Abstract: A wet cleaning or wet etch facility for semiconductor wafers includes a plurality of chemical baths into which wafers are dipped, a drying unit for drying the wafers, a robot arm that transports the wafers to the plurality of the chemical baths and the drying unit in sequence, and a bubble-detecting sensor for detecting the amount of bubbles generated by the chemicals. A central control unit stops the wet cleaning or wet etch process for a while when the amount of bubbles produced by the chemical exceeds a predetermined amount.

Abstract: An apparatus and method for operating a dishwasher in a variable dry cycle mode is provided. The dishwasher includes a wash chamber, a heater element located within the wash chamber, a rinse aid product dispenser, and a fan unit for circulating air. The method comprises determining a temperature of the wash chamber, determining an amount of rinse aid product in the dispenser, and, based upon the determined temperature and the amount of rinse aid product, determining an optimized heater element cycle and an optimized fan unit cycle.

Abstract: The invention produces a change to the acoustic input power applied to a liquid in a vessel. The magnitude and shape of the resulting change in the ultrasonic field in the vessel is measured and this data is used to determine the ultrasonic activity in the vessel. This measured ultrasonic activity is displayed as a measure of the performance of the system and/or it is fed back to the ultrasonic transmitter to control or maintain the process.

Abstract: Cleaning according to an evaporating dish cleaning mode or heating chamber cleaning mode is implemented based on a signal inputted by the control part. In the heating chamber cleaning mode, condensation is generated on the inner surface of the heating chamber 11 by steam, and the soil adhered to the inner surface of the heating chamber 11 is allowed to float to be in a state of removing it easily. In the evaporating dish cleaning mode, a cleaning liquid made of citric acid solution is pumped into an evaporating dish 35, it is heated to a predetermined temperature, and it is left therein. Therefore, calcium and magnesium deposited on the evaporating dish 35 are allowed in a state of removing them easily.

Abstract: An apparatus for cleaning a semiconductor substrate has a chuck for rotatably supporting the semiconductor substrate, and a horizontally movable probe for applying ultrasonic vibrations uniformly to cleaning solution supplied onto an upper surface of the semiconductor substrate. The probe makes contact with the cleaning solution supplied and extends vertically from the upper surface of the substrate. The cross-sectional area of the probe gradually increases in a direction towards the semiconductor substrate so that the ultrasonic vibrations are widely distributed to the cleaning solution. The lower surface of the probe has surface features that act to disperse a reflected wavefront of the vibrational energy. Thus, patterns formed on the semiconductor substrate will not be damaged by the ultrasonic vibrations.

Abstract: An engine cleaning system has a cleaning solution container (11) having a filter element (52) therein and is adapted to establish a predetermined quantity of solution for a particular engine. Solution is pumped from the solution container (11) to the engine interior by the engine oil pump, and a solution drain line (31) connects the engine interior and the solution container. Oil and cleaning solution are pumped by the engine oil pump continuously during the cleaning process. The solution container has a removable closure for filter replacement and a drain valve (12) for solution and oil.

Abstract: A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.

Abstract: Pollution caused by chemical pollutants can be estimated automatically. A chemical pollutants detecting unit 60 installed in a duct 33 includes a supporting shaft 61, which is inserted into a sidewall 11a of a housing, for supporting the chemical pollutants detecting unit 60, a quartz crystal microbalance 62 for detecting organic matters in a clean air 53 passing through the duct 33, an oscillating circuit 63 for oscillating the quartz crystal microbalance 62, an oscillation frequency detecting block 64, a chemical pollutants calculating block 65, a controller 66, an output unit 67, a heater 68 for heating the quartz crystal microbalance 62, and a thermo-hygrometer 70. A chemical filter is examined automatically whether an ability of removing the chemical pollutants thereby is degraded or not. If the ability is found to have been degraded, efficiency in an IC manufacturing method can be prevented from being degraded by issuing an alarming signal beforehand.

Abstract: The present invention comprises methods, compositions and apparatus for cleaning the surfaces within vessels that have restricted points of entry, and in particular, the surfaces within oxygen converters and oxygen cylinders. These oxygen converters and oxygen cylinders are components of the onboard oxygen supply systems of aircraft. A surfactant and a solvent are mixed to form a cleaning composition that is boiled at reduced pressure and increased temperature within the oxygen converter or oxygen cylinder. The oxygen converter or oxygen cylinder is rinsed with pure solvent, and the rinse fluid is measured to determine the level of contaminants. Dry air is forced through the oxygen converter or oxygen cylinder to remove remaining solvent. The cleaning composition may comprise a fluorocarbon solvent and a fluorosurfactant.

Abstract: In an apparatus for etching a glass substrate according to the present invention, impurities that are attached to the surface of a glass substrate, which are formed by assembling a color filter substrate and a TFT substrate provided in the etching bath filled with etchant, are removed by using ultrasonic oscillation generated from an ultrasonic oscillator, by which a glass substrate having uniform thickness and surface is obtained.

Abstract: A slit type blow nozzle 14 for ejecting a blow gas 1 and a slit type chemical rinse nozzle 12 for ejecting a rinse chemical 2 are arranged such that the blow gas removes a coating film dissolved by the chemical rinse from the end surface of a glass substrate.

Abstract: A method and apparatus for dispensing a fluid of mixed disinfectant and water in a spray to footwear of a worker is disclosed. The apparatus includes a housing including a base section, a platform installed within the base section, a fluid dispensing assembly coupled to the housing, and a fluid dispensing system of mixed disinfectant and water including a first valve assembly configured to dispense fluid to the fluid dispensing assembly when a force is applied to the platform so that the spray of the fluid is dispensed onto the footwear. A method of sanitizing the footwear of a worker with a fluid may include the steps of detecting when the worker has stepped onto a platform and dispensing the fluid onto the footwear for at least a predetermined period.

Abstract: Provided is a substrate processing apparatus capable of supplying pure water that is stabilized with respect to the concentration of nitrogen gas. First and second nitrogen concentration meters to measure the nitrogen gas concentration of pure water are respectively disposed before and after a concentration change part that can dissolve and degas nitrogen gas by using a hollow fiber type separation membrane. In order to maintain the nitrogen gas concentration of pure water at a target concentration value, the dissolution and degassing in the concentration change part are controlled by adjusting the degree to which a first valve on a nitrogen gas supply path and a second valve on a nitrogen gas degassing path are opened, based on a concentration difference between a target concentration and both of the first and second nitrogen concentration meters.

Abstract: An method and apparatus for forming wafers of varying thickness'. The apparatus includes a template. The template is formed of a main disk including a plurality of cavities extending into a first side thereof and a backing plate positioned on a side of the main disk opposite the first side. Holding disks are moistened and positioned within respective cavities for releasably securing a wafer in the cavity. When the template is releasably secured to and rotatable with a rotating head and positioned such that the first side faces a lapping and polishing surface, wafers received by the cavities are lapped and polished upon rotation of the rotating head. A plurality of shims are selectively received within respective cavities between a base of the cavity and the holding disk for adjusting a depth of the cavity thereby adjusting an amount of a wafer to be lapped and polished. The shims have varying thickness' and are color coated, each color being representative of a predetermined thickness for the shim.

Abstract: A liquid processing apparatus is provided to improve its processing efficiency, together with a liquid processing method. The apparatus is capable of both reduction in temperature-variation of a processing liquid at processing and shortening for temperature-recovery of the processing liquid. Further, the liquid processing apparatus can facilitate the establishment of respective designated temperatures for different processes and carry out different processes continuously and effectively. The apparatus includes an inner cylinder 25 to accommodate semiconductor wafers W and a chemical supply unit 50 to supply the semiconductor wafers W in an inner cylindrical chamber 23 with a chemical liquid. The apparatus further includes a case heat exchanger 90 arranged in an outer peripheral position of the inner cylinder 25 and allowing a temperature-adjustment medium to flow and a medium supplier 100 to supply the regulator 90 with the temperature-adjustment medium.

Abstract: A processing apparatus and a processing method are capable of properly and easily obtaining accurate data on the contact pressure applied by an end effector to a workpiece while a process is being carried out. A processing apparatus (7) processes a surface of a wafer (W) held by a spin chuck (22) (holding means) by bringing an end effector (40) into contact with the surface of the wafer (W). The end effector (40) can be retracted from the surface of the wafer (W) to a waiting position (25). A measuring and cleaning device (28) comprises, in combination, a measuring device (26) for measuring contact pressure to be applied to the wafer (W) by the end effector (40), and a cleaning device (27) for cleaning the end effector (40). The measuring device (26) has a table (60) for supporting the end effector (40), and a pressure sensor (62) for measuring a pressure applied to the table (60) to estimate a contact pressure actually applied by the end effector (40) to the wafer (W).

Abstract: An automatic dishwashing appliance containing a cell and/or device comprising same for electrolyzing tap water and/or wash and/or rinse liquor for treating tableware to improve cleaning, sanitizing and stain removal. The present invention also relates to methods of use and articles of manufacture.

Abstract: A wet cleaning device for chemically cleaning a plurality of wafers. The wet cleaning device includes a plurality of first chemical cleaning tanks for conducting a first cleaning procedure, a plurality of second chemical cleaning tanks for conducting a second cleaning procedure, a transferring tank including a first measuring device for measuring the wafers after the first cleaning procedure, a measuring tank including a second measuring device for measuring the wafers after the second cleaning procedure, a first transporting device, and a second transporting device.

Abstract: An auto slurry deliver fine-tune system and a method using the system is discloses. A slurry flow system varies the flow rate of the slurry in a CMP system and the distance between the slurry injector and the polish head of the CMP system. A current detect system detects the current driving the turn-table of the CMP system. Moreover, a judgement system determines whether the current is minimum in order to determine that the flow rate and the distance are optima.

Abstract: A dishwasher having the advantage of fast interrupt of the operation of its dishwasher components is disclosed. The dishwasher has an openable cabinet and a washing compartment disposed within the openable cabinet. The dishwasher further includes a handle associated with the openable cabinet for opening the cabinet to provide access to the washing compartment and a sensor in operative communication with the handle such that when a user grasps the handle, the sensor senses the user's presence prior to opening the cabinet so that operation of the dishwasher can be interrupted.

Abstract: The methods and apparatus of the present invention include an tubing disposed within an conduit to assure flow through the outer pipe. The tubing string is nearly neutrally buoyant or substantially buoyant and has a cleaning and monitoring tool attached to its end. In a preferred embodiment of the present invention, an apparatus for removing material from an conduit includes an tubing extending through the conduit and having a flowbore adapted to flow fluids within the tubing and a monitoring and cleaning tool attached to and receiving the fluids from the tubing. The tool preferably includes a plurality of nozzles, a sonic measuring device, and an expandable element.

Abstract: An apparatus for monitoring a cleaning process for a medical device includes a cleaning chamber for receiving and cleaning the instrument with a cleaning liquid, a receiving well within the cleaning chamber, a removable soil standard receivable within the receiving well whereby to be exposed to the cleaning process within the cleaning chamber; and a soil detector coupled to the cleaning chamber and adapted to provide an indication of the amount of the soil on the soil standard while the soil standard is received within the receiving well.

Abstract: A method for servicing firefighter's turnout gear includes the step of transporting a mobile servicing facility in proximity to a fire department facility. The mobile servicing facility carries cleaning equipment for cleaning firefighter's turnout gear. For example, the cleaning equipment may include a cleaning machine for use with a carbon dioxide-based cleaning agent, a solvent, or laundry equipment. The method also includes the steps of operating the cleaning equipment to clean turnout gear of the fire department facility, and transporting the mobile servicing facility away from the fire department facility. Optionally, the mobile servicing facility also carries repairing equipment, supplies for repairing the turnout gear, power generation equipment, and/or a tracking system for preparing a report of services performed on the turnout gear.

Abstract: A wet processing device of this invention is comprised of a chemical processing tank to store chemicals for processing the surface of the wafer, a wafer conveyor device to carry the wafer in and out of the interior of the chemical processing tank, and a sensor to determine the amount of air bubbles occurring within the chemical when present within the chemical processing tank and issue a first and a second control signal, and a wash tank to store water for washing the wafer carried out from the chemical processing tank by the wafer conveyor. The rising speed of the wafer conveyor device pulled the wafer up from the chemical processing tank is controlled in response to the first control signal, and the wash tank water fill quantity for supplying water to the wash tank is controlled in response to the second control signal.

Abstract: Disclosed is a substrate cleaning method for removing particles from a substrate includes a first step of adjusting the concentration of dissolved nitrogen in pure water, so as to be less than or equal to the concentration of dissolved nitrogen in equilibrium with the atmosphere (about 16 ppm), in a supply line that supplies the pure water, and a second step of cleaning a substrate by supplying a cleaning tank with a cleaning solution produced by mixing at least hydrogen peroxide with the pure water adjusted at the first step, and applying an ultrasonic wave to the cleaning solution in which the substrate is immersed.

Abstract: The methods and apparatus of the present invention include an tubing disposed within an conduit to assure flow through the outer pipe. The tubing string is nearly neutrally buoyant or substantially buoyant and has a cleaning and monitoring tool attached to its end. In a preferred embodiment of the present invention, an apparatus for removing material from an conduit includes an tubing extending through the conduit and having a flowbore adapted to flow fluids within the tubing and a monitoring and cleaning tool attached to and receiving the fluids from the tubing. The tool preferably includes a plurality of nozzles, a sonic measuring device, and an expandable element.

Abstract: Method and apparatus for determining an endpoint of a cleaning process running in a chamber. In particular, one embodiment of the present invention is a method that includes steps of: (a) directing radiation absorbed by a byproduct of the cleaning process into an exhaust line of the chamber; (b) detecting a measure of absorbance of the radiation by the byproduct; and (c) determining the endpoint when the measure of absorbance falls within a predetermined window.

Abstract: A chip handling system for integrated circuit (IC) chips each having circuitry on a first face, has a delivery station for receiving, from a first transfer device, a row and column array of chips with the first face upward, a second transfer device enabled to move chips row-by-row across the delivery station from a first side to a second side, a delivery path aligned with a row of chips at the second side of the delivery station, a first linear transfer mechanism for moving a row of chips at the second side of the delivery station into and along the delivery path, a rotary transfer device having platforms arranged around a central axis, each platform having a groove parallel to the central axis for accepting rows of chips on each platform, and a drive rotating the device in angular increments to align the grooves with the delivery path, an elongate track and a second linear transfer mechanism located at a position relative to the rotary transfer device 180 degrees from the first delivery path, for receiving r

Abstract: An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Abstract: In the present invention a car wash system is provided with a plurality of additive supplies, often referred to as solutions in the car wash industry, each supply feeding to a manifold including a common meter that has a value associated with each of the separate additive supplies for controlling flow from each of the supplies. A single variable speed pump under control of the computer pumps water through the meter and against the vehicle to be washed. The flow of the water through the meter aspirates additives from the supplies that mix with the water stream in the meter. Opening and closing of the valves to admit one or more of the additives to the water stream is responsive to a pre selected car wash cycle that is controllable by a controller.

Abstract: An automotive vehicle washing system includes a frame comprising a bridge member end opposed and support sections mounted for linear reciprocating movement on spaced apart support rails. Pivoting washing nozzle support arms are mounted on the bridge section and are interconnected by a drive motor and drive pulleys to move in opposite directions to wash the sides and opposite ends of a vehicle. Each arm includes movable arm sections supporting spaced apart nozzle assemblies which may move toward each other or away from each other to size a vehicle according to its width. Each arm includes opposed elongated beam members which also provide fluid conducting passages for conducting washing fluids to the nozzle assemblies. Certain ones of the nozzle assemblies are drivenly connected to an oscillating servomotor. The servomotor is also used to position the pivoting arm sections through a lost motion coupling and a gear drive unit.

Abstract: A process for removing residues from the microstructure of an object is provided, which comprises steps of preparing a remover including CO2, an additive for removing the residues and a co-solvent dissolving the additive in said CO2 at a pressurized fluid condition; and bringing the object into contact with the remover so as to remove the residues from the object. An apparatus for implementing the process is also provided.

Abstract: An ultrasonic vibrating apparatus and an ultrasonic cleaning apparatus capable of permitting ultrasonic cleaning of a wafer to be carried out using an existing cleaning tank and while keeping the object immersed in cleaning liquid. An ultrasonic wave is irradiated to a cleaned object while keeping it immersed in cleaning liquid stored in a cleaning tank formed with an upper opening. A vibrating plate is securely mounted thereon with an ultrasonic transducer through a wave transmission element and arranged so as to close the upper opening of the cleaning tank in a cover-like manner. The vibrating plate is so arranged that a vibrating surface thereof downwardly faces and is immersed in the cleaning liquid.

Abstract: The prevent invention provides a substrate processing apparatus and a substrate processing method which can process hydrophobic wafers with a fluid mixing nozzle.

Abstract: A cleaning device and method is provided for a glue-spreading element, which spreads glue in a working position onto a material web, in particular a paper web, and which can be moved to a cleaning position inside the cleaning device. At least one scraper element is provided for cleaning the glue-spreading element.

Abstract: There are provided a lower sensor and an upper sensor mounted respectively on top and bottom surfaces of a sensor unit, an operation unit calculating respective measurements indicating the degree of adhesion of dirt to respective surfaces of a lower mold and an upper mold based on respective detection signals from the lower sensor and the upper sensor, and a comparator unit comparing each measurement from the operation unit with a predetermined reference value to transmit a predetermined warning signal if the measurement is equal to or smaller than the reference value. The warning signal is thus transmitted if reflected radiation that is radiation reflected from the mold surface has its intensity equal to or smaller than the reference value.

Abstract: An automatic system is used for controlling the cleaning stage of a strip cleaning line, e.g. an aluminum strip cleaning line. The cleaning line includes a chemical cleaning section and at least one rinse section, with cleaning solution being sprayed onto the top and bottom faces of the aluminum strip as it passes through the cleaning section. A programmable logic controller has a dwell time set point for each coil of aluminum strip, which gives for standard conditions of chemical concentration and temperature the time the strip should be exposed to the spray. The controller receives input signals based on the measured temperature and concentration of the cleaning solution and adjusts the dwell time of the cleaning solution spray on the aluminum strip accordingly.

Abstract: An electrochemical sensor (A, A′) is specific for the detection of peroxyacetic acid in a solution which also contains hydrogen peroxide. A potential is applied between a reference electrode (120, 120′) and a working electrode (118, 118′). A read voltage (FIG. 7) is selectively pulsed across a counter electrode (122, 122′) and the working electrode. The current flowing between the working electrode and the counter electrode is dependent on the peroxyacetic acid concentration in the solution (FIG. 6). By careful selection of the read voltage, the contribution of hydrogen peroxide to the current flow is virtually negligible. The sensor effectively measures peroxyacetic acid concentrations in the range generally employed in sterilization and disinfection baths (100-3000 ppm.).

Abstract: Cleaning solution supply units provide cleaning solutions to a tank equipped with a wafer mounting unit on which a wafer is mounted. Drain outlets are provided which drain the respective cleaning solutions from the tank, and a motor is used to rotate the rotatable wafer mounting unit to conduct a spin dry process within the tank. An isopropyl alcohol (IPA) vapor supply unit is provided supplies an IPA vapor to the tank to conduct an IPA pressure reduction dry process within the tank. Valves are used to selectively place the tank in fluid communication with the cleaning solution supply units, the drain outlets and the IPA vapor supply unit.

Abstract: The present invention is directed to a device and method for removing build-up on such measurement gauges. The inventive device and method involve a movable scraper that fits around a cylindrical shield of a measurement gauge and continuously removes the build-up on the shield. Movement of the scraper is accomplished by a magnetic coupling between a magnetic core attached to the scraper, which is inside a pipe or other piece of equipment, and solenoids that are installed on the outside of the pipe. The device and method of the invention ensure instantaneously correct readings from the measurement gauge and improve control and operation strategies of heat exchanges, with significant economic advantages.

Abstract: Method and apparatus for servicing a vehicle's transmission cooling system, where the apparatus includes a source valve with inlet and outlet ports, a pump with inlet and outlet ports, and a return valve with inlet and outlet ports. The pump inlet is connected to the source valve outlet. The pump pumps fluid from the source valve inlet through the source valve outlet and the pump inlet to the pump outlet for servicing the transmission cooling system. The fluid returns from the return valve inlet to the return valve outlet and the pump then re-pumps the fluid into the transmission cooling system. The service apparatus may also include a fluid source and a filter interposed between the fluid source and the source valve, where the fluid returns to the fluid source prior to re-pumping the fluid. The service apparatus may also include a flowmeter interposed between the return valve and the fluid source and a filter interposed between the return valve and the flowmeter.

Abstract: The present invention relates to a method and monitoring device for monitoring a wash process inside a washing apparatus, the method comprising the steps of introducing into the washing apparatus a monitoring device suitable for measuring physical and/or mechanical parameters of the wash process and recording the measured parameters within the monitoring device. A self-contained and wireless monitoring device is used.

Abstract: A process tank for stripping photoresist from semiconductor wafers. In one aspect the invention is a process tank having a process chamber, means to support at least one wafer in the processing chamber, means for supplying a process liquid to the chamber, a lid adapted to close the chamber, a liquid level sensor adapted to stop the supply of process liquid to the chamber when the process liquid fills the chamber to a predetermined level below a wafer supported in the processing chamber, an acoustical energy source adapted to supply acoustical energy to process liquid located in the chamber so as to create a mist of the process liquid in the processing chamber, and means to supply a process gas to the chamber, the process gas supply means being located above the predetermined level and adapted to supply process gas to the chamber under pressure during mist creation.

Abstract: A vehicle wash system having a series of spray assemblies for use in cleaning vehicles such as a highway salt truck. As the vehicle is driven through the vehicle wash system, sensors alert the control system as to the location of the vehicle. While using a single pump, the control system then activates and deactivates valves to selectively open and close high pressure flow paths to various spray assemblies as the vehicle moves through the vehicle wash system. The nozzles in the spray assemblies receive full pressure water when the corresponding valve is opened and are oriented to clean specific portions of the vehicle in a predetermined sequence.

Abstract: The present invention is a valve cleaning apparatus and method for transporting a cleaning fluid from a supply tank into the air intake valves of a combustion engine. It comprises housing having a pair of legs and a closed end. The housing has a flow path through the housing. A valve is located collinear with the flowpath. The valve cleaning apparatus also includes tubing, a nozzle and a hook to hang the assembly from the hood of a car.

Abstract: A new method and apparatus is provided that assures constant fluid flow of the fluid that is entered into a semiconductor device processing tank or container. A flow meter is set to a particular flow rate; the fluid that comes from the POU is routed through the flow meter. The fluid passes through a flow meter into a processing tank. The fluid is allowed to fill the container up to an overflow point of the container. An overflow basin is provided into which the overflowing fluid is routed from where the fluid is drained into a fluid reclaim vessel. The overflow is detected by a sensor, the sensor activates an overflow relieve valve that is mounted in the bottom of the container. The overflow relieve valve is opened and drains fluid from the container thus counteracting the overflow of the fluid into the overflow basin. The interaction between the overflow detector and the overflow relieve valve assures a constant rate of supply of the fluid to the processing tank or container.

Abstract: In one aspect, a dishwasher comprising a controller coupled to a human machine interface comprising an indicator corresponding to a dishwasher model type is described. The dishwasher further comprises a cabinet comprising a tub having a front opening and forming a wash chamber, at least one rack extending into the wash chamber, a water pump for pumping water into the dishwasher, and a door engaged to the cabinet for closing the tub front opening. The controller is configured to control operation of at least the pump based on the model type indicator.

Abstract: Method of checking the aseptic nature of washing before opening at least one door of the washing machine. A washing machine (10) is fitted with at least one door (14) capable of being opened into a clean room (20) at the end of each washing-rinsing-spin drying cycle. So as to avoid this opening operation being performed if the conditions for asepsis of the washing are not ensured, opening is conditional on an opening authorization signal being emitted by a control unit (36). This unit checks, successively, the introduction of water into the tank (22) of the machine, the presence in the tank of detergent products, heating of the water to a minimum temperature and the maintainence of this temperature for a predetermined time interval. If any one of these conditions is not fulfilled, the automatic opening signal is not emitted.

Abstract: The aim of the invention is to provide a simple and economical device for opening and closing separate suction openings (13, 14, 15) of a device (1) which is provided for treating substrates, especially semiconductor wafers, and which comprises a treatment reservoir (3). Said treatment reservoir is filled with a treatment fluid and is arranged in an essentially closed space that has at least two separate suction openings (13, 14, 15). To this end, a rotatable disc (17) is provided which covers up the suction opening while isolating it from the space and which comprises a through-opening (18). One of the suction openings (13, 14, 15) can be at least partially overlapped by said through-opening.

Abstract: A method for monitoring a cleaning process for a soiled medical device. The method involves cleaning the soiled device with a cleaning liquid in a cleaning chamber, exposing a detector to the cleaning liquid to measure the amount of soil removed, determining whether a sufficient amount of the soil has been removed from the soiled device so that the soiled device can be sterilized, and sterilizing the soiled device. One method of determining the amount of soil is by detecting the signal generated from the reaction between a chemical and the soil. Another method is to provide a soiled standard and measure the amount of soil removed from the soiled standard to determine whether enough soil has been removed from the soiled standard so that the soiled device can be sterilized. Another method involves measuring the amount of soil removed from the soiled device with at least two detectors.