Metal-depositing Composition Contains Elemental Metal Of Group Ib (cu, Ag, Au) Patents (Class 106/1.18)
  • Patent number: 10889908
    Abstract: Superconformally filling a recessed feature includes: contacting the recessed feature with superconformal filling composition that includes: Au(SO3)23? anions; SO32? anions; and Bi3+ cations; convectively transporting Au(SO3)23? and Bi3+ to the bottom member of the recessed feature; subjecting the recessed feature to an electrical current to superconformally deposit gold from the Au(SO3)23? on the bottom member relative to the sidewall and the field, the electrical current providing a cathodic voltage; and increasing the electrical current subjected to the field and the recessed feature to maintain the cathodic voltage between ?0.85 V and ?1.00 V relative to the SSE during superconformally depositing gold on the substrate to superconformally fill the recessed feature of the article with gold as a superconformal filling of gold, the superconformal filling being void-free and seam-free.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: January 12, 2021
    Assignee: GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Daniel Josell, Thomas P. Moffat
  • Patent number: 10788713
    Abstract: Ink-jet printable compositions including nanoparticles capped with a protective layer of hydrocarbon chains and a single solvent exhibiting a single evaporation rate and having a specifically defined viscosity and surface tension that result in uniform and printable alignment layers for liquid crystal materials. Patterned liquid crystal-containing cells are also disclosed including one or more layers including the same or different nanoparticles capped with a protective layer of hydrocarbon chains printed on a surface of a substrate or even another nanoparticle-containing layer. Methods for producing the cells are also disclosed, including the step of printing a pattern on one or more portions of a cell surface utilizing a composition comprising the capped nanoparticles. Devices including the cells are also disclosed.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: September 29, 2020
    Assignee: KENT STATE UNIVERSITY
    Inventors: Torsten Hegmann, Anshul Sharma, Dmytro Reznikov
  • Patent number: 10672531
    Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: June 2, 2020
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Narahari Pujari, Bawa Singh, Ravi Bhatkal, Siuli Sarkar, Anubhav Rustogi
  • Patent number: 10564524
    Abstract: There is provided an electronic apparatus that comprises a housing, an imaging element disposed in the housing, a battery disposed in the housing, and a heat storage material filled in a space in the housing and thermally connected to at least one of the imaging element or the battery.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: February 18, 2020
    Assignee: SONY CORPORATION
    Inventors: Taiki Sugiyama, Yuichi Ishida, Takashi Oishi, Kazuhiko Suzuki
  • Patent number: 10494306
    Abstract: Electronic devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a barium-titanium-tungsten-silicon oxide.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: December 3, 2019
    Assignee: Ferro Corporation
    Inventor: Walter J. Symes, Jr.
  • Patent number: 10420260
    Abstract: In accordance with the present invention, there is provided an electromagnetic shielding composition. The electromagnetic shielding composition in accordance with the broad aspects of the present invention includes from about 40% to 60% by volume of a sheet molding composition filled with an effective amount of carbon fibers for shielding of electromagnetic radiation from the electrical systems in an at least partially electrically driven vehicle.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: September 17, 2019
    Assignee: Magna International Inc.
    Inventor: William Joseph John Harney
  • Patent number: 10392693
    Abstract: A laminate structure having an indium target with the occurrence of defects being well controlled and excellent in adhesion between the indium target and a backing tube is provided. A laminate structure of an indium target and a backing tube wherein a defect area ratio at an indium-backing tube interface is 5.0% or less.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: August 27, 2019
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yousuke Endo, Hiroyoshi Yamamoto
  • Patent number: 10384266
    Abstract: Process for producing a layer structure, which comprises the steps: E1. provision of a composition comprising i. gold (Au) particles in an amount in the range from 0.1 to 50% by weight; ii. a balance to 100% by weight of a polar, protic organic solvent; iii. less than 5% by weight of water, where the % by weight, in each case based on the total mass of the composition, add up to 100% by weight; E2. application of the composition to a substrate to give a precursor; E3. heating of the precursor to a temperature in the range from 25 to 200° C. to give the layer structure.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: August 20, 2019
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Susanne Behl, Kai-Ulrich Boldt
  • Patent number: 10307825
    Abstract: An object of the present invention is to provide a metal powder and an ink with which a sintered body having good flexibility can be formed, and a sintered body having good flexibility. A metal powder according to an embodiment of the present invention has a mean particle size D50BET of 1 nm or more and 200 nm or less as calculated by a BET method, a mean crystallite size DCryst of 20 nm or less as determined by an X-ray analysis, and a ratio (DCryst/D50BET) of the mean crystallite size DCryst to the mean particle size D50BET of less than 0.4.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: June 4, 2019
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Issei Okada, Yoshio Oka, Takashi Kasuga, Yasuhiro Okuda, Jinjoo Park, Kousuke Miura, Hiroshi Ueda
  • Patent number: 10020790
    Abstract: A composite electronic component includes: a power stabilization unit including a capacitor and an inductor connected to each other in series and configured to rectify input voltage to generate output voltage; and a switch unit including a first switch connected to the capacitor in parallel and a second switch connected to the inductor in parallel.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: July 10, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: In Wha Jeong, Dong Seong Oh, Hugh Kim
  • Patent number: 9914743
    Abstract: Provided herein is a method for preparing a silver complex. The method includes reacting a silver oxide with a mixture of ammonium carbamate and isopropyl amine at room temperature in the presence of methanol.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: March 13, 2018
    Assignee: Inktec Co., Ltd.
    Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo
  • Patent number: 9580826
    Abstract: A method for recovering platinum group metals from a catalytic structure, such as a fuel cell membrane electrode assembly, involving dissolution of the platinum group metal by treating the catalytic structure in an electrolytic cell with a suitable electrolyte containing a complexing agent and introducing an electric current into the electrolytic cell; and subsequently re-precipitating the platinum group metal by increasing the pH of the electrolyte system and adding a reducing agent.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: February 28, 2017
    Assignee: Syddansk Universitet
    Inventors: Eivind Skou, Casper Noergaard, Serban Nicolae Stamatin
  • Patent number: 9466425
    Abstract: A first paste film containing a metal powder and non-vitreous inorganic oxide is formed on a glass ceramic green sheet, and a second paste film containing a metal powder is formed on the first paste film to cover at least the edge portion of the first paste film. Then the glass ceramic green sheet and the first and second paste films are fired. As a result, a surface electrode is obtained, and then a plating layer is formed on the surface electrode. The second paste film contains less non-vitreous inorganic oxide than the first paste film and the abundance ratio of the non-vitreous inorganic oxide in the surface electrode is lower in a region bordering the plating layer than in a region bordering the glass ceramic layer at least in an edge portion of the surface electrode.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: October 11, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Sumiyo Wakaki, Takahiro Sumi, Machiko Motoya
  • Patent number: 9416459
    Abstract: An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: August 16, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Ling Lin, Yen-Liang Lu, Chi-Mao Hsu, Chin-Fu Lin, Chun-Hung Chen, Tsun-Min Cheng, Chi-Ray Tsai
  • Patent number: 9028599
    Abstract: Provided is a copper film-forming composition, which is in the form of a solution and can obtain a copper film having sufficient electrical conductivity when heated at a relatively low temperature. This copper film-forming composition contains 0.01 to 3.0 mol/kg of copper formate or its hydrate, 0.01 to 3.0 mol/kg of copper acetate or its hydrate, at least one diol compound selected from a group of diols of formula (1) and diols of formula (1?), a piperidine compound of formula (2), and an organic solvent. When a content of the copper formate or its hydrate is assumed to be 1 mol/kg, the diol compound is contained in a range of 0.1 to 6.0 mol/kg and the piperidine compound is contained in a range of 0.1 to 6.0 mol/kg.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: May 12, 2015
    Assignee: Adeka Corporation
    Inventor: Tetsuji Abe
  • Patent number: 9006296
    Abstract: According to the present invention, a metal nanoparticle dispersion suitable to multiple layered coating by jetting in the form of fine droplets is prepared by dispersing metal nanoparticles having an average particle size of 1 to 100 nm in a dispersion solvent having a boiling point of 80° C. or higher in such a manner that the volume percentage of the dispersion solvent is selected in the range of 55 to 80% by volume and the fluid viscosity (20° C.) of the dispersion is chosen in the range of 2 mPa·s to 30 mPa·s, and then when the dispersion is discharged in the form of fine droplets by inkjet method or the like, the dispersion is concentrated by evaporation of the dispersion solvent in the droplets in the course of flight, coming to be a viscous dispersion which can be applicable to multi-layered coating.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: April 14, 2015
    Assignees: Harima Chemicals, Inc., SIJ Technology, Inc., National Institute of Advanced Industrial Science and Technology
    Inventors: Daisuke Itoh, Akihito Izumitani, Noriaki Hata, Yorishige Matsuba, Kazuhiro Murata, Hiroshi Yokoyama
  • Patent number: 8961669
    Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: February 24, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Anna Rzeznik
  • Publication number: 20140287165
    Abstract: The present disclosure is related to a cladding composition. The cladding composition may include cladding powder particles and flux particles. The flux particles may have an average particle size of less than about 40 ?m, and more than about 50% of the flux particles may adhere to the surfaces of the cladding powder particles.
    Type: Application
    Filed: March 21, 2013
    Publication date: September 25, 2014
    Applicant: Caterpillar Inc.
    Inventors: Daniel Thomas Cavanaugh, Daniel Joseph Sordelet, Justin Curtis Embrey
  • Patent number: 8815126
    Abstract: Disclosed is a method of screen printing an electrically conductive feature on a substrate, the electrically conductive feature including metallic anisotropic nanostructures, and a coating solution therefore.
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: August 26, 2014
    Assignee: Cambrios Technologies Corporation
    Inventor: Adrian Winoto
  • Publication number: 20140178572
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Application
    Filed: February 17, 2013
    Publication date: June 26, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Andy Lok-Fung CHOW, Dennis Kwok-Wai YEE, Crystal P. L. LI
  • Patent number: 8729397
    Abstract: An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: May 20, 2014
    Assignee: Unimicron Technology Corp.
    Inventors: Yi-Chun Liu, Wei-Ming Cheng, Tsung-Yuan Chen, Shu-Sheng Chiang
  • Patent number: 8709548
    Abstract: A method of making a sputtering target includes providing a backing structure, and forming a copper indium gallium sputtering target material on the backing structure by spray forming.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: April 29, 2014
    Assignee: Hanergy Holding Group Ltd.
    Inventors: A. Piers Newbery, Timothy Kueper, Daniel R. Juliano
  • Patent number: 8632628
    Abstract: One aspect of the present invention is a deposition solution to deposit metals and metal alloys such as for fabrication of electronic devices. According to one embodiment, the deposition solution comprises metal ions and a pH adjustor. The pH adjustor comprises a functional group having a general formula (R1R2N)(R3R4N)C?N—R5 where: N is nitrogen; C is carbon; and R1, R2, R3, R4, and R5 are the same or different and represent hydrogen, alkyl group, aryl group, or alkylaryl group. Another aspect of the presented invention is a method of preparing deposition solutions. Still another aspect of the present invention is a method of fabricating electronic devices.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: January 21, 2014
    Assignee: Lam Research Corporation
    Inventor: Artur Kolics
  • Patent number: 8623764
    Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: January 7, 2014
    Assignee: Lam Research Corporation
    Inventor: Mark Ian Wagner
  • Patent number: 8617301
    Abstract: Compositions and methods for depositing elemental metal M(0) films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing a metal precursor, an excess amount of neutral labile ligands, and a supercritical solvent; exposing the metal precursor to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; reducing the metal precursor to the elemental metal M(0) by using the reducing agent and/or the thermal energy; and depositing the elemental metal M(0) film while minimizing formation of metal oxides.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: December 31, 2013
    Assignee: Lam Research Corporation
    Inventor: Mark Ian Wagner
  • Publication number: 20130344235
    Abstract: This invention discloses compositions and methods that afford sustainable deposition of electroless copper coatings, using aqueous hypophosphite compositions as opposed to formaldehyde (FA) The invention thus obviates the use of nefarious FA, a suspected carcinogen, presently the predominant reducer for plating electroless copper. The patent enables to plate “heavy” copper thicknesses currently unobtainable by the prior art teachings of electroless copper processes, that are based on hypophosphite reducers. The process and compositions of this patent are especially attractive for horizontal plating machines, currently using (FA) compositios. It is also beneficial for plating electroless copper on aluminum or zinc diecastings The patent further envisions electroless plating of silver in a cyanide-free composition.
    Type: Application
    Filed: June 9, 2013
    Publication date: December 26, 2013
    Inventor: John J. Grunwald
  • Publication number: 20130319367
    Abstract: The invention relates to a zinc-free spray powder for thermally coating a substrate, in particular for thermally coating a bearing part of a bearing apparatus, which spray powder has the following composition except for unavoidable contaminants: tin=5% to 30% weight percent; aluminum=0.1% to 5% weight percent; iron=at most 1% weight percent, and copper=difference to 100% weight percent. The invention furthermore relates to a layer system applied via thermal spraying, a work piece, particularly a connecting rod, as well as a spray method for manufacturing a spray layer.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 5, 2013
    Inventors: Bernd Distler, Peter Ernst
  • Patent number: 8591636
    Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: November 26, 2013
    Assignee: Rohm and Haas Electronics Materials LLC
    Inventors: Feng Liu, Maria Anna Rzeznik
  • Patent number: 8591637
    Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: November 26, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Maria Anna Rzeznik, Feng Liu
  • Publication number: 20130241060
    Abstract: A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 19, 2013
    Applicant: ENTHONE INC.
    Inventors: Vincent Paneccasio, JR., Xuan Lin, Richard Hurtubise, Qingyun Chen
  • Patent number: 8388768
    Abstract: The present invention relates to a method for preparing an artificial patination material to substrates, preferably made from copper or copper alloys and a patination material. The raw material is a copper salt, which reacts with an alkali metal hydroxide. The precipitate is dispersed with powerful mixing and an addition of a dispersing agent. An oxidative agent like manganese dioxide is used, and carbon is used as an agent for catalyzing natural patina forming. Metal compounds are used to achieving desired color and/or color tinge. The invention relates also to the corresponding patination material.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: March 5, 2013
    Assignee: Luvata Espoo Oy
    Inventor: Tapio Korpinen
  • Patent number: 8383950
    Abstract: A first patterned etch stop layer and a first patterned conductor layer are laminated by a dielectric material to a second patterned etch stop layer and a second patterned conductor layer. As the etch stop metal of the first and second patterned etch stop layers is selectively etchable compared to a conductor metal of the first and second patterned conductor layers, the first and second patterned etch stop layers provide an etch stop for substrate formation etch processes. In this manner, etching of the first and second patterned conductor layers is avoided insuring that impedance is controlled to within tight tolerance.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: February 26, 2013
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, Sukianto Rusli, Robert F. Darveaux
  • Patent number: 8338629
    Abstract: Provided are an organometallic precursor, wherein a carboxyhydrazide compound is coordinated to a central metal, and a metal film or pattern using the precursor. By using the organometallic precursor, highly pure metal films or patterns can be obtained through a simple low-temperature process.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: December 25, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young Hun Byun, Tatsiana Kuzniatsova, Hye Yeon Yang
  • Patent number: 8333834
    Abstract: An object of the present invention is to provide a high-purity aqueous copper sulfonate solution and a simplified method of producing this solution. The aqueous copper sulfonate solution of the present invention is characterized in that the copper concentration therein is at least 90 g/L, the content of metal impurities is less than 10 mg/L as metal for each metal impurity, the content of chlorine is less than 10 mg/L, and the sulfonic acid is a sulfonic acid represented by the following general formula R—(SO3H)n (in the formula, R represents a lower alkyl group, lower alkylidene group, lower alkylene group, or hydroxyalkyl group and n represents 1 or 2).
    Type: Grant
    Filed: February 9, 2011
    Date of Patent: December 18, 2012
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Junnosuke Sekiguchi, Masaomi Murakami, Toru Imori
  • Publication number: 20120301739
    Abstract: A pretreatment composition for metal that provides enhanced corrosion resistance, enhanced paint adhesion and reduced chip damage to a wide variety of metal substrates. The pretreatment is also cleaner because it is based on zirconium rather than zinc phosphates. The pretreatment coating composition in use preferably comprises 50 to 300 parts per million (ppm) zirconium, 0 to 100 ppm of SiO2, 150-2000 ppm of total fluorine and 10-100 ppm of free fluorine, 150 to 10000 ppm of zinc and 10 to 10000 ppm of an oxidizing agent and has a pH of 3.0 to 5.0, preferably about 4.0. The coating composition can optionally include 0 to 50 ppm of copper. The suitable oxidizing agents can be selected from a large group.
    Type: Application
    Filed: June 25, 2012
    Publication date: November 29, 2012
    Applicant: Henkel AG & Co. KGaA
    Inventors: Donald VONK, Edis KAPIC, Bruce GOODREAU, Alvaro BOBADILLA
  • Patent number: 8236733
    Abstract: A method for forming a precursor solution for metal organic deposition includes dissolving an additive-free first precursor composed of a rare earth element, a second precursor comprising barium, and a third precursor composed of copper into an acid to form a compound solution; dissolving the compound solution into a solvent to form a pre-precursor solution; and evaporating the solvent from the pre-precursor solution to form a precursor solution having an increased viscosity; wherein at least one of the first precursor, the second precursor, and the third precursor is dissolved into a fluorine-free acid. A method for forming a superconducting thick film from the above precursor solution includes forming a thick film by a one-time coating of the precursor solution having an increased viscosity onto a biaxially-textured base followed by heat treating to form the superconducting thick film having a thickness of about 0.2 ?m or more and having no cracking.
    Type: Grant
    Filed: July 20, 2009
    Date of Patent: August 7, 2012
    Assignees: Seoul National University Industry Foundation, Sunam Co., Ltd.
    Inventors: Sang-Im Yoo, Seung-Hyun Moon, Geo-Myung Shin
  • Publication number: 20120128888
    Abstract: According to the present invention a composition is provided comprising at least one source of metal ions and at least one additive obtainable by reacting a) a polyhydric alcohol condensate compound derived from at least one polyalcohol of formula (I) X(OH)n (I) by condensation with b) at least one alkylene oxide to form a polyhydric alcohol condensate comprising polyoxyalkylene side chains, wherein n is an integer from 3 to 6 and X is an n-valent linear or branched aliphatic or cycloaliphatic radical having from 2 to 10 carbon atoms, which may be substituted or unsubstituted.
    Type: Application
    Filed: July 16, 2010
    Publication date: May 24, 2012
    Applicant: BASF SE
    Inventors: Cornelia Roeger-Goepfert, Roman Benedikt Raether, Alexandra Haag, Dieter Mayer, Charlotte Emnet
  • Publication number: 20120119352
    Abstract: An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100 ?m or smaller, in terms of the width of the exposed substrate area, and having a height of 3 ?m or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100 ?m or finer is formed therefrom.
    Type: Application
    Filed: March 10, 2010
    Publication date: May 17, 2012
    Applicant: Kanto Kagaku Kabushiki Kaisha
    Inventors: Ryota Iwai, Tomoaki Tokuhisa, Masaru Kato, Tokihiro Yokoshima, Masahiro Aoyagi, Yasuhiro Yamaji, Katsuya Kikuchi, Hiroshi Nakagawa
  • Patent number: 8143431
    Abstract: Novel copper alkoxide compound based ink formulations and their chemical syntheses are disclosed. The method of using the ink formulations to print conducting copper metal lines with standard ink jet printing and curing at <150° C. is also disclosed.
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: March 27, 2012
    Assignee: Air Products and Chemicals, Inc.
    Inventors: John Anthony Thomas Norman, Melanie K. Perez, Robert Krantz Pinschmidt, Jr.
  • Patent number: 8101097
    Abstract: Printable compositions comprising: (a) 5 to 40 parts by weight of silver nanoparticles having a maximum effective diameter of 150 nm, as determined by laser correlation spectroscopy; (b) 50 to 99.5 parts by weight of water; (c) 0.01 to 15 parts by weight of a dispersing agent; (d) 0.5 to 5 parts by weight of a film former; and (g) 30 to 70 parts by weight of metal particles having a maximum effective diameter of 10 ?m, as determined by laser correlation spectroscopy; wherein the printable composition has a viscosity of at least 1 Pa·s; processes for producing electrically conductive coatings using such compositions and electrically conductive coatings prepared thereby.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: January 24, 2012
    Assignee: Bayer MaterialScience AG
    Inventors: Stefan Bahnmüller, Stefanie Eiden, Stephan Michael Meier, Dirk Storch, Bernard Dunkel
  • Patent number: 8066912
    Abstract: A conductive pattern forming ink for forming a conductive pattern on a substrate by a droplet discharge method, includes: metal particles; an aqueous dispersion medium in which the metal particles are dispersed; sugar alcohol derived from a disaccharide; and a polyglycerol compound having a polyglycerol skeleton. H shown in the following formula (I) is 0.10 to 0.80.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: November 29, 2011
    Assignee: Seiko Epson Corporation
    Inventor: Naoyuki Toyoda
  • Patent number: 8067090
    Abstract: The invention relates to a platelike color effect pigment having the following structure: a) a metallic reflective core; b) a spacer layer made of a dielectric material, and; c) an, all in all, semitransparent absorber layer comprising, in essence, discrete metal particles that have an average diameter of 1 to 100 nm and optionally at least one other protective layer.
    Type: Grant
    Filed: October 18, 2006
    Date of Patent: November 29, 2011
    Assignee: Eckart GmbH
    Inventors: Ralph Domnick, Georg Bauer, Christian Wolfrum, Hans-Jorg Kremitzl, Thomas Klaumunzer, Thomas Schuster
  • Patent number: 7972538
    Abstract: A conductive pattern formation ink capable of producing a conductive pattern with reduced likelihood of generation of cracks, a conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics, and a wiring substrate provided with the conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member by patterning and comprised of a dispersion solution. The dispersion solution includes a solvent, metal particles dispersed in the solvent, and an anti-cracking agent contained in the solvent, wherein the anti-cracking agent is contained for preventing generation of cracks in the conductive pattern during desolvation of the solvent.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: July 5, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Naoyuki Toyoda, Toshiyuki Kobayashi, Sachiko Endo
  • Publication number: 20110151268
    Abstract: A material is provided containing a metal and a lactic acid condensate, wherein the metal is selected from the group of copper, silver, and gold. An electronic component having a surface made of metal, ceramic, or oxide may be coated with the material. A method for the production of metallic surfaces on an electronic component is also provided.
    Type: Application
    Filed: August 19, 2009
    Publication date: June 23, 2011
    Applicant: W.C. HERAEUS GMBH
    Inventors: Wolfgang Schmitt, Michael Schaefer, Ferdinand Bartels
  • Publication number: 20110015079
    Abstract: The present invention relates to a method of forming a precursor solution for metal organic deposition and a method of forming a superconducting thick film using the same. A first precursor comprising one rare earth element, a second precursor comprising barium, and a third precursor comprising copper are dissolved into acid to form a compound solution, the compound solution is dissolved into solvent to form a pre-precursor solution, and the solvent of the pre-precursor solution is evaporated to form a precursor solution with the increased viscosity. A sufficiently thick film can be formed without any cracking through only one-time coating.
    Type: Application
    Filed: July 20, 2009
    Publication date: January 20, 2011
    Applicants: Seoul National University Industry Foundation, SUNAM CO., LTD.
    Inventors: Sang-Im YOO, Seung-Hyun Moon, Geo-Myung Shin
  • Patent number: 7824580
    Abstract: A silver-containing, disperse, water-containing formulation and its use to produce electrically conductive and/or optically reflective coatings is described. The formulation contains at least a) 0.5 to 30 parts by wt. of silver metal particles with an effective diameter of at most 150 nm, preferably at most 100 nm, particularly preferably 40 to 80 nm, with a bimodal size distribution, b) 50 to 99.5 parts by wt. of water and optionally up to 30 parts by wt. of solvent, c) 0.01 to 10 parts by wt. of at least one, in particular polymeric, dispersant, d) 0 to 5 parts by wt. of film-producer, e) 0 to 5 parts by wt. of additives, f) 0 to 5 parts by wt. of conductive polymers, and has a viscosity of at most 150 mPa.s.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: November 2, 2010
    Assignee: Bayer MaterialScience AG
    Inventors: Matthias Boll, Stefanie Eiden, Johan Kijlstra
  • Patent number: 7786011
    Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: August 31, 2010
    Assignee: Lam Research Corporation
    Inventor: Mark Ian Wagner
  • Patent number: 7717987
    Abstract: The copper-indium-gallium (CuInGa) alloy is in particular to be used for the production of sputter targets, tubular cathodes and similar coating material sources. It has a phase corresponding to a Cu5Zn8 prototype phase in which the lattice sites of the zinc atoms (Zn) are occupied by gallium atoms (gallium-substituted Cu5Zn8 phase) and in which indium is simultaneously introduced into the elementary cell or phase, making up a proportion of up to 26 wt %.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: May 18, 2010
    Assignee: GfE Metalle und Materialien GmbH
    Inventors: Karl-Uwe van Osten, Stefan Britting
  • Publication number: 20100071587
    Abstract: Provided are an organometallic precursor, wherein a carboxyhydrazide compound is coordinated to a central metal, and a metal film or pattern using the precursor. By using the organometallic precursor, highly pure metal films or patterns can be obtained through a simple low-temperature process.
    Type: Application
    Filed: March 6, 2009
    Publication date: March 25, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Hun BYUN, Tatsiana KUZNIATSOVA, Hye Yeon YANG
  • Publication number: 20100009071
    Abstract: A bimodal metal nanoparticle composition includes first metal nanoparticles having an average diameter of from about 50 nm to about 1000 nm, and second stabilized metal nanoparticles having an average diameter of from about 0.5 nm to about 20 nm, the second stabilized metal nanoparticles including metal cores having a stabilizer attached to the surfaces thereof, wherein the stabilizer is a substituted dithiocarbonate.
    Type: Application
    Filed: July 8, 2008
    Publication date: January 14, 2010
    Applicant: XEROX CORPORATION
    Inventors: Naveen CHOPRA, Yuning LI, Peter M. KAZMAIER