Abstract: A graphite wafer carrier for LED epitaxial wafer processes, having a plurality of wafer pocket profiles above the carrier for carrying the epitaxial wafer substrate. The inner edge of the wafer pocket profile is a concave step with a plurality of inward-extended support portions; and also has a graphite wafer carrier edge and an axle hole at the center of the graphite wafer carrier. The pocket profiles of different quantities and sizes can be arranged on the basis of different process parameters. The disclosed structure can reduce or eliminate airflow interference and improve the wafer edge yield.

Abstract: A mask holding device has a replaceable magnetic means, and a deposition apparatus for an organic light emitting device includes the mask holding device. The mask holding device is provided with magnets, and the magnets can be replaced as required so as to change the magnetic force of the mask holding device.

Abstract: An aspect of the present invention is drawn to a device for use with an electrostatic chuck having a top surface and a bottom surface, the top surface being separated from the bottom surface by a width, the electrostatic chuck additionally having a hole therein, the hole having a first width at the top surface and having a second width at the bottom surface, the first width being less than the second width, the top surface being capable of having wafer disposed thereon. The device includes a pin, a shaft, a neck portion and an outer housing portion. The pin has a pin width less than the first width. The shaft has a pin-holding portion, an end portion and a central portion disposed between the pin-holding portion and the end portion. The central portion has a first bearing portion. The outer housing portion has a first end and a second end and includes a second bearing portion. The shaft is disposed within the outer housing portion and is moveable relative to the outer housing portion.

Abstract: A system and method for maintain a desired degree of platen flatness is disclosed. A laser system is used to measure the flatness of a platen. The temperature of the platen is then varied to achieve the desired level of flatness. In some embodiments, this laser system is only used during a set up period and the resulting desired temperature is then used during normal operation. In other embodiments, a laser system is used to measure the flatness of the platen, even while the workpiece is being processed.

Abstract: A mask assembly is disclosed to improve organic material deposition efficiency including: a plurality of deposition masks, at least one of opposite ends of each of the plurality of deposition masks is formed to have a plurality of projections, which form at least one boundary aperture region at a boundary of adjacent two deposition masks.

Abstract: A system and method of painting parts of large dimensions that present a certain amount of flexibility that makes their shape geometrically unstable in the event of being moved. The surface of a part is moved in front of a paint spray device by an arm of a robot, while the spray device remains stationary relative to the robot and while the part is being deformed. Other elements include a gripper for gripping parts of large dimensions, the gripper being adapted to implement the method; an installation; and a booth for performing surface treatment of parts.

Abstract: The present invention describes a method of and an apparatus for including: separating magnets and corresponding target plates; separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system; and inserting or removing a thin wafer from the thin-wafer handling system.

Abstract: A single axis application unit for processing a glass workpiece includes a workpiece supporting table, an applicator movable on a traveler shiftable along a first linear axis and a central suction unit that is activateable to grip the glass workpiece that travels along a second linear axis oriented generally perpendicular to the first linear axis. A central suction unit brake selectively secures the central suction unit both rotationally and translationally. The central suction unit is freely moveable both translationally and rotationally when the central suction unit brake is released. A mid-peripheral suction unit is located at a fixed location remote from the central suction unit and selectively activateable to grip the glass workpiece to hold the glass workpiece in a fixed orientation. A corner suction gripper is movable with the applicator parallel to the first linear axis, and is selectively activateable to grip the glass workpiece.

Abstract: A substrate support structure for clamping a substrate by means of a capillary force created by a liquid clamping layer having a lower pressure than its surroundings. The substrate support structure comprises a surface provided with a plurality of substrate supporting elements for holding the substrate, and the surface further comprises portions with different capillary potential for inducing, during clamping, a predetermined capillary flow within the liquid clamping layer.

Abstract: Improved wafer coating processes, apparatuses, and systems are described. In one embodiment, an improved spin-coating process and system is used to form a mask for dicing a semiconductor wafer with a laser plasma dicing process. In one embodiment, a spin-coating apparatus for forming a film over a semiconductor wafer includes a rotatable stage configured to support the semiconductor wafer. The rotatable stage has a downward sloping region positioned beyond a perimeter of the semiconductor wafer. The apparatus includes a nozzle positioned above the rotatable stage and configured to dispense a liquid over the semiconductor wafer. The apparatus also includes a motor configured to rotate the rotatable stage.

Abstract: A rolled film formation apparatus including a first chamber in which a first precursor is applied to a substrate, a second chamber in which a second precursor is applied to the substrate such that the first and second precursors react with each other and that an atomic layer is deposited on the substrate, a third chamber in which a purge gas is applied to the substrate, and conveyance roller pairs which are positioned in the first, second and third chambers, and convey the substrate. Each conveyance roller pair includes a first roller and a second roller which sandwich the substrate in a thickness direction of the substrate. At least one of the first and second rollers has an outer peripheral surface having a surface unevenness. The substrate is moved back and forth among the first, second and third chambers. The atomic layer is deposited more than once on the substrate.

Abstract: Embodiments described herein generally relate to an apparatus for heating substrates. In one embodiment, a susceptor comprises a ring shaped body having a central opening and a lip extending from an edge of the body that circumscribes the central opening. The susceptor comprises carbon fiber or graphene. In another embodiment, a method for forming a susceptor comprises molding carbon fiber with an organic binder into a shape of a ring susceptor and firing the organic binder. In yet another embodiment, a method for forming a susceptor comprises layering graphene sheets into a shape of a ring susceptor.

Abstract: A substrate support assembly includes a shaft assembly, a pedestal coupled to a portion of the shaft assembly, and a first rotary connector coupled to the shaft assembly, wherein the first rotary connector comprises a first coil member surrounding a rotatable shaft member that is electrically coupled to the shaft assembly, the first coil member being rotatable with the rotatable shaft, and a second coil member surrounding the first coil member, the second coil member being stationary relative to the first coil member, wherein the first coil member electrically couples with the second coil member when the rotating radio frequency applicator is energized and provides a radio frequency signal/power to the pedestal through the shaft assembly.

Abstract: The present disclosure relates to a lithographic tool arrangement for semiconductor workpiece processing. The lithographic tool arrangement groups lithographic tools into clusters, and selectively transfers a semiconductor workpiece between a plurality of lithographic tools of a first type in a first cluster to a plurality of lithographic tools of a second type in a second cluster. The selective transfer is achieved though a transfer assembly, which is coupled to a defect scan tool that identifies defects generated in the lithographic tool of the first type. The disclosed lithographic tool arrangement also utilizes shared structural elements such as a housing assembly, and shared functional elements such as gases and chemicals. The lithographic tool arrangement may consist of baking, coating, exposure, and development units configured to provide a modularization of these various components in order to optimize throughput and efficiency for a given lithographic fabrication process.

Abstract: In one embodiment, a method (e.g., a method for forming one or more semiconductor layers on a device) includes modifying a first side of a first semiconductor body inside of a processing system to at least partially manufacture one or more photovoltaic modules; flipping the first semiconductor body over inside the processing system; and modifying an opposite, second side of the first semiconductor body inside of the processing system to continue fabrication of the one or more photovoltaic cells, wherein modifying at least one of the first side or second side of the first semiconductor body is performed in at least one of a reduced pressure or increased temperature environment of the processing system and flipping the first semiconductor body is performed without removing the first semiconductor body from the processing system.

Abstract: Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

Abstract: The invention relates to a device for strip guidance in a hot medium, comprising a deflection roller (3, 38) mounted on supporting arms (1, 2, 34, 37, 54, 57) and a carrier device holding the supporting arms (1, 2, 34, 37, 54, 57). The device is characterized in that one of the supporting arms (1, 2, 34, 37, 54, 57) is mounted on the carrier device by means of a floating bearing (5), wherein the floating bearing (5) allows the mounted supporting arm on the carrier device to move parallel to the longitudinal direction of the deflection roller (3, 38), and in that an elastic counter element (12), which acts parallel to the longitudinal direction of the deflection roller (3, 38) upon the supporting arm (1, 2, 34, 37, 54, 57) mounted on the floating bearing (5), is present and counteracts an increasing distance between the supporting arms (1, 2, 34, 37, 54, 57).

Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing substrates includes a chamber body enclosing a processing volume, the chamber body comprising a chamber floor, a chamber wall coupled to the chamber floor, and a chamber lid removably coupled to the chamber wall, wherein at least one of the chamber floor, the chamber wall, and the chamber lid comprise passages for a flow of a thermal control media; a heater plate disposed adjacent to and spaced apart from the chamber floor; a sleeve disposed adjacent to and spaced apart from the chamber wall, the sleeve supported by the heater plate; and a first sealing element disposed at a first interface between the chamber wall and the chamber lid.

Abstract: Disclosed is a susceptor. The susceptor comprises a susceptor bottom plate supporting a wafer holder; a susceptor top plate opposite to a susceptor bottom plate; and susceptor lateral-side plates extending from the susceptor bottom plate to the susceptor top plate, and wherein at least one of the susceptor top plate, the susceptor bottom plate, and the susceptor lateral-side plates includes the adiabatic layer.

Abstract: A method of fabricating a semiconductor device comprises loading a circuit board including a semiconductor chip into underfill equipment, positioning the circuit board on a depositing chuck of the underfill equipment, filling an underfill material in a space between the semiconductor chip and the circuit board placed on the depositing chuck; transferring the circuit board including the underfill material so that it is positioned on a post-treatment chuck of the underfill equipment; heating the underfill material of the circuit board placed on the post-treatment chuck in a vacuum state, and unloading the circuit board, of which the underfill material has been heated in the vacuum state, from the underfill equipment.

Abstract: A method for removing material from surfaces of at least a portion of at least one recess or at least one aperture extending into a surface of a substrate includes pressurizing fluid so as to cause the fluid to flow into the at least one recess or the at least one aperture. The fluid may be pressurized by generating a pressure differential across the substrate, which causes the fluid to flow into or through the at least one aperture or recess. Apparatus for pressurizing fluid so as to cause it to flow into or through recesses or apertures in a substrate are also disclosed.

Abstract: Provided is a full-automatic working apparatus which has a work-object conveying mechanism and can be used on a desk. The desktop working apparatus works a work-object as desired by moving relatively the work-object and a working head.

Abstract: A spin chuck according to the present invention is provided and is configured to eliminate the wrap of chemical over the wafer edge. The dual speed wafer spin chuck apparatus acts to prevent liquids from affecting the backside of a wafer during processing. An outer ring is placed around the wafer with a narrow gap between the two such that drops of liquid on the surface of the wafer will touch the outer ring as they move to the outermost edge of the wafer.

Abstract: A film deposition apparatus includes a chamber, at least one susceptor disposed inside the chamber and including a seating part, and at least three protrusion parts disposed on the seating part. The seating part is configured to have a wafer seated thereon. The film deposition apparatus further includes a heat source configured to supply heat to the at least one susceptor. The at least three protrusion parts are spaced a distance apart from a center of the at least one susceptor, and the distance is greater than or equal to one third (?) of a radius of the wafer seated on the at least one susceptor or greater than or equal to one third (?) of a radius of the at least one susceptor.

Abstract: A manufacturing facility is provided for manufacturing a product on a foil (FO). The manufacturing facility comprises a deposition zone (10) formed by a clean room wherein at least a first and a second deposition facility (21, 22) are arranged for depositing a layer of a material on the foil. The manufacturing facility further comprises at least one processing facility (31) for processing the deposited layer, said processing facility being arranged outside said deposition zone and comprising a processing trajectory with a first path (31a) away from said deposition zone, towards a turning facility (41) and with a second path (31b) from said turning facility back towards said deposition zone.

Abstract: An apparatus for and method of color-striking a color-strikable article. The method includes the steps of: conveying a color-strikable article within a proximity of an energizer, and selectively color-striking said article with said energizer to produce a predetermined pattern on the article.

Abstract: The present invention relates to a cluster tool for processing semiconductor substrates. One embodiment of the present invention provides a mainframe for a cluster tool comprising a transfer chamber having a substrate transferring robot disposed therein. The substrate transferring robot is configured to shuttle substrates among one or more processing chambers directly or indirectly connected to the transfer chamber. The mainframe further comprises a shutter disk shelf configured to store one or more shutter disks to be used by the one or more processing chambers, wherein the shutter disk shelf is accessible to the substrate transferring robot so that the substrate transferring robot can transfer the one or more shutter disks between the shutter disk shelf and the one or more processing chambers directly or indirectly connected to the transfer chamber.

Abstract: Discs (7) arranged along a shaft and having holders (8) distributed over the circumference, inclined outwards and intended for workpieces are supported on a ring (5) surrounding the discs (7). Successive rings (5) form an approximately cylindrical cladding which prevents undesired coating of the discs (7). Cladding has openings for the holders (8) of a disc (7) which are uniformly distributed over the circumference at the same height, each formed by an upper recess (14) in the ring (5) carrying the disc (7) and an adjacent lower recess (15) of the following ring. Boundary lines (17) between successive rings (5) start somewhat below the narrowest points of the webs separating adjacent openings, so that the lower recesses (15) do not narrow towards the edge of the ring (5) and the upper recesses (14) narrow at most slightly so that the workpiece carrier can be assembled from bottom to top.

Abstract: A susceptor for securing a semiconductor wafer with an orientation flat within a pocket is disclosed. The pocket provides a first inner wall extending along the orientation flat and a second wall facing an arched periphery of the semiconductor wafer. The first inner wall provides a hollow extending outwardly from the first inner wall, where the hollow accompanies with one of structures of a step, a slope, and a chamfered corner.

Abstract: Embodiments of substrate support rings providing more uniform thickness of layers deposited or grown on a substrate are provided herein. In some embodiments, a substrate support ring includes: an inner ring with a centrally located support surface to support a substrate; and an outer ring extending radially outward from the support surface, wherein the outer ring comprises a reaction surface area disposed above and generally parallel to a support plane of the support surface, and wherein the reaction surface extends beyond the support surface by about 24 mm to about 45 mm.

Abstract: A liquid treatment apparatus of continuously performing a plating process on multiple substrates includes a temperature controlling container for accommodating a plating liquid; a temperature controller for controlling a temperature of the plating liquid in the temperature controlling container; a holding unit for holding the substrates one by one at a preset position; a nozzle having a supply hole through which the temperature-controlled plating liquid in the temperature controlling container is discharged to a processing surface of the substrate; a pushing unit for pushing the temperature-controlled plating liquid in the temperature controlling container toward the supply hole of the nozzle; and a supply control unit for controlling a timing when the plating liquid is pushed by the pushing unit. The temperature controller controls the temperature of the plating liquid in the temperature controlling container based on the timing when the plating liquid is pushed by the pushing unit.

Abstract: A method for wet treatment of plate-like articles includes, a chuck for holding a single plate-like article having an upwardly facing surface for receiving liquid running off a plate-like article when being treated with liquid, wherein the chuck is outwardly bordered by a circumferential annular lip. The chuck has an outer diameter greater than the greatest diameter of the plate-like article to be treated, and a rotatable part with an upwardly facing ring-shaped surface for receiving liquid running off the circumferential lip of the chuck. The rotatable part is rotatable with respect to the chuck, the ring-shaped surface is coaxially arranged with respect to the circumferential annular lip, the inner diameter of the ring-shaped surface is smaller than the outer diameter of the chuck, and the distance d between the lip and the upwardly facing ring-shaped surface is in a range from 0.1 mm to 5 mm.

Abstract: An improved mobile paint booth system and method for applying paint to a vehicle is herein disclosed. An improved mobile paint booth can comprise a plurality of vertical supports, a base support, a first upper beam, and a second upper beam. The plurality of vertical supports can comprise a corner support at each corner, and a middle support along a first wall. The base support can be substantially in the shape of a “U” that can connect each of the vertical supports. The base of the “U” can be along the bottom of the first wall. The first upper beam that can connect a first set of the corner support and the middle support. The second upper beam that can connect a second set of the corner support.

Abstract: A transfer apparatus for transporting substrates in a transfer chamber having a first and second ends and two sides extending between the ends. The transfer apparatus includes a drive section, at least one base arm fixed at one end with respect to the transfer chamber and including at least one arm link rotatably coupled to the drive section and at least one transfer arm rotatably coupled to a common end of the base arm, the at least one transfer arm has two end effectors. The drive section has motors with three independent axes of rotation defining three degrees of freedom. One degree of freedom moves the at least one base arm horizontally for transporting the at least one transfer arm and two degrees of freedom drives the at least one transfer arm to extend and retract the at least one transfer arm and swap the two end effectors.

Abstract: A system and method for controlling a dosage profile is disclosed. An embodiment comprises separating a wafer into components of a grid array and assigning each of the grid components a desired dosage profile based upon a test to compensate for topology differences between different regions of the wafer. The desired dosages are decomposed into directional dosage components and the directional dosage components are translated into scanning velocities of the ion beam for an ion implanter. The velocities may be fed into an ion implanter to control the wafer-to-beam velocities and, thereby, control the implantation.

Abstract: The printing machine includes a support plate provided on its periphery with a plurality of receiving elements for articles rotatably mounted on the support plate, and a device for rotating the support plate in order that two articles, mounted on their associated receiving elements, respectively face two separate printing stations, the printing stations being supported by a single base. The machine further has a device for generating a relative translational movement between the base and the support plate so that patterns are helically printed on the articles during the rotation of the receiving elements.

Abstract: A method includes holding bonded wafers by a wafer holding module. A gap between the bonded wafers along an edge is filled with a protection material.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber in which a processing space is defined, a substrate support disposed in the chamber and supporting a substrate; and an upper electrode to which a radio frequency (RF) power is applied, the upper electrode facing the substrate support. The substrate support includes a plurality of ground electrodes spaced apart from each other and independently controlled so that plasma is uniformly generated to an edge area of the substrate support between the upper electrode and the substrate support. The substrate processing apparatus may uniformly control plasma distribution or density on a substrate and a periphery of the substrate and may uniformly control plasma distribution or density in the central area of the substrate and the edge area of the substrate.

Abstract: A device and a method for producing impregnated reinforcements, in particular for composite materials such as drive belts. The method for producing the reinforcements includes: introducing the reinforcement into an applicator device; introducing at least one substance for impregnating the reinforcement into the applicator device; and, embodying the impregnated reinforcement. The device comprises at least one applicator through which the reinforcement is guided and at least one intake for a substance for impregnation.

Abstract: Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.

Abstract: A transportable process box for processing substrates coated on one side is described. The box has a base for the placement of a first substrate in a manner such that the latter is supported over the full area, a frame, a cover which is placed onto the frame, and an intermediate element which is arranged between the base and the cover and is intended for the placement of a second substrate in a manner such that the latter is supported over the full area. Arrangements and methods for processing substrates are also described.

Abstract: The present invention relates to a transfer apparatus for transfer to and/or from a processing machine, in particular an internal lacquering machine, for processing cylindrical containers with or without a closed bottom, in particular made of aluminium or steel, wherein the processing machine comprises a holding dial provided with holding elements for holding the cylindrical containers, to a processing system including such transfer apparatus and to a corresponding transfer method and it is an object of the present invention to provide such transfer apparatus, which allows for transferring cylindrical containers with or without a closed bottom to a processing machine the holding elements of which having radially and tangentially fixed positions relative to the holding dial and being equally distributed with a first mutual pacing on a circle with a reduced need for maintenance and/or cleaning.

Abstract: A sputtering device includes a chamber; and a substrate transferring unit for loading a substrate into, or unloading the substrate from the chamber, the substrate transferring unit including a gas injection assembly forming a gas cushion between the substrate and an upper surface of the substrate transferring unit.

Abstract: A self-centering susceptor ring assembly is provided. The susceptor ring assembly includes a susceptor ring support member and a susceptor ring supported on the susceptor ring support member. The susceptor ring support member includes at least three pins extending upwardly relative to the lower inner surface of the reaction chamber. The susceptor ring includes at least three detents formed in a bottom surface to receive the pins from the susceptor ring support member. The detents are configured to allow the pins to slide therewithin while the susceptor ring thermally expands and contracts, wherein the detents are sized and shaped such that as the susceptor ring thermally expands and contracts the gap between the susceptor ring and the susceptor located within the aperture of the susceptor ring remains substantially uniform about the entire circumference of the susceptor, and thereby maintains the same center axis.

Abstract: A film treating apparatus includes a film feeder configured to feed a film having first and second surfaces, a film processor configured to process the film fed from the film feeder, a film collector configured to collect the film processed by the film processor, a fixed support unit configured to support at least one of the first or second surface of the film and to guide the movement of the film, and a variable support unit configured to apply tension to the film while moving from the first surface of the film toward the second surface of the film.

Abstract: A continuous dosage form coating apparatus uses vibrational impulses to maintain a dosage forms in a fluid state to expose them to a coating material atomized by spraying.

Abstract: A component of a plasma processing chamber having a protective liquid layer on a plasma exposed surface of the component. The protective liquid layer can be replenished by supplying a liquid to a liquid channel and delivering the liquid through liquid feed passages in the component. The component can be an edge ring which surrounds a semiconductor substrate supported on a substrate support in a plasma processing apparatus wherein plasma is generated and used to process the semiconductor substrate. Alternatively, the protective liquid layer can be cured or cooled sufficiently to form a solid protective layer.

Abstract: A workpiece holder for securing workpieces in a dip bath has an open generally rectangular metal frame having opposite sides. An array of at least four metal rods extending between the opposite sides forms a guide track adapted to receive and hold a row of the workpieces in contact with one another. One of the sides is formed in alignment with the track with a fill hole through which the workpieces may pass to move into and out of the track.

Abstract: Disclosed are stent holding devices having a support mandrel and one or more stent retaining fixtures disposed on the mandrel. The retaining fixture may include a character identifier to facilitate tracking a stent mounted on the holding device. The retaining fixture may include a conical protrusion and a conical recess to allow any number of retaining fixtures to engage each other and be stacked on the mandrel. The retaining fixture may include a tubular member having a spiral cut that enables the diameter of the tubular member to be adjusted to allow for a frictional fit on the mandrel. The retaining fixture may have a Z-shaped or T-shaped structure configured to retain a stent. The stent retaining fixture may also have a filament for retaining a stent.

Abstract: A processing system includes a first processing module that includes a first chamber; and a first processing source that can deposit a first material on a web substrate. An isolation module includes an isolation chamber, and one or more segregation walls that define a sequence of compartments in the isolation chamber. The first chamber is connected to a first compartment in the sequence of compartments. Each of the segregation walls includes an opening to allow the web substrate to pass through. A second processing module includes a second chamber in connection with a last compartment in the sequence of compartments in the isolation module, and a second processing source configured to deposit a second material on the web substrate. A transport mechanism moves the web substrate continuously through the first processing module, the isolation module, and the second processing module.