Abstract: Disclosed is a substrate liquid processing apparatus including: a processing bath in which a processing liquid is stored; a chemical liquid component supply unit that supplies chemical liquid components; a concentration detecting unit that detects a concentration of the chemical liquid components; and a controller configured to perform a first control as a feedback control that replenishes the processing liquid with the chemical liquid components such that the concentration of the chemical liquid components contained in the processing liquid within the processing bath does not become less than a predetermined allowable lower limit, based on the concentration of the chemical liquid components detected by the concentration detecting unit.

Abstract: A substrate liquid processing method includes immersing the substrate in a processing liquid for processing the substrate, detecting a conversion point at which a processing condition of the processing the substrate is changed, and changing the processing condition when the conversion point is detected.

Abstract: An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.

Abstract: A substrate processing method is provided. The substrate processing method includes placing a substrate storage container storing a substrate on a load port; automatically determining a type of the substrate stored in the placed substrate storage container; and, by referring to a storage unit that stores parameter data set related to a transport condition for each type of substrate, controlling transport of the substrate stored in the substrate storage container based on the parameter data set corresponding to the automatically determined substrate type to process the substrate.

Abstract: A method for forming a thermoelectric element for use in a thermoelectric device comprises providing a mask adjacent to a substrate, the mask comprising a polymeric mixture, and bringing a template having a first pattern in contact with the mask to define a second pattern in the mask. The first pattern comprises one of holes and rods, and the second pattern comprises the other of holes and rods. Holes or rods of the second pattern expose portions of the substrate. Next, an etching layer is deposited adjacent to exposed portions of the substrate. The etching layer is configured to aid in etching the substrate. The substrate is subsequently etched with the aid of the etching layer.

Abstract: A substrate cleaning apparatus for cleaning a substrate is provided. The apparatus includes a cleaning bath in which a substrate holder holding a substrate is disposed in a vertical position, the substrate holder having a sealing member contacting a periphery of a surface of the substrate to seal a gap between the substrate and the substrate holder, and cleaning nozzles each configured to supply a jet of cleaning water to the substrate holder. The cleaning nozzles are disposed in the cleaning bath and arranged concentrically with a contact portion of the substrate surface contacting the sealing member and located at such positions that the jet of cleaning water impinges on the contact portion or its vicinity in an upper half of the substrate.

Abstract: An apparatus for processing semiconductor wafers includes at least a wet bench and an automatic handling system of a wafer carrier removably connected thereto. The wet bench includes a first processing tank, a second processing tank and a third processing tank, separated from one another, each processing tank being dedicated to a different chemical, as well as a special cleaning and drying tank for processing the automatic handling system when the wafer carrier has been removed.

Abstract: A plurality of cup-shaped workpieces are anodized by first securing each of them in a downwardly open position on an electrically conductive and flat workpiece frame that is then inverted such that the workpieces are open upward and lowered into a body of anodizing liquid in a treatment bath until the workpieces are wholly immersed and the frame is in contact with a horizontal rail. Thereafter the frame is moved horizontally while wholly immersed in the anodizing liquid while electricity flows between the rail and a cathode immersed in the bath below the workpieces such the liquid anodizes surfaces of the workpieces. The frame is raised out of the body of liquid with the workpieces open upward, and, while the workpieces are still above the body of liquid, inverting the frame and the workpieces so that the workpieces are open downward and any treatment liquid drains downward into the bath.

Abstract: A method of providing airflow management in a substrate production tool includes providing a first mechanism coupling the substrate production tool to a fan filter unit. The fan filter unit provides filtered air to the substrate production tool. A second mechanism couples the substrate production tool to a reduced pressure exhaust mechanism. The reduced pressure exhaust mechanism provides an exhaust for excess gas flow within the substrate production tool. A substrate process area of the substrate production tool is maintained at a lower pressure than a pressure of a substrate transfer section of the substrate production tool. The substrate process area maintains a higher pressure than a pressure of the reduced pressure exhaust mechanism. The substrate transfer section maintains a higher pressure than the pressure of the reduced pressure exhaust mechanism.

Abstract: Processes for extracting product molecules from an algae feed are provided. The algae feed represents an input stream, batch sample, or other algae portion suitable for use in product extraction. The product extraction is typically performed at pressures greater than ambient pressure. This allows for improved extraction, including the potential for use of extraction solvents at temperatures greater than the boiling point for the solvent.

Abstract: Machine (10) and method for treating containers (12) of liquids comprising in succession at least a loading station (15), into which the containers (12) to be treated are loaded, and all disposed according to a determinate first orientation, and a washing station (17), in which the containers (12) are subjected at least to washing and are disposed in a second orientation able to promote the fall due to gravity of the dirt and/or washing liquid present in the containers (12). The machine (10) comprises, downstream of the washing station (17) and outside it, a manipulator device (41) which automatically rotates the containers (12) exiting form the washing station (17) so as to reposition the containers (12) according to the first determinate orientation.

Abstract: Internal cleaning of inverted cans includes engaging a can's cylindrical wall with a wall-conforming vacuum or adhesive gripper, causing a spraying unit to travel axially in and out of the can's opening while the can is inverted on a circular conveyor, and using a supporting arm or bottom stop to subject the can to a counterforce against a flushing force from sprayed cleaning medium. This prevents the can from being pressed out of a receptacle in which it sits during cleaning.

Abstract: An exemplary cleaning apparatus includes a cleaning member, a connecting member, a drying member, and a workpiece holder. The connecting member includes a main housing defining two opposite surfaces and two blocks received in the main housing. The main housing defines a first chamber and two second chambers communicating with the first chamber, each of the second chambers extending through to one of the two opposite surfaces and near to the other opposite surface. The cleaning member and the drying member are connected to the two opposite surfaces and communicate with each other via the first chamber. The two blocks are movable between the first chamber the second chambers, respectively. Each block defines an engaging surface, facing the other engaging surface. When the blocks move into the first chamber and the engaging surfaces engage with each other, the blocks shut off communication between the cleaning member and the drying member.

Abstract: A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates in a treating position inside the treating tank, first and second treating liquid supply devices, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid is supplied, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid. Then the second treating liquid supply device may be controlled to replace the first treating liquid with the second treating liquid, while controlling the temperature control device to maintain the second treating liquid in the same temperature range.

Abstract: An ultrasonic cleaning apparatus including: a cleaning tank for storing a cleaning liquid; an object-to-be-processed holder for insertion into the cleaning tank, the holder holding an object to be processed and immersing the object into the cleaning liquid; a vibrator disposed on a bottom part of the cleaning tank; and an ultrasonic oscillator configured to make the vibrator ultrasonically vibrate. In the cleaning tank, a lateral holding member configured to hold the object is disposed. The holder is configured to be laterally moved by a driving apparatus. The control device is configured to control the driving apparatus such that the holder is laterally moved after the object has been held by the lateral holding member, and the control device is configured to control the ultrasonic oscillator such that the vibrator is made to ultrasonically vibrate so that the ultrasonic vibration from the vibrator is propagated to the object.

Abstract: A rapid and effective means for decontaminating fouled oil-control booms is provided. The process involves washing the boom with pressured washing fluid, reorienting the boom to facilitate full inspection, and drying the boom. This can be performed in an assembly-line manner, using one or more conveyors to transport the boom sequentially to a washing area, an inspection area, and a drying area. Consequently, contaminated oil-control booms can be cleaned and redeployed rapidly and inexpensively during an oil release accident.

Abstract: Disclosed is a substrate processing apparatus capable of decreasing the frequency of shutdown of the apparatus due to lack of processing liquid in a processing liquid supply unit, as well as efficiently using the processing liquid to improve a yield ratio. The substrate processing apparatus includes a plurality of liquid processing units to conduct liquid processing of substrates a substrate carrying unit to carry the substrates in and out of the liquid processing units, a processing liquid supply unit to supply the liquid processing units with processing liquid, and a level gauge to detect an amount of the processing liquid remaining in the processing liquid reservoir of the processing liquid supply unit. The carry of the substrates in the liquid processing units is suspended when the level gauge detects that the amount of the processing liquid remaining in the processing liquid reservoir is below a predetermined threshold.

Abstract: Provided are a substrate support unit and a substrate treating apparatus and method using the same. The substrate support unit includes a first support part and a second support part. The first support part is movable in a first direction. The first support part supports a first portion of a substrate in which a processing fluid is supplied in a direction corresponding to the first direction. The second support part is movable in a second direction. The second support part supports a second portion of the substrate. At least one of the first support part and the second support part supports the substrate while the processing fluid is supplied.

Abstract: A rapid and effective means for decontaminating fouled oil-control booms is provided. The process involves washing the boom with pressured washing fluid, reorienting the boom to facilitate full inspection, and drying the boom. This can be performed in an assembly-line manner, using one or more conveyors to transport the boom sequentially to a washing area, an inspection area, and a drying area. Consequently, contaminated oil-control booms can be cleaned and redeployed rapidly and inexpensively during an oil release accident.

Abstract: A cleaning assembly for containers, particularly for bottles, having a conveying device on which the containers are arranged by means of a receptacle means. To economically and ecologically improve the cleaning assembly, the receptacle means contains a liquid-tight tubular for an individual cleaning of the containers.

Abstract: A substrate treatment apparatus includes a container holder which holds a container for containing multiple substrates vertically stacked in horizontal postures, a substrate treatment section which collectively applies treatment to multiple substrates horizontally stacked in vertical postures, a main conveyance mechanism which conveys multiple substrates horizontally stacked in vertical postures between a substrate delivery position and the substrate treatment section, a carrying in/out mechanism which carries in/out the multiple substrates with respect to the container and changes postures of the multiple substrates between the horizontal postures and the vertical postures, and a sub conveyance mechanism which receives and delivers multiple substrates in vertical postures from and to the carrying in/out mechanism at a transfer position, receives and delivers multiple substrates in vertical postures from and to the main conveyance mechanism at the substrate delivery position, and conveys multiple substrates i

Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. The invention includes spraying a line of fluid to a substrate, thereby creating an air/fluid interface line on the substrate; supplying a line of drying vapors to the air/fluid interface line, thereby creating a Marangoni drying effect along the air/fluid interface line; and moving the substrate relative to the air/fluid line. Numerous other aspects are provided.

Abstract: The present invention generally provides an apparatus and method for processing and transferring substrates in a multi-chamber processing system that has the capability of receiving and performing single substrate processing steps performed in parallel, while using the many favorable aspects of batch processing. Embodiments of the invention described herein are adapted to maximize system throughput, reduce system cost, reduce cost per substrate during processing, increase system reliability, improve the device yield on the processed substrates, and reduce system footprint. In one embodiment, the cluster tool is adapted to perform a wet/clean process sequence in which various substrate cleaning processes are performed on a substrate in the cluster tool.

Abstract: A container processing machine (M) with at least one carousel (1, 1?) which defines a multiple-row processing section (2, 2?), processing devices (24, 25) which move concurrently in multiple rows with the carousel, container holding element groups which are attached to sections of a concurrently moving conveyor device (3), holding elements (H), at least within the processing section (2, 2?), that are positioned next to each other transversely to the conveyance direction, and feed and removal systems (Z, A) for the loading and the unloading of the holding elements (H). The feed and removal systems (Z, A) are designed with a single row, while the holding elements (H) of the groups are resettable between a single-row position, in which they are oriented at least approximately parallel to the conveyance direction, and, in the area of the loading and unloading zones (L, E), a position resetting device (U) for the holding elements.

Abstract: [Object] To provide a surface treatment apparatus capable of carrying out a surface treatment, a water washing process, a drying process, etc. automatically in an assembly line manner and in a space-saving installation area.

Abstract: Impurities can be eluted simultaneously from a plurality of local areas of a surface layer of a semiconductor substrate. A supporting unit supports the substrate, and a sample plate is disposed on the surface of the substrate. The sample plate has a plurality of holes that expose the local areas of the surface of the substrate. Eluant is provided onto the local areas of the surface layer of the substrate through the holes in the sample plate. The impurities are thus dissolved by the eluant to produce a sample. A nozzle transfers the sample from the local areas of the surface of the substrate to a plurality of sample cups. Therefore, samples from the surface layer of the substrate may be produced in a short amount of time.

Abstract: Provided are a substrate support unit and a substrate treating apparatus and method using the same. The substrate support unit includes a first support part and a second support part. The first support part is movable in a first direction. The first support part supports a first portion of a substrate in which a processing fluid is supplied in a direction corresponding to the first direction. The second support part is movable in a second direction. The second support part supports a second portion of the substrate. At least one of the first support part and the second support part supports the substrate while the processing fluid is supplied.

Abstract: A terminal cleaning apparatus integrated to an assembling apparatus for integrating a display panel by bonding an electronic part to an externally connecting terminal of a substrate in which substrates 5 respectively held by a first substrate holding portion 24 and a second substrate holding portion 25 moved by an XY table mechanism 23 are made to pass through a first cleaning portion 21 and a second cleaning portion 22 having different cleaning means to simultaneously clean and the substrate which is not cleaned is carried in and the substrate 5 is transferred between the substrate holding portions and the substrate 5 which has been cleaned is carried out simultaneously by a first substrate transferring mechanism 26. Thereby, an operational efficiency of a step of cleaning an externally connecting terminal can be improved by making substrate carrying operation efficient.

Abstract: A reduced pressure drying apparatus includes a chamber that closes in an airtight manner during a reduced pressure drying operation, a stage on which a substrate is mounted; and an exhaust unit having an exhaust tube that opens at exhaust openings within the chamber. The stage is disposed within the chamber during the reduced pressure drying operation. The exhaust unit discharges atmosphere from the chamber via the exhaust openings during the reduced pressure drying operation to reduce the pressure within the chamber. The exhaust openings are formed such that a position of the exhaust openings is substantially the same as or no higher than a surface position of the substrate. The reduced pressure drying apparatus allows a film having a more uniform thickness to be formed on the substrate.

Abstract: A substrate treating apparatus for treating substrates includes a treating tank for receiving and treating the substrates, a holding device movable, while holding the substrates in a cantilever mode, between a treating position in the treating tank and a transfer position above the treating tank, a transport device for supporting the substrates and transferring the substrates to and from the holding device in the transfer position, a detecting device for detecting a posture variation of the holding device, and a correcting device for correcting a position of the holding device or the transport device. The correcting device performs a correction according to the posture variation of the holding device detected by the detecting device in time of transfer of the substrates between the holding device and the transport device.

Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. A line of fluid is sprayed along a substrate surface forming an air/fluid interface line, and a line of drying vapor is supplied to the interface line to achieve Marangoni drying. Thus, a large portion of the substrate is simultaneously dried. A preferred apparatus employs a tank of cleaning and/or rinsing fluid. Above the tank fluid a source of rinsing fluid directs rinsing fluid to the surface of a substrate forming a meniscus on the substrate surface as the substrate is lifted from the cleaning fluid, and a drying vapor source directs drying vapor to the meniscus. The drying vapor lowers the surface tension of the meniscus, inducing a Marangoni flow of rinsing fluid from the substrate's surface, and thereby drying the substrate. The cleaning fluid tank has a substrate receiving and cleaning portion and a substrate rinsing portion.

Abstract: A washing unit for vegetables, comprising at least one upper and one lower stacked tanks, which are suitable to contain washing water and vegetables to be washed, and wherein a connection is provided between an upper and a lower tank of said tanks, said connection being suitable to allow for the vegetables to be washed to be transferred among said at least two tanks.

Abstract: A method for cleaning optics in a chamber. The method can include introducing a first etchant into a chamber that encloses an optical component and a source of electromagnetic radiation that is suitable for lithography, ionizing the first etchant, and removing debris from a surface of the optical component.

Abstract: An indexer part, removal processing part, interface, and dry processing part are disposed adjacent to each other in a row. That is, the removal processing part that performs removal processing of an organic matter by using a removal liquid is disposed adjacent to the indexer part loading and unloading a substrate with respect to the exterior of an apparatus. The interface that gives and receives a substrate between the removal processing part and dry processing part is interposed between the removal processing part and the dry processing part that performs dry processing of a substrate after passing through the removal processing. This enables to provide a substrate processing apparatus that can completely dry the substrate after a reaction product removal processing.

Abstract: A semiconductor processing system for wafers or other semiconductor articles. The system uses an interface section at an end of the machine accessible from the clean room. A plurality of processing stations are arranged away from the clean room interface. A transfer subsystem removes wafers from supporting carriers, and positions both the wafers and carriers onto a carrousel which is used as an inventory storage. Wafers are shuttled between the inventory and processing stations by a robotic conveyor which is oriented to move toward and away from the interface end. The system processes the wafers without wafer carriers.

Abstract: A cleaning processing system including a wafer transfer device, a wafer detecting sensor for detecting a wafer, a memory for storing the position and direction of an extra wafer present inside the cleaning processing system when the power supply is cut off, an alarm device for generating an alarm in the case where the information detected by the wafer detecting sensor when the power supply to the cleaning processing system is turned on differs from the wafer information taken out of the memory, an alarm canceling section for canceling the alarm, an apparatus control section for controlling the wafer transfer device to recover the extra wafer, and a recovery start-up section for emitting an instruction to start the wafer recovery to the apparatus control section.

Abstract: A chip handling system for integrated circuit (IC) chips each having circuitry on a first face, has a delivery station for receiving, from a first transfer device, a row and column array of chips with the first face upward, a second transfer device enabled to move chips row-by-row across the delivery station from a first side to a second side, a delivery path aligned with a row of chips at the second side of the delivery station, a first linear transfer mechanism for moving a row of chips at the second side of the delivery station into and along the delivery path, a rotary transfer device having platforms arranged around a central axis, each platform having a groove parallel to the central axis for accepting rows of chips on each platform, and a drive rotating the device in angular increments to align the grooves with the delivery path, an elongate track and a second linear transfer mechanism located at a position relative to the rotary transfer device 180 degrees from the first delivery path, for receiving r

Abstract: A cleansing system for automatically cleansing a workpiece through cleansing tanks and drying tanks in steps to process and assemble the workpiece, an ultrasonic cleansing apparatus, a vacuum drying apparatus, a cleansing apparatus, a cleansing tank, a drying tank and a production system. For example, a descending air current with a sufficient wind velocity/air capacity is obtained, a cleansing time is reduced and unevenness in cleansing of the workpiece is suppressed without bringing contaminations in a preceding tank into a following tank. The present invention has a carriage device (21) which carries a workpiece (2) to a predetermined position, a plurality of workpiece processing portions (23) arranged around the carriage device (21) in a radial pattern, a drive portion which drives the carriage device (21), a workpiece supply portion (25) which supplies the workpiece (2), and a workpiece discharge portion (26) which discharges the workpiece (2).

Abstract: A liquid processing apparatus has a substrate rotating device including a holder for holding a substrate and a motor, a chamber for applying the liquid processing to the substrate, a posture changing mechanism for changing the posture of the substrate rotating device at outside of the chamber such that a state of the substrate held by the holder changes between vertical and horizontal, and a position adjusting mechanism for relatively adjusting the positions of the chamber and the substrate rotating device together with the posture changing mechanism such that the holder is housed in the chamber. The substrate is taken out from the container and held by the holder in a horizontal state. After the posture of the holder was changed to vertical, a process liquid is supplied to the substrate of vertical state.

Abstract: A substrate cleaning system for cleaning wafers using a sheet-type wet cleaning treatment. The system has a sealable system body, a loading/unloading booth having a substrate carry-in section in which a plurality of substances are stocked to be carried in before a cleaning treatment is applied to them and a substrate carry-out section in which a plurality of substrates are stocked to be carried out after the cleaning treatment is applied, a processing booth provided with at least one sheet-type substrate cleaning chamber in which the cleaning treatment can be applied to a plurality of substrates by a plurality of cleaning solutions, and a robot booth provided with a transport robot for transporting the substrates one by one between the processing booth and the loading/unloading booth, the respective booths having partition walls.

Abstract: To provide a cleaning processing method and a cleaning processing apparatus which can improve cleaning efficiency. The apparatus is structured to install processing units 11a-11d which provide more than one kind of chemical liquids out of a plurality of chemical liquids A-C for processing wafers W, and to enable the same kind of a processing liquid to be provided for at least two processing units, and, upon successively processing objects-to-be-processed which require their own processing sequences, to consecutively load each object-to-be-processed W to a processing unit which stores designated chemical liquid for a processing sequence of the object-to-be-processed.

Abstract: A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.

Abstract: A cleaning apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical force, and another part in which a fluid including a gaseous reactant is directed onto the surface of the substrate while the surface is irradiated to cause a chemical reaction between the reactant and organic contaminants on the surface, to chemically removing the organic contaminants. In the method of cleaning the substrate, the physical and chemical cleaning processes are carried out in a separate manner from one another so that the frozen particles of the aerosol are not exposed to the effects of the light used in irradiating the surface of the substrate. Therefore, the effectiveness of the aerosol in cleaning the substrate is maximized.

Abstract: By a simple apparatus construction and process, it is made possible to “clean precisely” a surface at the molecular/atomic level, and the purification degree of the surface processed minutely is made into 1012 molecules/cm2 or less. A steam-spraying nozzle is disposed such that a line slit nozzle is in a diameter direction, and mist-containing steam is sprayed onto the surface of a substrate. Thereby, particles in the steam-spraying surface (the particles were made to adhere by dipping the substrate in a solution containing polystyrene (particle diameter of 0.6 &mgr;m) or alumina (particle diameter of 0.3 &mgr;m to 0.5 &mgr;m) particles at 105 particles/ml.) are removed by about 90% to 95% after ten-seconds spraying, and by 99% or more, that is, to less than the detection limit of a wafer inspection device, after twenty-seconds spraying.

Abstract: A computer-implemented method and system for cleaning a contaminated cannula so that it may be reused includes moving the contaminated cannula from a drug reconstitution station where the cannula is used to prepare a drug solution into a first rinsing station where the cannula is cleaned. A database is referred to to determine what drug solution the cannula has been contaminated with, and to determine a first amount of cleaning fluid that needs to be passed internally through the cannula, and a second amount of cleaning fluid that needs to be passed externally about the cannula so that there is effectively no contaminant remaining inside and outside of the cannula. The first amount of cleaning fluid is passed internally through the cannula. The second amount of cleaning fluid is passed externally about the cannula. After the cannula is cleaned, the cannula is moved to the drug reconstitution station to prepare another drug solution.

Abstract: In a post chemical-mechanical polishing (CMP) procedure for cleaning a workpiece, a cleaning solution is delivered to the core of a brush where the solution is absorbed by the brush and then applied by the brush onto the workpiece. The cleaning solution is uniformly applied to the workpiece. The volumes of solutions used in the scrubbing process is reduced. A thin oxide layer is etched. A hydrophilic surface state is maintained. The workpiece is then rinsed and dried in a centrifugal processing between upper and lower rotors. A high level clean is achieved while consumption of rinsing and drying fluids is reduced.

Abstract: A method for drying a disk-shaped substrate. The substrate is typically a substrate used for the manufacture of magnetic disks, and has a centrally located opening. The substrate is lowered into a liquid bath by a first holder, which also becomes immersed in the bath. The first holder lifts the substrate until the substrate extends partially out of contact with the liquid. A second, dry holder grabs a dry portion of the substrate that extends out of the bath, and continues to lift the substrate out of contact with the liquid.

Abstract: Chambers each include an inlet port for supplying N2 gas and an outlet port for discharging an inner atmosphere, and therefore the chambers have different amounts of supply of N2 gas in a unit of time and different amounts of discharge of inner atmosphere in a unit of time. With this structure, the first to fourth processing chambers are controlled to have the lowest inner pressure(p3), a transfer module is controlled to have an inner pressure (p2) higher than the inner pressure (p3) and a loader and an unloader are controlled to have the highest inner pressure (p1). That eliminates the necessity for keeping the whole substrate processing apparatus at the highest inner pressure (p1) and supplying a large amount of N2 gas, and therefore it is possible to achieve processings of substrate at lower cost, with shorter purge time and less contamination of substrate.

Abstract: A method and apparatus for drying a disk-shaped substrate. The substrate is typically a substrate used for the manufacture of magnetic disks, and has a centrally located opening. The substrate is lowered into a liquid bath by a first holder, which also becomes immersed in the bath. The first holder lifts the substrate until the substrate extends partially out of contact with the liquid. A second, dry holder grabs a dry portion of the substrate that extends out of the bath, and continues to lift the substrate out of contact with the liquid.