Group Ib (cu, Au) Metal Patents (Class 106/1.26)
  • Patent number: 11555252
    Abstract: An aqueous acidic copper electroplating bath that produces a satin deposit includes a source of copper ions, an acid, a satin additive, and optionally one or more acidic copper electroplating bath additive(s), wherein the satin additive includes a block copolymer with the structure of RO(EO)m(PO)nH.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: January 17, 2023
    Assignee: Coventya, Inc.
    Inventors: George Bokisa, Claire Theuret
  • Patent number: 10600996
    Abstract: Disclosed herein is an emotion lighting apparatus for vehicle. According to the present invention, the emotion lighting apparatus for vehicle comprises a lighting unit as a light source selected from the group consisting of OLED and LED, a supporting unit for supporting the light source, and a cover for covering the light unit and including a transmitting window passing light from the light source. In this case, the light unit and cover are bendable.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: March 24, 2020
    Assignee: KOLON GLOTECH, INC.
    Inventor: Byoung Cheul Park
  • Patent number: 10518330
    Abstract: A method for creating nanoparticles directly from bulk metal by applying ultrasound to the surface in the presence of a two-part surfactant system. Implosive collapse of cavitation bubbles near the bulk metal surface generates powerful microjets, leading to material ejection. This liberated material is captured and stabilized by a surfactant bilayer in the form of nanoparticles. Nanoparticles can be produced regardless of the bulk metal form factor. The method is generally applicable of metals and alloys. The method can be applied to an environmentally important problem, the reclamation of gold from an electronic waste stream.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: December 31, 2019
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Dale L. Huber, John Daniel Watt, Jonathan Chavez, Lauren Marie Ammerman
  • Patent number: 10500643
    Abstract: The invention provides a green chemistry, aqueous method to synthesize gold nanoparticles directly from bulk gold sources. The method involves the ultrasonication of bulk gold in water in the presence of an alkythiol species and a quaternary ammonium surfactant. An organic bilayer forms on the surface of the gold which renders it susceptible to material ejection from the violent collapse of cavitation bubbles. This ejected material is stabilized in solution by the formation of an organic bilayer and can be easily separated. It can then be subjected to an aqueous digestive ripening step to give a gold nanoparticle ensemble with a well-defined plasmon resonance. This method is applicable to a number of different sources of bulk gold. The method can be applied to an environmentally important problem; the recovery of gold from electronic waste streams. For example, gold nanoparticles can be extracted directly from the surface of SIM cards, with no prior manipulation of the cards necessary.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: December 10, 2019
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Dale L. Huber, John Daniel Watt, Jonathan Chavez, Lauren Marie Ammerman
  • Patent number: 10329681
    Abstract: A copper-silver dual-component metal electroplating solution includes copper methanesulfonate, silver methanesulfonate, methanesulfonic acid, chlorine ions, and water. An electroplating method for forming a copper-silver dual-component metal by using such an electroplating solution, the steps of which includes (a) contacting the copper-silver dual-component metal electroplating solution with a substrate; (b) applying an operating voltage, the current density of which is controlled to be between 0.1 and 2 ASD in order to carry out electroplating on the substrate. Therefore, the electroplating solution has environmental characteristics, such as less poisoning hazards, through the design of methanesulfonic acid and methanesulfonate electroplating solution. Also, the potential and the current are adjusted during the electroplating in order to obtain a copper-silver dual-component metal plating layer with a specific silver content.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: June 25, 2019
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chi-Haw Chiang, Liang-Huei Jiang, Ren-Ruey Fang, Chien-Liang Chang, Yu-Ping Wang, Ming-Ta Hsieh
  • Patent number: 10011914
    Abstract: The present invention relates to an electrolyte composition for depositing copper on metal substrates. The composition contains a combination of two aromatic amines and an electrochemically inert cation. This electrolyte makes it possible to increase the copper nucleation density. It also allows bottom-up filling in trenches that have a very small opening dimension, typically lower than 40 nm.
    Type: Grant
    Filed: September 10, 2014
    Date of Patent: July 3, 2018
    Assignee: ALCHIMER
    Inventors: Laurianne Religieux, Paul Blondeau, Dominique Suhr
  • Patent number: 10006126
    Abstract: The present invention is directed to compositions for electroless plating baths and their use, and more particularly to different solutions each usable to both make up an original bath and to replenishment of the original bath.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: June 26, 2018
    Assignee: SURFACE TECHNOLOGY, INC.
    Inventor: Jijeesh Thottathil
  • Patent number: 9809883
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • Patent number: 9663667
    Abstract: An electroless waterless silver plating ink process for coating an article substrate with a bright metallic silver plate, wherein the silvering ink comprises a silver salt, an ammonium salt and dimethyl sulfoxide.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: May 30, 2017
    Inventor: Andre Reiss
  • Patent number: 9611549
    Abstract: Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: April 4, 2017
    Assignee: Rphm and Haas Electronic Materials LLC
    Inventors: Feng Liu, Maria Rzeznik
  • Patent number: 9382626
    Abstract: Catalysts which include nanoparticles of palladium metal and cellulose derivatives are used in electroless metal plating. The palladium catalysts are free of tin.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: July 5, 2016
    Inventors: Feng Liu, Maria Anna Rzeznik
  • Patent number: 9259725
    Abstract: According to one embodiment, a catalyst includes a metal ion, and an acyclic ligand having at least one aza-containing moiety, where the ligand is complexed to the metal ion.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: February 16, 2016
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: William C. Floyd, III, Carlos A. Valdez, Roger Aines, Sarah Baker, Joe H. Satcher, Jr.
  • Patent number: 9248504
    Abstract: There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: February 2, 2016
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yuki Kaneshiro, Shinichi Suenaga, Hidefumi Fujita, Minoru Kishida
  • Patent number: 9144794
    Abstract: Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: September 29, 2015
    Inventors: Feng Liu, Maria Anna Rzeznik
  • Patent number: 9138733
    Abstract: Catalysts which include nanoparticles of palladium metal and cellulose derivatives are used in electroless metal plating. The palladium catalysts are free of tin.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: September 22, 2015
    Inventors: Feng Liu, Maria Anna Rzeznik
  • Patent number: 9017463
    Abstract: A copper plating solution and a method for preparing a copper plating solution are provided. The copper plating solution comprises: a copper salt, a complexing agent, a stabilizer, a reducing agent, a surfactant, a hydroxyl-terminated polyoxypropylene ether, and a sodium trisulfide-isothiourea-propane sulfonate.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: April 28, 2015
    Assignee: BYD Company Limited
    Inventor: Jialiang Wei
  • Patent number: 8980077
    Abstract: Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: March 17, 2015
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Duane R. Romer, Elissei Iagodkine, Inho Lee
  • Publication number: 20140305803
    Abstract: Disclosed are pretreatment compositions and associated methods for treating metal substrates with pretreatment compositions, including ferrous substrates, such as cold rolled steel and electrogalvanized steel. The pretreatment composition includes: (a) a group IIIB and/or IVB metal; (b) free fluorine; (c) a source of aluminum ions; and (d) water. The methods include contacting the metal substrates with the pretreatment composition.
    Type: Application
    Filed: June 18, 2014
    Publication date: October 16, 2014
    Inventors: Mark W. McMillen, Edward F. Rakiewicz, Mark W. Simpson, James A. DeChant
  • Publication number: 20140290530
    Abstract: The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2A?B2-?O4-? (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0<?<2, and 0<?<1.5. Polymer article containing the metal compound and method for preparing the polymer article as well as selective metallization of a surface of the polymer article are also provided. In addition, the present disclosure provides an ink composition and the selective metallization for a surface of the insulative substrate using the ink composition.
    Type: Application
    Filed: April 1, 2014
    Publication date: October 2, 2014
    Applicants: BYD COMPANY LIMITED, SHENZHEN BYD AUTO R&D COMPANY LIMITED
    Inventors: Qing GONG, Wei ZHOU, Bifeng MAO, Weifeng MIAO
  • Patent number: 8815126
    Abstract: Disclosed is a method of screen printing an electrically conductive feature on a substrate, the electrically conductive feature including metallic anisotropic nanostructures, and a coating solution therefore.
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: August 26, 2014
    Assignee: Cambrios Technologies Corporation
    Inventor: Adrian Winoto
  • Patent number: 8771409
    Abstract: It is an object of the present invention to provide an electroless gold plating solution capable of directly subjecting a plated coating film made of an underlying metal such as nickel or palladium to gold plate processing, of forming a thick gold plated coating film having a thickness of 0.1 ?m or more, of forming a uniform gold plated coating film, and of safely performing plating work. The present invention relates to an electroless gold plating solution comprising: a water-soluble gold compound; and hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. Preferably, the electroless gold plating solution comprises 0.1 to 100 g/L of hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine.
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: July 8, 2014
    Assignee: Electroplating Engineers of Japan Limited
    Inventors: Takanobu Asakawa, Tomoyuki Fujinami
  • Patent number: 8747643
    Abstract: Copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: June 10, 2014
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Zukhra I. Niazimbetova, Maria Anna Rzeznik
  • Patent number: 8703166
    Abstract: Antimicrobial and algaecidal products are disclosed. In general, the antimicrobial or algaecidal products can be adhered to structural components of buildings and include particles that, when combined with water, produce a solution that is toxic to organisms such as algae. The products provide an algaecidal wash as water percolates on, or through the product, and can prevent or control growth of unsightly algae and other microbes.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: April 22, 2014
    Inventor: John Flynn
  • Patent number: 8632628
    Abstract: One aspect of the present invention is a deposition solution to deposit metals and metal alloys such as for fabrication of electronic devices. According to one embodiment, the deposition solution comprises metal ions and a pH adjustor. The pH adjustor comprises a functional group having a general formula (R1R2N)(R3R4N)C?N—R5 where: N is nitrogen; C is carbon; and R1, R2, R3, R4, and R5 are the same or different and represent hydrogen, alkyl group, aryl group, or alkylaryl group. Another aspect of the presented invention is a method of preparing deposition solutions. Still another aspect of the present invention is a method of fabricating electronic devices.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: January 21, 2014
    Assignee: Lam Research Corporation
    Inventor: Artur Kolics
  • Patent number: 8617301
    Abstract: Compositions and methods for depositing elemental metal M(0) films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing a metal precursor, an excess amount of neutral labile ligands, and a supercritical solvent; exposing the metal precursor to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; reducing the metal precursor to the elemental metal M(0) by using the reducing agent and/or the thermal energy; and depositing the elemental metal M(0) film while minimizing formation of metal oxides.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: December 31, 2013
    Assignee: Lam Research Corporation
    Inventor: Mark Ian Wagner
  • Patent number: 8545689
    Abstract: Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: October 1, 2013
    Assignee: International Business Machines Corporation
    Inventors: Shafaat Ahmed, Hariklia Deligianni
  • Patent number: 8454815
    Abstract: Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: June 4, 2013
    Assignee: Rohm and Haas Electronics Materials LLC
    Inventors: Zuhra I. Niazimbetova, Maria Anna Rzeznik
  • Patent number: 8404035
    Abstract: An electroless copper plating solution that is favorable to improve the adhesion of a plating film and realizes uniform plating at a low temperature is characterized by containing a water-soluble nitrogen-containing polymer in an electroless copper plating solution, and preferably the above-mentioned electroless copper plating solution contains glyoxylic acid and phosphinic acid as reducing agents. The water-soluble nitrogen-containing polymer is preferably a polyacrylamide or a polyethyleneimine and, preferably, its weight average molecular weight (Mw) is at least 100,000 and Mw/Mn is 10.0 or less.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: March 26, 2013
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori, Yoshihisa Fujihira
  • Patent number: 8357285
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: January 22, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka Morii, Masanori Orihashi
  • Patent number: 8317909
    Abstract: The present invention provides compositions and processes for preparing metallic ions for deposition on and/or into conductive substrates, such as metals, to substantially eliminate friction from metal to metal contact. It is used in the aqueous embodiment to form new metal surfaces on all metal substrates. The processes form stable aqueous solutions of metal and metalloid ions that can be adsorbed or absorbed on and/or into conductive substrates. The aqueous solutions consist of ammonium alkali metal phosphate salts, and/or ammonium alkali metal sulfate salts mixed with a water soluble metal or metalloid salt from Group I through Group VIII of the periodic table of elements. The aqueous solutions allow for a nano deposition of the metal ions on and/or into the surfaces of conductive substrates. The surfaces created by the deposited metal ions will provide metal passivation and substantially eliminate friction in metal-to-metal contact without the use of hydrocarbon based lubricants.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: November 27, 2012
    Assignee: DFHS, LLC
    Inventor: Frank G. Defalco
  • Patent number: 8298325
    Abstract: A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: October 30, 2012
    Assignee: Lam Research Corporation
    Inventors: Eugenijus Norkus, Jane Jaciauskiene, Yezdi Dordi
  • Patent number: 8268157
    Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: September 18, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Zukhra I. Niazimbetova
  • Patent number: 8268158
    Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: September 18, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Zukhra I. Niazimbetova, Elie H. Najjar, Maria Anna Rzeznik, Erik Reddington
  • Patent number: 8262895
    Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: September 11, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Zukhra I. Niazimbetova, Maria Anna Rzeznik
  • Patent number: 8262891
    Abstract: Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.
    Type: Grant
    Filed: October 2, 2006
    Date of Patent: September 11, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Deyan Wang, Robert D. Mikkola, George G. Barclay
  • Publication number: 20120156387
    Abstract: The present invention relates to an electrolyte for the electroless deposition of a metal layer on a substrate, wherein the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between ?2 and +5, and in which instead a ?-amino acid is used as stabilizer. In particular, the inventive electrolyte can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid. Furthermore, the invention is directed to a method for the electroless deposition of metal layers utilizing an inventive electrolyte as well as the use of ?-amino acids as stabilizer in electrolytes for the electroless deposition of metal layers in general.
    Type: Application
    Filed: July 6, 2010
    Publication date: June 21, 2012
    Applicant: ENTHONE INC.
    Inventors: Franz-Josef Stark, Christoph Werner
  • Patent number: 8197583
    Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: June 12, 2012
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki Hotta, Takahiro Ishizaki, Tomohiro Kawase, Masaharu Takeuchi
  • Publication number: 20120129005
    Abstract: It is an object of the present invention to provide an electroless gold plating solution capable of directly subjecting a plated coating film made of an underlying metal such as nickel or palladium to gold plate processing, of forming a thick gold plated coating film having a thickness of 0.1 ?m or more, of forming a uniform gold plated coating film, and of safely performing plating work. The present invention relates to an electroless gold plating solution comprising: a water-soluble gold compound; and hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. Preferably, the electroless gold plating solution comprises 0.1 to 100 g/L of hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine.
    Type: Application
    Filed: April 15, 2011
    Publication date: May 24, 2012
    Inventors: Takanobu Asakawa, Tomoyuki Fujinami
  • Publication number: 20120104331
    Abstract: One aspect of the present invention is a deposition solution to deposit metals and metal alloys such as for fabrication of electronic devices. According to one embodiment, the deposition solution comprises metal ions and a pH adjustor. The pH adjustor comprises a functional group having a general formula (R1R2N)(R3R4N)C?N—R5 where: N is nitrogen; C is carbon; and R1, R2, R3, R4, and R5 are the same or different and represent hydrogen, alkyl group, aryl group, or alkylaryl group. Another aspect of the presented invention is a method of preparing deposition solutions. Still another aspect of the present invention is a method of fabricating electronic devices.
    Type: Application
    Filed: October 29, 2010
    Publication date: May 3, 2012
    Inventor: Artur KOLICS
  • Patent number: 8152914
    Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: April 10, 2012
    Assignee: Atotech Deutschland GmbH
    Inventors: Sigrid Schadow, Brigitte Dyrbusch, Carl Christian Fels
  • Patent number: 8147601
    Abstract: This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: April 3, 2012
    Assignee: Surface Technology, Inc.
    Inventors: Michael Feldstein, Thomas Stephen Lancsek, Jijeesh Jose Thottathil
  • Patent number: 8137447
    Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: March 20, 2012
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki Hotta, Takahiro Ishizaki, Tomohiro Kawase, Masaharu Takeuchi
  • Publication number: 20120058254
    Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
    Type: Application
    Filed: November 14, 2011
    Publication date: March 8, 2012
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Teruyuki Hotta, Takahiro Ishizaki, Tomohiro Kawase, Masaharu Takeuchi
  • Patent number: 8057587
    Abstract: A method of coloring solder is provided. The method includes providing an aqueous coloring agent solution essentially containing 31-32% wt of copper sulfate, 64-65% wt of water and 3-4% wt of salt and an anti-caking agent, drying a solder seam with a dry cloth to remove excess flux, applying the aqueous coloring agent solution directly onto the solder seam; and wiping away excess amounts of the aqueous coloring agent solution with a second dry cloth.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: November 15, 2011
    Inventors: Michael Beeck, Lance Getic
  • Patent number: 8048284
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: November 1, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8012334
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: September 6, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 7988773
    Abstract: An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, an aldehyde compound, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: August 2, 2011
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Masayuki Kiso, Yoshikazu Saijo, Tohru Kamitamari
  • Patent number: 7985285
    Abstract: An electroless gold plating bath includes a water-soluble gold compound, a complexing agent, a formaldehyde metabisulfite adduct, and an amine compound represented by R1—NH—C2H4—NH—R2 or (CH2—NH—C2H4—NH—CH2)n—R4 (wherein R1 to R4 represent —OH, —CH3, —CH2OH, —C2H4OH, —CH2N(CH3)2, —CH2NH(CH2OH), —CH2NH(C2H4OH), —C2H4NH(CH2OH), —C2H4NH(C2H4OH), —CH2N(CH2OH)2, —CH2N(C2H4OH)2, —C2H4N(CH2OH)2 or —C2H4N(C2H4OH)2, and n is an integer of 1 to 4). A gold plated coating of a good appearance can be formed without causing a failure in appearance owing to the progress of intergranular corrosion in a nickel surface.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: July 26, 2011
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Masayuki Kiso, Yukinori Oda, Seigo Kurosaka, Tohru Kamitamari, Yoshikazu Saijo, Katsuhisa Tanabe
  • Patent number: 7973188
    Abstract: This invention relates to processes for the production of organometallic compounds represented by the formula M(L)3 wherein M is a Group VIII metal, e.g., ruthenium, and L is the same or different and represents a substituted or unsubstituted amidinato group or a substituted or unsubstituted amidinato-like group, which process comprises (i) reacting a substituted or unsubstituted metal source compound, e.g., ruthenium (II) compound, with a substituted or unsubstituted amidinate or amidinate-like compound in the presence of a solvent and under reaction conditions sufficient to produce a reaction mixture comprising said organometallic compound, e.g., ruthenium (III) compound, and (ii) separating said organometallic compound from said reaction mixture. The organometallic compounds are useful in semiconductor applications as chemical vapor or atomic layer deposition precursors for film depositions.
    Type: Grant
    Filed: September 8, 2010
    Date of Patent: July 5, 2011
    Assignee: Praxair Technology, Inc.
    Inventor: David Michael Thompson
  • Publication number: 20110151117
    Abstract: There is provided organic metal complexes for forming a metal thin layer, ink including the same, and a method for forming a metal thin layer using the same: wherein the organic metal complexes for forming a metal thin layer include Ag, and a ligand represented by the specific general formula; the organic metal complexes have an excellent stability and solubility toward a solvent; and the ink for forming a metal thin layer comprising the organic metal complexes is easy to form a metal thin layer of, and could be applied on the substrate consisting of material having low thermal stability because the ink can be decomposed at a low temperature.
    Type: Application
    Filed: July 14, 2010
    Publication date: June 23, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Kwan Seo, Dong Hoon Kim, Kwi Jong Lee