Abstract: The wire grid type polarization device includes a substrate and a plurality of metal layers that includes a first metal layer having a first side face, a second side face opposed to the first side face, and a top part. First and second dielectric layers are provided in the first side face, the second side face, and the top part of the first metal layer. The first dielectric layer is provided between the first metal layer and the second dielectric layer. The optical absorption rate of the first dielectric layer is less than that of the second dielectric layer.

Abstract: A display device including: a first substrate; first through third subpixel electrodes which are disposed on the first substrate to neighbor each other; a second substrate opposing the first substrate; a first wavelength conversion pattern at least partially overlapping the first subpixel electrode and a second wavelength conversion pattern at least partially overlapping the second subpixel electrode; a first light transmission pattern at least partially overlapping the third subpixel electrode and a second light transmission pattern disposed between the first wavelength conversion pattern and the second wavelength conversion pattern; and a low refractive layer which has a lower refractive index than the first and second wavelength conversion patterns.

Abstract: A half mirror includes a circularly polarized light reflecting layer including a cholesteric liquid crystal layer, a barrier layer, a bonding layer, and a front panel. The barrier layer, which is, for example, a layer formed by curing a composition containing a urethane (meth)acrylate monomer, is disposed between the bonding layer and the circularly polarized light reflecting layer.

Abstract: Display devices (100) include a solid state-based light guide illumination device (101), one or more tertiary reflectors (170?), and a display panel (180?). The illumination device and tertiary reflectors provide a backlight for a display panel in the display device. Components of some of the disclosed displays are configured such that the one or two tertiary reflectors uniformly illuminate the rear of the display panel, so that all areas of the display panel have a uniform brightness when viewed by an observer, e.g., directly in front, and along an optical axis, of the display device. Moreover, components of some of the disclosed display devices are configured such that the rear of the display panel is uniformly illuminated regardless of whether the display panel receives the illumination from the illumination device directly, or from the one or two tertiary reflectors.

Abstract: A method for fabricating a backlight source includes determining an n-step MacAdam ellipse in a uniform chromaticity diagram, where n is an integer smaller than or equal to 3; and fabricating the backlight source according to chromaticity coordinates within the n-step MacAdam ellipse to cause chromaticity coordinates of light emitted from different ones of light-emitting diodes of the backlight source to be within the n-step MacAdam ellipse.

Abstract: A lighting device includes LEDs, a light guide plate, and a frame. The light guide plate includes a light guide plate hole portion passing through in a thickness direction, a light entering surface, and a light exiting surface. The frame surrounds the light guide plate. The frame includes an outer peripheral wall portion and an inner peripheral wall portion. The outer peripheral wall portion opposes an outer peripheral end face of the light guide plate. The inner peripheral wall portion inserted to the light guide plate hole portion opposes an inner peripheral end face of the light guide plate on an inner side of the light guide plate hole portion. The inner peripheral wall portion has a configuration in which the opposing surface has a lower light reflectivity than that of an opposing surface of the outer peripheral wall portion.

Abstract: Provided are an ultraviolet curing apparatus and support platform. The ultraviolet curing apparatus includes an ultraviolet irradiation apparatus and the support platform. The ultraviolet irradiation apparatus is configured to irradiate the flexible liquid crystal display (LCD) panel which is to form a flexible LCD panel with ultraviolet rays; the support platform is configured to support the flexible LCD panel; a surface of the support platform used for supporting the flexible LCD panel is a curved surface, and a shape of the curved surface is same with the shape of the LCD panel of which the manufacture process is completed.

Abstract: A liquid crystal display device is disclosed. The liquid crystal display device includes a first substrate, and a plurality of grooves periodically spaced apart from each other over the first substrate. The liquid crystal display device also includes a pixel electrode and a common electrode spaced apart from each other over the first substrate, and a liquid crystal layer including a plurality of liquid crystal capsules on the grooves.

Abstract: The present application discloses an array substrate, a display panel and a display device. The array substrate comprises: a plurality of data lines and a plurality of gate lines, a plurality of pixel units defined by the plurality of data lines and the plurality of gate lines, each pixel unit comprising a first pixel electrode, a second pixel electrode, and at least three thin film transistors, the pixel unit further comprising: a charge-discharge element, the charge-discharge element and a third thin film transistor in the at least three thin film transistors charging and discharging the pixel unit such that the pixel unit forms a first voltage region and a second voltage region with different voltages.

Abstract: The present application discloses a liquid crystal array substrate having an array of a plurality of subpixel areas. The liquid crystal array substrate includes a plurality of first signal lines and a plurality of second signal lines crossing over each other; and a plurality of pixel electrodes corresponding to the plurality of subpixel areas, each of the plurality of subpixel areas including a single one of the plurality of pixel electrodes, and the single one of the plurality of pixel electrodes in each of the plurality of subpixel areas being an integral pixel electrode. Each of the plurality of subpixel areas includes a first subarea and a second subarea having a substantially mirror symmetry with respect to a plane of mirror symmetry containing the one of the plurality of second signal lines in plan view of the array of the plurality of subpixel areas. The first subarea and the second subarea constitute an integral subpixel area.

Abstract: According to an aspect, a display device has a first electrode, a second electrode and liquid crystal layer. When a voltage is not applied to the first and second electrodes, the major axes of the liquid crystal molecules are oriented in a third direction. When a voltage is applied between the first and second electrodes, the major axes are oriented so as to rise in a direction perpendicular to a first substrate while rotating clockwise in a vicinity of one of long sides of comb tooth portion that face each other and counterclockwise in a vicinity of the other of the long sides. An angle between an electrode base-side portion of a long side of each comb tooth portions and the third direction is larger than an angle between a distal end-side portion of the long side of each comb tooth portions and the third direction.

Abstract: The present application discloses a thin film transistor including a base substrate; an active layer; and a first linear polarization block configured to shield at least a portion of the active layer from light. A projection of the first linear polarization block on the base substrate at least partially overlaps with that of the active layer.

Abstract: The present disclosure provides an array substrate, a method for manufacturing the same, and a display device. The array substrate includes a base substrate, and gate lines and data lines arranged on the base substrate to define a plurality of pixel regions, and a diffuse reflection layer arranged in the plurality of pixel regions, in which a surface of the diffuse reflection layer facing a light emitting side of the array substrate is uneven.

Abstract: A method of manufacturing a pixel structure is provided. The method includes: forming a first conductive layer on a substrate, forming a second conductive layer on the substrate, and forming a third conductive layer on the substrate. Wherein, the first conductive layer, the second conductive layer and the third conductive layer are disposed to be overlapped and at a distance separated from each other. The first conductive layer, the second conductive layer and the third conductive layer are overlapped with each other in a vertical space. Further, an active switch is formed in a pixel area after forming the first conductive layer, wherein the first conductive layer is coupled to a drain electrode of the active switch. The second conductive layer is coupled to a first voltage line. The third conductive layer is coupled to a second voltage line.

Abstract: A substrate and a display panel are disclosed. The substrate is divided into a display area and a peripheral area surrounding the display area. A plurality of pixel units are provided in the display area. The substrate includes a plurality of selectively-light-transmissive units, and each of the plurality of pixel units is provided therein with a corresponding selectively-light-transmissive unit. Each of the plurality of selectively-light-transmissive units is in a light-transmissive state or a light non-transmissive state according to a received control signal.

Abstract: A method can be used to control the operation of one or more non-light-emitting, variable transmission devices. In an embodiment, a method of operating a plurality of non-light-emitting, variable transmission devices can include receiving requests for requested visible transmittance for the non-light-emitting, variable transmission devices; determining operating parameters for the non-light-emitting, variable transmission devices; and operating the non-light-emitting, variable transmission devices at the operating parameters, wherein the operating parameters for the non-light-emitting, variable transmission devices are different.

Abstract: The present invention provides optical computing by means of fast Fourier transform Integration on Silicon On Insulator chip technology with implementation in the analog and temporal domain. This is done by cascading (N?2) stages of delayed interferometers (couplers and phase shifters) where a parallel set of N time samples are taken and using the delay lines and phase of the optical components (constructive/deconstructive interference) the DFT is computed. The Optical Fast Fourier Transform (OFFT) design was built on passive components (2×2 couplers: cascaded Mach Zehnder Interferometer) used for addition and subtraction through optical interference, waveguides with short path differences are used for phase shifting and waveguides with long path differences are used for signal delay based on the needed number of outputs. Since the OFFT is a system of imbalanced interferometers, there are additional bends designed to compensate for the difference in power ratios of the arms.

Abstract: A Mach-Zehnder modulator includes: a first semiconductor arm including a lower semiconductor region, an upper semiconductor layer, and a core layer disposed between the lower semiconductor region and the upper semiconductor layer; a second semiconductor arm including a lower semiconductor region, an upper semiconductor layer, and a core layer disposed between the lower semiconductor region and the upper semiconductor layer; a conductive semiconductor region connecting the lower semiconductor regions of the first and second semiconductor arms with each other; and a differential transmission line including a first signal transmitting conductor, a second signal transmitting conductor, and a reference potential conductor. The first and second signal transmitting conductors are coupled to the first and second semiconductor arms, respectively.

Abstract: A handheld illuminating device with a monitoring function includes a main body and a plurality of light-emitting units and a video module at the front end of the main body. The main body is further provided with a wireless module, a display control module, a processor and a power supply module. The processor is electrically connected to the light-emitting units, the video module, the wireless module, the display control module and the power supply module, respectively. The power supply module is electrically connected with the light-emitting units, the video module, the wireless module and the display control module. With the above-mentioned structure, the handheld illuminating device captures real-time video information through the video module. The wireless module receives location information and transmits the real-time video information for remote storage, achieving the purpose of real-time monitoring.

Abstract: Provided is a cover window for covering two or more optical components of a device, the cover window including: a cover member having a top surface and a bottom surface configured for facing the optical components, when the cover member is mounted to the device; at least two light transmitting regions, each disposed in registry with a viewing cone of a respective optical component; and at least one peripheral region extending between the two light transmitting regions and disposed outside the viewing cone of the respective optical components; and a light-absorbing layer disposed at least at a portion of the peripheral region.

Abstract: To improve general versatility by being capable of using a different kind of light source as well as to improve the maintainability. Included is an optical unit including an optical system including a modulator; a signal unit that sends a signal to the modulator; a light source block including a light source that emits light, a lens that allows the light emitted from the light source to enter the optical unit, and a case including the light source inside; a power source block for light source that supplies electric power to the light source; a power source unit that supplies electric power to the signal unit and the power source block for light source; and an outer casing in which the optical unit, the signal unit, the power source unit, the light source block, and the power source block for light source are arranged, and the light source block is replaceable with a different kind of light source block including a different kind of light source.

Abstract: A projection system includes a first lens group that does not move when the projection magnification is changed with the aid of the zoom function, and the first lens group includes a correction lens group that is moved in the direction of the optical axis to correct worsened astigmatism. The projection system satisfies the following conditional expressions (1) and (2): |?BF20|<P×FNO×?2??(1) 1.5<|f1/f|??(2) where P represents the pixel pitch in an image displayed by liquid crystal panels, FNO represents the F number of the entire lens system, ?BF represents the amount of movement of the back focus position in a case where the correction lens group is moved by the amount of movement for correction of the aberration that changes when the temperature changes by 20° C., f represents the focal length of the entire lens system, and f1 represents the focal length of the correction lens group.

Abstract: A color wheel includes a base substrate and at least one fluorescent block. The base substrate includes a first annular portion and a second annular portion. The at least one fluorescent block is arranged on the first annular portion. The fluorescent block is configured to emit fluorescent light in a predetermined wavelength band after being irradiated with a laser beam. The second annular portion includes at least one color filtering portion, and the color filtering portion is configured to filter the fluorescent light. An inner circumference of the second annular portion is not smaller than an outer circumference of the first annular portion, or an outer circumference of the second annular portion is not larger than an inner circumference of the first annular portion.

Abstract: The light source device according to the present disclosure includes: a solid-state light source that emits red light having a luminous flux; a solid-state light source that emits green light having a luminous flux; a solid-state light source that emits blue light having a luminous flux; a dichroic mirror that combines, into combined light, the red light, the green light, and the blue light having exited from the respective solid-state light sources; a dynamic diffusion plate on which the combined light having exited from the dichroic mirror is incident; and a luminous-flux splitting element that splits the luminous flux that having exited from the solid-state light sources for emitting at least one of the red light, the green light, and the blue light.

Abstract: A control apparatus includes a calculator that calculates a target dimming rate of a projection display apparatus based on a feature quantity of image data, a diaphragm controller that controls a diaphragm position of a diaphragm based on a target diaphragm position corresponding to the target dimming rate, and a light source controller that controls a light quantity of a light source based on the target dimming rate and a dimming rate of the diaphragm at least until the diaphragm position of the diaphragm matches the target diaphragm position.

Abstract: A control apparatus includes a calculator that calculates a target dimming rate of a projection display apparatus based on a feature quantity of image data, a diaphragm controller that controls a diaphragm position of a diaphragm based on a target diaphragm position set for each range to which the target dimming rate belongs, and a light source controller that controls a light quantity of a light source on the basis of the target dimming rate and the diaphragm position.

Abstract: This disclosure relates to the field of projection display technologies, and discloses a projection system and a projection screen supporting device, the projection system including a projection screen and a projection device, and further a projection screen supporting device, the projection screen being installed on a bracket body of the projection screen supporting device, where the projection screen supporting device includes the bracket body, a supporting assembly, and a projection screen hanging assembly; the bracket body includes a first standing pole and a second standing pole, both of which are arranged substantially parallel to each other; the supporting assembly is fixed on the bracket body to support the bracket body; and the projection screen hanging assembly is arranged on the bracket body, at an adjustable position in the direction in which the first standing pole and the second standing pole extend, to hang a projection screen on the bracket body.

Abstract: An aerial panoramic oblique photography apparatus includes a pod body provided with at least two nadir cameras and a plurality of oblique cameras. The at least two nadir cameras are arranged in a transverse direction, and the shooting regions of adjacent nadir cameras of the at least two nadir cameras are partially overlapping. Since the aerial panoramic oblique photography apparatus is provided with at least two transversely arranged nadir cameras, a plurality of stripes of aerial images is obtained for each aerial oblique photo-shooting operation. This can increase photo-shooting efficiency, reduce the number of flight, and lower photo-shooting cost. The combination of at least two nadir cameras and a plurality of oblique cameras can capture texture of the sides of urban buildings from multiple angles. Three-dimensional real scenery model of a city can be established more efficiently and completely.

Abstract: Technical solutions are described for fabricating a semiconductor wafer. An example method includes generating a process assumption band for an element of the wafer. The process assumption band depicts a shape of the element based on a set of process variations in a photolithographic process used for fabricating the wafer. The method also includes generating a process variation band for the element of the wafer based on optical process correction simulation of the photolithographic process using design rules associated with the wafer. The method also includes determining a deviation between the process assumption band and the process variation band, and recalculating one or more design rules from the design rules associated with the wafer based on the deviation. The method also includes updating the design of the wafer in response to the process variation band not being changeable to match the process assumption band, after recalculating the design rules.

Abstract: Technical solutions are described for fabricating a semiconductor wafer. An example method includes generating a process assumption band for an element of the wafer. The process assumption band depicts a shape of the element based on a set of process variations in a photolithographic process used for fabricating the wafer. The method also includes generating a process variation band for the element of the wafer based on optical process correction simulation of the photolithographic process using design rules associated with the wafer. The method also includes determining a deviation between the process assumption band and the process variation band, and recalculating one or more design rules from the design rules associated with the wafer based on the deviation. The method also includes updating the design of the wafer in response to the process variation band not being changeable to match the process assumption band, after recalculating the design rules.

Abstract: A photolithography model used in an optical proximity correction process modifies an image output intensity of a point disposed along a two dimensional plane and having coordinates (x,y) in accordance with a gradient of a convolution of a mask value at the point and a sampling pattern function selected at the point. The sampling pattern function includes, in part, a first subset of sampling patterns and a second subset of sampling patterns. The first subset of sampling patterns includes first and second nodes. The second subset of sampling patterns include first and second antinodes. The gradient of the convolution of the mask value and the first and second nodes of the first subset are scaled by a first coefficient. The gradient of the convolution of the mask value and the first and second antinodes of the second subset are scaled by a second coefficient.

Abstract: An overlay compensation method and a related system are presented. The method includes: acquiring a first offset vector reflecting the relative position between overlay marks of a middle and a bottom target layers; acquiring a second offset vector reflecting the relative position between the overlay marks of a top and the middle target layers; decomposing the first offset vector into a first compensable component and a first uncompensable component; decomposing the second offset vector into a second compensable component and a second uncompensable component; computing minimum values of the first uncompensable component and the second uncompensable component; computing optimized values for the first compensable component and the second compensable component; and computing a third compensable component of a third offset vector reflecting the relative position between the overlay marks of the top and the bottom target layers.

Abstract: Pellicle-mask systems for advanced lithography, such as extreme ultraviolet lithography, are disclosed herein. An exemplary pellicle-mask system includes a mask having an integrated circuit (IC) pattern, a pellicle membrane, and a pellicle frame. The pellicle frame has a first surface attached to the pellicle membrane and a second surface opposite the first surface attached to the mask, such that the IC pattern of the mask is positioned within an enclosed space defined by the mask, the pellicle membrane, and the pellicle frame. A void is defined between the pellicle frame and the mask, where the void is defined by a portion of the second surface of the pellicle membrane not attached to the mask. The void is not in communication with the enclosed space and is not in communication with an exterior space of the pellicle-mask system.

Abstract: A photosensitive resin composition, ensuring that after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and a high-adhesion polyimide layer is obtained, and a polyimide using the photosensitive resin composition, can be provided. Furthermore, a semiconductor device in which after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and short circuiting or disconnection following a high-temperature storage test is unlikely to occur. A photosensitive resin composition is characterized by including a component (A) as a photosensitive polyimide precursor, and a component (B) containing a structure represented by formula (B1). (In formula (B1), Z is a sulfur or oxygen atom, and each of R1 to R4 independently represents a hydrogen atom or a monovalent organic group).

Abstract: The present invention provides a negative type photosensitive resin composition having high sensitivity, excellent halftone characteristics, capability to form a small tapered pattern shape, and alkali-developability. The negative type photosensitive resin composition includes, as an alkali-soluble resin (A), at least a weakly acidic group-containing resin (A1) and an unsaturated group-containing resin (A2), the weakly acidic group-containing resin (A1) containing an acidic group having an acid dissociation constant in the range of 13.0 to 23.0 in dimethyl sulfoxide, and the unsaturated group-containing resin (A2) containing an ethylenically unsaturated double bond group.

Abstract: A photoresist baking apparatus is provided. The photoresist baking apparatus comprises a baking chamber including an inlet, an outlet and a cover sealed connected thereon. The cover is applied to guide the hot air entering the baking chamber and includes a heating device for maintaining the temperature of the hot air. The heating device is disposed on the cover for heating the hot air flowing to the cover and maintaining the temperature of the hot air to be consistent when the hot air flowing to the outlet, thereby to prevent from the photoresist volatile condensing and dripping due to decreased temperature after the photoresist volatile contacting the cover and affecting the product quality, and to guarantee the temperature homogeneity inside the baking chamber.

Abstract: An optical system (OS) for focusing a beam of radiation (B) on a region of interest in a metrology apparatus is described. The beam of radiation (B) comprises radiation in a soft X-ray or Extreme Ultraviolet spectral range. The optical system (OS) comprises a first stage (S1) for focusing the beam of radiation at an intermediate focus region. The optical system (OS) comprises a second stage (S2) for focusing the beam of radiation from the intermediate focus region onto the region of interest. The first and second stages each comprise a Kirkpatrick-Baez reflector combination. At least one reflector comprises an aberration-correcting reflector.

Abstract: A method for processing a lithographic printing plate material includes treating the plate material with an alkaline development solution, and treating the plate material with an aqueous liquid whereby the aqueous liquid is sprayed to both the front side and the backside of the plate material.

Abstract: A method for processing a lithographic printing plate includes development with an alkaline solution and gumming with a first gum solution and subsequently with a second gum solution, wherein both gum solutions are provided in a cascade configuration wherein the second gum solution overflows into the first gum solution and wherein the plate material includes an aluminium support having a hydrophilic surface which includes more than 2.0 g/m2 of aluminum oxide.

Abstract: A method for processing a lithographic printing plate includes development with an alkaline solution and gumming with a first gum solution and subsequently with a second gum solution, wherein both gum solutions are provided in a cascade configuration whereby the second gum solution overflows into the first gum solution and wherein the gum solution(s) include a nitrate salt.

Abstract: A lithographic apparatus applies patterns to substrates, the substrates being processed as a plurality of lots. Each lot of substrates receives a particular layer pattern under layer-specific operating conditions. A thermal model is provided for modeling and compensating one or more characteristics of thermal behavior of components within the lithographic apparatus, in response to the varying layer-specific operating conditions associated with a sequence of lots. The thermal model is also used to simulate thermal behavior of the apparatus when processing a given collection of lots in different possible sequences. Based on comparison of the simulated thermal behavior in different sequences of lots, an optimized sequence is determined. Optionally, lot sequencing rules are determined and used to obtain a preferred thermal behavior when processing a collection of lots in the future.

Abstract: Techniques are provided that can select defects based on criticality of design pattern as well as defect attributes for process window qualification (PWQ). Defects are sorted into categories based on process conditions and similarity of design. Shape based grouping can be performed on the random defects. Highest design based grouping scores can be assigned to the bins, which are then sorted. Particular defects can be selected from the bins. These defects may be reviewed.

Abstract: A method comprising: evaluating a plurality of polarization characteristics associated with measurement of a metrology target of a substrate processed using a patterning process, against one or more measurement quality parameters; and selecting one or more polarization characteristics from the plurality of polarization characteristics based on one or more of the measurement quality parameters

Abstract: A target formed on a substrate, the target having: an alignment structure; and a metrology structure; wherein the alignment structure comprises structures that are arranged to generate a beat pattern when the alignment structure is illuminated with source radiation. Advantageously, when the target is illuminated, the beat pattern that appears in an image of the target allows the target to be easily identified using a pattern recognition technique.

Abstract: A system includes a microlithography projection objective configured to image radiation from an object plane to an image plane along a radiation path. The microlithography projection objective has an optical axis. The microlithography projection objective includes a plurality of optical elements along the optical axis of the projection objective. The plurality of optical elements includes an optical element. During use of the system, a liquid is present. The system is configured so that, during use of the system, a distance between the optical element and the image plane is varied to reduce at least one aberration induced by a change in a temperature in the system.

Abstract: A method, includes illuminating a structure of a metrology target with radiation having a linear polarization in a first direction, receiving radiation redirected from the structure to a polarizing element, wherein the polarizing element has a polarization splitting axis at an angle to the first direction, and measuring, using the sensor system, an optical characteristic of the redirected radiation.

Abstract: A support apparatus for a lithographic apparatus has an object holder and an extraction body radially outward of the object holder. The object holder is configured to support an object. The extraction body includes an extraction opening configured to extract fluid from a top surface of the support apparatus. The extraction body is spaced from the object holder such that the extraction body is substantially decoupled from the object holder. The extraction body comprises a projection configured such that it surrounds the object holder and such that, in use, a layer of liquid is retained on the projection and in contact with an object supported on the object holder.

Abstract: A lithography apparatus detects a plurality of first substrate-side marks arranged with respect to a part of shot regions on which patterning is to be performed by using the first original in the lithography apparatus and detects a plurality of second substrate-side marks arranged with respect to other shot regions different from the part of the shot regions on which patterning is to be performed by using the second original different from the first original in another lithography apparatus. The lithography apparatus outputs information on detection results of the plurality of second substrate-side marks to be available in the other lithography apparatus. Then, based on detection results of the plurality of first substrate-side marks, the lithography apparatus performs patterning while performing alignment with the first original with respect to the part of the shot regions.

Abstract: The present invention provides an electrophotographic photosensitive member which has a substrate, a photoconductive layer and a surface layer formed from hydrogenated amorphous silicon carbide in this order. The average value of the carbon content (C/(C+Si)) of the surface layer formed from the hydrogenated amorphous silicon carbide is set at 0.90 or more and less than 1.00, and the average value of the hydrogen content (H/(H+C+Si)) is set at 0.40 or less; and when the average value of the ratios of the sum of a Si—O bond and an O—Si—O bond in the outermost surface region that constitutes a range within a depth of 5 nm or less from the outermost surface of the surface layer is represented by a, and an average value of the silicon content (Si/(C+Si)) is represented by b, 0.015?a*b?0.090 holds.

Abstract: An average value of a hydrogen content ratio of a surface layer made of hydrogenated amorphous carbon is set to be 0.40 or less and a maximum value of an sp2 bonding ratio in an outermost surface region of the surface layer made of the hydrogenated amorphous carbon is set to be 0.50 or less.