Group Ib (cu, Au) Metal Patents (Class 106/1.26)
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Patent number: 7964746Abstract: Copper precursors useful for depositing copper or copper-containing films on substrates, e.g., microelectronic device substrates or other surfaces. The precursors includes copper compounds of various classes, including copper borohydrides, copper compounds with cyclopentadienyl-type ligands, copper compounds with cyclopentadienyl-type and isocyanide ligands, and stabilized copper hydrides. The precursors can be utilized in solid or liquid forms that are volatilized to form precursor vapor for contacting with the substrate, to form deposited copper by techniques such as chemical vapor deposition (CVD), atomic layer deposition (ALD) or rapid vapor deposition (digital CVD).Type: GrantFiled: March 30, 2008Date of Patent: June 21, 2011Assignee: Advanced Technology Materials, Inc.Inventors: Tianniu Chen, Chongying Xu, Thomas H. Baum, Bryan C. Hendrix, Jeffrey F. Roeder, Juan E. Dominguez, Adrien R. Lavoie, Harsono S. Simka
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Patent number: 7887693Abstract: An aqueous acidic copper electroplating composition containing an improved additive system for use at elevated temperatures. The improved additive system comprises (a) a suppressor comprising at least one high molecular weight polymer; (b) a brightener comprising at least one divalent sulfur compound; and (c) a leveler comprising a heterocyclic nitrogen compound. The improved electroplating composition is usable for plating through holes in printed circuit boards.Type: GrantFiled: June 22, 2007Date of Patent: February 15, 2011Inventors: Maria Nikolova, Gary B. Larson
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Publication number: 20100285664Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.Type: ApplicationFiled: July 21, 2010Publication date: November 11, 2010Applicant: Lam Research CorporationInventor: Mark Ian Wagner
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Patent number: 7767009Abstract: The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.Type: GrantFiled: September 14, 2005Date of Patent: August 3, 2010Assignee: OMG Electronic Chemicals, Inc.Inventor: Roger F. Bernards
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Patent number: 7744685Abstract: This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals.Type: GrantFiled: September 23, 2008Date of Patent: June 29, 2010Assignee: Surface Technology, Inc.Inventors: Thomas Steven Lancsek, Michael David Feldstein
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Patent number: 7691189Abstract: The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.Type: GrantFiled: April 17, 2007Date of Patent: April 6, 2010Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Tohru Nakai, Takeo Oki, Naohiro Hirose, Kouta Noda
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Patent number: 7686875Abstract: A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.Type: GrantFiled: December 18, 2008Date of Patent: March 30, 2010Assignee: Lam Research CorporationInventors: Eugenijus Norkus, Jane Jaciauskiene, Yezdi Dordi
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Patent number: 7611569Abstract: Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.Type: GrantFiled: July 6, 2007Date of Patent: November 3, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
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Publication number: 20090209693Abstract: It is an object to provide a novel material that can quickly form metal silver even at a low temperature of approximately 210° C. or less. This serves as a metal silver forming material that includes a silver ?-ketocarboxylate. By heating this forming material, it is possible to form metal silver quickly even at a low temperature of approximately 210° C. or less. Examples of the silver ?-ketocarboxylate include silver isobutyrylacetate, silver benzoylacetate, silver acetoacetate, silver propionylacetate, silver ?-methylacetoacetate, and silver ?-ethylacetoacetate.Type: ApplicationFiled: June 22, 2006Publication date: August 20, 2009Applicants: OSAKA INDUSTRIAL PROMOTION, OSAKA UNIVERSITYInventors: Katsuaki Suganuma, Shunro Yamaguchi, Mariko Hatamura
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Publication number: 20090162550Abstract: Copper (I) amidinate and copper (I) guanidinate precursors for forming copper thin films in the manufacture of microelectronic device articles, e.g., using chemical vapor deposition, atomic layer deposition, and rapid vapor deposition processes, as well as mixed ligand copper complexes suitable for such processes. Also described are solvent/additive compositions for copper precursors for CVD/ALD of copper metal films, which are highly advantageous for liquid delivery of such copper amidinates and copper guanidinates, as well as for other organocopper precursor compounds and complexes, e.g., copper isoureate complexes.Type: ApplicationFiled: December 29, 2006Publication date: June 25, 2009Applicant: ADVANCED TECHNOLOGY MATERIALS, INC.Inventors: Tianniu Chen, Chongying Xu, Thomas H. Baum, Bryan C. Hendrix, Thomas M. Cameron, Jeffrey F. Roeder, Matthias Stender
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Patent number: 7534289Abstract: An electroless gold plating solution that can form a gold plating film with excellent adhesion and that does not cause corrosion of a base metal film such as nickel, copper, cobalt, or palladium, or the like.Type: GrantFiled: July 2, 2008Date of Patent: May 19, 2009Assignee: Rohm and Haas Electronic Materials LLCInventor: Koichi Yomogida
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Patent number: 7531031Abstract: Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using chemical vapor deposition or atomic layer deposition processes.Type: GrantFiled: May 12, 2008Date of Patent: May 12, 2009Assignee: Advanced Technology Materials, Inc.Inventors: Chongying Xu, Alexander S. Borovik, Thomas H. Baum
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Patent number: 7527681Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.Type: GrantFiled: July 6, 2007Date of Patent: May 5, 2009Assignee: Rohm and Haas Electronic Materials LLPInventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
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Patent number: 7517555Abstract: A copper plating solution according to the present invention is characterized by that it comprising 0.03 mol/L to 0.5 mol/L of copper sulfate, 0.05 mol/L to 0.7 mol/L of ethylenediaminetetraacetic acid and 0.02 mol/L to 0.3 mol/L of sulfite, and has a pH adjusted to 5.0 to 8.5. A method for copper plating according to the present invention is characterized by that it comprises using the copper plating solution above. The copper plating solution and the method for copper plating according to the present invention stably provide a uniform copper plating film excellent in adhesion on the surface of an article to be plated, such as rare earth metal-based permanent magnet.Type: GrantFiled: April 26, 2002Date of Patent: April 14, 2009Assignee: Hitachi Metals, Ltd.Inventors: Fumiaki Kikui, Kaoru Kojima, Yoriyoshi Oooka, Kohshi Yoshimura
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Patent number: 7510639Abstract: Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.Type: GrantFiled: July 16, 2005Date of Patent: March 31, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: Deyan Wang, Robert D. Mikkola, Chunyi Wu, George G. Barclay
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Patent number: 7501014Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.Type: GrantFiled: July 6, 2007Date of Patent: March 10, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
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Publication number: 20090007814Abstract: This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially free of toxic and/or heavy metals.Type: ApplicationFiled: September 23, 2008Publication date: January 8, 2009Inventors: Thomas Steven Lancsek, Michael David Feldstein
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Patent number: 7473307Abstract: Disclosed herein is an electroless copper plating solution, including a copper salt, a completing agent, a reductant and a pH adjuster, in which the plating solution includes a 2,2-dipyridyl acid solution and the hydrogen ion concentration (pH) thereof is about 11.5 to about 13.0, a method of producing the same, and an electroless copper plating method. According to the plating solution of the present invention, an electroless copper plating film having stable and improved adhesivity and low electrical resistance can be obtained. Further, display devices including a metal pattern formed with the electroless copper plating solution can improve the reliability and price competitiveness of products prepared therefrom.Type: GrantFiled: August 3, 2007Date of Patent: January 6, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Ki Yong Song, Sung Hen Cho
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Patent number: 7465385Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.Type: GrantFiled: June 2, 2006Date of Patent: December 16, 2008Assignee: Rohm and Haas Electronic Materials LLCInventors: André Egli, Wing Kwong Wong, Raymund W. M. Kwok, Jochen Heber
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Publication number: 20080242880Abstract: Copper precursors useful for depositing copper or copper-containing films on substrates, e.g., microelectronic device substrates or other surfaces. The precursors includes copper compounds of various classes, including copper borohydrides, copper compounds with cyclopentadienyl-type ligands, copper compounds with cyclopentadienyl-type and isocyanide ligands, and stabilized copper hydrides. The precursors can be utilized in solid or liquid forms that are volatilized to form precursor vapor for contacting with the substrate, to form deposited copper by techniques such as chemical vapor deposition (CVD), atomic layer deposition (ALD) or rapid vapor deposition (digital CVD).Type: ApplicationFiled: March 30, 2008Publication date: October 2, 2008Inventors: Tianniu Chen, Chongying Xu, Thomas H. Baum, Bryan C. Hendrix, Jeffrey F. Roeder, Juan E. Dominguez, Adrien R. Lavoie, Harsono S. Simka
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Patent number: 7419536Abstract: There is provided a cyanide-free immersion type electroless gold plating liquid that is low in toxicity, can be used near a neutral ph, and has a good solder adhesion and plating film adhesion. The electroless gold plating liquid contains a cyanide-free water-soluble gold compound and a pyrosulfurous acid compound. The plating liquid may further contain a sulfurous acid compound and an aminocarboxylic acid compound. Pyrosulfurous acid or an alkali metal, alkaline earth metal, ammonium, or another such salt thereof can be used as the pyrosulfurous acid compound.Type: GrantFiled: February 18, 2004Date of Patent: September 2, 2008Assignee: Nikko Materials Co., Ltd.Inventors: Akihiro Aiba, Yoshiyuki Hisumi, Kazumi Kawamura
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Publication number: 20080178761Abstract: An objective is to provide plate making printing exhibit conductivity and flexibility with respect to a flexible substrate, and to provide a method of forming metal patterns via non-plate making printing, and a metal salt mixture usable for the method. Also disclosed is a method of forming a metal pattern possessing the steps of conducting patterning on a substrate with a metal salt mixture for the metal pattern formation possessing a metal salt and a reducing agent, and having a viscosity of 3-50 mPa·s at 25 ° C., and forming the metal pattern via heating to a temperature of 80-400° C.Type: ApplicationFiled: January 22, 2008Publication date: July 31, 2008Applicant: KONICA MINOLTA HOLDINGS, INC.Inventors: Atsushi TOMOTAKE, Hirotaka IIJIMA
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Patent number: 7402232Abstract: A silver electroplating solution containing a cyanide as a silver source, said silver electroplating solution characterized by containing at least one type of compound of As, Tl, Se, and Te as a brightener and a brightness adjuster having a benzothiazole skeleton or benzoxazole skeleton. This plating solution utilizes the high speed property of gloss agents to the maximum, does not have an effect on the current density, gives stable non- or semi-gloss plating appearance, and facilitates control.Type: GrantFiled: October 30, 2003Date of Patent: July 22, 2008Assignee: Shinko Electric Industries, Co., Ltd.Inventors: Yoko Ogihara, Shinichi Wakabayashi, Masao Nakazawa
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Patent number: 7396394Abstract: The invention provides a displacement electroless gold plating solution that is low in toxicity, can be used at a pH near to neutrality, and affords good solder adhesion and film adhesion. The displacement electroless gold plating solution contains a non-cyanide water-soluble gold compound and a hydrogensulfite compound. Preferably, the plating solution further contains a thiosulfuric acid compound or an aminocarboxylic acid compound. Sodium hydrogensulfite, potassium hydrogensulfite, ammonium hydrogensulfite or the like can be used as the hydrogensulfite compound.Type: GrantFiled: August 22, 2005Date of Patent: July 8, 2008Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Akihiro Aiba, Kazumi Kawamura, Hirofumi Takahashi
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Patent number: 7390354Abstract: A cyanide-free immersion type electroless gold plating solution that is less toxic can be used at near neutrality and gives an excellent and improved solder adhesion and plated film adhesion is provided. The electroless gold plating solution contains a cyanide-free water-soluble gold compound, a pyrosulfurous acid compound and a thiosulfuric acid compound. This plating solution preferably further contains a sulfurous acid compound and an aminocarboxylic acid compound. Pyrosulfurous acid and alkali metal salts, alkaline-earth metal salts, ammonium salts and other salts thereof can be used as the pyrosulfurous acid compound.Type: GrantFiled: June 23, 2005Date of Patent: June 24, 2008Assignee: Nikko Materials Co., Ltd.Inventors: Akihiro Aiba, Kazumi Kawamura
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Patent number: 7384458Abstract: The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is added, as a complexing agent for gold stabilization, to the electroless gold plating solution.Type: GrantFiled: March 14, 2007Date of Patent: June 10, 2008Assignee: Shinko Electric Industries Co., Ltd.Inventor: Masaki Sanada
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Patent number: 7371880Abstract: Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using chemical vapor deposition or atomic layer deposition processes.Type: GrantFiled: January 23, 2007Date of Patent: May 13, 2008Assignee: Advanced Technology Materials, Inc.Inventors: Chongying Xu, Alexander Borovik, Thomas H. Baum
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Publication number: 20080087549Abstract: An additive for copper plating comprising, as an effective ingredient, a nitrogen-containing biphenyl derivative represented by the following formula (I): [wherein X represents a group selected from the following groups (II)-(VII): and Y represents a lower alkyl group, lower alkoxy group, nitro group, amino group, sulfonyl group, cyano group, carbonyl group, 1-pyridyl group, or the formula (VIII): (wherein R? represents a lower alkyl group)], a copper plating solution formed by adding the additive for copper plating to a copper plating solution containing a copper ion ingredient and an anion ingredient, and a method of manufacturing on an electronic circuit substrate having a fine copper wiring circuit, which comprises electroplating in the copper plating solution using as the cathode an electronic circuit substrate in which fine microholes or microgrooves in the shape of an electronic circuit are formed on the surface.Type: ApplicationFiled: August 18, 2004Publication date: April 17, 2008Applicant: EBARA-UDYLITE CO.,LTD.Inventors: Hiroshi Ishizuka, Nobuo Sakagawa, Ryoichi Kimizuka, Wei-ping Dow
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Patent number: 7323581Abstract: A metalorganic complex composition comprising a metalorganic complex selected from the group consisting of: metalorganic complexes comprising one or more metal central atoms coordinated to one or more monodentate or multidentate organic ligands, and complexed with one or more complexing monodentate or multidentate ligands containing one or more atoms independently selected from the group consisting of atoms of the elements C, N, H, S, O and F; wherein when the number of metal atoms is one and concurrently the number of complexing monodentate or multidentate ligands is one, then the complexing monodentate or multidentate ligand of the metalorganic complex is selected from the group consisting of beta-ketoiminates, beta-diiminates, C2-C10 alkenyl, C2-C15 cycloalkenyl and C6-C10 aryl.Type: GrantFiled: August 28, 2000Date of Patent: January 29, 2008Assignee: Advanced Technology Materials, Inc.Inventors: Robin A. Gardiner, Thomas H. Baum, Connie L. Gordon, legal representative, Timothy E. Glassman, Sophia Pombrik, Brian A. Vaastra, Peter S. Kirlin, Douglas Cameron Gordon, deceased
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Patent number: 7306662Abstract: An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.Type: GrantFiled: May 11, 2006Date of Patent: December 11, 2007Assignee: Lam Research CorporationInventors: Algirdas Vaskelis, Eugenijus Norkus, Jane Jaciauskiene, Aldona Jagminiene
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Patent number: 7300501Abstract: The object is to provide an electroless gold plating liquid which has an adequate deposition speed for practical use without containing any thallium or other heavy metal ions, excellent stability of the plating liquid and contains a non-cyanide gold salt as a gold salt, an alkali metal salt or an ammonium salt of sulfurous acid and thiosulfuric acid as a metal complexing agent, a hydroxyalkylsulfonic acid or a salt thereof represented by the following general formula as a reducing agent, and an amine compound, wherein R represents hydrogen, a carboxyl group, or any of a phenyl group, a tolyl group, a naphthyl group, a saturated or unsaturated alkyl group, an acetyl group, an acetonyl group, a pyridyl group and a furyl group which may have a substitutional group, X represents any of hydrogen, Na, K, and NH4, and n is an integer between 0 and 4.Type: GrantFiled: March 29, 2005Date of Patent: November 27, 2007Assignee: Nikko Materials Co., Ltd.Inventors: Eiji Hino, Masashi Kumagai
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Patent number: 7297190Abstract: An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical brightener component, a halide component, and a pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.Type: GrantFiled: June 28, 2006Date of Patent: November 20, 2007Assignee: Lam Research CorporationInventors: Yezdi Dordi, William Thie, Algirdas Vaskelis, Eugenijus Norkus, Jane Jaciauskiene, Aldona Jagminiene
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Patent number: 7282088Abstract: The invention relates to an aqueous concentrate which is stable with respect to freezing and defrosting and which contains at least one water-soluble or water-dispersible copper compound and, optionally, also a water-soluble or water-dispersible tin compound for use in a diluted state as a bath for the currentless copper plating or bronze plating of objects, especially metal objects such as iron or steel wires, characterized in that it contains at least one complexed water-soluble or water-dispersed copper compound. The invention also relates to an aqueous bath which contains at least one aqueous or water-dispersible copper compound and, optionally, a water-soluble or water-dispersible tin compound for the currentless copper plating of objects in addition to at least one brightening agent and which has an adjusted pH value of less than 2.5. The invention also relates to a method for currentless copper plating or bronze plating of an object, especially a metallic object.Type: GrantFiled: April 2, 2003Date of Patent: October 16, 2007Assignee: Chemetall GmbHInventors: Klaus-Dieter Nittel, Ralf Schneider
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Publication number: 20070218212Abstract: The non-cyanide electroless gold plating solution according to the invention is a non-cyanide electroless gold plating solution free from a cyanide compound, wherein bis-(3-sulfopropyl)disulfide is added, as a complexing agent for gold stabilization, to the electroless gold plating solution.Type: ApplicationFiled: March 14, 2007Publication date: September 20, 2007Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Masaki Sanada
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Patent number: 7264848Abstract: The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—SH wherein n is 2 or 3 and X is SO3H or NH2, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.Type: GrantFiled: September 14, 2005Date of Patent: September 4, 2007Assignee: Shinko Electric Industries Co., Ltd.Inventors: Masaki Sanada, Masao Nakazawa, Kei Imafuji
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Publication number: 20070175359Abstract: Electroless gold plating compositions that include an adhesion enhancer compound and a reduction accelerator are provided to obtain direct electroless gold plating over a gold, nickel or nickel alloy deposit. A method of electroless gold plating on a nickel-containing substrate is also disclosed.Type: ApplicationFiled: December 5, 2006Publication date: August 2, 2007Inventor: Kilnam Hwang
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Patent number: 7241912Abstract: Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using chemical vapor deposition or atomic layer deposition processes.Type: GrantFiled: June 9, 2005Date of Patent: July 10, 2007Assignee: Advanced Technology Materials, Inc.Inventors: Chongying Xu, Alexander Borovik, Thomas H. Baum
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Patent number: 7220296Abstract: An electroless plating bath for filling high aspect ratio features with copper metal comprises water, a water soluble copper containing compound having an initial concentration of 0.5 to 50 g/L, a catalyst reducing agent having an initial concentration of 0.02 to 1.5 g/L, a bulk reducing agent having an initial concentration of 2.37 to 29.7 g/L, a buffering agent having an initial concentration of 25 to 100 g/L, a grain refining additive having an initial concentration of 0.25 to 5.0 g/L, a bath stabilizing agent having an initial concentration of 0.02 to 0.1 g/L, and a rate controlling additive having an initial concentration of 0.01 to 0.5 g/L. The catalyst reducing agent may comprise glyoxylic acid and the bulk reducing agent may comprise glycolic acid or hypophosphite.Type: GrantFiled: December 15, 2005Date of Patent: May 22, 2007Assignee: Intel CorporationInventors: Shaestagir Chowdhury, Matthew R. Bauer, Jeff Grunes, Soley Ozer
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Patent number: 7220347Abstract: An electrolytic copper plating bath used for via-filling plating of blind via-holes formed on a substrate, containing a water-soluble copper salt, sulfuric acid, chloride ions, and a leveler as an additive, wherein the leveler is either one or both of a quaternary polyvinylimidazolium compound represented by the following formula (1) and a copolymer, represented by the following formula (2), of vinylpyrrolidone and a quaternary vinylimidazolium compound: where R1 and R2 are each an alkyl group, m is an integer of not less than 2, and p and q are each an integer of not less than 1, and a copper electroplating method for via-filling plating of blind via-holes formed on a substrate by use of the electrolytic copper plating bath.Type: GrantFiled: July 15, 2005Date of Patent: May 22, 2007Assignee: C. Uyemura & Co., Ltd.Inventors: Toshihisa Isono, Shinji Tachibana, Tomohiro Kawase, Naoyuki Omura
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Patent number: 7169215Abstract: Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes; a soluble source of copper ions, a soluble source of molybdenum ions, and a reducing agent comprising boron, wherein the composition is adapted to electrolessly produce a copper molybdenum deposit.Type: GrantFiled: January 2, 2004Date of Patent: January 30, 2007Assignee: Ramot At Tel Aviv University Ltd.Inventors: Yossi Shacham-Diamand, Yelena Sverdlov
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Patent number: 7169216Abstract: An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.Type: GrantFiled: July 26, 2004Date of Patent: January 30, 2007Assignee: Hitachi, Ltd.Inventors: Takeyuki Itabashi, Hiroshi Kanemoto, Haruo Akahoshi, Eiji Takai, Naoki Nishimura, Tadashi Iida, Yoshinori Ueda
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Patent number: 7166732Abstract: Copper (I) amidinate precursors for forming copper thin films in the manufacture of semiconductor devices, and a method of depositing the copper (I) amidinate precursors on substrates using chemical vapor deposition or atomic layer deposition processes.Type: GrantFiled: June 16, 2004Date of Patent: January 23, 2007Assignee: Advanced Technology Materials, Inc.Inventors: Chongying Xu, Alexander Borovik, Thomas H. Baum
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Patent number: 7150781Abstract: The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5–2 to 0.1–5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.Type: GrantFiled: May 20, 2003Date of Patent: December 19, 2006Assignee: Nihon New Chrome Co., Ltd.Inventors: Kazuya Urata, Kunio Tachibana, Naoyuki Oniwa, Mikiya Tajima, Yukio Ogawa
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Patent number: 7147767Abstract: The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions.Type: GrantFiled: December 16, 2002Date of Patent: December 12, 2006Assignee: 3M Innovative Properties CompanyInventors: Steven D. Boyd, Susrut Kesari, William M. Lamanna, Michael J. Parent, Lawrence A. Zazzera, Haiyan Zhang
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Patent number: 7144491Abstract: It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode drum, and more particularly to obtain an electrolytic copper foil which allows fine patterning, and which is superior in terms of elongation and tensile strength at ordinary temperatures and high temperatures. Furthermore, it is an object of the present invention to obtain a copper electrolytic solution for this purpose. This copper electrolytic solution contains as additives an organo-sulfur compound and a quaternary amine compound with a specific skeleton.Type: GrantFiled: August 20, 2003Date of Patent: December 5, 2006Assignee: Nikko Materials Co., Ltd.Inventors: Masashi Kumagai, Mikio Hanafusa
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Patent number: 7128822Abstract: Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and methods are useful for providing a planarized layer of copper on a substrate having small apertures. The compositions and methods provide complete fill of small apertures with reduced void formation.Type: GrantFiled: June 4, 2003Date of Patent: October 31, 2006Assignee: Shipley Company, L.L.C.Inventors: Deyan Wang, Chunyi Wu, Robert D. Mikkola
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Patent number: 7122108Abstract: A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate.Type: GrantFiled: April 11, 2003Date of Patent: October 17, 2006Assignee: Shipley Company, L.L.C.Inventors: Jochen Heber, André Egli
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Patent number: 7105082Abstract: A composition for electrodeposition of a metal on a work piece, which electrodeposition is conducted at an electrodeposition temperature, is provided. The composition comprises a metal salt, a polymer suppressor having a cloud point, an accelerator and an electrolyte. If the cloud point is greater than the electrodeposition temperature, an anion is also present in an amount sufficient to lower the cloud point of the polymer suppressor to a temperature approximately no greater than the electrodeposition temperature.Type: GrantFiled: February 27, 2003Date of Patent: September 12, 2006Assignee: Novellus Systems, Inc.Inventor: Vishwas Hardikar
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Patent number: 7084288Abstract: The object of this invention is to provide an organometallic precursor for forming a metal film or pattern and a method of forming the metal film or pattern using the same. More particularly, the present invention provides an organometallic precursor containing a hydrazine-based compound coordinated with a central metal thereof, and a method of forming a metal film or pattern using the same. Further, the present invention provides a composition containing an organometallic compound and a hydrazine-based compound, and a method of forming a metal film or pattern using the same. Additionally, the present invention is advantageous in that a pure metal film or pattern is formed using the organometallic precursor or composition through a simple procedure without limiting atmospheric conditions at a low temperature, and the film or pattern thus formed has excellent conductivity and morphology. Therefore, the film is useful in an electronic device field including flexible displays and large-sized TFT-LCD.Type: GrantFiled: October 2, 2003Date of Patent: August 1, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Hae Jung Son, Euk Che Hwang, Sang Yoon Lee, Soon Taik Hwang, Byong Ki Yun
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Patent number: 7074315Abstract: In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to deposit matt layers of copper and has the additional advantageous property that the layers may also be deposited with sufficient coating thickness in very narrow bore holes at average cathode current density. For this purpose the bath contains at least one polyglycerin compound selected from the group comprising poly(1,2,3-propantriol), poly(2,3-epoxy-1-propanol) and derivatives thereof.Type: GrantFiled: October 10, 2001Date of Patent: July 11, 2006Assignee: Atotech Deutschland GmbHInventors: Gonzalo Urrutia Desmaison, Stefan Kretschmer, Gerd Senge, Thorsten Ross, Torsten Küssner