Abstract: An industrial parts washer includes a stand adapted to support a part, a chamber selectively movable from a first position clear of the part to a second position engaging the stand where the chamber forms a closed volume encapsulating the part. A nozzle is positioned within the chamber to supply pressurized fluid for cleaning the part. The industrial parts washer may include a washing station positioned adjacent a drying station where each of the washing and drying stations include chambers selectively movable to enclose the part.

Abstract: A washing machine includes a tub disposed inside a cabinet, for storing water; a drum rotatably disposed inside the tub, for washing laundry; and a steam generating apparatus disposed at the cabinet, for generating steam supplied to the inside of the drum, by using high-frequency induction heating. Accordingly, by generating steam using high-frequency induction heating, a structure of the steam generating apparatus can be simplified, and performance of generating steam can be improved.

Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

Abstract: A dish washing machine having a basket height adjusting apparatus. The dish washing machine includes a machine body having a washing tub defined therein, a basket disposed in the washing tub to receive dishes to be washed, and a basket height adjusting apparatus. The basket height adjusting apparatus includes a support bracket mounted at each side of the basket such that the support bracket can be moved vertically, rollers mounted to the support bracket to slide the basket forward and backward, and an adjusting lever mounted at the basket to adjust a vertical movement of the support bracket and to thereby adjust the height of the basket. The adjusting lever is moved along with the basket. Consequently, in the present invention, the thumb of a user is not caught in the basket and injured when the user rotates the adjusting lever.

Abstract: Provided is an apparatus for cleaning and drying a substrate by applying a plurality of chemicals and gases to the substrate. The apparatus may include: a substrate support member including a chuck receiving a substrate; a first nozzle member injecting a drying fluid onto a top surface of the substrate for drying the substrate; a low cover including an opened top and enclosing the chuck; and an upper cover selectively closing the opened top of the low cover so as to dry the substrate in a closed space. Therefore, the apparatus dries a substrate more efficiently and protects the substrate from being contaminated by foreign pollutants. Furthermore, generation of an undesired oxidation layer on the substrate can be prevented.

Abstract: A system and method for cleaning a substrate, such as a semiconductor wafer, utilizes a rotatable wafer supporting assembly with a cylindrical body to provide stability for the substrate being cleaned, even at high rotational speeds. The rotatable wafer supporting assembly may include wafer holding mechanisms with pivotable confining members that are configured to hold the substrate using centrifugal force when the wafer supporting assembly is rotated. In an embodiment, the cleaning system may include a positioning system operatively connected to an acoustic transducer to provide meaningful control of the acoustic energy applied to a surface of the substrate by selectively changing the distance between the acoustic transducer and the substrate surface so that the substrate can be cleaned more effectively.

Abstract: A centrifugal spray processor for processing semiconductor wafers uses larger numbers of spray nozzles. Each spray nozzle delivers a reduced volume of liquid, to reduce consumption of liquid process chemicals. The nozzles operate at a higher back pressure. The increased number of nozzles, offset nozzle patterns and groupings of nozzles, lower nozzle flow rates, and higher nozzle back pressures, provide improved processing results. The improved spray system may be provided as a retrofit kit.

Abstract: An ultrasonic cleaner apparatus is disclosed which includes a support housing, a tub supported by the housing and an ultrasound and sensor transducer contacting the bottom of the cleaning tank. A fixture assembly for holding items to be cleaned is configured for insertion into the cleaning tank. The fixture assembly comprises a predetermined number of slots, which are positioned around the perimeter of a pair of end disks disposed on the fixture assembly. The slots are configured to receive the distal ends of slats or other items to be cleaned. Rotation of the fixture assembly in the cleaning solution and ultrasonic energy effectively cleans the items while the fixture assembly securely holds the items during cleaning, rinsing and drying.

Abstract: A transducer for use in an acoustic energy cleaner is provided. The transducer includes a resonator and a plurality of crystals bonded to a surface of the resonator. The plurality of crystals is configured to be bonded to the surface of the resonator in a staggered arrangement with respect to each other. In one embodiment, the plurality of crystals is bonded to the surface of the resonator in a horizontally staggered arrangement. In another embodiment, the plurality of crystals is bonded to the surface of the resonator in a vertically staggered arrangement.

Abstract: An apparatus that includes a rotatable single wafer holding bracket with one or more wafer supports disposed on the single wafer holding bracket, wherein the one or more wafer supports position a center of a wafer to be off-center from an axis of rotation of the single wafer holding bracket.

Abstract: The present invention provides a system (200, 300) for remediating aberrations along the perimeter of a semiconductor wafer (202). The system includes a cleaning apparatus (204) within which the wafer is spun within a confined area. A chuck (208) defines the confined area, having a sidewall that extends above the upper surface (214) of the wafer and surrounds the perimeter of the wafer. The chuck also has a bottom wall, with an aperture formed therein, beneath the wafer. The system includes an isolation barrier (220), disposed atop the bottom wall of the chuck and around the aperture, in proximity to the lower surface so of the wafer. This forms a narrow gap (226) between the barrier and the wafer. A pressurized source forcefully directs a gas (218) at and along the lower surface of the wafer. The system also includes a remediation solution (228) that is applied to the upper surface of the wafer.

Abstract: An apparatus for washing parts includes a cleaning chamber including a spray portion and a reservoir portion. The spray portion includes a support for the parts and a spray bar having at least one orifice for distributing a cleaning solution. The reservoir portion stores and collects the cleaning fluid. A thermal energy source adjusts and maintains the operating temperature of the cleaning solution in the reservoir portion. The thermal energy source retains a transfer fluid and includes a heater for adjusting a temperature of the transfer fluid. A conduit extends through the thermal energy source and defines a passageway for the cleaning fluid. A pump draws the cleaning fluid through the passageway and discharges the cleaning solution through the spray bar, such that the operating temperature of the cleaning solution is increased.

Abstract: In accordance with one embodiment there is provided a method of improving the performance of a substrate cleaner of the type having a megasonic probe with a probe shaft extending generally parallel to a surface of a rotating substrate, and at least one dispenser for applying a cleaning liquid onto the surface of the substrate, wherein the megasonic probe agitates the liquid on the surface. The method comprising dissolving gas in the liquid before the liquid reaches the dispenser. In accordance with another embodiment, an apparatus for cleaning substrates comprises a rotary fixture which is adapted to support a substrate and rotate the substrate about a first axis, a probe having a probe shaft extending generally parallel to a surface of the substrate, and a megasonic transducer in acoustically coupled relation to the probe.

Abstract: A system for cleaning a semiconductor substrate is provided. The system includes transducers for generating acoustic energy oriented in a substantially perpendicular direction to a surface of a semiconductor substrate and an acoustic energy oriented in a substantially parallel direction to the surface of the semiconductor substrate. Each orientation of the acoustic energy may be simultaneously or alternately generated.

Abstract: Apparatus for pressure processing components is disclosed which includes an improved closure system that minimizes dust-generating parts and allows easy access to the chamber. Ports are provided for introducing and releasing pressurized gases and fluids to and from the processing space. The heating system of the apparatus heats both the cover and the stage inside the pressurized chamber such that cycle time to equilibrate heated, pressurized fluids such as supercritical carbon dioxide inside the chamber are decreased. The apparatus includes a mechanism that raises the stage inside the chamber, pressing it against the fixed cover and sealing the inside of the pressure vessel. In one embodiment a screw-type jack is used to move the component-loaded stage fitted with a deformable o-ring seal a short travel distance to seat against the lid and seal the pressure chamber. In a related embodiment a computer and an electronic stepper motor are used to drive the pressing means in an automated fashion.

Abstract: A substrate treatment apparatus comprises a treatment vessel, a substrate holder for rotating the substrate in a horizontal plane in the treatment vessel, a nozzle unit arranged in an upper part of the treatment vessel such that a liquid is downwardly fed, a feed line for feeding the liquid to the nozzle unit, and a chamber enclosing therein the apparatus in its entirety. The nozzle unit is constructed in a form of a bar such that as viewed in plan, the liquid ejected from the nozzle unit reaches the substrate with an area range having a length not smaller than a diameter of the substrate and a width smaller than the diameter of the substrate.

Abstract: A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the cleaning liquid from moving into a center portion of the semiconductor substrate. The cleaning liquid supplied to the edge section flows from the edge section towards a side section of the semiconductor substrate due to the rotation of the semiconductor substrate. An ultrasonic wave generator is provided above the edge section for generating ultrasonic waves. The ultrasonic waves are applied to the cleaning liquid supplied onto the edge and bottom sections, thereby improving the cleaning efficiency. The cleaning apparatus has a guide to guide the cleaning liquid supplied to the edge section toward the side section.

Abstract: A cleaning apparatus is provided with a processing bath to be filled with a cleaning chemical, an ultrasonic oscillator, and a retainer for holding a substrate to be immersed into a cleaning chemical. The front surface of the substrate is cleaned while ultrasonic waves are radiated from the ultrasonic oscillator onto the back surface of the substrate.

Abstract: An apparatus for preparing a wafer is provided. The apparatus includes a wafer backside plate and a central shaft. The wafer backside plate has a top surface that includes a cylindrical edge lip, which defines a central aperture. The central shaft is designed to fit within the central aperture. The wafer backside plate is designed to automatically slide between an up position during rotational wager processing and a down position when the wafer is not in rotational wafer processing. A gap defined between the top surface of the wafer backside plate and the wafer is less when the wafer backside plate is in the up position than when the wafer backside plate is in the down position.

Abstract: A system and method for cleaning a substrate, such as a semiconductor wafer, utilizes a rotatable wafer supporting assembly with a cylindrical body to provide stability for the substrate being cleaned, even at high rotational speeds. The rotatable wafer supporting assembly may include wafer holding mechanisms with pivotable confining members that are configured to hold the substrate using centrifugal force when the wafer supporting assembly is rotated. In an embodiment, the cleaning system may include a positioning system operatively connected to an acoustic transducer to provide meaningful control of the acoustic energy applied to a surface of the substrate by selectively changing the distance between the acoustic transducer and the substrate surface so that the substrate can be cleaned more effectively.

Abstract: Disclosed is a dishwasher, by which installation height of a rack is adjusted inside a washing chamber and in which the installation height is automatically adjusted by a button. The present invention includes a washing chamber having tableware washed therein, a rack movably installed in the washing chamber to hold the tableware thereon, a plurality of guide rollers fixed to both confronting sidewalls of the washing chamber, a guide rail provided between the first and second rollers to slide back and forth, and a height adjustment means for moving the rack upward and downward, the height adjust means provided to slide on the guide rail.

Abstract: A method for cleaning a semiconductor substrate is provided. The method initiates with introducing a liquid onto the top surface of the semiconductor substrate. Then, a bottom surface of a resonator is coupled to a top surface of a semiconductor substrate through the liquid. Next, sonic energy is transmitted through the resonator to the liquid. Then, the liquid is heated through the bottom surface of the resonator. A method for applying localized heating to a cleaning chemistry during a cleaning operation of a semiconductor substrate is also provided. The method initiates with positioning a resonator to contact a surface of a cleaning chemistry applied to a semiconductor substrate. Then, heat energy is simultaneously applied with the sonic energy through the resonator to clean the semiconductor substrate. A device for cleaning a semiconductor substrate and system for cleaning a semiconductor substrate are also provided.

Abstract: A method and apparatus is provided that may protect a fragile component (such as a quartz plate) positioned within a megasonic tank from impact by falling objects. The megasonic tank may include a barrier (such as one or more extended rollers, quartz bars, or a net) that is configured to protect the fragile component.

Abstract: The present invention provides a small, quiet sonic cleaner which can be used to clean jewelry and other small objects. The cleaner includes a tank which is rigidly connected to a vibration generator such as an eccentrically loaded motor, and which is flexibly coupled to a base upon which the cleaner sits. The coupling of the tank to the base is preferably through progressive motion attenuators such as springs, which provide superior vibration isolation for the tank.

Abstract: The present ball/roller bearing cleaning method is a method which, using cleaning liquid 24, cleans a bearing to be cleaned 1 composed of an inner ring 1b, an outer ring 1a, a rolling bodies 1c and a retainer. In the cleaning method, the cleaning liquid 24 is made to flow through the bearing to be cleaned 1 from the axial direction of the present bearing 1 into spaces in which the raceway surfaces of the inner and outer rings 1b and 1a of the bearing to be cleaned 1 surround the rolling bodies 1c and retainer. For example, a cylindrical-shaped rotary die 2 having spiral grooves 2a is interposed into a cleaning liquid supply passage, and the cleaning liquid 4 is supplied to thereby rotate the cylindrical-shaped rotary die 2, whereby the cleaning liquid having high pressure can be supplied to the bearing to be cleaned 1 from the cylindrical-shaped rotary die 2.

Abstract: Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe.

Abstract: In accordance with one embodiment there is provided a method of improving the performance of a substrate cleaner of the type having a megasonic probe with a probe shaft extending generally parallel to a surface of a rotating substrate, and at least one dispenser for applying a cleaning liquid onto the surface of the substrate, wherein the megasonic probe agitates the liquid on the surface. The method comprising dissolving gas in the liquid before the liquid reaches the dispenser. In accordance with another embodiment, an apparatus for cleaning substrates comprises a rotary fixture which is adapted to support a substrate and rotate the substrate about a first axis, a probe having a probe shaft extending generally parallel to a surface of the substrate, and a megasonic transducer in acoustically coupled relation to the probe.

Abstract: Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe.

Abstract: An apparatus and a method for removing coating layers from the top of alignment marks on a wafer are described. The apparatus includes a cleaning chamber that is a cavity and a lid member suspended in the cavity, a wafer chuck that is rotatably mounted in the lid member for holding a wafer in an upside down position such that the alignment marks are facing downwardly, and at least two solvent dispensing arms mounted in an outer peripheral area of the lid member that are immediately adjacent to the chuck for dispensing a flow of solvent upwardly toward the active surface of the wafer when the wafer is held in a stationary position, each of the at least two solvent dispensing arms are positioned corresponding to a position of one of the alignment marks.

Abstract: Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.

Abstract: The present invention provides a method for avoiding particulate contamination of a semiconductor wafer in a stripping bath and a stripping system for implementing the method. The method includes providing at least one semiconductor wafer vertically oriented in a wafer containing fixture; providing a solution bath for removing particulate material from a semiconductor wafer surface; immersing the wafer containing fixture in the solution bath positioned over a movable member having a contact surface such that upon moving the movable member in a vertical direction the contact surface contacts a portion of the edge of the at least one semiconductor; and moving the movable member such that the at least one semiconductor wafer is projected upward from a resting position in the wafer containing fixture.

Abstract: A second housing whose center portion is depressed and whose end portion around the center portion is formed like a visor is arranged around a first housing whose center portion is depressed and whose end portion around the center portion is formed like a visor, and a hollow portion is formed between the first housing and the second housing by sandwiching a packing between the end portions of the housings. Further, degassed water for preventing empty heating is filled in the hollow portion, and an ultrasonic transducer is placed on the surface of the center portion of the first housing. A weight for preventing the vibration of the wall is provided on the wall surface of the second housing. Since the vibration of the wall of the housing is suppressed by the weight, vibration energy returns toward the bottom surface of the center of the housing through water and is radiated from the bottom surface efficiently as ultrasonic waves.

Abstract: Embodiments of the invention include a megasonic energy cleaning apparatus that has the ability to rotate the wafer to be cleaned, as well as rotate the cleaning probe during the cleaning process. Rotating the cleaning probe while the wafer is being cleaned is effective to increase the cleaning action of the apparatus while also minimizing damage to the wafer. Curved grooves, such as a spiral groove, can be etched into the cleaning probe to minimize forming harmful waves that could potentially cause damage to the wafer surface or to structures already made on the surface. Using a cleaning probe having a curved groove while also rotating the cleaning probe effectively cleans particles from a wafer while also limiting damage to the surface of the wafer.

Abstract: A megasonic cleaning apparatus is provided for removing contamination particles on a wafer. The megasonic cleaning apparatus includes a piezoelectric transducer and an energy transfer rod. The piezoelectric transducer is for generating megasonic energy. The energy transfer rod installed over the wafer along a radial direction of the wafer is for distributing the megasonic energy to cleaning solution over the wafer and for vibrating the cleaning solution. The energy transfer rod is shaped and sized to uniformly distribute energy in the radial direction of the wafer through the cleaning solution to remove the contamination particles from the wafer.

Abstract: Apparatuses and methods of processing a substrate. The apparatus includes a wet-cleaning chamber, a drying chamber, and a substrate transferring chamber which transfers a substrate to and from the wet-cleaning chamber and the drying chamber. The drying chamber is one of a supercritical drying chamber or a low pressure drying chamber. The wet-cleaning chamber is one of a single-wafer cleaning chamber, a horizontal spinning chamber, a megasonic wet-cleaning chamber, or a horizontal spinning chamber having acoustic waves transmitted to the substrate.

Abstract: A pressure chamber assembly for processing a substrate includes a pressure vessel defining an enclosed pressure chamber. A substrate holder is disposed in the pressure chamber and is adapted to hold the substrate. A drive assembly is operable to move the substrate holder. The drive assembly includes a first drive member connected to the substrate holder for movement therewith relative to the pressure vessel and a second drive member fluidly isolated from the first drive member and the pressure chamber. A drive unit is operable to move the second drive member. The drive unit is fluidly isolated from the first drive member and the pressure chamber. The second drive member is non-mechanically coupled to the first drive member such that the drive unit can move the substrate holder via the first and second drive members.

Abstract: The invention provides an apparatus and method for cleaning or etching wafers. The invention further provides a megasonic transducer designed to apply mechanical vibrations to a layer of fluid in contact with a wafer. The electromechanical transducer is housed in a quartz or sapphire lens which is chemically compatible with the layer of fluid, and sealed to protect the housing interior from fluids and chemical fumes. An electrical power source produces a signal that is sent to the transducer to generate a megasonic wave. The wave travels between the lens and the wafer, through the layer of fluid, dislodging small particles from the wafer which are then removed in the fluid stream. In one embodiment of the present invention, a wafer to be cleaned is placed on a rotatable support below a transducer assembly. A fluid is introduced through the transducer assembly to provide a layer of fluid between the lens and wafer.

Abstract: The present invention provides an apparatus for etching a substrate, comprising: a container; a substrate support disposed in the container; a rotation actuator attached to the substrate support; and a fluid delivery assembly disposed in the container to deliver an etchant to a peripheral portion of a substrate disposed on the substrate support. Preferably, the substrate support comprises a vacuum chuck and the fluid delivery assembly comprises one or more nozzles. The invention also provide a method for etching a substrate, comprising: rotating a substrate positioned on a rotatable substrate support; and delivering an etchant to a peripheral portion of the substrate. Preferably, the substrate is rotated at between about 100 rpm and about 1000 rpm, and the etchant is delivered in a direction that is substantially tangent to the peripheral portion of the substrate at an incident angle between about 0 degrees and about 45 degrees from a surface of substrate.

Abstract: An apparatus and method for cleaning a roller cover of the type used to apply a coating material is disclosed. In one embodiment the apparatus includes a body, at least one roller cover engaging element for positioning at least partially within the interior area of a roller cover and engaging the roller cover, and a drive adaptor associated with the body for effectuating rotation of the roller cover engaging element, and thus a roller cover connected thereto, with a drive. In one embodiment, the drive adaptor comprises a shaft connected to the body of the apparatus and extending therefrom, the shaft adapted to be rotated by a drive.

Abstract: The object of this invention is to provide a semiconductor wafer cleaning apparatus designed to clean several wafers at the same time while rotating the wafers held in a horizontal, laid-down position. In an operation of this apparatus, a wafer feeding robot arm 20 feeds wafers 60 from a wafer cassette 10 to a wafer boat 50 and seats the wafers in the wafer boat while maintaining a horizontal, laid-down position of the wafers. The wafer boat 50, with the horizontally laid-down wafers 60, is vertically moved downward by a boat drive unit 40 to be immersed in a wafer cleaning liquid flowing in a wafer cleaning bath 30. Thereafter, the boat 50 is rotated within the wafer cleaning liquid, and so the wafers 60 are washed and cleaned by the wafer cleaning liquid while being maintained in the horizontal, laid-down position and being rotated horizontally.

Abstract: A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location.

Abstract: The invention concerns a device for wet etching an edge of a semiconductor disk.

Abstract: A substrate processing system has a first substrate cleaner and a second substrate cleaner. The first substrate cleaner comprises a forward portion and a rear portion. The forward portion includes a rotatable substrate support. The rear portion is vertically thicker than the forward portion. The rear portion includes a device for rotating the support. The second substrate cleaner includes the elements included in the first substrate cleaner. The second substrate cleaner is stacked above the first substrate cleaner with the forward portions being vertically aligned and the rear portions being vertically aligned. A space is formed between the forward portions to permit access to the forward portion of the first substrate cleaner and to permit ample gas flow into the area between the forward portions of the first and the second substrate cleaners.

Abstract: An apparatus for cleaning a substrate has a process bowl that has a first circumferential zone and a second circumferential zone. That apparatus also has a support located in the process bowl that supports a substrate, and a megasonic transmitter located in the first circumferential zone. The apparatus also comprises a cleaning liquid dispenser that includes an outlet. The dispenser is mounted on the process bowl and is configured to apply liquid to a surface of the substrate through the outlet. The dispenser is positioned in the second circumferential zone. The first circumferential zone and the second circumferential zone are selected to minimize non-uniformity of the propagation of megasonic energy caused by the dispensing of cleaning liquid onto the substrate.

Abstract: There is proposed an apparatus and method for cleaning a semiconductor substrate, which make it possible to minimize the adhesion of mist in a cleaning tank at the occasion of cleaning a semiconductor substrate, to realize a-high removal effect of residual polishing particles, and to enable to obtain a clean surface. In view of preventing a mist generated by the jet of high pressure water from re-adhering to the substrate during the cleaning of a semiconductor substrate, a cover member is disposed at a mist-generating region so as-to prevent the splash of the mist. Additionally, a cavity is caused to generate by contacting a high pressure water with a still water, and high-frequency generated by the generation of the cavity is utilized for removing the residual polishing particles. Alternatively, the ejection of high pressure water against the surface of the substrate is performed in a liquid phase such-as ultrapure water, thereby preventing the generation of mist.

Abstract: An apparatus and method for cleaning of disc-shaped objects, such as semiconductor wafers, employing a rotational fluid track. The cleaning may take place in a vertical cleaning chamber or optionally a horizontal cleaning chamber. Rotation of wafers is obtained without direct contact by motorized driver rollers that may have the potential of damaging the wafer. In preferred embodiments of the invention, a viscous shearing force is tangentially directed upon the surface of a wafer as the wafer rests upon support rollers within a cleaning chamber. Pressurized cleaning solutions are directed toward the wafer surface at an angle sufficient to impart a rotational force upon the wafer. In one embodiment of the invention, as the wafer spins within the cleaning chamber, a megasonic cleaning transducer is employed to enhance the surface cleaning process.

Abstract: Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe.

Abstract: A Megasonic cleaning apparatus having at least one reflector (e.g., a parabolic or paraboloid reflector) positioned to collect otherwise wasted cleaning energy and redirect that energy to one or a plurality of positions on a wafer's edge is provided. A first embodiment comprises a complex parabolic reflector which has a width greater than that of the wafer and a preferred length approximately equal to the diameter of the wafer, and which is shaped to provide focal points which vary along the length of the parabolic reflector, such that energy striking the reflector at different points along the reflector's length is directed to a plurality of different points along the wafer's edge.

Abstract: A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. The wafer cleaner preferably includes a wafer rotating mechanism, a steam inlet for applying steam to the active surface of the wafer as it is rotated and a liquid inlet for simultaneously applying a liquid to the back side surface of the wafer. A method for manufacturing an integrated circuit in accordance with the present invention includes subjecting an active surface of the wafer to a plurality of processes selected from a group including deposition, patterning, doping, planarization, ashing and etching, and steam cleaning the active surface at least once before, during, and after the plurality of processes. Preferably, an aqueous vapor phase is applied to the first surface of the wafer as an aqueous liquid phase is applied to the other surface of the wafer.

Abstract: A processor for processing microelectronic workpieces includes a process vessel adapted to hold one or more microelectronic workpieces vertically within a rotatable fixture. A drive motor is coupled to the rotatable fixture to spin the rotatable fixture during processing. A processing fluid is introduced into the process vessel for processing of the microelectronic workpieces. The rotatable fixture is raised out of the processor for loading/unloading. The processor can be used to clean, plate, etch, strip, rinse, or dry microelectronic workpieces.