Abstract: A flexible circuit board and display device including the same are disclosed. In one aspect, the flexible circuit board includes a base film including a bending area and a plurality of signal wires formed over the bending area of the base film. At least one through-hole is defined in the base film.

Abstract: The present disclosure provides an assembly method of an electronic device. The assembly method includes: opening an upper cover of a loading mechanism on a circuit board, in which the upper cover has an opening, and when the upper cover is in a closed state, the opening exposes a central processing unit socket located on the circuit board; snapping an elastic sheet to opposite sides of an inner edge of the opening of the upper cover through buckling portion of the elastic sheet; and closing the upper cover of the loading mechanism so that an elastic sheet body of the elastic sheet covers the central processing unit socket.

Abstract: A method for applying an electrical conductor to an electrically insulating substrate, the method comprising providing a flexible membrane with a pattern of grooves formed on a first surface thereof, and loading the grooves with a composition comprising particles of a conductive material. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back surface of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded into the grooves adheres to the substrate. The membrane(s) may remain on the electrically insulating substrate. The electrically conductive particles in the composition can then be sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).

Abstract: A method for manufacturing a multilayer circuit board includes providing an inner circuit substrate defining a through hole, attaching a support plate to the inner circuit substrate to seal an opening of the through hole; placing an electronic module in the through hole; pressing a first substrate onto a surface of the inner circuit substrate; removing the support plate; pressing a second substrate onto another surface of the inner circuit substrate, the first substrate and the second substrate infilling the through hole and jointly encapsulating the electronic module; forming a first conductive wiring layer on a surface of the first substrate facing away from the first surface to obtain a first circuit substrate, and forming a second conductive wiring layer on a surface of the second substrate facing away from the second surface to obtain a second circuit substrate. A multilayer circuit board is also disclosed.

Abstract: A passive circuit element is disclosed. The passive circuit element includes an array of conductive pads arranged on a substrate such that a gap is formed between each of the conductive pads. The passive circuit element further includes a first wire electrically connected to a first conductive pad of the array of conductive pads such that the first wire passes through a first gap formed between a second conductive pad and a third conductive pad. The passive circuit element further includes a second wire electrically connected to a fourth conductive pad of the array of conductive pads such that the second wire passes through the first gap. At least one of the second and third conductive pads has a substantially planar side facing toward the first gap.

Abstract: A printed wiring board includes an insulating layer, a first conductor layer formed on the insulating layer, an adhesive layer formed on the first conductor layer, a resin insulating layer formed on the insulating layer such that the adhesive layer is formed between the first conductor layer and the resin insulating layer, and a second conductor layer formed on the resin insulating layer. The first conductor layer is formed such that the first conductor layer has a smooth upper surface and a smooth side surface and that the adhesive layer has a smooth film formed on the smooth upper and side surfaces, and a protruding part protruding from the smooth film.

Abstract: In some embodiments, a storage device includes a printed circuit board, a memory device coupled to the printed circuit board, a storage controller which controls the memory device and is coupled to the printed circuit board, an active interposer including a logic element coupled to the printed circuit board, a sensor disposed inside the active interposer and configured to sense an impact and provide a sensor signal of the impact to the storage controller, and a strain gauge disposed inside the active interposer and configured to measure a physical strain and provide a signal about the physical strain to the storage controller.

Abstract: A housing assembly and a method for preparing the same, and an electronic device are provided. The housing assembly includes a glass body. The glass body has multiple micrometer-sized pointed protrusions on a first surface of the glass body. Each of the multiple pointed protrusions includes an apex, a base, and three lateral surfaces each extending from the apex to the base. At least 95% of the multiple pointed protrusions each have a length-width ratio of 1:(0.6-31/2/2).

Abstract: A terminal apparatus assembly include: a terminal configured to be selectively fastened to a bracket; and a locking unit including an inner locking part configured to be movable with respect to the bracket such that the terminal and the bracket are fastened to or separated from each other. The inner locking part is configured to move in one direction toward the bracket or the terminal when at least a portion is pressed by an external force and to move in a direction opposite to the one direction by a restoring force when the pressing is released.

Abstract: A display device includes a substrate including a first area, a second area, and a bending area between the first area and the second area, a light-emitting element disposed on the first area, a driver disposed on the second area, and a support part that is disposed under the substrate. A first opening and a plurality of second openings are defined in the support part. The first opening overlaps the bending area and the plurality of second openings overlap the first area.

Abstract: A display device includes: a front cover that is optically transmissive; a design sheet that is optically transmissive and is arranged on the front surface side or the back surface side of the front cover; a cushion layer that is optically transmissive and is arranged on the back surface side of the front cover; and a light source that is arranged on the back surface side of the cushion layer. The cushion layer includes a plurality of first recessed portions each of which is, in a cross-sectional view taken along a plane parallel to a stacking direction of the front cover and the design sheet, in a projecting shape in the stacking direction and is in a recessed shape on the back side of the projecting shape.

Abstract: An electronic device is provided. The electronic device includes a cover, a flexible display having at least a portion arranged inside the cover, a roller which is arranged inside the cover and ensures that at least the portion of the flexible display is rolled, a bracket which is arranged inside the cover and configured to cover at least the portion of the flexible display, a battery disposed between the cover and the bracket, and a flexible printed circuit board (FPCB) which is connected to the battery and arranged at one side of the battery, wherein the FPCB may be electrically connected to a display driving circuit of the flexible display, the display driving circuit being arranged in the roller.

Abstract: The description relates to hinged devices. One example relates to a device that has a first portion hingedly secured along a spine and a second portion hingedly secured along the spine. The example can also include a first spine cover secured relative to the spine and extending into the first portion and a second spine cover secured relative to the spine and extending into the second portion. An extent to which the first spine cover extends into the first portion and the second spine cover extends into the second portion is controlled by an angular orientation of the first and second portions.

Abstract: According to certain embodiments, a foldable electronic device comprises: a flexible display disposed on a front surface of the foldable electronic device; a housing forming an exterior of the foldable electronic device and foldable around a folding axis, the housing comprising a bezel formed along an edge of the flexible display; a window stacked on the flexible display; and an adhesive layer bonding the window to another element, the adhesive layer comprising: a first area comprising a first adhesive; and a second area which is formed along an edge of the first area, and has an area which corresponds to the bezel, the second area comprising a second adhesive; wherein a strength of the second adhesive can be weakened in a different manner than the strength of the first adhesive.

Abstract: An electronic device includes a housing, a first protrusion portion and a first covering member. The housing has a bottom portion. The first protrusion portion is arranged on the bottom portion of the housing, wherein the first protrusion portion has a first groove through which a first wire passes. The first covering member detachably covers the first protrusion portion, wherein the first covering member has a first opening. In a first position, the first opening of the first covering member is used for allowing the first wire to pass through.

Abstract: A temperature adjusting structure for an electronic equipment provided inside a vehicle includes a first region. The first region is connected, through an air supply port, to at least one of a different region from the first region that is to have cooler air or warmer air than the first region, and a duct of an air conditioner of a vehicle. Air which is to flow into the air supply port is to flow into a region where the electronic equipment is present in the first region.

Abstract: An electronic control unit (ECU) with separable cooling and memory modules is described. The cooling module has an integrated liquid-cooling circuit with a direct connection to the cooling circuit. The memory module includes an independent memory that can store data and be tested independent of the cooling module. The cooling module and the memory module contact at thermal-contact surfaces to enable cooling when installed in a vehicle. In this way, the cooling module may provide cooling through the thermal-contact surface to one or more memory modules and the memory module may be implemented without an internal cooling system.

Abstract: An immersion cooling apparatus includes a pressure vessel including a vessel body and at least one lid. The at least one lid is detachably joined to the vessel body, wherein a certain lid of the at least one lid has a coolant outlet and a coolant inlet. The pressure vessel is filled with liquid coolant. A mounting member places the circuit board at a position between the coolant outlet and the coolant inlet within the pressure vessel. The circuit board is immersed in the liquid coolant within the pressure vessel such the circuit board is surrounded with the liquid coolant. The liquid coolant forcedly flows from one side of the circuit board to outside through the coolant outlet and forcedly flows into the other side of the circuit board from outside through the coolant inlet.

Abstract: A liquid-cooling plate for a CPU, includes a circulating liquid-cooling main body, a peripheral frame, a base and a liquid accumulation reservoir. The base has a central portion and a peripheral portion surrounding the central portion. A step is formed between the central portion and the peripheral portion so that the central portion is raised over the peripheral portion. The central portion defines an interior space and has a cover and two faucets. The interior space is adapted to accommodate the circulating liquid-cooling main body, and the cover closes the interior space. The two faucets are located above the cover and communicate with the circulating liquid-cooling main body. The liquid accumulation reservoir is located external to the central portion and is adapted to contain a liquid leaked from the faucets. By integrating the liquid accumulation reservoir in the liquid-cooling plate, an effective saving in an interior space of a server is resulted.

Abstract: Disclosed are a heat sink base and a heat sink. The heat sink base includes a base body. The bottom of the base body is provided with at least one protruded structure, and the bottom of the base body abuts against the top of the CPU. Each of the at least one protruded structure includes a gentle region with a protrusion, and a slope region surrounding the protruded gentle region with the protrusion. The gentle region of the protruded structure abuts against a high heat flux region at the top of the CPU, thus forming a region with relatively high pressure and relatively stable pressure compared with the slope region. Therefore, the heat sink base provided by the present invention has a simple and reasonable structure, and can efficiently dissipate the heat generated by the CPU, thus improving the cooling efficiency and obtaining more stable and more consistent cooling performance.

Abstract: A device of drawing out surface heat of an electronic component includes a housing, a liquid inlet port, a liquid outlet port, a partition wall and flow guiding walls. The housing includes opposite a contact wall and a heat dissipating wall, and a side wall respectively connected to the contact wall and the heat dissipating wall. The liquid inlet port and the liquid outlet port are formed on the side wall. The partition wall is formed in the housing, and connected to inner surfaces of the contact wall, the heat dissipating wall and the side wall, to divide an interior of the housing into an inflow channel and an outflow channel. The flow guiding walls are respectively formed in the inflow channel and the out flow channel, and connected to the inner surface of the contact wall.

Abstract: A method of forming a power electronics assembly includes forming a plurality of pathway openings in a heat exchanger body and inserting a tubular member in each pathway opening of the plurality of pathway openings. The tubular member includes a plurality of internal surface enhancements. An interference fit is defined between the tubular members and the heat exchanger body via one or more of mechanical or thermal expansion to define a plurality of fluid pathways in the heat exchanger. One or more power electronics devices are installed to the heat exchanger body.

Abstract: An information technology (IT) enclosure includes an IT container having immersion coolant self-contained therein, one or more cooler trays and one or more dedicated battery spacings that are alternately arranged in a series manner within the IT container. Each cooler tray to house a cooler, each battery spacing to house one or more rows of battery packs. The IT enclosure includes a supply channel disposed at a first side of the IT container, and a return channel and a fluid pump disposed at another side of the IT container. Where, when in operation, the immersion coolant circulates amongst the alternate one or more rows of battery packs and coolers to transfer a thermal load from the one or more rows of battery packs to the coolers.

Abstract: Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.

Abstract: An electronic device protecting casing with heating function includes: a casing; a battery box within the casing; an interior of the battery box being arranged with a battery, a back side of the battery box being formed with an opening for receiving the battery; an outer cover serving to seal the opening; an inner side of the outer cover being formed with a heat isolation sheet; a heating unit being installed within the casing for heating the tablet computer; the heating unit including an electric heating plate. When power of the battery is transferred to the electric heating plate, the electric heating plate generates heat power and then transfers the power to the tablet computer for heating it; and a control circuit is installed within the casing; the electric heating plate is connected to the battery through a control switch; and the control circuit is connected to the control switch.

Abstract: To provide a radiation sheet that exhibits favorable heat dissipating performance, a heat dissipation plate including the radiation sheet, a heat dissipation device provided with the heat dissipation plate, and a curable paste capable of being suitably used for forming the above-mentioned radiation sheet. A sheet including a cured material of a curable paste that contains a polymerizable monomer (A) having only an ethylenic unsaturated double bond-containing group as a polymerizable group, a radical polymerization initiator (B) and a layered silicate (C) is used as a radiation sheet.

Abstract: A liquid-cooling heat-dissipation structure is provided, which includes a first structure having a plurality of skived fins and a second structure having a plurality of guide fins. The first structure and the second structure are combined to each other, so that a chamber is formed between the first structure and the second structure for receiving a working fluid, and the skived fins and the guide fins are disposed in the chamber.

Abstract: An electronic control device capable of improving cooling performance by air cooling is provided. The electronic control device includes a circuit board 6 (board), a heat-generating component 7 (heating element) mounted on the circuit board 6, a heat dissipation material 12 (thermally conductive material) that is in contact with the heat-generating component 7 and conducts heat of the heat-generating component 7, a fin-integrated housing 3 (housing) that is in contact with the heat dissipation material 12 and covers the circuit board 6, and a cover 1 that covers the fin-integrated housing 3. The cover 1 has a hole (2) 8 and a hole (3) 9 as intake holes, and a hole (1) 2 as an exhaust hole. The hole (1) 2 is formed at a position close to the heat-generating component 7 relative to the hole (2) 8 and the hole (3) 9. The hole (2) 8 and the hole (3) 9 are formed at positions away from the heat-generating component 7 relative to the hole (1) 2.

Abstract: A housing structure includes a first cover and a second cover. The first cover includes a first substrate and two first side plates. The second cover includes a second substrate and two second side plates. The two first side plates and the two second side plates are spliced between the first substrate and the second substrate, such that an accommodating space is formed between the first cover and the second cover.

Abstract: A heat dissipation module comprises: a heating element; a heat dissipation member disposed on one side of the heating element and including a first plate and a second plate; a third plate disposed on one side of the heating element; and a heat transfer path for transferring the heat generated from the heating element to the heat dissipation member. The heat transfer path comprises: a first path disposed between the first plate and the second plate; a third path disposed within the third plate; and a plurality of unit heat transfer paths having a second path connecting the first path and the third path, wherein the respective second paths of the plurality of unit heat transfer paths are spaced apart from each other.

Abstract: An electric deviceincludes a case, a circuit substratethat is disposed in the case, and electronic componentsthat are disposed in the case, and generate heat when energized. The caseis filled with a liquid insulating-and-cooling medium, the circuit substrateis disposed in an orientation in which the normal lines of the substrate surfaces that are the plate surfaces of the circuit substrateare horizontal, the electronic components are disposed on the lower side of the case, and at least some of the electronic componentsare immersed in the liquid insulating-and-cooling medium.

Abstract: The power conversion device includes: a DC-DC converter unit including a transformer having a coil substrate where a primary side coil is formed and a bus bar forming a secondary side coil, and converting a voltage of DC power input from a DC power supply into a different voltage; and a cooling portion where a cooling flow path through which a cooling liquid flows is provided and the DC-DC converter unit is disposed. The bus bar of the transformer has a cooling portion side fixed portion fixed to the cooling portion provided with the cooling flow path.

Abstract: A power control apparatus has a plurality of switch units, a cooling unit, and an electronic control circuit. The electronic control circuit is configured to perform: measuring temperatures of each of the plurality of switch units; comparing the temperatures of each of the plurality of switch units measured in the measuring step; and determining whether a temperature difference between any two of the plurality of switch units is greater than or equal to a threshold value based on information from the comparing step.

Abstract: A display device includes: a display panel that includes, in a front surface, a display area in which an image is displayed, and projects, from the display area, light that has entered from a back surface as display light showing the image; a thermal conductive sheet that is disposed contacting the display panel, and has an opening positionally corresponding with the display area; and a light transmissive material that sandwiches the thermal conductive sheet together with the display panel.

Abstract: A component grounding system according to one embodiment includes a case for accommodating a plurality of components, a direct current (DC) capacitor disposed on one side of the case and electrically connected to the case, and a bus bar, disposed between the case and the DC capacitor, for connecting the case and the DC capacitor, the bus bar representing an electrode, wherein each of the plurality of components may be connected to the bus bar.

Abstract: The present application provides a display device comprising: a display panel including a display region and a non-display region, wherein the non-display region includes first and second fan-out regions and a bending region; an optical functional film layer formed in the display region and the first fan-out region; an adhesive layer formed on the optical functional film layer; and a protective layer located in the bending region and with a gap with the optical functional film layer, and an end of the adhesive layer extends beyond the optical functional film layer and is connected to the protective layer, and the adhesive layer covers the optical functional film layer, the gap, and part of the protective layer.

Abstract: An electronic device is provided according to various embodiments of the present disclosure. The electronic device includes a housing including a rear plate having an opening and a support bracket at least partially disposed along an edge of the rear plate; a camera decoration disposed in the opening to be exposed to the outside, covering a camera assembly and connected to rear plate; a printed circuit board disposed in the housing; a rear structure supporting the camera assembly and the printed circuit board; a fixing member coupled to the rear structure and fixing the camera assembly and/or the printed circuit board to the support bracket; and a conductive member at least partially disposed between the camera decoration and the fixing member to electrically connect the camera decoration and the fixing member to each other.

Abstract: The present invention relates to a composite material for shielding electromagnetic radiation in the GHz range, comprising a matrix material and metal fibers, wherein the metal fibers contain at least one of the elements selected from the group consisting of copper, silver, gold, nickel, palladium, platinum, cobalt, iron, chromium, vanadium, titanium, aluminum, silicon, lithium, combinations of the foregoing and alloys containing one or more of the foregoing. Moreover, the present invention relates to a shielding against electromagnetic radiation comprising said composite material and to an electronic device comprising at least one component which is shielded against electromagnetic radiation with said shielding.

Abstract: A manufacturing system according to the present disclosure includes one or more manufacturing apparatuses, a carrier, and a control system. Each of the one or more manufacturing apparatuses performs predetermined work on a board. The carrier carries a burden. The control system controls carrying work by the carrier. The burden includes a plurality of functional modules. Each of the plurality of functional modules provides a predetermined function for the one or more manufacturing apparatuses. The carrier includes a coupling portion to be coupled to any of the plurality of functional modules. The control system has at least one functional module, selected from the plurality of functional modules and coupled to the coupling portion, carried by the carrier.

Abstract: A mapping device includes: a substrate engraved with an alignment pattern; an electrostatic chuck under the substrate and in contact with the substrate; and an anti-separation frame on the substrate and preventing the substrate from being separated.

Abstract: A semiconductor structure and its fabrication method are provided. The semiconductor structure includes: a substrate including a base substrate with a first device region and a second device region; a first active region on the first device region and a second active region on the second device region; an isolation layer between the first active region and the second active region; and a first gate electrode and a second gate electrode on the substrate. The first active region includes a first functional region and a first shared region. The first gate electrode is located on the device region and on a portion of a surface of the first active region. The second gate electrode is located on the second device region and on a portion of a surface of the second active region; and the second gate electrode also extends to a surface of the first shared area.

Abstract: A semiconductor device according to an embodiment of the present disclosure includes a read transistor and a write transistor that are electrically connected to each other over a substrate. The read transistor includes a read channel layer disposed on a plane over the substrate, a read gate dielectric layer disposed over the read channel layer, and a read gate electrode layer disposed over the read gate dielectric layer. The write transistor includes a write channel layer disposed over a portion of the read gate electrode layer, a write bit line disposed on an upper surface of the write channel layer, a write gate dielectric layer on a side surface of the write channel layer, and a write word line disposed to be adjacent to the write gate dielectric layer.

Abstract: The present disclosure relates to a memory and a memory forming method. The memory forming method includes: providing an initial substrate; etching the initial substrate to form a plurality of capacitor holes and a plurality of recesses that are connected to the capacitor holes in a one-to-one corresponding manner and located below the capacitor holes; forming an isolation layer that connects adjacent ones of the recesses and fills up the recesses, and using the initial substrate remaining below the isolation layer as a substrate; and forming a capacitor in the capacitor hole.

Abstract: A semiconductor structure includes at least one transistor. The transistor includes a channel, a gate, a source, and a drain. The channel includes a first material layer and a second material layer arranged around the first material layer. Resistivity of the first material layer is greater than a first preset value, and resistivity of the second material layer is less than a second preset value, the first preset value being greater than the second preset value. The gate covers at least one side of the channel. The source and the drain are at two ends of an extension direction of the channel.

Abstract: A semiconductor structure includes a substrate, a barrier layer covering the substrate, first adjustment layers, and first contact structures. The substrate includes multiple spaced Active Areas (AAs). The AAs include first contact areas. The barrier layer is provided with multiple spaced first contact holes, each of which penetrates through the barrier layer and extends into the substrate to expose a respective one of the first contact areas. Each of the first adjustment layers is on a sidewall of a respective one of the first contact holes. Each of the first contact structures fills a respective region enclosed by the first adjustment layer and the first contact area. A method for manufacturing a semiconductor structure is also provided.

Abstract: Embodiments relate to a semiconductor structure, and an array structure and a method for fabricating same. The semiconductor structure includes: a substrate having a bit line structure therein; an active area, where an end of the active area is positioned on the bit line structure, and along a direction perpendicular to the substrate, the active area includes a first channel layer and a second channel layer wrapping at least a bottom surface and part of a sidewall of the first channel layer, and a bottom of the second channel layer is electrically connected to the bit line structure; a word line structure, where the word line structure is positioned on two opposite sides of the active area in the direction perpendicular to the substrate; and a source and a drain respectively positioned at two ends along an extension direction of the active area.

Abstract: Provided is a semiconductor device. The semiconductor device includes a lower structure; a lower electrode on the lower structure; a dielectric layer on the lower electrode; and an upper electrode on the dielectric layer, wherein the lower electrode includes a bending reducing layer and a dielectric constant-increasing layer between the bending reducing layer and the dielectric layer, the dielectric constant-increasing layer is configured to increase a dielectric constant of the dielectric layer, and an elastic modulus of the bending reducing layer is greater than an elastic modulus of the dielectric constant-increasing layer.

Abstract: A semiconductor memory device includes a substrate, a conductive line extending in a first horizontal direction above the substrate, an isolation insulating layer including a channel trench extending in a second horizontal direction intersecting with the first horizontal direction and extending from an upper surface to a lower surface of the isolation insulating layer, above the conductive line, a channel structure disposed above the conductive line, a gate electrode extending in the second horizontal direction, in the channel trench, a capacitor structure above the isolation insulating layer, and a contact structure interposed between the channel structure and the capacitor structure, wherein the channel structure includes an amorphous oxide semiconductor layer disposed in the channel trench above the conductive line, and an upper crystalline oxide semiconductor layer interposed between the amorphous oxide semiconductor layer and the contact structure.

Abstract: A semiconductor device may include contact plug structures on a substrate, and an insulation structure filling a space between the contact plug structures to insulate the contact plug structures from each other. The contact plug structures may be spaced apart from each other in a first direction. The insulation structure may include a first insulation pattern and a second insulation pattern. The second insulation pattern may include an insulation material having an etch selectivity with respect to silicon oxide. The first insulation pattern may contact a portion of sidewalls of the second insulation pattern and a portion of sidewalls of the contact plug structure. The first insulation pattern may include a material having a band gap higher than a band gap of the second insulation pattern.

Abstract: A semiconductor device includes: a bit line; an active semiconductor layer on the bit line, having a first portion extending in a vertical direction and a second portion connected to the first portion and extending in a horizontal direction, including an oxide semiconductor; a word line on a side wall of the active semiconductor layer; a gate insulating layer between the active semiconductor layer and the word line; a first contact on the active semiconductor layer, having a bottom at a level lower than a top surface of the word line and a top at a level higher than the top surface of the word line, including an oxide semiconductor containing a first dopant; a second contact adjacent to the second portion of the active semiconductor layer on the bit line and including an oxide semiconductor containing a second dopant; and a landing pad on the first contact.