Abstract: Substrates can be suppressed from being separated from supporting grooves. A substrate processing apparatus includes a substrate holding unit and a processing tub. The substrate holding unit is configured to hold multiple substrates. The processing tub is configured to store a processing liquid therein. The substrate holding unit comprises a supporting body, an elevating device and a restriction unit. The supporting body has multiple supporting grooves and is configured to support the multiple substrates with a vertically standing posture from below in the multiple supporting grooves, respectively. The elevating device is configured to move the supporting body between a standby position above the processing tub and a processing position within the processing tub. The restriction unit is configured to be moved up and down along with the supporting body by the elevating device and configured to restrict an upward movement of the substrates with respect to the supporting body.

Abstract: Disclosed is a first cleaning apparatus including a first cleaning bath, a cover provided at the upper part of the first cleaning bath, a drainage portion provided at the lower part of the first cleaning bath, a first cleaning unit and a second cleaning unit provided respectively at a first side surface and a second side surface in the first cleaning bath, and first and second moving units configured to move the first and second cleaning units, respectively, wherein each of the first and second cleaning units includes a plurality of cleaning solution supply pipes provided at different heights and a plurality of nozzles provided at each of the cleaning solution supply pipes, the nozzles provided at one cleaning solution supply pipe have identical cleaning solution spray angles, and the nozzles provided at the other cleaning solution supply pipes have different cleaning solution spray angles.

Abstract: Provided is a substrate processing system and a substrate processing method. The substrate processing system includes a polishing part for performing a Chemical Mechanical Polishing (CMP) process on a substrate, a cleaning part for cleaning the substrate on which the polishing process is performed, and a substrate transferring part for transferring the substrate to the cleaning part before polishing the substrate in the polishing part. The substrate may be preparatorily cleaned in the cleaning part before the polishing process, and then enters the polishing part.

Abstract: Embodiments that relate to mechanisms for cleaning wafers is provided. A method for wafer cleaning includes cleaning wafers by a wet-bench cleaning operation. The method also includes thereafter cleaning each of the wafers by a single-wafer cleaning operation. In addition, a cleaning apparatus for enhancing the performance of the above method is also provided.

Abstract: Machine (10) and method for treating containers (12) of liquids comprising in succession at least a loading station (15), into which the containers (12) to be treated are loaded, and all disposed according to a determinate first orientation, and a washing station (17), in which the containers (12) are subjected at least to washing and are disposed in a second orientation able to promote the fall due to gravity of the dirt and/or washing liquid present in the containers (12). The machine (10) comprises, downstream of the washing station (17) and outside it, a manipulator device (41) which automatically rotates the containers (12) exiting form the washing station (17) so as to reposition the containers (12) according to the first determinate orientation.

Abstract: A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.

Abstract: A washing plant (10) comprises a battery (12) of washing and heat-disinfection machines (14, 16, 18) disposed along an alignment axis (X), able to operate in parallel with respect to each other in order to effect the washing and heat-disinfection, at least a translator slider (20) mobile in an automatic manner parallel to the alignment axis (X) in a front position to said battery (12), which receives the objects to be washed and both transports them in correspondence to the entrance of one of the machines (14, 16, 18) selected on each occasion depending on the washing program set or depending on availability, and moves them inside the desired machine (14, 16, 18) in a direction of feed (F) substantially perpendicular to said alignment axis (X), transport means (24) being provided to direct the objects to be washed toward the translator slider (20) operating in a direction of transport (Y) substantially parallel to said alignment axis (X).

Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back

Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus includes a first chamber through which a substrate is conveyed, a second chamber where an oxide film formed on the substrate conveyed from the first chamber is removed; and a third chamber that discharges the substrate conveyed from the second chamber to the outside after rinsing the substrate, wherein the first chamber and the third chamber are disposed on top and on bottom.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes an index part including a port on which a container containing a substrate is placed and an index robot, a processing part for processing the substrate, and a buffer unit disposed between the processing part and the index part to allow the substrate transferred between the processing part and the index part to be temporarily stayed therein. The processing part includes a glue removal processing module, a substrate cooling processing module, a heat processing module, and a functional water processing module which are disposed along a transfer passage for transferring the substrate.

Abstract: A method is used for removing a metal contaminant deposited on a quartz member selected from the group consisting of a reaction tube, wafer boat, and heat-insulating cylinder of a vertical heat processing apparatus for a semiconductor process. The method includes obtaining the quartz member unattached to the vertical heat processing apparatus; then, performing diluted hydrofluoric acid cleaning of cleaning the quartz member by use of diluted hydrofluoric acid; then, performing first purified water cleaning of cleaning the quartz member by use of purified water; then, performing hydrochloric acid cleaning of cleaning the quartz member by use of hydrochloric acid; and then, performing second purified water cleaning of cleaning the quartz member by use of purified water.

Abstract: The surface treatment apparatus includes: a supply device for supplying an introduced workpiece to the inside of a treatment cell of a subsequent surface treatment device; a surface treatment device for supplying a surface treatment liquid to the inside of the treatment cell while rotating the treatment cell, thereby performing a surface treatment on the workpiece; a workpiece collection device for inverting the treatment cell, and squirting the inside of the treatment cell with water from below to flow out the workpiece, thereby collecting the workpiece into a collection vessel; a drying device for receiving the collection vessel from the workpiece collection device, and exposing the workpiece within the collection vessel to air, thereby drying the workpiece; and a carrying device for carrying the treatment cell between the surface treatment devices, and between the surface treatment device and the workpiece device, wherein the surface treatment apparatus includes the one or more surface treatment devices.

Abstract: The present invention resides in a washing device constructed by a conveyer of a carrying-in side arranged in a frame, a reservoir lower portion having plural rails for holding the work and an ultrasonic generator arranged in this frame, each reservoir upper portion united with this reservoir lower portion, a raising-lowering device for raising and lowering each reservoir upper portion, an arm mechanism for work conveyance, a moving device for controlling advancing and retreating movements of the arm mechanism, a movable device for controlling a swinging return of the arm mechanism, and a conveyer of a carrying-out side for conveying a processed work. The conveyer and the rail of each reservoir lower portion are approximately arranged on the same face. The work is horizontally moved through this conveyer and the rail and is washed and dried by utilizing the union of each reservoir lower portion and each reservoir upper portion.

Abstract: A method for automation of conventional manual operation of setting the work-pieces on the hanger (H) for transporting the work-pieces, which moves such as in the surface treatment equipment (300), so as to provide the labor and power saving effect, to improve the efficiency on the operation, and to further improve the quality of the surface of the work-piece after treatment, comprises the process to separate and align plural work-pieces which are joined and aligned; the process to support the skewer-shaped supporting member (K) supporting plural separated and aligned work-pieces while maintaining the separated and aligned configuration; and the process to hang the skewer-shaped supporting member (K) supporting the work-pieces in the separated and aligned configuration on the hanger (H).

Abstract: The invention provides a cleaning apparatus which can remove an organic material for an organic EL element attaching to a mask made of a thin metal film. The cleaning apparatus of the invention includes first and second cleaning tanks cleaning a mask with a predetermined cleaning solution at room temperature, first and second rinse tanks rinsing the mask with a predetermined rinse solution at room temperature, and a carrying device holding the mask at a predetermined angle other than horizontally and carrying the mask held at the predetermined angle to the first and second cleaning tanks and the first and second rinse tanks without damage occurring to the thin metal film of the mask by stress caused by gravity. The carrying device holds the mask horizontally at first, stands up in a vertical direction while holding the mask to hold the mask at the predetermined angle.

Abstract: A substrate processing apparatus includes a photosensor for detecting the presence/absence of a substrate in each place within a carrier cassette, a pair of processing tanks for performing the same process at the same time, and a supply mechanism for supplying a processing solution to the processing tanks independently. The number of substrates is detected in accordance with the result of the detection of the photosensor. If the number of substrates detected is not greater than an allowable number for one of the processing tanks, the processing solution is supplied to only the one processing tank to perform the process. This reduces the consumption of the processing solution in a batch process.

Abstract: A processing apparatus includes a processing bath having a liquid injection port in the bottom thereof, a rectifier plate located between the bottom of the processing bath and a position at which an object to be processed is positioned, and a distribution portion extending between the rectifier plate and the liquid injection port and over the liquid injection port. The distribution portion includes an opposing portion opposing the liquid injection port, a surrounding portion surrounding a space between the opposing portion and the liquid injection port, and a guard portion or extended portion extending outwardly from the bottom end of the surrounding portion.

Abstract: Described are cleaning benches and methods for removing contaminant layers from semiconductor process components using small volumes of hazardous liquids and minimizing cross-contamination between components from different deposition chambers. Components to be cleaned are stored within or supported by a dedicated cassette before they are placed in a receptacle of cleaning liquid. The cassette displaces a significant percentage of the receptacle's volume; consequently, only a relatively small volume of cleaning liquid is needed to fully submerge the component. In typical embodiments, the combined cassette and component displace a volume of liquid that is greater than the volume of liquid used to clean the component. The cleaning bench can include different chemical baths for different components. Cassettes dedicated for use with particular components can be keyed to particular receptacles.

Abstract: After subjected to a developing process, a rinsing process and a replacing process in this order in a developing unit 10A, 10B, a substrate W wet with an anti-drying solution is wet-transported to a supercritical drying unit 20 by a primary transport robot 30. The supercritical drying unit 20 performs a high-pressure drying process (supercritical drying process) in a dedicated manner. Accordingly, by virtue of the presence of the anti-drying solution, the substrate W is effectively prevented from becoming air-dry during the transportation of the substrate W.

Abstract: A wet etching apparatus and method to shorten processing time and to eliminate formation of unintended mask pattern are described. In the conventional art, after a mask pattern is formed, alien substances such as water mist or stain are left on the substrate. The alien substances act as an etching block in the wet etching process. This generates an unintended mask pattern. The present invention uses ultraviolet light to remove the alien substances prior to the etching process. When the alien substances are removed, the intended mask pattern is generated after the etching process. The wet etching device according to the present invention includes an ultraviolet cleaner and a conveyor to convey substrates to and from the ultraviolet cleaner. Spaces for the ultraviolet cleaner and the conveyor are created in the wet etching apparatus by reducing space for cassettes and reducing space required by the loader.

Abstract: The present invention resides in a washing device constructed by a conveyer of a carrying-in side arranged in a frame, a reservoir lower portion having plural rails for holding the work and an ultrasonic generator arranged in this frame, each reservoir upper portion united with this reservoir lower portion, a raising-lowering device for raising and lowering each reservoir upper portion, an arm mechanism for work conveyance, a moving device for controlling advancing and retreating movements of the arm mechanism, a movable device for controlling a swinging return of the arm mechanism, and a conveyer of a carrying-out side for conveying a processed work. The conveyer and the rail of each reservoir lower portion are approximately arranged on the same face. The work is horizontally moved through this conveyer and the rail and is washed and dried by utilizing the union of each reservoir lower portion and each reservoir upper portion.

Abstract: A system for treating, in liquids, a mass-production parts contained in transport baskets, comprising at least one tank which contains liquid for submerging the transport baskets, at least one transport vehicle for the transport baskets by which the transport baskets can be moved over the at least one tank, at least one basket carrier which is arranged at the transport vehicle in such a way that its height is adjustable, which is able to grip a transport basket, submerge same in the tank, rotatingly drive same around an axis and lift same out of the tank, as well as a clamp for securing the basket carrier relative to the at least one tank.

Abstract: A flexible container for liquid transport made of a flexible material includes a top face portion, a bottom face portion, and a peripheral face portion connecting the top face portion and the bottom face portion. An air tight, water resistant slide fastener is openably/closably mounted to the peripheral face portion of the container. A liquid stirring port is provided at the top face portion, and a liquid injecting and ejecting port are provided at a lower end of a rear face portion of the peripheral face portion. Container suspending pieces and bottom face portion fixing pieces are mounted at the top face portion of the container and at four corners of the bottom face portion. During washing, the container can be washed reliably and efficiently while the inside of the spread out container can be visually checked by efficiently utilizing the air tight, water resistant slide fastener, liquid stirring port, liquid injecting and ejecting port, and container suspending pieces, and bottom face port fixing pieces.

Abstract: A wet etching apparatus and method to shorten processing time and to eliminate formation of unintended mask pattern are described. In the conventional art, after a mask pattern is formed, alien substances such as water mist or stain are left on the substrate. The alien substances act as an etching block in the wet etching process. This generates an unintended mask pattern. The present invention uses ultraviolet light to remove the alien substances prior to the etching process. When the alien substances are removed, the intended mask pattern is generated after the etching process. The wet etching device according to the present invention includes an ultraviolet cleaner and a conveyor to convey substrates to and from the ultraviolet cleaner. Spaces for the ultraviolet cleaner and the conveyor are created in the wet etching apparatus by reducing space for cassettes and reducing space required by the loader.

Abstract: An overhead traveling crane system has cylindrical guide members (16d, 18d) and guide bars (15a, 16a) installed on a moving device (18) and a lifting device (15), respectively. The guide bars (15a, 16a) are inserted nestably into the cylindrical guide members (16d, 18d) so [as to move] that the lifting device (15) can be raised and lowered by wires only substantially vertically relative to the moving device (18) when wires (15b, 16b) are wound up and down. The lower end parts of the cylindrical guide members (16d, 18d) are expanded in a flared shape so that the upper end parts of the guide bars (15a, 16a) can be moved minutely horizontally in the period between the start of engagement and the completion of engagement. Similarly, a flared position guide means may be provided on a lower part of the lifting device for engagement with positioning means located on the target on the ground.

Abstract: A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board.

Abstract: A system and methods for substrate preparation are provided. In one example, a wafer processing system includes a system enclosure that contains wafer processing apparatus within an isolated wafer processing environment. The wafer processing apparatus include a pair of immersion tanks in the lower front region of the system with a pair of wafer pickers behind the immersion tanks to extract wafers from the tanks. In the rear of the system, a pair of brush boxes are located in a lower region with a pair of dryer units positioned above the brush boxes. A robot arm is positioned between the pair of immersion tanks and the pair of brush boxes in a middle region of the system, and is configured to transition wafers between the processing apparatus. A pair of output shelves holding output cassettes is positioned over the immersion tanks. The output cassettes receive clean wafers after processing.

Abstract: An overhead traveling crane system, wherein at least two locking members (25a) are mounted vertically slidably on a lifting device (15), a stopper (25b) and a contact member are fixed to the upper and lower end parts of each locking member (25a), respectively. A non-contact sensing device is fixed to the underside of the lifting device (15), and a sensor element (27) is fixed to the locking members (25a). The lowering of the locking members (25a) is stopped when the contact means is brought into contact with a reference position, and the lowering of the lifting device (15) is stopped when the lifting device (15) is lowered further so as to move the sensing device on the lifting device (15) side closely to the sensor element on the locking members (25a). Even though a general-purpose overhead traveling crane is used, the vertical positioning accuracy of the lifting device installed on the overhead traveling crane is increased.

Abstract: A machine for cleaning a die by using electrolysis and ultrasonic vibration which has in combination a degreasing processing system, an electrolytic-cleaning system with an electrolyte circulator system, and a rinse system. The die, in a container, is dipped into an electrolytic liquid tank with an ultrasonic vibrator, and it is electrolyzed in a cleaning medium for large sized dies and die components.

Abstract: A modular semiconductor substrate cleaning system is provided that processes vertically oriented semiconductor substrates. The system features a plurality of cleaning modules that may include a megasonic tank-type cleaner followed by a scrubber. An input module may receive a horizontally oriented substrate and rotate the substrate to a vertical orientation, and an output module may receive a vertically oriented substrate and rotate the substrate to a horizontal orientation. Each of the modules (input, cleaning and output) has a substrate support and may be positioned such that the substrate supports of adjacent modules are equally spaced. The modules are coupled by an overhead transfer mechanism having a plurality of substrate handlers spaced the same distance (X) as the substrate supports of the modules therebelow.

Abstract: The invention relates to an installation for treating wafers made of materials serving as microelectronics substrates including a tank for containing a treatment bath, a wafer support device capable of receiving at least one wafer of a first size, and an element for grasping and placing each wafer of the first size in the bath and for removing it therefrom. The installation further includes a support for receiving at least one wafer of a second size that is smaller than the first size, the shape of the support allowing it to be grasped by the grasping element and received by the wafer support device in the tank.

Abstract: A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board.

Abstract: Disclosed is a process of recycling and reusing an aqueous degreasing solution for further use as a component of a coolant solution which is itself recycled and reused in metal cutting machines. Also disclosed is a method of degreasing parts, and a degreasing apparatus which is controlled such that an appropriate amount of the aqueous degreasing solution is introduced into the coolant solution. Finally, disclosed herein is a method and system for preparing a coolant in which an aqueous degreasing solution is further utilized as a feeder solution for a coolant solution, with the resulting solution being able to be separated into its component parts and reused in the cutting and cleaning of metals to form metal parts.

Abstract: In an apparatus for treating semiconductor wafers, a plurality of chemical treatment tanks 21a to 21c filled with treatment liquids for processing semiconductor wafers W and a plurality of rinse treatment tanks 22a to 22c filled with rinse liquids for rinsing the semiconductor wafers W are disposed in a direction across the direction of conveyance of a wafer holder conveyor carriage 5, such as a direction perpendicular thereto. A transportation device provided with a wafer boat 14 is disposed at a position in the vicinity of the chemical treatment tanks 21a to 21c and the rinse treatment tanks 22a to 22c, to transfer the wafers W to and from the wafer holder conveyor carriage 5 and also transport the thus transferred wafers W to the chemical treatment tanks 21a to 21c and the rinse treatment tanks 22a to 22c. This configuration makes it possible to reduce the size of the treatment apparatus and also improve the processing efficiency thereof.

Abstract: An apparatus for cleaning wafers includes one or more rows of receptacles for receiving cleaning agents or water The wafers are moved through and downward into the receptacles one by one for allowing the wafers to be cleaned by the cleaning agents first and then cleaned by the water. A vacuuming device may be used for drawing the air of the cleaning agent out of the apparatus. The wafers may be grasped between two grasping arms and separated from each other and moved through the receptacles. About 50 wafers may be cleaned once at a time.

Abstract: In a method and apparatus for cleaning filters, the cleaning is efficiently performed by selecting cleaning steps according to the degree of contamination of the filter media. The degree of contamination of the filter media is analyzed before the filter is carried into the cleaning apparatus. Filters with heavily contaminated filter media are subjected to pretreatment before the cleaning process is performed, and the filters with less contaminated filter media are directly subjected to the cleaning process. The cleaned filter is subjected to a restoration process before reuse.

Abstract: A circuit-like system which includes a lower conveyor line, an upper conveyor line and a pair of lift or transfer mechanisms at the end of each line constructed for moving a work piece. A travel and hoist mechanism and a beam assembly are provided for discontinuously moving work pieces along the lower line and raising and lowering them for treatment. A hook assembly is provided for restraining the downward movement of a work piece at a selected location when the hook assembly is in an operative position. The lift or transfer mechanism is provided which includes telescoping arms for grasping a work piece, which arms are carried by a vertically moveable carrier that is mounted in a stationary frame.

Abstract: Disclosed is a process of recycling and reusing an aqueous degreasing solution for further use as a component of a coolant solution which is itself recycled and reused in metal cutting machines. Also disclosed is a method of degreasing parts, and a degreasing apparatus which is controlled such that an appropriate amount of the aqueous degreasing solution is introduced into the coolant solution. Finally, disclosed herein is a method and system for preparing a coolant in which an aqueous degreasing solution is further utilized as a feeder solution for a coolant solution, with the resulting solution being able to be separated into its component parts and reused in the cutting and cleaning of metals to form metal parts.

Abstract: Disclosed is a process of recycling and reusing an aqueous degreasing solution for further use as a component of a coolant solution which is itself recycled and reused in metal cutting machines. Also disclosed is a method of degreasing parts, and a degreasing apparatus which is controlled such that an appropriate amount of the aqueous degreasing solution is introduced into the coolant solution. Finally, disclosed herein is a method and system for preparing a coolant in which an aqueous degreasing solution is further utilized as a feeder solution for a coolant solution, with the resulting solution being able to be separated into its component parts and reused in the cutting and cleaning of metals to form metal parts.

Abstract: A method for efficiently cleaning a cleaning subject, especially a method for cleaning an electrophotographic photosensitive member enables a uniform and high quality image to be obtained without leaving image defects and irregular images. The method includes a cleaning step during which the circulation flow rate during dipping of the cleaning subject in a cleaning solution is different from the circulation flow rate when the cleaning subject is pulled up, and where the cleaning solution is showered on the surface of the cleaning subject when it is pulled up. The cleaning method may be used in a method for manufacturing an electrophotographic photosensitive member for depositing a functional film by a plasma CVD method on a substrate.

Abstract: A pre-clean deluge system for cleaning automobile white bodies including a cleaning solution filtration and distribution system. The filtration system includes a series of filters specially adapted to remove metal particles from the cleaning solution. The distribution system includes deluge cannons that are position so as to deliver cleaning solution to the interior of the white body in a location during the white body travel so that the particles flushed therefrom are introduced into a small tank prior to a main tank in which the white body is subsequently immersed. The distribution system also provides regulated flow of cleaning solution to the deluge cannons, as well as a bypass to facilitate cycling of cleaning solution for end-of-shift filtration purposes.

Abstract: A method and apparatus for reducing the risk of environmental contamination from mercury spillage during carry over between processing tanks during the gold ball bond removal process by providing a self-contained, compact, environmentally safe system for use with toxic chemicals and liquids. The present invention provides a self-contained, integrally molded enclosure upper and lower chambers separated by a partition. The partition has a plurality of stations integrally formed therein, each of which is capable of containing a chemical liquid. The method comprises dipping a slide containing the semiconductor chip first into a toxic liquid, then into a first decontamination station and finally into a second decontamination station.

Abstract: In cleaning by sodium hypochlorite, filtration membrane cartridges are immersed in a washing tank storing a solution of sodium hypochlorite to decompose and remove organic contaminants clogging the pores of filtration membranes by oxidation of sodium hypochlorite; in rinsing with water, the cartridges are immersed in a washing tank storing a rinsing water to wash away the sodium hypochlorite attached to the filtration membrane by the rinsing water; in cleaning by oxalic acid, the cartridges are immersed in a washing tank storing oxalic acid to wash away ferrous substances attached to the filtration membrane by oxalic acid; and in giving hydrophilic property by a hydrophilic agent, the cartridges are immersed in a washing tank storing a solution of the hydrophilic agent so as to apply the hydrophilic agent to the filtration membranes in preparation for dry lay-up.

Abstract: Substrate transporting method comprising (a) inputting process data, (b) determining whether a number of units required for processing the wafer is an odd number or an even number, (c1) when a determination result of the step (b) is an odd number, transporting the wafer, (d1) taking out the wafer by the second arm from a cassette section, (e1) loading the W by the second arm to an odd-numbered unit, (f1) unloading the W by the third arm from an odd-numbered unit, except for a final unit, (g1) loading the W by the third arm to an even-numbered unit, (h1) unloading the W by the second arm from an even-numbered unit, and (i1) unloading the W from the final unit by the first arm and loading the W by the first arm into the cassette section, and (c2) when a determination result of the step (b) is an even number, transporting the W (d2) taking out the W by the third arm from the cassette section, (e2) loading the W by the third arm into an odd-numbered unit, (f2) loading the W by the second arm from an odd-numbered

Abstract: A degreasing and cleaning apparatus for cleaning circuit boards and the like has a first, wash sump containing a boiling, environmentally friendly wash material and a second, rinse, sump containing an environmentally friendly rinse material, separated by a weir. An anti-splash and surge control fence is mounted on top of the weir to control splashing and spill-over between the sumps. The wash sump contains a plurality of spray wands and a programmed hoist pans the carrier of the boards past the spray wands in incremental steps. After the wash cycle, the carrier is introduced into the second, rinse, sump and then given a final vapor rinse. The temperature ranges in which the apparatus is operated yield optimum cleaning.

Abstract: In a substrate processing apparatus receiving substrates held in a common carrier in a horizontal attitude, the substrates are transferred in the horizontal attitude from the common carrier to an exclusive carrier. The exclusive carrier is rotatable on a horizontal axis. By rotating the exclusive carrier, the substrates are turned from the horizontal attitude to a vertical attitude. Then, the substrates held in the vertical attitude are taken out of the exclusive carrier and transferred to a processing part for processing in the vertical attitude. This allows a simple and speedy turn of the plurality of substrates. Further, even the apparatus for processing the substrates in a vertical attitude can transfer the substrates into and out of the apparatus in the horizontal attitude by using the common carrier.

Abstract: A system and method are provided for vacuum coating articles that includes a means for moving the articles in semi-continuous fashion successively through a series of vacuum chambers. A carousel is transported successively through each of the vacuum chambers that rotates the articles in an epicycloidal fashion. A means is also provided for precisely and reproducibly loading and unloading the carousel with the article.

Abstract: A processing system for processing of wafers that are formed by slicing a cylindrical workpiece which is adhered to a support plate by an adhesive agent. The processing system includes a washing apparatus, a removing apparatus, a separating apparatus, and a transferring apparatus. The washing apparatus washes the wafers that are remained adhered to the support plate. The removing apparatus removes a group of the wafers from the support plate. The removed wafers are gathered in a cylindrical shape. The separating apparatus separates the wafers one by one. The separating apparatus includes a vessel for accommodating the wafers separated one from another. The transferring apparatus transfers the wafers from the washing apparatus to the removing apparatus and then to the separating apparatus.

Abstract: A degreasing and cleaning method for cleaning circuit boards and the like has a first, wash sump containing a boiling, environmentally friendly wash material and a second, rinse, sump containing an environmentally friendly rinse material, separated by a weir. An anti-splash and surge control fence is mounted on top of the weir to control splashing and spill-over between the sumps. The wash sump contains a plurality of spray wands and a programmed hoist pans the carrier of the boards past the spray wands in incremental steps. After the wash cycle, the carrier is introduced into the second, rinse, sump and then given a final vapor rinse. The temperature ranges in which the apparatus is operated yield optimum cleaning.

Abstract: A substrate processing apparatus is provided which requires a reduced installation space and allows for ready change of a process order. A substrate processing apparatus includes: a first transportation mechanism movable along a first transportation path in a predetermined transportation direction; a cassette load portion provided on one side of the transportation path; a plurality of unit portions arranged in a direction crossing the transportation direction on the other side of the first transportation path; and a second transportation mechanism disposed between each two adjacent unit portions and movable along a second transportation path in the transportation direction. The first transportation mechanism can perform a substrate transferring operation with respect to a cassette placed on the cassette load portion and a processing unit in a unit portion disposed in closest proximity to the first transportation path among the plurality of unit portions.