Abstract: A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

Abstract: A rotor for separating residual resin from additively manufactured objects in a centrifugal separator, the rotor including a rotor base and a plurality of engagement members configured to secure additively manufactured, light polymerized, objects to the rotor base, each object carrying unpolymerized resin on a surface thereof. The improvement includes a plurality of catch pans removably connected to the base, each catch pan configured to receive unpolymerized resin therein upon centrifugal separation of the resin from the additively manufactured, light polymerized, objects.

Abstract: A substrate cleaning apparatus includes a substrate holding mechanism holding the substrate, a rotation mechanism rotating the substrate held by the substrate holding mechanism, and a cleaning mechanism cleaning the substrate. The cleaning mechanism includes a support column, an arm extending from the support column and having a fixed height position, a cleaning tool supported by the arm and cleaning a surface of the substrate by contacting the surface, a lift mechanism moving the cleaning tool vertically with respect to the arm between an raised position separated from the substrate and a lowered position in contact with the substrate, and a controller controlling at least a speed at which the cleaning tool descends.

Abstract: A method for cleaning a semiconductor substrate without damaging its patterned structure via an ultra/mega sonic device comprises applying liquid into a space between the substrate and the sonic device; setting an ultra/mega sonic device power supply at a frequency f1 and power P1; and at zero output before bubble cavitation occurs; followed by at f1 and P1 again after bubble temperature is lowered; detecting power on time (at P1, f1), power off time or amplitude of each waveform output by the power supply; comparing the detected power on time with a preset time T1, power off time with a preset time ?2, amplitude of each waveform with a preset value, if the detected power on time is longer than ?1, or power off time is shorter than ?2, or amplitude of any waveform is larger than the preset value, shut down the power supply and send out an alarm.

Abstract: Disclosed is an anilox laser cleaning machine that includes: a multi-laser head with laser modules on a horizontal guide of a first movable support associated with the horizontal sliding carriage with the intermediation of brackets coupled to vertical micrometric axes associated with the horizontal sliding carriage controlled by servomotors. Each laser module includes: a laser resonator emitting a laser beam with a focal point in the vertical plane equidistant to the axes of rotation of the traction rollers of the anilox roller; and a vertical tube terminated in a nozzle oriented towards the focal point of the laser beam, connected to a suction source. The machine also includes a rotation detector with a palpate wheel contacting the surface of the anilox roller and associated with an encoder device connected to the electronic system of the machine that, in the absence of movement detection or irregular movement, activates the emergency stop.

Abstract: A rotatable wafer chuck includes chuck arms and wafer holders that are aerodynamically shaped to reduce turbulence during rotation. A wafer holder may include a friction support and an independently rotatable vertical alignment member and clamping member that is shaped to reduce drag. The shape reduces turbulence during edge bevel etching to improve the uniformity of the edge exclusion and during high-speed rotation to improve particle performance.

Abstract: A liquid processing apparatus of the present disclosure holds and rotate a substrate in a substrate holding unit, ejects an etching liquid while moving a main nozzle of a main nozzle unit between a first position where the etching liquid reaches a center of the substrate and a second position closer to a peripheral side of the substrate than the first position, and then, ejects the etching liquid to the substrate from a sub nozzle provided at a third position closer to the peripheral side of the substrate than the first position at an ejection flow rate higher than that from the main nozzle.

Abstract: A substrate processing apparatus is used for a spin drying apparatus, a pencil-type scrubbing cleaning apparatus, an IPA drying apparatus and the like, which are used as semiconductor wafer processing apparatuses. The substrate processing apparatus includes a substrate stage and a substrate chuck mechanism. The substrate chuck mechanism includes a chuck body having a substrate placing portion configured to place a peripheral portion of a substrate and a guide surface configured to guide an outer circumferential end surface of the substrate and to position the substrate when the substrate is placed on the substrate placing portion, and a chuck claw rotatably supported on the chuck body and configured to hold the peripheral portion of the substrate between the substrate placing portion and the chuck claw by turning the chuck claw inward in a closing direction.

Abstract: An improved portable cleaning system for use in cleaning heat exchanger tube bundles, fin-fans, towers and other elongated components. The cleaning system comprises a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: A cleaning device of a porous plate for nuclear power including: cleaning tanks (72, 73) that is capable of storing a cleaning liquid therein and is capable of housing the porous plate (43) in an upright state; a rotation device (84) that is capable of rotating the porous plate (43) within the respective cleaning tanks (72, 73); and an ultrasonic wave oscillation device (111) that irradiates the porous plate (43) within the cleaning tanks (72, 73) with ultrasonic wave. Thus, it is possible to efficiently remove the adhered foreign substances.

Abstract: A cleaning apparatus for a power driven buffing pad includes a wash plate mounted in a cleaning solution reservoir that provides agitating and cleaning contact with the pad mounted on an operating driver. The wash plate can be reciprocated vertically by the operator against a biasing arrangement to operate a pump to deliver cleaning solution from the reservoir to the face of the pad in contact with the wash plate.

Abstract: A nozzle for discharging droplets of a processing liquid for processing a substrate has a main body including a supply port, a drain port, a processing liquid flow passageway connecting the supply port and the drain port, and a plurality of discharge ports from which the processing liquid is discharged. The processing liquid flow passageway includes a plurality of branch flow channels, which branch out between the supply port and the drain port and collect together between the supply port and the drain port. The plurality of discharge ports form a plurality of columns respectively corresponding to the plurality of branch flow channels; and are aligned along and connected to the corresponding branch flow channels. A piezo element applies vibration to the processing liquid flowing through the plurality of branch flow channels.

Abstract: Methods, systems and apparatus for cleaning phonograph records are disclosed. In some embodiments, a phonograph record can be cleaned in a liquid basin using ultrasonic transducers, wherein the liquid basin has a dampening structure. Also, the ultrasonic transducers are disposed on a flexible wall for reducing vibrations of the cleaner.

Abstract: Vacuum concentrator, comprising a vacuum chamber with a closure which may be sealed in an airtight manner, a centrifuge rotor arranged in the vacuum chamber with at least one receiver for at least one vessel for samples to be dried, a drive motor arranged outside the vacuum chamber for driving the centrifuge rotor, a vacuum pump connected to the vacuum chamber, a tempering device associated with the vacuum chamber for tempering the at least one sample in the vacuum chamber, a pressure sensor associated with the vacuum chamber for detecting the pressure inside the vacuum chamber and an electrical control and evaluating device which is connected to the drive motor, the vacuum pump, the tempering device and the pressure sensor, for detecting the end point of the vacuum concentration by means of the pressures detected by the pressure sensor in the vacuum chamber and terminating the vacuum concentration when the end point is determined.

Abstract: An embodiment of the present invention provides a water wash system that may mix a cleaning fluid with at least one chemical agent to form a cleaning solution. The cleaning solution may reduce the corrosives on components of a compressor. The cleaning solution may be an mildly acidic solution to reduce corrosion of a caustic nature. Alternatively, the cleaning solution may be a mildly basic solution to reduce corrosion of an acidic nature.

Abstract: An embodiment of the present invention provides a water wash system that may mix a cleaning fluid with at least one chemical agent to form a cleaning solution. The cleaning solution may reduce the corrosives on components of a compressor. The cleaning solution may be a mildly acidic solution to reduce corrosion of a caustic nature. Alternatively, the cleaning solution may be a mildly basic solution to reduce corrosion of an acidic nature.

Abstract: The technology of washing and treatment MWU (modular washing unit) is conceived to wash and treat fruits and vegetables in a confined environment, with progressively more and more clean water (counter-current) and with an optimal ratio between the quantities of water used and processed products. The system allows important savings of water, chemicals and energy. The technology of washing and treatment MWU (modular washing unit) is conceived to allow the transport and the treatment of the product in confined environment, with clean water (counter-current) In the MWU the product is submitted to sequence of filling and emptying with appropriated solutions, progressively cleaner, prior to subsequent discretionary treatments. A treatment plant can be equipped with a variable number of MWUs, with additional remote MWUs to meet the desired production capacity.

Abstract: A dishwasher (100) for pot washing, comprising a detector (160) for automatically detecting what type of washing basket (140) has been placed in the dishwasher (100). This enables automatic selection of water pressure and granule control, such that more sensitive crockery and plates are not damaged. The detector can be an inductive sensor (160) that detects an indicating member (141) of the washing basket. The washing basket can comprise one or several indicating members, for enabling a more reliable detection. A method of operating such a dishwasher (100) comprises the steps of automatically detecting what type of washing basket (140) is placed in the dishwasher, and then controlling the water pressure and granule addition according to what washing basket was detected. A system comprises an above dishwasher and an above washing basket.

Abstract: A multi-function parts washer for removing contaminants from parts either by hand or automatically using an aqueous cleaning fluid includes a base cabinet having sides, a floor and an open top defining a compartment. A parts receptacle is mounted in the compartment for receiving parts to be washed. The receptacle is mounted for reciprocating, vertical movement in the compartment. An agitator assembly includes one or more compressed gas bladders mounted to the parts receptacle. The bladder has an inlet for introducing compressed gas into the bladder and an outlet for discharge of the compressed gas from the bladder. As compressed gas is introduced into the bladder, the bladder inflates and the parts receptacle is raised, and as compressed gas is discharged from the bladder, the parts receptacle is lowered to provide an agitating motion of the parts receptacle and the parts thereon in the cleaning fluid. The agitator can include a hydraulic cylinder to effect movement of the parts receptacle.

Abstract: An embodiment of the present inventions provides a method for preconditioning a semiconductor fabrication component using a plasma etching process and an optional enhanced ultrasonic and/or megasonic preconditioning step in order to eliminate the need for a burn-in period typically associated with said components, as well as extend the useful life of the component during its wear-out phase.

Abstract: A root crop washer has a rotatable washing drum which is partially immersed in a water trough, and a stone separator mounted before an inlet of the drum. A loading hopper is provided for delivering a root crop to the stone separator. An elevator is mounted at an outlet of the washing drum for discharge of cleaned produce from an outlet of the washing drum. Rotating paddles within the stone separator impart a swirling motion about a vertical axis to water in the stone separator. The root crop is supported by the water and moved around an inner sidewall of the stone separator between an inlet and an outlet of the stone separator. At the same time unwanted heavier material such as stones and clay falls downwardly through the stone separator for discharge through a waste outlet at a bottom of the stone separator.

Abstract: A sonication cleaning system is provided. The sonication cleaning system includes a cleaning tank configured to contain a liquid and a flow control system configured to cause a gradient cross flow of the liquid through the cleaning tank. The system further includes a sonication generator configured to agitate the liquid in the cleaning tank and a controller configured to vary a power applied to the sonication generator to agitate the liquid in the cleaning tank based on an oscillation position of a workpiece within the cleaning tank.

Abstract: A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.

Abstract: In the case of a device and a method for cleaning substrates on a carrier, to the underside of which the substrates are fastened so as to be parallel to and slightly apart from one another, the carrier has in its interior a plurality of longitudinal channels, which run parallel to one another. As a result of the sawing of the wafers, they merge, via openings, into interstices between the substrates. As a result of a relative movement, an elongate tube, from which cleaning fluid is let out, is introduced into one of the longitudinal channels, the relative movement being achieved substantially through moving of the carrier.

Abstract: A substrate cleaning apparatus includes a transport section that transports a substrate in a predetermined direction, and an ultrasonic oscillation section that can clean the front surface side of the substrate by applying ultrasonic waves to the back surface of the substrate which is transported in the predetermined direction by the transport section. The ultrasonic oscillation section includes a liquid supply section that brings liquid into contact with the back surface of the substrate by surface tension, and a vibrator that applies ultrasonic vibrations to the liquid.

Abstract: A megasonic cleaning method and a megasonic cleaning apparatus are provided. Microcavitation bubbles may be formed by applying an electromotive force to a cleaning solution using a megasonic energy in a separate room from an object to be cleaned. The microcavitation bubbles having a stable oscillation among the formed microcavitation bubbles may be moved to the object to be cleaned. A surface of the object to be cleaned may be cleaned using the microcavitation bubbles having the stable oscillation. Particles attached onto the surface of the object to be cleaned may be effectively removed while preventing pattern damage.

Abstract: A system for fluid processing one or more substrate surfaces arrayed in a fluid. The system has a process module with a frame and a plurality of agitation members to fluid process the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly has a holder frame and a number of substrate holders, each of which is coupled to the holder frame and configured to hold a substrate so that a different substrate is held by each substrate holder of the substrate holder assembly for transport therewith as a unit to and from the process module. The substrate holder assembly and each substrate holder of the substrate holder assembly are removably coupled to the process module frame and, when coupled to the process module frame, each substrate holder is independently moveable and positionable relative to the other substrate holders of the substrate holder assembly.

Abstract: A stage device for use in a vacuum includes a frame-shaped movable stage having a sample mounting surface, a fixed stage surrounded by the movable stage, an air bearing to float the movable stage by supplying gas to a gap between the stages, a pressure regulator to regulate a pressure of the gas, a differential pumping portion to prevent the gas from flowing outside the gap, and a controller. The controller moves the movable stage within a predetermined range under a pressure in the differential pumping portion set equal to that for movable stage in use when setting a floating height of the movable stage lower than that for movable stage in use, and under the pressure in the differential pumping portion set higher than that for movable stage in use when setting the floating height of the movable stage equal to that for movable stage in use.

Abstract: A liquid processing apparatus includes: a hollow holding plate configured to hold an object to be processed; a hollow outer rotational shaft fixedly connected to the holding plate; a rotary drive part configured to rotate the outer rotational shaft; and a lift pin plate disposed in a hollow space of the holding plate, and having a lift pin configured to support the object to be processed. Inside the lift pin plate, a cleaning-liquid supply part configured to supply a cleaning liquid is extended. Connected to the lift pin plate is a lifting member configured to locate the lift pin plate on an upper position and a lower position. When located on the lower position, the lift pin plate receives a force of the rotary drive part for rotating the outer rotational shaft so that the lift pin plate is rotated.

Abstract: An exposure apparatus exposes a substrate with an exposure light through an exposure liquid. The exposure apparatus includes an optical element from which the exposure light exits; a stage which is movable on the light-exit side of the optical element; a certain member which is provided on the stage; and a vibration generator which vibrates the certain member to apply vibration to the liquid in the liquid immersion space formed on the certain member. It is possible to suppress the deterioration of the performance which would be otherwise caused by any contamination.

Abstract: A mask cleaning apparatus comprises: a bath containing a cleaning liquid; an ultrasonic wave generation unit for generating and applying ultrasonic waves to the cleaning liquid; a supporting member for supporting the mask; and a driving unit formed to rotate the mask in the bath. As a result, the mask cleaning apparatus achieves an improved mask cleaning capability.

Abstract: Disclosed is a liquid treatment apparatus capable of effectively exhausting processing liquid atmosphere around a target object. The liquid treatment apparatus includes a container, a support part located within the container that supports the target object, a rotation driving mechanism to rotate the target object supported by the support part, a processing liquid supply mechanism to supply a processing liquid to the target object, and a rotation cup, which is located outside of the outer circumference of the target object and is rotatable together with the support part. A rotation exhaust cup is arranged above the rotation cup and is rotatable together with the rotation cup. A discharge mechanism discharges processing liquid atmosphere guided by the rotation cup and the rotation exhaust cup.

Abstract: A dish washing machine having a basket height adjusting apparatus. The dish washing machine includes a machine body having a washing tub defined therein, a basket disposed in the washing tub to receive dishes to be washed, and a basket height adjusting apparatus. The basket height adjusting apparatus includes a support bracket mounted at each side of the basket such that the support bracket can be moved vertically, rollers mounted to the support bracket to slide the basket forward and backward, and an adjusting lever mounted at the basket to adjust a vertical movement of the support bracket and to thereby adjust the height of the basket. The adjusting lever is moved along with the basket. Consequently, in the present invention, the thumb of a user is not caught in the basket and injured when the user rotates the adjusting lever.

Abstract: Megasonic cleaning systems and methods of using megasonic pressure waves to impart cavitation energy proximate a surface of a microelectronic substrate are disclosed herein. In one embodiment, a megasonic cleaning system includes a process tank for containing a liquid, a support element for carrying a substrate submerged in the liquid, and first and second transducers positioned in the tank. The first transducer is further positioned and/or operated to initiate cavitation events in a bulk portion of the liquid proximate a surface of the substrate. The second transducer is further positioned and/or operated to control an interface of fluid friction between the substrate and the bulk portion of the liquid.

Abstract: An improved portable cleaning system for use in cleaning heat exchanger tube bundles, fin-fans, towers and other elongated components. The cleaning system comprises a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: In order to produce a cleaning device which cleans in a particularly effective manner wherein the cleaning device comprises a cleaning chamber for accommodating a workpiece requiring cleaning and a fluid transfer device for transferring at least one fluid into the cleaning chamber and/or out of the cleaning chamber and wherein the fluid transfer device comprises at least one nozzle in the form of a slotted nozzle extending along a slot axis and said fluid is arranged to be fed into the cleaning chamber or fed out of the cleaning chamber by means of said fluid transfer device in a direction transverse to the slot axis, it is proposed that the cleaning device comprise a slotted nozzle moving device for moving at least a part of the slotted nozzle.

Abstract: A method and apparatus for cleaning printed circuit boards are provided. The method includes providing a cleaning apparatus with a housing having a conveyance mechanism for carrying printed circuit boards through the housing. The cleaning apparatus has at least a prewash station, a wash station and a final rinse station therein. The printed circuit boards are carried on the conveyance mechanism to the prewash station. A plurality of fluidic oscillator nozzles of the prewash station are utilized to direct liquid onto the printed circuit boards. Each fluidic oscillator nozzle outputs a stream of liquid with an instantaneous direction that oscillates back and forth relative to a nozzle axis over time.

Abstract: A pad washing system is provided. This system includes a filter device that further includes: a filter component having a textured top surface and at least one baffle formed on the underside thereof; a filter support apparatus adapted to receive the filter device, wherein the filter support apparatus further includes: a base, a plurality of vertical support columns formed integrally with the base, a plurality of caps mounted on top of the vertical columns, and a plurality of biasing members disposed between the caps and the tops of the vertical columns; a bucket for receiving both the filter device and the filter support apparatus; a threaded rim attached to or formed integrally with the top edge the bucket; and a splash guard mountable within the threaded rim.

Abstract: In a substrate cleaning method and a substrate cleaning method according to the present invention, a brush 3 is brought into contact with a substrate W while rotating the same, and a cleaning position Sb of the brush 3 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. A process fluid formed of liquid droplets and a gas is sprayed by a two-fluid nozzle 5 onto the substrate W, and a cleaning position Sn of the two-fluid nozzle 5 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. During the movement of the cleaning position Sb of the brush 3 from the center part of the substrate W toward the peripheral part thereof, the cleaning position Sb of the two-fluid nozzle is positioned nearer to a center P0 than the cleaning position Sb of the brush 3. Since contaminations of the brush are prevented from adhering again to the wafer, it can be avoided that the wafer W is contaminated.

Abstract: A post-processing system is provided for cleaning and/or curing a part produced by solid freeform fabrication (SFF). The post-processing systems include a housing, a part retaining device to retain the part within the housing, and an actinic radiation source to cure the part with actinic radiation. The systems also include a fluid circulation device adapted to expose the part to cleaning fluid and/or to allow the cleaning fluid to absorb actinic radiation to permit filtration of removed build material to allow extended use of the cleaning fluid. Certain systems include a first rotating portion that can rotate the retained part about a first axis, and further systems include a second rotating portion that can rotate the retained part about a second axis. The systems also include additional features to provide safe and efficient cleaning and/or curing of parts produced by SFF.

Abstract: A cleaning method highly effectively cleans a surface of a semiconductor wafer by removing a dissolution product, produced when a surface of a semiconductor wafer is processed by a developing process that develops an exposed film formed on the semiconductor wafer by wetting the exposed film with a developer, from the surface of the semiconductor wafer. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto a central part of a rotating wafer processed by a developing process to spread the cleaning liquid in a film over the surface of the wafer. Then, the cleaning liquid pouring nozzle is shifted to create a dry area in a central part of the wafer and the wafer is rotated at 1500 rpm to expand the dry area.

Abstract: A particle purge system purges particles from an electronic device. The electronic device is inverted and secured to an interface plate included with the system. A clean purge fluid is injected into an inlet of the interface plate to release and remove particles in the electronic device. The particle purge system agitates the electronic device to enhance the release of particles from components in the electronic device into the purge fluid. At least a portion of the purge fluid that contains the released particles is exhausted through an outlet in the interface plate.

Abstract: Megasonic cleaning systems and methods of using megasonic pressure waves to impart cavitation energy proximate a surface of a microelectronic substrate are disclosed herein. In one embodiment, a megasonic cleaning system includes a process tank for containing a liquid, a support element for carrying a substrate submerged in the liquid, and first and second transducers positioned in the tank. The first transducer is further positioned and/or operated to initiate cavitation events in a bulk portion of the liquid proximate a surface of the substrate. The second transducer is further positioned and/or operated to control an interface of fluid friction between the substrate and the bulk portion of the liquid.

Abstract: Particles adhering to the surface of a substrate are removed by physical action of injection of droplets or megasonic vibrations or by combination of the physical action and slight etching on the surface of the substrate. On the other hand, metal contaminants adhering to the surface of the substrate are altered to hydroxides with an alkaline solution and thereafter dissolved with an acid solution to be removed. Thus, it is possible to rapidly process the substrate while minimizing the quantity of etching on the surface of the substrate.

Abstract: An ultrasonic cleaning apparatus which performs ultrasonic cleaning of a contamination attached to a surface of an object to be cleaned, by using a cleaning liquid to which ultrasonic waves are applied has a cleaning bath pooling the cleaning liquid, a support base on which the object to be cleaned is supported in the cleaning liquid, ultrasonic wave generation device for alternately focusing first ultrasonic waves having a frequency of 1 to 10 MHz and second ultrasonic waves having a frequency equal to or lower than ½ of that of the first ultrasonic waves toward the object to be cleaned, a focus position adjustment device of adjusting the distance between a focus position for the focus and the surface of the object to be cleaned, and moving device of moving at least any one of the ultrasonic wave generation device and the support base so that the effect on the surface of the object to be cleaned of the ultrasonic waves generated by the ultrasonic wave generation device is uniform.

Abstract: The invention relates to the continuous cleaning of objects, in particular of semiconductor elements, using ultrasound, wherein the objects to be cleaned are arranged within a liquid. Furthermore, the present invention relates to an apparatus for carrying out the method according to the invention. A basic idea of the invention is that the surface of an object to be cleaned (2) in a tank (5) filled with liquid passes through at least one oscillation maximum that is emitted by at least one sound source (8a) being present in the tank (5). According to one embodiment, the sound source fields (8) that are positioned within the tank (5) are arranged inclined with respect to the transport direction (4).

Abstract: An aqueous washing system and method of operation for washing of articles such as engineering components, including curing of resin impregnated porous metal components, comprising placing the articles into a process chamber (10) and supplying from a supply tank (11) an aqueous washing fluid at a temperature at or above 100° C. A head of pressure is established above the fluid in tank (11) whereby the fluid may be transferred by a pump (P1) to the process chamber (10). After a washing cycle the articles are rinsed by clean water and then vacuum dried before removal from the process chamber (10).

Abstract: Ultrasonic probe comprising an elongate body having a first end and a second end, an ultrasonic transducer attached to the probe at or adjacent the first end, and an enlarged support section intermediate the ultrasonic transducer and the second end, wherein the enlarged support section has an equivalent diameter greater than an equivalent diameter of the body at any location between the enlarged support section and the ultrasonic transducer. The probe may be used to introduce ultrasonic energy into ultrasonic cleaning systems.

Abstract: Embodiments of the present invention relate to semiconductor device manufacturing, and more particularly to a horizontal megasonic module for cleaning substrates. In one embodiment an apparatus for cleaning a substrate is provided. The apparatus comprises a tank adapted to contain a cleaning fluid, a movable housing having a first side adapted to be placed in the cleaning fluid, a plurality of rotatable rollers coupled to the first side of the housing, the rollers positioned and including grooves to securely hold the substrate in a horizontal orientation, and one or more transducers adapted to direct vibrational energy through the cleaning fluid in the tank toward the substrate, wherein at least one of the transducers directs vibrational energy toward the substrate and substantially parallel to a major surface of the substrate.

Abstract: A substrate processing apparatus for processing a substrate With a processing fluid is provided. The apparatus includes holding members 60 for holding the substrate W, a chuck member 61 for supporting the holding members 60 and a top-face member 62 approaching the substrate W to cover its surface. In arrangement, since the top-face member 62 is supported by the chuck member 61, the holding members 60 can rotate together with the top-face member 62 in one body. With this structure, it is possible to reduce the influence of particles on the substrate W and also possible to provided a low-cost substrate processing apparatus occupied as little installation space as possible.