Abstract: A cart for carrying a cut-off saw having a saw blade. The cart includes a frame with upper and lower portions, a wheel arm pivotably coupled to the lower portion about a first axis, and a rear wheel assembly coaxial with the first axis and coupled to the frame and the wheel arm. The cart includes a front wheel coupled to an end of the wheel arm opposite the rear wheel assembly, an adjustment lever pivotably coupled to the upper portion about a second axis, and a link having a first end pivotably coupled to the adjustment lever and spaced from the second axis, and a second end pivotably coupled to the wheel arm between the first axis and the front wheel. Pivoting the adjustment lever about the second axis pivots the wheel arm about the first axis to adjust a vertical position of the front wheel relative to the upper portion.

Abstract: An apparatus can include a first material support member and a second material support member each configured to removably attach to a tile tray. The material support members can define a linear saw blade slot through which a saw blade extends while cutting a planar material. The apparatus also can include a first paddle and a second paddle each configured to interpose a respective portion of the planar material between the respective paddle and a respective one of the material support members. Each of the paddles further can be configured to engage the respective material support member using an alignment pin that fixes a position of the paddle relative to the position of the respective material support member.

Abstract: A hand-held power tool for machining a workpiece, comprising a drive motor, a tool holder, which can be driven by the drive motor, and which is for a working tool for machining the workpiece, and a guide element having a guide surface for guiding the hand-held power tool on the workpiece in a working direction, wherein the tool holder is mounted via a bearing arrangement such that it moves relative to the guide element and the tool holder can be driven by a servo motor arrangement, wherein the hand-held power tool can be swivelled via the bearing arrangement about at least one adjusting swivel axis passing through the guide surface at an angle, in particular at a right angle, for the relative adjustment of the tool holder relative to the guide element, wherein the hand-held power tool has a control device for controlling the servo motor arrangement.

Abstract: A method for cutting or otherwise removing material from an inorganic substrate (e.g., a substrate formed from a cementitious material, such as concrete, or stone, etc.) includes applying an aqueous solution that includes a hardener/densifier to the inorganic substrate and/or to a removal element (e.g., a saw blade, an abrasive wheel, a grinding disk, etc.), the inorganic substrate or material removed from the inorganic substrate as the removal element removes material from the inorganic substrate. A system for removing material from an inorganic substrate includes a removal element and an aqueous solution that includes a hardener/densifier.

Abstract: Tool cores may have removable sections, which may be removable without damaging, cutting or severing attachment configurations for the removable sections. The removable sections may be handled simultaneously. Moving parts used to facilitate removal of the removable sections may be secured in a pre-loaded configuration.

Abstract: A tile saw includes a saw unit having a motor and a saw blade driven by the motor, a table through which the saw blade at least partially protrudes, and a pan positioned underneath the table and including a channel configured to receive at least a portion of the saw blade. The channel extends along a longitudinal axis perpendicular to a rotational axis of the saw blade such that fluid moves through the channel in a first direction in response to rotation of the saw blade. An interior wall is positioned adjacent the channel. The interior wall is obliquely oriented relative to the longitudinal axis of the channel to redirect the fluid in a second direction that is different from the first direction.

Abstract: A roof cutter and a method of cutting a roof is provided. The roof cutter includes a base that is movable between a retracted configuration and a cutting configuration. In the retracted configuration, the blade is displaced from the roof. In the cutting configuration, the blade is positioned so as to facilitate cutting of the roof. The roof cutter includes a stop assembly and an engagement member that is configured to engage with the stop assembly when the base is in the cutting configuration, thereby establishing a maximum cutting depth. A dampening mechanism softens impacts associated with the blade moving to the cutting depth and absorbs vibrations associated with cutting the roof at the cutting depth. An adjustment assembly is configured to selectively adjust the cutting depth and/or to selectively restrain the base in the retracted configuration, thereby preventing the blade from cutting the roof.

Abstract: A power tool includes a rotatable support arrangement for supporting at least one cutting disc. An upper shroud member and a lower shroud member cooperate to define a volume in which the at least one cutting disc can be supported. The rotatable support arrangement can be coupled to the upper shroud member such that movement of the upper shroud member towards the lower shroud member causes the cutting disc to protrude through an opening in the lower shroud member. A biasing member urges the upper shroud member and the lower shroud member away from each other. A limiting mechanism limits the range of movement of the upper shroud member relative to the lower shroud member under action of the biasing member. The limiting mechanism can be disengaged by opening the upper shroud member via at least one hinge coupling.

Abstract: A cutting apparatus is provided with a cutting unit. The cutting unit includes a spindle on which a cutting blade is mounted for rotation, a spindle housing that rotatably supports the spindle, a blade cover that is attached to the spindle housing and covers the cutting blade, a cutting water supply nozzle that supplies cutting water to the cutting blade, and a blade monitor that has an end face configured to monitor a cutting edge of the cutting blade. The end face of the blade monitor has a recessed portion to which rinsing water is supplied to rinse the end face.

Abstract: A cutting apparatus includes a chuck table for holding a workpiece thereon, a cutting unit for cutting the workpiece held on the chuck table with a cutting blade secured in place on a distal-end portion of a spindle by a mount flange mounted on the distal-end portion of the spindle, an indexing feed unit for moving the cutting unit in indexing feed directions parallel to axial directions of the spindle, a processing feed unit for moving the chuck table in processing feed directions perpendicular to the indexing feed directions, and an end face correction unit for correcting an end face of the mount flange that supports the cutting blade in contact therewith. The processing feed unit includes a table moving base that supports the chuck table thereon and an actuating mechanism for moving the table moving base. The end face correction unit is fixedly mounted on the table moving base.

Abstract: A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region having a plurality of devices formed thereon and a peripheral surplus region surrounding the device region are formed, the protective sheet disposing method including: a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion; a protective sheet affixing step of affixing the first protective sheet to the peripheral surplus region; a liquid resin dropping step of dropping a liquid resin onto a region of a second protective sheet; an integrating step of integrating the first protective sheet and the second protective sheet with each other; and a cutting step of cutting the first protective sheet and the second protective sheet.

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

Abstract: The present invention relates to a laying machine for laying at least one flexible casing or tube, cable or wire including: a blade arrangement for making a trench in the ground, a consolidation and laying means being arranged behind the blade arrangement, for clearing and safe-guarding the trench from collapsing while laying at least one flexible casing or tube, cable or wire into the trench. A blade assembly comprising compartments for cooling fluid and air.

Abstract: An apparatus for cutting grooves in a ground surface includes a wheeled vehicle with a tool carrier connected to the wheeled vehicle. The tool carrier is rotatable about an axis parallel to the direction of travel of the vehicle and perpendicular to the direction of travel of the vehicle. A grinding tool for cutting grooves in a ground surface is rotatably mounted to the tool carrier. The grinding tool may be movable laterally relative to the vehicle. A rotatable cam is configured so that rotation of the cam causes pivotal movement of the tool carrier relative to the forward frame. Rotation of the cam moves the grinding tool into and out of engagement with the ground surface.

Abstract: A substrate processing apparatus 1 is configured to supply a processing liquid to a peripheral portion of a wafer W being rotated. The substrate processing apparatus 1 includes a rotating/holding unit 21 configured to rotate and hold the wafer W; a processing liquid discharging unit 73 configured to discharge the processing liquid toward the peripheral portion of the wafer W held by the rotating/holding unit 21; a variation width acquiring unit configured to acquire information upon a variation width of a deformation amount of the peripheral portion of the wafer W; and a discharge controller 7 configured to control a discharge angle and a discharge position of the processing liquid from the processing liquid discharging unit 73 onto the peripheral portion based on the information upon the variation width of the deformation amount of the peripheral portion acquired by the variation width acquiring unit.

Abstract: A device for cutting a mat or panel made of mineral wool or a board or panel made of porous construction material, including a system for moving the mat or panel made of mineral wool or the board or panel made of porous construction material, which includes at least one conveyor, capable of moving along a direction, an endless diamond element designed to cut the mat or panel made of mineral wool or the board or panel made of porous construction material, a device for running the endless diamond element in a direction perpendicular to the direction of movement of the mat or panel made of mineral wool or the board or panel made of porous construction material, the endless diamond element being an endless diamond wire, an endless diamond cable or an endless diamond strip.

Abstract: A cutting apparatus includes: a processing feeding unit that performs processing feeding of a chuck table adapted to hold a workpiece; and two cutting units in which rotational axes of two spindles coincide with each other and cutting blades mounted to the spindles face each other. Each cutting unit includes a flange mechanism in which the cutting blade having a cutting edge fixed to an outer peripheral edge of a one-side outer surface of a circular disk-shaped base is fixed to the spindle. The flange mechanism is fixed to a tip of the spindle, sucks an other-side outer surface of the base of the cutting blade, and fixes the cutting blade to the spindle with the one-side outer surface of the base exposed to the side of the tip of the spindle, and the one-side outer surfaces of the cutting blades fixed to the two cutting units.

Abstract: A power tool and methods are provided for detecting objects (e.g., flesh or other materials) in the operating path of a power tool's output component (e.g., saw blade or drill bit). An object detection sensor in the power tool generates an output signal indicative of a type of material detected in the operating path of the power tool. A power tool controller receives the object detection sensor output and determines when a material in the operating path of the power tool changes. The controller changes operation of a motor of the power tool (e.g., increasing or decreasing speed or stopping the motor) in response to the detected material change. The object detection sensor may include, for example, an RF sensor, a capacitive sensor, a camera, a conductivity probe, or an ultrasound probe.

Abstract: A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.

Abstract: A cutting apparatus includes a processing feed direction determining mechanism. The processing feed direction determining mechanism includes an imaging unit that images a region including a cut groove and a recording unit that records chipping data of the imaged cut groove. The recording unit records first chipping data of a cut groove formed by cutting a workpiece from a first direction, second chipping data of a cut groove formed by cutting the workpiece from a direction opposite from the first direction, third chipping data of a cut groove formed by cutting the workpiece from a second direction orthogonal to the first direction, and fourth chipping data of a cut groove formed by cutting the workpiece from a direction opposite from the second direction.

Abstract: A cleaning device includes: a lens cover configured to cover an object lens of a camera provided in a machining area of a machine tool, the lens cover being transparent; a motor configured to rotate the lens cover; and a wiping member configured to, when the lens cover rotates, wipe at least an adhering substance that has adhered to a region of the lens cover in an angle-of-view of the camera.

Abstract: A processing method for a package substrate in which a plurality of device chips on a wiring base material are sealed with a sealant includes a through-hole forming step of forming a through-hole in the package substrate so as to have a predetermined positional relation to a scheduled division line and a segmentation step of performing alignment with reference to the through-hole and segmenting the package substrate along the scheduled division line from the sealant side to segment the package substrate into individual packages.

Abstract: A method for controlling a wall saw system during creation of a separating cut in a workpiece. The wall saw system includes a saw head, a pivotable saw arm, a first saw blade, and a larger second saw blade. The separating cut is performed in a plurality of main cuts, where the parameters of the main cuts (saw blade diameter of the saw blade used, main-cut angle) are defined before the start in a main-cut sequence. After the processing of the separating cut by the first saw blade is concluded, the controlled processing of the separating cut is interrupted by a control unit and the wall saw is moved into a parking position such that all actions of the saw-blade change (swinging out the saw arm, removing the first saw blade, installing the second saw blade, and swinging in the saw arm) can be performed.

Abstract: A microtrencher having a vacuum system configured to clean spoil from a microtrench having a side shroud and a suction nozzle. A method of using the microtrencher to cut a microtrench in a roadway and using the vacuum system to clean spoil from the roadway and microtrench.

Abstract: A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.

Abstract: A concrete saw trailing having a deck for receiving the saw and safely transporting the saw. The saw trailer additionally includes a vacuum excavation system having a vacuum tank for recovering debris from a worksite, a power washing system for cleaning operations, and a cooling water supply system for coupling to and supporting use of the concrete saw. A pair of split ramps permit access to the deck from the street side of the trailer, and two opposing saddle bag water tanks provide enough water for the use of vacuum excavation system, power washing system, and cooling water supply system.

Abstract: Some embodiments include a III-nitride light emitting device with a light emitting layer disposed between an n-type region and a p-type region. A glass layer is connected to the III-nitride light emitting device. A wavelength converting layer is disposed between the III-nitride light emitting device and the glass layer. The glass layer is narrower than the III-nitride light emitting device.

Abstract: A dust-free multifunctional cut machine, including a worktable board, a machine case carrying the worktable board, a rod assembly arranged on the top of the worktable board, a frame and a cutting assembly comprising a cutting blade and a motor for driving the cutting blade for rotation, and a dust suction assembly arranged between the output shaft end of the motor and a cutting blade and having a spiral casing and a dust suction vane, wherein, the spiral casing includes a dust suction inlet and a dust exhaust outlet, the rod assembly includes a rod fixture and a slide bracket, the frame is connected with the slide bracket through the frame rotating seat and the frame moves back and forth through the rod with the use of the slide bracket. The dust-free multifunctional saw has three functions including bench sawing, miter sawing and automatic dust collection.

Abstract: A novel cutting method and apparatus includes a cutting blade adapted to consistently and easily form a desirable kerf in a concrete substrate while capturing substantially all resulting concrete dust.

Abstract: An apparatus for cutting grooves in a ground surface includes a wheeled vehicle with a tool carrier connected to the wheeled vehicle. The tool carrier is rotatable about an axis parallel to the direction of travel of the vehicle and perpendicular to the direction of travel of the vehicle. A grinding tool for cutting grooves in a ground surface is rotatably mounted to the tool carrier. The grinding tool may be movable laterally relative to the vehicle. A rotatable cam is configured so that rotation of the cam causes pivotal movement of the tool carrier relative to the forward frame. Rotation of the cam moves the grinding tool into and out of engagement with the ground surface.

Abstract: Disclosed in this invention is a wafer processing apparatus and method for pre-alignment and edge exposure of a wafer. The wafer processing apparatus includes a pre-alignment module, an edge exposure module, a motion module, a control module and a rotary table. The motion module includes a rotation module, a lifting module and a translation module, which are disposed and interconnected above one another. The rotation module is connected at the top to the rotary table and is configured to drive the rotary table to rotate together with the wafer. The lifting module is configured to drive the rotation module and the rotary table to move vertically. The translation module is configured to drive the lifting module and the rotation module to move horizontally. The pre-alignment module and the edge exposure module are positioned in correspondence to opposing sides of the wafer. The invention reduces the number of objects to be controlled as well as the complexity in control and system structure.

Abstract: A power tool includes a brushless motor, a supplying circuit, and a controller. The brushless motor is configured to drive and rotate when a voltage applied to the brushless motor is larger than or equal to an induced voltage. The supplying circuit is configured to apply a driving voltage to the brushless motor. The controller is configured to control the supplying circuit. The supplying circuit includes a rectifying circuit, a capacitor, and a switching circuit. The rectifying circuit is configured to rectify an alternating voltage and output a rectified voltage. The capacitor is configured to smooth the voltage inputted via the rectifying circuit. The switching circuit is configured to perform a switching operation based on a PWM signal to adjust a period during which the driving voltage is applied. The controller is configured to set a duty ratio within a prescribed range, and output the PWM signal of the set duty ratio to the switching circuit to control the switching operation.

Abstract: A cutting apparatus includes a rotatable holding table having a rectangular holding surface, a cutting unit having a cutting blade mounted to a rotatable spindle, and a sensor unit detecting a tip of the cutting blade entering between a light projection section and a light reception section. The sensor unit has an upper end located to be lower than a lower end of the holding table in a Z direction and is located below the axis of the spindle or an extension region of the axis, and when short sides of the rectangular holding surface are set parallel to a Y direction, an upper side of the sensor unit is opened to allow the cutting blade to enter between the light projection section and the light reception section.

Abstract: A cutting device including a stand and a saw supported by the stand. The saw includes a motor and a blade rotatably driven by the motor. A pair of rails is supported by the stand. A tray is configured to support an object to be cut on an upper surface and including a roller assembly on a lower surface. The tray is slidable along the pair of rails towards and away from the blade. At least one of the rails is disposed over a basin configured to hold water.

Abstract: An apparatus for containing and collecting debris, dust, and/or fluid generated by a table saw is disclosed. The apparatus may include a pan and a frame for supporting the table saw during use. A plurality of trays may be attached to the pan. The trays may be extended from the pan to provide additional surface area for collecting debris, dust, and/or fluid generated by the saw. A hood apparatus may be coupled to the frame. The hood apparatus may include a fixed shield and an extendable shield for covering above the saw and containing debris, dust, and/or fluid from escaping the apparatus above the saw. A plurality of hanging curtains may be coupled to the fixed and extendable shields to prevent debris, dust, and/or fluid from escaping behind or to the side of the saw. Gravity drainage in the trays and pan may remove debris and dust from the fluid.

Abstract: A circular saw cutting machine (1) includes a machine main body (10), an articulated robot (60), and a cutter stocker (70). A circular saw (5) is secured and interposed by a cutter clamp cylinder (CYL21) between a front end face (32) of the main spindle (21) and a cutter presser piece (50) with pins (33, 51) inserted in pin insertion holes (5b). When removing the circular saw (5), a hydraulic is switched over to cause the cutter clamp cylinder (CYL21) to perform unclamping so that the cutter presser piece (50) can be pulled out of the main spindle (21). When the articulated robot (60) performs cutter change, a main spindle motor (M10) and a brake (25) are controlled based on the rotation angle detected by a spindle stop position sensor (SE10) to stop the main spindle (21) in a predetermined home angle condition.

Abstract: An assembly for supporting the extended operation of mounted power hand tools is provided. The power tool extension apparatus extends between a baton-style handle and a depth-adjusting single wheel correlated to enable the operator to control the mounted power hand tool in a one-handed walk along manner. The alignment of the power tool extension apparatus, the mounted power tool, and the centrally disposed single wheel facilitates a wide range of selective pivotal motion of the single wheel and thus the mounted power tool about the extension apparatus.

Abstract: A method for sawing a semiconductor wafer is provided. The method includes sawing a semiconductor wafer to form a first opening. In addition, the semiconductor wafer includes a dicing tape and a substrate attached to the dicing tape by a die attach film (DAF), and the first opening is formed in an upper portion of the substrate. The method further includes sawing through the substrate and the DAF of the semiconductor wafer from the first opening to form a middle opening under the first opening and a second opening under the middle opening, so that the semiconductor wafer is divided into two dies. In addition, a slope of a sidewall of the middle opening is different from slopes of sidewalls of the first opening and the second opening.

Abstract: A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a slit which is open at an outer peripheral edge thereof. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A method for controlling a wall saw system during the creation of a separating cut in a workpiece. The movement of the saw head is controlled at the end points such that a boundary of the wall saw facing the end point coincides with the end point after the pivoting movement of the saw arm. In the case of a free end point, the boundary of the wall saw is formed by an upper exit point of the saw blade. In the case of an obstacle, the boundary of the wall saw is formed by the saw blade edge of the saw blade if the processing occurs without the blade guard or by the blade guard edge of the blade guard if the processing occurs with the blade guard.

Abstract: This document describes systems and processes of manufacturing, visualizing, and distributing stone slabs. In an exemplary embodiment, a 3D scene may be generated that depicts a portion of a major surface of a stone slab at a target area of a slab installation environment.

Abstract: An abrasive segment can include an inner segment portion, an outer segment portion, and a central segment portion connected thereto. The inner segment portion can include an inner circumferential wall and an outer circumferential wall. Leading and trailing radial sidewalls can extend between the inner circumferential wall and the outer circumferential wall opposite each other. The outer segment portion can include an inner circumferential wall and an outer circumferential wall. Leading and trailing radial sidewalls can extend between the inner circumferential wall and the outer circumferential wall opposite each other. The central segment portion can include a leading radial sidewall and a trailing radial sidewall. The leading radial sidewall of the central segment portion can establish an acute angle, ?, with respect to the outer circumferential wall of the inner segment portion and an obtuse angle, ?, with respect the inner circumferential wall of the outer segment portion.

Abstract: A calibration plate for measuring calibration of digital microscope and methods of using the same. The calibration plate comprises at least one calibration area formed with a surface structure which includes a plurality of grid cells arranged periodically, wherein at least part of boundary and/or at least part of apexes of each grid cell can be identified by an optical imaging system of the digital microscope. The invention also includes a digital microscope system equipped with the calibration plate.

Abstract: A quick tensioning system applicable to handheld chainsaws is provided wherein, during chain re-tensioning, the chain guiding bar remains firmly anchored to the bar holder and guiding means are provided to retract the motorized driving sprocket versus said guiding bar. The system includes a guide interposed between a stationary bar holding body and a motor body. This allows a linear or a rotation relative movement between the sliding driving sprocket and the stationary guiding bar. A drive is provided by means of a screw that an operator can easily operate via a knob conveniently mounted nearby the chainsaw handle.

Abstract: The continuous cutting apparatus includes a guide rail (5), an extruder (3) for extruding and moving forward a series of sintered magnet blocks (1) on the guide rail (5), a holder plate (6) for holding the magnet blocks in place, and a plurality of OD blades (2) for cutoff machining the magnet blocks into magnet pieces. The cutting apparatus is capable of continuously cutoff machining magnet blocks each into a multiplicity of magnet pieces of desired shape and/or size, achieving a significant increase in productivity and ensuring efficient production of magnet pieces.

Abstract: A slitting apparatus having an anvil cylinder with an outer cylindrical surface adapted to support the material as it conveys through the slitting apparatus. An in-line cutting assembly having a series of blades with cutting edges disposed within a common plane that is oriented perpendicular to the cylinder's central axis. The cutting edges are arranged in an arcuate line that spirals inwardly toward the outer circumferential surface whereby the blades progressively slice the material so that the in-line cutting assembly forms a singular continuous slit.

Abstract: A system for uncovering and sealing a narrow trench. The system comprises several subsystems, including a work machine, a frame for providing a seal with the surface to be trenched, a saw blade, a vacuum system, a system for placing product, and a resealer. The blade includes rotatable tooth bits, which may be rotated and secured to create a blade for narrower or a wider trench. A removable cover and the blade are easily changeable. A surface engaging member on the frame is manipulated to maintain a seal with changing ground surfaces. Additionally, the vertical location of the blade within the frame is adjustable to create a deeper or shallower trench.

Abstract: A carriage (50) for a wall saw that includes a saw head and a motor-driven feed unit with a guide slide and a feed motor. The carriage is made up of a base frame (51) with a supporting frame (55) and a receiving plate (56), a guide frame (52) with a handle (58), and a chassis (53) with a first axle (64), a second axle (66), and at least three wheels (65, 67). At least one wheel (65) of the chassis (53) is designed to be connectable to a gearwheel (45) of the guide slide (26) in a force- and torque-transmitting manner with the aid of a connection device.

Abstract: Cutting apparatus includes a chuck table for holding a workpiece, a cutting unit for cutting the workpiece held on the chuck table, and a feeding mechanism for relatively moving the chuck table and the cutting unit. The cutting unit includes a spindle adapted to be rotationally driven, a rotatable cutting blade mounted on the spindle and having a peripheral cutting edge, a cutting water nozzle for supplying a cutting water to the cutting blade, a photocatalyst member provided so as to come into contact with the cutting water supplied from the cutting water nozzle, and a light applying unit for exciting the photocatalyst member to thereby give an oxidizing power due to hydroxy radicals to the cutting water.

Abstract: A hole saw includes a cylindrical body disposed along an axis of rotation with a side wall extending axially from a cap end to a cutting end. The cutting end includes a plurality of cutting teeth. The hole saw also includes a cap coupled to the cap end of the cylindrical body. The side wall defines an elongated aperture configured to receive a tool for removing work piece plugs from within the cylindrical body. The elongated aperture has a first slot portion adjacent the cutting edge. The first slot portion is oriented perpendicular to the axis of rotation. The elongated aperture also has a second slot portion connected to the first slot portion and extending from the first slot portion toward the cap end. The second slot portion is oriented at an oblique angle relative to the axis of rotation.