Abstract: The present invention is drawn to a wire container comprising a plurality of spring-like wires having wave patterns forming a part support that minimize contact points between the container and one or more contained parts when the container is subjected to a vibration causing the wires and the parts to move, thereby eliminating any fixed contact points between the part and the supporting part support. Another aspect of the current invention is a process for removing penetrant from parts comprising: placing one or more parts with penetrant applied in a container having spring-like wire with wave patterns forming a part support; oscillating the container during a cleaning process thereby compressing and expanding one or more spring-like wires thus exposing part surfaces and removing the penetrant from the parts.

Abstract: Provided are a single type substrate treating apparatus and method. A polishing unit is disposed in a process chamber for polishing a substrate chemically and mechanically, and a cleaning unit is disposed in the same process chamber for cleaning the substrate. Therefore, according to the single substrate treating apparatus and method, a polishing process and a cleaning process can be performed on a substrate in the same process chamber by a single substrate treating method in which substrates are treated one by one.

Abstract: A cleaning method highly effectively cleans a surface of a semiconductor wafer by removing a dissolution product, produced when a surface of a semiconductor wafer is processed by a developing process that develops an exposed film formed on the semiconductor wafer by wetting the exposed film with a developer, from the surface of the semiconductor wafer. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto a central part of a rotating wafer processed by a developing process to spread the cleaning liquid in a film over the surface of the wafer. Then, the cleaning liquid pouring nozzle is shifted to create a dry area in a central part of the wafer and the wafer is rotated at 1500 rpm to expand the dry area.

Abstract: In one embodiment of the invention, an apparatus for collecting fluid within a wafer cleaning chamber is provided. The apparatus includes a rotatable annular manifold configured to support a wafer within an inner cavity defined by an inner surface of the annular manifold. The annular manifold includes a channel extending from an inner surface of the annular manifold to a floor of the annular manifold. The floor has at least one opening. The apparatus includes a catch basin having a base with at least one drain. The base has an inner sidewall and an outer sidewall extending therefrom. The catch basin is disposed under the annular manifold to capture fluid dispensed from the at least one opening of the floor of the annular manifold. A spin, rinse and dry module and a method for collecting a fluid delivered to the surface of a rotating wafer are provided.

Abstract: What is contemplated is a printing cylinder washer having a removable or portable drive assembly, or a series of portable drive assemblies of different lengths to accommodate different sizes of print rollers. The drive assemblies have a drive mechanism enabled by a dynamic flow of cleaning solution within the washer reservoir. What is also contemplated is the use of an elevation system, an agitation platform, under-immersion spray bars, an ultrasonic wave cleaning system, and a hatch or door equipped with a thermal breaker in conjunction with the hydro-driven portable drive assembly. What is also contemplated is a method of washing printing rollers within the above-described printing cylinder washer by aligning a nozzle with the drive assembly.

Abstract: A cleaning apparatus cleans a peripheral part of a substrate to be processed W. The cleaning apparatus includes a first cleaning part 11 configured to be brought into contact with a peripheral part of a front surface Wa of the substrate to be processed W and rotated in an in-plane direction of the substrate to be processed W, and a second cleaning part configured to be brought into contact with a peripheral part of a rear surface Wb of the substrate to be processed W and rotated in the in-plane direction of the substrate to be processed W. A frictional force to be applied from the second cleaning part 12 to the rear surface Wb of the substrate to be processed W is larger than a frictional force to be applied from the first cleaning part 11 to the front surface Wa of the substrate to be processed.

Abstract: A method and apparatus for removing a first liquid from a surface of a substrate is provided. A second liquid is supplied to at least part of a surface of a substrate having a rotary movement. The rotary movement has a center of rotation and an edge of rotation. The second liquid is directed from the center of rotation to the edge of rotation using a nozzle. A dry zone is created on the substrate as the position of the spray moves from the center of rotation to the edge of rotation. As a result, the first liquid and the second liquid are removed from the surface of the substrate.

Abstract: A substrate cleaning apparatus is used to clean a substrate with a cleaning liquid. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold a substrate horizontally, a rotating mechanism configured to rotate the substrate held by the substrate holding mechanism, a liquid supply nozzle for supplying a cleaning solution to the substrate, and a spin cover provided around the substrate and rotatable at substantially the same speed as the substrate. The spin cover has an inner circumferential surface shaped so as to surround the substrate. The inner circumferential surface is, from a lower end to an upper end thereof, inclined radially inwardly.

Abstract: A substrate holding device according to the present invention comprises: a motor; a rotating shaft rotated by the driving force of the motor; a spin base coupled to the rotating shaft and rotated integrally with the rotating shaft; a cover member surrounding the motor and having its one end arranged in the vicinity of the spin base; a rotating ring fixed to a surface, opposite to the cover member, of the spin base; a fixed ring arranged opposite to the rotating ring along the axis of the rotating shaft; a spring provided at the one end of the cover member for elastically urging the fixed ring toward the rotating ring; and clean gas supply mechanism for supplying clean gas to a space between the rotating ring and the fixed ring.

Abstract: A substrate processing apparatus 10 includes a holding table 20 for rotatably holding a wafer W, a nozzle 40 for supplying chemical solutions L1 and L2 to the wafer W, at least one light irradiation units G1 and G2, and a pot 30 placed in the outer radius of the holding table 20for collecting the processing solutions L1 and L2 that are scattered from the wafer W. The pot 30 also includes a cover 70 that can be moved in the direction of the axis of the holding table 20so that a plurality of chemical solution collecting chambers M1 and M2 are formed in the pot by changing the position of the cover 70.

Abstract: The plug is proposed for insertion into a hollow core of a roller cover to keep water from traveling through the hollow core, the plug comprising a body sized and configured to be received in the hollow core, and the body incorporating a peripheral lip thereon to keep the plug from being pushed into the hollow core by water pressure applied thereagainst.

Abstract: A sonic cleaner for small articles includes two tanks for receiving a liquid and articles to be cleaned and a base unit having chambers for receiving each tank. A vibratory motion generator attaches to the base unit through an isolating structure. Complementary attachment elements on the vibratory motion generator and each tank form a releasable, rigid connection. When the tank is attached to the vibratory motion generator, liquid in the tank can be agitated. When the releasable, rigid connection is detached, the tank can be removed from the base unit for disposing of liquid in the tank without having to handle the entire sonic cleaner.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: A washing machine for glass lenses (11) or other similar items of the type including a conveyor (1) has a bearing surface (10) for moving the lenses through a washing chamber (12) made of a succession of washing means (21). The traction force transmitted to the aforementioned bearing surface (10) is carried out by two chains (13) with endless links (14), located on the both sides of the aforementioned bearing surface (10), each chain (13) being joined at the longitudinal side corresponding to the aforementioned bearing surface (10) and is stretched tight between two driving gears, of axis parallel to the plane of the aforementioned bearing surface and perpendicular to the direction of the displacement.

Abstract: The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.

Abstract: A substrate cleaning device comprises a chamber for cleaning a substrate; a substrate support installed in the chamber providing a surface for supporting the substrate during cleaning thereof; at least one cleaning solution supply outlet for spraying a cleaning solution onto a surface of the substrate; a vibration force generator for supplying a vibratory action; a vibration force generating shaft which receives said vibratory action from the vibration force generator so that said vibration force generating shaft vibrates for agitating the cleaning solution on the substrate; and a vibration force distributor for preventing a vibration force from being concentrated on a portion of the substrate below the vibration force generating shaft.

Abstract: An apparatus for processing a substrate is provided which includes a first manifold module to generate a fluid meniscus on a substrate surface. The apparatus also includes a second manifold module to connect with the first manifold module and also to move the first manifold module into close proximity to the substrate surface to generate the fluid meniscus.

Abstract: A paint implement cleaning system consists of a basic container having at least three water pressure nozzles located therein. There is at least one at the bottom of the container and others are located midway within the container and diametrically opposite from each other. The basic container has a closure cap therein which suspends cleaning implements therefrom. One implement can be a paint laden paint brush which is cleaning by way of the nozzles located within the container. A paint roller can be rotatably supported on a threaded spindle which in turn is suspended from the closure cap. A jet pipe is located adjacent to the paint roller and has a multiple of nozzles thereon which direct pressurized water streams tangentially against the circumference of the paint roller to cause the paint roller to spin while being cleaned.

Abstract: A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

Abstract: A liquid treatment apparatus treating a surface of a substrate held generally horizontally on a stage in a housing by supplying a treating liquid to said surface from a supply nozzle. The liquid treatment apparatus includes a cup body provided so as to surround the substrate held in the substrate holding part laterally, the cup body being mounted detachably to a base inside the housing from an upward direction thereof; a cup body holding part holding the cup body detachably; and an elevating mechanism moving the cup body holding part up and down between a first position at which the cup body is mounted upon the base body and a second position located above the first position.

Abstract: The present invention provides a rotary shaft sealing mechanism having the seal between the rotary shaft and the seal ring improved, and a liquid processing apparatus including the rotary shaft sealing mechanism. The cleaning processing apparatus 1 comprises a rotor 34 for holding wafers W, an outer chamber 71a and an inner chamber 71b which can house the rotor 34, a spindle 50 for rotating the rotor 34, and an outer cylindrical member 32 disposed around the spindle 50. A first sealing ring 13, etc. of resins are provided in a ring member 12 constituting the outer cylindrical member 32. A clearance between the spindle 50 and the first sealing ring 13 is adjusted by press inserting the spindle 50 into the first sealing ring 13, etc. and rotating the spindle 50 for a prescribed period of time to abrade the fist sealing ring 13, etc.

Abstract: An industrial parts washer includes a stand adapted to support a part, a chamber selectively moveable from a first position clear of the part to a second position engaging the stand where the chamber forms a closed volume encapsulating the part. A nozzle is positioned within the chamber to supply pressurized fluid for cleaning the part. The industrial parts washer may include a washing station positioned adjacent a drying station where each of the washing and drying stations include chambers selectively moveable to enclose the part.

Abstract: A cleaning apparatus 1 includes a foup loading/unloading part 2 for mounting foups F each accommodating a plurality of wafers W at intervals of a constant pitch (normal pitch), a rotor 34 capable of holding the wafers W at half the normal pitch (half pitch), a wafer transporting device 11 for transporting the wafer E between the foup F and the rotor 34, wafer posture changing devices 20a, 20b, a wafer elevating mechanism 40, a motor 31 for rotating the rotor 34, an outer chamber 71a and an inner chamber 71b both accommodating the rotor 34, and cleaning liquid nozzles 53, 55 for supplying a cleaning liquid to the wafers W. The rotor 34 holds the wafers W at intervals of an optional pitch (every one holding pitch or every plural holding pitches) to carry out a cleaning operation. Consequently, it is possible to process substrates accommodated in two containers at one batch processing.

Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

Abstract: There is provided a nozzle apparatus for stripping an edge bead from a wafer, which includes a rotatable support arm, and a side rinse nozzle coupled to a leading end of the support arm to remove the bead of photoresist remaining on the edge of a wafer. The side rinse nozzle has a first nozzle for removing the bead on the upper surface of the wafer edge, and a second nozzle for removing the bead on the outer end surface of the wafer. The first and second nozzles each have a shape such that a length thereof is long in a radial direction of the wafer and a width thereof is narrow.

Abstract: A device and method for cleaning paint accessories and particularly roller covers and/or other paint accessories simultaneously or individually. A spray head has a fluid inlet engageable to a source of fluid and a fluid collection chamber in communication with the fluid inlet. A plurality of spray apertures are radially spaced within the spray head to be adjacent the nap of a roller cover during use. A sealing surface positioned within the radius of the spray apertures seals off an end of the roller cover. A housing having an inner cavity for receiving a roller cover has a diameter sized to create cleansing fluid flow through the nap of a roller cover. A plurality of outlet apertures in communication with the inner cavity are radially spaced to be adjacent a nap portion of a roller cover during use. A plurality of decreased diameter nestable sleeves adapted to fit in the housing are also provided to accommodate variously circumferentially dimensioned paint rollers.

Abstract: Provided is an apparatus for cleaning and drying a substrate by applying a plurality of chemicals and gases to the substrate. The apparatus may include: a substrate support member including a chuck receiving a substrate; a first nozzle member injecting a drying fluid onto a top surface of the substrate for drying the substrate; a low cover including an opened top and enclosing the chuck; and an upper cover selectively closing the opened top of the low cover so as to dry the substrate in a closed space. Therefore, the apparatus dries a substrate more efficiently and protects the substrate from being contaminated by foreign pollutants. Furthermore, generation of an undesired oxidation layer on the substrate can be prevented.

Abstract: A system and method for cleaning a substrate, such as a semiconductor wafer, utilizes a rotatable wafer supporting assembly with a cylindrical body to provide stability for the substrate being cleaned, even at high rotational speeds. The rotatable wafer supporting assembly may include wafer holding mechanisms with pivotable confining members that are configured to hold the substrate using centrifugal force when the wafer supporting assembly is rotated. In an embodiment, the cleaning system may include a positioning system operatively connected to an acoustic transducer to provide meaningful control of the acoustic energy applied to a surface of the substrate by selectively changing the distance between the acoustic transducer and the substrate surface so that the substrate can be cleaned more effectively.

Abstract: A method for producing an optical information recording medium includes the steps of: coating a solution for forming a dye recording layer onto a surface of a rotating disc-shaped resin substrate; and discharging a cleaning solution from a nozzle onto a peripheral edge to remove the dye recording layer from the peripheral edge, wherein discharge of the cleaning solution is initiated 1.0 to 300 seconds after completion of the coating, and the nozzle is disposed on a plane that extends in a normal line direction of the substrate and includes a straight line representing a discharge direction of the cleaning solution, so that an angle defined by the discharge direction and the normal line is 0 to 60°.

Abstract: A food washing apparatus of the invention includes an ozonized water generator (10), a cylindrical washing tank (1) in which the food materials are put and which can rotate to wash the food materials, a drainage part (4) formed at a part of the washing tank (1) and including openings to such a degree that water passes through and the food materials do not pass through, and wash water pipings (2, 9) which are inserted and disposed in the washing tank (1) in an axial direction and in which water spray holes (2a, 2a) for spraying wash water including at least ozonized water are formed, and while at least one part of the wash water sprayed from the wash water pipings (2, 9) is draind from the washing tank (1) every rotation of the washing tank (1), washing of the food materials is performed.

Abstract: The invention concerns an apparatus for cleaning the edge of a wafer that may be relatively simply constructed with low cost, and prevent the wafer from being re-contaminated by the edge cleaning, thus resulting in increase of the yield rate of wafers. The apparatus includes a cleaning agent ejection nozzle body provided on a side part of a chuck for ejecting a particulate cleaning agent (CO2 particles) towards the side and the edge portions of the wafer held and rotated by the chuck, and a nozzle body carriage for moving the nozzle body between rest and cleaning positions.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

Abstract: An ultrasonic cleaner apparatus is disclosed which includes a support housing, a tub supported by the housing and an ultrasound and sensor transducer contacting the bottom of the cleaning tank. A fixture assembly for holding items to be cleaned is configured for insertion into the cleaning tank. The fixture assembly comprises a predetermined number of slots, which are positioned around the perimeter of a pair of end disks disposed on the fixture assembly. The slots are configured to receive the distal ends of slats or other items to be cleaned. Rotation of the fixture assembly in the cleaning solution and ultrasonic energy effectively cleans the items while the fixture assembly securely holds the items during cleaning, rinsing and drying.

Abstract: An apparatus for cleaning a semiconductor wafer and method for cleaning a wafer using the same wherein, the apparatus includes a chamber on which a wafer is mounted, a revolving chuck mounted in the chamber for supporting and fixing the wafer, a nozzle for spraying cleaning solution onto the wafer, a cover for covering an upper part of the chamber, and a light source. The cleaning solution, preferably one of ozone water, hydrogen water, or electrolytic-ionized water, may be heated for a short time and used to clean the wafer.

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

Abstract: The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.

Abstract: According to the present invention, a metal and a barrier material, such as copper and a tantalum-based barrier material, are effectively removed from the wafer edge and especially from the bevel by using an etchant that comprises a diluted mixture of hydrofluoric acid and nitric acid. The method is compatible with currently available etch modules for removing metal from the wafer edge, wherein, depending on the hardware specifics, copper, barrier material and dielectric material may be removed in a single etch step, or a first etch step may be performed substantially without any nitric acid so as to avoid the formation of nitric oxides. In this way, the formation of instable layer stacks may be substantially avoided, thereby reducing the risk of material delamination from the substrate edge.

Abstract: A device having at least one cleaning unit for cleaning installations, especially for the production and/or processing of food stuffs or pharmaceuticals is provided. The device may include a cleaning unit that is configured to move within the installation to be cleaned. The cleaning unit may also be provided with one or more nozzles with rotatable nozzle tips configured to rotate as cleaning agent flows through the nozzle tip.

Abstract: A device is suggested which includes a carrier (1) for receiving the disk-shaped object (10), a liquid supply device (17) for applying liquid onto a disk-shaped object (10) located on the carrier (1), and a liquid catch ring (2), which is positioned essentially coaxially around the carrier (1) and is rotatable around the axis of the liquid catch ring (2).

Abstract: In accordance with one embodiment there is provided a method of improving the performance of a substrate cleaner of the type having a megasonic probe with a probe shaft extending generally parallel to a surface of a rotating substrate, and at least one dispenser for applying a cleaning liquid onto the surface of the substrate, wherein the megasonic probe agitates the liquid on the surface. The method comprising dissolving gas in the liquid before the liquid reaches the dispenser. In accordance with another embodiment, an apparatus for cleaning substrates comprises a rotary fixture which is adapted to support a substrate and rotate the substrate about a first axis, a probe having a probe shaft extending generally parallel to a surface of the substrate, and a megasonic transducer in acoustically coupled relation to the probe.

Abstract: Apparatuses and methods of processing a substrate. The apparatus includes a wet-cleaning chamber, a drying chamber, and a substrate transferring chamber which transfers a substrate to and from the wet-cleaning chamber and the drying chamber. The drying chamber is one of a supercritical drying chamber or a low pressure drying chamber. The wet-cleaning chamber is one of a single-wafer cleaning chamber, a horizontal spinning chamber, a megasonic wet-cleaning chamber, or a horizontal spinning chamber having acoustic waves transmitted to the substrate.

Abstract: A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the cleaning liquid from moving into a center portion of the semiconductor substrate. The cleaning liquid supplied to the edge section flows from the edge section towards a side section of the semiconductor substrate due to the rotation of the semiconductor substrate. An ultrasonic wave generator is provided above the edge section for generating ultrasonic waves. The ultrasonic waves are applied to the cleaning liquid supplied onto the edge and bottom sections, thereby improving the cleaning efficiency. The cleaning apparatus has a guide to guide the cleaning liquid supplied to the edge section toward the side section.

Abstract: A substrate treatment apparatus comprises a treatment vessel, a substrate holder for rotating the substrate in a horizontal plane in the treatment vessel, a nozzle unit arranged in an upper part of the treatment vessel such that a liquid is downwardly fed, a feed line for feeding the liquid to the nozzle unit, and a chamber enclosing therein the apparatus in its entirety. The nozzle unit is constructed in a form of a bar such that as viewed in plan, the liquid ejected from the nozzle unit reaches the substrate with an area range having a length not smaller than a diameter of the substrate and a width smaller than the diameter of the substrate.

Abstract: An apparatus and method for automatically collecting metallic impurities of a semiconductor wafer. In one aspect, an apparatus includes an air tight process chamber including a loading unit for loading the semiconductor wafer and unloading unit for unloading the semiconductor wafer; a vapor phase decomposition unit disposed in the process chamber for decomposing a silicon oxide layer on the semiconductor wafer; and a scanning unit disposed in the process chamber for scanning the semiconductor wafer to collect the metallic impurities. The scanning unit includes a scanning solution bottle for obtaining scanning solution that is used for absorbing metallic impurities on the semiconductor wafer; a scanning arm capable of downward, upward, and rotational movement; and a nozzle coupled to the scanning arm for drawing in scanning solution from the scanning solution bottle, and for forming a droplet of scanning solution that cohers to the nozzle when scanning a semiconductor wafer to collect metallic impurities.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: A method including the step of providing a substrate having a contact pad, and an under bump metallurgy overlying the contact pad, and a photoresist layer overlying the under bump metallurgy, and wherein the photoresist layer has an opening defined therein down to the under bump metallurgy and aligned with the contact pad. Pretreating the substrate with the first wetting solution prior to plating a first seed layer over the under bump metallurgy. Thereafter, plating a first seed layer is plated onto the under bump metallurgy.

Abstract: An apparatus for collecting impurities on a semiconductor wafer includes an airtight process chamber, a rotary chuck disposed in the process chamber for rotating and horizontally supporting the semiconductor wafer, a first scanning unit for forming a droplet of a first scanning solution and for scanning an upper surface of the semiconductor wafer rotated by the rotary chuck with the droplet to collect first impurities, a driving unit for tilting the rotary chuck and the semiconductor wafer supported on the rotary chuck, and a second scanning unit for receiving a second scanning solution for collecting second impurities from an edge portion of the semiconductor wafer, the second scanning solution being in contact with the edge portion of the semiconductor wafer tilted by the driving unit and rotated by the rotary chuck so that the second scanning solution scans the edge portion of the semiconductor wafer.

Abstract: A flexible container for liquid transport made of a flexible material includes a top face portion, a bottom face portion, and a peripheral face portion connecting the top face portion and the bottom face portion. An air tight, water resistant slide fastener is openably/closably mounted to the peripheral face portion of the container. A liquid stirring port is provided at the top face portion, and a liquid injecting and ejecting port are provided at a lower end of a rear face portion of the peripheral face portion. Container suspending pieces and bottom face portion fixing pieces are mounted at the top face portion of the container and at four corners of the bottom face portion. During washing, the container can be washed reliably and efficiently while the inside of the spread out container can be visually checked by efficiently utilizing the air tight, water resistant slide fastener, liquid stirring port, liquid injecting and ejecting port, and container suspending pieces, and bottom face port fixing pieces.

Abstract: Appliance (100) having a housing (101) of compact dimensions wherein articles, particularly nursing bottles (123, 179) and accessories (119), are treated inside a chamber (1). Treatment is achieved with dosed amounts of fresh water retrieved from a fresh water tank (7), by successive cycles of washing, rinsing, and sterilizing. The treatment cycles use additives and high-speed jets of heated liquid and of steam, which are filtered for repeated use. At the end of the treatment, liquids are purged to a wastewater tank (33). Self-treatment of the appliance is provided by use of the same treatment cycles. The appliance is independent of external water supply, portable and automatic for use in situ, where electricity supply is available.