Abstract: A wire saw includes a U-shaped cutting area. An endless sawing wire loop runs between a plurality of wire pulleys including at least two displaceable cutting area pulleys, displaceable wire tensioning pulleys and wire plane changing pulleys. The endless wire loop defines a first cutting area plane P1 in the U-shaped cutting area and at least one further wire loop plane dissimilar from the first cutting area plane. The wire plane changing pulleys guide the sawing wire between the first cutting area plane and the further wire loop plane P2. A wire driving pulley is driven by a wire drive motor. A cutting area pulley actuator runs the cutting area pulleys along each side of the workpiece cutting area. The displaceable wire tensioning pulleys are displaceable by at least one tensioning actuator within the further wire loop plane P2 to maintain a tensioned sawing wire.

Abstract: An electronic component removal device comprising a cutting wire routed through a cutting region configured to receive an electronic component coupled to a substrate. The electronic component removal device can also include a leading actuator coupled to a leading end of the cutting wire to cause movement of the cutting wire in a cutting direction at a cutting speed. The electronic component removal device can further include a trailing resistance device coupled to a trailing end of the cutting wire to resist movement of the cutting wire in the cutting direction with a variable resistance. In addition, the electronic component removal device can include a leading tension sensor to sense a leading tension in the cutting wire between the cutting region and the leading actuator. The trailing resistance device can resist movement of the cutting wire with a resistance that varies based on the leading tension in the cutting wire.

Abstract: A method for slicing a workpiece using a wire saw which includes wire row formed by winding a fixed abrasive grain wire having abrasive grains secured to a surface around a plurality of grooved rollers, the method including feeding a columnar workpiece to wire row for slicing while allowing fixed abrasive grain wire to reciprocate and travel in an axial direction, thereby slicing the workpiece at a plurality of positions aligned in axial direction at same time. After end of slicing the workpiece, the fixed abrasive grain wire is rewound from position at the end of slicing the workpiece by length of ? or more and ? or less of the fixed abrasive grain wire fed's length from start of slicing when the workpiece and wire row begin to contact with each other to the end of slicing the workpiece, and then the workpiece is drawn out of wire row.

Abstract: In an ingot cutting apparatus that cuts an ingot using a plurality of stretched wires, load sensors are provided on the new wire side and the old wire side of the ingot, and loads applied to the new wire side and the old wire side of the ingot are measured using the load sensors on the new wire side and the old wire side. When measuring the loads, for example, the center of moment about the X-axis that is the running direction of the wire is calculated. When the deviation from the center of gravity of the ingot is greater than or equal to a reference value, notification for replacement of the wire, control of the conveying speed of the wire, control of the pressing speed of the ingot, and so forth are performed through a control unit.

Abstract: The present invention provides a wire electrode supply apparatus for suppressing wire electrode driving vibration for wire electrodes having a wide range of diameters and formed of various materials, thereby improving processed surface roughness. The wire electrode supply apparatus includes a back tension adjustment unit that adjusts a back tension of the wire electrode drawn from a source bobbin, a tension applying unit, and a constant pressure ejecting unit that ejects the wire electrode with constant pressure and rate after the transference via the tension applying unit and an electrical discharge machining unit. The tension applying unit includes a low tension applying unit that applies a tension to the wire electrode, and a high tension applying unit that can supply a higher tension. After the high tension applying unit supplies a tension, the low tension applying unit supplies a tension. Otherwise, only the low tension applying unit supplies a tension.

Abstract: A reciprocating tool includes a motor, a crank, a connecting rod, a rod, a tool bit, and a counter weight. The tool bit is mounted such that the action portion is positioned on a side opposite to a side with the rod central axis or the extended line of the rod central axis viewing from the rotational center of the crank. The first eccentric shaft and the second eccentric shaft are disposed such that at a position where the first eccentric shaft causes the rod to reach top dead center (TDC), the second eccentric shaft causes the counter weight to reach bottom dead center (BDC) or a point before the BDC, and at a position where the first eccentric shaft causes the rod to reach the BDC, the second eccentric shaft causes the counter weight to reach a point before the TDC.

Abstract: The invention relates to a wire management system (7) for a wire saw (8) having a cutting wire (3) which is guided through a cutting area (13), the wire management system (7) comprising a wire supplying unit (5) for supplying cutting wire (3) to the cutting area (13) of the wire saw (8) and a wire receiving unit (6) for receiving cutting wire (3) from the cutting area (13) of the wire saw (8), wherein at least one of the wire supplying unit (5) and the wire receiving unit (6) comprises: at least one rotatable reservoir spool (1) for carrying the cutting wire (3) in overlapping windings, at least one rotatable storage spool (2) for temporarily receiving the cutting wire (3) in windings, wherein the rotational axis (2b) of the storage spool (2) coincides with the rotational axis (1 b) of the reservoir spool (1), a wire guiding means (9) for guiding the cutting wire (3) when being wound up on the storage spool (2), such that the wire windings on the storage spool (2) do not overlap each other and/or have a lower

Abstract: An array includes a substrate having a frontside surface and a backside surface. A backside cavity is formed in the backside surface. Backside through vias extend through the substrate from the frontside surface to the backside surface. Embedded component through vias extend through the substrate from the frontside surface to the backside cavity. An embedded component is mounted within the backside cavity and coupled to the embedded component through vias. In this manner, the embedded component is embedded within the substrate. By embedding the embedded component within the substrate, the overall thickness of the array is minimized. Further, by electrically connecting the embedded component to the embedded component through vias, which are relatively short, the impedance between active surface ends of the embedded component through vias and the bond pads of the embedded component is minimized thus providing superior power management.

Abstract: A wire saw apparatus 1 executes cut-machining by pressing a workpiece W against a cutting wire 3 spirally wound around multiple wire guides 2, while running the cutting wire 3 and simultaneously swinging the wire guides 2 as well as the cutting wire 3. The wire saw apparatus 1 includes a controller 8 controlling a position of a workpiece holder 51 for holding the workpiece W. The position is controlled depending on a swing angle of the cutting wire 3 so that machined portion of the workpiece W is shaped into an arc.

Abstract: A method for manufacturing silicon flakes includes steps as follows. A silicon material is contacted with a machining tool which includes at least one abrasive particle fixedly disposed thereon. The silicon material is scraped along a displacement path with respect to the machining tool to generate the silicon flakes having various particle sizes.

Abstract: There is provided a method of manufacturing a substrate, the method including: polishing a surface of a material substrate; and forming a penalization film on the surface of the material substrate alter the polishing of the surface of the material substrate.

Abstract: A stone cutting device configured to cut a workpiece with a plurality of cutting tools by swinging the cutting tools within a predetermined angle range. Each of the cutting tools includes: a blade extending in a length direction of the workpiece; and at least one cutting tip disposed on an end of the blade and protruding from the blade in a width direction of the blade so as to cut the workpiece while being reciprocated in a swinging motion. The stone cutting device includes a frame unit configured to combine and reciprocate the cutting tools and individually adjust tension in each of the cutting tools. The frame unit includes an actuator applying tension to the cutting tools so as to apply a load of 8 tons to 27 tons to each of the cutting tools.

Abstract: A secure document includes a fluorescent barcode and a fluorescent filler printed onto a substrate. The fluorescent barcode is printed using a first fluorescent ink of a first color and the fluorescent filler is printed using a second fluorescent ink of a second color that is different than the first color. In order to read the fluorescent barcode, the secure document must be illuminated with ultraviolet and/or infrared light. Then, a color filter must be used to filter the fluorescent filler out, leaving the fluorescent barcode visible.

Abstract: Provided is a wire saw (1) that cuts an ingot (I) while swinging the ingot. The wire saw (1) includes a first driving block (100), a second driving block (110), and an ingot holder (120). When the first driving block (100) moves, the second driving block (110) moves in a direction perpendicular to a moving direction of the first driving block (100), and simultaneously the ingot holder (120) is swung. The ingot holder (120) is transferred to a z-axial direction in which the ingot is cut by a lifting block (73), and the lifting block (73) moves independently of the first or second driving block (100 or 1110). Thus, the ingot (I) can be swung separately from the lifting block (73), and be inhibited from moving left and right. Since only the first driving block (100) is controlled, easy control and a simple structure are provided.

Abstract: This method of cutting a high-hardness material with a multi-wire saw includes the steps of: (A) providing at least one ingot which includes a body portion 10a with two ends and a low-quality crystal portion 10e that is located at only one of the two ends of the body portion; (B) fixing the at least one ingot onto a fixing base; and (C) slicing the at least one ingot by moving the ingot with respect to a saw wire so that the saw wire does not contact with the low-quality crystal portion 10e of the at least one ingot but does contact with its body portion 10a.

Abstract: A method and apparatus are used to simultaneously slice a multiplicity of slices from a workpiece. The workpiece is held with a feed device so as to position an axis of the workpiece parallel to axes of wire guide rolls of a wire saw and is moved from above through a web of the wire saw. A slurry is supplied as abrasive to wire sections of the web while the wire sections are moved relative to the workpiece. The relative movement guides the wire sections from an entry side to an exit side through the workpiece. A coolant is sprayed from the side and below through nozzles into slicing gaps in the workpiece. The nozzles are arranged below the web parallel to the axes of the wire guide rolls. The coolant is sprayed into the slicing gaps through a nozzle situated opposite the entry side of the respective wire section.

Abstract: A sample preparation apparatus and method of preparing a rock sample using such an apparatus, as useful in connection with the digital numerical simulation of properties of the rock. The disclosed apparatus includes a fixably mounted diamond wire cutter. Three linear translation stages are coupled to a specimen holder. One of the translation stages moves the specimen in a direction parallel to the plane of the cutting wire. The other two translation stages move the specimen in different directions from one another, and when actuated together, advance the specimen into the wire for short distances in a direction out of the plane of the cutting wire. Short piecewise linear cuts are made in the specimen, to provide a sample of the desired shape with a small cross-section.

Abstract: A method for cutting a workpiece with a wire saw includes running at least one saw wire in a lateral direction. A first abrasive grain slurry is supplied to the saw wire on two points that are separated by a predetermined distance in a lateral direction. Cutting of the workpiece is started by moving at least one of the workpiece and the saw wire relative to the other and bringing the workpiece into contact with the saw wire from above at a location between the two points on the saw wire where the first abrasive grain slurry is supplied. A second abrasive grain slurry is supplied to a part of an area where the saw wire meshes with the workpiece.

Abstract: The present invention provides a method of cutting a workpiece efficiently with high accuracy by utilizing tension adjusters to approximate tension in a wire in a wire saw to a predetermined target tension while effectively reducing only tension in a winder-side wire. The method comprises a forward-driven cutting step of cutting a workpiece while moving a wire forward, a first switching step of reversing a driving direction of the wire, a backward-driven cutting step of cutting the workpiece while moving the wire backward, and a second switching step of reversing a driving direction of the wire and returning to the forward-driven cutting step, the steps being repeated in this order. In both switching steps, only tension in a winder-side wire is reduced by tension manipulators. A reduction in target wire tension therefor is performed after completion of deceleration of the wire in each switching step.

Abstract: The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a chemical property, a physical property, or both, and adjusting the chemical composition of the cutting fluid while cutting the workpiece to maintain the property being monitored. The present invention additionally provides an apparatus to perform the inventive method.

Abstract: A method including providing a ceramic log (300) with a first end and an opposing second end; providing one or more cutting devices (100) comprised of a dual bladed cutting member (200); and removing material by cutting at least the first end with the dual bladed cutting member (200), wherein a first blade (210) of the dual bladed cutting member (200) provides a finished surface and a second blade (220) removes a percentage of scrap above the finished surface. An apparatus (100) for cutting a ceramic log (300).

Abstract: The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw.

Abstract: A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal.

Abstract: A sawing wire (100,110,120,130) with abrasive particles (20) is presented wherein the particles (20) are partly embedded in said a metallic core (14) and partly in said an organic binder layer (30). The advantage of the wire (100,110,120,130) is that the application of a metallic binder layer (30) can be avoided. Metallic binder layers add to the cost of a fixed abrasive sawing wire and in many cases pose health and safety problems which can be avoided by the use of an organic binder layer. Moreover the advantages of a good fixture of the abrasive particles in the metallic wire are maintained. Different embodiments are presented with different degrees of embedment into the metal wire.

Abstract: Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at % iron, nickel and/or cobalt in the range of about 7 to 50 at %, at least one non-metal or metalloid selected from the group consisting of boron, carbon, silicon, phosphorus, and/or nitrogen present in the range of about 1 to 35 at %, and one metal selected from the group consisting of copper, titanium, molybdenum, aluminum, and/or chromium present in the range of about 0 to 25 at %, wherein the wire has an aspect ratio of greater than one and exhibits metallic and/or crystalline phases of less than 500 nm in size.

Abstract: An electrodeposited wire tool has a core wire extending in a longitudinal direction, a plating layer provided on an outer peripheral surface of the core wire, superabrasive grains held by the plating layer and coating layers covering the outer peripheral surfaces of the superabrasive grains. The coating layers are constituted of electroless Ni—P platings. The coating layers are heat-treated, and the electroless Ni—P platings are partially or entirely crystallized.

Abstract: A wire saw (S) for separating a plurality of ceramic components (11-16) from a ceramic component block (1) has a roller system (2), the roller system has a plurality of deflecting rollers (3-5) guiding a wire (6) to form a wire harp (7), wherein at least one of the deflecting rollers (3) is divided into separate discs (31-36) guiding a single wire winding (61-66) of the wire (6) and being inclined at an adjustable angle (a) of less than 90 DEG to an axle (A) connecting the centers (M1-M6) of the discs (31-36).

Abstract: A blade comprises a strip having a main body portion and an edge portion. Cutting medium in the form of a diamond grit is secured to the strip by braze material. The edge portion is thinner than the main body portion.

Abstract: The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.

Abstract: Example embodiments are directed to a wafer dividing apparatus and method thereof. The wafer dividing apparatus includes a chuck unit having upper and lower chucks, a cutting wire that is provided in a space between the upper and lower chucks to cut a wafer and driven by a first driving unit, and an etchant supplying nozzle supplying etchant to a groove of the wafer, which is formed by the cutting wire.

Abstract: The present invention is a band saw cutting apparatus including: a cutting table on which an ingot is horizontally placed; an endless-belt blade provided in a tensioned state between pulleys, the blade having a blade-abrasive-grain portion and a blade base; and a coolant spraying opening for spraying a coolant on the blade, the band saw cutting apparatus cutting the ingot by relatively feeding the blade from above to below, the blade being driven to rotate by rotating the pulleys, wherein the pulleys is configured to be rotatable about an axis thereof in both directions, and a direction of driving to rotate the blade can be changed to cut the ingot. As a result, there is provided a band saw cutting apparatus and an ingot cutting method that can stably secure the quality of the ingot to be cut, increase the lifetime of the blade, and improve the productivity.

Abstract: An integrated wafer processing system and a method thereof is disclosed. In one embodiment, a wafer stack of sliced wafers includes a base, and a plurality of sliced wafers extending outwardly from the base, where the plurality of sliced wafers are obtained by slicing a portion of a work piece, where the base is an uncut portion which is the remaining portion of the work piece or a plate attached by welding to the plurality of sliced wafers and where the work piece is mono-crystalline or multi-crystalline silicon. Further, the wafer stack of sliced wafers are treated in-situ in cleaning and wet chemical tanks for processes such as damage etching, texturization and oxide etching and also treated in-situ in high temperature furnaces for processes such as diffusion and anti-reflection coating.

Abstract: To provide a multi-wire saw that, at the start of cutting of an ingot, prevents a wire from being displaced in grooves of guide rollers due to the wire being lifted. A wire is wound around a plurality of wire guide rollers to be positioned in a feeding direction of an ingot, and in this state, a wire-lifting restraining member that is a body of rotation and restrains the wire from being lifted by being brought into contact with the wire is disposed near the wire guide rollers.

Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).

Abstract: The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.

Abstract: A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a first top outlet and a second top outlet located in a top position with respect to a work piece for applying fluids during sawing, and at least one chute located substantially below the work piece for receiving the fluids, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluids flow in a vertical direction against and into the work piece for slicing and cleaning wafers.

Abstract: Block-cutting gangsaw with vertical frame for cutting granite or other hard materials, comprising a blade-holding frame (19) that is supported with the possibility of reciprocating movement on an independent oscillating frame (40) which imparts the oscillating movement to it, so that each blade (20) of blade-holding frame (19) is always in contact with workpiece (18), and the contact area moves along a convex, curved trajectory.

Abstract: The present invention is a wire saw in which a wire for slicing is wound around a plurality of rollers to form a wire row; the wire for slicing is driven axially in a reciprocating direction; a workpiece is sliced simultaneously at a plurality of points arranged in an axial direction by feeding the workpiece against the wire row with the workpiece cut into while a slurry is supplied to the wire for slicing; the wire saw controlling in such a manner that the workpiece is extracted while the wire is caused to travel at a speed of 2 m/min or less at the time of extracting the workpiece from the wire row after slicing the workpiece. As a result, there is provided a wire saw in which the workpiece sliced with the wire row of the wire saw can be extracted from the wire row with a simple structure without a negative influence on its slicing surface.

Abstract: A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal.

Abstract: An apparatus for grinding a threaded portion of a workpiece, is provided. The threaded portion has a spiral groove formed therein. The apparatus includes a motor, a grinding cord, a detector and a controller. The motor has a rotary portion for rotating the threaded portion of the workpiece about an axis. The grinding cord is configured for being looped around the threaded portion of the workpiece with a middle part thereof engagingly received in a given portion of turns of the spiral groove for grinding the thread portion of the workpiece. The detector is for detecting a rotating cycle of the rotary portion. The controller is communicatively coupled to the detector for controlling the rotary portion to selectively rotate in a first rotating direction or in a reverse second rotating direction based on the received signal from the detector.

Abstract: The present invention is a wire saw in which a wire is wound around a plurality of grooved rollers, the workpiece is sliced into wafers by causing the wire to travel and pressing the workpiece against the wire while a slurry is supplied to the grooved rollers, the wire saw controlling in such a manner that the workpiece is sliced while a supply temperature of the slurry is increased from the start to the end of slicing the workpiece. As a result, there is provided a wire saw in which Warp of the workpiece to be sliced can be improved by suppressing a decrease in a temperature of the workpiece in the vicinity of the slicing end portion of the workpiece and by making an increase in displacement of the grooved roller during slicing straight, that is, by making the slicing trajectory depicted in the workpiece close to a straight line.

Abstract: The present invention is a method for resuming operation of a wire saw comprising the steps of: slicing the workpiece while measuring and recording a displacement amount in an axial direction of each of the grooved rollers and a temperature of the workpiece during the slicing of the workpiece; suspending the slicing of the workpiece; adjusting the displacement amount in an axial direction of each of the grooved rollers and the temperature of the workpiece by supplying temperature-adjusting mediums separately temperature-controlled to the grooved rollers and the workpiece so as to be equal to the displacement amount and temperature recorded upon suspending the slicing of the workpiece respectively, after the suspending, before resuming the slicing of the workpiece; and thereafter resuming the slicing.

Abstract: A superabrasive wire saw-wound structure includes a superabrasive wire saw (10) formed with an average diameter D and a reel (1). The superabrasive wire saw (10) includes a core wire (11), a bonding material (12) surrounding a surface of the core wire (11), and a plurality of superabrasive grains (13) bonded to the surface of the core wire (11) with the bonding material (12). The reel (1) includes a peripheral surface (2) having one end (3) and the other end (4). The superabrasive wire saw (10) which is to be unreeled successively toward a workpiece is wound around the peripheral surface (2) reciprocatingly between the one end (3) and the other end (4) to be multi-layered. A pitch P for winding the superabrasive wire saw (10) around the peripheral surface (2) between the one end (3) and the other end (4) satisfies a relation of D<P<2D.

Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).

Abstract: Improved methods including providing a frame saw system having multiple blades for cutting slabs of masonry materials. The improved methods allow for cutting masonry materials into slabs having surface small deviations. A process for cutting masonry blocks of granite, marble, rock, and the like, also includes positioning a support structure of a unifying material perpendicularly across the blade of the frame saw, wherein the support structure is adhered to at least one of the blades for keeping the blades in fixed relative positions, subjecting the block to a sawing operation using the frame saw, and at least substantially removing the support structure as the blades become submerged in the block.

Abstract: The present invention is a wire saw in which a wire for slicing is wound around a plurality of rollers to form a wire row; the wire for slicing is driven axially in a reciprocating direction; a workpiece is sliced simultaneously at a plurality of points arranged in an axial direction by feeding the workpiece against the wire row with the workpiece cut into while a slurry is supplied to the wire for slicing; the wire saw controlling in such a manner that the workpiece is extracted while the wire is caused to travel at a speed of 2 m/min or less at the time of extracting the workpiece from the wire row after slicing the workpiece. As a result, there is provided a wire saw in which the workpiece sliced with the wire row of the wire saw can be extracted from the wire row with a simple structure without a negative influence on its slicing surface.

Abstract: The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron present in the range of 12.0 to 19.0 atomic percent, nickel present in the range of 15.0 to 17.0 atomic percent, cobalt present in the range of 2.0 to 21.0 atomic percent, optionally carbon present in the range of 0.1 to 6.0 atomic percent and optionally silicon present in the range of 0.4 to 4.0 atomic percent, wherein said wire has a thickness of 140 ?m or less and wherein said wire includes spinodal glass matrix microconstituents. The wire may be used in abrading a substrate.

Abstract: Block-cutting gangsaw with vertical frame for cutting granite or other hard materials, comprising a blade-holding frame (19) that is supported with the possibility of reciprocating movement on an independent oscillating frame (40) which imparts the oscillating movement to it, so that each blade (20) of blade-holding frame (19) is always in contact with workpiece (18), and the contact area moves along a convex, curved trajectory.

Abstract: A skid plate for a concrete saw is integrally cast having two end mounting portions and a middle portion with a slot in the middle portion. A horizontal slot in a leading end mounting portion cooperates and a vertical slot in the trailing end portion releasably engage pins on the saw to allow the skid plate to be easily fastened to and removed from the saw. A spring loaded latch mechanism holds the pins in the slots.

Abstract: The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.