Abstract: A cutting bit assembly for attachment to a tool holder of a milling-type machine includes a cutting tip, a generally cylindrical shank extending from the cutting tip and comprising a rotation-limiting surface, and a spring clip surrounding a body of the shank. The spring clip includes a protrusion configured to interact with the rotation-limiting surface of the shank to limit rotation of the shank relative to the spring clip. The spring clip includes a contracted configuration and an expanded configuration, and in both the contracted configuration and the expanded configuration the protrusion interacts with the rotation-limiting surface.

Abstract: A machine tool for producing a workpiece of predefined length includes: a frame for receiving the workpiece, which extends in a longitudinal direction and guides the workpiece in the longitudinal direction at least in part; a cutting tool for severing the workpiece in a machining position; a drivable stop element which is mounted on the frame so as to be displaceable in order to move the workpiece into the machining position; and at least one actuable slide element which is mounted on the frame so as to be displaceable guides the workpiece when the at least one actuable slide element is moved by the drivable stop element.

Abstract: A wheeled oscillating blade device for pushing an oscillating blade on wheels to facilitate removing materials from the ground surface includes a housing. A pair of wheels is rotatably coupled to the housing to facilitate pushing and pulling the housing on a ground surface. A motor is positioned within the housing, and a shaft extends out from the motor. The motor rotates the shaft in an oscillating motion when the motor is turned on. A blade mount is positioned within the bottom opening and is in mechanical communication with the shaft, wherein the shaft oscillates the blade mount when the motor is turned on. A blade is mounted to the blade mount, wherein the blade oscillates when the motor is turned on. The oscillating motion of the blade facilitates removing materials from the ground surface.

Abstract: Systems and methods for automated cutting of lumber are disclosed. The system includes a loading module that receives lumber from a loading area and places the lumber on a cutting table. The system includes an actuating module that receives the lumber from the loading module, inspects the lumber, records lumber information based on the inspection, and positions the lumber on the cutting table in preparation for cutting. The system includes a sensor module that detects the position of the lumber on the cutting table, and records the position to the lumber information. The system includes a computing module that analyzes the lumber information received from the actuating module and sensor module. The system includes a cutting module that cuts the lumber based the lumber information, the cutting resulting in cut lumber. The system includes an unloading module that places the cut lumber on an unloading area.

Abstract: A control system for a saw blade used to cut slots in carbon anodes used in aluminum processing includes an instrument package installed on the saw blade. The instrument package includes one or more sensors used to measure one or more operating characteristics. If the operating characteristics are outside of a threshold operating characteristic. then one or more operating parameters of the saw blade can be adjusted. Example adjustments may be made to the rotational speed or depth of cut of the saw blade. or repair or replacement of cutting elements or the saw blade.

Abstract: Systems and methods for automated cutting of lumber are disclosed. The system includes a loading module that receives lumber from a loading area and places the lumber on a cutting table. The system includes an actuating module that receives the lumber from the loading module, inspects the lumber, records lumber information based on the inspection, and positions the lumber on the cutting table in preparation for cutting. The system includes a sensor module that detects the position of the lumber on the cutting table, and records the position to the lumber information. The system includes a computing module that analyzes the lumber information received from the actuating module and sensor module. The system includes a cutting module that cuts the lumber based the lumber information, the cutting resulting in cut lumber. The system includes an unloading module that places the cut lumber on an unloading area.

Abstract: An oscillating blade includes a body having a cutting edge, the cutting edge defining a first end of the oscillating blade, and an anchor coupled to the body and defining a second end of the oscillating blade. The anchor includes a base disposed at least partially in a first plane, a tool arbor engagement portion including a side wall extending away from the first plane and a cap wall coupled to the side wall and disposed at least partially in a second plane that is spaced apart from the first plane, and a plurality of lock points spaced between the first end and the second end of the oscillating blade in a first direction. The cap wall defines a central arbor hole configured to receive a power tool arbor. The plurality of lock points is laterally aligned in a second direction that is perpendicular to the first direction.

Abstract: A reciprocating saw blade includes a body with a shank end configured to secure the blade with a reciprocating saw, a plunging end configured to enter a workpiece, and a cutting edge and opposite back edge extending between the shank end and the plunging end. The cutting edge is formed to include a plurality of teeth arranged in a repeating pattern that includes left set teeth and right set teeth, the plurality of additional teeth being substantially the same size as each other and as the third tooth, wherein the plurality of additional gullets are substantially the same size as each other, and wherein the enlarged first gullet is longer in an axial direction than each of the plurality of additional gullets.

Abstract: This invention relates to a thin cutting diamond chain saw and a guide bar corresponding to the thickness of the chain, adapting the guide bar with a new Nose Roller (guide bar edge) to dedicated wall cutting machines.

Abstract: The present invention relates to a method for introducing a recess (3) into a workpiece (1), wherein the recess (3) is introduced with a processing cathode (2) by electrochemical ablation, wherein a flank (1.3) delimiting the recess (3) is exposed with the ablation, which flank extends from a first surface (1.1) of the workpiece (1) in the direction of an opposite second surface (1.2) of the workpiece (1), wherein a protective anode (7.1, 7.2) is arranged on at least one of the surfaces (1.1, 1.2) during removal, which protective anode is associated with the flank (1.3) and bears against the at least one surface (1.1, 1.2) in electrical contact with the workpiece (1), and wherein the protective anode (7.1, 7.2) is offset outwards relative to the flank (1.3), i.e. away from the recess (3).

Abstract: A solder supply unit able to be attached to a solder cutting unit and is able to detached is provided. The solder supply unit includes a reel holder rotatably holding a reel of a tape-like solder material; and a guidance member guiding the tape-like solder material wound around the reel when the tape-like solder material is fed out. The guidance member includes an extension portion guiding a lower surface of the tape-like solder material along a feeding direction of the tape-like solider material; and an opening penetrating the extension portion in an up-down direction and extending toward an upstream side in the feeding direction from a downstream end of the guidance member. The opening is formed in the predetermined length in the feeding direction so that a holding member, which holds the tape-like solder material together with another holding member, is able to move in the feeding direction.

Abstract: A relationship between an average current (IP-AVE) of a current non-suppression period (TIP) and an average current (IB-AVE) of a current suppression period (TIB) is set as 0.65?IP-AVE/(IP-AVE+IB-AVE)?0.90, a relationship between any current non-suppression period (TIP) and the current suppression period (TIB) immediately after is set as 0.30?TIB/(TIP+TIB)?0.60, a relationship between a forward feeding period (TP) and a reverse feeding period (TN) is set as 0.40?TN/(TP+TN)?0.70, a relationship between the current non-suppression period (TIP), the current suppression period (TIB), the forward feeding period (TP), and the reverse feeding period (TN) is set as {TN/(TP+TN)}>{TIB/(TIP+TIB)}, and the current non-suppression period (TIP) is controlled to account for ? or more of the forward feeding period (TP).

Abstract: A welding rod fastening method capable of fixing the welding rod perpendicularly to a welding surface to reduce a spattering phenomenon in which fine metal particles scatter around a welded portion due to an incorrect welding angle when welding, and a welding device in which the welding rod is fastened vertically thereby. The welding rod fastening method is a method for fixing a welding rod to a welding rod fixing block having a welding rod housing hole formed therein, and includes inserting the welding rod into a welding rod housing hole of the welding rod fixing block, and fastening fixing screws to spaces on both sides of the welding rod housing hole on the basis of the welding rod to tighten the welding rod housing hole. The fixing screws fastened to the spaces on both sides of the welding rod housing hole are tightened in tightening directions that are opposite to each other.

Abstract: Disclosed are methods of forming an impulse weld in a stack comprising a plurality of metal layers. Also disclosed herein are welded products exhibiting lower electrical resistivity when compared to an electrical resistivity of a substantially identical reference stack that was not yet welded. Also disclosed herein are systems for making such welded products.

Abstract: Provided are an ultrasonic welding head and a welding device. The ultrasonic welding head comprises a welding surface and a side surface. The welding surface is provided with a first welding tooth. The first welding tooth is configured to weld members to be welded. The side surface has an extension direction which intersects an extension direction of the welding surface. The ultrasonic welding head further comprises a connection surface. The connection surface is connected to the welding surface and the side surface, so as to form an avoidance space to avoid the members to be welded.

Abstract: A high-precision laser trigger system according to one embodiment of the present disclosure includes a stage on which an object is mounted, a trigger generator configured to generate a trigger signal according to a time-based mode and a position-based mode, a laser configured to emit laser light when the trigger signal is input, a motion controller configured to control the stage and the trigger generator, and a control device configured to identify coordinates of the stage, which places the object in a light-emitting position of the laser in the position-based mode, and transmit coordinate information including the coordinates and a mode change signal for changing a mode between the time-based mode and the position-based mode to the motion controller.

Abstract: The present disclosure provides a scanning device, including a laser transmitter and a reflection assembly. The reflection assembly includes a drive member and a first reflector, the drive member being configured to drive the first reflector to rotate; the laser transmitter is configured to emit a laser beam, and an emitting end of the laser transmitter is arranged facing the first reflector, causing the laser beam being emitting toward the first reflector and the first reflector to reflect the laser beam to change a direction of the laser beam.

Abstract: A method for joining two components of a battery includes welding the two components to one another by scanner welding using a processing beam provided by a welding apparatus, and guiding a measurement beam of an OCT sensor system optically coaxially with the processing beam while the welding apparatus is performing the scanner welding. The measurement beam and the processing beam are guided at a substantially matching angle of incidence relative to at least one processing surface of the two components.

Abstract: A laser processing method includes a preparation step and a processing step. In the preparation step, a workpiece (100), which is a processing object, is set at a processing position. In the processing step, the workpiece (100) set at the processing position is irradiated with pulse laser that has been emitted from a processing head (13) and has passed through an optical scanning device, to form plural holes in the workpiece (100). The optical scanning device scans with the pulse laser, so that a phenomenon in which a position of irradiation with the pulse laser sequentially changes from an initial position to a terminal position at a scanning speed and then returns to the initial position is periodically repeated.

Abstract: A laser-beam working machine includes a laser head rotatable around a main axis and movable along the main axis, a first chuck configured to irradiate a laser beam to the workpiece, and a second chuck provided between the laser head and the first chuck along the main axis to be rotatable around the main axis. The first chuck includes a grip configured to hold a workpiece rotatably around the main axis. The second chuck includes a plurality of guide rollers provided around the main axis to form an opening between the plurality of guide rollers through which the workpiece is configured to pass through. The plurality of guide rollers is configured to move toward and away from the main axis to change a size of the opening so that the plurality of guide rollers guides the workpiece along the main axis and the grip passes through the opening.

Abstract: A device and a method for producing welded plate-shaped workpieces, in particular bipolar plates or heat exchanger plates. The workpieces are transported vertically on a horizontal plane XY by an endless circulating product transport system through a processing area and welded. The workpieces are transported through the processing area at a constant speed and are welded there by at least two welding lasers operating simultaneously, the position of the workpieces being determined and the at least two welding lasers being controlled thereby.

Abstract: A computer-implemented method of monitoring a quality of a welding operation. The method includes: obtaining video of the welding operation in progress; processing the video to identify regions of interest in the video, each region of interest corresponding to a portion of an image in the video; for each region of interest, determining a quality index by processing the portion of the image corresponding to the region of interest; and based on the quality indices determined for the regions of interest, generating one or more welding quality signals indicative of the quality of the welding operation.

Abstract: An oscillating laser welding with filler wires for jointing aluminum alloy sheets with a large gap therebetween, including the following steps: providing two aluminum alloy sheets first, and reserving a gap (2) and keeping the gap with a constant width between opposite surfaces of the two aluminum alloy sheets to be jointed; providing a laser welding head (1), a wire feeding nozzle (3), and a protective gas nozzle (4) above the gap; presetting a welding start guiding plate (5) at a welding starting end of the gap, forming a molten pool on the welding start guiding plate by a laser beam, and guiding the molten pool to the welding starting end of the gap; and enabling the wire feeding nozzle and the laser welding head to correspond to the gap and travel in the same direction. The aluminum alloy welding wires fill the whole gap after being heated and molten by the laser beam, and the welding of the two aluminum alloy sheets is completed.

Abstract: A process of forming a non-optically detectable authentication marking (210,320, 410,535) in a diamond (200,300). Authentication marking (210,320,410,535) is formed adjacent the outer surface of an article formed from a diamond material having intrinsic optical centers. Method includes the step of applying an image of predesigned authentication marking (210,320,410,535) to a region (201,310,530) of a diamond (200,300) at or adjacent the surface of the diamond (200,300) by way of a direct laser writing; wherein the fluorescence background of the diamond material from intrinsic optical center is suppressed by authentication marking (210,320, 410, 535) under fluorescent imaging, such that the non-optically detectable identifiable authentication marking (210,320,410,535) is viewable against the fluorescence background at the region (201,310,530) of the diamond (200,300) where the authentication marking (210,320,410,535) is applied.

Abstract: In a method for manufacturing an optical coupling arrangement, first and second optical components having transmitting and receiving facets, respectively, are positioned with the facet facing each other. A glass coupler preform body with a converging element is positioned between the optical components, the converging element facing the transmitting facet configured to transmit a light beam. A coupling waveguide is designed, taking into account positioning misalignments, to transmit light between the converging member and a transmitting facet, and at least part of the designed coupling waveguide is formed in the coupler preform body.

Abstract: A method for determining the filling welding parameters of large deformation pipeline steel based on secondary regulation method includes: welding specimens to be welded for secondary welding thermal simulation experiments based on a thermal simulation to obtain samples after thermal simulation; processing the samples after thermal simulation into CTOD samples and calculating fracture toughness parameters; pre-loading of specimens requiring pre-strain after thermal simulation by uniaxial tension, and then processing samples before and after pre-strain after thermal simulation, conducting slow strain rate tension tests and calculating stress corrosion cracking susceptibility parameters; comparing the change in elongation of the samples before and after pre-strain and calculating the pre-strain sensitivity parameters; determining secondary thermal simulation parameters; converting the secondary thermal simulation parameters into welding heat input parameters; determining welding parameters based on welding heat

Abstract: A sputter measurement system includes: a camera that captures an image of an observation region including a molten portion; a spot light source that emits spot light toward a lateral side of the observation region when viewed from the camera; and a controller that measures a size of a sputter based on the image captured by the camera.

Abstract: Disclosed is a chip bonding composition for a power semiconductor package, which, by comprising an epoxy resin including glycidyl amine-based epoxy resin and bisphenol A type epoxy resin, a glycidyl ether-based diluent, and a polysilsesquioxane (PSQ) resin, has high thermal conductivity and adhesion, high heat dissipation characteristics, and low modulus characteristics. The chip bonding composition according to the present invention comprises: silver powder; an epoxy resin; a curing agent; a catalyst; a glycidyl ether-based diluent; and a PSQ resin.

Abstract: A method of repairing a rotating machine part. The method includes removing a damaged portion of a front end of an airfoil part of the rotating machine part, manufacturing a repair coupon having the same shape as the removed damaged portion by using a base material in an additive manufacturing method, and coupling the repair coupon manufactured through the manufacturing of the repair coupon to the front end of the airfoil part. Accordingly, after the damaged portion of the front end of the airfoil part of the rotating machine part is removed, the repair coupon having the same shape as the removed damaged portion is manufactured in the additive manufacturing method and then is coupled to the front end of the airfoil part from which the damaged portion is removed so that the front end of the rotating machine part can be easily repaired.

Abstract: The present invention relates to the field of heat exchange technology, specifically to a composite process and system for producing a profiled microchannel plate heat exchanger. This process integrates selective laser melting additive manufacturing with micro electrical discharge machining to create microchannel plate heat exchangers featuring large aspect ratio flow channels and closed profile section flow channels. It enables the fabrication of channels with various cross-sections, such as circular and rectangular, as well as hollow closed profile section flow channels, including micro circular and square holes. The process allows for high-precision machining of microchannels with any aspect ratio. Heat exchangers produced using this composite process can endure extreme high temperatures and pressures, offering superior environmental benefits and contamination-free performance compared to conventional microchannel heat exchangers.

Abstract: A weld nut feeder pin includes a first pin end opposite a second pin end, and a pin body that extends from the first pin end toward the second pin end. The weld nut feeder pin includes a pin fluid conduit defined through the second pin end to extend to the first pin end and through the pin body, and the pin fluid conduit is configured to receive a pressurized fluid. The weld nut feeder pin includes a plurality of outlet conduits defined through the pin body so as to be in communication with the pin fluid conduit. Each of the plurality of outlet conduits is spaced apart about a perimeter of the pin body and extends along an axis. The axis is oblique to a longitudinal axis of the weld nut feeder pin.

Abstract: The present disclosure relates to systems and methods for affixing and/or removing a fastener from a wafer-carrying pod. The system includes a robotic arm with a screw tool assembly disposed at the far end of the robotic arm. The screw tool assembly includes a lower sleeve configured to receive a fastener. A screwdriver is disposed within an upper sleeve of the screw tool assembly, and a motor is provided to rotate the screwdriver. In use, the screw tool assembly is positioned over the fastener so the lower sleeve surrounds the fastener and the screwdriver engages the fastener. The screwdriver unscrews the fastener from the pod, and the fastener head is received within the lower sleeve.

Abstract: A method of mounting an elastic ring, e.g., sealing ring, on a body via a mounting unit is presented, having at least three fingers which are movable relative to each other. The method comprises holding and clamping the ring on the exterior side of the fingers which extend into a cross-section framed by the ring, moving at least one finger along a circle or a plurality of fingers along a common circle or a plurality of concentric circles such that the elastic ring is stretched and the cross-section thereof is increased, moving the ring and the component relative to each other so that the component projects into the cross-section and the ring extends around the component, moving one or more fingers relative to each other so that the ring contacts the component in sections between adjacent fingers, and moving the fingers out of the ring. Also disclosed are a mounting unit for executing the method, and a ring mounting device including such a mounting unit.

Abstract: The lateral processing machine includes a bed, a floor surface X-axis guide, a first moving column that reciprocates in X direction, a first Y-axis guide disposed on the first moving column, a first processing unit guided by the first Y-axis guide and includes a first ram that supports the first spindle and advances or retracts in Z direction, a second processing unit guided by the first Y-axis guide and includes a second ram that supports the second spindle and advances or retracts in Z direction, and an expansion cover including a box cover, a first X box, a first X telescopic cover, a first Y box receiving a first ram, a second Y box receiving a second ram to reciprocate in Y direction, a first Y telescopic cover, a second Y telescopic cover, and a third Y telescopic cover.

Abstract: A lateral processing machine, includes: a bed; a floor surface X-axis guide; a first moving column that reciprocates in X direction; a first Y-axis guide disposed on the first moving column; a first processing unit guided by the first Y-axis guide and including a first ram that supports a first spindle and advances or retracts in Z direction; a second processing unit guided by the first Y-axis guide and including a second ram that rotatably supports a second spindle and advances or retract in Z direction; a first tool changer that exchanges a tool with the first spindle positioned at a first tool changing position; and a second tool changer that exchanges the tool with the second spindle positioned at a second tool changing position when the first spindle is positioned at the first tool changing position.

Abstract: A device for machining a gear using a rotating machining tool. The device has a motor spindle having a drive motor and motor spindle shaft drivable by the drive motor for driving the machining tool. The device has an attachment structure for releasably attaching the device to a work spindle of a tool head. The attachment structure is configured so the tool axis is parallel to the work spindle axis when the device is attached to the work spindle. A device is further disclosed to connect a machining tool to a counter bearing in a simple manner. For this purpose, the counter bearing has a hollow shaft. A mandrel having first and second clamping regions are arranged at positions along the longitudinal axis of the mandrel. The mandrel is inserted through the hollow shaft along the tool axis into a longitudinal bore of the machining tool.

Abstract: A monitoring module comprises a tool interface for holding the tool and a tool holding interface for insertion into a tool holder. The monitoring module has a sensor unit, whereby the axis of rotation of the monitoring module runs through the sensor unit. The sensor unit detects a variable representative of an acceleration in a plane normal to the axis of rotation of the monitoring module when the monitoring module rotates together with the tool/tool holder. A computing unit of the monitoring module receives the variables representative of the acceleration recorded by the sensor unit, determines a total acceleration from this, compares the total acceleration with a threshold value and determines that there is a concentricity error of the tool to be rotated, the monitoring module and/or the tool holder if the total acceleration is greater than the threshold value.

Abstract: A method of operating a machine tool apparatus, including: causing a tool mounted on the machine tool apparatus to work on a workpiece, during the working of the workpiece by the tool, at least one sensor monitoring the tool, machine tool apparatus and/or workpiece, for one or more signals indicative of the condition of the tool; and using the output of the one or more sensors to automatically configure when and/or how the tool and/or workpiece is inspected by at least one inspection device, the output of which is used to determine whether or not to keep using the tool.

Abstract: A workpiece position determination device includes an imager, a driver to move the imager relative to a workpiece in a planar direction parallel to a planar surface of the imager, a controller to control the driver so that the imager moves along a prescribed trajectory that passes through locations in a boundary portion in the planar surface in a plan view, a storage to store image information captured by the imager while the imager moves along the prescribed trajectory, and coordinate information of the imager at a time of capturing each image information, a position determiner to determine the position of the workpiece in the planar direction corresponding to the boundary portion based on the image information and the coordinate information stored in the storage, and an offset determiner to determine an offset of the workpiece from a reference position based on a determination result from the position determiner.

Abstract: A method of grinding a wafer includes a grinding step of grinding, by a grinding wheel, a central region of a wafer held by a holding table, to form a circular recessed part and form a ring-shaped reinforcing part 18 on the outer circumferential side of the circular recessed part. The wafer has such a thickness that the deformation of the wafer in which the circular recessed part 17 is formed is able to be suppressed by the ring-shaped reinforcing part.

Abstract: A slab edge preparation system to enable seam alignment between two slab edges abutted to each other with little visible seam therebetween, including a linear guide mechanism, a grinder mounting plate affixed to a depth adjustment base affixed to the linear guide mechanism, the grinder mounting plate configured to removably affix a hand tool grinder thereto one side of the grinder mounting plate proximate the grinder aperture, a grinder extension affixed at one end to the hand tool grinder, the grinder extension configured to extend therethrough the grinder aperture in the grinder mounting plate and affix to a cutting tool and position the cutting tool against the slab edge, and an alignment housing affixed to other side of the grinder mounting plate opposite the hand tool grinder, the cylindrical alignment housing configured to position grinder extension bearing therein the grinder aperture to maintain the grinder extension in alignment.

Abstract: Provided is a polishing tool and a methods for polishing a wafer or manufacturing a semiconductor device. A method for polishing a wafer includes contacting a surface of the wafer to a polishing pad at an interface; rotating the wafer and/or the pad; and delivering a series of selected treatment agents to the interface and removing waste from the interface through channels extending through the pad, while controlling a rate of delivering the selected polishing agents and removing the waste streams through the channels formed in the pad to optimize polishing of the wafer.

Abstract: Embodiments of the present disclosure relate a CMP tool and methods for planarization a substrate. Particularly, embodiments of the present disclosure provide a substrate transporter for use in a CMP tool. The transporter may be used transport and/or carry substrates among various polishers and cleaners in a CMP tool while preventing the substrates from drying out during transportation. By keeping surfaces of the substrates wet during substrate waiting time or idle time in the CMP tool, embodiments of the present disclosure prevent many types of defects, such as byproducts, agglomerated abrasives, pad debris, slurry residues, from accumulate on the substrate surface during CMP processing, thus improve yields and device performance.

Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and at least one detection window. The at least one detection window is located in the polishing layer. The at least one detection window includes a center portion and a cover portion surrounding the center portion. The cover portion is joined to the polishing layer, and a ratio of an area of the center portion to an area of the cover portion is between about 0.03 to about 5.00.

Abstract: Described herein are multi-layered windows for use in chemical-mechanical planarization (CMP) systems and CMP processes. The multi-layered windows of the present disclosure include a transparent structural layer and a hydrophilic surfactant applied to at least a portion of at least one surface of the transparent structural layer. Such multi-layered windows may be in the polishing pad, the platen, or both.

Abstract: A chemical mechanical polish apparatus and methods for manufacturing and use of the chemical mechanical polishing apparatus are discussed herein. In an embodiment, a polishing apparatus is provided that includes: a polishing pad coated with polypeptides; and an enzyme spraying device positioned adjacent to the polishing pad.

Abstract: Disclosed is a polishing pad including a polishing layer that is a molded body of a polyurethane composition, wherein the polyurethane composition contains 90 to 99.9 mass % of a thermoplastic polyurethane including a non-alicyclic diisocyanate unit as an organic diisocyanate unit, and 0.1 to 10 mass % of a hygroscopic polymer, and the molded body has a hardness of 60 or more and less than 75, as measured with a type-D durometer compliant with JIS K 7215.

Abstract: A machine for processing sheet metal parts includes a brush unit having at least one horizontally rotating abrasive brush for brushing the surface of the sheet metal parts to be processed. In order to adjust the processing gap or the infeed, the brush unit is movable in the vertical direction. A measuring device for measuring the diameter of the freely turning abrasive brush at different speeds may be designed as an optical measuring unit, in particular a light barrier. A calibration device is used to calculate the correct vertical position of the abrasive brush depending on a selected speed and the associated diameter of the abrasive brush.

Abstract: Embodiments of the present disclosure provided herein include an apparatus and method for pad conditioning in a chemical mechanical polishing system. The apparatus includes a first conditioning head coupleable to a first pad conditioning disk disposed at a first head distance from the first conditioning head. The apparatus further includes a second a third conditioning head configured similarly to the first conditioning head. The apparatus includes a controller configured to receive sensor readings, determine whether the sensor readings are outside of a predetermined range, and adjust the first, second, and third head distances. A method of conditioning a polishing pad includes receiving sensor readings from at least one pad thickness sensor, determining if the sensor readings are outside of a predetermined range, and, upon determining that the sensor readings are outside of the predetermined range, adjusting a head distance of a conditioning head based on the sensor readings.

Abstract: A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.