Abstract: A drilling unit for drilling a hole, wherein the drilling unit comprising a drilling head (1). Said drilling head (1) further comprising pulling means (2) for pulling a casing (7) into the hole, a pilot bit (3) for drilling a center hole, connecting means and a ring bit assembly (4) for reaming the center hole for the casing (7). Said ring bit assembly (4) being connected to said pilot bit (3) by the connecting means and to said casing (7) by the pulling means (2). Said ring bit assembly (4) comprising a carrier (5) comprising carrier coupling means (23) and a plurality of ring bit segments (6) movably attached to said carrier coupling means (23).

Abstract: Provided is an indium phosphide substrate, a semiconductor epitaxial wafer, and a method for producing an indium phosphide substrate, which can satisfactorily suppress warpage of the back surface of the substrate. The indium phosphide substrate includes a main surface for forming an epitaxial crystal layer and a back surface opposite to the main surface, wherein the back surface has a WARP value of 3.5 ?m or less, as measured with the back surface of the indium phosphide substrate facing upward.

Abstract: Provided is an indium phosphide substrate, a semiconductor epitaxial wafer, and a method for producing an indium phosphide substrate, which can satisfactorily suppress warpage of the back surface of the substrate. The indium phosphide substrate includes a main surface for forming an epitaxial crystal layer and a back surface opposite to the main surface, wherein the back surface has a BOW value of ?2.0 to 2.0 ?m, as measured with the back surface of the indium phosphide substrate facing upward.

Abstract: A method for producing a tool with a diamond-studded tool head includes the steps of providing a tool shank and fixing a support element to a free end of the tool shank. The method further includes the steps of applying a layer of material interspersed with diamonds at least in sections to the support element and to a section of the tool shank adjoining the support element, and at least partially removing the support element, so that the layer of material interspersed with diamonds forms a tool head which in cross-section has the form of a circular ring and has a front-side recess.

Abstract: A method of cutting a microtrench in which the buried utility is exposed by opening an access hole in a roadway above the buried utility using a roadway access hole drill that rotates and vibrates the drill bit. A roadway access hole drill having a down-the-hole jack-hammer drill bit and a motor to rotate the down-the-hole jack-hammer drill.

Abstract: A laser processing apparatus includes a chuck table for holding a workpiece, a laser beam applying unit for applying a pulsed laser beam to the workpiece held by the chuck table while positioning spots of the pulsed laser beam on the workpiece, thereby processing the workpiece with the pulsed laser beam, and a control unit for controlling operation of the laser beam applying unit. The laser beam applying unit includes a laser oscillator for oscillating pulsed laser to emit a pulsed laser beam, a decimator for decimating pulses of the pulsed laser beam to adjust a repetitive frequency thereof, a scanner for scanning the spots of the pulsed laser beam over the workpiece at predetermined intervals, and an f? lens for focusing the pulsed laser beam.

Abstract: A method is for generating a freeroom for a mast element in a ground. The method includes the steps: a) drilling a first annular recess into the ground, the first recess having: a first diameter; and a first depth; b) drilling a second annular recess in the ground, the second recess being arranged to receive the mast element, and the second recess: having a diameter which is smaller than the first diameter; having a second depth which is larger than the first depth; surrounding a first core of the ground; and being surrounded by the first recess; wherein there is, defined between the first recess and the second recess, a second core which can be removed to generate a freeroom.

Abstract: Wall sealing and penetrator apparatus for use in penetrating walls in dangerous conditions. An example wall sealing and penetrator apparatus includes a first portion comprising: a first housing, a first sealing element, a first vacuum port; and a second portion comprising, a second housing, a second sealing element, a second vacuum port, and a cutting element.

Abstract: A tool head capable of introducing deep recesses into hard and brittle material such as glass and glass ceramics is provided. The tool head includes a hollow cylindrical abrasive body merging into a hollow shank. The hollow cylindrical abrasive body has an end face with a central abrasive area at the location of a cylinder axis. The central abrasive area is connected with the inner wall surface of the hollow cylindrical abrasive body by at least one web. The end face of the abrasive body, the web, and at least a portion of the outer wall surface of the abrasive body are covered with abrasive. The hollow shank has at least one opening to the interior between the at least one web and the inner wall surface of the abrasive body.

Abstract: A machine for boring holes into a slab includes a plurality of milling bits mounted on a distal end of a rotatable carrier and a coring bit slidably connected to the carrier such that the coring bit rotates with the rotating carrier and is slidable axially relative to the carrier. The coring bit cuts a relatively smooth bore into the solid medium whereas the milling bits create a bore with a relatively rough finish. An actuator engages the coring bit to adjust the depth of cut of the coring bit relative to the milling assembly depending on the desired finish of the hole to be bored. An undercut assembly is mounted on the carrier and selectively operable to form an undercut in the slab at the bottom of the hole so that a cured patch of material poured into the hole is restrained from working loose from the hole.

Abstract: Disclosed are examples of methods and systems for cutting up a reinforced concrete mass, in which a drilling tool is provided. In various embodiments, the drilling tool comprises: a drill tube carrying a cutter member; a device for causing the drill tube to vibrate, the device comprising a vibration generator for generating longitudinal vibration in the drill tube; a device for injecting a drilling fluid at the distal end of the drill tube; and a device for moving the drill tube along its longitudinal direction. In the disclosed methods and systems, the reinforced concrete mass is cut up by drilling at least one hole with the help of the drill tool by causing the drill tube to vibrate while injecting the drilling fluid into the mass from the distal end of the drill tube.

Abstract: A drill bit is disclosed. The drill bit has a cutting portion having an annular portion, where the annular portion has a first end on which is disposed a cutting element and a second end that includes an outer insertion element and a stop shoulder. The drill bit has a drill shaft portion having a cylindrical drill shaft, where the drill shaft has an inner insertion element with an end face on a side of the drill shaft facing the cutting portion. The outer insertion element and the inner insertion element together form a plug connection in an insertion direction that is parallel to the axis of rotation and the insertion elements are connectable to each other via a pin element that is movable into a slot-shaped recess. The pin element is attached to an outside of the inner insertion element and the outer insertion element has the slot-shaped recess.

Abstract: Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Abstract: A cutting apparatus including a cutting unit on which a cutting blade is detachably mounted, a control unit for controlling the cutting unit, and a blade case holder for holding a blade case for storing the cutting blade is provided. The blade case is provided with an IC tag allowing reading and writing of use history information of the cutting blade. The control unit is connected to a read/write unit for reading the use history information from the IC tag of the blade case held by the blade case holder and writing the use history information to the IC tag. The use history information read from the IC tag by the read/write unit is reflected in processing conditions for a workpiece to be processed, and the use history information after processing of the workpiece is written to the IC tag by the read/write unit.

Abstract: A drill bit which is rotatable about a drilling axis is disclosed. The drill bit has a cutting section having one or more cutting segments and a first plug-connecting element and a drill shaft section having a second plug-connecting element. The first plug-connecting element and the second plug-connecting element form a plug connection and the first plug-connecting element and the second plug-connecting element are connectable by a pin connection.

Abstract: A drill bit which is rotatable about a drilling axis is disclosed. The drill bit has a drill shaft section having a first plug-connecting element and a cutting section having a second plug-connecting element. The first plug-connecting element and the second plug-connecting element form a plug connection. The cutting section includes a plurality of cutting subsections each having a ring subsection and at least one cutting segment, wherein each ring subsection together with the first plug-connecting element forms the plug connection and is connectable to the first plug-connecting element by a pin connection.

Abstract: A core drill bit includes an elongate hollow cylindrical body having opposite first and second end sections, a plurality of cutting segments with a connecting portion joined to the second end section, a plurality of reinforcing members joined to the second end section between the cutting segments and contacting adjacent cutting segments to offer rotational support thereto, and a plurality of current concentrators disposed on one or both of the second end section and the connecting portion. The cutting segments being capacitive discharge welded to the second end section whereby the surface of the second end section melts during the welding to affix the cutting segments with the tool body. The cutting segments include diamonds dispersed therein with portions having varying diamond concentrations.

Abstract: Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Abstract: Lifter cups are provided for engaging and lifting objects and include a mounting portion and a flexible engaging portion. The flexible engaging portion is configured to form a sealing disk for engaging the object. The sealing disk has channels diffusing fluid from the contact surface with the object. The channel walls have raised portions separated by concentric slits. For handling objects of magnetic material, a permanent magnet may be recessed into the flexible engaging portion. When the sealing disk engages with the surface of the object, the magnet exerts a magnetic force on the object sufficient to support holding the object for additional lateral support when lifting away from the center of gravity of the object. A transfer assembly and a method of configuring a lifter device for use in a stamping process for manufacturing a vehicle are also provided.

Abstract: A bolt on drive assembly for a core drill which utilizes an improved high strength spoked reinforcer mounted beneath a disc. The disc and high strength spoke reinforcer are removably mounted on the tube by bolt fasteners. A drive connection is removably mounted and centrally located on a outer disc of the pair of discs. The drive connection is adapted to connect with a drive shaft to cause rotation of the tube. The system can also include a split in the disc when the high strength spoked reinforcer is not welded thereto thereby providing a means of water control. The high strength spoked reinforcer can be a separate piece that is bolted to the disc or can be integrally formed as one piece therewith. An adapter is provided that allows for standard drilling that fits into a recess in the center hub and is removable to expose the recess for attachment to a specialized drill motor, such as an A-flange.

Abstract: A fly cutter cutting tool is disclosed by this invention. The fly cutter cutting tool has a mounting shaft and a cutting base in a T-arrangement to provide a counter-balance. The carbide insert is attached to the working end. The working end has a rake angle to aid in clearing chips from beneath the tool holder and aid in the cutting process. The working end also has a hood to create a downward angle to deflect machined chips to prevent fouling of the work piece during cutting. The mounting shaft is attached to the cutting base at a perpendicular or a substantially perpendicular angle.

Abstract: A guide assembly comprises a frame assembly, a plurality of clamping assemblies, and a head assembly. The clamping assemblies may be mountable to the frame assembly for attaching the frame assembly to a structure. The head assembly may be mountable to the frame assembly and may include a tool coupled to the head assembly. The tool assembly may be axially movable relative to the head assembly to cause the tool to exert a down force on the structure when the frame assembly is attached thereto.

Abstract: There is disclosed cutting means of a honeycomb dried body in which cracks are not easily generated in the honeycomb dried body, even when a grindstone continues to be used for a long period of time, a cutting speed is raised and a cutting object is a honeycomb dried body having a large diameter. There is provided a cutting method of a honeycomb dried body to cut the honeycomb dried body while applying a force Pm which resists a thrust force Pt required for the cutting and a weight Pw of a cutoff section, to a portion which becomes the cutoff section.

Abstract: In a method for multiple cutoff machining a rare earth magnet block, a cutting fluid feed nozzle having a plurality of slits is combined with a plurality of cutoff abrasive blades coaxially mounted on a rotating shaft, each said blade comprising a base disk and a peripheral cutting part. The slits in the feed nozzle into which the outer peripheral portions of cutoff abrasive blades are inserted serve to restrict any axial run-out of the cutoff abrasive blades during rotation. Cutting fluid is fed from the feed nozzle through slits to the rotating cutoff abrasive blades and eventually to points of cutoff machining on the magnet block.

Abstract: Cutting and grinding of ceramic-type logs to a desired piece length is disclosed. A method of manufacturing ceramic ware is disclosed which comprises transversely cutting a piece from a ceramic-type log having a longitudinal axis by cutting into the log with a blade at a location along the length of the log to form a cut transverse surface on the piece and grinding the cut transverse surface with a side of the blade. An apparatus for manufacturing ceramic ware is also disclosed comprising means for transversely cutting a piece from a ceramic-type log having a longitudinal axis, including a blade for cutting into the log at a location along the length of the log to form a cut transverse surface on the piece, and means for grinding the cut transverse surface with a side of the blade.

Abstract: A wire saw (S) for separating a plurality of ceramic components (11-16) from a ceramic component block (1) has a roller system (2), the roller system has a plurality of deflecting rollers (3-5) guiding a wire (6) to form a wire harp (7), wherein at least one of the deflecting rollers (3) is divided into separate discs (31-36) guiding a single wire winding (61-66) of the wire (6) and being inclined at an adjustable angle (a) of less than 90 DEG to an axle (A) connecting the centers (M1-M6) of the discs (31-36).

Abstract: The present invention relates to a method for production of photovoltaic wafers and abrasive slurries for multi-wire sawing of wafers for photovoltaic applications, and more specific to abrasive slurries which are easy to remove from the wafers after sawing, where the abrasive slurry comprises one part recycled abrasive slurry, an alkali in sufficient amount to provide a pH in the abrasive slurry mixture in the range from 6.0 to 9.0, and one part novel abrasive slurry in an amount sufficient to provide an ion content in the abrasive slurry mixture to provide an electric conductivity of less than 50 ?S/cm.

Abstract: A Concrete Polishing Extension device for treating hardened concrete surfaces and more specifically interior surfaces of countertop sinks made from decorative concrete. The extension device has features for use with grinding deep, contoured surfaces of concrete. The preferred embodiment is comprised of an extended shaft with connection features and other features; a containment cap; a means to connect cap to shaft; an external sleeve that encircles the shaft; a slip ring collar; a means to connect external sleeve to slip ring collar; a bearing such as a thrust bearing; means to connect slip ring collar to bearing; and a means of the extended shaft used to contain bearing, slip ring collar and sleeve assembly. The device has a distal end with means to removably attach to a standard driver and a proximal end with means to removably attach to engage a standard grinding head.

Abstract: A non-core drill bit is provided with a metallic seat 2 attached to the tip of a shank of a boring tool, a cylindrical first diamond grindstone body 3 fixed to the metallic seat 2 and having a recessed cutout portion 10 to be opened to one side, and a second diamond grindstone body 4 installed inside the recessed cutout portion 10. The tip of the second diamond grindstone body 4 is positioned on the metallic seat 2 side from the tip of the first diamond grindstone body 3. The inner side of the tip face of the first diamond grindstone body 3 is preferably formed in an approximately reverse-conical recessed shape.

Abstract: The present invention provides a method for slicing a silicon single crystal ingot having a plane direction (110) by a wire saw to manufacture a (110) silicon wafer, wherein slicing is performed in such a manner that each angle formed between a traveling direction of a wire in the wire saw and a [?112 ] direction and a [1-12] direction in the (110) silicon single crystal ingot or a direction crystallographically equivalent to the directions exceeds 30°. As a result, the method for manufacturing the (110) silicon wafer that can suppress occurrence of breaking at the time of slicing and improve a production yield ratio can be provided.

Abstract: The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.

Abstract: A wire saw for cutting hard materials includes a carbon nanotube fiber wire spun from carbon nanotubes. The carbon nanotube fiber wire may be made from a plurality of fibers, each fiber being spun from carbon nanotubes, the fibers being twisted together to form the wire. Furthermore, the wire may also include diamond particles, silicon carbide particles and/or extra carbon nanotubes to enhance the abrasive properties of the wire. A method is provided for slicing a silicon boule including: linearly translating a carbon nanotube fiber wire between rotating drums while maintaining the wire under tension; using a fixture, moving the silicon boule onto the moving tensioned wire, whereby the wire cuts into the silicon; delivering lubricating fluid to the surface of the silicon where contact is made with the wire; and collecting the lubricating fluid after it leaves the surface of the silicon.

Abstract: A wiresaw beam for use in an apparatus for slicing wafers from an ingot, such as semiconductor wafers from a single crystal ingot or a polycrystalline silicon ingot. The wiresaw beam may be made from a polymer composite material comprising a thermoset polymer resin and carbon nanotubes.

Abstract: Methods, devices, and systems for wafer processing are described herein. One method of wafer processing includes modifying a peripheral edge of a wafer to create a number of edge surfaces substantially perpendicular to a number of dicing paths and dicing the wafer along the number of dicing paths. In one or more embodiments, the method includes modifying the peripheral edge of the wafer with a first tool and dicing the wafer with a second tool different from the first tool.

Abstract: The present invention provides a method for slicing a silicon single crystal ingot having a plane direction (110) by a wire saw to manufacture a (110) silicon wafer, wherein slicing is performed in such a manner that each angle formed between a traveling direction of a wire in the wire saw and a [?112] direction and a [1-12] direction in the (110) silicon single crystal ingot or a direction crystallographically equivalent to the directions exceeds 30°. As a result, the method for manufacturing the (110) silicon wafer that can suppress occurrence of breaking at the time of slicing and improve a production yield ratio can be provided.

Abstract: A method for manufacturing a silicon wafer comprises a slicing step of a silicon single crystal ingot to obtain sliced wafers, a single-side grinding step to grind only one side of a wafer, and a smoothing step to smooth the other side of the wafer by controlling application of etchant depending on surface profile of the other side of the wafer. According to a method of the present invention a silicon wafer that has high flatness, is removed machine working damage, and is reduced of profile change of chamfer to be minimal can be manufactured.

Abstract: A processing tip including a first processing part, and a second processing part attached to an upper surface of the first processing part and having a front portion and a rear portion, the front portion having an apex and a first width and the rear portion having a second width, the first width being narrower than the second width.

Abstract: A singulation saw for sawing either substrate or wafers includes a pair of counter-rotating saw blades mounted for independent movement in a vertical direction for alternatively engaging with a substrate to be singulated. The singulation saw further includes a transport system including a pair of substrate carriers reciprocates the substrates. While the first substrate is being cut, the second substrate or other substrate carrier sequentially unloads a cut substrate, loads a new uncut substrate and then moves the uncut substrate to a vision system for determining the position of the substrate relative to the second carrier and then positions the second carrier and its substrate in a standby position ready to be cut by the pair of saw blades that are cutting the first substrate. As the first cut substrate is moved to an unload position, the new uncut substrate is moved into a cutting position.

Abstract: A diamond core drill bit (100) is disclosed. The drill bit has a right-circular cylindrical body (120) with at least one side lubrication hole (122) toward the bottom of the body and a plurality of parallel grooves (124) oriented in an axial direction at the bottom circumferential sidewall of the body. A cap (130) at the top of the cylindrical body (120) closes one end of the body. The cap has a central lubrication hole (134) and alternative embodiments have at least one core extraction hole (132). These holes extend through the cap to the interior of the body. A hollow drive shaft (140) is mated to the cap (130) over the central lubrication hole (134), such that a lubricant can flow through the hollow shaft and into the internal volume of the body and out a side lubrication hole (122).

Abstract: The present invention features a reciprocating wire saw particularly adapted or configured for cutting hard materials. In one aspect, the reciprocating wire saw comprises (a) a flexible wire; (b) a plurality of cutting segments fittable onto the flexible wire, wherein each of the cutting segments comprises an outer surface; and a (c) plurality of superabrasive particles braze bonded onto the outer surface of the cutting segments to form a cutting wire. In another aspect, the reciprocating wire saw comprises a plurality of superabrasive particles braze bonded directly to the wire itself to form a cutting wire. The cutting wire is unique in that it comprises a pre-determined superabrasive particle concentration and is configured to cut various materials, such as granite, in a reciprocating manner.

Abstract: A method for making a stone article includes the steps of providing a block of material having substantially square top and bottom surfaces, impacting the top and bottom surfaces with a non-square blade so as to split off-excess material from the top and bottom surfaces and provide said surfaces with a shape substantially matching the non-square blade cutting a cylindrical cut into said top surface, drilling a hole into the bottom surface, and applying a force into the hole whereby a stone portion within the cylindrical cut is removed from the block of material. A stone polishing apparatus is also provided.

Abstract: A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.

Abstract: A quick-change core drill includes an adapter and a generally tubular drill barrel. The adapter comprises a first end adapted to be removably connected to a drill spindle and a second end adapted to be removably connected to the drill barrel. The drill barrel includes an inside diameter D1, a first end, and a second end having a crown with an inside diameter D3. The first end of the drill barrel is adapted to be removably connected to the second end of the adapter such that the inside diameter D1 is at least as large as the inside diameter D3. Upon detection of a jammed core inside the drill barrel, the user can quickly and easily remove the jammed core from the drill barrel by disconnecting the drill barrel from the adapter. Since there are no obstructions present, the user can simply remove the jammed core from the first end of the drill barrel.

Abstract: A rotatable cutting tool unit of a tool assembly for a cutting machine that is used in conjunction with an associated method of cutting provides several novel aspects. The tool arrangement, which includes two tool units, includes first and second disk-shaped tools rotatable about an axis. The tools define maximum tool arrangement boundaries along the axis. A driving arrangement, at an axial location between the first and second tools, supports the first and second tools for rotation and transfers driving force. A radially outer periphery of the driving arrangement is at a radius less than a radius of a peripheral cutting edge portion of the first tool and less than a radius of a peripheral cutting edge portion of the second tool.

Abstract: The present invention is directed to a coring drill and method for preparing a block for containing a receptacle assembly. The coring drill comprises a generally cylindrically-shaped corer hub having a longitudinal drilling axis. A generally cylindrically-shaped first corer has a first-corer axis coaxial with the longitudinal drilling axis and a first coring end having a first-coring diameter. The first-corer is removably attachable to the corer hub. A generally cylindrical-shaped second corer has an second-corer axis coaxial with the longitudinal drilling axis and a second coring end having a second coring diameter greater than the first coring diameter. The second-corer is attached to the corer hub. A generally cylindrical-shaped counter-borer has a counter-borer axis coaxial with the longitudinal drilling axis and a counter-boring end having a third coring diameter greater than the second coring diameter. The counter-borer is attached to the corer hub.

Abstract: A cutting machine comprising a chuck table for holding a workpiece, a spindle unit having a rotary spindle for mounting a cutting blade which cuts the workpiece held on the chuck table, and a spindle unit support mechanism for supporting the spindle unit in such a manner that it can move in a cutting direction, wherein the spindle unit support mechanism comprises a movable base, a guide rail which is provided on the movable base and has a predetermined curvature radius, a spindle unit support member which is movably disposed along the guide rail and mounts the spindle unit, and an angle adjustment mechanism for moving the spindle unit support member along the guide rail to adjust the angle.

Abstract: In the cutting solution supplying and controlling apparatus for a dicing machine, a flow rate adjusting device is provided in addition to a regulator as the pressure adjusting device. The flow rate adjusting device has a flow rate controller, which controls a proportional solenoid valve according to a signal applied from a flow rate sensor as a feedback signal. Thus, even if the pressure of the water supplied from the water supply equipment of the factory changes, the flow rates of the cutting solution and the coolant are maintained. Moreover, the flow rates can be easily adjusted according to the type of work to be processed.

Abstract: The present invention provides a fixture for mounting a substrate to mounting tape on a film frame so as to retain the substrate to the film frame for dicing. A plurality of grooves for receiving a cutting saw extend longitudinally and transversely across the fixture to define die regions. The fixture also includes a plurality of apertures that align with the substrate and with dies to be cut from the substrate. The aligned apertures supply vacuum to the substrate to retain the substrate and cut dies in the fixture. When the dicing is completed, the vacuum is turned off and the individual dies can be readily removed from the fixture.

Abstract: A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.