Abstract: The invention provides an extrusion material supply device suitable for use in melt extrusion molding, and a method for manufacturing an optical transmission body, in which a deterioration of an optical signal transmission loss is extremely small, and productivity intrinsic to an extrusion molding method is provided in combination. An extrusion material supply device 1 includes: a vertical hopper 2, which has a cooling unit 3 and a heat melting unit 4 continuous with a lower portion thereof, and houses a material rod R; cooling means 5 for cooling the cooling unit 3; an electric heater 6 that heats the heat melting unit 4; and gas pressurizing means 7 for sequentially supplying molten plastics M to a metal die by a gas pressure. The heat melting unit 4 is formed into a cylinder shape in which an inner diameter is larger than an inner diameter of the cooling unit 3 arranged above, and enables the molten plastics M to spread in the heat melting unit 4.

Abstract: A vacuum deposition apparatus includes a vacuum deposition device, a mask, a vacuum chamber and a controlling unit. The vacuum deposition device deposits a thin film layer on a substrate. The mask is disposed between the substrate and the vacuum deposition device, and the thin film layer is selectively deposited on the substrate using the mask. The vacuum chamber surrounds the vacuum deposition device and the mask, the controlling unit is disposed outside of the vacuum chamber, and the controlling unit is connected with the vacuum deposition device and controls both a tensile force and a compressive force on the mask.

Abstract: The present invention provides a substrate double-surface hole-filling apparatus for carrying out a hole-filling operation on a substrate which has a first surface and a second surface, comprises a first feeding device, a first scraping device, a first drying device, a second feeding device, a second scraping device, a second drying device and a turnover device. The substrate double-surface hole-filling apparatus has a turnover device turning over the substrate which needs to be carried out with hole-filling operation. Therefore, the substrate double-surface hole-filling apparatus can automatically carry out the hole-filling operation on two surfaces of the substrate without manual turnover of the substrate, thus improving production efficiency.

Abstract: Disclosed herein is a method of coating a catalyst support, in which a monolithic catalyst support provided therein with a plurality of longitudinally formed channels is quantitatively coated with catalyst slurry applied to post-treatment of exhaust gas, including the steps of: introducing catalyst slurry into a quantitative container whose bottom is vertically moved; moving a catalyst support to the top of a container such that the bottom of the catalyst support and top of the container are horizontally disposed each other; sealing the bottom of the catalyst support and the top of the container from the outside; moving the bottom of the container upward; and applying a vacuum to the channels of the catalyst support.

Abstract: A method of coating a substrate with a liquid comprising a catalyst component, which substrate comprises a plurality of channels, wherein the method comprises: (a) holding the substrate vertically; (b) introducing the liquid into the substrate through the open ends of the channels at a lower end of the substrate; and (c) after the lower end of the substrate has been part-filled with the liquid, applying a vacuum to the open ends of the channels at the upper end of the substrate while introducing the liquid into the substrate.

Abstract: A semiconductor plasma processing apparatus includes a vacuum chamber in which semiconductor substrates are processed, a process gas source in fluid communication with the vacuum chamber for supplying a process gas into the vacuum chamber, and an RF energy source adapted to energize the process gas into the plasma state in the vacuum chamber. The apparatus can also include a chamber wall wherein the chamber wall includes a means for supplying a plasma compatible liquid to a plasma exposed surface thereof wherein the plasma compatible liquid flows over the plasma exposed surface thereby forming a flowing protective liquid layer thereon. A liquid supply delivers the plasma compatible liquid to the chamber wall.

Abstract: The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.

Abstract: For vacuum treatment of workpieces by a multitude of distinct processing stations (P11-P1n, P21-P2m) the processing stations are grouped in two groups (I and II). The workpieces are handled towards and from the processing stations of the first group (I) simultaneously, whereat the workpieces are treated by the processing stations of the second group (II) in a selectable individual sequence.

Abstract: In various exemplary embodiments described herein, a system and related method to provide airflow management system in a substrate production tool includes a housing to couple the substrate production tool to a fan filter unit to provide filtered air to the housing, a facility connection to couple the substrate production tool to a reduced pressure exhaust mechanism, a substrate transfer section coupled below the housing and in airflow communication with the facility connection, and a substrate process area coupled to the substrate transfer section by one or more substrate transfer slots. A chamber substantially containing the substrate transfer section and the substrate process area is coupled to the housing to receive the filtered air and to the facility connection to provide an exhaust for excess gas flow. The chamber maintains a low pressure in the substrate process area relative to the substrate transfer section.

Abstract: Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.

Abstract: The present description is directed to a manufacturing method of solid-state dye-sensitized solar cells and a solid-state electrolyte filling device used in the manufacturing method. The present invention provides a manufacturing method of dye-sensitized solar cells that fills the solid-state electrolyte more uniformly with enhanced efficiency to secure higher light-to-energy conversion efficiency.

Abstract: A coated film manufacturing method and a coating machine are provided which can prevent deformation of a die coater due to evaporation of a coating liquid and prevent surface deficiency occurring when starting the coating. A coating machine is prepared which includes a die coater having a manifold, a slot communicating with the manifold, and a lip face formed at an end of the slot, a heat-insulating plate being disposed in a region below the lip face of the die coater and having a tapered top end portion, and a depressurizing chamber being disposed upstream in a web conveying direction from the die coater. The coating machine is made to stand by at a position for forming a clearance greater than a predetermined clearance between the coating machine and the web at the time of coating while flowing the coating liquid from the die coater.

Abstract: A processing system includes a first processing module that includes a first chamber; and a first processing source that can deposit a first material on a web substrate. An isolation module includes an isolation chamber, and one or more segregation walls that define a sequence of compartments in the isolation chamber. The first chamber is connected to a first compartment in the sequence of compartments. Each of the segregation walls includes an opening to allow the web substrate to pass through. A second processing module includes a second chamber in connection with a last compartment in the sequence of compartments in the isolation module, and a second processing source configured to deposit a second material on the web substrate. A transport mechanism moves the web substrate continuously through the first processing module, the isolation module, and the second processing module.

Abstract: Embodiments of gate valves and methods of using same are provided herein. In some embodiments, a gate valve for use in a process chamber may include a body having an opening disposed therethrough from a first surface to an opposing second surface of the body; a pocket extending into the body from a sidewall of the opening; a gate movably disposed within the pocket between a closed position that seals the opening and an open position that reveals the opening and disposes the gate completely within the pocket; and a shutter configured to selectively seal the pocket when the gate is disposed in the open position. In some embodiments, one or more heaters may be coupled to at least one of the body or the shutter.

Abstract: The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

Abstract: An integrated system for transferring and processing a substrate in a controlled environment to enable selective deposition of a thin layer of a cobalt-alloy material on a copper surface of a copper interconnect to improve electromigration performance of the copper interconnect, comprising: a lab-ambient transfer chamber; a substrate cleaning reactor coupled to the lab-ambient transfer chamber, wherein the substrate cleaning reactor cleans the substrate surface to remove metal-organic complex contaminants on the substrate surface; a vacuum transfer chamber; a vacuum process module for removing organic contaminants from the substrate surface; a controlled-ambient transfer chamber filled with an inert gas; and an electroless cobalt-alloy material deposition process module used to deposit the thin layer of cobalt-alloy material on the copper surface of the copper interconnect after the substrate surface has been removed of metallic contaminants and organic contaminants, and the copper surface has been removed of

Abstract: The present invention relates to a coating method and a coating device of the packaging material, applicable in the packaging process of a substrate. By adopting the melt spraying process for coating the molten packaging material, the steps of drying and sintering in the related art can be omitted. Therefore, the production circle of the whole packaging process can be shortened and the number of production apparatus can be decreased, and, thus, the investment and cost of the apparatus and the maintenance thereof during the production procedure can be decreased.

Abstract: An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of ?55 degrees C.

Abstract: An object of the present invention is to provide an apparatus for successive deposition used for manufacturing a semiconductor element including an oxide semiconductor in which impurities are not included. By using the deposition apparatus capable of successive deposition of the present invention that keeps its inside in high vacuum state, and thus allows films to be deposited without being exposed to the air, the entry of impurities such as hydrogen into the oxide semiconductor layer and the layer being in contact with the oxide semiconductor layer can be prevented; as a result, a semiconductor element including a high-purity oxide semiconductor layer in which hydrogen concentration is sufficiently reduced can be manufactured. In such a semiconductor element, off-state current is low, and a semiconductor device with low power consumption can be realized.

Abstract: A nozzle is mounted on an end of an ejector for ejecting an aerosol on an ejection side in a honeycomb filter production apparatus. The nozzle is formed into a shape having a longitudinal direction. A single introduction port is formed at an end surface of the nozzle on one side in the longitudinal direction, and a plurality of discharge ports are formed at an end surface of the nozzle on the other side in the longitudinal direction. A single introduction passage extends linearly from the single introduction port in the longitudinal direction. A plurality of discharge passages are each branched from an end portion of the introduction passage on a side opposite to the introduction port and extend to corresponding one of the discharge ports in a direction tilted from the longitudinal direction.

Abstract: According to certain techniques, a system for coating a substrate includes a preparation component, a coating component, and a curing component. The preparation component includes a plasma applicator that irradiates the substrate with plasma to form a prepared substrate. The coating component coats the prepared substrate with a coating medium to form a coated substrate. The coating component includes a coating head that receives the coating medium from a reservoir and applies the coating medium to the prepared substrate to form the coated substrate. The coating component includes a vacuum that removes an excess amount of the coating medium from the coated substrate. The curing component includes at least one ultraviolet emitter and irradiates the coated substrate with ultraviolet energy to form a cured substrate.

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus includes a vacuum chamber having a dome and a floor. A substrate support is disposed inside the vacuum chamber. A plurality of thermal lamps are arranged in a lamphead and positioned proximate the floor of the vacuum chamber. A reflector is disposed proximate the dome, where the reflector and the dome together define a thermal control space. The substrate processing apparatus further includes a plurality of power supplies coupled to the thermal lamps and a controller for adjusting the power supplies to control a temperature in the vacuum chamber.

Abstract: A coating device includes an upper stage, a lower stage and a spraying part. The upper stage masks an upper surface of a display panel. The lower stage masks a lower surface of the display panel. The spraying part sprays ink to a side surface of the display panel. The side surface of the display panel is exposed between the upper stage and the lower stage. The coating device includes the upper stage and the lower stage, so that the coating device may form a coating layer of uniform thickness by precisely spraying ink. In addition, a cross-section of the coating layer may be precisely formed having specific shape such as an L or C shape. A display apparatus having high light usage efficiency and reduced light leakage may be provided by using the coating device.

Abstract: A substrate holder apparatus includes a substrate holder configured to hold a substrate in a vacuum processing space in a chamber, a support column coupled to the substrate holder, a first rotating support unit which rotatably supports the support column, a second rotating support unit which rotatably supports the support column at a position spaced apart from a position where the first rotating support unit supports the support column, a housing configured to support the first rotating support unit and the rotating support unit, and a conductive member configured to electrically connect the support column to the housing.

Abstract: Disclosed herein is a flat panel display (FPD) manufacturing apparatus for performing a desired process for a substrate positioned in a chamber after establishing a vacuum atmosphere in the chamber. The vacuum chamber is divided into a chamber body and an upper cover to ensure easy opening/closing operations of the upper cover.

Abstract: A substrate processing apparatus including a holder for rotatably holding a substrate; a coating solution supply nozzle for supplying a coating solution onto a front surface of the substrate to be processed held by the holder; a treatment chamber housing the holder and the coating solution supply nozzle; a cooling device which cools the substrate before the coating solution is supplied to the substrate, to a predetermined temperature; a heating devices which heats the substrate coated with the coating solution to a predetermined temperature; and a transferer that transfers the substrate between the treatment chamber, the cooling device and the heating device, wherein the treatment chamber, the cooling device and the heating device are partitioned from ambient air, and wherein at least the treatment chamber is connected to a gas supply mechanism having a supply source of a gas having a kinematic viscosity coefficient higher than that of air.

Abstract: Provided is a method of manufacturing a semiconductor device. The method includes (a) loading a substrate having a silicon-containing film formed thereon into a process chamber; (b) supplying a gas into the process chamber from a gas supply unit until an inner pressure of the process chamber is equal to or greater than atmospheric pressure; and (c) supplying a process liquid from a process liquid supply unit to the substrate to oxidize the silicon-containing film.

Abstract: This invention discloses apparatus for processing one or more of a Lens Precursor, a Lens Precursor Form and an ophthalmic Lens. The apparatus provides for vapor phase processing of the subject Lens Precursor, a Lens Precursor Form and an ophthalmic Lens.

Abstract: A method of cleaning off organic deposition material accumulated on a mask includes forming an organic deposition material pattern on a substrate using the mask, which includes a plurality of slots, in a deposition chamber including a deposition source; transporting the mask to a stock chamber that is maintained at a vacuum and adjacent to the deposition chamber; and partially cleaning off the organic deposition material accumulated along the boundaries of the slots of the mask in the stock chamber. A system to clean off an organic deposition material accumulated on a mask having a plurality of slots, includes a deposition chamber including a deposition source; and a stock chamber that is maintained at substantially the same vacuum as the deposition chamber and includes a cleaning device that cleans off the organic deposition material accumulated on the mask.

Abstract: Provided is a vacuum treatment device, when a lifting pin inserted to a through hole is moved up, a substrate on a placement table is placed on a lid member which is connected to an upper end of a lifting pin and is separated from a placement surface of the placement table. Additionally, when the lifting pin is moved down, the substrate comes into contact with the placement surface so as to be placed thereon. An annular seal member surrounding a periphery of an opening of the through hole is provided in a portion which faces the lid member in a bottom surface of a depression provided in the placement surface of the placement table. The lid member annularly comes into contact with the seal member when the lifting pin is moved down, and a space inside the through hole and a space outside the through hole are separate by the seal member, thereby preventing gas from flowing into the through hole.

Abstract: A semiconductor manufacturing apparatus according to the present embodiment comprises a chamber. A chemical-agent supply part is configured to supply a water-repellent agent or an organic solvent to a surface of a semiconductor substrate having been cleaned with a cleaning liquid in the chamber. A spray part is configured to spray a water-capture agent capturing water into an atmosphere in the chamber.

Abstract: A drive device is provided to include: a case; a first motor and a second motor having an output shaft extending along a first axial line in the case and a second axial line parallel to the first axial line in the case, respectively; a first output shaft including a first shaft body and roller followers, the roller followers being engaged at a predetermined reduction gear ratio with the rib of the first motor; a second output shaft including a second shaft body and roller followers, the roller followers being engaged at a predetermined reduction gear ratio with the rib of the second motor; a first sealing member located between the case and the outer peripheral surface of the first shaft body; and a second sealing member located between an inner peripheral surface of the first shaft body and an outer peripheral surface of the second shaft body.

Abstract: An apparatus for particle deposition is disclosed. The apparatus includes a housing configured to couple to a work piece to form a chamber. A nozzle directs a working gas into the chamber to deposit a particle entrained in the working gas at the work piece. The nozzle may be coupled to a flow channel within the chamber that directs the working gas through the nozzle. The coupling between the housing and the work piece may be a slidable coupling.

Abstract: The invention relates to a process for producing a bone-regeneration material. According to the method, a bio-compatible, open-pored body is exposed to a vacuum and osteoinductive and/or osteogenic substances are absorbed into the pores of the body, for example by means of a vacuum generated therein. It is thus possible to produce a bone-regeneration material, which contains osteoinductive and/or osteogenic substances in the pores of the bio-compatible body, said substances acting as a network structure for new somatic cells that are to grow into the porous body.

Abstract: An apparatus forms an electroconductive substance in micro holes, the apparatus introduces a fluid, that includes at least a metal complex dissolved in a supercritical fluid or a subcritical fluid, into a reaction chamber including a first space and a second space, allows a planar substrate to be disposed in the fluid that continuously moves in a specific direction in the reaction chamber. A second surface of the substrate is vertical to the specific direction in which the fluid that is introduced into the first space moves; the substrate is supported throughout the entire first surface so that the fluid travels in the micro holes of the substrate from the second surface toward the first space of the substrate; and a support member including a fine communication hole through which the fluid passes toward the second space is disposed.

Abstract: A method and device for coating with polyimide solution are provided. The method includes the following steps: placing a glass substrate onto a support surface to form a face contact therebetween; heating the glass substrate to a preset coating temperature through the support surface; and coating the glass substrate with the polyimide solution. With the glass substrate heated before being coated, the polyimide solution diffusion and solvent evaporation during coating can be accelerated, which is conducive to controlling the temperature uniformity and consistency and preventing the cloud-like spots. The glass substrate in face contact with the support plate is more conducive to being fully heated, and can prevent the glass substrate from being heated non-uniformly due to the contact of the glass substrate with the supporting legs, thereby preventing the foot-like spots.

Abstract: A method of coating a honeycomb monolith substrate comprising a plurality of channels with a liquid comprising a catalyst component comprises the steps of: (i) holding a honeycomb monolith substrate substantially vertically; (ii) introducing a pre-determined volume of the liquid into the substrate via open ends of the channels at a lower end of the substrate; (iii) sealingly retaining the introduced liquid within the substrate; (iv) inverting the substrate containing the retained liquid; and (v) applying a vacuum to open ends of the channels of the substrate at the inverted, lower end of the substrate to draw the liquid along the channels of the substrate.

Abstract: A method for filling features in a layer over a substrate is provided. A dispersion of nanoparticles less than 5 nm is placed on the layer. The liquid is frozen by lowering a temperature of the liquid. The frozen liquid is sublimated by decreasing pressure and subsequently heating the frozen liquid, wherein the nanoparticles are not sublimated.

Abstract: A vapor deposition reactor and a method for forming a thin film. The vapor deposition reactor includes at least one first injection portion for injecting a reacting material to a recess in a first portion of the vapor deposition reactor. A second portion is connected to the first space and has a recess connected to the recess of the first portion. The recess of the second portion is maintained to have pressure lower than the pressure in the first space. A third portion is connected to the second space, and an exhaust portion is connected to the third space.

Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.

Abstract: The present invention is a method and apparatus for cleaning a chemical vapor deposition (CVD) chamber using cleaning gas energized to a plasma in a gas mixing volume separated by an electrode from a reaction volume of the chamber. In one embodiment, a source of RF power is coupled to a lid of the chamber, while a switch is used to couple a showerhead to ground terminals or the source of RF power.

Abstract: A film forming device for a solar cell according to an exemplary embodiment of the present invention includes a chamber configured to receive a substrate and including a body having a hollow portion, a heating device in the hollow portion, and an insulating member configured to enclose the substrate and the heating device.

Abstract: Methods and apparatus for coating substrates. A die can be employed for extrusion coating an elongated substrate, where the die defines a coating cavity therein. The die can comprise a die block having a coating supply channel for supplying a coating material to the coating cavity. The die can further comprise a guide plug and a die plate removably coupled to the die block. The guide plug can comprise a substrate inlet having a non-circular lateral cross-section, and the die plate can comprise a substrate outlet also having a non-circular lateral cross-section. A coating system comprising such a die can operate to coat a substrate where the substrate can be pushed at least partially through the die and contacts the coating material therein.

Abstract: There is provided a powder deposition apparatus including a drum-like rotating body disposed in a vacuum container and configured to rotate in a vertical direction, a deposition source disposed inside the drum-like rotating body, a tubular powder supplying/recovering member disposed close to an inner wall of the drum-like rotating body and configured to recover powder coming through an upper face and to supply the powder to the inner wall through a lower face, and a lid member provided in a vicinity of the lower face of the powder supplying/recovering member and configured to supply the powder to the inner wall through the lower face of the powder supplying/recovering member by being allowed in an open state and to accumulate the powder coming in the powder supplying/recovering member through the upper face by being allowed in a closed state.

Abstract: An apparatus for combinatorial site-isolated thin film deposition may include a source of a liquid precursor, a nebulizer configured to convert the liquid precursor to an aerosolized mist of particles, a first deposition cell configured to direct an aerosolized mist of particles onto a first selected region of the substrate, and a second deposition cell configured to direct an aerosolized mist of particles onto a second selected region of the substrate. A method for combinatorial site-isolated thin film deposition may include providing a liquid precursor, converting the liquid precursor to an aerosolized mist of particles, transporting the aerosolized mist of particles to a first deposition cell and a second deposition cell in proximity to a surface of a substrate, and depositing the transported aerosolized mist of particles onto a first selected region and a second selected region of the surface of the substrate.

Abstract: A reactor assembly having a plurality of reaction chambers defined therein is provided. The reactor assembly includes conductive leads that mate with contacts disposed on a substrate being combinatorially processed. The conductive leads may be disposed within walls of the reactor assembly so that one end of the lead mates with the contacts on the substrate or anywhere on the surface of a conductive blanket substrate, while the other end of the lead enables communication with an external monitoring or control device.

Abstract: A method and apparatus for impregnating tobacco industry products with sensate constituents of botanicals by storing the tobacco industry products and the botanicals separately and applying heat and/or pressure to the apparatus to obtain a modified taste and aroma profile, are disclosed.

Abstract: Certain example embodiments of this invention relate to techniques for applying an overcoat (e.g., which may include an organic material) to a coated article having a layer stack already disposed thereon in order to reduce the potential for surface marring. An evacuative process may be used to deposit the mar reducing overcoat. The coated article including the mar-reducing overcoat has a contact angle greater than, and a surface friction less than, a contact angle and a surface friction of the single- or multi-layer stack supported by the substrate alone. Any marring due to cat-scratching or the like preferably would not be visible at 4× magnification following application of the mar reducing overcoat.

Abstract: In embodiments of the current invention, methods of combinatorial processing and a test chip for use in these methods are described. These methods and test chips enable the efficient development of materials, processes, and process sequence integration schemes for semiconductor manufacturing processes. In general, the methods simplify the processing sequence of forming devices or partially formed devices on a test chip such that the devices can be tested immediately after formation. The immediate testing allows for the high throughput testing of varied materials, processes, or process sequences on the test chip. The test chip has multiple site isolated regions where each of the regions is varied from one another and the test chip is designed to enable high throughput testing of the different regions.

Abstract: The invention relates to a process for the continuous production of a flexible substrate, preferably a plastics film containing a multi-layer coating in a roll-to-roll coating process, in which at least one vacuum coating process and at least one wet coating process are combined together, and to a device for use in such a process.