Abstract: A gas-heated dishwasher includes a gas burner for heating the rinsing liquid and drying dishes, which is suitable for drying dishes and heating the rinsing liquid in an efficient way, while, at the same time, making it possible for a worktop to be placed on top of the dishwasher, the gas burner is embodied and disposed in the motor chamber so that it heats at least one closed tubular heating body filled with a fluid during a sub-program dry section and heats the rinsing fluid during the sub-program sections when the rinsing fluid is used.

Abstract: Analysis equipment for determining a concentration of an organic component and a caustic component of a reusable organic caustic solution that has been utilized for removing a ceramic coating from a metallic component at elevated temperatures and pressures, such as in an autoclave. Sensors are positioned between a filter for removing particles of the ceramic coating dispersed in the reusable organic caustic solution from the reusable organic caustic solution and a storage tank storing the reusable organic caustic solution after removal from the autoclave. The sensors measure physical properties of the reusable organic caustic solution after removal of the particles from the reusable organic caustic solution, such as electrical conductivity, opacity, refractive index, density, fluidity and the speed of sound in the solution.

Abstract: The present invention provides an apparatus for cleaning a workpiece with a cleaning medium that is maintained at a single fluid phase. The apparatus comprises means for providing the cleaning medium; a pressurizable cleaning vessel for receiving the cleaning medium and the workpiece; and means for maintaining a single fluid phase of the cleaning medium in the cleaning vessel. The present invention further provides a process for cleaning the workpiece with cleaning medium under conditions such that the workpiece is exposed to a single fluid phase of the cleaning medium. The present invention further includes a process for a storage media that includes instructions for controlling a processor for the process of the present invention. The storage media comprises means for controlling the processor to control contacting conditions of the workpiece and the cleaning medium such that the workpiece is exposed to a single fluid phase of the cleaning medium.

Abstract: A parts washer including a receptacle positioned on a reservoir for cleaning liquid having a drain opening and a module which engages a portion of the reservoir in the cleaning liquid for adjusting the temperature of the cleaning liquid and circulating the cleaning liquid into the receptacle. The module includes a heating element, a sensor and pump. An enclosure houses a temperature controller which displays the temperature of the cleaning liquid and a low liquid level condition. A bridge thermally links the heating element to the sensor so that the sensor normally generates a signal representative of the temperature of the cleaning fluid unless the level of the cleaning fluid is disposed below the sensor.

Abstract: A high-pressure processing apparatus for removing unnecessary matters on objects to be processed by bringing a high-pressure fluid and a chemical liquid other than the high-pressure fluid into contact with the objects to be processed in a pressurized state is provided with a plurality of high-pressure processing chambers, a common high-pressure fluid supply unit for supplying the high-pressure fluid to each one of the high-pressure processing chambers, a common chemical liquid supply unit for supplying the chemical liquid to the each high-pressure processing chambers, and a separating unit for separating gaseous components from a mixture of the high-pressure fluid and the chemical liquid discharged from the high-pressure processing chambers after the objects are processed. Thus, a high-pressure processing apparatus which has such a compact construction as to be partly installable in a clean room and can stably perform a high-pressure processing can be provided.

Abstract: A novel chemistry, system and application technique reduces contamination of semiconductor wafers and similar substrates and enhances and expedites processing. A stream of liquid chemical is applied to the workpiece surface. Ozone is delivered either into the liquid process stream or into the process environment. The ozone is preferably generated by a high capacity ozone generator. The chemical stream is provided in the form of a liquid or vapor. A boundary layer liquid or vapor forms on the workpiece surface. The thickness of the boundary layer is controlled. The chemical stream may include ammonium hydroxide for simultaneous particle and organic removal, another chemical to raise the pH of the solution, or other chemical additives designed to accomplish one or more specific cleaning steps.

Abstract: Initially, process parameters for dense phase fluid cleaning are determined. Thereafter, a cleaning chamber containing a substrate is pressurized with a dense phase fluid, based on these process parameters. The substrate is then cleaned with the dense phase fluid, again based on these process parameters. Exhaust fluid is subsequently expelled from the cleaning chamber, and thereafter analyzed. The process parameters are then adjusted to adjusted process parameters based on the analysis of the exhaust fluid. Thereafter, the cleaning chamber is again pressurized and cleaning repeated. This pressurization and cleaning is based on the adjusted process parameters. Also, this pressurization and cleaning is repeated until the substrate is sufficiently clean.

Abstract: A carbon dioxide dry cleaning system features a pair of liquid carbon dioxide storage tanks in communication with a compressor. A sealed cleaning chamber contains the objects to be cleaned. By selectively pressurizing the storage tanks with the compressor, liquid carbon dioxide is made to flow to the cleaning chamber through cleaning nozzles so as to provide agitation of the objects being dry cleaned. Liquid carbon dioxide displaced from the cleaning chamber returns to the storage tanks. In an alternative embodiment, a single storage tank is pressurized via a compressor with gas from the cleaning chamber so that liquid solvent from the storage tank travels to the cleaning chamber through nozzles. The objects in the cleaning chamber are agitated by a rotating basket. After a prewash cycle, liquid solvent from the cleaning chamber is directed to a still. The liquid solvent in the still is boiled through a connection with the head space of the cleaning chamber.

Abstract: The present invention pertains to a system for cleaning wafers that includes specialized pressurization, process vessel, recirculation, chemical addition, depressurization, and recapture-recycle subsystems, as well as methods for implementing wafer cleaning using such a system. A solvent delivery mechanism converts a liquid-state sub-critical solution to a supercritical cleaning solution and introduces it into a process vessel that contains a wafer or wafers. The supercritical cleaning solution is recirculated through the process vessel by a recirculation system. An additive delivery system introduces chemical additives to the supercritical cleaning solution via the solvent delivery mechanism, the process vessel, or the recirculation system. Addition of chemical additives to the sub-critical solution may also be performed. The recirculation system provides efficient mixing of chemical additives, efficient cleaning, and process uniformity.

Abstract: A method is disclosed for decontaminating a supercritical processing apparatus and/or wafers after a wafer cleaning step. In accordance the embodiments of the invention, a supercritical cleaning step utilizes a surfactant to clean a wafer and uses a supercritical rinse solution in a post-cleaning step to decontaminate the supercritical processing apparatus, the wafer or both from processing residues. In accordance with further embodiments of the invention, supercritical rinse solutions are used to cure processing surfaces of the supercritical processing apparatus after the supercritical processing apparatus is serviced or when replacement parts are installed.

Abstract: Disclosed is a washing machine comprising a heating tank accommodating the washing and washing water; a heating part heating the washing water in the heating tank; and a circulation pump circulating the washing water in the heating tank. With this configuration, the present invention provides the circulation pump circulating washing water in the heating tank, thereby preventing the washing from oxidizing, improving a washing efficiency especially improving a washing efficiency according to washing material, and saving washing water. Further, water supply and drain can be easily performed.

Abstract: An apparatus comprising multiple heating, cooling, and/or cleaning zones. The apparatus produces a jet flow of solvent/cleaning fluid onto an article to be cleaned without the need for a pump or compressor. The jet flow provides more effective contaminant removal. The multiple zones result in increased residence time for increased efficiency in separating the solubilized contaminant from the solvent/cleaning fluid.

Abstract: A dishwasher mainly includes a washing cabinet and a steam generator havingwater-feeding and steam-feeding holes provided at two ends thereof. Water fed into the steam generator via the water-feeding hole is quickly heated to produce high-temperature steam that is sent via the steam-feeding hole into a steam pipeline distributed over inner surfaces of the washing cabinet, so that the steam is sprayed via apertures and/or spray holes on the steam-feeding pipeline into the washing cabinet to sterilize and soften hardened food residues on the dishware positioned in the washing cabinet for washing, making the dishware effectively cleaned and sterilized.

Abstract: A plant for the continuous washing of plastic material in scales. The plant having a washing apparatus, at least one filtering unit connected to the apparatus for purifying the washing fluid and means for varying the time the scales remain in the washing apparatus as a function of the quantity of scales contained at that same moment in the same apparatus.

Abstract: An apparatus for cleaning a microelectronic substrate includes a pressure chamber, a supply of a process liquid including dense phase CO2 fluidly connected to the chamber and a distilling system. Distilling system includes a still fluidly connected to the chamber and operative to separate CO2 from the process fluid. The distilling system is operative to re-introduce the separated CO2 into the chamber or a further chamber.

Abstract: Methods for cleaning a microelectronic substrate in a cluster tool are described that include placing the substrate in a pressure chamber of a module in a cluster tool; pressurizing the pressure chamber; introducing liquid CO2 into the pressure chamber; cleaning the substrate in the pressure chamber; removing the liquid CO2 from the pressure chamber, depressurizing the pressure chamber, and removing the substrate from the pressure chamber. Apparatus for processing a microelectronic substrate are also disclosed that that include a transfer module, a first processing module that employs liquid carbon dioxide as a cleaning fluid coupled to the transfer module, a second processing module coupled to the transfer module, and a transfer mechanism coupled to the transfer module. The transfer mechanism is configured to move the substrate between the first processing module and the second processing module.

Abstract: A method and apparatus are provided for removing solid and/or liquid residues from electronic components such as semiconductor wafers utilizing liquid or supercritical carbon dioxide which is solidified on the surface of the wafer and then vaporized and removed from the system. In a preferred embodiment the solidification and vaporizing steps are repeated (cycled) before removal of the CO2 from the vessel. The residues are carried away with the vaporized carbon dioxide.

Abstract: A wash apparatus includes a tank for holding clean solvent, a first distillation chamber, a second distillation chamber and a washbasin surrounded by a closeable hood structure for cleaning paint spray guns and associated parts placed therein. The washbasin is selectively positionable in fluid circulating communication with either of the first and second distillation chambers during washing operations, wherein solvent discharged in the washbasin returns to the selected distillation chamber. When either of the distillation chambers becomes filled with contaminated solvent, the washbasin is operatively positioned in fluid circulating communication with the other distillation chamber for continued washing operations, thereby allowing the contaminated solvent in the filled distillation chamber to be purified during a distillation cycle. The purified solvent from the distillation cycle returns to the clean solvent holding tank.

Abstract: An apparatus for cleaning an enrober head and a method for using the apparatus, in which the apparatus has a cleaning medium supply vessel having an outlet and an open top, an enrober head mount registered with the open top of the vessel, and a pump, arranged to pump cleaning medium from the vessel to an applicator for application to enrober head elements requiring cleaning. The mount is adapted to attach an enrober head to the vessel, such that, when an enrober head is removed from an enrober and mounted on the apparatus, cleaning medium applied to elements of the enrober head can pass through those elements, through the mount and open top, and back into the vessel, cleaning the enrober head elements, and allowing the cleaning medium to be reapplied.

Abstract: A washer including a plurality of spray jets and nozzles is disposed within a washing chamber for spraying washing and rinsing fluids into the washing chamber. Conduits supply the washing and rinsing fluids to the jets. A sump at the bottom of the washing chamber collects the washing and rinsing fluids sprayed from the jets. A pump re-circulates the washing and rinsing fluids from the sump to the conduits and nozzles. The washer is further comprised of a fluid displacement device centrally disposed within the sump. A fluid displacement device is dimensioned to displace fluid within the sump and to define a generally annular sump chamber surrounding the fluid displacement device that communicates with the pump.

Abstract: A system for heating solvents in processing semiconductor wafers has a coiled solvent tube, a coiled cooling water tube, and electric heater elements, cast in place within an aluminum casting. The solvent flows through the solvent tube and is heated by conduction of heat through the casting. The solvent is safely isolated from the heating elements. Water is pumped through the cooling water tube, to cool the casting if solvent flow is interrupted, or if the measured casting temperature exceeds a predetermined set point temperature. Solvent temperature is maintained by controlling power to the heating elements based on the measured solvent temperature at the processing chamber.

Abstract: A device for wet processing of a semiconductor-containing substrate that addresses contamination in the wet process by removing undesired sources of gas contamination, the method involving pumping a processing liquid through a degasifier, exposing the semiconductor wafer, in a vessel, to the degasified processing liquid; and optionally recirculating the processing liquid through the degasifier and back into the vessel.

Abstract: A method and a device for producing an adhesive surface on a substrate which can be bonded to another substrate. In an implementation, the technique includes treating the surface of the substrate by wet chemical etching to remove an oxide layer and to provide a hydrophobic surface, and exposing the etched hydrophobic surface to a gaseous ozone atmosphere to provide a dry hydrophilic surface. A device for producing an adhesive surface on a substrate according to an implementation includes a bath with an etchant for removing an oxide layer from the surface of the substrate and to produce a hydrophobic surface, and a container having an inner volume that surrounds the bath. The inner volume also includes a gaseous ozone atmosphere to produce a dry hydrophilic surface.

Abstract: A kitchenware washing apparatus has a wash tank and a heated tank connected in a manner that they have a common wall for maximum water heating efficiency. In a preferred manner, the common wall has a tiered configuration. A particle accumulator is positioned inside a cabinet of the apparatus and in a flow path of the overflow drain water from the wash tank.

Abstract: A wet cleaning or wet etch facility for semiconductor wafers includes a plurality of chemical baths into which wafers are dipped, a drying unit for drying the wafers, a robot arm that transports the wafers to the plurality of the chemical baths and the drying unit in sequence, and a bubble-detecting sensor for detecting the amount of bubbles generated by the chemicals. A central control unit stops the wet cleaning or wet etch process for a while when the amount of bubbles produced by the chemical exceeds a predetermined amount.

Abstract: A combination of parallel processes to provide optimal re-mediation operations for contaminated soil. Soils with high levels of heavy petroleum hydrocarbons are directed to a thermal process for destruction in a combustion process. Carbon dioxide generated and recovered in the thermal process is employed as a solvent in a solvent process to clean other soils of petroleum hydrocarbons and certain chlorinated hydrocarbon compounds. In the solvent process, contaminated soils are run through a closed soil separator where the soils are washed with carbon dioxide. The carbon dioxide is then dried from the soil and the soil is sent for segregation. Soils with the lightest forms of hydrocarbon contamination (gasoline, etc.) are subjected to a vaporization process utilizing heat energy generated in the thermal process to heat the soil, under a partial vacuum, and the vapors generated are captured, condensed, and recovered as product.

Abstract: A method and system for reliably reducing the formation of particles upon wafers or substrates during wafer processes is disclosed. The method and system reduces residue contamination of a substrate material during wafer processes by pre-filling a pressure chamber to a first pressure P1 with a purified pre-fill prior to filling the pressure chamber with a primary bulk source at a second pressure P2. By pre-filling a chamber with purified pre-fill source at the first pressure P1 which is substantially equal to the bulk source pressure P2, the contaminants found in the bulk CO2 remain within the bulk CO2. Thus, this method and system reduces precipitation of contaminates caused by the depressurization of the bulk source during wafer processes and thereby reduces corresponding substrate material contamination.

Abstract: An automated kitchenware washing tank has a pump system with a pump and fluid conduits to couple the pump between an intake opening through one of the walls and discharge openings in the wall of the tank. At least some of the discharge openings are preferably formed in at least one angled portion of the tank wall that faces downwardly into the tank, and, more preferably, on two opposed angled portions that face downwardly into the tank. A control system may be coupled to the pump for controlling the speed with which the pump supplies cleaning fluid to the discharge openings. The control system comprises a speed selector that is adapted to allow a user to activate the speed selector to select between at least two different speeds for pumping the cleaning fluid to the discharge openings. In operation, the automated washing tank pumps cleaning fluid from within the tank through the intake outlet through the fluid conduits and out of the discharge openings into the tank to create turbulence within the tank.

Abstract: Provided is a parts washer that includes a multi-tiered basin, a cleaning fluid and a biological component, living within the fluid, that breaks down organic waste. The multi-tiered basin includes a sink member with a false bottom, and a support grid and filter are interposed between the false bottom and a bottom panel of the sink member. The false bottom, support grid, and filter are readily removable from the sink member. The tank is partially filled with the cleaning fluid and a pump and conduit assembly direct a flow of the cleaning fluid to the basin. The cleaning fluid discharged into the basin flows through a drain hole in the false bottom, through the filter and support grid, and then through a drain hole in the bottom panel of the sink member back into the tank for reuse. The cleaning fluid includes, at least, a surfactant that functions to remove organic waste from the parts being washed.

Abstract: A dish-cleaning appliance comprising a sink having a bowl defining a wash chamber with an open top for providing access to the wash chamber. A liquid recirculation system is provided for spraying liquid onto the dish rack to effect the cleaning of any dishes along the rack. A basket with a sprayer is disposed within the wash chamber. A self-aligning coupling fluidly connects a liquid conduit to the sprayer when the basket is seated.

Abstract: A slurry tank autocleaner for cleaning an empty slurry tank. A first pipe is inserted in the interior of the slurry tank, where the first pipe has an open end located inside the slurry tank. A first nozzle is disposed on the open end of the first pipe. A cover is used to cover the slurry tank, where the cover has a plurality of second nozzles targeting the slurry tank. A second pipe is connected to the second nozzles. A controller is used to control chemical, pure water or dry gas to spurt from the first nozzle and the second nozzles through the first pipe and the second pipe. Thus, the slurry tank can be automatically cleaned.

Abstract: A substrate processing unit 10 capable of restraining contaminants such as particles, watermarks and the like from being adhered to a substrate such as a semiconductor wafer and the like, wherein the substrate processing unit 10 comprises a processing bath 11 for accommodating the substrates (e.g., wafer W) to be processed, a processing fluid introduction pipe 21 for supplying processing fluid (e.g., purified water J) to the processing bath 11, a vapor generating bath 61 for accommodating an organic solvent S (e.g., IPA fluid), a processing fluid discharge section 30 for discharging processing fluid from the processing bath 11, and a solvent heating unit 62 for heating the organic solvent S inside the vapor generating bath 61, wherein the vapor generating bath 61 introduces vapor generated from the organic solvent S to the inside of the processing bath 11, and the solvent heating unit 62 heats the organic solvent S inside the vapor generating bath 61 at a temperature in the range of 50° C.

Abstract: The present invention relates to a chemical solution treatment apparatus for dissolving and removing ruthenium-based metal adhering to a substrate by a chemical solution, comprising: a chemical solution treatment unit which make the substrate come into contact with said chemical solution; a reservoir unit for storing the chemical solution which is used in said chemical solution treatment unit; and a chemical solution circulation system having said reservoir unit, a chemical solution supplying means for supplying the chemical solution inside said reservoir unit to said chemical solution treatment unit, and a chemical solution returning means for returning the chemical solution, which is used and recovered in said chemical solution treatment unit, to said reservoir unit, wherein: said chemical solution treatment unit comprises a chemical solution supplying nozzle for supplying the chemical solution to the substrate, and a recovering mechanism for recovering the used chemical solution; said reservoir unit has a

Abstract: A dishwasher sanitation cycle includes sampling a temperature of rinse water inside a dishwasher, executing a heating cycle to keep water temperature at optimal levels, and executing a heat sum cycle to ensure that dishes are sanitized according to accepted standards.

Abstract: A method for servicing firefighter's turnout gear includes the step of transporting a mobile servicing facility in proximity to a fire department facility. The mobile servicing facility carries cleaning equipment for cleaning firefighter's turnout gear. For example, the cleaning equipment may include a cleaning machine for use with a carbon dioxide-based cleaning agent, a solvent, or laundry equipment. The method also includes the steps of operating the cleaning equipment to clean turnout gear of the fire department facility, and transporting the mobile servicing facility away from the fire department facility. Optionally, the mobile servicing facility also carries repairing equipment, supplies for repairing the turnout gear, power generation equipment, and/or a tracking system for preparing a report of services performed on the turnout gear.

Abstract: A continuous flow, steady state fluid delivery and recovery system for a process chamber and processes requiring supercritical fluid and desired additives including co-solvents, for conducting repetitive batch processing operations in an automated environment, for such processes as supercritical carbon dioxide cleaning and processing of semiconductor wafers. The system provides for steady-state operation of fluid flow and byproducts recovery while the process chamber is brought rapidly and repeatedly on and off line as in batch operations and for various process steps.

Abstract: A food serving preparation oven is provided and includes a plurality of walls forming a heating area in which food servings to be heated are disposed and a cleaning fluid circulation assembly for performing selected cleaning of the heating area. The cleaning fluid circulation assembly is operable to circulate cleaning fluid through a loop which includes the heating area, a sump area, and a pressure side area. The cleaning fluid circulation assembly includes a pump to effect movement of cleaning fluid to an in-loop outlet opening, which opens into the heating area. A fluid distribution element disposed within the heating area at a spacing from the in-loop outlet opening directs a portion of cleaning fluid in a first directed stream into the heating area and directs another portion of cleaning fluid in a second directed stream into the heating area.

Abstract: A spray clean stage of a pretreatment system for treating a product surface having contaminants includes a tank for holding a cleaning solution to clean the product surface. A solution applicator is in fluid communication with the tank through an applicator inlet. The solution applicator is oriented to spray the solution onto the product surface thereby removing the contaminants from the product surface. A partition at least partially covers the tank and receives runoff of the solution from the product surface being sprayed with the solution. The partition is oriented to direct the runoff of solution from the product surface into the tank at a location spaced from the applicator inlet to distance the contaminants removed from the product surface from the applicator inlet.

Abstract: The present invention is directed to a controlled environment processing chamber or chambers in which solvents and/or solutions used for processing a material or object can be introduced. The process includes a means of applying a negative gauge pressure to the chamber to remove air or other non-condensable gases. Means are provided for introducing a solvent, solvent mixture or solution in either a liquid or vapor state. A first system recovers solvent(s) or solution(s) from the object being processed and chamber, and a second system, separate from the first system, further recovers residual solvent or solution from the object and chamber. Treatment may be in the form of coating, etching, deposition, cleaning, stripping, plating, adhesion, dissolving, penetrating, anodizing, impregnating, debinding or any other process in which material is removed or deposited on a solid surface by transfer from or to a liquid or gas phase.

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract: The present invention relates to a wrap around booster (10), and more specifically, the present invention relates to a wrap around booster (10) for use with a high temperature dishwashing machine (40). The wrap around booster (10) heats the water of the dishwashing machine (40) from approximately 110-140° F. to at least 150° F. in the wash tank (11) and at least 180° F. in the rinse tank (26). This is accomplished by keeping a relatively constant volume of water in the rinse tank (26) containing the wrap around booster (10), which maintains the rinse tank water at least 180° F. The rinse tank water surrounds the wash tank (11). The warmer water in the rinse tank (26) surrounding the wash tank (11) therefore heats the water contained in the wash tank (11) through convection. Therefore, one heating system does the work of two heating systems.

Abstract: A steam mop. A housing contains a water reservoir for storing water and a heating plate outside the water reservoir. The reservoir dispenses water to the heating element which heats the dispensed water to produce steam substantially instantaneously. The reservoir preferably includes a mechanism for dispensing additional water to the heating element on demand to produce a “burst of steam.” Preferably an absorbent cloth to which is attached a relatively stiff perimeter frame adapted to fit around the bottom of the housing is provided, the cloth assembly being easily removable for cleaning.

Abstract: A semiconductor cleaning apparatus and a method of cleaning a wafer surface using the semiconductor cleaning apparatus are provided. In the semiconductor cleaning apparatus, wastewater is easily treated, the consumption of chemical usage is considerably reduced, and a contaminant removal efficiency on the wafer surface is maximized even at a room temperature or a low temperature by using a mixed chemical solution composed of an aqueous ammonium hydroxide and ozone as a cleaning solution in cleaning the wafer surface. In the method of cleaning the wafer surface, a cleaning solution is formed in a mixing tank by adding ozone to aqueous ammonium hydroxide. The cleaning solution is supplied into a cleaning bath through a filter for removing ozone bubble. Megasonic power is applied to the cleaning solution in the cleaning bath using a megasonic transducer. A wafer dipped in the cleaning solution which is at a room temperature to remove the contaminants on wafer surface.

Abstract: A system for heating solvents in processing semiconductor wafers has a coiled solvent tube, a coiled cooling water tube, and electric heater elements, cast in place within an aluminum casting. The solvent flows through the solvent tube and is heated by conduction of heat through the casting. The solvent is safely isolated from the heating elements. Water is pumped through the cooling water tube, to cool the casting if solvent flow is interrupted, or if the measured casting temperature exceeds a predetermined set point temperature. Solvent temperature is maintained by controlling power to the heating elements based on the measured solvent temperature at the processing chamber.

Abstract: An apparatus for cleaning a glass substrate for use in information recording medium, having improved detergency, includes a plurality of gas feeding pipes, provided in a cleaning tank storing therein a cleaning fluid, for feeding air into the cleaning tank to generate bubbles of air in the cleaning fluid in which a glass substrate is immersed. The bubbles are brought into contact with the glass substrate while stirring the cleaning fluid to effectively remove deposits on the surface of the glass substrate.

Abstract: A cookware washer includes a wash chamber, and a lower rack positioned within said wash chamber. The lower rack includes a substantially unobstructed bottom surface.

Abstract: A cleaning unit (A) includes a movable cart (20) which carries a cleaning system for cleaning baked-on residues from walls (10) of a sterilizer chamber (12). The cleaning system includes a lid (80) which is mounted over an opening (82) to the chamber. In one embodiment, the door (232) of the chamber provides the lid. An articulating nozzle (124) extends from the lid into the interior of the chamber. Alkaline and acid cleaning solutions (180, 182), for removing organic and inorganic residues, respectively, from the chamber, are stored in two storage containers (52, 54) carried by the cart. A first pump (60), mounted on the cart, pumps first the alkaline, then the acid cleaning solution to the nozzle. A second pump (62), mounted on the cart, connects with a scavenge fitting (166) in the chamber to return the cleaning fluid to the respective storage container.

Abstract: A method and apparatus for removing contaminants from the surface of a metallic article comprises a continuously flowing acid bath whose level of acidity and temperature is controlled and over which a purging gas flows to continuously remove hazardous gases generated during the removal of contaminants from the metallic article.

Abstract: A system for heating solvents in processing semiconductor wafers has a coiled solvent tube, a coiled cooling water tube, and electric heater elements, cast in place within an aluminum casting. The solvent flows through the solvent tube and is heated by conduction of heat through the casting. The solvent is safely isolated from the heating elements. Water is pumped through the cooling water tube, to cool the casting if solvent flow is interrupted, or if the measured casting temperature exceeds a predetermined set point temperature. Solvent temperature is maintained by controlling power to the heating elements based on the measured solvent temperature at the processing chamber.

Abstract: Methods for cleaning a microelectronic substrate in a cluster tool are described that include placing the substrate in a pressure chamber of a module in a cluster tool; pressurizing the pressure chamber; introducing liquid CO2 into the pressure chamber; cleaning the substrate in the pressure chamber; removing the liquid CO2 from the pressure chamber, depressurizing the pressure chamber, and removing the substrate from the pressure chamber. Apparatus for processing a microelectronic substrate are also disclosed that that include a transfer module, a first processing module that employs liquid carbon dioxide as a cleaning fluid coupled to the transfer module, a second processing module coupled to the transfer module, and a transfer mechanism coupled to the transfer module. The transfer mechanism is configured to move the substrate between the first processing module and the second processing module.