Abstract: Machine for the surface processing of products (L) under controlled pressure conditions different than the ambient pressure, comprising • at least one sealed chamber (12, 13), provided with at least one opening (15, 16), that can be closed, for inserting and removing a plurality of products (L) to be processed, • a device (30) for adjusting the pressure inside said at least one chamber (12, 13), • in said at least one chamber (12, 13), a moving device (20) for vertically moving said products (L), so as to accumulate at least two said products on levels arranged over one another, • a horizontal moving device (19) for moving said products (L) from and towards said at least one opening (15, 16) when the products (L) are arranged at the same level of said at least one opening (15, 16) wherein, from an operational viewpoint, a plurality of said products (L) are inserted into said at least one chamber (12, 13), and at least two products of said plurality of products (L) are over one another for a span of processing

Abstract: An apparatus for cleaning semiconductor substrates including a chamber, a chuck, a liquid collector, an enclosing wall, at least one driving mechanism, at least one internal dispenser, and at least one external dispenser. The chamber has a top wall, a side wall and a bottom wall. The chuck is disposed in the chamber. The liquid collector surrounds the chuck. The enclosing wall surrounds the liquid collector. The driving mechanism drives the enclosing wall to move up and down, wherein when the enclosing wall is driven to move up, a seal room is formed by the liquid collector, the enclosing wall, the top wall and bottom wall of the chamber. The internal dispenser is disposed inside the seal room. The external dispenser is disposed outside the seal room and capable of getting in and out of the seal room after the enclosing wall is driven to move down.

Abstract: A substrate coating apparatus comprises a source of a washcoat, a washcoat showerhead comprising a showerhead plate having a plurality of nozzle apertures for discharging the washcoat towards a face of the substrate located below the washcoat showerhead, a conduit fluidly connecting the source of the washcoat to the washcoat showerhead for supplying washcoat to the washcoat showerhead and a partition ring located between the washcoat showerhead and the face of the substrate. The partition ring is dimensioned to be smaller than the face of the substrate and the substrate coating apparatus is configured in use to bring the partition ring into contact with the face of the substrate to thereby define a central region of the face of the substrate which lies within an interior of the partition ring and a peripheral region of the face of the substrate which lies outside the partition ring.

Abstract: A device for depositing a layer on a substrate, while a mask is placed on the substrate, includes an adjustment device for adjusting the position of a mask carrier with respect to a support frame. The adjustment device has, on the support frame, an adjustment lever that is mounted to rotate about an axis of rotation of a pivot bearing and that has a first and second arm. The second arm acts on the mask carrier, and a control rod that can be vertically displaced by an actuator acts on the first arm. For a vertical adjustment device, the second arm and the first arm extend in a horizontal direction, in which the second arm acts on a push rod that is connected to the mask carrier. For a horizontal adjustment device, the second arm extends in a vertical direction and the first arm extends in a horizontal direction.

Abstract: Disclosed is a substrate processing apparatus and the method of processing an exhaust gas. The substrate processing apparatus and the method of processing an exhaust gas according to the present invention, an exhaust gas decomposition module may decompose a source gas exhausted from a process chamber to decompose a ligand of the source gas. Also, the ligand and the source gas of which the ligand has been decomposed may be put in a stabilized state by reacting with separately supplied O2, N2O, or O3, and then, may be changed to a mixed gas including a reactant gas mixed therewith. Subsequently, the mixed gas may flow into the exhaust pump and may be emitted. Alternatively, the ligand and the source gas may be mixed with the reactant gas and may be emitted.

Abstract: A chemical vapor deposition system for coating one or more workpieces is described herein. The deposition system includes a plurality of processing chambers which may be operated independently to increase throughput of the deposition system. Each chamber includes a modular fixture that is configured to maintain the workpieces in a predetermined arrangement which allows for a hollow cathode effect to be maintained in an Interior space of the chamber. The deposition system achieves significantly faster, higher-quality deposition and more complete, conformal coverage.

Abstract: Rapid plasma nitriding is achieved by harnessing the power and increased density of plasma discharges created by hollow cathodes. When opposing surfaces are maintained at the proper voltage, sub atmospheric pressure, and spacing, a phenomenon known as the hollow cathode effect creates additional hot oscillating electrons capable of multiple ionization events thereby increasing the number of ions and electrons per unit volume (plasma density). The present invention describes the harnessing of this phenomenon to rapidly plasma nitride metal surfaces and optionally rapidly deposit functional coatings in a continuous operation for duplex coatings.

Abstract: Apparatus for use in preparing heterostructures having a reduced concentration of defects including apparatus for stressing semiconductor substrates to allow them to conform to a crystal having a different crystal lattice constant.

Abstract: A source gas supply apparatus that supplies a source gas into a processing container, includes: a raw material container configured to contain a raw material, and to vaporize the raw material; a source gas supply flow path configured to supply the source gas including the vaporized raw material into the processing container; a flow rate measurement part installed in the source gas supply flow path, and configured to measure a flow rate of the source gas; a diluent gas supply flow path joining a downstream side of the flow rate measurement part in the source gas supply flow path, and configured to supply a diluent gas for diluting the source gas; and a gas mixer provided at a merging portion of the source gas supply flow path and the diluent gas supply flow path, and configured to mix the source gas with the diluent gas via a Venturi effect.

Abstract: A display panel vacuum suction system includes a control device, a robot arm, and a vacuum device. The robot arm includes two or more retractable rods, and each of the retractable rods is connected with a vacuum plate. Each vacuum chamber is disposed in each of the vacuum plates, and each vacuum hole is disposed on a surface of each of the vacuum plates, wherein each vacuum chamber is connected with the vacuum device by a suction pipe. The control device controls expansion and retraction of the retractable rods of the robot arm, so that the vacuum plates connected with the retractable rods can be combined to pick up a single display panel or pick up two display panels respectively. By combining vacuum plates, and controlling the opening or closing of the vacuum holes of each of the vacuum plates, different sizes of display panels can be sucked.

Abstract: The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion.

Abstract: The present invention is directed to an apparatus and a respective process, which can be used in the production of exhaust catalysts. In particular, the present apparatus is used in a process to supply the liquid coating slurry to substrates, like honeycomb monoliths.

Abstract: Disclosed are a substrate treating apparatus and a substrate transporting method. A first ID block takes a substrate from a carrier placed on a carrier platform and sends the taken substrate to one of six treatment layers. Moreover, a second ID block returns the substrate, sent from the treatment layer, for example, to a carrier placed on a platform. This allows the first ID block to transport many substrates to the six treatment layers arranged in an upward/downward direction more rapidly. Moreover, this simultaneously allows the second ID block to transport many substrates, having been sent from the six treatment layers arranged in the upward/downward direction, to the carrier more rapidly. As a result, a throughput of a substrate treating apparatus can be enhanced.

Abstract: Methods of machining a body to produce a chip wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body.

Abstract: A process for the formation of an assembly comprising a structured or compacted porous film (c) comprising a) application of a porous film (d) onto an elastic substrate (a) in a stretched state such that a reversible adhesion of the film on the stretched substrate (a) occurs, and b) relaxing the substrate (a) with the applied film thereon to obtain a structured or compacted porous film (c), c) applying a support material (e) to a part of the structured or compacted film (c) so that the structured or compacted film to which no support material (e) is attached is releasable.

Abstract: An atmospheric pressure plasma device is disclosed. The atmospheric pressure plasma device includes a conductive tube connected to a power device, an electrode formed as a plate and receiving power supplied from the conductive tube and a dielectric configured to control discharge instability by being formed to surround a side surface of the electrode.

Abstract: Disclosed is a method and a corresponding apparatus for coating open-pored bodies with at least one coating suspension, the coating suspension having solids and solutes in a liquid medium in a quantity in wet state which is to correspond to at least a required target quantity, and the coating operation having a variation in the applied wet coating quantity from one body to the other. The method includes steps of: coating the body with an actual quantity of the coating suspension, which is always larger than the required target quantity taking the variation of the coating operation into account, determining the difference between the actual quantity and the required target quantity, and reducing the difference between actual quantity and target quantity by removing still wet coating suspension.

Abstract: An illustrative embodiment of the present disclosure provides a method of manufacturing a composite structure. A composite material having a closed cross-section or a partially closed cross-section is cured to form the composite structure, wherein the composite material is in contact with a foam mandrel assembly when curing begins. A supportive foam mandrel in the foam mandrel assembly is collapsed during curing.

Abstract: An assembly of a chamber lid and a ceiling is used in a film deposition apparatus for semiconductor processes. The assembly comprises a chamber lid, a ceiling and a retaining mechanism. The chamber lid comprises a recession capable of containing the retaining mechanism. The ceiling comprises a plate and a support ring protruding from the middle of the plate. The retaining mechanism comprises a pair of arms, a pair of connecting members respectively connected to the arms, a pair of linkages respectively forcing the connecting members to move along different directions and a driver driving the linkages to move relative to each other. When the connecting members move toward and get close to each other along different directions, the arms accordingly retain the support ring.

Abstract: An apparatus for vapor deposition of thin film coatings, including: a process controller; a plurality of precursor containers into which a plurality of coating precursors, each in the form of a liquid or a solid, are respectively placed; a plurality of precursor vapor reservoirs, each in communication with a respective one of said precursor containers; a plurality of in-line devices which control a vapor flow of a coating precursor vapor from one of said precursor containers into one of said precursor vapor reservoirs with which said precursor container is in communication upon receipt of a signal from said process controller; a plurality of precursor control valves which control vapor flow from said precursor vapor reservoir upon receipt of a signal from said process controller; and a process chamber for vapor deposition of said coating on a substrate when present in said process chamber.

Abstract: Methods and systems for imprint lithography are described. In an embodiment, a method may include receiving a substrate in an imprint lithography chamber. Such a method may also include applying a deformable layer to a surface of the substrate. The method may further include injecting a gas that dissolves into the deformable layer more quickly than air into the chamber. Additionally, the method may include pressing a mold into the deformable layer. The method may also include controlling one or more processing parameters in order to achieve device formation objectives.

Abstract: The present disclosure provides an impregnation method that includes the steps of providing a workpiece to be impregnated, placing the workpiece in a bath of impregnating agent inside a vessel, and oscillating movement of a vibrating body inside the vessel during an impregnation period. The vibrating body creates oscillating pressure changes inside the bath by acting on the bath. the method further includes removing the workpiece from the bath after the impregnation period.

Abstract: Disclosed are a standby port and a substrate processing apparatus having the same. The standby port exhausts fumes generated when a processing liquid is discharged into the standby port before the supply of the processing liquid onto a substrate, thereby preventing pollution of a chamber atmosphere.

Abstract: Disclosed is a substrate processing apparatus and the method of processing an exhaust gas. The substrate processing apparatus and the method of processing an exhaust gas according to the present invention, an exhaust gas decomposition module may decompose a source gas exhausted from a process chamber to decompose a ligand of the source gas. Also, the ligand and the source gas of which the ligand has been decomposed may be put in a stabilized state by reacting with separately supplied O2, N2O, or O3, and then, may be changed to a mixed gas including a reactant gas mixed therewith. Subsequently, the mixed gas may flow into the exhaust pump and may be emitted. Alternatively, the ligand and the source gas may be mixed with the reactant gas and may be emitted.

Abstract: A method for making a composite article comprises securing a layup over a form. The layup including a plurality of dry intermediate reinforcement plies wrapped around an inner reinforcement ply. Resin is infused into the layup under vacuum. The resin-infused layup is consolidated under pressure and cured.

Abstract: A method for dehydration and critical point drying of a sample in a single chamber is introduced, comprising the steps of (a) dehydrating the sample by replacing water by an intermediate fluid, (b) replacing the intermediate fluid by a transitional fluid, (c) pressurising the transitional fluid to or beyond its critical pressure and/or heating the transitional fluid (4 to or beyond its critical temperature, and (d) in response to gradually releasing the pressure, letting the transitional fluid gasify and escape from the sample. In step (a) and/or step (b), a ratio of the fluid to-be-replaced to the replacing fluid is measured and used to control a supply of the replacing fluid. The method reduces consumption of intermediate fluid and/or transitional fluid, making the process more efficient in terms of duration and user interaction while ensuring a high degree of dryness and the integrity of the sample.

Abstract: A substrate processing apparatus (100) comprising a process tunnel (102) including a lower tunnel wall (122), an upper tunnel wall (142), and two lateral tunnel walls (128), said tunnel walls being configured to bound a process tunnel space (104) that extends in a longitudinal transport direction (7) and that is suitable for accommodating at least one substantially planar substrate (180) oriented parallel to the upper and lower tunnel walls (122, 142), the process tunnel being divided in a lower tunnel body (120) comprising the lower tunnel wall and an upper tunnel body (140) comprising the upper tunnel wall, which tunnel bodies (120, 140) are separably joinable to each other along at least one longitudinally extending join (160), such that they are mutually movable between a closed configuration in which the tunnel walls (122, 128, 142) bound the process tunnel space (104) and an open configuration that enables lateral maintenance access to an interior of the process tunnel.

Abstract: Polymeric coatings, their applications, and the methods of their preparation are described. The coatings may be used to confer desirable properties to the consumer and/or medical products. Also described are methods of loading therapeutic agents on the polymeric coatings and the applications of the drug eluting polymeric coatings thus obtained.

Abstract: The wafer processing system includes a rotatable wafer support member for supporting a wafer and a plurality of collections trays disposed about a peripheral edge of the wafer support member. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough section for collecting fluid. The system includes a chamber exhaust outlet that is formed in the housing for venting gas from the interior of the housing outside of the collection trays and a chemical exhaust outlet that is formed in the housing for venting gas that flows through the collection chamber to the chemical exhaust outlet. The chemical exhaust outlet is fluidly isolated from the chamber exhaust outlet.

Abstract: A curved substrate with a film includes a substrate having a first main surface, a second main surface and an end surface, and an antiglare film provided on the first main surface. The substrate has a flat portion and a bent portion. A value obtained by dividing a reflected-image diffusibility index value R of the bent portion by the sum of the reflected-image diffusibility index value R of the bent portion and a reflected-image diffusibility index value R of the flat portion is 0.3 or higher and 0.8 or less.

Abstract: To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).

Abstract: Disclosed is a liquid processing apparatus for performing a liquid processing by supplying a processing liquid from a nozzle to a substrate. The apparatus includes: a cup body provided to surround a substrate holding unit; a nozzle arm provided with a nozzle and supported by a support unit; a moving mechanism configured to move the nozzle arm via the support unit between a stand-by position and a processing position; an elevating mechanism configured to move up and down the support unit; a cover member including a top plate portion provided above a driving region and configured to partition the driving region from a region where the substrate is held within the cup body; an opening formed in a portion corresponding to a moving path of the support unit in the top plate portion; and an exhaust mechanism configured to evacuate the driving region.

Abstract: Provided is a substrate processing apparatus that removes a film by supplying a processing liquid to the peripheral edge of a substrate. An ejection unit ejects the processing liquid to the peripheral edge of the substrate held and rotated by a substrate holding unit. An ejection position setting unit sets the ejection position of the processing liquid of the ejection unit to correspond to the removal width of the film included in a recipe, and a property information acquisition unit acquires property information of the film to be removed. A correction amount acquisition unit acquires the correction amount for correcting the ejection position of the processing liquid based on the property information of the film, and an ejection position correction unit corrects the ejection position of the processing liquid by the ejection unit based on the correction amount acquired by the correction amount acquisition unit.

Abstract: A deposition apparatus uniformly controlling deposited quantities of a plurality of depositing sources by efficiently determining an abnormal depositing source. The deposition apparatus may reduce loss of materials by exactly determining an abnormal depositing source. The deposition apparatus includes: a plurality of depositing sources spraying a deposition material; a substrate holder fixing a substrate to face the depositing source; a depositing source shutter disposed at one side of the depositing source and opening and closing an passage of each depositing source; and a main shutter disposed between the depositing source and the substrate fixed to the substrate holder and depositing a part of the deposition material on the substrate through the main shutter.

Abstract: Exemplary pressurization and coating systems, methods, and apparatuses are described herein. In certain embodiments, pressurization systems, methods, and apparatuses are used in conjunction with coating systems, methods, and apparatuses to control pressure about a substrate after a coating material is applied to a surface of the substrate. An exemplary system includes a die tool configured to apply a coating material to a substrate passing through the die tool and a pressurization apparatus attached to the die tool and forming a pressurization chamber. The pressurization apparatus is configured to receive the substrate from the die tool and control pressure about the substrate in the pressurization chamber. In certain embodiments, the die tool forms a coating chamber and is configured to apply the coating material on at least one surface of the substrate in the coating chamber.

Abstract: A firearm and tool oiling chamber comprised of an oil less air compressor, sealed chamber, oil atomizer and air filter. Said system introduces air through the oil atomizer breaking oil down to a fine vapor allowing the vapor to cover all surfaces of firearm or tool. As the vapor enters the chamber, being heavier than air it forces air out through the exhaust line and filter. Any escaping oil is caught in filter. The oil is able to cover all surfaces of firearm or tool and to penetrate into areas that hand oiling does not reach using much less oil than conventional methods.

Abstract: Methods of machining a body to produce a chip are provided wherein the body is formed of a material and in a state such that the material exhibits sinuous flow during a machining operation. The methods include providing a layer located on a surface of the body, and machining the body by causing engagement between a cutting tool and the body in a contact region below an area of the surface having the coating layer thereon and moving the cutting tool relative to the body to produce the chip having the layer thereon. The layer reduces sinuous flow in the material of the body and the chip is formed primarily by laminar flow.

Abstract: A control device is configured to make a robot arm and a substrate holding device execute a blade member advancing operation for advancing a pair of blade members into a substrate placing structure, a substrate receiving operation for receiving a substrate placed on an upper stage of the substrate placing structure by the blade member in a substrate non-holding state, and a substrate placing operation for placing the substrate on the blade member in a substrate holding state onto a lower stage. A timing of receiving a substrate by the substrate receiving operation is shifted from a timing of placing a substrate by the substrate placing operation. A substrate conveying robot capable of shortening the tact time upon conveying substrates regardless of the kind of substrate fixing method in the substrate holding device can be provided.

Abstract: The present invention increases uniformity of plasma processing in a surface to be processed of an object to be processed or increases uniformity of plasma processing between objects to be processed. There is provided a plasma processing apparatus including: a processing container; a gas supply system; an exhaust system; a plasma generating unit; a gas flow path installed between an outer wall of the processing container and the plasma generating unit, the gas flow path guiding a temperature controlling gas to flow along the outer wall of the processing container; a plurality of gas introduction holes disposed along a circumferential direction of the processing container and configured to introduce the temperature controlling gas into the gas flow path; and a gas exhaustion hole configured to exhaust the temperature controlling gas passed through the gas flow path.

Abstract: There are provided a substrate processing apparatus and a substrate processing method realizing an effective reduction of a voltage change of a substrate on an electrode to reduce the variation of incident energy of ions entering the substrate. The substrate processing apparatus includes: a first electrode holding a substrate on a main surface of the first electrode; a second electrode facing the first electrode; a RF power source applying to the first electrode a RF voltage whose frequency is equal to or higher than 40 MHz; and a pulse voltage applying unit applying to the first electrode a pulse voltage decreasing in accordance with a lapse of time, by superimposing the pulse voltage on the RF voltage.

Abstract: A method for introducing a substrate into a measuring apparatus, in particular a lithography mask into a coordinate measuring machine, includes the following steps: a) providing a first substrate in a start station; b) transporting the first substrate to a parking station; c) transporting a second substrate from the measuring apparatus to the start station; and d) transporting the first substrate from the parking station into the measuring apparatus. Measurements are carried out on the second substrate during the process of introducing the first substrate. A device for carrying out the method is also provided.

Abstract: A tool for machining an object comprising: a first part including a rotatable member, the rotatable member being rotatable to cause rotation of a machine tool; a second part; a joint coupling the first part and the second part to enable relative movement between the first part and the second part; and a sensor to sense an object to be machined.

Abstract: A method and apparatus for manufacturing of 3D objects. The apparatus includes a number of material deposition heads terminated by nozzles, of which one or two nozzles are configured to deposit a first material to form a first and second pattern layers. The pattern layers are laterally shifted from each other such that when the first and second pattern layers are deposited, a space (empty volume) with a varying cross section is formed. In some examples, two or more nozzles could be used to deposit the corresponding first and second pattern layers. The nozzles could move independent of each other.

Abstract: A method of manufacturing an exhaust gas-purifying catalyst comprising: moving a gas-flow control tool from a first position where the gas-flow control tool faces the first end face with the slurry in the reservoir interposed therebetween and is spaced apart from the slurry in the reservoir to a second position where the gas-flow control tool faces the first end face with a distance from the first end face shorter than that in the first position, in a period during which the slurry flows from the first end face's side toward the second end face's side, the gas-flow control tool being configured to generate a distribution of linear velocities of gas flows when the gas-flow control tool faces the first end face and gas is passed therethrough toward the first end face.

Abstract: A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.

Abstract: According to one embodiment, a substrate processing apparatus (1) includes a table (4) configured to support a substrate W, a solvent supply unit (8) configured to supply a volatile solvent to a surface of the substrate W on the table (4), and an irradiator (10) configured to emit light to the substrate W, which has been supplied with the volatile solvent, and function as a heater that heats the substrate W such that a gas layer is formed on the surface of the substrate W to make the volatile solvent into a liquid ball. Thus, it is possible to dry the substrate successfully as well as to suppress pattern collapse.

Abstract: A slit opening of a slit nozzle extends unidirectionally in a longitudinal direction from near the center of a circular substrate to near an outer edge of the substrate, and has a length in the longitudinal direction equal to or smaller than a radius of the substrate. When the slit nozzle discharges chemical onto the substrate, a rotary holder rotates the substrate and the slit nozzle relatively to each other about the center of the substrate. Accordingly, the chemical from the slit nozzle all adheres to a surface of the substrate to form an excellent liquid column and a chemical film on an almost entire surface of the substrate along the outer edge of the circular substrate. This yields satisfactory coating of the substrate with the chemical while waste chemical is suppressed.

Abstract: A manufacturing method of anti-fog coatings on lenses is provided. The method includes: a lens assembling step, a lens spraying step, a pre-drying step, a curing step and a lens obtaining step. In the lens assembling step, a plurality of lenses are disposed on a base of a movable carrier. In the lens spraying step, the plurality of lenses are moved to a spraying device and sprayed with a light-curable anti-fog material on a surface thereof. In the pre-drying step, any extra light-curable anti-fog materials are removed from the plurality of lenses by a suction device. In the curing step, the plurality of lenses are placed into a light curing apparatus and radiated by the ultraviolet lights to form an anti-fog coating on the surface of the plurality of lenses. In the lens obtaining step, the plurality of lenses are taken out of the light curing apparatus.

Abstract: A deposition system can conduct ALD or CVD deposition and can switch between the deposition modes. The system is capable of depositing multi-metal films and multi-layer films of alternating ALD and CVD films. Reactant supplies can be bypassed with carrier gas flow to maintain pressure in a reactor and in reactor supply lines and purge reactants.

Abstract: A system and technique that improve the quality of substrate processing may include a plurality of processing chambers; a vacuum transfer chamber; a plurality of transfer chambers; a plurality of gate valves; a plurality of first gas supply units configured to supply an inert gas to a substrate; a transfer robot; and a control unit for controlling the plurality of first gas supply units and the transfer robot to: supply the inert gas to the substrate at a first flow rate when a distance between a gas supply port and the substrate passing through the plurality of gate valves is a first distance; and supply the inert gas to the substrate at a second flow rate greater than the first flow rate when the distance between the gas supply port and the substrate is greater than the first distance when the substrate passes through the plurality of gate valves.