Abstract: The present disclosure relates to the field of lighting and more specifically, to a Bluetooth low energy mesh enabled adaptive light emitting diode (LED) driver with wireless battery powered switches for lighting control. In an aspect, the LED driver can include a rectifier (104); a switch mode power supply (106), a wireless Bluetooth and microcontroller board (110) and a portable wireless switch (506). The rectifier (104) can convert AC mains (102) to a DC level. The switch mode power supply circuit (106) can supply a constant voltage output followed by a constant current supply (108) for the LED load. The wireless Bluetooth module (110) can be connected in a mesh topology to other LED drivers, wireless switches and the smartphone. The microcontroller circuit (110) can enable the user to adjust the current level supplied to the LED Load using both analogue and PWM dimming techniques (112).

Abstract: The invention proposes a communication adaptor, comprising within one casing: a transmission antenna, a wired control interface connected to wired control interface terminals, a control circuitry for converting wirelessly received wireless communication signals into wired control interface signals and vice versa, wherein the adaptor is designed such that it can be brought in close contact with a reception antenna of a converter for lighting mean, such as e.g. LEDs, in order to establish a wireless communication, wherein the control circuitry and the wired control interface are powered by means of the wired control interface terminals.

Abstract: A fracturing well site system includes an electric-driven apparatus, a fuel-driven apparatus, an electric-power supply apparatus and a grounding system. The grounding system includes a first grounding terminal which is spaced from each of the electric-driven apparatus, the fuel-driven apparatus and the electric-power supply apparatus by a preset distance. The fuel-driven apparatus and at least one of the electric-driven apparatus and the electric-power supply apparatus are connected to the first grounding terminal, and the first grounding terminal is configured to ground the fuel-driven apparatus and the at least one of the electric-driven apparatus and the electric-power supply apparatus.

Abstract: A raster scanning x-ray source can be light and small, and can have high resolution. A raster-assembly can be attached directly to and can encircle an x-ray tube. The raster-assembly can adjoin or can be very close to the x-ray tube, resulting in a small and lightweight scanning x-ray source. X-rays can backscatter back into the x-ray tube instead of into a detector, thus improving resolution of the resulting image. A voltage-multiplier, which can be used with the x-ray source, can include separate voltage-multiplier-stages in a stack.

Abstract: Encapsulated PCB assembly (1) for electrical connection to a high- or medium-voltage power conductor in a power distribution network of a national grid, comprising a) a PCB (10), delimited by a peripheral edge (20) and comprising a high-tension pad (60, 62) on a voltage of at least one kilovolt, b) an electrically insulating encapsulation body (70) in surface contact with, and enveloping, the high-tension pad and at least a portion of the PCB edge adjacent to the high-tension pad, c) a shielding layer (80) on an external surface (90) of the encapsulation body and for being held on electrical ground or on a low voltage to shield at least a low-voltage portion of the PCB. The high-tension pad extends to the peripheral edge of the PCB.

Abstract: A flexible electronic device (SED) that can conform to a three-dimensional structure, and methods for manufacturing the SED, are disclosed herein. The SED comprises a flexible substrate which is modified in accordance with a folding pattern. The flexible substrate can be folded or unfolded along crease lines of the folding pattern, and the largest deformations of the substrate are localized at the crease lines. Various functional components of the SED are positioned on rigid regions of the substrate defined by the folding pattern. Such that the various functional components are protected from large deformations due to a folding or unfolding process, ensuring good performance of the functional components.

Abstract: A device for manufacturing a stretchable substrate structure according to an embodiment includes a carrier substrate receiving portion configured to receive a carrier substrate therein, a stretchable substrate receiving portion configured to receive a stretchable substrate in a direction facing the carrier substrate, and a diaphragm configured to be deformed by air pressure provided on one surface, wherein the diaphragm comes in contact with an entire surface of the stretchable substrate in a plane direction when deformed, such that the stretchable substrate is combined to the carrier substrate by deforming according to the deformed shape of the diaphragm.

Abstract: There is provided a semiconductor apparatus including a memory controller; a CPU; a high-speed communication controller; a memory operation terminal group that includes a plurality of memory operation terminals for inputting a first signal propagating between an external memory group and the memory controller; a high-speed communication terminal group that includes a plurality of high-speed communication terminals for inputting a second signal to the high-speed communication controller; an inspection terminal group that includes a plurality of inspection terminals for acquiring information from the CPU and performing debugging; and a terminal mounting surface at which the memory operation terminal group, the high-speed communication terminal group, and the inspection terminal group are provided, in which at the terminal mounting surface, a first inspection terminal among the plurality of inspection terminals is located between the memory operation terminal group and the high-speed communication terminal group

Abstract: A component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and having a cavity delimited at least partially by a first polymer, and a component embedded in the cavity of the stack and being at least partially covered by a second polymer, wherein an anchoring interface is formed at an interface between the first polymer and the second polymer at which the first polymer and the second polymer are mechanically anchored with each other.

Abstract: Provided is a sheet-like device suitable for a flexible electrical product that is robust, highly flexible, and operates stably. The sheet-like device includes a first part where a first film layer, a first conversion unit, and a second film layer overlap, a second part where the first film layer is absent and the second film layer is present, and a third part where the first film layer, a second conversion unit, and the second film layer overlap. The first part the second part, and the third part are arranged side by side in this order in a first direction. A first region including the first part the second part, and the third part has an elongation per unit length greater than an elongation per unit length of the first film layer alone when a same force is applied in the first direction at 20° C.

Abstract: A wiring substrate includes: a base material; a first through-hole and a second through-hole that are formed in the base material; magnetic material that is filled in the first through-hole; a third through-hole that is formed in the magnetic material; a first plating film that covers an inner wall surface of the third through-hole; and a second plating film that covers an inner wall surface of the second through-hole and the first plating film. The first plating film includes a first electroless plating film that is in contact with the inner wall surface of the third through-hole, and a first electrolytic plating film that is laminated on the first electroless plating film.

Abstract: An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.

Abstract: A package circuit structure includes a multilayer circuit board, an electronic component, and an insulating layer. The multilayer circuit board includes a metal portion and an opening. The opening is extending from a first side of the multilayer circuit board toward the second side of the multilayer circuit board facing the first side. A bottom of the opening is sealed by the metal portion. The electronic component is received in the opening and adhered to the metal portion. The electronic component is electrically connected to the multilayer circuit board and encapsulated in the opening by the insulating layer. A method for manufacturing the package circuit structure is also provided.

Abstract: An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; an electrical interface for a processor substrate at the first main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage. The power device module has at least one contact configured to receive the voltage provided at the second main side of the electrically insulating material. Distribution circuitry embedded in the electrically insulating material is configured to carry the lower voltage provided by the power device module to the first main side of the electrically insulating material.

Abstract: A reflowable grid array (RGA) interposer includes first connection pads on a first surface of a body and second connection pads on a second surface of the body. Heating elements within the body are adjacent to the second connection pads. First interconnects within the body connect some of the second connection pads to the first connection pads. Second interconnects within the body connect pairs of the second connection pads. A motherboard assembly includes first and second components (e.g., CPU with co-processor and/or memory) and the RGA interposer. The first connection pads are in contact with motherboard contacts. The second connection pads are in contact with the first and second components. The first component passes signals directly to the motherboard by the first interconnects. The second component passes signals directly to the first component by the second interconnects but does not pass signals directly to the motherboard by the first interconnects.

Abstract: A method of inspecting a printed wiring board includes preparing a printed wiring board having product and inspection regions such that the board has inner-layer lands in the regions, forming vias on the inner-layer lands in the regions, forming outer peripheral part(s) in the wiring board such that the outer peripheral part(s) expose outer peripheral portion(s) of the inner-layer land in the inspection region, determining a center coordinate of the inner-layer land in the inspection region based on a position of the outer peripheral part(s), determining a center coordinate of the via(s) in the inspection region based on a shape of the via(s) in the inspection region, determining a misalignment amount based on a distance between the center coordinate of the inner-layer land and the center coordinate of the via(s) in the inspection region, and determining alignment accuracy between the via and the inner-layer land based on the misalignment amount.

Abstract: A display device, includes: a substrate including a display front portion, a display curved portion, a non-display curved portion, and a non-display rear portion; a display layer attached to the display front portion and the display curved portion; a member attached to an inner side of the substrate, and including articulations attached to an inner side of the non-display curved portion; and a window attached to an outer side of the display layer; wherein: the display layer is attached to an outer side of the substrate; at least a portion of the display curved portion forms a first generally curved surface; at least a portion of the non-display curved portion forms a second generally curved surface; the non-display rear portion forms a substantially flat surface; at least one of the articulations has a cross-sectional width that decreases in a direction away from the substrate; and at least one of the articulations contacts each other to form the second generally curved surface of the non-display curved porti

Abstract: A display apparatus includes a display panel, a substrate, and a frame structure. The substrate has an outer circumference end face including a first end face part and a second end face part intersecting the first end face part at a first intersection, a first groove formed on the first end face part and extending in a first direction, and a second groove formed on the second end face part and extending in a second direction. The frame structure holds the display panel and the substrate, and has a cyclic frame part surrounding the substrate and the display panel, a first rib erected on a first part of the frame part, and a second rib erected on a second part of the frame part.

Abstract: An information handling resource may include a housing configured to enclose components of the information handling resource and a latch comprising a body and a purchase. The body may be coupled to the housing such that the latch is rotatable relative to the housing about an axis parallel to an exterior face of the housing and further rotatable in a plane perpendicular to the exterior face such that the body is rotatable from a closed position relative to the housing to an open position relative to the housing and vice versa. The purchase may be coupled to the body such that the purchase is rotatable relative to the body about an axis parallel to the plane in which the body rotates relative to the housing such that the purchase is rotatable from a first position relative to the body to a second position relative to the body and vice versa.

Abstract: A combination mounting bracket for an information handling system includes a main bracket and an adjustable bracket. The main bracket is securely mounted on a display device of the information handling system. The adjustable bracket includes a mounting surface and multiple standoffs. The mounting surface is configured to be placed in physical communication with a stand for the display device. The standoffs are in physical communication with the mounting surface and with the main bracket. The standoffs are configured to transition between an extended position and a compressed position.

Abstract: A veneer for a wall-mounted keypad may include indicia that are laser cut therethrough and that are representative of functions that may be performed by the keypad. The veneer may include a recess that extends into an inner surface of the veneer, proximate to the indicia. The recess may be shaped such that a perceived aesthetic of an outer surface of the veneer is preserved during formation of the indicia. The recess may for example have an organic shape defined by a curved outer perimeter that does not define any corners.

Abstract: A fiber optic node includes an electronics equipment enclosure. The electronics equipment enclosure includes a lid and a base defining an overall interior space of the electronics equipment enclosure. The lid includes a lid top and a lid mating surface to contact and overlap a base mating surface of the base to close the electronics equipment enclosure. The lid further includes at least one lid side wall extending away from the lid top. The at least one lid side wall includes at least one protruding lid side wall extending outwards to project beyond the lid mating surface. The base includes a base bottom and at least one base side wall extending away from the base bottom. The base further includes a base mating surface to contact and overlap the lid mating surface of the lid to close the electronics equipment enclosure.

Abstract: A waterproof device including a casing structure, a cover structure, a first engaging plate, a second engaging plate, a first elastic member, and a second elastic member is provided. The casing structure, on which the cover structure is disposed, includes a bottom plate, a first side plate, a second side plate, a third side plate, and a fourth side plate. The first engaging plate is disposed adjacent to the first side plate, and the first elastic member is connected therebetween. The second engaging plate is disposed adjacent to the second side plate, and the second elastic member is connected therebetween. The first engaging plate can reciprocate between a first positioning position and a first disengagement position relative to the first side plate, and the second engaging plate can reciprocate between a second positioning position and a second disengagement position relative to the second side plate.

Abstract: The present disclosure relates to the field of power electronics, and proposes a power conversion system, including a power cabinet, a first divider and a plurality of power modules. The power cabinet includes a first high voltage compartment and a first low voltage compartment. The first divider is arranged in the power cabinet, and extends along a height direction of the power cabinet to separate the first high voltage compartment and the first low voltage compartment. The plurality of power modules are arranged in the power cabinet, each power module includes a high voltage input terminal and a low voltage output terminal; the high voltage input terminal is arranged in the first high voltage compartment, and the low voltage output terminal is arranged in the first low voltage compartment.

Abstract: A modular electrical bus system for a valve manifold has a communication module, a valve driver module, and a plurality of I/O modules each having a plurality of I/O fittings being both electrically and mechanically connectable together via a bridge member connecting adjacent modules. The bridge member has a housing with an interior for housing electronic components for memory storage or Wi-fi reception and transmission that is operably connected to a complementary electrical fitting constructed to be connected to an electrical fitting of a module of said electrical fieldbus system without adding extra length to said bank of modules of said electrical fieldbus system.

Abstract: A monitoring-and-control drawer for an electrical enclosure is connected to an electricity source and to an electrical load and is linked to at least one communication interface allowing the drawer to be supplied with power or to communicate with an industrial computer. The monitoring-and-control drawer is mobile within the enclosure between three main positions: a disconnected position, a test position, and an operating position. At least one lateral structure comprises a mobile lateral contact (352) comprising electrical contacts (436) which, during the movement of the drawer between the test position and the operating position, are fixed with respect to a communication interface and connect the drawer to this interface.

Abstract: A host casing of an electronic device includes a housing, a filler panel, and a disassembly and assembly structure. A front side of the housing has an opening. The dummy cover is disposed in the opening of the housing. The disassembly and assembly structure is disposed inside the housing. In a first state, the disassembly and assembly structure buckles with the dummy cover, thereby fixing the dummy cover. In a second state, the disassembly and assembly structure releases the dummy cover, and simultaneously pushes the dummy cover out of the opening. Therefore, the replacement action between the dummy cover and a pluggable device can be effectively simplified, so that maintenance personnel can easily assemble or disassemble the dummy cover without the assistance of additional tools.

Abstract: Guide holders for engaging a motherboard sled with an input-output sled stacked thereon within an electronic chassis, are disclosed. The electronic chassis includes a motherboard sled having a housing having a first sidewall and a second sidewall opposite to the first sidewall, a first guide holder and a second guide holder. The first guide holder is coupled to the first sidewall and includes a first plurality of slots for directing motion of a first plurality of guide pins of an input-output sled in a predetermined direction. The second guide holder is coupled to the second sidewall and includes a second plurality of slots for directing motion of a second plurality of guide pins of the input-output sled in the predetermined direction. The motion of the first plurality of guide pins and the second plurality of guide pins, upon completion, locks the input-output sled to the motherboard sled.

Abstract: A connection mechanism is provided with a circuit board that replaces internal chassis cabling to multiple electronic devices. In use, the motion of a lever of the connection mechanism drives a carrier of the circuit board in one direction to make an electrical connection at a side of the circuit board. Continued motion of the lever drives the carrier downward to make an additional electrical connections at the bottom of the circuit board.

Abstract: A storage device frame assembly is configured to be mounted on a first side plate. The storage device frame assembly includes a support frame and a handle. The support frame is configured to be removably mounted on the first side plate. The handle includes a pivotable component and a slidable component. The pivotable component is pivotably disposed on the support frame. The slidable component is slidably disposed on the pivotable component.

Abstract: An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

Abstract: A knockdown water-cooling unit latch device structure includes a latch device assembly having multiple latch members. The latch members are correspondingly assembled with each other around a water-cooling unit. The latch members are connected with each other via at least one connection member. Alternatively, the latch members are directly assembled with each other by means of engagement or lap joint. The latch members of the latch device assembly are assembled with the water-cooling unit so that when the latch device assembly is assembled with the water-cooling unit, the latch members will not interfere with the water-cooling unit.

Abstract: A cold plate has, on a surface thereof, an attachment surface for contacting a cooling object, and has, in the interior thereof, an accommodating portion that accommodates a cooling medium. The cold plate is provided with a first opening that communicates with the accommodating portion, a body-side connection pipe is connected to the first opening, a tube-side connection pipe, which has a bendable tube connected to one end thereof, is connected to the body-side connection pipe. The body-side connection pipe and the tube-side connection pipe are connected so as to be able to rotate about the pipe axis.

Abstract: A coolant distribution unit providing reliant circulation of coolant in a liquid cooling system for a heat-generating component such as a computer server is disclosed. The coolant distribution unit includes a manifold unit having a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold unit. The first pump circulates coolant from the inlet to the outlet. A second pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The second pump may be disconnected from the manifold unit, while the first pump continues to circulate coolant through the manifold unit.

Abstract: A sensing device for a vehicular sensing system includes a housing having a front housing portion and a metallic rear housing portion. A first printed circuit board and a second printed circuit board are disposed in the housing. The second printed circuit board is electrically connected to the first printed circuit board, which has an electrical connector for electrically connecting the sensing device to a vehicle wire harness. The second printed circuit board has circuitry thereat, with the circuitry generating heat when the sensing device is operating. The rear housing portion comprises a thermally conductive element that extends through an aperture of the first printed circuit board and is thermally coupled at the second printed circuit board. The thermally conductive element conducts heat generated by the circuitry of the second printed circuit board to the rear housing portion to dissipate the heat from the sensing device.

Abstract: A cooling device includes: a duct that guides air that has absorbed heat generated inside a cooling target and has been discharged, to the cooling target; a cooler that is provided in the duct and cools the air flowing inside the duct; and an adjusting mechanism that is located on a downstream side of the cooler, adjusts an amount of the air discharged from the duct into a room where the cooling target is installed.

Abstract: A system includes a central supply line and a central return line connected to a fluid source of cooling liquid. A rack supply manifold is connected to the central supply line. A rack return manifold is connected to the central return line. A liquid cooling loop assembly may be coupled to at least one cooling device connected to a circuit board. Multiple inlet connectors may be connected to the rack supply manifold. Multiple outlet connectors may be connected to the rack return manifold. The multiple inlet connectors provide a passageway for the cooling liquid from the central supply line into the liquid cooling loop assembly for distribution to the at least one cooling device. The multiple outlet connectors provide a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device.

Abstract: An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel.

Abstract: Embodiments disclosed include a heat exchange apparatus and method comprising, in an electronic device, a first heat exchanger for exchanging heat with the device wherein the heat exchanger comprises a flow duct for receiving a fluid, and at least a portion of the flow duct is arranged for thermal communication with the device. Preferred embodiments include a pressure reducing unit comprising a pump associated with the flow duct and a Venturi tube configured for reducing the pressure of the fluid in the portion of the flow duct arranged in thermal communication with the device and less than the pressure external to the duct. An embodiment includes a fluid reservoir, and a second heat exchanger for removing heat from the fluid reservoir wherein the second heat exchanger comprises an evaporator in a refrigerant system through which refrigerant is passed in a closed loop via an expansion valve from a gas cooler and back into a compressor.

Abstract: A cooling system comprises a board management controller (BMC), a thermoelectric cooling (TEC) controller, and a cooling distribution unit (CDU) controller. The BMC monitors a cooling system to obtain a first power value representing a power consumed by an electronic device, performs a lookup operation in a control lookup table based on the first power value, and determines a first thermoelectric cooling (TEC) current and a first pump speed based on the lookup operation. The TEC controller is to control a TEC device attached to the electronic device to cause the first TEC current to flow within the TEC device. The CDU controller is to configure a pump speed of a fluid pump of the CDU according to the first pump speed.

Abstract: In a housing of a vehicle control device are formed a suction port for taking outdoor air and a discharge port for discharging air taken in through the suction port. A flow passage that connects the suction port and the discharge port is formed inside the housing. A blocking member, a radiator, and a blower are provided in the flow passage. The blocking member is provided at a position where the blocking member faces at least a portion of an opening face of the suction port in the flow passage and a distance between the blocking member and the suction port is in a predetermined range.

Abstract: A power electronics module for an industrial or vehicle battery charger system or the like is provided. The power electronics module utilizes a chassis housing including a heatsink surface and a plurality of sidewalls. A main power section printed circuit board is disposed adjacent to the heatsink surface of the chassis housing a. A low voltage, low power printed circuit board is disposed adjacent to the main power section printed circuit board opposite the heatsink surface of the chassis housing. An alternating current input filter portion printed circuit board including electromagnetics is disposed along one of the plurality of sidewalls of the chassis housing and separated from the low voltage, low power printed circuit board within the chassis housing.

Abstract: A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.

Abstract: An automatic exchanging device is provided which moves alongside the front face of a component mounting line. When an automatic exchange request for a feeder is generated in any of multiple component mounting machines constituting the component mounting line, the automatic exchanging device moves to the front of the component mounting machine in which the automatic exchange request was generated to automatically exchange the feeder. When a new automatic exchange request is generated in any one of the component mounting machines, a pull-out operation of a predetermined number of component mounting machines is prohibited, from the component mounting machine facing the automatic exchanging device toward the position of the component mounting machine in which the new automatic exchange request was generated.

Abstract: An insertion tool for assisting in the insertion of an OCP 3.0 type expansion card in an expansion card slot of a computer system is disclosed. The expansion card may be a pull tab type form factor that does not have a mechanism such as an ejector latch to assist in applying force to insert the card. The expansion card has a front panel opposite a distal edge connector. The tool has a handle and a head coupled to the handle. The head has two contact areas that contact different areas of the front panel of the expansion card. For example, one of the contact areas may be an extended side arm and the other area may be a lateral rib extending from the head.

Abstract: A component mounting system includes multiple component mounting lines where multiple component mounters and a feeder storage are aligned along a board conveyance direction, a feeder exchange device configured to move along the board conveyance direction to exchange the feeder between the component mounter and the feeder storage of the component mounting line in charge, and a memory device. The feeder exchange device is configured to store an in-process feeder in the feeder storage of the component mounting line in charge, when it is determined, based on production information and feeder information, that there is the in-process feeder that was used in the component mounting line in charge and is scheduled to be used in another component mounting line.

Abstract: A maintenance management device comprises: an inspection device configured to inspect an exchangeable element in a component mounting machine configured to mount a component on a circuit board; and an information management section configured to store statistical information in which results of multiple inspections with the inspection device are linked to identification information for each of multiple exchangeable elements targeted for inspection.

Abstract: A static random access memory device includes a first gate of a write port circuit disposed in a standard threshold voltage region of a substrate and a second gate of a read port circuit disposed in a low threshold voltage region, abutting the standard threshold voltage region, of the substrate. A distance between a first edge, corresponding to an edge of the first gate, and a boundary, between the standard threshold voltage region and the low threshold voltage region, is different from a distance between the boundary and a second edge, corresponding to an edge of the second gate.

Abstract: A semiconductor device includes first and second fin type patterns, first and second gate patterns intersecting the first and second fin type patterns, third and fourth gate patterns intersecting the first fin type pattern between the first and the second gate patterns, a fifth gate pattern intersecting the second fin type pattern, a sixth gate pattern intersecting the second fin type pattern, first to third semiconductor patterns disposed among the first, the third, the fourth and the second gate patterns, and fourth to sixth semiconductor patterns disposed among the first, the fifth, the sixth and the second gate patterns. The first semiconductor pattern to the fourth semiconductor pattern and the sixth semiconductor pattern are electrically connected to a wiring structure, and the fifth semiconductor pattern is not connected to the wiring structure.

Abstract: A method includes forming a stack of material layers to cover an array region and a periphery region of a substrate. A first patterned mask layer is formed, and the pattern of the first patterned mask layer is transferred to the stack of material layers, thereby forming a first array pattern and a first periphery pattern respectively in the array and periphery regions. A second patterned mask layer is provided above the first array and periphery patterns. The pattern of the second patterned mask is not aligned with the pattern of the first patterned mask. The pattern of the second patterned mask layer is transferred to form the first and second sacrificial patterns respectively in the array and periphery regions. The first array pattern, the first and second sacrificial patterns, and the first periphery pattern are simultaneously transferred to form a second array pattern and a second periphery pattern.