Abstract: A semiconductor wafer saw for dicing semiconductor wafers comprises variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: The present invention provides a cutting method for hard, brittle materials that is capable of completely cutting through hard, brittle materials such as ceramic, glass, concrete, stone and single crystal materials without the occurrence of edge chipping and at high speed. The present invention is characterized by being a method for completely cutting through a hard, brittle material 1 using a disk-shaped rotary grindstone 2, wherein the cross-sectional shape of the outer peripheral edge 20 of rotary grindstone 2 has a V-shaped pointed shape.

Abstract: A cutting machine comprising a chuck means for holding a workpiece to be cut and a cutting means for cutting the workpiece held on the chuck means. The cutting machine further has a first moving means for moving the chuck means relative to the cutting means in the first direction, a second moving means for moving the cutting means relative to the chuck means in the second direction perpendicular to the first direction, and a third moving means for moving the cutting means relative to the chuck means in the third direction perpendicular to the first direction and the second direction. The cutting means comprises a rotary blade which can turn on the center axis of rotation extending in the second direction and is shaped like an annular thin plate perpendicular to the second direction.

Abstract: A cutting machine of a type having bellows means disposed at least on one side of a chuck table to be reciprocated. A protective sheet covering the upper surface of the bellows means is disposed. One end of the protective sheet is reciprocated in accordance with the reciprocation of the chuck table, while the other end of the protective sheet is connected to winding means. When the chuck table is moved forward or backward, the protective sheet is gradually wound up by the winding means. When the chuck table is moved backward or forward, the protective sheet is gradually wound off from the winding means.

Abstract: There is provided a process for significantly reducing thickness variations and the deviations of the wafer's centerline from a reference plane in material cut with wire saws in a wire cutting apparatus by utilizing a sacrificial layer. The sacrificial layer prevents excessive kerf loss in slices or wafers at the wire entry and exit points. The process can be used to produce semiconductor wafers having greater uniformity in thickness.

Abstract: The present invention provides a cutting method for hard, brittle materials that is capable of completely cutting through hard, brittle materials such as ceramic, glass, concrete, stone and single crystal materials without the occurrence of edge chipping and at high speed.

Abstract: Alignment method and apparatus for aligning a cutting blade with a selected street on a semiconductor wafer. It has square chip areas defined by crossing streets and alignment spots formed on its surface. Two street lines with at least one street intervening therebetween are selected, and linear functions ƒ(x) and g(x) are determined on the basis of the coordinates of their alignment spots according to the least squares method. The linear functions ƒ(x) and g(x) run among the alignment spots at the closest distances thereto to represent the two selected streets. Another linear functions ƒ′(x) and g′(x) are determined by putting the linear functions f(x) and g(x) into parallelism with the X-axis.

Abstract: A cinerary urn receptacle made of stone comprising a cylindrical block hollowed from one first end to a second end and a cover having a sealing portion and an assembling portion, the sealing portion closing the block first end, the assembling portion projecting from the first end, and the second end comprising an internal countersinking for receiving an inner seal to be fitted on an assembling portion projecting from the cover of another identical receptacle to form a funerary column. The method for making such receptacles from a column turned in natural stone consists in carrying out a double coaxial coring of the column in one single operation to form the block that has a cylindrical recess passing through from a first end to a second end and countersinking of an internal portion of the recess.

Abstract: The invention provides a method of machining a rare earth alloy at high machining preciseness and high efficiency. In a step of grinding a block of a rare earth alloy with a grinding wheel having, on a peripheral portion thereof, a grinding edge including diamond abrasive particles, a coolant with surface tension of 25 mN/m through 60 mN/m is supplied to the grinding edge with the grinding wheel rotated.

Abstract: The vertical blade saw assembly for ceramic and masonry materials is designed to provide an assembly that allows the user to make cuts of any shape to ceramic tiles and masonry materials in order to permit the installation of precision cuts for a particular setting. The assembly has an electric drive motor that is protected from the coolant used to keep the blade from overheating. The assembly has a plurality of parallel arms that are connected and permit the oscillating motion of the arms. The vertical blade is connected to the arms which place the blade in motion. The assembly has a base unit to provide support for the assembly. A coolant tray is positioned around the base unit. A water pump and accompanying tubing is used to circulate the coolant to the blade. Several cutting blades are also disclosed.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A working method capable of implementing various types of devices such as a slider available with high reliability without causing malfunction or the like due to contamination during an actual use is provided by solving a problem of deterioration in profile precision and a problem of contamination resulting from roughness of a cut surface or chipping. A wire saw comprising a wire having a diameter greater than a width of a portion cut by a first cutting step, namely, a width of a cut groove is brought into contact with the cut groove of a bar. While the wire saw is slid in a longitudinal direction, the bar is sliced across the overall thickness of the bar along the thickness of the bar. Thus, while the bar is cut, a final cut surface formed by cutting is smoothed.

Abstract: A drill bit for producing circular-cylindrical recesses or boreholes is formed of a drilling cylinder (1) having cutting elements (3) at the leading end in the drilling direction. A detachable core sleeve (2) is arranged in the interior of the drilling cylinder (1). The cutting elements (3) extend radially inwardly at least for the wall thickness (a) of the core sleeve (2). The core sleeve (2) serves to receive a core formed of removed masonry and is intended to facilitate removal of the core from the drill bit. The manageability of the drill bit is substantially improved in this way.

Abstract: Disclosed is an improved precision cutting apparatus comprising a chuck table for holding a workpiece, and first and second cutting means each including a spindle unit having a blade attached thereto. The first and second cutting means are series-arranged with their blades opposing a predetermined distance apart, thereby cutting along two traces at one time by moving the chuck table relative to the stationary cutting means. These cutting means need not be allowed to overrun the workpiece while cutting, thus saving extra time required for overrunning which otherwise, would be required as is the case with the parallel-arrangement of two cutting means, and accordingly the dicing can be performed at an increased efficiency.

Abstract: A method for precision cutting liquid soluble scintillator materials by an operator is disclosed, including the steps of providing a first run of a moving filament in operative proximity to cut the scintillator materials, concurrent with wetting at least the first run length of the moving filament with organic solvent, and engaging the wetted first run with the soluble scintillator materials for a time sufficient to create a kerf having cut surfaces with solvent thereon, with the kerf cut surfaces dissolved to reshape the kerf corners, and without the formation of surface hydrates. The wetting step is accompanied by providing a second run of the wetted filament in a reverse direction and engaging the scintillator materials. The first run and second run engaging steps are concurrent with tensioning the moving filament, producing kerfs through the scintillator materials, with organic solvent delivered onto kerf surfaces.

Abstract: A singulation system for a BGA product is disclosed, which has a cutting mechanism with a cutting head, a conveyor belt arranged under the cutting head, a cutting table positioned to connect with the conveyor belt, a cleaning station positioned beside the cutting mechanism, a loading frame capable of moving up and down and positioned beside the cleaning station, a cassette storage containing multiple receiving cassettes (each having a BGA product contained therein) and positioned to abut one end of the loading frame, a gripping device arranged at the other end of the loading frame, and a revolving arm assembly arranged among the cutting table, the cleaning station and the loading frame and comprising three revolving arms each having a pivotal end and a distal end respectively extending above the cutting table, the cleaning station and the loading frame with each distal end having a suction device mounted thereon.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: The slitting assembly includes a grinding wheel with a wide flat grinding face for first cutting a multilayer sheet of soft and compressible, electronic device material, such as lithium-ion polymer material for a uni-cell battery, to a first depth and includes a cutting wheel with a blade-like edge for completing the slit by cutting through uncut layers of the multilayer sheet. The grinding face has a width of at least the thickness of the multilayer sheet, and in practice, the depth of the cut is preferably one half the sheet thickness, which in a uni-cell battery sheet is midway through a separator layer. The grinding wheel is positioned to apply cutting forces to the multilayer sheet in a direction that is substantially parallel to the feed direction to control the application of compressive forces that may compress the soft sheet material and if uncontrolled, may create short circuits between electrically conductive layers.

Abstract: A process for dicing a preform made of an oxide single crystal into cut pieces each having a given shape, includes the steps of removing molecules of the oxide single crystal through dissociation and evaporation with an optochemical reaction under irradiation of a laser beam upon the preform, thereby forming grooves on the preform, and then cleaving the preform along the groove.

Abstract: Disclosed is an accessory mounted on a cutting device including two mutually parallel guide bars. The accessory includes a first channel formed in the accessory for receiving one of the two mutually parallel guide bars. A second channel is formed to receive the other of the two mutually parallel guide bars in such manner that the second guide bar is freely translatable in the second channel. An affixation device is firmly affixes the accessory to one of two mutually parallel guide bars.

Abstract: A tool for treatment of rock, masonry or concrete by drilling, grinding or cutting off, the tool has a plurality of cutting segments each having a plurality of bonded cutting bodies formed as diamond crystals and subjected to an abrasive wear during an operation, a tool base body which carries the cutting segments, and at least one marking provided on at least one segment and forming a wear indicator, the at least one marking being arranged so that it changes during operation of the tool with wear of the cutting segments.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their elective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A core bit includes a tube (2) having an opening end surface (21) in the axial direction and a plurality of tips (3) fixed to the opening end surface (21) of the tube (2). Each of the tips (3) includes an abrasive grain layer (31) that contains diamond abrasive grains and a binder for bonding the diamond abrasive grains to each other. The diamond abrasive grains contain not more than 0.03 weight % of inclusions. The inclusions contain iron and nickel as main components. The binder contains at least 0.1 weight % and not more than 2.0 weight % of graphite. The core bit has a short perforation time, i.e., a high cutting speed, excellent sharpness, excellent durability, and a long life. The core bit is suitable for boring a concrete structure.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A running bonded abrasive wire cuts wafers one by one from a slice base, which hold the wafers. The cut wafers are transported on the first conveyor to a collecting part. During the transport process, a CCD camera images the shape of the wafer, and outputs the image data of the wafer to a control unit. The control unit image-processes the image data to recognize whether the transported wafers are normal or inferior. In accordance with the recognition results, the collecting part collects the normal wafers and the inferior wafers separately.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: The present invention provides a hole saw or core drill bit for cutting annular holes in materials such as concrete, asphalt, masonry, rock, stone and related materials. The bit includes an elongated cylindrical body having a first end portion and a second end portion, a mounting platform at the first end of the body for attaching the bit to a driver and a cutting head at the second end of the body. The cutting head constitutes a plurality of cutting segments mounted on the annular face of the second end portion of the body. Each of the segments includes an outer portion, a middle portion and an inner portion. Each of the portions includes diamond particles dispersed throughout. The inner portions and the outer portions of the segments each have a greater concentration of diamond particles as compared to the middle portions. This dispersion of diamond particles provides a core drill bit with improved performance.

Abstract: A dicing machine of the present invention is provided with two spindles, which are arranged parallel to one another in the direction of the Y-axis and face one another. A workpiece is moved toward the spindles in the direction of the X-axis, and two blades fitted to the two spindles cut the workpiece. The two spindles are movable in the direction of the Y-axis, so that the two blades can be arranged at a desired interval. One of the spindles is movable in the direction of the X-axis so that the two blades can be arranged on the same street. Hence, desired two streets or one street can be simultaneously cut with the two blades.

Abstract: A high-speed drill for rock stake engineering includes an outer tube and an inner tube fixed in the outer tube, and an annular space is formed by the outer and the inner tube for pressured air and water to flow down from a power shaft connected with an upper portion of the outer tube. An annular cushion block is connected with a bottom of the outer and the inner tube, having many through holes. Further, cutters are fixed under a bottom surface of the cushion block, rotating together with the outer tube rotated by the power shaft, cutting into rock and cooled and washed synchronously by the pressured air and water coming through the annular space down from the power shaft.

Abstract: A saw blade is provided which includes an inner collar separated from an outer collar with a resilient isolated layer. The inner collar fastens to the arbor shaft of a driving motor, while the outer collar is welded to the rim containing hardened particles, such as diamond bits. The inner and outer collars form inner and outer collar flanges which receive the resilient isolating material therebetween. In an alternative embodiment, the inner and outer collars are separated from one another with a plurality of plugs formed of resilient isolating material. The plurality of plugs are formed in a circular pattern about the arbor shaft and are spaced apart from one another. In another embodiment, a vibration dampening coupler is fastened to the arbor shaft and formed separate from the cutting blade. The isolating resilient layer may be formed as a solid layer, as a plurality of O-rings, or with a void therein.

Abstract: A device and method for cutting and grinding a hard but brittle material (such as glass plate, etc.) for producing a doughnut-shaped substrate are provided. The device of the present invention comprises a tubular core rod and shank extending therefrom and coaxial therewith. A plate is attached to the rod and shank and extends therefrom. A skirt is attached to the plate and surrounds the rod. Both the rod and skirt include at least one circumferential cavity. A core drill and a skirt drill are integral with the core rod and skirt, respectively. The cavities, skirt, and drills include diamond whetstone parts.

Abstract: A slicing machine for slicing an ingot using a rotary blade that maintains the inner peripheral cutting edge of the blade in a highly rigid state. The slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade in which an axial force is applied to the blade prior to slicing in order to displace the blade in an axial direction. The inner peripheral cutting edge of the blade is kept rigid and the ingot is sliced accurately. The displacement of the blade is stored and controlled by a control unit.

Abstract: A slicing method includes slicing an ingot by a rotary blade while the inner peripheral cutting edge of the blade is kept in a highly rigid state. A slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade, where an axial force is applied to the blade prior to slicing in order to displace the blade in an axial direction. The inner peripheral cutting edge of the blade is kept rigid and the ingot is sliced accurately. The displacement of the blade is stored and controlled by a control unit.

Abstract: An apparatus for percussively milling slots in rock or the like includes a flat disk-like radial boring tool mounted on a drive shaft which is rotated slowly against the work while being driven percussively and radially outwardly toward the work in the neighborhood of, for example, forty times for every revolution of the tool.

Abstract: A hollow drilling tool is made up of an axially extending tubular carrier part, a cutting body at one end of the carrier part, and guide elements located in the axial direction of the carrier part between the cutting body and the carrier part. The radially outer surface of each guide element is in alignment in the axial direction of the carrier part with the radially outer surface of the cutting body. The guide elements guide the hollow drilling tool in a borehole formed by the cutting body.

Abstract: A glass drilling machine for drilling holes in a sheet of glass in which each hole is partly drilled from one side of the sheet and is then finish drilled from the opposite side. The machine is made up of aligned first and second drilling devices which are attached near the ends of first and second pivotable arms, respectively, the first and second arms being periodically pivoted toward and away from the sheet to bring the drilling devices into and out of drilling engagement with the sheet. The first and second arms are releasably clamped to first and second spindles, respectively, which pivot about first and second axes, respectively, the first and second axes being spaced apart but close to one another and positioned remote from the drilling devices. The position of the first arm is adjustable along its longitudinal axis and the position of the second arm is adjustable along the axis of the second spindle.

Abstract: Atomized water is produced by an atomizer mounted on a drilling device and introduced through a mist flow passage formed in a hollow drill. By applying the atomized water flowing from the atomizer to a cutting bit at the leading end of the drill through the mist flow passage, the cutting bit heated and reaching a high temperature in drilling is cooled. Thus, a rigid material of concrete or the like can be efficiently drilled without being stained with wetting.

Abstract: A glass drilling machine for drilling holes in a sheet of glass in which each hole is partly drilled from one side of the sheet and is then finish drilled from the opposite side. The machine is made up of aligned first and second drilling devices which are attached near the ends of first and second pivotable arms, respectively, the first and second arms being periodically pivoted toward and away from the sheet to bring the drilling devices into and out of drilling engagement with the sheet. The first and second arms are releasably clamped to first and second spindles, respectively, which pivot about first and second axes, respectively, the first and second axes being spaced apart but close to one another and positioned remote from the drilling devices.

Abstract: Core water and mud collector tool for use by a carrotting drill during the piercing of a concrete floor, said tool being connected as an adaptor between the motor shaft and the shoulder of the circular carrotting drill. Circulating through said tool is a liquid first applied at the exterior of the core drill, passing between the diamond bit segments, and being aspirated to the top between the carrot and the interior of the drill, to be evacuated through the interior of the above adaptor by holes of sizes increasing starting from the inside of the adaptor shaft, going through the wall of said shaft, the tunnel opening of the barrel and the suction tube. The suction has for effect to conserve the carrot in the interior of the carrotting drill when the concrete floor is pierced, such suction helping to exert a reaction in the direction of drilling which facilitates drilling as water is being aspirated, instead of being projected by jet, thus keeping the zone surrounding the punched hole clean.

Abstract: Apparatus for manufacturing thin wafers from bars, such as in the manufacture of wafers for use as semiconductor substrates, include an arrangement wherein a holder member is fastened to the bar, the bar is sliced to separate a disc-shaped wafer therefrom and wherein prior to completion of the slicing operation, the end face of the bar is leveled to a precisely planar condition. The slicing operation is terminated after the bar is sliced completely through and the holder member is partially, but not completely, sliced through so that a wafer formed by the slicing operation remains connected to the bar by the holder member. The wafer is disconnected from the bar by abrading a portion of the holder member connecting the wafer to the bar.

Abstract: A process for the sawing of crystal rods or blocks into thin wafers by innal-hole saws is specified. In this process, the deviation of the saw blade from the intended cutting line, occurring in virtually every sawing operation, is countered by the force of a fluid being applied, at least periodically, to the side surfaces of the blade. This allows the force conditions in the saw cut and thus the deflection of the saw blade, to be influenced. This process results in an improved geometrical quality of the wafers obtained and in prolonged service life of the saw blades which have to be resharpened less often.

Abstract: An improved hole saw is disclosed. A mandrel of the hole saw forms an elongated threaded body. The mandrel, at a first end forms a shank adapted to be secured in the chuck of a hand power drill or drill press. The second end of the mandrel forms an enlarged, radially extended, circular flange having a recessed axially aligned hole formed therein. The shank end of, for example, a quarter inch pilot-hole drill is secured in the flanged end of the mandrel by one or more set screws. The mandrel is inserted, shank end first, into the open serrated cutting end of a cylindrically shaped hole saw. The threaded shank end of the mandrel is screwed into a threaded base of the hole saw, the radially extended flange of the mandrel being mated to and tightened against the inside base end of the hole saw.

Abstract: A drill bit, hvaing heavy-duty cutting elements, is proposed which is intended for rotary, air-cooled application. So that the drill bit can be operated with a relatively low thrust pressure, PCD cutting elements (14) are provided which only slightly overlap the thin-walled cylinder (11, 12) to produce an air gap for cooling and for conveying the drilling dust.

Abstract: A device for removing waste plugs from hole saws comprising a plug member positioned internally of a hole saw and retained therein by means of screws or other projections which extend outwardly through cleanout slots of the hole saw. The projections may be joined through an external annular ring which encircles the hole saw. The ring may be grasped and forced downwardly causing the plug member to eject a waste plug from the hole saw. A spring may be positioned between a mandrel of the hole saw and the plug member in order to normally bias a plug member downwardly to assist its positioning and ejectment of a waste plug.

Abstract: Drilling apparatus for trepanning a difficult to work material. A drill member includes a very thin wall cylindrical cutting head integral with a shank portion, with the assembly being machined from the same piece of stock to insure concentricity. A fluid supply collar includes lower and upper Teflon washer inserts which surround the shank portions and which are held in place respectively by a shoulder of the cutting head and a chuck or other holder of a machine which rotates the drill member. Fluid supplied to the collar is directed through radial and axial passageways in the drill member to the lower margin thereof, and which lower margin includes a continuous abrading surface on the inside, outside and edge thereof. The length of shank extending from the holder is extremely short due to the dimension of the collar thereby resulting in high stiffness to insure for concentricity during drilling operations.