Including Forming A Solidified Or Hardened Coating For Cleaning Patents (Class 134/4)
  • Patent number: 10792904
    Abstract: A method for bonding a first component to a second component includes placing the first and second components in a cavity. Each of the first and second components has a bonding portion, and the bonding portion of the first component faces the bonding portion of the second component. A supercritical fluid is then introduced into the cavity with a temperature of 40-400° C. and a pressure of 1,500-100,000 psi, and a pressure of 4-100,000 psi is applied on both the first and second components, assuring the bonding portion of the first component bond to the bonding portion of the second component. Moreover, a method for separating a first component from a second component includes placing a composite in a cavity. The composite includes the first component, the second component and a connecting layer by which the first component joins to the second component. The supercritical is then introduced into the cavity.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: October 6, 2020
    Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
    Inventors: Ting-Chang Chang, Chih-Cheng Shih, Ming-Hui Wang, Wen-Chung Chen, Chih-Yang Lin
  • Patent number: 10774292
    Abstract: The present disclosure relates to compositions and methods of using the compositions for treating a floor surface. The disclosed compositions clean the floor surface, repair damage, or maintain the original look of the floor. The disclosed compositions also do not provide a permanent finish on the floor, are temporary coatings, or do not significantly change the gloss of the floor after application.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: September 15, 2020
    Assignee: Ecolab USA Inc.
    Inventors: Brian Robert Leafblad, Grant Daniel Lindh, Avila M. Hoffman, Traci Lynn Gioino, Dale Curtis Larson
  • Patent number: 10720342
    Abstract: A substrate processing of the present invention includes a supplying unit which supplies a process liquid containing a sublimable substance in a molten state to the pattern-formed surface of a substrate, a solidifying unit which solidifies the process liquid on the pattern-formed surface so as to form a solidified body and a sublimating unit which sublimes the solidified body so as to remove the solidified body from the pattern-formed surface, and the vapor pressure of the process liquid at a temperature of 20 to 25° C. is equal to or more than 5 kPa, and the surface tension thereof at a temperature of 20 to 25° C. is equal to or less than 25 mN/m.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: July 21, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yuta Sasaki, Yosuke Hanawa
  • Patent number: 10711228
    Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a support member which supports a substrate; a treatment liquid discharging member which discharges a treatment liquid containing a monomeric substance to the substrate located in the support member; and a light irradiator which irradiates light to the treatment liquid discharged to the substrate.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 14, 2020
    Assignee: SEMES CO., LTD.
    Inventors: Mong-Ryong Lee, Miyoung Jo, Yerim Yeon, Anton Koriakin
  • Patent number: 10549312
    Abstract: In one embodiment, a spin coating apparatus includes a coating liquid feeding module to drop a coating liquid onto a substrate, and a motor to rotate the substrate. The module drops a first drop amount of the coating liquid onto the substrate at a first discharge rate, while the motor rotates the substrate at a first number of rotations. The module drops a second drop amount of the coating liquid onto the substrate at a second discharge rate larger than the first discharge rate, while the motor rotates the substrate at a second number of rotations smaller than the first number of rotations, after the first drop amount of the coating liquid is dropped. The module discharges the coating liquid onto the substrate at a third discharge rate smaller than the second discharge rate, after the coating liquid is discharged onto the substrate at the second discharge rate.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: February 4, 2020
    Assignee: Toshiba Memory Corporation
    Inventor: Keisuke Nakazawa
  • Patent number: 10199209
    Abstract: In one embodiment, a substrate treatment apparatus includes cleaning and rinse modules configured to clean and rinse a surface of a substrate provided with a pattern, and a solidifying agent containing liquid supplying module configured to supply a solidifying agent containing liquid that contains a solidifying agent to the cleaned and rinsed surface of the substrate. The apparatus further includes a precipitation module configured to precipitate the solidifying agent as solid on the surface of the substrate, and a decomposition module configured to decompose and gasify the solid to remove the solid from the surface of the substrate. The solidifying agent contains an ammonium salt, and the ammonium salt contains an ammonium ion or an ion having a structure in which at least one of four hydrogen atoms of an ammonium ion is substituted with another atom or atom group.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: February 5, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Tomohiko Sugita, Katsuhiro Sato, Hiroyasu Iimori, Yoshihiro Ogawa
  • Patent number: 9799539
    Abstract: In an apparatus for treating a wafer-shaped article, a spin chuck is provided for holding and rotating a wafer-shaped article. A liquid dispenser comprises a check valve positioned so as to prevent process liquid from dripping out of a discharge nozzle of the liquid dispenser. A valve seat of the check valve is at a distance in a range of 20 mm to 100 mm from an outlet opening of said discharge nozzle.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: October 24, 2017
    Assignee: LAM RESEARCH AG
    Inventor: Francisco Camargo
  • Patent number: 9704730
    Abstract: A cleaning liquid and a gas are discharged in sequence to a central portion of a substrate while the substrate is being rotated, and after nozzles that discharge them are moved to a peripheral edge side of the substrate, discharge of the cleaning liquid is switched to a second cleaning liquid nozzle set at a position deviated from a movement locus of the first cleaning liquid nozzle. Both of the nozzles are moved toward the peripheral edge side of the substrate while discharging the cleaning liquid and discharging the gas so that a difference between a distance from the discharge position of the second cleaning liquid nozzle to the central portion of the substrate and a distance from the discharge position of the gas nozzle to the central portion of the substrate gradually decreases.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: July 11, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Atsushi Ookouchi, Kousuke Yoshihara, Hiroshi Ichinomiya, Hirosi Nisihata
  • Patent number: 9685330
    Abstract: Methods for manufacturing semiconductor devices are disclosed. A photoresist layer is formed over a substrate. A cryogenic process is performed on the photoresist layer. After the cryogenic process, a cleaning process is performed on the photoresist layer to remove the photoresist layer.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: June 20, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuo-Sheng Chuang, You-Hua Chou
  • Patent number: 9570326
    Abstract: A substrate cleaning method includes: a first step in which a cleaning liquid is ejected from a nozzle N2 to a central portion of a wafer W; a second step in which a dry gas is ejected from a nozzle N3 to the central portion of the wafer W to form a dry area; a third step in which the cleaning liquid is ejected from the nozzle N2 while the nozzle N2 is moved from a central side of the wafer W to a peripheral side thereof; a fourth step in which a width of an intermediate area generated between a wet area and the dry area is acquired; and a fifth step in which, when the width of the intermediate area exceeds a predetermined threshold value, a process parameter is changed such that the width of the intermediate area becomes the threshold value or less.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: February 14, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Ryoichi Uemura, Yasushi Takiguchi
  • Patent number: 9514954
    Abstract: Methods and apparatus for treating an organic film such as photoresist with a hydroxyl-generating compound prior to removing the organic film from a substrate are provided. Treatments include exposure to one or more of hydrogen peroxide vapor and water vapor in a non-plasma environment. In some implementations, conditions are such that condensation on the surface is suppressed. Methods include treating high-dose ion-implantation photoresists and post-plasma doping photoresists with little or no material loss and permit mild plasma removal of the photoresist after treatment.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: December 6, 2016
    Assignee: Lam Research Corporation
    Inventors: Bayu Atmaja Thedjoisworo, Bradley Jon Jacobs, Ivan Berry, David Cheung
  • Patent number: 9272313
    Abstract: The disclosure relates to the cleaning of oilfield tools made of metal, particularly to the method of reclamation oilfield tools, already used in the mechanical deep-pumping extraction of oil, as well as to the product made with the help of the mentioned method. The method of remanufacturing of standard length rods includes cleaning the rod with at least one cryogen to eliminate environmental contamination and to assist in workplace safety.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: March 1, 2016
    Assignee: TRC Services, Inc.
    Inventor: Lonnie Dale White
  • Patent number: 9159593
    Abstract: Apparatus and methods for removing particle contaminants from a solid surface includes providing a layer of a viscoelastic material on the solid surface. The viscoelastic material is applied as a thin film and exhibits substantial liquid-like characteristics. The viscoelastic material at least partially binds with the particle contaminants. A high velocity liquid is applied to the viscoelastic material, such that the viscoelastic material exhibits solid-like behavior. The viscoelastic material is thus dislodged from the solid surface along with the particle contaminants, thereby cleaning the solid surface of the particle contaminants.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: October 13, 2015
    Assignee: Lam Research Corporation
    Inventors: Mark Naoshi Kawaguchi, David Mui, Mark Wilcoxson
  • Patent number: 9126230
    Abstract: A method and an apparatus using aqueous fixatives for fogging of ventilation ductwork, enclosures, or buildings containing dust, lint, and particulates that may be contaminated by radionuclides and other dangerous or unsafe particulate contaminants, which method and apparatus are capable of (1) obtaining full coverage within the ductwork and (2) penetrating and fixing the lint, dust and large particles present in the ductwork so that no airborne particles are released during or after the application of the fixative. New aqueous fogging solutions outperform conventional glycerin-based solutions. These aqueous solutions will fog using conventional methods of application and contain a surfactant to aid wetting and penetration of the lint and dust, a binder to stabilize loose or respirable particles, and an agent to aid in fogging and enhance adhesiveness. The solutions are safe and easy to use.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: September 8, 2015
    Assignee: Vista Engineering Technologies, Inc.
    Inventors: Joseph W. Maresca, Jr., Lori M. Kostelnik, James R. Kriskivich, Rick L. Demmer, Julia L. Tripp
  • Patent number: 9109188
    Abstract: A semiconductor wafer cleaning formulation, including 1-35% wt. fluoride source, 20-60% wt. organic amine(s), 0.1-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an imine, 20-50% wt. water, and 0-21% wt. metal chelating agent(s). The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: August 18, 2015
    Assignee: ADVANCED TECHNOLOGY MATERIALS, INC.
    Inventors: William A. Wojtczak, Ma. Fatima Seijo, David Bernhard, Long Nguyen
  • Publication number: 20150128994
    Abstract: A method for cleaning a substrate includes supplying to a substrate a film-forming processing liquid which includes a volatile component and forms a film on the substrate, vaporizing the volatile component in the film-forming processing liquid such that the film-forming processing liquid solidifies or cures on the substrate and forms a processing film on the substrate, supplying to the substrate having the processing film a strip-processing liquid which strips the processing film from the substrate, and supplying to the processing film formed on the substrate a dissolving-processing liquid which dissolves the processing film after the supplying of the strip-processing liquid.
    Type: Application
    Filed: November 12, 2014
    Publication date: May 14, 2015
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Miyako KANEKO, Keiji TANOUCHI, Takehiko ORII, Itaru KANNO, Meitoku AIBARA, Satoru TANAKA
  • Publication number: 20150128995
    Abstract: A method for cleaning a substrate, includes supplying to a substrate having a hydrophilic surface a film-forming processing liquid which includes a volatile component and forms a film on the substrate, vaporizing the volatile component in the film-forming processing liquid such that the film-forming processing liquid solidifies or cures on the substrate and forms a processing film on the hydrophilic surface of the substrate, and supplying to the substrate having the processing film a strip-processing liquid for stripping the processing film from the substrate.
    Type: Application
    Filed: November 12, 2014
    Publication date: May 14, 2015
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Miyako KANEKO, Keiji Tanouchi, Takehiko Orii, Itaru Kanno
  • Patent number: 9017487
    Abstract: A method for cleaning a deposition chamber includes forming a deposited layer over an interior surface of the deposition chamber, wherein the deposited layer has a deposited layer stress and a deposited layer modulus; forming a cleaning layer over the deposited layer, wherein a material comprising the cleaning layer is selected such that the cleaning layer adheres to the deposited layer, and has a cleaning layer stress and a cleaning layer modulus, wherein the cleaning layer stress is higher than the deposited layer stress, and wherein the cleaning layer modulus is higher than the deposited layer modulus; and removing the deposited layer and the cleaning layer from the interior of the deposition chamber.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: April 28, 2015
    Assignee: International Business Machines Corporation
    Inventors: Tien-Jen J. Cheng, Zhengwen Li, Keith Kwong Hon Wong
  • Patent number: 9017486
    Abstract: A method for cleaning a deposition chamber includes forming a deposited layer over an interior surface of the deposition chamber, wherein the deposited layer has a deposited layer stress and a deposited layer modulus; forming a cleaning layer over the deposited layer, wherein a material comprising the cleaning layer is selected such that the cleaning layer adheres to the deposited layer, and has a cleaning layer stress and a cleaning layer modulus, wherein the cleaning layer stress is higher than the deposited layer stress, and wherein the cleaning layer modulus is higher than the deposited layer modulus; and removing the deposited layer and the cleaning layer from the interior of the deposition chamber.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: April 28, 2015
    Assignee: International Business Machines Corporation
    Inventors: Tien-Jen Cheng, Zhengwen Li, Keith Kwong Hon Wong
  • Publication number: 20150056460
    Abstract: The present invention relates to a protein/peptide composition for protection of surfaces comprising an aqueous solution of at least two components, the first component (A) being a water-soluble protein or a mixture of water-soluble proteins having an average molecular weight Mw of at least 30000, and being capable of forming a gel, and the second component (B) being a water-soluble peptide or a mixture of water-soluble peptides mixture having an average molecular weight of 200-10000, and being capable of inhibiting gel formation in said composition. The present invention further relates to a method for preparing such a composition, the use of the composition for protecting a surface, a method for protecting a substrate surface using the composition, and to a substrate surface coated with the composition.
    Type: Application
    Filed: March 11, 2013
    Publication date: February 26, 2015
    Inventor: Sigfrid Svensson
  • Patent number: 8940099
    Abstract: A reflow oven includes a chamber housing including surfaces that are in contact with heated air mixed with contaminants, including flux, and a water-soluble layer selectively applied to the surfaces of the chamber housing. Embodiments of the reflow oven include an acrylic-based layer, such as an acrylic paint. In one embodiment, the acrylic paint includes a water-soluble polymer, a polymer emulsion, and water. The water-soluble polymer includes butyl benzyl phthalate. In some embodiments, the acrylic paint includes 1-10% by weight butyl benzyl phthalate, 30-55% by weight acrylic polymer emulsion, and balance water. In a certain embodiment, the acrylic paint includes 1-5% by weight butyl benzyl phthalate, 35-50% by weight acrylic poly emulsion, and balance water. Methods of treating surfaces of the reflow oven are further disclosed.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: January 27, 2015
    Assignee: Illinois Tool Works Inc.
    Inventors: Douglas Ngai, Joo Yong Tay, Wen-Feng Liu, Roberto P. Loera, Steven Dwade Cook
  • Patent number: 8940101
    Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus includes a first chamber through which a substrate is conveyed, a second chamber where an oxide film formed on the substrate conveyed from the first chamber is removed; and a third chamber that discharges the substrate conveyed from the second chamber to the outside after rinsing the substrate, wherein the first chamber and the third chamber are disposed on top and on bottom.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: January 27, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Beung-Hwa Jeong, Kwang-Nam Kim, Gyoo-Chul Jo
  • Publication number: 20150020849
    Abstract: Compositions and methods of removing particulate matter from a surface. An example comprises contacting a kneadable dust removal composition with the surface so that the particulate matter adheres or becomes embedded within the composition, and is removed from the surface with the dust removal composition. Preferably the dust removal composition comprises a polymerized siloxane, more preferably a substituted polymerized siloxane, even more preferably, a non-cross-linked, linear polymerized siloxane. In other embodiments the invention comprises a kneadable dust removal composition, preferably comprising a polymerized siloxane. The dust removal composition may be packaged to be attachable to a broom, sweeper, or mop so that it make used to pick up residue from sweeping, brushing or mopping. In other embodiments the dust removal composition may be packaged in a “twist-up” or other similar package permitting the composition to be extruded or advanced to expose a fresh surface.
    Type: Application
    Filed: July 17, 2013
    Publication date: January 22, 2015
    Inventor: James Jefferies Harrison
  • Publication number: 20150020850
    Abstract: A substrate processing apparatus comprises: a liquid film former which forms a liquid film by supplying a liquid on an upper surface of the substrate W held horizontally; a cooling gas discharge nozzle which discharges cooling gas of a temperature lower than a freezing point of the liquid forming the liquid film to the liquid film; a thawing liquid discharge nozzle which discharges a thawing liquid to a frozen film formed by freezing the liquid film; a thawing liquid supplier which supplies the heated thawing liquid to the thawing liquid discharge nozzle via a pipe; and a receiver which receives the cooling gas and the thawing liquid respectively discharged from the cooling gas discharge nozzle and the thawing liquid discharge nozzle at the respective retracted position and guides the cooling gas and the thawing liquid to a common flow passage.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 22, 2015
    Inventors: Masahiko KATO, Katsuhiko MIYA, Hiroyuki YASHIKI
  • Patent number: 8926761
    Abstract: The present invention relates to methods for cleaning semiconductors used in photovoltaic cells and modules, and methods for manufacturing p-n junctions for photovoltaic cells and modules. More particularly, the method comprises providing at least one semiconductor layer of a photovoltaic module and scrubbing the surface of the least one semiconductor layer in the presence of a chemical solution.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: January 6, 2015
    Assignee: First Solar, Inc.
    Inventors: Long Cheng, Jigish Trivedi
  • Publication number: 20150000695
    Abstract: A method for cleaning an interior of a process chamber after performing a process of forming a carbon-containing film on a substrate in the process chamber includes performing a cycle a predetermined number of times. The cycle includes supplying a modifying gas into the process chamber to modify deposits including the carbon-containing film deposited on a surface of a member in the process chamber and supplying an etching gas into the process chamber to remove the modified deposits through a thermochemical reaction.
    Type: Application
    Filed: March 31, 2014
    Publication date: January 1, 2015
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Takaaki NODA, Shingo NOHARA, Yoshiro HIROSE
  • Patent number: 8920568
    Abstract: A method for the dissolution of amorphous dithiazine buildup on a surface is presented. The method consists of treating the dithiazine buildup with a solution of hydrogen peroxide, which reacts and breaks apart the buildup for easy removal.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: December 30, 2014
    Assignee: Baker Hughes Incorporated
    Inventor: Grahame N. Taylor
  • Publication number: 20140373870
    Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film. The liquid chemical contains an agent for forming a water-repellent protecting film, and a solvent. The agent is for provided to form a water-repellent protecting film on a wafer after a cleaning step for the wafer and before a drying step for the wafer, the wafer having at its surface an uneven pattern and containing at least one kind element of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water-repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized in that the agent for forming a water-repellent protecting film is a compound represented by the following general formula [1].
    Type: Application
    Filed: September 5, 2014
    Publication date: December 25, 2014
    Inventors: Takashi SAIO, Soichi KUMON, Masanori SAITO, Shinobu ARATA, Hidehisa NANAI, Yoshinori AKAMATSU
  • Publication number: 20140349022
    Abstract: The cleaning formulation and method uses a polysilazane for superior cleaning and to create a protective coating with “easy clean” properties on numerous surface types, including metals, marine paints and gel-coat surfaces; cleaning and guarding them from the effects of all types of accretions, including two of the most pernicious—ice and diesel exhaust soot. The polysilazane is used with a cyclomethicone solvent, preferably pentacyclomethicone and/or hexacyclomethicone. The preferred method of application is by direct contact and application of the cleaning formulation to the treated surface via a microfiber cloth wrapped around a firm rubber blade or the like.
    Type: Application
    Filed: December 14, 2012
    Publication date: November 27, 2014
    Inventor: Mark NOLDE
  • Patent number: 8882926
    Abstract: A method for removing residual filter cakes that remain adhered to a filter after typical particulate removal methodologies have been employed, such as pulse-jet filter element cleaning, for all cleanable filters used for air pollution control, dust control, or powder control.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: November 11, 2014
    Assignee: Energy & Environmental Research Center Foundation
    Inventors: Jay C. Almlie, Stanley J. Miller
  • Publication number: 20140290692
    Abstract: Embodiments relate to solid nano-particles applied to the surface of well equipment to treat bituminous material adhesion. An embodiment provides a method of treating the surface of well equipment. The method may comprise applying a solid nanoparticle film to the surface of the well equipment with a treatment fluid comprising solid nanoparticles. The method may further comprise allowing the solid nanoparticles to interact with the surface of the well equipment and/or bituminous materials adhered to the surface of the well equipment to remove at least a portion of the bituminous materials from the surface of the well equipment.
    Type: Application
    Filed: March 27, 2013
    Publication date: October 2, 2014
    Applicant: Halliburton Energy Services, Inc.
    Inventors: Lee J. Hall, Philip W. Livanec
  • Patent number: 8846163
    Abstract: A method for removing native oxides from a substrate surface is provided. In one embodiment, the method comprises positioning a substrate having an oxide layer into a processing chamber, exposing the substrate to a gas mixture while forming a volatile film on the substrate and maintaining the substrate at a temperature below 65° C., heating the substrate to a temperature of at least about 75° C. to sublimate the volatile film and remove the oxide layer, and depositing a first layer on the substrate after heating the substrate.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: September 30, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Chien-Teh Kao, Jing-Pei (Connie) Chou, Chiukin (Steven) Lai, Sal Umotoy, Joel M. Huston, Son Trinh, Mei Chang, Xiaoxiong (John) Yuan, Yu Chang, Xinliang Lu, Wei W. Wang, See-Eng Phan
  • Patent number: 8828145
    Abstract: Apparatus and methods for removing particle contaminants from a surface of a substrate includes coating a layer of a viscoelastic material on the surface. The viscoelastic material is coated as a thin film and exhibits substantial liquid-like characteristic. An external force is applied to a first area of the surface coated with the viscoelastic material such that a second area of the surface coated with the viscoelastic material is not substantially subjected to the applied force. The force is applied for a time duration that is shorter than a intrinsic time of the viscoelastic material so as to access solid-like characteristic of the viscoelastic material. The viscoelastic material exhibiting solid-like characteristic interacts at least partially with at least some of the particle contaminants present on the surface.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: September 9, 2014
    Assignee: Lam Research Corporation
    Inventors: Yizhak Sabba, Seokmin Yun, Mark Kawaguchi, Mark Wilcoxson, Dragan Podlesnik
  • Publication number: 20140230846
    Abstract: The present method comprises providing a flexible web substrate (e.g., polymeric flexible web substrates) that forms at least part of a component of a device, coating so as to wet-out on and cover all or a substantial portion of a major surface on one side or both sides of the flexible web substrate with flowable polymeric material, while the flexible web substrate is moving in a down-web direction, and solidifying the polymeric material so as to form one cleaning layer on the major surface of one side or both sides of the flexible web substrate. The present invention can be utilized in a continuous in-line manufacturing process. In applications of the present invention where the flexible web substrate will not form a component of a device, the present invention broadly provides a method for cleaning particles from a flexible web of indefinite length.
    Type: Application
    Filed: May 1, 2014
    Publication date: August 21, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: William R. Dudley, William Blake Kolb, Michael A. Johnson, Stephen A. Johnson, Chris J. Tanley
  • Patent number: 8801860
    Abstract: A method for restoring a vehicle headlight lens by removing contaminants begins with wiping the lens surface of a vehicle headlight clean. An alcohol-saturated cleaning substance is used to remove debris and pollution from the surface. The alcohol is specifically selected to also remove moisture from the surface of the lens to the greatest extent possible. For optimal cleaning conditions the headlight is heated either by illumination or direct sunlight to a temperature of about 70 to 110 degrees Fahrenheit. A lens restoration solution that includes a dissolving chemical compound such as acetone, methyl ethyl ketone, cyclohexanone and/or tetrahydrofuran is applied to the lens surface, either with an applicator or by spraying. After the lens surface has been restored to a smooth, transparent condition, and adequately hardened, a UV protectant is applied to maintain the lens surface.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: August 12, 2014
    Inventor: Thomas M. Wall
  • Publication number: 20140209662
    Abstract: A reflow oven includes a chamber housing including surfaces that are in contact with heated air mixed with contaminants, including flux, and a water-soluble layer selectively applied to the surfaces of the chamber housing. Embodiments of the reflow oven include an acrylic-based layer, such as an acrylic paint. In one embodiment, the acrylic paint includes a water-soluble polymer, a polymer emulsion, and water. The water-soluble polymer includes butyl benzyl phthalate. In some embodiments, the acrylic paint includes 1-10% by weight butyl benzyl phthalate, 30-55% by weight acrylic polymer emulsion, and balance water. In a certain embodiment, the acrylic paint includes 1-5% by weight butyl benzyl phthalate, 35-50% by weight acrylic poly emulsion, and balance water. Methods of treating surfaces of the reflow oven are further disclosed.
    Type: Application
    Filed: September 30, 2013
    Publication date: July 31, 2014
    Applicant: Illinois Tool Works Inc.
    Inventors: Douglas Ngai, Joo Yong Tay, Wen-Feng Liu, Roberto P. Loera, Steven Dwade Cook
  • Patent number: 8778464
    Abstract: The present invention provides a method for removing metal and/or metal oxide contamination from the interior of a vacuum coating reactor, the method comprising the steps of: a) performing an idle coating step by depositing a coating layer, wherein the coating layer comprises silicon; b) at least partly removing the deposited coating layer. The method according to the invention is particularly suitable for cleaning reactors in the context of solar cell manufacturing. The method is time saving and cost saving.
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: July 15, 2014
    Assignee: Tel Solar AG
    Inventors: Paolo Losio, Oliver Kluth, Jiri Kalas
  • Publication number: 20140144464
    Abstract: A method for cleaning a substrate includes supplying a treatment solution which includes a volatile component onto the front surface of a substrate, solidifying or curing the treatment solution through vaporization of the volatile component of the treatment solution such that a treatment film is formed on the entire portion of the front surface of the substrate, treating a different surface of the substrate while the entire portion of the front surface of the substrate is covered with the treatment film, and supplying to the substrate a removal solution which removes the treatment film in the amount sufficient such that the treatment film covering the entire portion of the front surface of the substrate is removed substantially in entirety after the treating of the different surface of the substrate is finished.
    Type: Application
    Filed: September 12, 2013
    Publication date: May 29, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Miyako Kaneko, Takehiko Orii, Itaru Kanno
  • Publication number: 20140144465
    Abstract: A substrate cleaning system has a first processing apparatus including a first holding device for holding a substrate, and a treatment solution supply device for supplying onto the entire portion of the front surface of the substrate a treatment solution which includes a volatile component and solidifies or is cured to form a treatment film, and a second processing apparatus including a second holding device for holding the substrate, and a removal-solution supply device for supplying onto the substrate a removal solution which removes the treatment film formed on the front surface of the substrate after the treatment solution supplied by the treatment solution supply device solidifies or is cured.
    Type: Application
    Filed: September 12, 2013
    Publication date: May 29, 2014
    Applicant: Tokyo Electron Limited
    Inventors: Miyako KANEKO, Takehiko Orii, Itaru Kanno
  • Patent number: 8728244
    Abstract: A method for descaling a metal strip, in which the metal strip is guided in a direction of conveyance through at least two plasma descaling units, in which it is subjected to a plasma descaling, where the plasma descaling is followed directly or indirectly by an operation in which the metal strip is coated with a coating metal by hot dip galvanizing of the metal strip. The metal strip is coated with the coating metal by a vertical passage process. The coating metal is retained as a coating bath in a coating tank by an electromagnetic seal. The metal strip preheated by the plasma descaling is guided, without exposure to air, from the plasma descaling into a protective gas atmosphere of a continuous furnace necessary for the coating.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: May 20, 2014
    Assignee: SMS Siemag Aktiengesellschaft
    Inventors: Holger Behrens, Rolf Brisberger, Klaus Adolf Frommann, Matthias Kretschmer, Rüdiger Zerbe, Evgeny Stepanovich Senokosov, Andrei Evgenievich Senokosov
  • Publication number: 20140083454
    Abstract: Positions on a mold at which foreign matter is present are detected, and adhered position information related to the positions is obtained. Corresponding position information related to positions on a substrate, which are positions that correspond to the positions of the foreign matter when a pattern of protrusions and recesses and a surface of the substrate on which a curable composition is coated face each other and undergo a predetermined positioning operation, is generated based on the adhered position information. At least one droplet of the curable composition is arranged at the positions of the substrate. The pattern of protrusions and recesses is pressed against the surface of the substrate on which the composition is coated while administering the predetermined positioning operation. The curable composition is cured, and the mold is separated from the cured composition. Thereby, foreign matter adhered to molds can be removed efficiently and at low cost.
    Type: Application
    Filed: September 24, 2013
    Publication date: March 27, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Satoshi WAKAMATSU, Tadashi OMATSU
  • Publication number: 20140069458
    Abstract: Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
    Type: Application
    Filed: November 19, 2013
    Publication date: March 13, 2014
    Applicant: Eastman Chemical Company
    Inventors: Michael Wayne Quillen, Dale Edward O'Dell, Zachary Philip Lee, John Cleaon Moore, Edward Enns McEntire, Spencer Erich Hochstetler, Richard Dalton Peters, Rodney Scott Armentrout, Darryl W. Muck
  • Publication number: 20140060575
    Abstract: Provided is a substrate treating method. The substrate treating method may include treating a substrate by using a chemical solution; rinsing the substrate by using pure water after treating the substrate by using the chemical solution; and treating the substrate by using an organic solvent, wherein the substrate treating method further includes coating the substrate with a hydrophobic membrane between the treating of the chemical solution and the treating of the organic solvent.
    Type: Application
    Filed: August 28, 2013
    Publication date: March 6, 2014
    Applicant: SEMES CO. LTD
    Inventors: Kang Suk Lee, Jae Myoung Lee, Bok Kyu Lee, Yong Hee Lee, Jin Bok Lee
  • Publication number: 20140041685
    Abstract: An apparatus for cleaning a substrate includes a cleaning chamber which accommodates a substrate inside the cleaning chamber, a treatment solution supply device which supplies a treatment solution having a volatile component and capable of solidifying or being cured to form a treatment film through vaporization of the volatile component, and a removal solution supply device which supplies a removal solution capable of removing the treatment film formed on a surface of the substrate. The treatment solution supply device supplies the treatment solution on the surface of the substrate set inside the cleaning chamber, and the removal solution supply device supplies the removal solution onto the treatment film formed on the surface of the substrate.
    Type: Application
    Filed: August 7, 2013
    Publication date: February 13, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Miyako KANEKO, Takehiko Orii, Satoru Shimura, Masami Yamashita, Itaru Kanno
  • Patent number: 8623146
    Abstract: A cooling gas discharge nozzle 7 is arranged above an initial position P(Rin) distant from a rotation center P(0) of a substrate W toward the outer edge of the substrate W and supplies a cooling gas to the initial position P(0) of the rotating substrate W to solidify DIW adhering to an initial region including the initial position P(Rin) and the rotation center P(0). Following formation of an initial solidified region FR0, a range to be solidified is spread toward the outer edge of the substrate W and all the DIW (liquid to be solidified) adhering to a substrate surface Wf is solidified to entirely freeze a liquid film LF.
    Type: Grant
    Filed: January 19, 2012
    Date of Patent: January 7, 2014
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Masahiko Kato, Naozumi Fujiwara, Katsuhiko Miya
  • Patent number: 8608857
    Abstract: Methods and apparatus for cleaning a substrate (e.g., wafer) in the fabrication of semiconductor devices utilizing electrorheological (ER) and magnetorheological (MR) fluids to remove contaminant residual particles from a surface of the substrate are provided.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: December 17, 2013
    Assignee: Micron Technology, Inc.
    Inventor: Nishant Sinha
  • Patent number: 8551252
    Abstract: Methods for removing residual particles from a substrate are presented including: receiving the substrate including the residual particles; and functionalizing the residual particles with functionalizing molecules, wherein the functionalizing molecules selectively attach with a surface the residual particles, where the functionalizing molecules impart a changed chemical characteristic to the residual particles, and where the changed chemical characteristic facilitates removal of the residual particles from the substrate. In some embodiments, methods further include: before functionalizing, cleaning the substrate, where the cleaning leaves residual particles adhered with a surface of the substrate, and where the residual particles are hydrophilic; and if the surface of the substrate is hydrophobic, performing the functionalizing.
    Type: Grant
    Filed: April 3, 2008
    Date of Patent: October 8, 2013
    Assignee: Intermolecular, Inc.
    Inventor: Zachary Fresco
  • Patent number: 8530316
    Abstract: A method for fabricating a semiconductor device, the method including growing a first semiconductor structure comprising a first semiconductor material on a surface of a substrate, wherein growing the first semiconductor structure includes forming a semiconductor particle comprising the first semiconductor material on a second semiconductor structure of the semiconductor device. The method further includes forming a protection layer of a second semiconductor material on the first semiconductor structure, wherein forming the protection layer includes forming the protection layer on the semiconductor particle. The method further includes removing a portion of the protection layer, wherein removing the portion of the protection layer includes fully removing the protection layer on the semiconductor particle and the semiconductor particle.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: September 10, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Hung Cheng, Jhi-Cherng Lu, Ming-Hua Yu, Chii-Horng Li, Tze-Liang Lee
  • Publication number: 20130224322
    Abstract: A method for removing foreign matters attaching on a surface of a fine pattern of a mold, having the fine pattern being convexo-concave, at least on one surface thereof, thereby cleaning the fine pattern surface of the mold, and an imprinting device applying that method therein, without removing, comprises the following steps of: applying a photo-curable resin on a surface of a body to be transcribed, onto which the mold is suppressed, and thereby forming a photo-curable resin layer; suppressing the mold on the photo-curable resin, which is applied on the surface of the body to be transcribed; separating the photo-curable resin cured from the mold, after curing the photo-curable resin, and whereby taking the foreign matters attaching on the surface of the fine pattern into the photo-curable resin cured to remove them, wherein the photo-curable resin to be formed on the surface of the body to be transcribed is formed with such thickness that it can remove the foreign matters attaching on the fine pattern, and
    Type: Application
    Filed: November 11, 2011
    Publication date: August 29, 2013
    Applicant: Hitachi High-Technologies Corporation
    Inventors: Noritake Shizawa, Naoaki Yamashita, Masashi Aoki, Tetsuhiro Hatogai
  • Publication number: 20130180543
    Abstract: A method for cleaning a deposition chamber includes forming a deposited layer over an interior surface of the deposition chamber, wherein the deposited layer has a deposited layer stress and a deposited layer modulus; forming a cleaning layer over the deposited layer, wherein a material comprising the cleaning layer is selected such that the cleaning layer adheres to the deposited layer, and has a cleaning layer stress and a cleaning layer modulus, wherein the cleaning layer stress is higher than the deposited layer stress, and wherein the cleaning layer modulus is higher than the deposited layer modulus; and removing the deposited layer and the cleaning layer from the interior of the deposition chamber.
    Type: Application
    Filed: February 28, 2013
    Publication date: July 18, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: International Business Machines Corporation