Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.

Abstract: A power cable includes a conductor having a first section, a second section, and a weld metal located axially between the sections. The first section includes a central element made of a first metal and an outer structure made of a second metal surrounding the central element. The second section includes the second metal. An axial end section of the first section extends to the weld metal and includes a central axially extending member surrounded by the outer structure, wherein the member includes a first axial part made of the first metal and a second axial part made of the second metal. The first axial part has a first end welded to the central element and a second end welded to a first end of the second axial part. A second end of the second axial part and the outer structure are welded to the second section via the weld metal.

Abstract: Device for solidifying a coating layer hot deposited on a wire, corresponding installation and method. The device comprises a cooling liquid injection chamber with a liquid inlet and a wire inlet, a cooling chamber with a liquid outlet and a wire outlet, and a partition arranged between the injection and cooling chambers, comprising a wire passage. It also has a conduit for separating the wire. The partition comprises channels fluidically connecting the injection chamber with the cooling chamber and leading into the center of the wire passage in an eccentric manner and being inclined forming an angle (?) with respect to a longitudinal direction. This directs a jet of cooling liquid on the wire in the direction from the injection chamber towards the cooling chamber.

Abstract: An apparatus for treating a substrate includes a vessel having a sealable process space formed therein in which the substrate is accommodated, a supply port that is provided inside a wall of the vessel and that supplies a process fluid into the process space, an exhaust port provided inside the wall of the vessel and spaced apart from the supply port, and a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above. The buffer member includes a sidewall portion that is located outward of the supply port and the exhaust port and that makes contact with the wall of the vessel and an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, the through-hole forming a straight flow path in an up/down direction.

Abstract: A processing apparatus includes a delivery unit for delivering a workpiece between a cassette placed on a cassette rest and a chuck table and a measuring unit for measuring a thickness of the workpiece. The delivery unit includes a base having a non-contact-type suction holder for ejecting air to develop a negative pressure to attract and hold the workpiece under suction out of contact therewith, and a moving unit for moving the base. The height of the non-contact-type suction holder is adjusted according to the thickness of the workpiece measured by the measuring unit to place the non-contact-type suction holder in a position that is spaced from a face side of the workpiece by a distance in a predetermined range while the workpiece is being delivered by the delivery unit.

Abstract: A mask sheet has a first side face and a second side face that are substantially parallel to each other and arranged oppositely. The first side face is perpendicular to a thickness direction of the mask sheet. The mask sheet includes: at least one opening portion, each opening portion including a first opening extending from the first side face toward the second side face and a second opening extending from the second side face toward the first side face, and the first opening and the second opening are communicated with each other, and an inner border of the second opening being located within an outer border of the first opening in a direction perpendicular to a circumferential direction of the second opening; at least one groove located on a periphery of the second opening, the at least one groove being formed in the second side face of the mask sheet.

Abstract: According to one embodiment, a semiconductor manufacturing apparatus member includes a base and a particle-resistant layer. The base includes a first surface, a second surface crossing the first surface, and an edge portion connecting the first surface and the second surface. The particle-resistant layer includes a polycrystalline ceramic and covering the first surface, the second surface, and the edge portion. The particle-resistant layer includes a first particle-resistant layer provided at the edge portion, and a second particle-resistant layer provided at the first surface. A particle resistance of the first particle-resistant layer is higher than a particle resistance of the second particle-resistant layer.

Abstract: An upper flow passage 181 is connected to a buffer space 182. The upper flow passage 181 has a constant cross-sectional shape and a processing fluid flows as a laminar flow in the upper flow passage 181. On the other hand, the buffer space 182 has a larger flow passage cross-sectional area than the upper flow passage 181. Thus, the processing fluid flowing in the upper flow passage 181 is released at once into the wide buffer space 182, whereby the pressure of the processing fluid decreases. A backflow of the processing fluid from the buffer space 182 to the upper flow passage 181 is prevented due to this pressure difference and the magnitude of a flow passage resistance of the upper flow passage 181 viewed from the buffer space 182.

Abstract: Device for solidifying a coating layer hot deposited on a wire-, corresponding installation and method. The device comprises a cooling liquid injection chamber with a liquid inlet and a wire inlet, a cooling chamber with a liquid outlet and a wire outlet, and a partition arranged between the injection and cooling chambers, comprising a wire passage. It also has a conduit for separating the wire. The partition comprises channels fluidically connecting the injection chamber with the cooling chamber and leading into the center of the wire passage in an eccentric manner and being inclined forming an angle with respect to a longitudinal direction-. This directs a jet of cooling liquid on the wire in the direction from the injection chamber towards the cooling chamber.

Abstract: The present disclosure provides an exhaust module for exhausting an exhaust from at least one wafer baking apparatus having an exhaust port. The exhaust module includes at least one pipeline, a heating unit, a solvent dispensing unit, and a filtering unit. The at least one pipeline is connected to the exhaust port of the wafer baking apparatus and configured to exhaust the exhaust gas from the wafer baking apparatus. The heating unit is connected to the pipeline and configured to heat the exhaust gas. The solvent dispensing unit is connected to the heating unit and configured to dispense a solvent to cool and dissolve the exhaust gas. The filtering unit is connected to the solvent dispensing unit and configured to filter the solvent.

Abstract: A device for coating a wire with polymer fibers and method thereof are provided. The device includes a wire holder unit fixing both ends of a wire, a fiber forming unit including a first fiber forming module and a second fiber forming module that receive a polymer solution, face each other, and form fibers while approaching each other and retreating from each other, and a control unit adjusting a tension of the wire by controlling the wire holder unit and crossing the wire and the fibers by controlling the fiber forming unit. The fiber forming unit rotates the wire along an axis which extends in a longitudinal direction of the wire. The fibers are attached and coated on the wire when the wire and the fibers cross each other. The wire coating method can improve an adsorption state of coated fibers by including a post-processing step.

Abstract: A drug coating layer that prevents breakage of elongated drug crystals on a balloon surface while maintaining the drug crystals in an appropriate shape to act on the living body includes plural elongated bodies which are crystals of a water-insoluble drug each extending from the surface of the balloon at various lengths and angles, and a water-soluble additive layer provided in a space between an outer surface of an aggregate of the elongated bodies and the balloon surface to fill a space between the elongated bodies. The outer surface of the additive layer being located outside the aggregate, being uneven connecting a plurality of tip ends and side surfaces of the elongated bodies to each other. The tip ends of the elongated bodies slightly protrude from the additive layer, and the side surfaces and/or tip surfaces of the elongated body are exposed on the surface of the additive layer.

Abstract: A method, system, and apparatus for cooling a product comprises a chilling assembly further comprising a liquid flow assembly including a main conduit, at least one delivery conduit attached to the main conduit, and at least one nozzle attached to the delivery conduit wherein liquid is distributed onto a product from the at least one nozzle; and an airflow assembly including an air pump and at least one input conduit wherein the air pump drives airflow through the input conduit; a conveyor assembly conveys the product through the chilling assembly and a drain pan is configured below the conveyor assembly for collecting drainage and waste.

Abstract: Stacked thermal process chamber module for remote radiative heating of semiconductor device workpieces. A stacked thermal process module may include a stack of thermal process chambers and one or more generators of electromagnetic radiation. The electromagnetic radiation may be transported from a generator remote from the process chambers through one or more waveguides, thereby minimizing the volume and/or cleanroom footprint of the stacked thermal process chamber module. A waveguide may terminate in a process chamber so that electromagnetic radiation delivered during a thermal process may be coupled into one or more materials of the workpiece. The radiative heating process may overcome many of the limitations of thermal process chambers that instead employ a local heat source located within a process chamber.

Abstract: Examples of a method for teaching a transportation position includes correcting the position of an alignment jig having a plurality of sloping surfaces relative to a susceptor pin projecting upwards from an upper surface of a susceptor by lowering a robot hand to bring one of the sloping surfaces into contact with the susceptor pin and causing the susceptor pin to slide on the sloping surfaces by virtue of an own weight of the aliment jig, detecting a position of the alignment jig before and after the positional correction of the alignment jig, and correcting a movement destination information by an amount corresponding to a difference between an initial position and a corrected position of the alignment jig.

Abstract: The present disclosure generally relate to a semiconductor processing apparatus. In one embodiment, a processing chamber is disclosed herein. The processing chamber includes a chamber body and lid defining an interior volume, the lid configured to support a housing having a cap, a substrate support disposed in the interior volume, a vaporizer coupled to the cap and having an outlet open to the interior volume of the processing chamber, wherein the vaporizer is configured to deliver a precursor gas to a processing region defined between the vaporizer and the substrate support, and a heater disposed adjacent to the vaporizer, wherein the heater is configured to heat the vaporizer.

Abstract: A height adjustable solar panel mounting assembly with an asymmetric lower bracket is disclosed. The asymmetric lower bracket includes a flat support ledge on a first side of the asymmetric lower bracket and a tilted spring support ledge on a second side of the asymmetric lower bracket, where the first side is opposite from the second side. A central box frame is defined by the asymmetric lower bracket where a helical drive element is receivable in the central box frame.

Abstract: A thermal spray assembly (10) for transforming precursor material (60) into a layer of deposited material joined to a substrate body. A plasma torch produces a plasma jet from a plasma nozzle (28) and a feeder mechanism (30) guides the precursor material into the plasma jet in use and is capable of providing a feeder orifice when in an open condition. The feeder mechanism (30) is provided with a distribution chamber configured for guiding moving precursor material azimuthally around the plasma torch, a plurality of deflector structures (38) configured for deflecting the precursor material (60) from the distribution chamber and guiding it into a guide chamber configured for guiding the precursor material (60) to the plasma jet in use.

Abstract: A method for treating workpieces that consist of porous carbon material with liquid silicon with the formation of silicon carbide, comprising the steps: Preheating porous carbon workpieces under inert gas to the selected operating temperature TB1, feeding liquid silicon to the porous carbon workpieces at an operating pressure pB2 and an operating temperature TB2, and impregnating the porous carbon workpieces with liquid silicon, reaction of the liquid silicon in the workpiece at a temperature TB3 with the formation of silicon carbide that consists of carbon and silicon, gassing the workpiece with inert gas and cooling from the operating temperature TB3 to the conditioning temperature Tk, cooling the workpieces to room temperature, the temperature TB3 being greater than or equal to the temperature TB2, and the workpiece in step d of the method no longer being in contact with liquid silicon outside of the workpiece.

Abstract: An induction furnace for heating a workpiece includes a chamber and an insulation cylinder positioned therein, with the insulation cylinder including a base cover movable between first and second positions, and the first position positioning the workpiece within a heating zone and the second position positioning the workpiece within a cooling zone. A translation system in the furnace includes a first member coupled to the base cover of the insulation cylinder and extending through a wall of the chamber, an actuator coupled to the first member, the actuator configured to translate the first member to move the base cover of the insulation cylinder between the first and second positions, and an expansion member encircling a portion of the first member and configured to hermetically seal an interior volume of the chamber from an environment volume external to the chamber.

Abstract: An induction furnace for heating a workpiece includes a chamber and an insulation cylinder positioned therein, with the insulation cylinder including a base cover movable between first and second positions, and the first position positioning the workpiece within a heating zone and the second position positioning the workpiece within a cooling zone. A translation system in the furnace includes a first member coupled to the base cover of the insulation cylinder and extending through a wall of the chamber, an actuator coupled to the first member, the actuator configured to translate the first member to move the base cover of the insulation cylinder between the first and second positions, and an expansion member encircling a portion of the first member and configured to hermetically seal an interior volume of the chamber from an environment volume external to the chamber.

Abstract: A system for heating, coating, cooling and screening a granular substrate is provided. The system, such as an apparatus for continuous coating granular particles, includes a preheater apparatus for heating granular particles, a rotary drum having an inlet horizontally coupled to the preheater for receiving heated granular particles directly from the fluidized bed preheater, a coating apparatus positioned within the drum for applying a coating to the heated granular particles, and a cooling apparatus positioned horizontally in association with the drum for cooling the granular particles subsequent to coating.

Abstract: Apparatus and method for applying a water-based emulsion of silicone fluid to a printed web required to be cooled, such that evaporative cooling of the web is promoted in addition to coating of said web with a silicone material. Water evaporated following the application of the silicone fluid to the web is recovered by condensation on the applicator(s) and reapplied to the web, thus economizing the amount of silicone fluid mixture necessary to provide both cooling and enhanced slip characteristics necessary for further handling and processing of the web. The condensation step is effected by containing the evaporated water from the web within a compact enclosure enveloping both the applicator(s) and the web, and optionally chilling said applicator(s) with a cooling medium, preferably water, by means of said cooling medium flowing through at least one of the applicators.

Abstract: This disclosure relates to a thermal spray coating system including a table that is configured to support a component. A spray torch is configured to direct a thermal spray at a component surface. A cooling device is arranged adjacent to spray torch and configured to be in close proximity to the component surface. The cooling device includes a manifold that is connected to an air supply. The manifold has a face with multiple impingement holes less than one-eighth inch (3.1 mm) in diameter that are configured to direct cooling air on the component surface. In one example, the diameter of the impingement holes is approximately 0.059 inch (1.5 mm) and provide cooling air at a velocity of at least 400 ft per second (122 meters per second). The face is arranged within one inch (25 mm) of the component surface, in one example. Accordingly, the above cooling device uses less air and yields more consistent results in thermal coating of the component.

Abstract: The present disclosure relates to extrusion coating systems, extrusion coated substrates, and processes for making the same. In some aspects, extrusion coating systems as described herein may include an at least partially insulated outlet wall, which may facilitate production of coated substrates exhibiting a very desirable surface texture and appearance. Coated substrates of the present invention may be utilized in a variety of end applications, including, but not limited to, interior and exterior construction materials for homes, buildings, and furniture.

Abstract: A cooling pedestal for supporting a substrate, comprises a support structure having cooling conduits to flow a fluid therethrough to cool the substrate, and a contact surface comprising a coating of a diamond-like carbon. The coating comprises (i) a coefficient of friction of less than about 0.3, (ii) an average surface roughness of less than about 0.4 micrometers, and (iii) a microhardness of at least about 8 GPa.

Abstract: A method of forming a capsule, comprising: encapsulating a body of solid core material with a coating material and converting the core material from a solid to a liquid to form a capsule having a liquid core encapsulated by a solid coating. An apparatus configured to perform the method is also described.

Abstract: Coating rollers accepting liquid media provide liquid chemicals to substrates for depositing a thin coating layer on the flat substrates, such as semiconductors or panels. The liquid media is cooled to a life-preserving temperature while shielded from the thermal energy heating the substrates to prevent degrading the liquid media. Physical barrier or temperature barrier can be established in vicinities of the rollers to further limit exposing the liquid media to high temperature.

Abstract: A method for treating a carbonaceous material comprising heating a carbonaceous material to form a mixture of the carbonaceous material and a tar; cooling the mixture of the carbonaceous material and the tar; and coating a surface of the carbonaceous material with the tar to form a tar-coated carbonaceous material, and a system related thereto.

Abstract: Before the end of the treatment of metal parts in a molten salt bath nitriding/nitrocarburizing station, a chamber, arranged so that the oxygen contained in the chamber can be discharged in order to create an inert atmosphere, is filled with a refrigerant in liquid form and with a strong capacity for volume expansion as it evaporates. All the parts treated are transferred into the chamber. The chamber is closed, and the parts are left in the chamber for a preset length of time to reach a temperature at which the salt congeals and forms a protective barrier. The parts are then removed and subjected to a rinsing operation.

Abstract: Embodiments of the present disclosure relate to apparatus and methods for forming particles of cathode active materials with a thin protective coating layer. The thin protective coating layer improves cycle and safety performance of the cathode active material. A coating precursor may be added at various stages during formation of the particles of cathode active materials. The thin layer of chemical may be a complete coating or a partial coating. The coating may include a thin layer of chemicals, such as an oxide, to improve cycle performance and safety performance of the cathode active material.

Abstract: A capsule forming apparatus comprising a plurality of outputs configured to output capsule materials, a tank for housing a first capsule material and being configured to supply the first capsule material to the outputs and at least one conduit being configured to convey a second capsule material to the outputs. A method for forming capsules is also described.

Abstract: The present disclosure relates to extrusion coating systems, extrusion coated substrates, and processes for making the same. In some aspects, extrusion coating systems as described herein may include an at least partially insulated outlet wall, which may facilitate production of coated substrates exhibiting a very desirable surface texture and appearance. Coated substrates of the present invention may be utilized in a variety of end applications, including, but not limited to, interior and exterior construction materials for homes, buildings, and furniture.

Abstract: An apparatus and associated method are generally described as a thin film exhibiting a tuned anisotropy and magnetic moment. Various embodiments may form a magnetic layer that is tuned to a predetermined anisotropy and magnetic moment through deposition of a material on a substrate cooled to a predetermined substrate temperature.

Abstract: Coating rollers accepting liquid media provide liquid chemicals to substrates for depositing a thin coating layer on the flat substrates, such as semiconductors or panels. The liquid media is cooled to a life-preserving temperature while shielded from the thermal energy heating the substrates to prevent degrading the liquid media. Physical barrier or temperature barrier can be established in vicinities of the rollers to further limit exposing the liquid media to high temperature.

Abstract: Thermal management of film deposition processes. In one aspect, a deposition system includes a vacuum chamber defining an evacuated interior volume, a deposition source disposed within the interior volume, a substrate holder disposed within the interior volume and arranged to hold a substrate with a first surface of the substrate facing the deposition source and a second surface of the substrate disposed facing away from the deposition source, and a heat sink disposed to have a first side of the heat sink in radiative thermal contact with the second surface of the substrate held by the substrate holder, the first side of the heat sink comprising a collection of features having a longitudinal dimension that is four or more times larger than a lateral dimension between the features, the features thereby dimensioned and aligned to reflect, multiple times in succession, radiative thermal emissions of the second surface of the substrate.

Abstract: An extrusion system is described herein. The extrusion system includes a die and tip defining an extrusion cavity, the extrusion cavity configured to receive heated material for extrusion and coating one or more wires. Furthermore, an exit region of the die is configured to be cooled to a temperature less than that of the heated material during coating the one or more wires.

Abstract: A system and a method for providing a film having a matte finish. The system includes means for providing a coated substrate, the coated substrate comprising a first coatable material applied to a substrate, the coatable material forming a first major surface of the coated substrate; means for changing the viscosity of the first coatable material from a first viscosity to a second viscosity; a face-side roller having an outer surface positioned to contact the first major surface of the coated substrate to impart a matte finish thereon; and optionally, means for hardening the first coatable material.

Abstract: An organic material deposition system and method are provided. The organic material deposition apparatus may include a chamber having a processing space formed therein, a source supply device that generates an organic source and injects and diffuses the organic source into the processing space through a shower head provided in the processing space. The substrate is supported by a stage device that moves the substrate upward and downward within the processing space to adjust a distance between the substrate and the shower head. A pumping port provided at an upper positioned at an upper portion of the processing space provides a vacuum exhaust path that directs flow through the processing space toward the stage device. This allows an organic thin film with a uniform thickness to be deposited using an apparatus with a relatively simple configuration.

Abstract: A process for production of a granular urea product in a fluidized-bed where: small droplets (10) of fresh urea melt are contacted with a cooling medium to form solid particles, said solid particles (11) are contacted with droplets of urea melt (12) which are larger than said germ particles, the solid particles and said droplets forming together larger solid particles (13), and said solid particles further increasing their size step by step and upon contact with droplets of urea melt, until the solid particles reaches a given size, and said solid particles are then subject to a further growing process by contact with liquid droplets now smaller than the solid particles, until a desired size of the granular product is reached.

Abstract: A method for producing a printed product with raised print includes receiving a prepress format document containing a plurality of flat ink color separations and at least one raised print color separation, printing onto a substrate the flat ink color separations using flat ink and the at least one raised print color separation using dimensional ink, allowing the flat and dimensional ink to dry, heating the inked substrate to a temperature that causes the applied dimensional ink to become sticky, applying thermographic powder to the heated inked substrate such that the thermographic powder sticks to the sticky dimensional ink, removing the thermographic powder from regions of the substrate where the dimensional ink is not applied, reheating the sheet to melt the thermographic powder, and cooling the sheet to result in a print product having both flat and raised printed content.

Abstract: The present invention is a method of developing a resist film on a substrate using a developing solution at a predetermined temperature lower than room temperature, including a first cooling step of mounting and cooling the substrate on a cooling plate at a temperature lower than room temperature and higher than the predetermined temperature in a cooling apparatus; a second cooling step of then carrying the substrate into a developing apparatus and supplying a rinse solution at the predetermined temperature or lower onto the substrate to cool the substrate in the developing apparatus; a developing step of then supplying the developing solution onto the substrate and developing the resist film on the substrate to form a resist pattern in the resist film; and a cleaning step of then supplying a rinse solution at the predetermined temperature onto the substrate to clean a front surface of the substrate.

Abstract: A method of making a liquid discharge head which includes a nozzle to discharge liquid, a pressure chamber communicating with the nozzle, a pressure chamber substrate to form surfaces of the pressure chamber, and a piezoelectric actuator to apply pressure to liquid in the pressure chamber having a lower electrode, a ferroelectric film, and an upper electrode, includes a silicon wafer supplying process, a position adjustment process, a surface treatment process to reform a surface of the lower electrode, a liquid applying process to apply ferroelectric precursor on the lower electrode by an inkjet method, a heating process to heat the ferroelectric precursor film, and a cooling process. A series of processes from the position adjustment process to the cooling process is iterated to form a ferroelectric film having a predetermined thickness. The series of processes is performed with certain waiting times inserted between key processes.

Abstract: An object is to improve use efficiency of an evaporation material, to reduce manufacturing cost of a light-emitting device, and to reduce manufacturing time needed for a light-emitting device including a layer containing an organic compound. The pressure of a film formation chamber is reduced, a plate is rapidly heated by heat conduction or heat radiation by using a heat source, a material layer on a plate is vaporized in a short time to be evaporated to a substrate on which the material layer is to be formed (formation substrate), and then the material layer is formed on the formation substrate. The area of the plate that is heated rapidly is set to have the same size as the formation substrate and film formation on the formation substrate is completed by one application of heat.

Abstract: Apparatus for assembling a semiconductor device has a plate with body and a surface heatable to a controlled a temperature profile from location to location across the plate. Mesas at same temperature of plate protrude from the surface are configured to support a portion of the substrate. Movable capillaries have openings for blowing cooled gas onto selected locations of the assembly. At least one movable syringe movable has an opening for dispensing a polymer precursor.

Abstract: An apparatus for forming an amorphous coating film by jetting flame containing particles of a flame spray material from a flame spray gun toward a base material, causing the particles to be melted by the flame, and cooling both the particles and the flame with the means of a cooling gas before they reach the base material. The apparatus includes a tubular member provided among the path along which the flame is jetted that it surrounds the flame passing through a melting zone in which the particles are melted. The tubular member has a flow channel for the cooling gas, formed along and integrally to the tubular member.

Abstract: A device for metal coating of fibers, for example ceramic fibers, by a liquid process, the device including a crucible containing a liquid metal bath through which a fiber is drawn to be coated with the metal, and a cooling system positioned downstream from the metal bath to solidify the metal sheath created around the fiber by capillarity. The cooling system includes at least one nozzle for ejecting a compressed gas towards the coated fiber, and the system is sized such as to solidify the metal on the periphery of the coated fiber over a length of no more than 200 mm.

Abstract: Systems and processes for treatment of a cadmium telluride thin film photovoltaic device are generally provided. The systems can include a treatment system and a conveyor system. The treatment system includes a preheating section, a treatment chamber, and an anneal oven that are integrally interconnected within the treatment system. The conveyor system is operably disposed within the treatment system and configured for transporting substrates in a serial arrangement into and through the preheat section, into and through the treatment chamber, and into and through the anneal oven at a controlled speed. The treatment chamber is configured for applying a material to a thin film on a surface of the substrate and the anneal oven is configured to heat the substrate to an annealing temperature as the substrates are continuously conveyed by the conveyor system through the treatment chamber.

Abstract: The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.