Abstract: A system for beverage cartridge preparation allows users to self-select, self-fill, and self-seal single use beverage cartridges for convenience. A frame assembly supports a cartridge handling system and a cartridge filling system. The cartridge filling system includes a fillable container and a portion dispensing system. The cartridge handling system includes a movement guide system moving the beverage cartridges, a sealing system for sealing the beverage cartridges after filling, and a motion system for actuating the cartridge handling system, the portion dispensing system, and the sealing system. The movement system includes mobility relative to operative members of the filling and handling systems and one or more single use beverage cartridges. Adaptive cartridge shapes and components are provided to fit a particular preparation system.

Abstract: A wafer dividing method includes forming modified layers which will be starting points of division, integrally attaching an annular frame and the wafer together through a dicing tape, directing the wafer downward and expanding the dicing tape to divide, into individual device chips, the wafer along the modified layers formed along the streets, counting particles scattered at the time of division of the wafer by a particle counter disposed in a dust collection path set directly below the wafer, and determining, on the basis of the number of the particles, whether or not the modified layers have been properly formed, at the time of carrying out the dividing step.

Abstract: A composite material can include: a substrate of a first reaction-bonded silicon carbide (first RB-SiC) material; and a reaction-bonded diamond-retaining silicon carbide (RB-DSiC) layer bonded to a surface of the substrate. In some aspects, the RB-DSiC layer includes diamond particles bonded with a second reaction-bonded silicon carbide (second RB-SiC) material. The diamond particles may be homogeneously distributed through the second RB-SiC or only at the surface thereof. The diamond particles can be in an ordered pattern or un-ordered pattern. For example, a CMP conditioning disc can include the composite material of one of the embodiments.

Abstract: A system for beverage cartridge preparation allows users to self-select, self-fill, and self-seal single use beverage cartridges for convenience. A frame assembly supports a cartridge handling system and a cartridge filling system. The cartridge filling system includes a fillable container and a portion dispensing system. The cartridge handling system includes a movement guide system moving the beverage cartridges, a sealing system for sealing the beverage cartridges after filling, and a motion system for actuating the cartridge handling system, the portion dispensing system, and the sealing system. The movement system includes mobility relative to operative members of the filling and handling systems and one or more single use beverage cartridges. Adaptive cartridge shapes and components are provided to fit a particular preparation system.

Abstract: A method for separating integrated circuit dies from a wafer includes making at least two cutting passes with a laser along a first die street of an integrated circuit die, the first die street extending along a first axis on the wafer. The method also includes making at least two cutting passes with the laser along a second die street of the integrated circuit die, the second die street extending along a second axis on the wafer that is generally perpendicular to the first axis. In one process, three cutting passes are made with the laser alternatingly along the first and second die streets to separate the integrated die circuit along the first and second axes. In another process, two cutting passes are made with the laser along the first die street in opposite directions, and two cutting passes are then made with the laser along the second die street in opposite directions.

Abstract: The invention discloses a device (1) for releasing glasses (2) from the bodies (3) of vehicles where the device (1) comprises a frame (4), at least one suction pad (5), one guide pulley (6) fitted with two guide grooves (7) for guiding a cutting wire (8), or two guide pulleys (6) with a common central line, and two winding pulleys (9). The winding pulleys are fitted with winding grooves (10) for winding the cutting wire (8) and a spacing element or a spacing pulley (11) keeping the cutting wire (8) at a safe distance from the suction pad (5). During releasing the glass (2) the cutting angle (?) of the cutting wire (8) does not exceed the value of 90°. Each end of the cutting wire (8) is wound onto the winding pulleys (9) due to the guide grooves (7) wherein a safe distance from the suction pad (5) is ensured to eliminate their damage.

Abstract: The present subject matter discloses a longitudinal silicon ingot slicing apparatus for lateral slicing of cylindrical ingot to maximize resulting chips yield as compared to the conventional transverse slicing of ingot. The resulting rectangular wafers made from lateral slicing of ingot maximizes yield as by the lateral slicing of ingot, overall chips per wafer ratio gets increased as compared to transversal cutting while the said apparatus and method decreases waste due to conflict between chip and wafer geometry. The novel apparatus of longitudinal slicing of cylindrical ingot is comprising of a wire wounded around a wire reels and a plurality of grooved rollers to form a wire raw to slice the cylindrical silicon ingot. A motors are connected with the wire reels and with at least one grooved roller to slide the wire row back and forth to cut the cylindrical ingot. A work feed table is also configured along with the JIG fixture that holds the cylindrical ingot as well as align the wire raw during slicing.

Abstract: There is provided a tool blade, comprising a backing strip particles of abrasive material and a binder layer of binding material which binds the abrasive particles along an edge of the backing strip, wherein the edge of the backing strip is pre-formed with teeth, on which the abrasive particles are bound by the binding material. A profiled cutting portion extends beyond the pre-formed teeth. The pre-formed teeth are shaped as generally triangular waves or are flattened at least partially along an upper edge on which the cutting portion is at least partially disposed. A method of making such a blade is also provided.

Abstract: A quick tensioning device for a portable machine tool, in particular for an angle grinding machine, includes at least one output shaft which can be rotated, at least one clamping unit that is at least partly arranged in the output shaft and has at least one clamping element, which is movably mounted at least about and/or along a movement axis of the clamping unit, for fixing an insert tool unit to the output shaft without tools, and at least one torque transmission unit for transmitting a torque to the insert tool unit when the insert tool unit is arranged on the output shaft, said torque transmission unit having at least one torque transmission element which is formed separately from the output shaft. The quick tensioning device includes at least one securing unit at least for securing the torque transmission element to the output shaft in a rotationally fixed manner.

Abstract: Methods for producing ceramic multi-layer components and multi-layer components made by such methods. A method includes the following steps: providing green layers for the ceramic multi-layer components, stacking the green layers into a stack and subsequently pressing the stack into a block, singulating the block into partial blocks each having a longitudinal direction, thermally treating the partial blocks and subsequently machining surfaces of the partial blocks. Recesses are produced on the surfaces of the partial blocks during the machining, and the partial blocks are singulated.

Abstract: A walk-behind apparatus and method for cutting non-linear trenches in concrete includes a frame supported by fixed direction wheels at a front end on a fixed axis of rotation, and multi-directional wheels at a rear end to rotate on movable axes of rotation, to permit the frame to rotate about a vertical axis passing through the frame. A handle is engageable by a user walking behind the frame for pushing the apparatus forward and/or for steering. A cutting wheel has a diameter of 5-20 inches and a cutting portion having a width of 0.5-1.5 inches. The cutting rotates on an axis parallel to the fixed axis and which extends notionally through the fixed direction wheels. The cutting wheel is disposed within a protective shroud viewable by the user to permit the user to visually align and guide the cutting wheel along a non-linear path on the ground while steering.

Abstract: Drilling tools, such as drill bits, having a shank, a crown, and a plurality of abrasive cutting elements. In the case of impregnated drilling tools, the abrasive cutting elements are dispersed throughout at least a portion of the crown. In the case of surface-set drilling tools, the abrasive cutting media is secured to and projects from a cutting face of the crown. The matrix of the crown of the drilling tools includes a carbide-forming alloy that forms a direct carbide bond with at least one cutting element of the plurality of abrasive cutting elements.

Abstract: The present subject matter discloses a method of lateral slicing of cylindrical silicon ingot to maximize resulting chips yield as compared to the conventional transverse slicing of ingot. The resulting rectangular wafers made from lateral slicing of ingot maximizes yield as by the lateral slicing of ingot, overall chips per wafer ratio gets increased as compared to transversal cutting while the said method decreases waste due to conflict between chip and wafer geometry. The novel apparatus or system of present method includes JIG having plurality of parallel bars. The JIG is provided to covers and holds the ingot during slicing while the parallel bars of JIG between which diamond dust embedded wires gets located and which behaves as a guide for diamond embedded wires during the slicing of ingot. Also, this JIG mechanism protects and holds the wires from sliding down and miss the designated location of slicing during the process as the slicing of cylindrical ingot is being done longitudinally.

Abstract: A component transfer apparatus includes: an upthrust section that thrusts up a wafer component held by a wafer holding table from below; an extraction head that suctions the wafer component thrust up by the upthrust section or an adjustment chip placed on the upthrust section; an imaging section that performs imaging of the wafer component or the adjustment chip being suctioned by the extraction head; and a control section that controls driving of the extraction head and operations of the imaging section. Upon suction position adjustment, the control section causes the imaging section to perform imaging of the wafer component or the adjustment chip being suctioned by the extraction head, and adjusts a suction position of the wafer component by the extraction head based on a result of the imaging.

Abstract: A semiconductor wafer (12) with a thinned central portion (2) has a first side (3) and a second side (4) and at least one reinforcement structure for increasing the radial bending resistance of the semiconductor wafer (12). The reinforcement structure provides at least one passage (10) for a fluid flow between an inner face (9) of said one reinforcement structure towards an outer face (8) of the reinforcement structure. The passages (10) are manufactured in a z-direction coming from above the semiconductor wafer (12) in a direction which is essentially perpendicular to the surface, e.g. to the first side (3), of the semiconductor wafer (12).

Abstract: A water-soluble working fluid of the invention is used for cutting a brittle material using a wire saw. The water-soluble working fluid is provided by blending water, alkylene oxide adduct of acethylene glycol, and glycols. The water-soluble working fluid of the invention is capable of providing favorable cutting accuracy when the brittle material is cut using a wire, and thus is suitable for cutting out a large-diameter wafer. The water-soluble working fluid of the invention is especially suitably applicable to an abrasive-grain-fixed wire saw.

Abstract: A method for preparing a plurality of micro-devices for transfer includes temporarily bonding the micro-devices onto a carrier substrate; testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and removing the first failed micro-device from the carrier substrate.

Abstract: A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.

Abstract: Provided is a waste water collection device for collecting waste water dispelled from a water cooled saw. The device has a trough defining an elongated opening through the top, center and bottom of the trough to allow a water cooled saw blade to pass through the opening and contact a ground surface to be cut. The trough is constructed to retain waste water leaving the water cooled saw during use. A saw connection is constructed for connecting the trough to a water cooled saw so that the saw is within the opening of the trough. A waste water outlet is constructed to remove waste water retained within the trough. A flexible hose is constructed to remove a slurry from a trench cut by the saw during use. A vacuum connector is constructed for connecting a vacuum source to the waste water outlet and flexible hose. Also provided is a method of collecting waste water dispelled from the water cooled saw cutting the ground using the device.

Abstract: In a single-wire type wire saw, a work is fed relatively to a wire stretched between a pair of grooved guide rollers disposed in the same direction and the work is cut by traveling the wire. When a cutting-feeding direction changes during a cutting of the work, an operation shaft is moved along an arc around the center axis of the wire in a cutting area and simultaneously support arms are rotated around the operation shaft to thereby oppose the wire support direction of the pair of grooved guide rollers to the cutting-feeding direction.

Abstract: A cutting apparatus for cutting corner pieces formed of stone or other materials for use as building faces or for cutting flat pieces is disclosed herein. The cutting apparatus includes a frame with a first and a second conveyor operatively attached to the frame. The first and the second conveyors are configured to carry a workpiece from a first end of the frame to the second end of the frame. The first conveyor is disposed at an angle of about 45 degrees to a ground surface supporting the cutting apparatus. The second conveyor is disposed at an angle of about 45 degrees to the ground surface supporting the cutting apparatus, wherein the second conveyor is positioned perpendicularly to the first conveyor so as to form a V-shaped channel therewith.

Abstract: In order to produce silicon wafers, liquid ultra-pure silicon is solidified on a silicon monocrystalline seed arranged in the bottom area of a crucible and having a seed surface comprising a {110}-crystal orientation and an edge surface having a {100}-crystal orientation starting from the bottom of the crucible, thus forming a silicon block on the seed surface of the silicon monocrystalline seed which largely takes over the {110}-crystal orientation. Subsequently, the silicon block is divided into wafers with a wafer surface having a {100}-crystal orientation.

Abstract: A crystalline silicon ingot is produced using a directional solidification process. In particular, a crucible is loaded with silicon feedstock above a seed layer of uniform crystalline orientation. The silicon feedstock and an upper part of the seed layer are melted forming molten material in the crucible. This molten material is then solidified, during which process a crystalline structure based on that of the seed layer is formed in a silicon ingot. The seed layer is arranged such that a {110} crystallographic plane is normal to the direction of solidification and also so that a peripheral surface of the seed layer predominantly also lies in a {110} crystallographic plane. It is found that this arrangement offers a substantial improvement in the proportion of mono-crystalline silicon formed in the ingot as compared to alternative crystallographic orientations.

Abstract: Disclosed is a singulation apparatus, comprising: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being for cutting the workpiece. A singulation method is also disclosed.

Abstract: A saw apparatus for sawing paving slabs has a frame mounted on a ground contacting propulsion member such that the frame may move above a slab to be cut without touching the slab. A first saw support assembly disposes a blade of a saw in cutting engagement with the slab for a transverse cut. A second saw support assembly disposes a blade of another saw in cutting engagement with the slab for a longitudinal cut. The saws are mounted on the saw assemblies and the saw assemblies are mounted on the frame and the frame is mounted on the ground contact propulsion members such that no part of said frame need contact the slab during cutting.

Abstract: A cutting device for cutting a pile, including a body part, for connecting the cutting device to a working machine and a gripper attached to the body part to drive the cutting device around the pile to be cut, the gripping means having at least two opposite gripping parts to obtain a grip from the pile and to release the gripper from the grips. The cutting device includes at least two sawing parts arranged to move to a sawing position and to a secure position, and the cutting device having a saw connected to the sawing parts to perform sawing operation when at least one sawing part is in the sawing position, and the cutting device includes elastic means to adapt to forces, which arises during sawing movement of the a saw. The saw is arranged to move during the sawing movement substantially horizontally to the pile being cut.

Abstract: Various methods and apparatuses are provided relating to separation of a substrate into a plurality of parts. For example, first a partial separation is performed and then the partially separated substrate is completely separated into a plurality of parts.

Abstract: A cutting method of a honeycomb formed body is provided. This is a cutting method of a honeycomb formed body in which, while a kneaded material containing a ceramic raw material is extruded to form a honeycomb formed body with a honeycomb shape having partition walls defining and forming a plurality of cells, the extruded honeycomb formed body is cut before drying by a cutting blade vibrated at a frequency of 0.3 kHz or more in a direction perpendicular to a direction in which this honeycomb formed body moves. It is preferably a cutting method of a honeycomb formed body in which the cutting blade is vibrated at a high frequency of 10 kHz or more.

Abstract: A method including providing a ceramic log (300) with a first end and an opposing second end; providing one or more cutting devices (100) comprised of a dual bladed cutting member (200); and removing material by cutting at least the first end with the dual bladed cutting member (200), wherein a first blade (210) of the dual bladed cutting member (200) provides a finished surface and a second blade (220) removes a percentage of scrap above the finished surface. An apparatus (100) for cutting a ceramic log (300).

Abstract: A method of making a glass forming apparatus with reduced weight includes forming a cavity in the glass forming apparatus and expanding the size of the cavity by abrasively removing material from the glass forming apparatus through application of a wire saw.

Abstract: A hand-operated implement has a guide bar on which is fitted a cutting chain for cutting mineral and metal materials. The cutting chain is driven around the guide bar by a chain sprocket. The chain sprocket is arranged in a chain sprocket chamber which is delimited by a chain sprocket cover. A cutting element has an outer side facing a sidewall of the chain sprocket cover which lies in a first notional plane. The distance between the sidewall and the first notional plane measured perpendicular to the first notional plane and centrally between the top of the cutting element and the peripheral wall is less than approximately 0.8 cm over at least 30% of the section between a second notional plane containing the central axis of a fixing bolt on the guide bar and the exit opening at which the cutting chain leaves the chain sprocket chamber.

Abstract: An amount of warp of a wafer is not only reduced, but the amount of warp of the wafer is also accurately controlled to a desired amount. The present invention relates to a method for slicing a semiconductor single crystal ingot, by which a cylindrical semiconductor single crystal ingot is bonded to and held by a holder in a state where the ingot is rotated at a predetermined rotation angle around a crystal axis of the ingot different from a center axis of a cylinder of this ingot and the ingot is sliced by a cutting apparatus in this state. The predetermined rotation angle at the time of bonding and holding the ingot with the use of the holder in such a manner that an amount of warp of a wafer sliced out by the cutting apparatus becomes a predetermined amount.

Abstract: A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal.

Abstract: Provided is a waste water collection device and a method of collecting waste water dispelled from a water cooled saw cutting the ground.

Abstract: A method of preparing a plurality of workpieces for concurrent cutting using a stone cutting machine is disclosed. Each workpiece can include a stone slab that has two parallel faces and one or more edges, a substrate that is bonded to a first face, and a substrate that is bonded to a second face of the stone slab. The stone cutting machine can have a plurality of stone cutting elements and it can be configured to concurrently create a plurality of stone cuts. The method can include: providing a plurality of workpieces; and positioning the plurality of workpieces by placing a set of shims between adjacent pairs of workpieces. The set of shims can be placed to compensate for variations in workpiece thickness and/or to position each of the workpieces with one edge of each stone slab in relative alignment with one of the stone cutting elements.

Abstract: A silicon single crystal wafer is provided. The silicon single crystal wafer includes an IDP which is divided into an NiG region and an NIDP region, wherein the IDP region is a region where a Cu based defect is not detected, the NiG region is a region where an Ni based defect is detected and the NIPD region is a region where an Ni based defect is not detected.

Abstract: An apparatus for sawing cured slipform cast concrete products, which apparatus comprises a frame with wheels, and a concrete saw connected movably to the frame, wherein the apparatus comprises a brushing unit for cleaning slipform casting bed.

Abstract: A wire saw assembly having a slide frame, support frames, and a tensioning carriage. The slide frame has a mounting plate movably attached thereto. Rotation of a lead screw moves the mounting plate towards a work piece. Two support frames are attached to the mounting plate. Each support frame has a plurality of drive wheels and a hydraulic motor for each drive wheel. The tensioning carriage has a slide plate with an idler pulley attached rotatably thereto. Rotation of a threaded rod moves the slide plate and idler pulley to increase or decrease tension in the wire saw. A diamond wire saw is looped around the drive wheels and idler pulley. The slide frame is attached to the work piece and as the mounting plate is advanced towards the work piece, the diamond wire saw engages and cuts the work piece.

Abstract: A method and apparatus for cutting rigid, brittle articles such as tile used as a building material is improved by the capability to make both straight and curved cuts in tile on a single machine. The machine has both circular and plunge cutting tools and a table for moving the tile in both curved and straight lines in relation to the cutting tool, thereby achieving both curved and straight cuts.

Abstract: A concrete saw having a geared assembly for rotating a cutting blade is described. The saw utilizes a longitudinally oriented engine for rotating the blade. Various additional features and improvements are described including a particular belt tensioner assembly, an indicator and control system for cutting blade depth, a handle adjustment and locking system, and provisions for control of blade water are described.

Abstract: Within the scope of a Silicon-wafer making, in which a silicon monocrystal seed is arranged in the bottom region of a crucible, wherein the silicon monocrystal seed has a seed surface with a {110}-crystal orientation perpendicular to the bottom region of the crucible, in which liquid high-purity silicon is solidified, starting from the seed surface of the silicon monocrystal seed, and in which the silicon block is split into Silicon-wafers in such a manner that a wafer surface has a {100}-crystal orientation, wherein the silicon monocrystal seed is manufactured from a silicon monocrystal block, the block axis of which has a [110]-spatial orientation, wherein the silicon monocrystal block is cut-off for forming the seed surface of the silicon monocrystal seed with the {110}-crystal orientation parallel to the block axis.

Abstract: Aspects of the present disclosure relate generally to limiting the use of an autonomous or semi-autonomous vehicle by particular occupants based on permission data. More specifically, permission data may include destinations, routes, and/or other information that is predefined or set by a third party. The vehicle may then access the permission data in order to transport the particular occupant to the predefined destination, for example, without deviation from the predefined route. The vehicle may drop the particular occupant off at the destination and may wait until the passenger is ready to move to another predefined destination. The permission data may be used to limit the ability of the particular occupant to change the route of the vehicle completely or by some maximum deviation value. For example, the vehicle may be able to deviate from the route up to a particular distance from or along the route.

Abstract: A battery operated concrete saw system (10) includes an alternating current electric saw (12) and a lithium based battery pack (58) including a plurality of batteries (60) connected in series to power the saw through an inverter (70) that changes the direct current from the battery pack to alternating current that powers the saw.

Abstract: A method and apparatus for cutting rigid, brittle articles such as tile used as a building material is improved by the capability to make both straight and curved cuts in tile on a single machine. The machine has both circular and plunge cutting tools and a table for moving the tile in both curved and straight lines in relation to the cutting tool, thereby achieving both curved and straight cuts.

Abstract: Systems and methods of transferring loads between adjacent cast-in-place slabs, such as concrete slabs, and for accurately positioning dowels between adjacent sections of slabs are provided. A generally planar plate-type dowel is used which may be positioned within a cutaway in a preexisting slab of concrete. The dowel is shaped to generally conform to the shape of the cutaway, which is made by a saw blade. Once the dowel is positioned within the preexisting slab, a new slab is poured adjacent the preexisting slab. Rubber seals are included on the edges of the dowels to provide spacing or a gap between the dowel and the preexisting slab to allow for lateral independent movement of the adjacent slabs, and to prevent concrete from the newly poured second slab from entering into the gap. A saw unit for making a generally planar cut horizontally into an edge of a hardened concrete slab is also provided.

Abstract: A tile saw comprises a frame, a primary table moveably supported by the frame for supporting a work-piece to be cut, a water tray located under the primary table, a supporting arm mounted on the frame, and a cutting device supported by the supporting arm. The primary table also includes first and second connecting edges and a secondary table which may be removably attached, without the use of tools, to either the first or second connecting edge of the primary table. When the secondary table is attached, the supporting area for the work-piece is increased resulting in increased stability and increased cutting accuracy.

Abstract: A method is described for producing a sawing bead for use in a sawing cord. Sawing cords are used for cutting hard and brittle materials. In the method, laser cladding is used to form an abrasive layer on a small metallic tube (204) or sleeve. The abrasive layer (220) comprises a metal matrix material in which abrasive particles such as diamond, cubic boron nitride or other hard cutting materials are embedded. The metal matrix material preferably comprises an active metal that improves wetting and adhesion of the abrasive particles. Although the abrasive particles are relative large—with a particle size in excess of 100 ?m—they are evenly distributed throughout the abrasive layer. This is achieved by letting the tube (204) rotate relative to the laser cladding system possibly in combination with a relative axial movement so that the cladding track loops on itself thereby forming an abrasive layer (220). Additionally the method allows to shape the sawing bead for improved geometrical tolerances and centricity.

Abstract: The present invention is for the recovery of maximum silicon value of kerf silicon waste, produced during the manufacture of silicon wafers by wire saw, diamond saw and chemical mechanical polishing, as high purity metallurgical silicon. This recovery is achieved by a process scheme that effects an initial removal of minor extrinsic metallic impurities but not the major silicon compound impurities, and followed, preferentially, by a direct metallurgical process to form elemental silicon. The recovered silicon is for use as feedstock for polysilicon manufacturing, as high purity polysilicon for PV application, and in metallurgical alloy manufacture.

Abstract: A method and a plant are provided for calibrating surfaces of stone materials, suitable for working at least one slab (1) composed of an entry side and an exit side and of two parallel side edges; the slab (1) is pushed along the side edges through a conveyor belt and is subjected to the cutting action imparted by multiple tools equipped with a peripheral speed compatible with optimum cutting parameters for the stone material; the tools move along a predefined path along the surface of the slab (1), and the motion imparted by the conveyor belt and the predefined tool path is combined in order to completely cover the surface of the slab (1); the contact between the slab (1) and the tools is ensured simultaneously at least in one point on each of the two side edges of the slab (1).

Abstract: The present invention provides a method for manufacturing a corundum substance, comprising steps of providing a corundum crystal having an a-axis and a growth along the a-axis; and obtaining the corundum substance from the corundum crystal in a particular direction.