Abstract: A general method and apparatus for treating materials at high speed comprises the steps of dissolving a relatively high concentration ozone gas in a solvent at a relatively low predetermined temperature T1 to form an ozone-solvent solution with a relatively high dissolved ozone concentration, and heating either the ozone-water solution or the material to be treated or both, the ozone-solvent solution and the material to be oxidized with a point-of-use heater to quickly increase the temperature to a predetermined higher temperature T2>T1, and applying the ozone-solvent solution to said material(s) whereby the heated ozone-water solution will have a much higher dissolved ozone concentration at said higher temperature, than could be achieved if the ozone gas was initially dissolved in water at said higher temperature.

Abstract: In a high pressure processing method for removing an unnecessary substrate on the surface of the surface of a workpiece by bringing it into contact with supercritical carbon dioxide and additives in a high-pressure chamber, removing the unnecessary substance on the workpiece, first rinsing and second rinsing are performed under a substantially same pressure with continuous flowing of supercritical carbon dioxide.

Abstract: The invention relates to a method of low temperature cleaning and applying an antimicrobial treatment to food and beverage plant equipment. In addition, the method includes carbon dioxide compatible chemistry. The method may be achieved through a multi-step method.

Abstract: Disclosed is a novel process for cleaning and restoring the operating efficiency of organic liquid chemical exchangers in a safe and effective manner and in a very short period of time, without a need to disassemble the equipment and without the need to rinse contaminate from the equipment after cleaning. Used is a formulation of monocyclic saturated terpene mixed with a non-ionic surfactant package specifically suited to oil rinsing. The terpene-based chemical is injected into organically contaminated exchangers using a novel process involving high-pressure steam to form a very effective cleaning vapor.

Abstract: An environmental friendly cleaning method is provided. The method comprises the step of cleaning an article using a composition comprising material extracted from the fruit of a plant of the genus Garcinia, for example the fruit of the plant Garcinia atroviridis.

Abstract: The present invention relates to a method for cleaning a pressurized container having at least one chemical contained therein such as, for example, chlorine gas or sulfur dioxide gas. The pressurized container may be any type of container able to store chemicals under pressure. Preferably, however, the container may be a rail tank car. Generally, the method may include steps for injecting the container with a quantity of input gas to form an input gas/chemical mixture and removing the input gas/chemical mixture from the container via a vacuum pump. input gas/chemical mixture may be pushed into a reaction tank for neutralization of the chemical by a neutralizing solution.

Abstract: A coherent body (B) of wet crushed ice is pumped along a pipe (5). The crushed ice body can be used as a means of cleaning the pipe wall, as a means of driving a product liquid out of the pipe for recovery, or as a barrier for preventing mixing of two different bodies of liquid (1,2) in the pipe to either side of it. Being coherent but flowable and non-tensile, the mass of crushed ice can negotiate internal constrictions, obstructions and junctions of the pipe readily, unlike conventional solid or gelled pigs.

Abstract: A method of cleaning the interior of a processing chamber first performs a halogenation treatment by supplying a treatment gas containing a halogenating gas into the processing chamber and heating a support member for a target substrate, thereby halogenating a metal element in a by-product film. A reduction treatment is then performed by supplying a treatment gas containing a reducing gas into the processing chamber, thereby reducing a halide of the metal element and liberating the metal element. An oxidation treatment is then performed by supplying a treatment gas containing an oxidizing gas into the processing chamber and heating the casing walls of the processing chamber, thereby passivating the liberated metal element by oxidation.

Abstract: Disclosed is a novel process for interior cleaning and by cleaning, removing noxious gas and/or restoring the operating efficiency of organically contaminated hydrocarbon processing equipment in a safe and effective manner and in a very short period of time, without a need to manually enter an unsafe environment and mechanically remove organic contaminants. Used is a formulation of non-aqueous, monocyclic saturated terpene mixed with a non-ionic surfactant package. The terpene-based chemical is injected into organically contaminated equipment using a novel process involving high-pressure steam to form a very effective cleaning vapor.

Abstract: Disclosed is a novel process for interior cleaning and by cleaning, removing noxious gas and/or restoring the operating efficiency of organically contaminated hydrocarbon processing dynamic devices in a safe and effective manner and in a very short period of time, without a need to manually enter an unsafe environment and mechanically remove organic contaminants. Used is a formulation of non-aqueous, monocyclic saturated terpene mixed with a non-ionic surfactant package. The terpene-based chemical is injected into the organically contaminated device using a novel process involving high-pressure steam to form a very effective cleaning vapor. The device is activated during the process. The vapor may be optionally directed against the normal-flow direction of the device.

Abstract: Disclosed is a cleaning method of a ceramic member, which permits removing with a high accuracy the contaminants from a ceramic member contaminated with the contaminant. The cleaning method comprises the steps of processing the contaminated ceramic member with an alkaline chemical liquid having a pH value not smaller than 10 in the presence of an ultrasonic wave, processing the ceramic member processed with the alkaline chemical liquid with a prescribed acidic chemical liquid in the presence of an ultrasonic wave, and heating the ceramic member processed with the acidic chemical liquid under temperatures not lower than 1,000° C.

Abstract: An improved method for removing contaminant particles from a surface of a semiconductor wafer includes forming a sacrificial film on the surface of the wafer and then removing the sacrificial film by supercritical fluid cleaning. The removal of the sacrificial film via the supercritical fluid cleaning process facilitates removing the contaminant particles. The method further includes identifying and characterizing the contaminant particles and creating a record of the contaminant particle data. The composition of the sacrificial film is selected based on the contaminant particles data and the supercritical cleaning recipe is selected based on the composition of the sacrificial film and the contaminant particles data.

Abstract: A composition and method for stripping and cleaning organic coatings from substrates, comprising a solution of high-boiling alcohols, preferably polyglycols, a surfactant, preferably a nonylphenol ethoxylate, and an alkali metal hydroxide, said composition being essentially free of any amines. The composition aggressively and effectively strips paints and other organic coatings without harming underlying substrates damaged by prior art strippers, over conventional or lower time periods, and at conventional or lower temperatures. One embodiment of the invention comprises from about 40% to about 98.9% by weight of a high-boiling alcohol; from about 1% to about 60% of a non-ionic surfactant; and from about 0.1% to about 10% of an alkali hydroxide or mixture of alkali hydroxide.

Abstract: The method and apparatus are for safely cleaning live equipment. The method comprises the steps of heating a water-based solution by means of an apparatus to produce superheated steam; grounding this apparatus; conducting the superheated steam through an insulated conduct; and concentrating this superheated steam into a pressurized jet at an output of the insulated conduct. After the step of grounding the apparatus, the method further comprises the step of applying the pressurized jet through the insulated conduct output, onto the live equipment to be cleaned.

Abstract: An automatic deliming process for a steam oven cooker is described. The process initiates a deliming procedure after a predetermined time of normal operation, which period of time is determined by the hardness of the water in the local area. Upon the expiration of this period of time a microprocessor signals an operator to shut down normal operation of the oven, and initiate the deliming process. The microprocessor then activates a peristaltic pump which injects a predetermined quantity of deliming liquid from an external reservoir into the generator. After the deliming time has passed and the generator contents have cooled to 140° F. the microprocessor automatically activates a drain pump to drain the deliming solution from the generator. Subsequently the microprocessor activates a fill-solenoid opening and inlet from a reservoir of rinse water into the generator to rinse the same. The microprocessor then again opens the drain to drain the rinse water, and normal operation is resumed.

Abstract: A terpene-free cleaning composition containing: (a) an oil-soluble anionic surfactant; (b) a water-soluble anionic surfactant; (c) a primary solvent consisting of a C1-4 alkyl ester; (d) a short-chain cosurfactant; and (e) water.

Abstract: A method for removing silicone sealant from glass-ceramic surfaces is provided. The method includes heating the sealant to a temperature greater than 325 degrees Celsius so that it thermally degrades and then, mechanically removing the sealant from the glass-ceramic surface. A method of salvaging a glass-ceramic cooking surface from a cooktop including silicone sealant between a cooktop frame and the glass-ceramic cooking surface is also provided. If a defect is detected in the cooktop during manufacturing or distribution, the entire cooktop is heated to a predetermined temperature to allow the silicone sealant to be easily removed without using a knife or other potentially damaging devices. Once the silicone sealant is removed, the glass-ceramic cooking surface may be reused to produce another cooktop assembly.

Abstract: A substrate drying system having an IPA concentration interlock detector for detecting the concentration of substrate-drying IPA vapor in a processing or cleaning tank of a Marongoni-type substrate drying system, for example, as substrates are dried in the cleaning tank after washing typically using deionized water. In the event that inadequate concentrations of the IPA vapor are delivered to the cleaning tank, the IPA concentration interlock detector transmits an alarm signal to the tool controller to alert facility personnel to the inadequate IPA concentrations in the cleaning tank and prevent the formation of water marks on the substrates.

Abstract: A plant for the continuous washing of plastic material in scales. The plant having a washing apparatus, at least one filtering unit connected to the apparatus for purifying the washing fluid and means for varying the time the scales remain in the washing apparatus as a function of the quantity of scales contained at that same moment in the same apparatus.

Abstract: Method for processing an article with a dense processing fluid in a processing chamber while applying ultrasonic energy during processing. The dense fluid may be generated in a separate pressurization vessel and transferred to the processing chamber, or alternatively may be generated directly in the processing chamber. A processing agent may be added to the pressurization vessel, to the processing chamber, or to the dense fluid during transfer from the pressurization vessel to the processing chamber. The ultrasonic energy may be generated continuously at a constant frequency or at variable frequencies. Alternatively, the ultrasonic energy may be generated intermittently.

Abstract: A composition and method for the removal of scale from a substrate are disclosed. The composition and method are more specifically utilized for the in situ removal of silicate-containing scale from interior surfaces of boilers and other heat exchange equipment. The silicate-containing scale is deposited in the boilers as silicate-sulfate complexes of calcium, magnesium, aluminum, and other metal atoms that are present in water. The composition, which is circulated throughout the boiler to contact the interior surfaces, such as the boiler tubes, includes a chelating agent having at least two carboxylic acid functional groups, preferably citric acid. The composition also includes an alkali metal hydroxide basic agent. The preferred alkali metal hydroxides are either potassium or sodium hydroxide. The basic agent establishes an overall basic pH of from 7 to 14 in the composition to enable precipitation of the metal atoms from the composition after interaction with the chelating agent.

Abstract: A process for cleaning a material with a cleaning system having system apparatus and at least one electronic device associated with the system apparatus, the at least one electronic device having a specified temperature operation range, the system having contacting apparatus, the process including contacting a material with an extracting fluid under conditions of temperature and pressure sufficient to maintain the extracting fluid at, near or above its critical point to produce a clean material, flowing the extracting fluid from the contacting apparatus to pressure reducing apparatus to lower pressure of the extracting fluid, lowering the pressure of the extracting fluid with the pressure reducing apparatus, thereby cooling the extracting fluid producing cooled extracting fluid, and flowing the cooled extracting fluid in heat exchange relation with the at least one electronic device to maintain temperature of the at least one electronic device within the specified temperature operation range; and a system for

Abstract: A system and method are provided for stripping one or more optical fibers having multiple coatings, accomplished with multiple stripping steps or passes. As an example, each coating may be stripped relatively independently. Such stripping may be accomplished with multiple bursts of a fluid or gas heated to a temperature sufficient to remove the coating.

Abstract: An apparatus for cleaning a semiconductor wafer and method for cleaning a wafer using the same wherein, the apparatus includes a chamber on which a wafer is mounted, a revolving chuck mounted in the chamber for supporting and fixing the wafer, a nozzle for spraying cleaning solution onto the wafer, a cover for covering an upper part of the chamber, a heating lamp fixed on an upper part of the cover for heating the wafer or the cleaning solution, a cooling water conduit surrounding the cover, and an antipollution plate mounted on a lower part of the heating lamp in the cover for preventing the heating lamp from being polluted by the cleaning solution. According to an embodiment of the present invention, the cleaning solution, preferably of ozone water, hydrogen water, or electrolytic-ionized water, is heated for a short time and used to clean the wafer.

Abstract: A method for the production of (meth)acrylic acid and/or a (meth)acrylic ester is provided. This method for the production of (meth)acrylic acid and/or a (meth)acrylic ester includes washing the device constructed for the production thereof with a basic solution and subsequently rinsing them with a solvent for the purpose of removing solid substances such as polymer and precipitate which occur during the production of (meth)acrylic acid and/or a (meth)acrylic ester.

Abstract: A method of restoring a contaminated polymer article including contacting a contaminated polymer article with an oil which is not a plasticizer under conditions effective to remove substantially all contaminants present on the polymer article to produce a restored polymer article.

Abstract: The present invention comprises methods, compositions and apparatus for cleaning the surfaces within vessels that have restricted points of entry, and in particular, the surfaces within oxygen converters and oxygen cylinders. These oxygen converters and oxygen cylinders are components of the onboard oxygen supply systems of aircraft. A surfactant and a solvent are mixed to form a cleaning composition that is boiled at reduced pressure and increased temperature within the oxygen converter or oxygen cylinder. The oxygen converter or oxygen cylinder is rinsed with pure solvent, and the rinse fluid is measured to determine the level of contaminants. Dry air is forced through the oxygen converter or oxygen cylinder to remove remaining solvent. The cleaning composition may comprise a fluorocarbon solvent and a fluorosurfactant.

Abstract: A water supply apparatus and a method thereof have a high capability of peeling-off and removing unnecessary objects such as a resist film, and parameters for setting efficient water supply conditions. The water supply apparatus and the method are designed to supply water for cleaning, peeling-off, or treating a target article. On a surface of the target article to be processed, a nozzle device is provided for spraying a mixture of water vapor and water mist. At least the following parameters are respectively set as water supply conditions to proper values so as to supply water to the target article, and these parameters include (1) a weight ratio of water vapor to water mist on the surface to be processed, (2) a temperature of the surface to be processed, and (3) a distance between a (water) blowing port of the nozzle device and the surface to be processed.

Abstract: A method of removing cured silicone polymer deposits from electronic components. The components are immersed in a preheated solution of a quaternary ammonium fluoride in a hydrophobic non-hydroxylic aprotic solvent with agitation. The components are then immersed in a preheated solvent consisting essentially of a hydrophobic aprotic solvent with agitation. This is followed by a rinse and spray of the components with a hydrophilic, essentially water soluble solvent, with agitation. The components are then immersed in a water bath and then rinsed with a pressurized spray of water and then dried with a N2 blow dry.

Abstract: The present invention relates to a process for pickling hot rolled, hot rolled & annealed, and cold rolled & annealed stainless steel strip in a continuous fashion. The process comprises a series of pre-pickling tanks and pickling tanks, and optionally includes a scrubber-brush tank, a de-smutting tank, a filtration unit and a heat exchanger.

Abstract: Methods and apparatus for cleaning hearing aid devices are disclosed. Drying is facilitated in hearing instruments through a novel combination of heater and desiccant in an essentially closed system. Greater efficiency is obtained by minimizing the volume of gas, e.g., air, requiring moisture extraction.

Abstract: A to-be-cleaned substrate is cleaned by use of an acid liquid agent in a cleaning cup, the remaining acid liquid agent is washed out by use of pure water, then an alkaline liquid agent is emitted to the surface of the to-be-cleaned substrate in the same cleaning cup to remove the acid liquid agent remaining on the to-be-cleaned substrate. A neutralization reaction between the acid and alkali is caused by emitting the alkaline liquid agent to the surface of the to-be-cleaned substrate so as to efficiently remove the acid liquid agent remaining on the surface of the to-be-cleaned substrate.

Abstract: The invention provides a method and device for decontaminating a contaminated hollow metal needle having electrical wires attached to the needle which heat cleaning fluid dispensed into the needle.

Abstract: A semiconductor manufacturing apparatus is described. That apparatus includes an ash chamber that has an ash chamber base, and a heating unit that is coupled to the ash chamber base. The heating unit applies heat to the ash chamber base to reduce deposition of residues onto ash chamber base surfaces, which could cause surface particle defects in a semiconductor device.

Abstract: A system for stripping an optical fiber includes a source of air and means for generating very short bursts of air. A heater heats the bursts of air to a temperature sufficient to remove the outer coating from an optical fiber, while maintaining the air isolated from the heat source. A single burst of heated air removes the outer coating of an optical fiber, within less than about one second. A series of closely spaced bursts or a prolonged burst of heated air may be used to remove an expanded length of fiber coating. Stripping may include translation of the fiber or the heater or portions thereof. The stripper may be configured to strip several loaded fibers or a single fiber.

Abstract: The pickling process of the present invention is designed for pickling electrical steel strip in a continuous fashion and comprises at least one pickling tank equipped with at least one set of sprayers designed to spray the top and bottom surfaces of a steel strip with a solution comprised of hydrogen peroxide prior to and/or after the strip is immersed in a solution contained in a pickling tank. The set(s) of sprayers in each of the pickling tanks are located above the level of the pickle bath solution, rather than being located in separate spray tanks. Upon exiting the final pickling tank, the strip is brushed/scrubbed to loosen any residual scale to form a clean strip.

Abstract: A processor for cleaning, rinsing, and drying workpieces includes a process vessel, an ozone injection system for introducing ozone gas into the process vessel, a liquid injection system for introducing a processing fluid into the process vessel, and a drying system for delivering a drying fluid to the process vessel. The processing fluid is introduced into the process vessel such that the processing fluid lies beneath a workpiece. Ozone gas is introduced into the process vessel. The workpiece is then bathed in the processing fluid. A drying fluid is introduced into the process vessel while the processing fluid is evacuated from the process vessel. Microelectronic workpieces can be cleaned and dried in a single vessel, reducing the equipment and space used in manufacturing.

Abstract: Disclosed are methods of cleaning articles of manufacture using hydrofluorocarbon and hydrochlorofluorocarbon fluids. The methods comprise generally the steps of (a) providing a hydrofluorocarbon and/or hydrochlorofluorocarbon fluid in liquid or supercritical state; (b) contacting an article of manufacture with said fluid; and (c) removing substantially all of said fluid from said article of manufacture.

Abstract: A method of removing residual contamination including metal nitride particles from semiconductor wafer surfaces including the steps of: providing at least one semiconductor wafer with metal nitride particles adhering to the at least one semiconductor wafer surface thereto; subjecting the at least one semiconductor wafer to at least one mechanical brushing process while a cleaning solution including a carboxylic acid is supplied to at least one semiconductor wafer surface; and, subjecting the at least one semiconductor wafer to an a sonic cleaning process including the carboxylic acid cleaning solution.

Abstract: In a method for processing a workpiece to remove material from a first surface of the workpiece, steam is introduced onto the first surface under conditions so that at least some of the steam condenses and forms a liquid boundary layer on the first surface. The condensing steam helps to maintain the first surface of the workpiece at an elevated temperature. Ozone is provided around the workpiece under conditions where the ozone diffuses through the boundary layer and reacts with the material on the first surface. The temperature of the first surface is controlled to maintain condensation of the steam.

Abstract: The invention relates to the use of organic carbonates having formula (I) wherein: n=1-4 R and R′ are two linear or branched alkyl radicals which contain a number of carbon atoms whose sum is equal to at least 5 and which can be the same or different, as solvents for the washing of metal surfaces.

Abstract: A semiconductor manufacturing a method and an apparatus is described. That apparatus includes an ash chamber that has an ash chamber base, and a heating unit that is coupled to the ash chamber base. The heating unit applies heat to the ash chamber base to reduce deposition of residues onto ash chamber base surfaces, which could cause surface particle defects in a semiconductor device.

Abstract: A method of removing residual contamination including metal nitride particles from semiconductor wafer surfaces including the steps of: providing at least one semiconductor wafer with metal nitride particles adhering to the at least one semiconductor wafer surface thereto; subjecting the at least one semiconductor wafer to at least one mechanical brushing process while a cleaning solution including a carboxylic acid is supplied to the at least one semiconductor wafer surface; and, subjecting the at least one semiconductor wafer to an a sonic cleaning process including the carboxylic acid cleaning solution.

Abstract: An apparatus for cleaning a glass substrate for use in information recording medium, having improved detergency, includes a plurality of gas feeding pipes, provided in a cleaning tank storing therein a cleaning fluid, for feeding air into the cleaning tank to generate bubbles of air in the cleaning fluid in which a glass substrate is immersed. The bubbles are brought into contact with the glass substrate while stirring the cleaning fluid to effectively remove deposits on the surface of the glass substrate.

Abstract: A method for cleaning polyethylene terephthalate containers including contacting the PET container with an alkaline wash solution having a temperature ranging of less than about 60° C. is disclosed. The alkaline wash solution is formulated from a first concentrate, a second concentrate, an alkalinity source, and a balance of water. The first concentrate preferably has a first nonionic surfactant, a first builder, and acid in an amount effective to provide a phase stable solution. The second concentrate preferably has a second nonionic surfactant and a second builder. The first and second concentrate are present in the wash solution in a concentration ranging from about 0.3 wt. % to 2.0 wt. %. Preferably, the first nonionic surfactant has a cloud point ranging from about 5° C. to 60° C.

Abstract: A method for removing organic contaminants from a semiconductor surface whereby the semiconductor is held in a tank and the tank is filled with a fluid such as a liquid or a gas. Organic contaminants, such as photoresist, photoresidue, and dry etched residue, occur in process steps of semiconductor fabrication and at times, require removal. The organic contaminants are removed from the semiconductor surface by holding the semiconductor inside a tank. The method is practiced using gas phase processing. The tank is filled with a gas mixture, comprising water vapor and ozone.

Abstract: The present invention pertains to apparatus and methods for maintaining wafer back side, bevel, and front side edge exclusion during supercritical fluid processing. Apparatus of the invention include a pedestal and an exclusion ring. When the exclusion ring is engaged with the pedestal a channel is formed. A reactant-free supercritical fluid is passed through the channel and over a circumferential front edge of a wafer. The flow of reactant-free supercritical fluid protects the bevel and circumferential front edge of the wafer from exposure to reactants in a supercritical processing medium. The back side of the wafer is protected by contact with the pedestal and the flow of reactant-free supercritical fluid. Exclusion rings of the invention, when engaged with their corresponding pedestals make no or very little physical contact with the wafer front side.

Abstract: Methods for cleaning screw extruder, especially powder-coating extruders, include filling the extruder barrel with a gel purge formulation comprised of a high-boiling pyrrolidone or piperidone (lactam) solvent (most preferably N-methyl pyrrolidone (NMP)), thickened with 5-50 wt. % of a thermoplastic resin thickening agent, most preferably polystyrene (PS). Once the extruder barrel is filled with the gel purge formulation, the screws are stopped and the gel allowed to soak for between about 10 to about 30 minutes. The screws are then restarted and the gel is discharged from the extruder. Immediately after the gel purge formulation exits the machine, a small amount of a thermoplastic “rinse” polymer (e.g., polyethylene) may be added so as to remove any vestigial amount of the gel purge formulation therefrom.

Abstract: In a method for cleaning a surface of a substrate an amount of a solution is applied on a surface of the substrate. After the solution is applied on the surface, crystallization of the solution is initiated to form a liquid-crystal mixture. Once the liquid-crystal mixture is formed, relative motion between the liquid-crystal mixture and the substrate is created to dislodge contaminants adhered to the substrate. In one alternative method, the solution is applied on a pad. In another alternative method, the substrate is place in a bath of the solution. A wafer cleaning module also is described.

Abstract: A method of cleaning semiconductor wafers before the epitaxial deposition comprising (A) etching silicon wafers with HF; (B) rinsing the etched wafers with ozonated ultrapure water; (C) treating the rinsed wafers with dilute SC1; (D) rinsing the treated wafers; (E) treating the wafers with dilute HF; (F) rinsing the wafers with DI water; (G) drying the wafers with nitrogen and a trace amount of IPA; wherein steps (E) through (G) are conducted in a single dryer chamber and wafers are not removed from the chamber between steps. A system comprising a single tank adapted for cleaning, etching, rinsing, and drying the wafers has means to inject HF into a DI water stream.