Abstract: A semiconductor device includes: a peripheral circuit region including circuit elements on a substrate, the circuit elements of a page buffer and a row decoder; and a cell region including gate electrode layers, stacked in a first direction, perpendicular to an upper surface of the substrate, and connected to the row decoder, and channel structures extending in the first direction to penetrate through the gate electrode layers and to be connected to the page buffer. The row decoder includes high-voltage elements, operating at a first power supply voltage, and low-voltage elements operating at a second power supply voltage, lower than the first power supply voltage. Among the high-voltage elements, at least one first high-voltage device is in a first well region doped with impurities having a first conductivity-type.

Abstract: A three dimensional non-volatile memory structure includes word lines connected to non-volatile memory cells arranged in blocks. A plurality of word line switches are connected to the word lines and one or more sources of voltage. The word line switches are arranged in groups of X word line switches such that each group of X word line switches is positioned in a line under Y blocks of non-volatile memory cells and has a length that is equal to the width of the Y blocks of non-volatile memory cells, where X>Y.

Abstract: A memory device includes a plurality of memory cells, a peripheral circuit, and control logic. The peripheral circuit is configured to perform an incremental step pulse program (ISPP) on the plurality of memory cells. The control logic is configured to control the peripheral circuit to perform the ISPP using bit line voltages set based on different bit line step voltages according to a target program state of each of the plurality of memory cells among a plurality of program states.

Abstract: A memory device includes a memory structure including at least one non-volatile memory cell capable of storing multi-bit data, and a control device configured to perform a program verification after a first program pulse is applied to the at least one non-volatile memory cell, determine a program mode for the at least one non-volatile memory cell based on a result of the program verification, and change a level of a pass voltage, applied to another non-volatile memory cell coupled to the at least one non-volatile memory cell, from a first level to a second level which is higher than the first level, or a setup time for changing a potential of a bit line coupled to the at least one non-volatile memory cell, according to the program mode.

Abstract: A non-volatile memory operates in a high perform mode when writing host data by using a first programming algorithm. When performing background operations, the non-volatile memory writes data using a lower performance, but higher endurance programming algorithm. In both cases the data is written in the same multi-level format, but the higher endurance programming algorithm uses, for example, a staircase waveform with a smaller step size. A count is kept for the number of program/erase cycles for memory blocks for both types of programming trim, but where a high performance write is weighted more heavily than a high endurance write.

Abstract: A memory programming circuit for programming a non-volatile memory device having an array structure includes a plurality of rows, each row having a row index and comprising one or more memory units, each memory unit being configured to receive one or more input signals and to deliver one or more output signals, the memory programming circuit comprising: a first source line connected to the top electrode of the memory units comprised at rows of odd row indices, and a second source line connected to the top electrodes of the memory units comprised at rows of even row indices.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes apparatus including memory cells connected to word lines including at least one dummy word line and data word lines. The memory cells are arranged in strings and are configured to retain a threshold voltage. The apparatus also includes a control means coupled to the word lines and the strings and configured to identify ones of the memory cells connected to the at least one dummy word line with the threshold voltage being below a predetermined detection voltage threshold following an erase operation. The control means is also configured to selectively apply at least one programming pulse of a maintenance program voltage to the at least one dummy word line to program the ones of the memory cells connected to the at least one dummy word line having the threshold voltage being below the predetermined detection voltage threshold.

Abstract: A semiconductor memory device includes first conductive layers arranged in a first direction, a second conductive layer disposed at a position overlapping with the first conductive layers viewed from the first direction, a third conductive layer disposed at a position overlapping with the first conductive layers viewed from the first direction and arranged with the second conductive layer in a second direction intersecting with the first direction, a first semiconductor column opposed to the first conductive layers and the second conductive layer, a second semiconductor column opposed to the first conductive layers and the third conductive layer, and a fourth conductive layer disposed between the second conductive layer and the third conductive layer. The fourth conductive layer has a length in the second direction smaller than a length of the second conductive layer in the second direction and a length of the third conductive layer in the second direction.

Abstract: The memory device includes a block with a plurality of memory cells arranged in a plurality of data word lines, which are arranged in sub-blocks that are not separated from one another by physical joints or by dummy word lines. A controller is configured to erase the memory cells of a selected sub-block of the plurality of sub-blocks without erasing the memory cells of the unselected sub-blocks. The controller reads data of the edge one word lines of the unselected sub-blocks adjacent the selected sub-block and stores this data in a temporary location external of the block before erasing the memory cells of the selected sub-block. The controller then re-programs the data that is being temporarily stored back into the memory cells of the edge word lines of the unselected sub-blocks after erase of the selected sub-block is completed.

Abstract: A three-dimensional memory device, such as 3D AND Flash memory device, includes a first page buffer, a second page buffer, a sense amplifier, a first path selector, and a second path selector. The first page buffer and the second page buffer are respectively configured to temporarily store a first write-in data and a second write-in data. The first path selector couples the sense amplifier or the first page buffer to a first global bit line according to a first control signal. The second path selector couples the sense amplifier or the second page buffer to a second global bit line according to a second control signal.

Abstract: The present technology provides a method of operating a semiconductor memory device detecting a threshold voltage distribution for memory cells included in a page selected from among a plurality of memory cells. The method of operating the semiconductor memory device includes selecting a target state in which the threshold voltage distribution is to be detected, determining a plurality of read voltages for dividing a voltage range in which a threshold voltage of the selected target state is distributed, and performing a plurality of sensing operations using the plurality of read voltages on the selected page. Masking to the target state is applied in each of the plurality of sensing operations.

Abstract: A memory apparatus and method of operation are provided. The memory apparatus includes memory cells configured to retain a threshold voltage. The memory cells are connected to one of a plurality of word lines and are arranged in strings comprising a plurality of blocks. A control means is coupled to the plurality of word lines and the strings and is configured to periodically determine a read frequency metric associated with a plurality of read operations of one of the plurality of blocks of the memory cells. The control means is also configured to relocate data of the one of the plurality of blocks and cause the one of the plurality of blocks to remain unused for a predetermined relaxation time based on the read frequency metric.

Abstract: A non-volatile memory combines a hard bit and a soft bit read into a single, efficient soft sense sequence by using two sense per state level to improve read time efficiency. Rather than a standard hard bit read, where two soft bit reads are performed, offset above and below the hard bit read value, the hard bit read is shifted so that it reliable senses one state but less reliably senses the other state and soft bit data is only determined for the less reliably sensed state. This reduces the amount of soft bit data. The efficient soft sense sequence can be used as a default read mode, providing soft bit information for ECC correction without triggering a read error handling flow. Merging the soft bit and hard bit sense into one sequence can avoid extra overhead for read sequence operations.

Abstract: A memory device includes unselected sub-block, which includes bit line; drain select (SGD) transistor coupled with bit line; a source voltage line; source select (SGS) transistor coupled with source voltage; and wordlines coupled with gates of string of cells, which have channel coupled between the SGS/SGD transistors. Control logic coupled with unselected sub-block is to: cause the SGD/SGS transistors to turn on while ramping the wordlines from a ground voltage to a pass voltage associated with unselected wordlines in preparation for read operation; cause, while ramping the wordlines, the channel to be pre-charged by ramping voltages on the bit line and the source voltage line to a target voltage that is greater than a source read voltage level; and in response to wordlines reaching the pass voltage, causing the SGD and SGS transistors to be turned off, to leave the channel pre-charged to the target voltage during the read operation.

Abstract: According to one embodiment, a semiconductor memory device includes first and second memory cells; a first word line connected to the first and second memory cells; a first bit line connected to the first memory cell; a second bit line connected to the second memory cell; a first sense amplifier connected to the first bit line; a second sense amplifier connected to the second bit line; a voltage generation circuit; and a first row decoder which supplies a voltage to the first word line.

Abstract: A system has been described that performs differential temperature compensation based on a differential between the temperature at time of programming and temperature at time of reading for a set of data. Differential temperature compensation is useful for bulk programming/reading (e.g., many pages of data) and/or programming/reading super pages of data (multiple pages residing on different memory die).

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines and disposed in strings. A control means is coupled to the word lines and the strings and is configured to ramp a voltage applied to a selected one of the word lines from a verify voltage to a reduced voltage during a program-verify portion of a program operation. The control means successively ramps voltages applied to each of a plurality of neighboring ones of the word lines from a read pass voltage to the reduced voltage beginning with ones of the plurality of neighboring ones of the word lines immediately adjacent the selected one of the word lines and progressing to ones of the plurality of neighboring others of the word lines disposed increasingly remotely from the selected one of the word lines during the program-verify portion of the program operation.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to one of a plurality of word lines including at least one edge word line and a plurality of other data word lines. The memory cells are arranged in strings and configured to retain a threshold voltage corresponding to one of a plurality of data states. The memory apparatus also includes a control means coupled to the plurality of word lines and the strings. The control means is configured to identify the at least one edge word line. The control means is also configured to periodically apply a program voltage to the at least one edge word line to reprogram the memory cells associated with the at least one edge word line without erasing the memory cells associated with the at least one edge word line.

Abstract: A semiconductor memory device according to an embodiment includes memory cell transistors, a word line, and a controller. A memory cell transistor whose threshold voltage is included in first and second states store first and second data, respectively. In a verify operation of the first data, during application of a verify high voltage of the first data to the word line, the controller is configured to determine whether or not a threshold voltage of a memory cell transistor to which the first data is to be written exceeds the verify high voltage of the first data, and also determine whether or not a threshold voltage of a memory cell transistor to which the second data is to be written exceeds a verify low voltage of the second data.

Abstract: A method of cache programming of a NAND flash memory in a triple-level-cell (TLC) mode is provided. The method includes discarding an upper page of a first programming data from a first set of data latches in a plurality of page buffers when a first group of logic states are programmed and verified. The plurality of page buffers include the first, second and third sets of data latches, configured to store the upper page, middle page and lower page of programming data, respectively. The method also includes uploading a lower page of second programming data to a set of cache latches, transferring the lower page of the second programming data from the set of cache latches to the third set of data latches after discarding the lower page of the first programming data, and uploading a middle page of the second programming data to the set of cache latches.

Abstract: An operating method of a non-volatile memory device comprises: performing a foggy operation applying a first application voltage to a word line and applying a first verification voltage having a same level as or a higher level than a target threshold voltage to the word line, determining whether the foggy operation is completely performed according to whether a number of memory cells each having a threshold voltage higher than the first verification voltage is equal to or greater than a first number, performing a fine operation applying a second application voltage to the word line and applying a second verification voltage having the same level as the target threshold voltage, and determining whether the fine operation is completely performed, according to whether a number of memory cells each having a threshold voltage lower than the second verification voltage is less than or equal to a second number.

Abstract: A memory apparatus and operating method are provided. The apparatus includes memory cells connected to word lines and disposed in memory holes and configured to retain a threshold voltage. The memory holes are organized in rows grouped in strings. A control means is coupled to the word lines and the memory holes and programs the memory cells associated with a first one of the strings in a program operation and acquire a smart verify programming voltage in a smart verify operation including smart verify loops. The control means discards the smart verify programming voltage and determines another smart verify programming voltage in another smart verify operation on the memory cells associated with a second one of the strings in response to a quantity of the smart verify loops needed to complete programming of the memory cells associated with the first one of the strings being outside a predetermined threshold criteria.

Abstract: Methods, systems, and devices for accessing a multi-level memory cell are described. The memory device may perform a read operation that includes pre-read portion and a read portion to access the multi-level memory cell. During the pre-read portion, the memory device may apply a plurality of voltages to a plurality of memory cells to identify a likely distribution of memory cells storing a first logic state. During the read portion, the memory device may apply a first read voltage to a memory cell based on performing the pre-read portion. The memory device may apply a second read voltage to the memory cell during the read portion that is based on the first read voltage. The memory device may determine the logic state stored by the memory cell based on applying the first read voltage and the second read voltage.

Abstract: A memory controller includes an over-program controller that preprograms and then erases the memory cells such that each of the memory cells has a first threshold voltage level, wherein fast cells are detected among the memory cells according to a threshold voltage less than or equal to a second threshold voltage less than the first threshold voltage, and a processor that generates fast cell information identifying the fast cells among the memory cells and stores the fast cell information in a buffer. The over-program controller controls the over-programming of the fast cells and normal programming of normal cells among the memory cells based on the fast cell information stored in the buffer.

Abstract: An apparatus disclosed herein comprises: a plurality of memory cells and a control circuit coupled to the plurality of memory cells. The control circuit is configured to: acquire a first set of read levels on a wordline of a first block of pages of memory cells; acquire a second set of read levels on a first wordline of a second block of pages of a second set of memory cells in response to determining that the fail bit count of the page after a read operation is above the threshold amount; and acquire a third set of read levels on a second wordline of the second block in response to determining that the fail bit count of the page after the second read operation is above the threshold amount.

Abstract: A method for programming a target memory cell of a memory array of a non-volatile memory system, the method comprises determining a total number of erase/programming (EP) cycles that were applied previously to the memory cell and, (1) if the determined total number of cycles does not exceed a threshold value, applying an asymmetric programming scheme, and, (2) if the determined total number of cycles exceeds the threshold value, applying a symmetric programming scheme. Further, a magnitude of a boosting voltage bias (VPASS) that is to be applied to an unselected word line may be determined according to the determined total number of erase/programming (EP) cycles.

Abstract: Embodiments of the present disclosure relate to the field of semiconductor technology, and provide an anti-fuse memory and a control method thereof. The anti-fuse memory is configured to generate a programming pulse signal based on a row strobe signal, a word line of the anti-fuse memory array is configured to receive the row strobe signal, and the anti-fuse memory array is programmed in response to the programming pulse signal. The embodiments of the present disclosure are at least advantageous to improving accuracy of reading data from the anti-fuse memory array and improving yield of the anti-fuse memory.

Abstract: A signal width repair circuit and method, and an electronic device are provided. The signal width repair circuit includes: a delay unit, configured to receive an input signal, and delay the input signal for a preset duration to obtain a delayed signal, the input signal being a low-level signal; a signal reconstruction unit, configured to receive the input signal and the delayed signal, and repair the input signal and the delayed signal to obtain a repaired signal; and a signal selection unit, configured to receive the input signal and the repaired signal and select one of the input signal and the repaired signal for output, to obtain a target signal that has a width satisfying a preset width, the preset duration being equal to or greater than a duration with the preset width.

Abstract: Method, systems and apparatuses may provide for technology that executes a margin test of a first memory storage based on a subset of first signals associated with the first memory storage. The technology determines, based on the margin test, first margin data to indicate whether the first memory storage complies with one or more electrical constraints. The technology determines, based on the first margin data, whether to execute a signal training process.

Abstract: Implementations described herein relate to memory section selection for a memory built-in self-test. A memory device may read a first set of bits stored in a test control mode register. The memory device may identify a test mode, for performing a memory built-in self-test, based on the first set of bits. The memory device may read a second set of bits stored in a section identifier mode register. The memory device may identify one or more memory sections of the memory device, for which the memory built-in self-test is to be performed, based on the second set of bits. The one or more memory sections may be a subset of a plurality of memory sections into which the memory device is divided. The memory device may perform the memory built-in self-test for the one or more memory sections of the memory device based on the test mode.

Abstract: In some aspects of the present disclosure, a memory device is disclosed. In some aspects, the memory device includes a plurality of memory cells arranged in an array, an input/output (I/O) interface connected to the plurality of memory cells to output data signal from each memory cell, and a control circuit. In some embodiments, the control circuit includes a first clock generator to generate a first clock signal and a second clock signal according to an input clock signal and a chip enable (CE) signal and provide the first clock signal to the plurality of memory cells. In some embodiments, the control circuit includes a second clock generator to generate a third clock signal according to the input clock signal and a DFT (design for testability) enable signal. In some embodiments, the control circuit generates an output clock signal according to the second clock signal or the third clock signal.

Abstract: The disclosed test circuit includes: an input terminal, a processing circuit, and an output terminal. The input terminal receives an input signal. The input signal includes a test command for indicating a test target circuit module and an address of the target circuit module. The processing circuit responds to the test command and the target. The address of the circuit module determines the test mode signal, the test mode signal carries the test type, the test mode signal is used to trigger the target circuit module to perform the test corresponding to the test type, and the output terminal sends the test mode signal to the target circuit module according to the address of the target circuit module. Thus, the test mode signal can be accurately transmitted to different circuit modules in the memory chip.

Abstract: The embodiments provide a method for reading and writing and a memory device. The method includes: applying a read command to the memory device, the read command pointing to address information; reading data to be read out from a memory cell corresponding to the address information pointed to by the read command; and setting a mark of the address information pointed to by the read command as invalid if an error occurs in the data to be read out, and backing up the address information pointed to by the read command and the mark into a non-volatile memory cell according to a preset rule.

Abstract: A memory is provided. The memory includes banks, each bank includes a U half bank and a V half bank; a first error checking and correcting unit connected with the U half banks and the V half banks and configured to check and correct errors of output data of the U half banks and the V half banks; and a second error checking and correcting unit connected with the U half banks and the V half banks and configured to check and correct errors of the output data of the U half banks and the V half banks.

Abstract: A system includes a memory device having groups of managed units and a processing device coupled to the memory device. The processing device, during power on of the memory device, causes a read operation to be performed at a subset of a group of managed units and determines a bit error rate related to data read from the subset of the group of managed units. The bit error rate is a directional bit error rate resulting from an erroneously determined state compared to a programmed state that transitions between two opposing states. In response to the bit error rate satisfying a threshold criterion, the processing device causes a rewrite of the data stored at the group of managed units.

Abstract: A system, program product, and method for processing synchronized memory repairs. The method includes identifying a faulty memory row from a plurality of functioning memory rows in a memory array. The method also includes executing memory row repair operations directed toward the faulty memory row and identifying a repair row to operationally replace the faulty memory row. The method also includes creating a multiple hot state within a memory decoder. The memory decoder includes logic circuitry for executing operation of the plurality of functioning memory rows. The method further includes activating a wordline of the identified repair row through the multiple hot state, and executing one or more memory operations on the identified repair row though the memory decoder. Accordingly, the embodiments disclosed herein facilitate synchronization of the repair row and functioning memory rows within the memory array, as well as any associated peripheral signals.

Abstract: A fail detecting method of a memory system including a nonvolatile memory device and a memory controller, the fail detecting method including: counting, by the memory controller, the number of erases of a word line connected to a pass transistor; issuing a first erase command, by the memory controller, when the number of erases reaches a reference value; applying a first voltage, by the nonvolatile memory device, in response to the first erase command, that causes a gate-source potential difference of the pass transistor to have a first value; detecting, by the memory controller, a leakage current in a word line, after the applying of the first voltage; and determining, by the memory controller, the word line as a fail when a leakage voltage caused by the leakage current is greater than a first threshold value.

Abstract: A memory device includes a first dynamic random access memory (DRAM) integrated circuit (IC) chip including first memory core circuitry, and first input/output (I/O) circuitry. A second DRAM IC chip is stacked vertically with the first DRAM IC chip. The second DRAM IC chip includes second memory core circuitry, and second I/O circuitry. Solely one of the first DRAM IC chip or the second DRAM IC chip includes a conductive path that electrically couples at least one of the first memory core circuitry or the second memory core circuitry to solely one of the first I/O circuitry or the second I/O circuitry, respectively.

Abstract: An electronic device and a method of controlling an electronic device are provided. The electronic device includes a first transistor having a first resistor, second resistor, first transistor, and second transistor. The second resistor is connected to the first resistor. The first transistor is connected to the first resistor in parallel and has a first bulk. The second transistor is connected to the second resistor in parallel and has a second bulk. The first bulk of the first transistor receives a first voltage and the first bulk of the second transistor receives a second voltage. The first voltage and the second voltage are different.

Abstract: A semiconductor memory device includes a plurality of data latch circuits that are used for input and output of data between a sense amplifier circuit and an input/output circuit, and a data bus that is connected to the plurality of data latch circuits. Each of the data latch circuits includes an inverter circuit that temporarily stores data input and output between the sense amplifier circuit and the input/output circuit, and at least three MOS transistors between the inverter circuit and the data bus. The at least three MOS transistors may be multiple N-channel type MOS transistors and at least one P-channel type MOS transistor connected in parallel between the inverter circuit and the data bus, or at least one N-channel type MOS transistor and multiple P-channel type MOS transistors connected in parallel between the inverter circuit and the data bus.

Abstract: A memory system includes a memory device and a memory controller. The memory device includes a memory area configured to store data and an input/output (I/O) buffering part configured to store data outputted from the memory area. The memory controller is configured to control read operations of the memory device. The memory device is configured to store data of all columns in a selected row designated by a row address among a plurality of rows in the memory area into the I/O buffering part in response to an external command outputted from the memory controller and is configured to output data of a selected column designated by a column address among the data stored in the I/O buffering part, and the memory controller is configured to perform a scheduling operation for successively executing read request commands having the same row address among a plurality of read request commands for performing read operations of the memory device.

Abstract: A memory device stores data for a host device. In one approach, a method includes: selecting, by the memory device, a first mode of operation for a host interface that implements a communication protocol for communications between the memory device and the host device. The host interface is configured to implement the communication protocol using a mode selected by the memory device from one of several available modes. In response to selecting the first mode, resources of the memory device are configured to customize the host interface for operation in the first mode.

Abstract: A dynamic random access memory applied to an embedded display port includes a memory core unit, a peripheral circuit unit, and an input/output unit. The memory core unit is used for operating in a first predetermined voltage. The peripheral circuit unit is electrically connected to the memory core unit for operating in a second predetermined voltage, where the second predetermined voltage is lower than 1.1V. The input/output unit is electrically connected to the memory core unit and the peripheral circuit unit for operating in a third predetermined voltage, where the third predetermined voltage is lower than 1.1V.

Abstract: Described apparatuses and methods enable communication between a host device and a memory device to establish relative delays between different data lines. If data signals propagate along a bus with the same timing, simultaneous switching output (SSO) and crosstalk can adversely impact channel timing budget parameters. An example system includes an interconnect having multiple data lines that couple the host device to the memory device. In example operations, the host device can transmit to the memory device a command indicative of a phase offset between two or more data lines of the multiple data lines. The memory device can implement the command by transmitting or receiving signals via the interconnect with different relative phase offsets between data lines. The host device (e.g., a memory controller) can determine appropriate offsets for a given apparatus. Lengths of the offsets can vary. Further, a system can activate the phase offsets based on frequency.

Abstract: A data serializer, a latch data device using the same and a controlling method thereof are provided. The data serializer includes at least one data buffer and a de-skew buffer. The data buffer at least receives an inputting data and a controlling signal. An outputting signal and a complementary outputting signal, which is complementary to the outputting signal, are formed when the controlling signal is at a predetermined level. The de-skew buffer receives the complementary outputting signal to accelerate or slow down forming the outputting signal.

Abstract: Sense amplifier, memory and control method are provided. The sense amplifier includes: amplify module configured to amplify voltage difference between bit line and reference bit line when the sense amplifier is in amplifying stage; write module connected to the bit line and the reference bit line, and configured to pull the voltage difference between the bit line and the reference bit line according to data to be written when the sense amplifier is in write stage; controllable power module connected to the amplify module, configured to provide first voltage to the amplify module when the sense amplifier is in non-write stage, and to provide second voltage to the amplify module when the sense amplifier in write stage. Herein, the second voltage is less than the first voltage, and the second voltage is in positive correlation with the drive capability of the write module.

Abstract: A duty correction device includes a clock generation circuit, first and second correction pulse generation circuits, and a duty correction circuit. The clock generation circuit generates first to third divided clock signals, each having a phase offset from a reference clock signal. The first correction pulse generation circuit generates a first correction pulse by detecting a phase difference between a delayed clock signal and the first and second divided clock signals. The second correction pulse generation circuit generates a second correction pulse by detecting a phase difference between the second and third divided clock signals. The duty correction circuit checks whether the first and second correction pulses are generated at a preset logic level of the reference clock signal, and reflects the first or second correction pulses in a duty correction operation for the reference clock signal according to a result of the check.

Abstract: Methods, systems, and devices for a decoding architecture for memory devices are described. Word line plates of a memory array may each include a sheet of conductive material that includes a first portion extending in a first direction within a plane along with multiple fingers extending in a second direction within the plane. Memory cells coupled with a word line plate, or a subset thereof, may represent a logical page for accessing memory cells. Each word line plate may be coupled with a corresponding word line driver via a respective electrode. A memory cell may be accessed via a first voltage applied to a word line plate coupled with the memory cell and a second voltage applied to a pillar electrode coupled with the memory cell. Parallel or simultaneous access operations may be performed for two or more memory cells within a same page of memory cells.

Abstract: A method for compressing nucleic acid sequence data wherein each sequence read is associated with a molecular tag sequence, wherein a portion of the sequence reads alignments correspond to sequence reads mapped to a targeted fusion reference sequence includes determining a consensus sequence read for each family of sequence reads based on flow space signal measurements corresponding to the family of sequence reads, determining a consensus sequence alignment for each family of sequence reads, wherein a portion of the consensus sequence alignments correspond to the consensus sequence reads aligned with the targeted fusion reference sequence, generating a compressed data structure comprising consensus compressed data, the consensus compressed data including the consensus sequence read and the consensus sequence alignment for each family, and detecting a fusion using the consensus sequence reads and the consensus sequence alignments from the compressed data structure.

Abstract: Systems and methods for communicating, storing, and/or analyzing data that may include genomic data are described herein. In various embodiments, unaligned genomic sequence read data and/or portions thereof may be stored and/or communicated as a list of variants relative to a particular reference associated with a reference motif identified in the genomic sequence read data. In further embodiments, quality score information associated with a genomic dataset may be analyzed and/or communicated as quality score parameter information. Additional embodiments may facilitate relatively efficient analysis of unaligned genomic sequence read data using metadata associated with reference motifs identified in the unaligned genomic sequence read data.