. In an installed configuration, the energy storage device electrically and mechanically couples to the inverter via a DC connector and one or more latching mechanisms, and the inverter mechanically and electrically couples to the transformer tower via an AC connector and one or more latching mechanisms.

Abstract: An information technology (IT) rack that includes IT appliances, housed by the IT rack, and a set of backplanes. Each backplane includes appliance-interfacing connectors. Insertion of the IT appliances into the IT rack causes mating of backplane-interfacing connectors of the IT appliances with the appliance-interfacing connectors. The IT rack further includes a centrally located interface to which the appliance-interfacing connectors are wired. The centrally located interface determines a connectivity of the IT appliances.

Abstract: In one implementation, an apparatus includes a securing component configured to attach the line card ejector to a chassis of a network communication device, prevent removal of a line card from the chassis when the securing component is in a first configuration, and allow removal of the line card from the chassis when the securing component is in a second configuration. The apparatus also includes an ejection component configured to facilitate insertion and removal of the line card from the chassis of the network communication device. The apparatus further includes a sensor component configured to detect an imminent removal of the line card from the chassis of the network communication device.

Abstract: A slide rail assembly includes a first rail, a second rail, a bracket base, and a bracket. The first rail defines a channel. The second rail is movably connected to the first rail and is longitudinally displaceable relative to the first rail in the channel of the first rail. The bracket base is connected to the first rail. The bracket is movably connected to the bracket base. When displaced in an extending direction from a retracted position toward an extended position relative to the first rail, the second rail drives the first rail to displace the bracket base from a first position to a second position relative to the bracket.

Abstract: Equipment module support brackets, rack-mounted equipment cabinet systems, and related methods can include at least one equipment module, a rack-mounted equipment cabinet for storing the rack-mounted equipment, and at least one equipment module support bracket installed in the rack-mounted equipment cabinet for supporting the at least one equipment module stored in the rack-mounted equipment cabinet. The support bracket can include a longitudinally extending top face, and at least one aperture disposed on opposite ends of a rear facing longitudinal edge of the longitudinally extending top face. The support bracket can include a height of less than one (1) rack unit (RU) when mounted in the rack-mounted equipment cabinet. The support bracket can include at least one server support bracket for supporting a server.

Abstract: A fan assembly for an electronics module is presented, the fan assembly includes a fan housing at least partially enclosing a fan, a first bracket assembly at a first end of the fan housing, the first bracket having a handle and a latching element, and a second bracket disposed on a second end of the fan housing. The handle is movable between an unlatched position for manual grasping of the handle and a latched position for allowing an air flow through the fan assembly.

Abstract: A chassis includes a base, a number of fans mounted in the base, and an air guiding member. The base includes a bottom wall and a sidewall perpendicularly connected to a side of the bottom wall. The fans are mounted on the bottom wall. The air guiding member includes a fixing portion slidably mounted to the sidewall and a guiding portion pivotably connected to the fixing portion. The guiding portion is pivotable to adjust the direction of airflow from the fans.

Abstract: Systems and apparatuses for ensuring proper heat sink installation in an information handling system are disclosed. The information handling system may include a first receiving mechanism configured to receive a first component and to be coupled with a first heat sink for cooling the first component. The information handling system may further include a second receiving mechanism configured to receive a second component and to be interchangeably coupled with one of the first heat sink and a second heat sink for cooling the second component. The information handling system may further include a bracket associated with the first receiving mechanism, the bracket having a key configured to allow the first receiving mechanism to be coupled with the first heat sink and to prevent the first receiving mechanism from being coupled with the second heat sink.

Abstract: In accordance with embodiments of the present disclosure, a vibrational isolator may include at least one supporting section and at least one attachment member mechanically coupled to the at least one supporting section and configured to mechanically couple to a chassis, such that when disposed in a chassis, the at least one supporting section suspends from the chassis and is configured to support vibration-generating equipment. In accordance with these and other embodiments of the present disclosure, a method may include forming at least one supporting section and forming at least one attachment member mechanically coupled to the at least one supporting section and configured to mechanically couple to a chassis, such that when disposed in a chassis, the at least one supporting section suspends from the chassis and is configured to support vibration-generating equipment.

Abstract: A heat dissipating system including a casing body, a heat source and a piezoelectric fan is provided. The casing body includes an upper casing and a bottom case, wherein at least one of the upper casing and the bottom casing includes at least one air inlet. The heat source and the piezoelectric fan are both disposed in the casing body. The piezoelectric fan has an opening facing the heat source while the air inlet is adjacent to the opening. Air is adsorbed into the opening through the air inlet and is exhausted out towards a direction of the heat source by the piezoelectric fan.

Abstract: A cooling system for cooling an electronic component has a heat pipe defined by an inner wall and an outer wall with an intermediate fluid chamber. The heat pipe has a wall to be put in contact with a cold plate and extends away from the cold plate to define a cup shape with a fluid movement member positioned within the chamber to move the fluid from an end of the chamber adjacent to the cold plate to a spaced end of the cup shape.

Abstract: A ground structure of a controller that is mounted in a construction machine such as a dump truck and has a case having an upper surface on which a connector receiver hole for a receptacle connector to be received is provided includes: a cable harness that is provided by a plurality of cables including a ground cable and is connected to the receptacle connector; and a connecting portion for the ground cable to be connected, the connecting portion being provided near the connector receiver hole on the upper surface.

Abstract: A drive unit for driving a motor has a component assembly including a main circuit board having a component side and a solder side, one or more main circuit conductors formed in at least one layer of the main circuit board, a power component module including one or more power components, the power component module having electrical connection terminals for connecting the power component(s) to the one or more main circuit conductors of the main circuit board and a cooling plate coupled to the power component(s) in a manner enabling transfer of heat from the power component(s) to the cooling plate. The power component module is mounted to the component side of the main circuit board. The component assembly further includes a heat sink mounted on the cooling plate and a fan mounted on the heat sink.

Abstract: One or more racks in a rack computing system include shelving systems with mounting portions to receive computer systems in the mounting portion. The mounting portion can include an air flap structure that can restrict airflow through internal space of the mounting portion when a rack computer system is absent from the mounting portion. The air flap structure can retract to enable a computer system to be mounted in an internal space of the mounting portion. A mounting portion can include at least a portion of a backplane assembly that can be aligned to couple with a rack computer system mounted in the mounting portion to communicatively couple the rack computer system with one or more communication networks. The mounting portion can include an ejection mechanism that can eject an installed computer system from the mounting portion.

Abstract: A server enclosure having a plurality of panels abutted to one another and constrained by a connector having a channel and at least one aperture. Each respective panel has at least one perpendicular portion being perpendicular to a face of the respective panel and adjoining a perimeter of the respective panel. Connectivity media coincident to the aperture can affix at least two panels and a connector to one another.

Abstract: A chassis directs cooling air around compute components of an information handling system (IHS). The chassis includes an enclosure having a base wall, an air intake at a front side, and an air exhaust at a rear side. Stiffeners are attached laterally across the base wall and positioned between the front side and a rear area of the base wall. A planar member is horizontally attached on top of the one or more stiffeners. The planar member is provisioned with the compute components, which substantially block air flow above the planar member causing thermal shadowing of the thermal energy generating component that is provisioned in the rear area. Air channels formed through each of the stiffeners direct air flow under the planar member toward the rear area that is provisioned with the thermal energy generating component.

Abstract: To avoid the need to operate in-chassis fans to cool rack-mounted servers in a data center, the data center is arranged into a hot aisle and a cold aisle. The cold aisle is adjacent to a first side of the rack mounted servers and receives cold air from a cold air supply unit. The hot aisle is adjacent to a second side of the rack-mounted servers and has a lower pressure than the cold aisle. Because of the pressure difference between the cold aisle and the hot aisle, cold air flows through the rack-mounted servers, cooling electronic equipment therein, into the hot aisle. Control systems are used to obtain sufficient cooling.

Abstract: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.

Abstract: A data center (100) includes at least one rack room (in for example module 140) having a floor and a plurality of rack storage areas on the floor, each rack storage area being arranged to accommodate a plurality of racks (143) in which a plurality of rack-mountable electronic components may be housed, one or more controllable air circulation systems (in for example module 122), one or more cold aisles (144) in the rack room, each cold aisle being adjacent to a rack storage area, and one or more hot aisles (145) in the rack room, each hot aisle being adjacent to a rack storage area. There may be a large air duct, in the form of a personnel corridor (123), for transporting, under the control of the one or more air circulation systems, cooling air, above the floor, to the one or more cold aisles. The air supply corridor/duct (123) may have a height greater than 1.5 m above the floor and a cross-sectional area of at least 2 m2 and a maximum dimension in the plane of the cross-section of less than 3 m.

Abstract: A data center includes heat producing components and an air handling system that provides reduced relative humidity air to cool the heat producing components. The air handling system includes a thermal storage unit that removes thermal energy from incoming air under a given set of ambient air conditions and releases thermal energy into incoming air under another set of ambient air conditions. Under the given set of ambient air conditions, the thermal storage unit cools the incoming air and causes water vapor to condense out of the incoming air. Under the other set of ambient air conditions, the thermal storage unit releases thermal energy into the incoming air, thus heating the incoming air.