Abstract: A system for cleaning a substrate with a foam performs a method for generating a cleaning foam. In the first operation of the method, the system pumps a fluid into a premix chamber. The premix chamber is a component of a male plug which fits into a female housing in the system. Then the system injects a gas into the premix chamber to initiate generation of the foam from the fluid. The foam flows from the premix chamber into a sealed helical channel formed by a helical indentation on an outside surface of the male plug and an inner surface of the female housing to allow the foam to reach a desired state along a length of the sealed helical channel. In the last operation of the method, the foam outputs from an exit end of the helical channel through the male plug to a component of the system.

Abstract: A method for cleaning plated polished disks used in hard drive media is provided. The method includes positioning plated polished disks in a first batch scrubber having multiple first brushes, wherein each of the plated polished disks is positioned between two of the first brushes, and scrubbing the plated polished disks with the first brushes. The method further includes positioning the plated polished disks scrubbed in the first batch scrubber in a second batch scrubber having multiple second brushes, wherein each of the plated polished disks is positioned between two of the second brushes, and scrubbing the plated polished disks with the second brushes.

Abstract: A method of maintaining a floor comprises discharging a diluting fluid from a first reservoir to a mixing apparatus, discharging a cleaner concentrate from a second reservoir to the mixing apparatus, continuously identifying changes in fluid level within the first reservoir with a level sensor, providing a first signal indicative of an identified change in fluid level, passing the cleaner concentrate and diluting fluid through a flow control device, and processing the first signal to generate an output signal and controlling operation of the pump and the flow control device in response to the output signal to provide a flow of fluid to a cleaning device at a substantially constant ratio of the diluting fluid from the first reservoir to the cleaner concentrate from the second reservoir for substantially all fluid levels of the first reservoir.

Abstract: A substrate processing method includes a rinsing step of supplying water of a first temperature to a surface of a silicon substrate to apply a rinsing process using the water to the silicon substrate surface, a second temperature water supplying (coating) step of supplying water of a second temperature lower than the first temperature to the silicon substrate surface after the rinsing step, and a drying step of rotating the silicon substrate after the second temperature water supplying step to spin off the water on the silicon substrate surface to a periphery of the silicon substrate and thereby dry the silicon substrate.

Abstract: In a substrate processing method according to the present invention, a cleaning liquid nozzle supplies a rinsing liquid to a central portion of a substrate and thereafter moves from a position corresponding to the central portion of the substrate to a position corresponding to a peripheral, edge portion thereof while supplying the rinsing liquid before stopping at the position corresponding to the peripheral edge portion. Next, a drying liquid nozzle moves from the position corresponding to the peripheral edge portion to the position corresponding to the central portion while supplying a drying liquid. Then, the drying liquid nozzle is kept stationary at the position corresponding to the central portion for a predetermined period of time while supplying the drying liquid. Thereafter, a gas nozzle moves from the position corresponding to the central portion to the position corresponding to the peripheral edge portion while supplying an inert gas.

Abstract: A hard floor surface care process comprising a process of identifying, cleaning, polishing, and protecting manmade and natural stone hard floor surfaces having a single surface or multi-surface quality. The hard floor surface care process comprising an acid reactive or nonreactive hard floor surface identifying process; an emulsifying solution, agitating, and toweling cleaning process; a polishing process utilizing a lubricating solution with a polishing chemistry or pad, and a protecting process utilizing a protecting chemistry selected as a function of the identifying process.

Abstract: Provided is a liquid processing apparatus in which a target substrate is horizontally held on a substrate holding unit and rotated around a vertical shaft, and the chemicals are supplied from a chemical supplying unit to the bottom surface of the target substrate that is rotating. In particular, the liquid processing apparatus performs a first step in which the chemicals are supplied to the target substrate while rotating the target substrate at a first rotation speed, a second step in which the supply of the chemicals is halted and the chemicals are thrown off by rotating the target substrate at a second rotation speed higher than the first rotation speed, and a third step in which the rinse liquid is supplied to the target substrate while rotating the target substrate at a third rotation speed equal to or lower than the first rotation speed.

Abstract: A substrate processing method comprising: holding a substrate substantially horizontally by a rotatable substrate holding mechanism; supplying a rinsing liquid onto the top of the substrate held by the substrate holding mechanism at the substrate holding step; after the rinsing liquid supply step, spraying a gas onto the top of the substrate held by the substrate holding mechanism, by a gas knife mechanism, to form a gas spraying zone on the substrate top, and unidirectionally scanning the substrate top in its entirety by this gas spraying zone, without rotating the substrate; replenishing the rinsing liquid by supplying, in parallel to the gas knife spraying step, a rinsing liquid onto the substrate top at its area downstream in the gas-spraying-zone scanning direction rather than the gas spraying zone formed by the gas knife mechanism; and drying the substrate surface after the gas knife spraying step and the rinsing liquid replenishing step.

Abstract: In the case of a device and a method for cleaning substrates on a carrier, to the underside of which the substrates are fastened so as to be parallel to and slightly apart from one another, the carrier has in its interior a plurality of longitudinal channels, which run parallel to one another. As a result of the sawing of the wafers, they merge, via openings, into interstices between the substrates. As a result of a relative movement, an elongate tube, from which cleaning fluid is let out, is introduced into one of the longitudinal channels, the relative movement being achieved substantially through moving of the carrier.

Abstract: A substrate cleaning apparatus for cleaning a substrate is provided. The apparatus includes a cleaning bath in which a substrate holder holding a substrate is disposed in a vertical position, the substrate holder having a sealing member contacting a periphery of a surface of the substrate to seal a gap between the substrate and the substrate holder, and cleaning nozzles each configured to supply a jet of cleaning water to the substrate holder. The cleaning nozzles are disposed in the cleaning bath and arranged concentrically with a contact portion of the substrate surface contacting the sealing member and located at such positions that the jet of cleaning water impinges on the contact portion or its vicinity in an upper half of the substrate.

Abstract: In a method of manufacturing a disk drive device, a cleaning process and an assembly process are performed in succession in a clean room having a predetermined cleanness level. The cleaning process includes an alkali cleaning process, a first purified water cleaning process, a second purified water cleaning process, a spray cleaning process, a draining process and a drying process. In the first purified water cleaning process, purified water ultrasonic wave cleaning is sequentially performed on the base member of the disk drive device to be cleaned by using ultrasonic waves of frequencies of 40 kHz, 68 kHz and 132 kHz in purified water filled in a first purified water cleaning tank. The cleaned base member and other components having a predetermined cleanness level are assembled in the assembly process continuous from the cleaning process.

Abstract: A cleaning and drying-preventing method including: positioning a nozzle in a container such that a funnel-like inner circumferential surface of the container is located around a periphery of a distal end of the nozzle; sucking a liquid in the nozzle to retract a level of the liquid to a side of a supply passage; supplying a solvent into the container to form a swirl flow of the solvent turning around the distal end of the nozzle, and cleaning the nozzle by the swirl flow; supplying a solvent into the container to form a liquid pool of the solvent; and further retracting the level of the liquid in the nozzle to the side of the supply passage. A liquid layer, an air layer, and a solvent layer are formed in the nozzle in this order from the side of the supply passage, to prevent drying of the liquid in the nozzle.

Abstract: Low-VOC cleaning compositions effective in removing stubborn UV inks from printing-press components include at least one non-ionic surfactant selected from the group consisting of a sorbitan ester, an ethoxylated sorbitan ester, an ethoxylated castor oil, polyethylene glycol ester and an alcohol ethoxylate; and at least one carrier comprising or consisting essentially of at least one of (i) an organic solvent miscible therewith or (ii) D-limonene. The cleaning composition has a VOC limit less than 100 g/L.

Abstract: A heat transfer composition comprising trans-1,3,3,3-tetrafluoropropene (R-1234ze(E)), difluoromethane (R-32) and 1,1-difluoroethane (R-152a).

Abstract: A method for cleaning a filtering membrane, contaminated by contaminants including inorganic and organic materials during a fluid-filtering process, is disclosed, the method comprises cleaning the filtering membrane by using a first cleaning solution of pH 6˜9 so as to remove the organic material from the filtering membrane; and cleaning the filtering membrane by using a second acid cleaning solution so as to remove the inorganic material from the filtering membrane, wherein the cleaning method of the present invention uses the first cleaning solution having pH 6˜9 instead of a strong-alkaline cleaning solution so as to prevent the filtering membrane from being damaged, and also uses the cleaning solution maintained at a relatively low temperature instead of hot water so as to improve economical efficiency by reduction of energy consumption.

Abstract: The invention is directed at systems and methods which provide for effective cleaning and drying of vehicles of different shapes and sizes. The invention in one example includes a vehicle washing apparatus comprising a conveyor system to move a vehicle along a path, and a bridge assembly supported above a vehicle and moveable along the length thereof. At least one trolley assembly is operatively supported by the bridge assembly and is moveable in a direction generally transverse to the movement of the bridge assembly. At least one cleaning arm assembly for delivering cleaning fluid to or for brushing the surface of a vehicle is operatively supported by the at least one trolley assembly or bridge.

Abstract: Systems and methods for aligning wafers within wafer processing equipment. In a first embodiment, a wafer alignment nozzle comprises a fixed cylindrical member. A moveable cylindrical member is disposed with the fixed cylindrical member in a sliding fit. The moveable cylindrical member comprises a plurality of angled fluid orifices for directing a plurality of streams of the fluid onto a surface of the wafer.

Abstract: The present application provides a water wash system for use with a compressor of a gas turbine engine. The water wash system may include a number of spray nozzles in communication with the compressor, a heat recovery steam generator, a flow of heating water from the heat recovery steam generator, and a tap off line in communication with the flow of heating water and the spray nozzles so as to deliver the flow of heating water to the compressor.

Abstract: A method for an automated self-cleaning of a continuous dishwasher for items to be cleaned with at least one rinsing zone, at least one clear rinsing zone and also a transporter. Items to be cleaned are conveyed in the direction of transportation via the transporter. The continuous dishwasher comprises at least one fine filter with a back-rinser on at least one storage tank and also at least one device for emptying each of the storage tanks. The continuous dishwasher automatically carries out a self-cleaning cycle in which cleaning liquid located in each of the storage tanks is used several times in succession in the various zones for cleaning thereof. The cleaning liquid is circulated by means of circulating pumps in the respective storage tanks and supplied to spraying systems, which are already present in the respective zones, or to separate nozzles or nozzle heads for wetting the inner side of the faces delimiting the respective zone.

Abstract: The present invention discloses a method of washing ware, in particular in an automatic domestic or institutional ware washing machine, using a detergent composition containing a cationic starch. This eliminates the need for a surfactant in the rinse step. The cationic starch provides a layer of cationic starch on the ware so as to afford a sheeting action in an aqueous rinse step without any added rinse agent.

Abstract: Disclosed is a method for drying a plate-like article; the method including rinsing with an aqueous rinsing liquid with subsequent rinsing with an organic solvent, wherein the organic solvent has a water content of below 20 mass-% wherein the organic solvent is supplied at a solvent temperature, which is at least 30° C. and not higher than 60° C.

Abstract: The invention relates to a method of cleaning and/or sterilization of an object provided in a hermetically sealed enclosure, providing a pressure difference between an internal volume of the enclosure and surroundings and generating a plasma solely inside the enclosure for said cleaning and/or sterilization of the object. The invention further relates to an apparatus for enabling the same. The apparatus 10 comprises a vacuum chamber 1, which can be evacuated using a vacuum pump 2, and a source 3 arranged to generate plasma of a suitable gas in an enclosure 8, which is substantially hermetically closed with respect to the atmosphere of the vacuum chamber. The enclosure 8 may be of a flexible type or may be manufactured from a rigid material. In case when the enclosure is rigid the pressure inside the enclosure may be lower than an outside pressure.

Abstract: A process for quickly removing hydrocarbon contaminants and noxious gases in a safe and effective manner from catalytic reactors, other media packed process vessels and associated equipment in the vapor phase without using steam. The cleaning agent contains one or more solvents, such as terpenes or other organic solvents. The cleaning agent is injected into contaminated equipment, along with a carrier gas, in the form of a cleaning vapor.

Abstract: A method for cleaning a shopping cart includes urging the shopping cart up a ramp and into an interior of a wash chamber of a shopping cart cleaner. A main door leading into said interior of the wash chamber may be closed. A cleaning mode of the shopping cart cleaner may be selected from either an automatic cleaning mode or a manual cleaning mode. A sump that is disposed at a bottom of the wash chamber may be filled with a quantity of water. The shopping cart may be washed with the water and a wash detergent. The shopping cart may be rinsed with the water and a rinse chemical. The water may be drained from the sump. The main door may be opened. The shopping cart may be removed from the wash chamber.

Abstract: A method for cleaning a bell cup after its removal from a rotary paint atomizer. A device is provided that preferably includes an enclosure within which the bell cup is retained during the cleaning operation. Pressurized cleaning fluid is introduced into the enclosure where it flows over the bell cup and removes paint therefrom. The enclosure may be connected to the nozzle end of a paint spray gun that can be used to deliver the pressurized cleaning fluid thereto.

Abstract: Apparatuses, systems, and methods to clean a paint roller are disclosed. Such apparatuses and systems include a housing with an outlet; a handle connected to housing; an adapter disposed on an end portion of the handle; a nozzle disposed inside the handle; an idler attached to an inside surface of the housing; and a slot disposed on the housing on a location substantially opposite to the location of the inside surface of the housing where the idler is attached, wherein the idler is configured to support a paint roller cover to be cleaned and the slot is configured to receive a first portion of a paint roller frame configured to support the paint roller cover so as to dispose the paint roller cover substantially in front of the cleaning fluid jet.

Abstract: Methods for use of select organic compounds for the activation and stabilization of thermally labile enzymes, including proteases, are disclosed. The invention further relates to compositions of certain organic compounds with enzymes to enable the use of such enzymes at high temperature conditions, such as for warewash temperatures and conditions. In particular, organic activator-stabilizers including heat-deactivated proteases and zwitterionic materials are combined with enzymes according to the invention. As a result, the invention provides enzyme cleaning efficacy for various high temperature conditions, including warewash applications.

Abstract: Disclosed is a supercritical processing apparatus and a supercritical processing method for suppressing the pattern collapse or the injection of material constituting a processing liquid into a substrate. A processing chamber receives a substrate subjected to a processing with supercritical fluid, and a liquid supply unit supplies a processing liquid including a fluorine compound to the processing chamber. A liquid discharge unit discharges the supercritical fluid from the processing chamber, a pyrolysis ingredient removing unit removes an ingredient facilitating the pyrolysis of a liquid from the processing chamber or from the liquid supplied from the liquid supply unit, and a to heating unit heats the processing liquid including a fluorine compound of hydrofluoro ether or hydrofluoro carbon.

Abstract: Disclosed are methods and apparatus for cleaning heat exchangers and similar vessels by introducing chemical cleaning solutions and/or solvents while maintaining a target temperature range by direct steam injection into the cleaning solution. The steam may be injected directly into the heat exchanger or into a temporary side stream loop for recirculating the cleaning solution or admixed with fluids being injected to the heat exchanger. The disclosed methods are suitable for removing metallic oxides from a heat exchanger under chemically reducing conditions or metallic species such as copper under chemically oxidizing conditions. In order to further enhance the heat transfer efficiency of heating cleaning solvents by direct steam injection, mixing on the secondary side of the heat exchanger can be enhanced by gas sparging or by transferring liquid between heat exchangers when more than one heat exchanger is being cleaned at the same time.

Abstract: Several methods of removing contaminant particles from a surface of a substrate are disclosed herein. In one embodiment, the method includes directing an incompressible fluid spray onto a surface of a substrate to remove contaminant particles from the surface. In an embodiment, the surface of the substrate and the nozzle are both immersed in an incompressible fluid. The fluid can flow across the surface of the substrate to remove the contaminant particles from the area. The fluid spray can be positioned normal to the substrate surface, or can be positioned at an angle relative to the substrate surface.

Abstract: A conveyor dishwasher (2) has a control apparatus (50) for automatically setting the quantity of final rinse liquid sprayed in the final rinse zone (18) per unit time as a function of the conveying speed and/or as a function of the type of washware conveyed through the final rinse zone (18). A rinse aid metering apparatus (57) is also provided which is designed to add in a metered fashion a constant quantity of rinse aid per unit time to the fresh water provided for final rinsing purposes independently of the quantity of final rinse liquid sprayed in the final rinse zone (18) per unit time.

Abstract: An instrument reprocessor is disclosed. The instrument reprocessor includes a basin having a rim located in an inclined plane forming an acute angle with respect to a horizontal plane. At least one nozzle is disposed in a plane substantially parallel to the inclined plane. The at least one nozzle is configured to discharge a stream into the basin in a direction substantially parallel to the inclined plane. A lid assembly is also disclosed. The lid assembly may cover the basin in a close configuration.

Abstract: A method and apparatus for wetting the surface of a workpiece is disclosed. The apparatus includes a chamber with a vacuum port and a fluid port and a workpiece holder including a body, a ring, and a port. The body includes a surface and defines a cavity extending from the surface. The ring is adapted to retain the workpiece on the surface of body over the cavity. The ring forms a fluid seal relative to the workpiece and to the workpiece holder. The port is defined in the body and in communication with the cavity. The port affects pressure in the cavity to minimize a pressure differential between the front and back surfaces of the workpiece. The fluid port is in communication with the chamber. The fluid port delivers a fluid (e.g., a substantially degassed fluid) to wet the front surface of the workpiece during operation of the chamber at a reduced pressure relative to atmosphere.

Abstract: A vehicle maintenance system is disclosed having a power unit, a pump, a foam generator, an air compressor, first and second fluid tanks, a hose reel assembly, a wash gun assembly and a support member.

Abstract: Provided is a method and apparatus for cleaning a photomask. The photomask including a first region and a second region surrounding the first region, a pattern to be protected disposed on the first region, and a material to be removed exists on the second region. A cleaning liquid is sprayed from an inside region of the second region toward an outer region of the second region to remove the material, and a gas is blown from the first region toward the second region to protect the pattern.

Abstract: The invention relates to a method for removing at least part of at least one layer of a composite coating that is formed of fibers and at least one resin that is present on the surface of the body of a gas cartridge. In said method, at least one liquid nitrogen stream is dispensed at a temperature less than ?100 DEG C at a pressure of at least 00 bars upon contact with said coating so as to remove at least part of said coating layer present on the body of the gas cartridge.

Abstract: The present disclosure provides a method and apparatus for cleaning a semiconductor wafer. In an embodiment of the method, a single wafer cleaning apparatus is provided and a wafer is positioned in the apparatus. A first chemical spray is dispensed onto a front surface of the wafer. A back surface of the wafer is cleaned while dispensing the first chemical spray. The cleaning of the back surface may include a brush and spray of cleaning fluids. An apparatus operable to clean the front surface and the back surface of a single semiconductor wafer is also described.

Abstract: A cleaning device for cleaning respirators, in particular breathing regulators and/or breathing masks, is proposed. The cleaning device comprises at least one cleaning chamber for receiving at least one respirator. The cleaning device also has at least one fluid device for applying at least one cleaning fluid to the respirator. The cleaning device also has at least one pressure application device with at least one pressure connection. The pressure connection can be connected to at least one gas carrying element of the respirator. The pressure application device is set up for applying pressurized gas to the gas carrying element.

Abstract: A method for cleaning the surface of a silicon substrate, covered by a layer of silicon oxide includes: a) exposing the surface for 60 to 900 seconds to a radiofrequency plasma, generated from a fluorinated gas, to strip the silicon oxide layer and induce the adsorption of fluorinated elements on the substrate surface, the power density generated using the plasma being 10 mW/cm2 to 350 mW/cm2, the fluorinated gas pressure being 10 mTorrs to 200 mTorrs, and the substrate temperature being lower than or equal to 300° C.; and b) exposing the surface including the fluorinated elements for 5 to 120 seconds to a hydrogen radiofrequency plasma, to remove the fluorinated elements from the substrate surface, the power density generated using the plasma being 10 mW/cm2 to 350 mW/cm2, the hydrogen pressure being 10 mTorrs to 1 Torr, and the substrate temperature being lower than or equal to 300° C.

Abstract: A method of cleaning equipment such as heat exchangers, evaporators, tanks and other industrial equipment using clean-in-place procedures and a pre-treatment solution prior to the conventional CIP cleaning process. The pre-treatment step improves the degree of softening of the soil, and thus facilitates its removal. The pre-treatment solution can be a strong acidic solution, a strong alkaline solution, or comprise a penetrant. A preferred strong acidic solution is an acid peroxide solution. In some embodiments, the pre-treatment may include no strong alkali or acid ingredient; rather, the penetrant provides acceptable levels of pre-treatment.

Abstract: Disclosed are a liquid processing apparatus and a liquid processing method. The liquid processing apparatus includes an ejection port ejecting a first liquid to a wafer, a first liquid supply mechanism supplying sulphuric acid to the ejection port, and a second liquid supply mechanism supplying hydrogen peroxide solution to the ejection port. The first liquid supply mechanism includes a first temperature adjustment mechanism maintaining the first liquid heated to a first temperature, a second temperature adjustment mechanism connected to the first temperature adjustment mechanism, and an ejection line connecting the second temperature adjustment mechanism with the ejection port. The second temperature adjustment mechanism includes a second circulation line and a second heater. The ejection line connects the second circulation line through a switching valve at a location further downstream than the second heater.

Abstract: A vacuum processing apparatus includes a vacuum chamber for performing a plasma process and a cleaning process unit for performing a cleaning process to apply a plasma process to a wafer on which a single layer or a laminated film containing a metallic film is formed by using a corrosive gas, and a control unit having a sequence to abort the plasma process when an abnormality occurs in the vacuum chamber and transfer the wafer subjecting to the aborting of the plasma process to the cleaning process unit, after elapsing a predetermined time, to perform the cleaning process.

Abstract: Inventive methods, systems and compositions of cleaning integrated circuit (“IC”) substrates are described. The cleaning methods of the present invention include: charging a solution, which contains at least a solute selected to promote cleaning of the IC substrate, to produce a charged solution, such that at least a portion of the solute is present as clusters in the charged solution; and conveying the charged solution for cleaning the IC substrate. The cleaning systems of the present invention include: a charging chamber for holding a solution, which contains at least a solute selected to promote cleaning of the integrated circuit substrate; and a first acoustic energy source capable of vibrating the solution in the charging chamber to produce a charged solution such that at least a portion of the solute is present as clusters in the charged solution.

Abstract: A method for cleaning a semiconductor wafer composed of silicon directly after a process of chemical mechanical polishing of the semiconductor wafer includes transferring the semiconductor wafer from a polishing plate to a first cleaning module and spraying both side surfaces of the semiconductor wafer with water at a pressure no greater than 1000 Pa at least once while transferring the semiconductor wafer. The semiconductor wafer is then cleaned between rotating rollers with water. The side surfaces of the semiconductor wafer are sprayed with an aqueous solution containing hydrogen fluoride and a surfactant at a pressure no greater than 70,000 Pa. Subsequently, the side surfaces are sprayed with water at a pressure no greater than 20,000 Pa. The wafer is then dipped into an aqueous alkaline cleaning solution, and then cleaned between rotating rollers with a supply of water. The semiconductor wafer is then sprayed with water and dried.

Abstract: According to one embodiment, a supercritical drying method comprises cleaning a semiconductor substrate with a chemical solution, rinsing the semiconductor substrate with pure water after the cleaning, changing a liquid covering a surface of the semiconductor substrate from the pure water to alcohol by supplying the alcohol to the surface after the rinsing, guiding the semiconductor substrate having the surface wetted with the alcohol into a chamber, discharging oxygen from the chamber by supplying an inert gas into the chamber, putting the alcohol into a supercritical state by increasing temperature in the chamber to a critical temperature of the alcohol or higher after the discharge of the oxygen, and discharging the alcohol from the chamber by lowering pressure in the chamber and changing the alcohol from the supercritical state to a gaseous state. The chamber contains SUS. An inner wall face of the chamber is subjected to electrolytic polishing.

Abstract: Embodiments of the present invention generally relate to a method and apparatus for ex-situ cleaning of a chamber component part. In one embodiment, a system for cleaning component parts in a cleaning chemistry is provided. The system comprises a wet bench set-up comprising a cleaning vessel assembly for holding one or more component parts to be cleaned during a cleaning process and a detachable cleaning cart detachably coupled with the cleaning vessel assembly for supplying one or more cleaning chemistries to the cleaning vessel assembly during the cleaning process.

Abstract: A cleaning method is provided for brush cleaning a surface of a substrate. The method comprises scrubbing a first surface of the substrate with a brush having a first surface geometry; and then scrubbing the first surface of the substrate with a brush having a second surface geometry, wherein the first and the second surface geometries are different. Numerous other aspects are provided.

Abstract: Disclosed herein are devices, methods and systems for ex-situ component recovery. The ex-situ recovery can be performed by desorbing or outgassing components of a processing system in a recovery system, rather than in the processing system itself. The recovery system can include a docking station and/or a heated vacuum chamber. The heated vacuum chamber can be used to desorb or outgas components that will be located inside the processing system, while the docking station can be used to desorb or outgas components that will be connected to the processing system. The processing system components can be placed under pressure by the recovery system to desorb or outgas contaminants and remove virtual leaks. The recovery system pressure can include a vacuum roughing pump, a turbomolecular pump, and/or a cryogenic pump to apply a pressure necessary to desorb or outgas the components.

Abstract: A process is provided for removing polymeric fouling on process equipment surfaces to restore the efficiency of such equipment. This is accomplished by contacting the fouled equipment with a solvent comprising at least one non-aromatic hydrocarbon compound, or a mixture of one or more non-aromatic organic compounds and one or more aromatic hydrocarbon compounds, for a period of time sufficient to remove the polymeric fouling.

Abstract: A method and apparatus for providing multiple spray zones to different subportions of a silverware basket within the wash chamber of a dishwasher.