Abstract: A pneumatic handling and recoating apparatus for handling workpieces, such as glass, is provided. The apparatus utilizes a holding device operatively connected to a vacuum assembly. The holding device engages workpieces by vacuum and subsequently releases them by a burst of gas. The burst of gas also facilitates the application of a coating material, such as a stain-retardant agent, to a workpiece upon release from the holding device.

Abstract: A paint shield device for doorknobs of various sizes. The device includes two flexible clamshell shaped half cups mold formed together as a unit and connected together along a living hinge between the half cups. The half cups are pivotally movable together about the living hinge to mate or overlap each free distal side margin of each of the half cups to form a substantially complete cup having a substantially cylindrical side wall, a substantially closed bottom, and an open end adapted to admit a doorknob therein. A prong or post extends outwardly from an outer sidewall surface of each half cup to receive an elastic connector stretchably attachable to each prong or post with the half cups in the closed position to produce sufficient biasing force to hold the device in position over the doorknob.

Abstract: A mounting assembly for supporting a stent and a method of using the same to coat a stent is disclosed.

Abstract: Replaceable component carriers (40) are adapted to be freely floating in belt apertures (74) and have alignment features (160), such as conical holes (170), mated to features (162), such as tapered pins (184), in processing stations to temporarily hold a carrier (40) and its components (10), such as resistors, in a fixed position during various processes, such as termination. The carriers (40) include a rigid substructure (50) and a more elastic coating (60) to provide receiving holes (46) that can be adapted to hold particular components (10). The carriers (40) can be replaced without removing the belt (72), whenever differently shaped holes (46) are desired or become too worn to reliably handle components (10), thereby reducing damage risk, replacement cost, and operational down time of the belt (72).

Abstract: The subject invention includes a plating apparatus (10) having an electrically conductive rack (12) and a frame assembly (14). The frame assembly (14) includes a rod (24) and series of support structures (26). A number of removable (34) and fixed (32) bars are attached to the support structures (26) such that a strand of interconnected workpieces (18) are wrapped over the bars (32, 34) to define a revolution of the interconnected workpieces (18). The plating apparatus (10) and frame assembly (14) are characterized by a series of spacers (38) mounted along the removable bars (34) for separating adjacent revolutions of the interconnected workpieces (18) such that the workpieces (18) can be effectively coated with the material.

Abstract: An actuated edge grip chuck includes tabs with raised portions that press against the side of a substrate as opposed clamping on the top or bottom surfaces. The edge grip chuck includes a solid-state actuator to move a moveable tab into an open position. The solid-state actuator may be, e.g., a piezoelectric actuator or a shape memory alloy. The tab may be biased into the closed position such that when a substrate is held by the edge by the moveable tab and one or more fixed tabs. If desired, more than one moveable tab may be used.

Abstract: An apparatus for spreading liquid liner in the interior of a rocket motor tube, the rocket motor tube having masks attached at both ends of the rocket motor tube, the apparatus including a generally vertical support plate with an opening there through; a flange with a center opening attached to the support plate; a support tube inserted into the center opening of the flange; a stop disposed in the support tube, the stop abutting the support plate and engaging a mask on one end of the rocket motor tube; a retaining funnel that engages a mask on the other end of the rocket motor tube; a retaining ring that threadingly engages the retaining funnel; and at least two clamps attached to the support tube and engaging the retaining ring.

Abstract: A method for curing a layer of liquid coating applied to surfaces of a printed circuit board is disclosed. The method comprises exposing the layer of liquid coating to a curing agent; and manipulating the printed circuit board during the exposure so as to prevent the liquid coating from flowing from its applied location in response to gravitational forces. An apparatus for implementing the above method is also disclosed. The apparatus comprises a motorized assembly for rotating the printed circuit board. The apparatus also comprises a controller that controls the motorized assembly to rotate the printed circuit board about one or more horizontal axes extending through a plane that includes the printed circuit board while a liquid coating applied to surfaces thereof is being cured.

Abstract: A device for holding and vacuum-sealing a container as used in particular in the internal and/or external coating of containers. The device holds and vacuum-seals at least one container and has a sealing device for sealing the pouring opening in a defined end state also to comprise a holder with an introduction region, into which the wall region, which adjoins the pouring opening, together with the pouring opening, can be at least partially introduced, and a cage, which interacts with the holder and holds at least one clamping element in such a manner that, when force is applied to the cage in the direction in which the container is introduced into the defined end state, the clamping element can be guided out of a position in which it substantially releases the introduction region into a position in which it projects into the introduction region.

Abstract: A universal substrate holder of the invention for treating wafer substrates in liquids is provided with a shaft and a rod slidingly inserted into the central opening of the shaft. The end of the shaft that protrudes into the bowl supports a base platform for the substrate, while the end of the rod that protrudes into the bowl has radial arms that rigidly support an annular plate with pins that can pass through the opening of the base platform so that they can support the substrate above the surface of the platform. The annular plate supports clamping jaws made in the form of two-arm levers with shorter arms and longer arms. The longer arms are heavier and therefore in the stationary state of the holder keep the jaws turned into an open position. When the shaft begins to rotate, the jaws are turned under the effect of centrifugal forces into positions of clamping the substrate with the shorter arms.

Abstract: A substrate holder has a disk-like body with a central recess having diameter smaller than the diameter of the substrate placed onto the upper surface of the holder. The substrate can be clamped in place by the clamps of the edge-grip mechanism or placed into a seat without the use of clamps. In both cases, the substrate forms a partial wall that confines the heating/cooling recess or chamber. The aforementioned recess is filled with a cooling or heating liquid (depending on the mode of metal deposition) selectively supplied from a liquid heating or cooling system. In order to ensure in the working chamber above the substrate a pressure slightly higher than the pressure in the cooling/heating recess, the working chamber is first filled with the working solution under the atmospheric pressure, and then the recess is filled with a heating or cooling liquid with simultaneous increase of pressure in the working chamber to a level slightly exceeding the pressure in the recess.

Abstract: A method for coating an article such as a turbine engine shroud with an environmental or bond coating, such as a MCrAlY composition, to produce a surface finish suitable for machining to predetermined dimensions and specifications. The method of applying an environmental or bond coating uses a thermal spray process such as hyper velocity oxygen fuel (“HVOF”) to produce a thick and reasonably uniform coating which can be machined to desired dimensions while still providing key quality characteristics required to protect the coated parts in a high temperature, oxidative and corrosive atmosphere and permitting application of long life thermal barrier topcoats.

Abstract: An epitaxial growth furnace is provided for effecting the formation of an epitaxial layer on the surface of a semiconductor wafer by CVD in a reaction chamber of the furnace. The furnace comprises a wafer holder having an opening for exposing a surface area of the wafer which is subject to epitaxial growth, an opening flange adapted for engagement with a chamfered tapered face of a whole peripheral edge of the wafer on the side of said surface area thereof, and a plurality of jaws for detachably engaging with an outer periphery of the wafer on a back surface side of said surface area.

Abstract: A microelectronic substrate handling device comprising first and second support structures spaced from each other, the first support structure having a series of upper teeth defining a series of upper notches extending along a length of the first support structure and a series of lower teeth defining a series of lower notches extending along a length of the first support structure, each of the upper and lower notches opening toward the second support structure, wherein the upper and lower notches are offset from each other by a predetermined offset distance so that an edge of a microelectronic device will fit differently within the upper and lower notches of the first support structure when supported between the first and second support structures.

Abstract: A device is disclosed for supporting semiconductor wafers or other polished, opaque plates for processing or metrology in a vertical orientation, where the wafer loading and unloading occurs in a horizontal orientation. The device consists of a pallet designed with an opening such that both sides of the wafer are exposed. The wafer is loaded into the pallet to rest on three fixed rest members extending a short distance into the opening. Moving clamp members on the frame are located for movement toward or away from the corresponding rest members. Two cylindrical rest pins are located on axes parallel to the central axis of the opening to permit the wafer to rest under the force of gravity on the rest pins when the frame is rotated to its vertical position. Special provisions are made to minimize the effects of mechanical vibration of the wafer while insuring a robust physical restraint of the wafer within the apparatus without inducing mechanical stresses which could influence the shape of the wafer.

Abstract: A processing means (10; 20; 30) is disclosed, with which to hold part of a vehicle body (1; 6) during a processing operation in vehicle construction, in particular painting. With the objective of disclosing an improved, distinctly more economical and easily manipulated processing means of this kind, it is designed as a plastic holder with two contact or engagement sections (14; 19a; 22; 23; 33; 34; 35) disposed near its ends, which are to be inserted between two body parts (1; 2; 6) in order to fix them at a prespecified distance from one another.

Abstract: The present invention is directed to an apparatus for patterning a liquid on a substrate, with the apparatus including, a template having a pair of spaced-apart recessions with a protrusion disposed therebetween, with the protrusion being spaced-apart from the substrate a first distance and each of the pair of spaced-apart recessions being spaced-apart from the substrate a second distance, with the second distance being greater than the first distance; and a source of voltage in electrical communication with the template to produce an electric field between the template and the substrate, with a strength of the electrical field being inversely proportional to the first and second distances.

Abstract: An apparatus and method are provided for applying adhesive to an outer circumference of a section of tubing. The apparatus includes opposed grippers with concave adhesive transfer areas that can be moved into surrounding relationship with the tubing. Adhesive dispensing passages communicate with the adhesive transfer areas for delivering adhesive to the tubing. Counterbores are at opposed ends of the adhesive transfer areas and communicate with a vacuum source for removing excess adhesive.

Abstract: The present invention provides a wafer handling device having a base plate (G; G′), which has a first and a second supporting surface for a respective wafer (W1, W2) to be laid on; and a fixing device (K1, K2, S; K1′, K2′, S′) for the detachable fixing of the respective wafer (W1, W2) on the first and second supporting surface; the fixing device (K1, K2, S; K1′, K2′, S′) being configured in such a way that it contacts the respective wafer (W1, W2) only in the outer edge region of the side facing away from the supporting surface.

Abstract: A filament coating apparatus comprising a frame for releasably securing a filament, and a carriage mounted on the frame to oscillate between a first position and a second position. There is a first filament holding fixture mounted on the carriage and a second filament holding fixture also mounted on the carriage in axial alignment with the first filament holding fixture to secure a measured filament portion, preferably of an optical fiber, including a bare portion thereof, located inside a first boundary and a second boundary, between the first filament holding fixture and the second filament holding fixture. At least one spray head is attached to the frame at the first position with at least one radiation source attached to the frame at the second position.

Abstract: A vacuum processing chamber with walls defining a cavity for processing a substrate. The processing chamber includes a substrate support for supporting a substrate being processed in the cavity, a shadow frame for preventing processing of a perimeter portion of the substrate, and a shadow frame support supporting the shadow frame within the cavity. The shadow frame is positionable with a gap between an underside of the shadow frame and an upper surface of the substrate. At least one conductive element insulated from the walls and establishes a conductive path from the shadow frame to outside the cavity. The conductive path may be used to discharge charge from the shadow frame at a rate sufficient to prevent a voltage differential from accumulating between the shadow frame and the substrate which would cause arcing therebetween, or to apply a bias voltage to the shadow frame sufficient to attract particles to reduce contamination of the substrate.

Abstract: A wafer holder assembly includes first and second main structural members from which first and second wafer-holding arms extend. The first arm is secured to the main structural members by a graphite distal retaining member. The second arm is pivotally biased to a wafer-hold position by a graphite bias member. This arrangement provides a conductive path from the wafer to the assembly for inhibiting electrical discharges from the wafer during the ion implantation process. The assembly can further include additional graphite retaining members for maintaining the structural integrity of the assembly during the extreme conditions associated with SIMOX wafer processing without the need for potentially wafer-contaminating adhesives and conventional fasteners. The wafer-contacting pins at the distal end of the arms can be formed from silicon. The silicon pins can be coated with titanium nitride to enhance electrical contact with the wafer and to provide an abrasion resistant surface.

Abstract: A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture may be constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board. In the method, at least one printed circuit board is mounted to a clamping fixture support whereby a clamping fixture overlay is placed on top of the first printed circuit board.

Abstract: A wafer holding device, comprising a rotating baseplate, a wafer seat which is provided on the rotating baseplate coaxially with the rotating baseplate and which receives a peripheral edge of a wafer by a circumference, a predetermined number of chuck levers rotatably mounted on the wafer seat so that the chuck levers can be rotated around an axis extending in a tangential direction on a circumference of the rotating baseplate, and springs for resiliently pushing an end of the chuck lever toward the wafer seat, wherein the peripheral edge of the wafer received on the wafer seat is pinched by the wafer seat and the chuck lever.

Abstract: In an apparatus (S) for coating bottles (F), comprising a coating station (A) which contains at least one section of a conveyor track (G) for bottle conveying bodies (T), comprising a bottle holder (H) in each conveying body (T), comprising covering elements (E) which are associated with the conveying bodies and which can be moved between passive and covering positions, and comprising a bottle detector (P) which cooperates with a covering element displacement apparatus (V), the covering elements (E) are disposed directly on the conveying bodies (T) and are aligned towards the bottle holders (H).

Abstract: A method and apparatus for preheating golf balls prior to painting. The process includes forming golf balls with covers, heating, coating, and further heating the golf balls in a heated enclosure. The apparatus includes a ventilated holding tray that in addition to supporting the golf balls with a minimum of contact between balls and tray will allow for a thorough flow of heat about the balls for quick and uniform heating. This also will aid in reducing blemishes to the golf balls, by suspending freshly painted golf balls on conical pins set at right angles to the balls, thereby reducing the physical contact between the tray and freshly painted golf balls. The tray comprises replaceable ball support inserts. The inserts will generally be made from injection molded plastic and will be friction-fitted to the tray, and if damaged can be easily and inexpensively replaced.

Abstract: A coating process involving a hollow cylinder, a hollow shaft coaxial with the cylinder connecting a first and a second spacing device, mounting thereon on a vertical rod which is concentric to and mounted within a cylindrical coating vessel having a top and bottom, introducing coating liquid into the vessel adjacent to the bottom and withdrawing the liquid thereby depositing a layer of the coating liquid on the outside of the hollow cylinder and wherein a liquid seal is formed between the top and bottom of the cylinder and the hollow shaft.

Abstract: An edge handling chuck which operates to maintain a semiconductor wafer at a desirable orientation while rotating the wafer at high speeds is disclosed. The edge handling chuck consists of a cylindrical plate which holds a silicon wafer using multiple spring loaded edge wafer clamps. Gas passes through a center hole in the cylindrical plate and is dispersed to the atmosphere using multiple pressure relief openings in the cylindrical plate. The purpose of this gas arrangement is to stabilize the wafer due to spinning vortex effects. The cylindrical plate has mounted therein an ertalyte ring which provides an area of angled contact for the wafer. The gas arrangement operates to pass gas to the slight space between the semiconductor wafer and the cylindrical plate, thereby contacting a lower surface of the wafer, and subsequently out of the arrangement using the pressure relief holes.

Abstract: An improved wafer clamp retainer is provided. The retainer is used to movably secure a wafer clamp to an upper electrode within a parallel-plate reactor. When drawn downward, the wafer clamp is pressed by the retainer against an outer periphery of the wafer to hold the wafer against the lower electrode. When drawn upward, the retainer lifts the wafer clamp from the wafer so that the wafer can be accessed. The wafer clamp retainer includes one or more features formed about an outer surface of a shaft extending from one end of the retainer body. The feature can comprise one or more rings, or spiral threads which mate with a flexible washer. The washer can be pushed directly upon the shaft and snap-fitted with the features or, alternatively, threaded upon the shaft by employing mating features on the wall which surrounds the opening through the washer.

Abstract: An alignment mark shielding ring for use in a physical vapor deposition chamber and a method for using the ring to avoid arcing problems on the wafer. The alignment mark shielding ring can be constructed of a ring that has a generally L-shaped cross-section, at least one hood portion to function as the shield for the alignment mark, at least one alignment pin for engaging at least one alignment sleeve mounted in a lower chamber shield for holding the alignment mark shielding ring in place. The alignment sleeve is constructed in two halves, each having an aperture therethrough. The aperture in the top half is larger than the aperture in the bottom half such that even when the apertures are coated with a metal layer deposited in the PVD process, the alignment pin does not electrically short to the lower chamber shield and thus, any possibility of arcing is avoided.

Abstract: When replacing a paint cartridge (25) on the coating apparatus (11), a replenished paint cartridge of a next paint color is picked up from one of paint replenisher units (55a to 55n) by one gripper member (101) of a cartridge gripper (100). In the next place, while the replenished paint cartridge (25) is being continuously gripped on one gripper member (101), a consumed or empty paint cartridge (25) is gripped and removed from the housing (12) by the other gripper member (102). Then, the replenished paint cartridge on one gripper member (101) is loaded on the housing (12), and the empty paint cartridge (25) is returned to a corresponding one of the paint replenisher units (55a to 55n). Thus, the paint cartridges (25) can be replaced in a significantly simplified manner.

Abstract: A door positioning article positions a door of a motor vehicle in an ajar position with respect to the motor vehicle during coating steps of manufacture. The door positioning article includes a base. An extension is secured to the base for fastening the door positioning article to the motor vehicle. A retainer extends out from the base and holds the door in the ajar position with respect to the motor vehicle and the door positioning article. A spring extends between the base and the retainer for allowing the door to pass over the retainer and for forcing the retainer through an orifice in the door providing the defined ajar position.

Abstract: Disclosed is a semiconductor device manufacturing apparatus provided with a rotational gas injector for supplying source gases at an upper portion of a reaction chamber. According to the invention, source gases are injected from the upside of the wafers through the rotational type gas injector, and non-reacted gases are exhausted into the downside space of the wafers, so that lowering in the thickness uniformity of a thin film due to the horizontal flow of source gases provided in the conventional art decrease remarkably. Accordingly, although multiple wafers are loaded in a single reaction chamber, a thin film having very high thickness uniformity can be deposited with respect to all the wafers, thereby capable of enhancing the productivity.

Abstract: A semiconductor wafer holding assembly that secures a semiconductor wafer for wafer handling by a semiconductor processing machine. The wafer holding assembly includes a clamp ring that is mounted to a support frame and that has a wafer-engaging surface. A plurality of latch assemblies are mounted about the periphery of the clamp ring and adjacent to the wafer-engaging surface. Each latch assembly includes a latch body that carries a clamping roller assembly and a supporting roller assembly. A rolling element of the supporting roller assembly rolls along a circular path on an inclined surface on the clamp ring as the latch body is rotated through a pivot arc between an unlatched position and a latched position. Unless the latch body is positioned in the latched position, the rolling engagement between the supporting roller assembly and the inclined surface suspends the rolling element of the clamping roller assembly above the wafer surface until the latch body is in the latched position.

Abstract: A high-throughput lithography process for creating high-resolution patterns in a polymerizable composition using carefully controlled electric fields followed by curing of the polymerizable composition is described. The process involves the use of a template that includes the desired patterns. This template is brought into close proximity to the polymerizable composition on the substrate. An external electric field is applied to the template-substrate interface while maintaining a uniform, carefully controlled gap between the template and substrate. This causes the polymerizable composition to be attracted to the raised portions of the template. By appropriately choosing the various process parameters such as the viscosity of the polymerizable composition, the magnitude of the electric field, and the distance between the template and substrate, the resolution of the structures formed in the liquid may be controlled to conform to that of the template.

Abstract: A replaceable shielding apparatus provides a cost effective way of shielding a portion of a workpiece during processing. The apparatus includes a replaceable shield, made of comparable weight as the workpiece for allowing replacement of the shield in the same way as the replacement of the workpiece. With this feature, the replacement of the shield is a routine process and would not interfere much with the workpiece operation. The invention further includes a shield clamp for clamping the shield onto the workpiece. In a preferred embodiment, the invention further includes a non-reactive gas inlet for creating a pressurized cavity in the vicinity of the shielded portion of the workpiece.

Abstract: A metallization module for applying a metal layer on the screen of a CRT faceplate panel is described. The metallization module comprises a vacuum chamber having sidewalls, a base, an adaptor plate, and a lid. The adaptor plate is positioned between the lid and the sidewalls of the metallization module. Evacuation of the vacuum chamber causes atmospheric pressure to act against the outside surface of the lid, forming an airtight seal between the lid, the adaptor plate, and the top lip of the sidewalls. A plurality adjustable rods in conjunction with the adaptor plate are used to support the faceplate panel within the metallization module.

Abstract: A stent mounting device and a method of coating a stent using the device are provided.

Abstract: A manufacturing process of Christmas tree decorations where glass half-products are first blown to required dimensions and shapes, including the process stem. This glass half-product is fixed into the rack and placed into the metal-coating device where, under vacuum conditions, a thin (1 to 7 microns) layer of metals and/or their alloys is coated on its surface by vacuum plating or vacuum powder coating processes. The metal-coated surfaces created this way may be finished in various colors using clear and color varnishes either gloss or matt. The glass half-products for Christmas tree decorations may be provided with masking in the place of intended decor before the half-product is put into the vacuum metal-coating device. After the masking elements are removed, clear non-coated spots are created on the decoration surfaces. The rack accommodating the glass half-products of decorations is for their placement into the metal-coating device when above methods are performed.

Abstract: A system for processing a disk includes an end-effector having a plurality of fingers. The end-effector is mounted to a rotary actuator. The rotary actuator is mounted to a linear stage. The linear stage is positioned adjacent to an air track and a tank. The rotary actuator and the linear stage place the fingers into the inner diameter of a disk on the air track. The fingers grip the inner diameter of the disk. The rotary actuator and the liner stage then place the fingers holding the disk into the tank. The tank is filled with a processing liquid such as a lubrication solution to lubricate the disk.

Abstract: A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture may be constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board. In the method at least one printed circuit board is mounted to a clamping fixture support whereby a clamping fixture overlay is placed on top of the first printed circuit board.

Abstract: The invention relates to an installation for treating wafers made of materials serving as microelectronics substrates including a tank for containing a treatment bath, a wafer support device capable of receiving at least one wafer of a first size, and an element for grasping and placing each wafer of the first size in the bath and for removing it therefrom. The installation further includes a support for receiving at least one wafer of a second size that is smaller than the first size, the shape of the support allowing it to be grasped by the grasping element and received by the wafer support device in the tank.

Abstract: In one aspect, the invention includes a method of improving uniformity of liquid deposition when a liquid is spin-coated over a non-circular substrate. The substrate is retained on a platform and spun. The circular platform includes a plurality of shaping members pivotally connected to the platform. The plurality of shaping members are biased by spinning the platform to form a platform surface with a circular periphery. In another aspect, the invention includes a substrate coating apparatus. Such apparatus comprises a non-circular substrate support configured to support a substrate with a planar surface and non-circular periphery. The apparatus further comprises a motor configured to spin the substrate support. A plurality of shaping members are pivotally connected with the substrate support and each shaping member has a curved outer side surface.

Abstract: An apparatus and method for holding a substrate on a support layer in a processing chamber. The method includes the steps of positioning the substrate a predetermined distance from the support layer, introducing a plasma in the processing chamber, lowering the substrate to a point where the substrate engages the support layer, and maintaining the plasma for a predetermined time. The apparatus is directed to a susceptor system for a processing chamber in which a substrate is electrostatically held essentially flat. The apparatus includes a substrate support and a support layer composed of a dielectric material disposed on the substrate support. At least one lift pin is used for supporting the substrate relative to the support layer. Means are provided for moving each lift pin relative to the support layer. Means are also provided for producing a plasma within the processing chamber.

Abstract: An electrode forming apparatus for electric parts has a tape and a driving mechanism. The tape has holding holes for holding board-shaped electric parts therein at regular intervals and feeding holes for feeding the tape at regular intervals. The driving mechanism can feed the tape by engaging with the feeding holes of the tape. A pasting unit applies electric conductive paste to the electric parts held by the holding holes of the tape fed by the driving mechanism, in order to form a electrode. Each of the holding holes has a pair of abutting edges for abutting on both opposite surfaces of the board-shaped electric parts and at least one cutout portion formed from the butting edges. Due to the above constitution, the board-shaped electric parts can be held and conveyed by the abutting edges of the holding hole.

Abstract: A method and apparatus are provided for supporting a semiconductor wafer in a vacuum and transferring heat by gas conduction between the wafer and a wafer chuck to facilitate wafer processing. The wafer substrate is loaded onto a seat plate, and then a clamp ring is lowered against the force of compression springs that bias the seat plate upward on guides extending upward from the body of the chuck. The clamp ring touches the wafer on the front or top side with an inner O-ring that is attached to the bottom of the clamp ring, and forces the wafer and the seat plate down to a lower position parallel to a heat transfer surface of the chuck, spaced therefrom by a narrow gap. In the lower position, an outer O-ring that is also attached to the bottom of the clamp contacts an outer sealing surface that surrounds the heat transfer surface, thereby enclosing a cavity that includes an annular chamber around the outside of the chuck and the narrow gap. Gas is supplied to the passage and thus to the gap.

Abstract: An apparatus for forming a loop in a filament comprising a first wall having a first guide slot formed therein and a second wall having a second guide slot formed therein coplanar and parallel to the first guide slot. The first wall is opposite the second wall and each of the guide slots has opposing ends. A first gripper holds a filament at a first location. The first gripper is mounted from the first wall to the second wall at an end of each of the first guide slot and the second guide slot. The apparatus also includes a movable gripper to hold the filament at a second location. The movable gripper has a separation from the first gripper and is mounted from the first wall to the second wall adjacent to the other end of each of the first guide slot and the second guide slot for movement towards the first gripper to reduce the separation between them. This produces a loop of filament between the first gripper and the moveable gripper.

Abstract: The invention relates to a method and an arrangement in connection with coating of an optical fibre, in which a first fibre (3a) is directed from a fibre pay-off forward in the process via a press head (2a) forming the coating, and when the first fibre (3a) ends, a new fibre (3b) is directed to the press head (2a) in advance, and when the first fibre (3a) ends, a roll device (7) grips both the first fibre and the new fibre so that both fibres (3a, 3b) are caught between freely rotating rolls (7a, 7b) of the roll device (7), whereupon the tail of the first fibre (3a) makes the rolls (7a, 7b) of the roll device rotate, and the rotational movement of the rolls pushes the new fibre (3b) to the press head (2a) at a speed equal to that of the line.

Abstract: Provided herein is a method of improving the planarity of a support plate of a susceptor for use during deposition of a film of material onto a substrate comprising the steps of reducing pressure in a hollow core of a shaft to a level below atmospheric pressure; and reducing a pressure in the deposition chamber to a level required for the deposition of the film of material onto the substrate, where the pressure in the hollow core of the shaft acts upon a lower surface of the support plate connected to the shaft and interfacing with the hollow core of the shaft and the pressure in the deposition chamber acts upon an upper surface of the support plate adapted to support the substrate thereby improving planarity. Also provided are a susceptor and a method of depositing a film onto a substrate affixed to the susceptor of the present invention.

Abstract: The present invention relates to an electroless plating apparatus which can reduce the amount of a plating liquid to be used, maintain a stable plating process, be downsized, reduce an apparatus cost, form a film having a uniform thickness over an entire surface, and prevent a plating liquid from being deteriorated due to a temperature rise. The present invention comprises a holding apparatus for holding a substrate with a surface, to be plated, facing upward, a plating liquid holding mechanism for sealing a periphery of the surface, to be plated, of the substrate held by the holding apparatus, an electroless plating treatment liquid supply apparatus for supplying an electroless plating liquid to the surface, to be plated, of the substrate sealed by the plating liquid holding mechanism to allow the supplied electroless plating liquid to be stored on the substrate, and a heating apparatus provided below the substrate.