Abstract: To provide a multi-wire saw that, at the start of cutting of an ingot, prevents a wire from being displaced in grooves of guide rollers due to the wire being lifted. A wire is wound around a plurality of wire guide rollers to be positioned in a feeding direction of an ingot, and in this state, a wire-lifting restraining member that is a body of rotation and restrains the wire from being lifted by being brought into contact with the wire is disposed near the wire guide rollers.

Abstract: The present invention provides a method for slicing a silicon single crystal ingot having a plane direction (110) by a wire saw to manufacture a (110) silicon wafer, wherein slicing is performed in such a manner that each angle formed between a traveling direction of a wire in the wire saw and a [?112 ] direction and a [1-12] direction in the (110) silicon single crystal ingot or a direction crystallographically equivalent to the directions exceeds 30°. As a result, the method for manufacturing the (110) silicon wafer that can suppress occurrence of breaking at the time of slicing and improve a production yield ratio can be provided.

Abstract: An improved frame saw system has multiple blades for cutting slabs of masonry materials. The improved systems and methods allow for cutting masonry materials into slabs having surface small deviations. A frame saw system may include a support structure of unifying material bonded to at least one of the blades for keeping the blades in fixed relative positions. The support structure may be removable from the frame saw system as the blades are engaged in a swinging motion cutting into the block. In addition, a process for cutting masonry blocks of granite, marble, rock, and the like, includes pretreating the surface of the block with a skim coat to fill surface irregularities prior to cutting operations. A frame saw system may contain one or more spacers between the saw blades wherein a compressive force is applied across the blades connected to a frame to reduce deflection of the blades while cutting.

Abstract: In a method for detaching a plurality of ceramic components (11-15) from a ceramic component block (1), the following steps are provided: providing the component block (1); mounting a plurality of parallel wire segments (21-26) in a frame (3) to form a saw frame (2); and sawing the provided component block (1) into the plurality of components (11-15) using the saw frame (2).

Abstract: Improved methods including providing a frame saw system having multiple blades for cutting slabs of masonry materials. The improved methods allow for cutting masonry materials into slabs having surface small deviations. A process for cutting masonry blocks of granite, marble, rock, and the like, also includes positioning a support structure of a unifying material perpendicularly across the blade of the frame saw, wherein the support structure is adhered to at least one of the blades for keeping the blades in fixed relative positions, subjecting the block to a sawing operation using the frame saw, and at least substantially removing the support structure as the blades become submerged in the block.

Abstract: A method and a device for cutting a workpiece in a wire saw is described, wherein a workpiece is fixed in a wire saw by means of a mounting beam. In the method according to the invention, the generation of a mark or a step on the cutting area along the cutting slit at the transition from the workpiece to the mounting beam is moved further to the edge of the cutting area or is avoided entirely. Therefor, the workpiece is held during the cutting operation in the wire saw by a mounting beam such that while one of the two piercing points lies on the surface of the workpiece and while simultaneously the other of the two piercing points lies on the surface of the mounting beam, the piercing point lying on the surface of the workpiece is the entry side piercing point.

Abstract: A method of manufacturing silicon wafers that include a front surface and a block surface and lateral edges, includes forming a silicon wafer by separating a rectangular, in particular, silicon block with lateral surfaces and before separation, grounding and/or polishing the lateral surfaces of the silicon block parallel to the edge of the silicon wafer.

Abstract: The sawing machine according to the invention comprises a double portal structure (11) with two pairs of uprights (11.1), along which slides a respective ram (13). The rams (13) bear four support shafts (15), superposed in pairs and each supporting a coaxial roller, respectively a plurality of coaxial pulleys (18), mutually juxtaposed in packet fashion, having coplanar races according to respective vertical planes. A shaft (15) rotates integrally with the respective roller, or with the respective packet of pulleys (18). The other rollers, or packets of pulleys (18) are idle. On sets of four coplanar races is wound a corresponding wire or cutting tool (19) in closed loop, to execute the cut in a corresponding vertical plane of a block of material (B).

Abstract: The invention provides a cutting method and a cutting apparatus that cuts without chipping a composite material consisting of laminated layers of crystal material and amorphous material, in which the amorphous material is cut with an ultrasonically vibrated cutting blade and the crystal material is cut with a cutting blade that does not ultrasonically vibrate. With such a method and apparatus, the crystal material portion and the amorphous material portion of the composite material can be cut cleanly without chipping.

Abstract: A cutting apparatus that positions a wire saw driving device movably and appropriately at the desired site by freely moving an arm of a backhoe provided with a boom, which arm carries the wire saw driving device and is turnable and movable in upward, downward, leftward, rightward, forward, and backward directions, thus enabling cutting at sites too narrow in which to use a conventional machine. Cutting by use of a wire saw and by use of a disk blade can be alternately performed as needed.

Abstract: A skid plate for a concrete saw is integrally cast having two end mounting portions and a middle portion with a slot in the middle portion. A horizontal slot in a leading end mounting portion cooperates and a vertical slot in the trailing end portion releasably engage pins on the saw to allow the skid plate to be easily fastened to and removed from the saw. A spring loaded latch mechanism holds the pins in the slots. A replaceable insert is press fit or otherwise held in the skid plate, with the insert replacing portions of the skid plate adjacent an up-cutting edge of the cutting blade.

Abstract: A graphite block cut into slabs by a sawing device comprising a plurality of generally parallel, spaced-apart blades with each of the blades having a plurality of cutting segments mounted thereon, each of the cutting segments comprising a continuous phase impregnated with a superabrasive material selected from one of natural diamond, synthetic diamond, cubic boron nitride, and combinations thereof; wherein each of the granite slabs as cut from the block has a surface roughness Ra of less than 500 ?-in, and with thickness variation of 2 mm or less from a nominal slab target.

Abstract: The present invention features a reciprocating wire saw particularly adapted or configured for cutting hard materials. In one aspect, the reciprocating wire saw comprises (a) a flexible wire; (b) a plurality of cutting segments fittable onto the flexible wire, wherein each of the cutting segments comprises an outer surface; and a (c) plurality of superabrasive particles braze bonded onto the outer surface of the cutting segments to form a cutting wire. In another aspect, the reciprocating wire saw comprises a plurality of superabrasive particles braze bonded directly to the wire itself to form a cutting wire. The cutting wire is unique in that it comprises a pre-determined superabrasive particle concentration and is configured to cut various materials, such as granite, in a reciprocating manner.

Abstract: A graphite block cut into slabs by a sawing device comprising a plurality of generally parallel, spaced-apart blades with each of the blades having a plurality of cutting segments mounted thereon, each of the cutting segments comprising a continuous phase impregnated with a superabrasive material selected from one of natural diamond, synthetic diamond, cubic boron nitride, and combinations thereof; wherein each of the granite slabs as cut from the block has a surface roughness Ra of less than 500 ?-in, and with thickness variation of 2 mm or less from a nominal slab target.

Abstract: A horizontal frame saw is equipped with a plurality of generally parallel, spaced-apart blades for cutting granite. Each of the blades has a cutting edge with diamond cutting segments mounted thereon for engaging the granite with a swinging motion for cutting of the granite, wherein the segments have optimized/controlled segment variables for uniform wearing of the segments along each blade during cutting of granite. Segment variables include one or more of: spacing of segments along the length of the blade; diamond concentration in each segment; diamond grade (as measured by compressive fracture strength) in each segment; segment composition (bond, secondary abrasives); or segment dimensions.

Abstract: A saw blade for medical, in particular surgical, applications having a recess for mounting the saw blade inside a saw which exerts an saw movement, especially an oscillating saw movement, to the saw blade. In order to improve the dynamic behavior of the saw blade, longitudinal flat areas of a surface of the saw blade are provided with a plurality of superficial impressions of a defined contour that are aligned at an angle to the longitudinal axis of the saw blade.

Abstract: A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.

Abstract: A process id disclosed for structurally repairing and aesthetically filling, and mutually coupling slabs (1) and layers (2–4) into a block (5), comprising the steps of: heating, drying and impregnating the slabs (1) with resin; penetrating the resin through atmospheric pressure; inserting positive pressures; applying a liquid- or gas-tight sealing coating (6, 7, 8) around the block (5) to allow resin to flow around and inside the block (5), containing hydrostatic resin pressures and checking resin consumptions through a formwork; directly supporting through the block (5) the thrusts generated by pressure differentials; when preparing the block (5), assembling the stone slabs (1) independently from mutual thickness and distance between centers with other stone slabs (1).

Abstract: The present invention relates to a saw blade for cutting and finishing the surface of a work piece. The saw blade having a set of teeth disposed about the outer edge for making a cut in a work piece and an abrasive secured to the lateral surface of the saw blade. The abrasive extending laterally outwardly from the surface of the saw blade and providing a finishing effect on the work piece as the abrasive widens the cut beyond the cut of the saw blade teeth. A method for cutting and finishing a surface of a work piece utilizing a saw blade with an abrasive secured to a lateral surface of the blade and the abrasive extending beyond the cut of the saw blade teeth.

Abstract: The invention relates to a cable saw device (1) comprising a sawing cable (25) and a cable storage device (30) which is used for temporary accommodation of the sawing cable (25). The cable storage device (30) comprises several deflection rollers (5,6). At least two of said deflection rollers (5,6) are placed at a modifiable axial distance (A) from each other. The cable saw (25) is driven by several deflection rollers (5). Means for compensating the different speeds of the cable saw (25) are arranged between the driving deflection rollers (5).

Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.

Abstract: A sawing device includes a wire assembly (15) supported on wire-guiding rolls (11, 12) and pressed against a workpiece to be sawn (20) fixed on a support table (21). An oscillating device (23) produces a relative reciprocating movement between the workpiece and the wire assembly (15) around an oscillation axis (A) whereof the spatial position can be adjusted and programmed so that the oscillation axis (A) is at a programmable and adjustable distance from an effective axis of rotation (28) of the oscillating device (23).

Abstract: An improved portable stone cutter includes a base which is of a rectangular frame composed of a plurality of longitudinal bars, a pair of transverse bars and a pair sliding bars, a working table slidably secured to the sliding bars, a motor disposed on the front end of the frame and sustained by an arcuate support arm and a supplementary support arm which are releasably and rotatably secured to a pair of outmost longitudinal bars, a guarded circular saw blade connected to the motor and operated by the motor via a belt and a transmission shaft and a tool plate movably disposed to one of the outmost longitudinal bars. The feature is that the arcuate support arm and the supplementary support arm define a large space to permit a large piece of stone passing through the saw blade and both the supplementary support arm and the tool plate are removable to reduce the volume of the stone cutter to conveniently pack for transportation.

Abstract: A method for cutting a rare earth alloy using a wire with abrasive grains fixed to a core wire, including the step of cutting the rare earth alloy with the wire traveling in a state that a portion of the rare earth alloy to be cut with the wire is immersed in a coolant containing water as the main component, the coolant having a surface tension at 25° C. in a range of 25 mN/m to 60 mN/m.

Abstract: An apparatus and a method for determining the orientation of a crystallographic plane (100) relative to a crystal surface (2) are provided, in which the orientation is free from errors of adhesion of the crystal or contamination of the holders for the crystal. For this purpose, the angle which the crystal surface to be measured forms with a reference axis and the angle which the crystallographic plane forms with the reference axis are measured and subtracted. In a wire sawing apparatus with an X-Y positioning unit, next the desired correction is made with the aid of measurement of the orientation and at the same time the crystal is displaced in horizontal and vertical positions. As a result, there remains a further degree of freedom of rotation of the crystal in the cutting plane for achieving a cut which is free from forces perpendicular to the feed direction and wire direction, so that no tool deflection takes place or the cutting forces are minimal. Further, the precision of orientation is increased.

Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.

Abstract: A cutting blade is fixed on a shaft that rotates about its shaft center, and that is linearly advanced by an advancing movement. The shaft's center further revolves with a small radius of revolution at a rapid predetermined rate of revolution greater than the rate of advancing movement. Thus the blade is pressed against and cuts a substrate and produces chips, and the blade is intermittently disengaged from the substrate whereby the chips move in the direction in which the blade rotates to be removed from between the cutting edge of the blade and the substrate. This reduces working resistance, enhances working efficiency, and prevents the blade surface from having significant frictional heat. Furthermore, the generated frictional heat can readily dissipate and the blade can thus have a long life.

Abstract: A method for separating slices from a hard brittle workpiece involves subjecting the workpiece to an advancing movement and pressing it onto wires of a wire web of a wire saw, the wires being under a defined wire tension and making contact with the workpiece over a cutting depth along a cutting contour. The wires are lifted off the cutting contour an number of times while the wire tension is kept substantially unchanged, with the aid of rolls of a roll system. The roll system comprises at least one roll that is moved onto the wire web and back, the roll system comprising at least two moveable rolls which flank the workpiece. A wire saw is suitable for carrying out the method.

Abstract: The present invention relates to an apparatus for cutting a wafer, wherein the wafer cutting process is performed along a back side of a wafer, a semiconductor chip being formed on the front side thereof, by cutting the wafer along the back side of the wafer by directly recognizing the semiconductor chip shape formed on the front side of the wafer thereby minimizing cutting defects due to sawing blade misalignment. The present invention includes a hole formed in the center portion of a chuck table on which the wafer, which is facing down, is attached and a camera installed under the hole of the chuck table. After the wafer is properly aligned by the camera recognizing the semiconductor chip shape formed on the front side of the wafer, a wafer cutting process is performed by a sawing blade.

Abstract: A constitution comprises separated processing of an abrasive grain waste liquid into recycled abrasive grain and a fine abrasive grain mixed liquid in a first centrifugal separator, adding a fresh cutting liquid to the fine abrasive grain mixed liquid to direct the resulting liquid to a second centrifugal separator to subject the same to separated processing in the second centrifugal separator, into waste abrasive grain and a recovered cutting liquid directing the recovered cutting liquid through a recovered cutting liquid tank to a recovered abrasive grain tank, adding fresh abrasive grain and a cutting liquid for dilution to the recovered cutting liquid in the recovered cutting liquid tank and to the recycled abrasive grain to create a recycled abrasive grain mixed cutting liquid, and feeding the recycled abrasive grain mixed cutting liquid to an abrasive grain supply tank.

Abstract: The invention refers to a method for cutting blocks of stone (12), by means of a gangsaw (1) provided with diamond sector blades (35), comprising, besides a reciprocal approaching movement between the blades (35) and the block (12) and a periodical reciprocating movement of the blades (35), also a cyclic movement of approaching and moving away of the blades (35) relative to the block (12) and a hunting movement of the blade-holder frame. (FIG.

Abstract: A horizontal frame saw is equipped with a plurality of generally parallel, spaced-apart blades for cutting granite. Each of the blades has a cutting edge with diamond cutting segments mounted thereon for engaging the granite with a swinging motion for cutting of the granite.

Abstract: An aqueous grinding fluid has compositions mainly consisting of 40.0-95.0 wt. % a polyalcohol and/or a polyalcohol derivative, 5.0-50.0 wt. % water, 0.1-3.5 wt. % bentonite, 0.1-5.0 wt. % cellulose and weight %, 0.5-10.0 wt. % mica and optionally a small amount of a surfactant or polar solvent. Bentonite, cellulose and mica are preferably added with such combination to adjust a viscosity of a slurry to 150-300 mPa.second as a value measured by a rotating cylinder type viscometer. The aqueous suspension is nonflammable and stabilized in dispersiveness and settleability-proof of abrasive grits as well as a viscosity for a long time, and facilitates washing and cleaning of sliced wafers and a grinding machine without radiation of stinks.

Abstract: A device for simultaneously separating a multiplicity of wafers from a hard brittle workpiece having a longitudinal axis, with a wire web made from saw wire and with an advancing device which brings about a translational relative movement, which is perpendicular to the longitudinal axis of the workpiece, between the workpiece and the wire web of the wire saw, in the course of which movement the workpiece is passed through the wire web, wherein the wire web is formed from a multiplicity of individual wires, and wherein there is a device for holding and rotating the workpiece about the longitudinal axis.

Abstract: A thin strip-shaped grindstone 12 is held flat under tension and moved backwards and forwards in the longitudinal direction, while the grindstone is moved in a direction perpendicular to a cylindrical ingot 1 and cuts the ingot. A metal-bonded grindstone is used as the strip-shaped grindstone 12, at least one pair of electrodes 23 are disposed adjacent to both surfaces of the metal-bonded grindstone one on each side of the ingot. The metal-bonded grindstone is made the positive electrode and DC voltage pulses are applied between the grindstone and the electrodes, and at the same time, a conducting processing fluid 25 is fed to the gaps between the metal-bonded grindstone and the electrodes, and both surfaces of the metal-bonded grindstone are dressed electrolytically on both sides while the cylindrical ingot is being cut by the metal-bonded grindstone.

Abstract: A method for creating decorative patterns on surfaces of cured concrete blocks includes a plurality of texturing elements secured to one or more rotatable shaft via a plurality of flexible support cables. Upon rotation of the shaft, centrifugal force causes the secured texturing elements to radially extend from the shaft. The blocks are preferably positioned such that the rotating texturing elements repeatedly come into contact with particular surfaces of the blocks, thereby forming a textured or antiqued pattern on such block surfaces. In a particular embodiment, the rotatable shaft is reciprocally moved in a direction parallel to the block surfaces to be patterned, whereby an entire block surface is exposed to the rotating texturing elements.

Abstract: A slicing center includes a first structure (23) to carry out operations (24) necessary for the production of processed slices in trays or packaged, from pieces to be sliced. These operations (24) are controlled and interconnected by a second structure (25) so as to form subgroups (26) consisting of a positioning unit, a slicing unit, a processing unit and a final treatment unit. These subgroups (26) are in turn interconnected by third structure (27) comprising devices for storing and devices for handling and transportation of the slices, thereby to form a chain of transfer in which all the elements are compatible and interconnected.

Abstract: A saw cable guide (1) is provided with a stand (2) and at least two rotatable cable guide rollers (5, 9) mounted pivotably thereon. These are arranged with their pivot axes (8, 12) forming an angle with one another. The saw cable (19) is led around the stand (2) at a corresponding angle. A rotatable deflecting roller (13) is located on the stand (2). The rotatable deflecting roller (13) guides the cable during the deflection and may have a cable guide surface (15) with an oblique profiling (21).

Abstract: A work cutting apparatus comprises a plurality of cutting blades each including a metal plate phase containing a super hard abrasive grain dispersed entirely thereon. A work made of a rare-earth alloy magnet member is submerged in a coolant in a container. The work submerged in the coolant is cut by rotating the cutting blades at a high speed not slower than 8000 rpm and by moving the cutting blades to the work vertically or along a normal line passing a tangential point between the cutting blade and the work. The coolant may be supplied from a hose to a cutting region at a time of the cutting. At the time of cutting, the work is vibrated in a direction parallel to a main surface of the cutting blade and perpendicular to a direction of the cutting. Preferably, the cutting blade has a tip portion formed with a cutout, and a spacer including two main surfaces each having an outer circumferential portion formed with an annular stepped portion is inserted between the cutting blades.

Abstract: A wedge (6, 6′) intended to be inserted into a cutting slot is made in two parts (41, 42), the two parts (41, 42) comprising means (3) which allow them to slide one over the other, so as to produce a double wedge (6, 6′), the total thickness of which can vary between a maximum thickness value and a minimum thickness value.

Abstract: The vertical blade saw assembly for ceramic and masonry materials is designed to provide an assembly that allows the user to make cuts of any shape to ceramic tiles and masonry materials in order to permit the installation of precision cuts for a particular setting. The assembly has an electric drive motor that is protected from the coolant used to keep the blade from overheating. The assembly has a plurality of parallel arms that are connected and permit the oscillating motion of the arms. The vertical blade is connected to the arms which place the blade in motion. The assembly has a base unit to provide support for the assembly. A coolant tray is positioned around the base unit. A water pump and accompanying tubing is used to circulate the coolant to the blade. Several cutting blades are also disclosed.

Abstract: The present invention relates to a cutting block for a sawing machine for sawing stone blocks into slabs which has a pair of opposed yokes for tensioning a plurality of blades by means of tie-bars with spurs, wherein the tie-bars which hold the blades have a single spur between two blades placed side by side.

Abstract: A method for cutting a rare earth alloy of this invention includes cutting an object to be machined while supplying slurry containing dispersed abrasive grains between a wire and the object to be machined. The wire is driven with a drive member, at least a wire contact face of the drive member being composed of an organic polymer material. Cutting is carried out while a tension in a range between 14.7 N and 39.2 N is applied to the wire.

Abstract: The invention concerns a wire sawing device comprising at least a support table (35) bearing a piece to be sawed (34) urged against the set of wires layer (26, 27) two outer wire-guide rolls (10, 11) powered by motors (14, 15) and at least two inner wire-guide rolls (16, 17). The wire (18) is wound on the wire-guide rolls so as to constitute between the inner wire-guide rolls (16, 17) two cross sets of wires (26, 27) whereof the projecting wires are parallel and at a distance from a first space (31) and so as to be returned by the outer wire-guide rolls (10, 11) whereon is provided a second space (30) twice the first space (31). Such an arrangement enables a balanced distribution of forces on the inner wire-guides (16, 17), the surfaces of the sawed slices to be perfectly parallel, the shearing forces on the piece to be sawed (34) to be reduced, a decrease in the cutting pressure, a greater cutting speed and to improve the precision of the resulting slices.

Abstract: Devices and methods for cutting fiber-cement materials, such as planks, panels, boards, backing substrates and other materials. A fiber-cement siding cutting tool in accordance with one embodiment of the invention can have an actuator including a driver that moves along a stroke path between a release position and a cutting position. The fiber-cement siding cutting tool can also have a pair of cutting blades including a first cutting blade having a first cutting edge and a second cutting blade having a second edge. The first cutting blade is coupled to the driver to move along the stroke path between the release position and the cutting position. The second cutting blade can be positioned along the stroke path such that the first cutting edge faces the second cutting edge. The fiber-cement siding cutting machine can also include a workpiece support assembly having a first support member on a first side of the stroke path and a second support member on a second side of the stroke path.

Abstract: A slicing device using yarn includes at least two yard-guide cylinders on which the yarn is wound and by which the yarn can be moved with a reciprocating or continuous motion pressed against a piece to be sliced fixed on a supporting table. The yarn is wound on the yarn-guide so as to form at least two layers of yarn intersecting with one or several non-null intersecting angles (&bgr;) and so as to pass in a straight line from one cylinder to the other. The angle of inclination between the moving direction of the piece to be sliced and a line perpendicular to the plane of the yarn cylinder axes is adjustable so as to obtain strictly parallel slices. The intersection of the yarn layers improves the quality of slices obtained by facilitating the subsequent mechanical treatment operations of surfaces with crossed faults. Moreover, the angle of the yarn layers reduces the shearing and torsional stresses on the support of the piece to be sliced when the slices are being cut.

Abstract: A machine for cutting brittle materials includes a mandrel or shaft (200) having a first portion (310) with a taper, a sleeve (400) having an inner surface (410) and an outer surface (420) where the inner surface has the taper and is located adjacent to the first portion of the shaft, and a coating (890) around the outer surface where the coating has grooves (1010) extending around the sleeve.

Abstract: An attachment for a dicing saw having a housing, a carriage mounted in the housing, a bellows coupled to the carriage, and at least one drainage channel in the housing, the attachment including a collector for automatically collecting debris and fallen dice during operation of the dicing saw. There is also provided a method for cleaning a dicing saw having a housing, a carriage mounted in the housing, a bellows coupled to the carriage, and at least one drainage channel in the housing, the method including the steps of automatically collecting debris and fallen dice in a collector during operation of the dicing saw.

Abstract: A constitution comprises separated processing of an abrasive grain waste liquid into recycled abrasive grain and a fine abrasive grain mixed liquid in a first centrifugal separator, adding a fresh cutting liquid to the fine abrasive grain mixed liquid to direct the resulting liquid to a second centrifugal separator to subject the same to separated processing in the second centrifugal separator, into waste abrasive grain and a recovered cutting liquids directing the recovered cutting liquid through a recovered cutting liquid tank to a recovered abrasive grain tank, adding fresh abrasive grain and a cutting liquid for dilution to the recovered cutting liquid in the recovered cutting liquid tank and to the recycled abrasive grain to create a recycled abrasive grain mixed cutting liquid, and feeding the recycled abrasive grain mixed cutting liquid to an abrasive grain supply tank.

Abstract: A wire-saw constituted by a rope-like core wire and a cylindrical coil-like saw-wire body wounded around the core wire, and a large number of abrasive grains firmly fixed to the saw-wire body by metal. Problems of conventional wire-saws, such as unstable working performance, a short tool life, low safety and low reliability, and so on, are solved.