Abstract: In example embodiments, a supply flow rate of a clean gas can be reduced without decreasing process performance. A flow rate of a clean gas 78, having a low humidity, supplied from a clean gas supply device 70 or 78 when a drying process is performed on a substrate is set to be smaller than a flow rate of a clean gas 70 supplied from the clean gas supply device 70 or 78 into an internal space within a housing 60 when a liquid process is performed onto the substrate W, and a flow rate of a gas exhausted through the housing exhaust path when the drying process is performed is set to be smaller than a flow rate of a gas exhausted through the housing exhaust path 64 when the liquid process is performed.

Abstract: Systems for removing post etch polymer residue from etched surface includes a first proximity head to introduce a first cleaning chemistry as a first meniscus to a portion of the surface of the substrate so as to cover a length that extends to at least a diameter of the substrate and a first width that is less than the diameter of the substrate. A second proximity head is configured to introduce a second cleaning chemistry as a second meniscus to the portion so as to cover the length that extends to the diameter and a second width that is less than the diameter of the substrate. A substrate supporting device equipped with a motor coupled to a computing system is used to move the substrate supporting device under the first proximity head at a first linear speed and under the second proximity head at a second linear speed.

Abstract: In an apparatus and process for treating wafer-shaped articles, a spin chuck holds a wafer-shaped article in a predetermined orientation relative to an upper surface of the spin chuck. A heating assembly comprises a housing containing at least one infrared heating element. The heating assembly is mounted above the upper surface of the spin chuck and adjacent a wafer-shaped article when mounted on the spin chuck. The housing also contains a conduit having an inlet connected to a source of cooling fluid and an outlet returning cooling fluid to the source of cooling fluid.

Abstract: A method and system for cleaning a substrate in a multi-module cleaning assembly is provided. The method begins by receiving the substrate into the cleaning module. A cleaning chemistry, at a temperature elevated from an ambient temperature, is applied onto a top surface of the substrate. Concurrent with application of the cleaning chemistry, vapors are exhausted from the cleaning chemistry through a port located below a bottom surface of the substrate with the vapor exhaustion providing a negative pressure relative to a pressure external to the cleaning module. The application of the cleaning chemistry is terminated, followed by termination of the exhausting of the vapors. The substrate is dried after the flowing of inert gas is terminated.

Abstract: A rinsing liquid (DIW) is discharged from a rinsing liquid discharge port formed in a blocking member to perform rinsing processing to a substrate surface while a nitrogen gas is supplied into a clearance space, and a liquid mixture (IPA+DIW) is discharged from a liquid mixture discharge port formed in the blocking member to replace the rinsing liquid adhering to the substrate surface with the liquid mixture while the nitrogen gas is supplied into the clearance space. Thus, an increase of the dissolved oxygen concentration of the liquid mixture can be suppressed upon replacing the rinsing liquid adhering to the substrate surface with the liquid mixture, which makes it possible to securely prevent from forming an oxide film or generating watermarks on the substrate surface.

Abstract: A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates in a treating position inside the treating tank, first and second treating liquid supply devices, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid is supplied, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid. Then the second treating liquid supply device may be controlled to replace the first treating liquid with the second treating liquid, while controlling the temperature control device to maintain the second treating liquid in the same temperature range.

Abstract: A substrate processing apparatus includes a chamber configured to dispose a substrate to be processed with a substrate holder, a spin chuck to rotate the substrate, a gas discharging head configured to discharge a dehumidified gas to the substrate, a processing liquid supply nozzle, an IPA supply nozzle, and a driving device configured to move the gas discharging head between a retreat position of an upper part of the chamber and an approach position near the substrate. In particular, the gas discharging head is positioned at the approach position when the IPA is supplied to the substrate so that the dehumidified gas is supplied from the gas discharging head to the substrate when the IPA is supplied to the substrate.

Abstract: A substrate processing apparatus which holds and rotates a substrate substantially horizontally; having a control unit which controls a rinsing liquid supply mechanism for supplying a rinsing liquid onto the substrate; a gas knife mechanism that sprays gas onto the substrate to form a gas spraying zone and scans the entire substrate without rotating the substrate; a rinsing liquid mechanism for supplying a rinsing liquid onto the substrate at its area downstream from the gas spraying zone; and a drying unit for drying the substrate by rotating the substrate.

Abstract: An apparatus and method for treating a wafer-shaped article utilizes a gas supply hood that can be positioned in a working position above a holder so as to cover all or substantially all of a wafer shaped article when positioned on the holder. The gas supply hood accommodates a fluid dispenser for dispensing at least one fluid onto an upper surface of the wafer shaped article positioned on the holder. The gas supply hood permits the fluid dispenser to be moved laterally of the holder and the gas supply hood while the gas supply hood is in the working position and without moving the gas supply hood.

Abstract: The present invention relates to a service and maintenance station for a handheld drug delivery device of pen-injector type, comprising: a receptacle section to receive at least a portion of the drug delivery device, at least one service module adapted to maintain and/or to restore the operability of the drug delivery device, wherein the at least one service module comprises a cleaning and/or sterilizing module adapted to receive, to clean and/or to sterilize a distal end section of the drug delivery device to be connected with a piercing assembly.

Abstract: A cleaning device comprises a cleaning mechanism, a drying mechanism, and a transferring mechanism. The cleaning mechanism comprises a first receiving case, at least one cleaning tank received in the first receiving case, a transferring assembly, and a plurality of pipes. The transferring assembly is positioned on the first receiving case and located above the cleaning tank. The pipes communicate with the cleaning tanks. The drying mechanism comprises a second receiving case, a transporting member, and a plurality of air blower. The second receiving case is located besides the first receiving case, and parallel to the first receiving case. The transporting member is mounted on the second receiving case. The air blower are mounted on the second receiving case, and communicate with the second receiving case. The transferring mechanism is positioned at an end of the first receiving case and the second receiving case, respectively.

Abstract: Methods and apparatuses for integrated cleaning of objects comprising a sequence of wet cleaning and vacuum drying in a same process chamber. The present integrated cleaning process can eliminate moving parts, improving the system reliability. Vacuum decontamination can be included for degassing and decontaminating the cleaned objects. In an embodiment, a cleaner system combines various movements into an integrated movement to be handled by a robot, for example, to improve the throughput. For example, an integrated robot movement comprising picking up a closed container from the input load port, moving both the lid and body together, and then depositing the body and lid separately into the appropriate positions in the cleaner to be cleaned.

Abstract: A substrate cleaning apparatus cleans a surface of a substrate such as a semiconductor wafer and dries the substrate. The substrate cleaning apparatus includes a process chamber having a substrate conveying unit configured to hold a substrate horizontally with its upper surface facing upwardly and to convey the substrate in one direction, and a cleaning unit configured to clean the surface of the substrate in non-contact state by supplying a cleaning liquid to the surface of the substrate which is moving in the process chamber. The substrate apparatus has an inert gas blowing unit configured to blow an inert gas toward the front and reverse surfaces of the substrate which has been cleaned in the cleaning unit to produce an inert gas atmosphere in the process chamber while drying the substrate with the inert gas.

Abstract: A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.

Abstract: An apparatus capable of cleaning a material includes pipes arranged in a first barrel; and through holes defined in a second barrel. The second barrel is received in the first barrel. The apparatus further includes a driver comprising a drive shaft, the drive shaft extending through the first barrel and being connected to the second barrel. A fluid container is included store fluid, an air controller is provided air-dry the material. Before washing the material, the second barrel is driven by the driver to cause each of the through holes to disengage from a corresponding pipe. After washing the material, the second barrel is driven by the driver to cause each of the through holes to engage with the corresponding pipe.

Abstract: Silicon plates can be cleaned, rinsed and dried by hyperbaric superheated liquid and superheated steam. The superheated liquid can be used to clean and rinse the silicon plates after being saw from a silicon block. A slow drain can be open to remove the superheated liquid. A fast drain then can be open, preferably to atmosphere, to allow steam to vent through bottom. The fast drain can function as a drying process, vaporizing water droplets down the drain with the escaping steam.

Abstract: A substrate treating apparatus is provided which includes a treatment container which provides a space in which a substrate is washed; a substrate support member which is included in the space and supports the substrate; a spray member which selectively sprays a plurality of fluids on the substrate seated on the substrate support member. The treatment container comprises a plurality of recovery containers the entrances of which are stacked in an up-and-down direction to receive a fluid within the space; a first elevation member which moves the plurality of recovery containers in an up-and-down direction; and a second elevation member which relatively moves a part of the plurality of recovery containers in an up-and-down direction with respect to the remaining recovery containers.

Abstract: A substrate processing method includes a rinsing step of supplying water of a first temperature to a surface of a silicon substrate to apply a rinsing process using the water to the silicon substrate surface, a second temperature water supplying (coating) step of supplying water of a second temperature lower than the first temperature to the silicon substrate surface after the rinsing step, and a drying step of rotating the silicon substrate after the second temperature water supplying step to spin off the water on the silicon substrate surface to a periphery of the silicon substrate and thereby dry the silicon substrate.

Abstract: Processing and drying of a sample, such as a semiconductor or MEMS device, is achieved using a single pressure chamber. The pressure chamber holds the sample in a sealed interior volume throughout various process steps, such as, but not limited to, photoresist removal, sacrificial layer etching, flushing or rinsing, dehydration, and critical point drying. The pressure chamber is constructed of a chemically-resistant and pressure-resistant material to withstand the various chemicals and pressures that are encountered in the various process and drying steps. For example, the pressure chamber is constructed from a nickel-copper alloy. Automated release etching and critical point drying of a MEMS or semiconductor device is provided without removing the device from the sealed pressure chamber.

Abstract: An apparatus and method for washing and drying objects includes a rotating washing fluid sprayer having several nozzles to direct washing fluid, e.g., water, at an object being washed in a chamber. A drying fluid is directed at the object in the chamber to dry the object. The drying fluid, e.g., air, is directed in a spiral pattern against the object to urge washing liquid away from the object to dry the object and to push the drying liquid away from edges of the object. The air may be directed at the object simultaneously with the water to increase the energy with which the water impinges on the object and to urge dirt from the object being washed.

Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.

Abstract: A washing/drying machine according to the present invention is capable of efficiently performing a drying operation to reduce a drying period. The washing/drying machine includes a tank (11) for storing used water, and the water is circulated from the tank (11) for dehumidification of air circulated through a drying air duct (20). Since the water is circulated from the tank (11), a great amount of water can be supplied as dehumidification water for higher dehumidification efficiency. The amount of the circulated water (the amount of cooling water (dehumidification water)) is reduced in a first half of a drying process, and increased in a second half of the drying process. As a result, the drying efficiency is improved during the drying operation, thereby reducing the drying period.

Abstract: A drying apparatus for drying a semiconductor wafer includes a processing chamber including a rinsing section and a drying section adjacent thereto. The rinsing section has a chamber loading slot associated therewith for receiving the semiconductor wafer. The drying section has a chamber unloading slot associated therewith for outputting the semiconductor wafer. An exhaust control cap is carried by the processing chamber and includes a bottom wall, a top wall, at least one intermediate wall between the bottom and top walls, and a side wall coupled to the top, bottom and the at least one intermediate wall to define stacked exhaust sections. The exhaust control cap has a cap loading slot aligned with the chamber loading slot, a cap unloading slot aligned with the chamber unloading slot, and at least one exhaust port configured to be coupled to a vacuum source.

Abstract: A substrate processing apparatus and a substrate processing method are capable of restraining or preventing the generation of streaky particles on a substrate surface by excellent removal of a rinsing liquid therefrom. The substrate processing apparatus has a substrate inclining mechanism for inclining a substrate held by a substrate holding mechanism. After a rinsing liquid has been supplied onto a substrate to form a liquid mass, the substrate is inclined at a small angle by the substrate inclining mechanism. Then, the liquid mass is downwardly moved without being fragmented and then falls down without leaving minute droplets on the substrate top. Thereafter, the substrate is returned to a horizontal posture and then dried.

Abstract: The present invention describes a drying system for a dishwasher having a washing tub (2). The drying system comprises: a first fan (3) for propelling a first air stream through the washing tub (2) to an air transporting space (9) situated in the dishwasher outside the washing tub (2), wherein the first air stream is propelled in such a way that humidity in the washing tub (2) is absorbed by the first air stream and propelled to the air transporting space (9); and a second fan (4) for propelling a second air stream received from an area outside the dishwasher to the air transporting space (9). The drying system is further arranged such that the first and the second air streams are mixed in the air transporting space (9), and in that the mixed air stream is propelled to an exhaust opening (10) leading out from the dishwasher. Thereby, an efficient drying process can be achieved wherein air leaving the dishwasher has an appropriate temperature and humidity.

Abstract: A device (5), arranged for fluid communication with a washing chamber (2) of a dishwasher (1), the device further being arranged to allow a passage of air (9) between the washing chamber and the device, the device comprising a drying material (10) arranged in a bed (11), the drying material being able to withdraw moisture from the air passing through the bed during a withdrawal step, and release moisture to the air during a regeneration step, a heating element (13) arranged in the bed arranged to heat the drying material during the regeneration step such that moisture is released from the drying material, and a fan (14), arranged to circulate the air between the device and the washing chamber such that the air flow rate during the withdrawal step is higher than the air flow rate during the regeneration step by altering the fan speed.

Abstract: A method and system for cleaning a substrate in a multi-module cleaning assembly is provided. The method begins by receiving the substrate into the cleaning module. A cleaning chemistry, at a temperature elevated from an ambient temperature, is applied onto a top surface of the substrate. Concurrent with application of the cleaning chemistry, vapors are exhausted from the cleaning chemistry through a port located below a bottom surface of the substrate with the vapor exhaustion providing a negative pressure relative to a pressure external to the cleaning module. The application of the cleaning chemistry is terminated, followed by termination of the exhausting of the vapors. The substrate is dried after the flowing of inert gas is terminated.

Abstract: Methods for cleaning a substrate are provided. One such method includes receiving the substrate into a cleaning module and flowing an inert gas into the cleaning module. The flowing of the inert gas includes flowing the inert gas into an inlet defined within a top surface of the cleaning module and modifying a direction of the flowing inert gas to flow radially along the top surface of the cleaning module. Concurrent with or after initiating the flowing of the inert gas, a cleaning chemistry is introduced onto a surface of the substrate. The cleaning chemistry is at a temperature elevated from an ambient temperature. The dispensing of the cleaning chemistry is terminated and the flowing of the inert gas is terminated either concurrent with or after termination of the dispensing of the cleaning chemistry. The substrate is dried after the termination of the flowing of the inert gas.

Abstract: A chemical liquid process is performed on a substrate. Then, a rinse process that supplies a rinse liquid to the substrate is performed. Thereafter, a drying process that dries the substrate is performed while rotating the substrate. The drying process includes a first drying process that rotates the substrate at a first rotational speed; a second drying process that decreases the rotational speed of the substrate to a second rotational speed lower than the first rotational speed after the first drying process. In the second drying process, the rinse liquid and a drying solution are agitated and substituted while generating braking effect. In a third drying process, the rotational speed of the substrate is increased from the second rotational speed to a third rotational speed after the second drying process. Thereafter, in a fourth drying process, the drying solution on the substrate is scattered away by rotating the substrate.

Abstract: Disclosed is a liquid processing apparatus capable of performing a liquid processing and a drying processing in a position each having a different height. The liquid processing apparatus includes: a substrate holding unit configured to hold a substrate; a rotation driving unit configured to rotate the substrate holding unit; a substrate holding unit elevating member configured to lift and lower the substrate holding unit; a processing liquid supply unit configured to supply a processing liquid to the substrate; a liquid receiving cup configured to surround the substrate when the processing liquid is being supplied to the substrate; a drying cup located above the substrate and the liquid receiving cup when the processing liquid is being supplied to the substrate. The drying cup surrounds the substrate and located above the liquid receiving cup when the substrate is being dried.

Abstract: Equipment (10) for cleaning and drying roll stands, particularly roll stands in a rolling train, wherein a roll change device movable into the roll stand on rails transversely to the rolling line is provided for changing the rolls, wherein the device (10) is movable, similarly to the roll change device, on the rails (12) thereof and comprises a plurality of jet nozzles, which can be directed towards the roll stand (11), for a liquid cleaning medium (16) and blow nozzles (22, 22a, 22b, 22c) for a drying medium (24).

Abstract: The present invention provides a substrate processing system in which a processing liquid is supplied to a substrate W from a processing nozzle 50a situated above the substrate W so as to process the substrate W, and which makes it possible to prevent unintended dripping of the processing liquid from the processing nozzle. A substrate processing system 20 comprises a processing nozzle 50a capable of supplying a processing liquid to a substrate to be processed, an arm 54 supporting the processing nozzle, and droplet removing nozzles 60, 62 capable of blowing a gas to the processing nozzle. The arm is movable between a processing position and a waiting position, the processing nozzle being above a substrate when the arm is in the waiting position and being outside a substrate when the arm is in the processing position. The droplet removing nozzles are so situated that they are in the vicinity of the processing nozzle when the arm is in the waiting position.

Abstract: A cleaning system which includes an enclosure and having a door with a transparent window. The door is opened and closed to load and unload products to be cleaned. An operator puck on the outside of the enclosure couples magnetically to another actuator puck on the inside of the enclosure. This coupling allows an operator to move and direct the inside puck to actuate spray or air blast functions, without opening the enclosure. The outside operator puck includes one or more switches which turn on the various electronic components such as the liquid pump, light, or air blast valve. The cleaning system enables a user to efficiently direct cleaning action to parts inside to minimize the cleaning time, and to prevent exposure of chemicals. The cleaning fluid is cycled out of the enclosure continuously, and into a “trap” box, through a pump and back into the cleaner box in a closed loop cycle.

Abstract: A particle level varied depending on a drying processing condition can be suppressed to be stably lowered. A batch type substrate processing apparatus include a cleaning processing unit 62 having a cleaning tank 69 that stores therein a cleaning solution for cleaning a substrate, and a drying processing unit 61 disposed above the cleaning tank 69 and having a drying chamber 65 configured to perform therein a drying process on the substrate. Based on a previously investigated relationship, an internal temperature of the drying chamber is set as an internal temperature of the drying chamber when loading the substrate thereinto corresponding to the batch size of a next batch process performed in the drying chamber, and the internal temperature of the drying chamber is adjusted to be identical to the set internal temperature of the drying chamber before loading the substrate into the drying chamber.

Abstract: Provided is a dish washer. The dish washer includes a tub configured to accommodate dishes, a sump configured to supply water to the tub, and a water supply device configured to supply water received from an outer source to the sump or the tub. The water supply device includes a body and a plurality of discharge parts. The body includes a water supply passage along which water supplied from an outer source flows and a water chamber in which water supplied through the water supply passage is stored. Water is discharged from the water supply passage to the water chamber through the discharge parts.

Abstract: The invention refers to a cover, comprising a fleece arranged between a top and a bottom layer which holds a super absorber. At least in one layer a permeability area which is permeable to moisture is provided through which the cover can be moistened in a controlled way.

Abstract: A liquid processing apparatus 1 comprises a casing 5, a substrate holding mechanism 20 that holds a wafer (substrate to be processed) W, a process-liquid supplying mechanism 30 that supplies a process liquid, a draining cup 12 that receives a process liquid, and a draining pipe 13 that discharges a process liquid outside. The process-liquid supplying mechanism 30 includes a first chemical-liquid supply mechanism that supplies a hydrofluoric process liquid, and a drying-liquid supplying mechanism that supplies an organic solvent for drying a wafer W. A control part 50 causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and then causes the drying-liquid supplying mechanism to supply an organic solvent. In addition, before the control part 50 causes the drying-liquid supplying mechanism to supply an organic solvent, the control part causes a cleaning mechanism 10 to remove an alkaline component in a casing 5.

Abstract: A surface treating jig of the present invention includes a treatment solution collecting section having (i) a ring-like groove formed on a surface (a) facing to a surface (a) to be treated of a semiconductor wafer and (ii) a through hole for collecting the treatment solution, the through hole formed so as to be continuous with the ring-like groove. With this arrangement, the present invention provides a surface treatment apparatus that prevents the treatment solution from spattering to a surface other than the surface (a) to be treated, and thereby, treatment with the treatment solution can be performed only with respect to the target surface.

Abstract: A top plate 32 is provided to be moved in a horizontal direction between an advanced position, in which the top plate 32 covers from above a substrate W held by a substrate holding unit 21, and a retracted position that is retracted from the advanced position. An air hood 70 configured to supply a purified gas downward is provided to be lifted between a lower position, in which the air hood covers from above the substrate W held by the substrate holding unit 21, and an upper position located above the lower position.

Abstract: A drying system for a dishwasher including a passive vent assembly mounted to a top portion of the dishwasher. The passive vent assembly includes a passive vent structure having a series of air vents defined therein and through which drying air flows are drawn into the wash chamber of the dishwasher, a diffuser mounted over the air vents and including a series of fins for spreading the drying air flows across the wash chamber, and a moisture trap hood mounted over an upper surface of the passive vent structure.

Abstract: An apparatus serves for cleaning a coating machine for coating confectionery products with a coating mass. The apparatus is designed to be arranged in the coating machine which includes a rotatingly driven grating belt. The grating belt is designed and arranged to support confectionery products to be coated. The grating belt defines a grating belt plane. The apparatus includes a cart. The cart is designed to be moved back and forth in the coating machine above the grating belt plane in the mounted position of said cart in the coating machine. The cart includes a plurality of spraying nozzles. The spraying nozzles are designed and arranged to spray pressurized hot water onto the coating machine in an automatically controlled way.

Abstract: A cleaning apparatus includes at least one cleaning nozzle that generates and directs a high-pressure liquid jet towards a point of impact on a surface, such as a conveyor belt having a drying screen. A cleaning head has a main opening that faces towards the surface, a discharge opening and a wall with at least one inlet opening defined therein. The at least one cleaning nozzle is disposed outside of the cleaning head and is oriented such that the high-pressure liquid jet passes through the at least one inlet opening before striking the surface. At least one first compressed air supplying device is disposed outside of the cleaning head and is configured to steer liquid from the at least one cleaning nozzle, after it has struck the surface, towards the main opening of the cleaning head.

Abstract: A resist removal apparatus and method are effective in removing a resist without oxidizing the substrate material other than the resist. The resist removal apparatus, which removes resist from a wafer on which a resist film has been formed, includes a cluster spraying unit which sprays a wafer with clusters each of which is formed of a plurality of organic solvent molecules agglomerated together.

Abstract: A substrate processing apparatus and a substrate processing method are capable of restraining or preventing the generation of streaky particles on a substrate surface by excellent removal of a rinsing liquid therefrom. The substrate processing apparatus has a substrate inclining mechanism for inclining a substrate held by a substrate holding mechanism. After a rinsing liquid has been supplied onto a substrate to form a liquid mass, the substrate is inclined at a small angle by the substrate inclining mechanism. Then, the liquid mass is downwardly moved without being fragmented and then falls down without leaving minute droplets on the substrate top. Thereafter, the substrate is returned to a horizontal posture and then dried.

Abstract: In one aspect, a substrate processing apparatus is provided. The apparatus comprises a mechanism for forming a meniscus on a surface of a substrate by moving the substrate through a fluid; an air knife apparatus positioned to apply an air knife to shorten the meniscus formed on the surface of the substrate; and a drying vapor nozzle positioned to direct a drying vapor to the meniscus shortened by the air knife. Numerous other aspects are provided.

Abstract: A system and method of forming and using a proximity head. The proximity head includes a head surface including a first zone, a second zone and an inner return zone. The first zone including a first flat surface region and multiple first discrete holes connected to a corresponding first conduit and arranged in a first row. The second zone including a second flat region and multiple second discrete holes connected to a corresponding second conduit. The inner return zone being disposed between and adjacent to the first zone and the second zone and including multiple inner return discrete holes connected to a corresponding inner return conduit and arranged in an inner return row. The first row and the inner return row are parallel. A portion of an edge of each of the inner return discrete holes is recessed into the head surface.

Abstract: Disclosed is a substrate processing apparatus for cleaning and drying a substrate such as a semiconductor wafer. This substrate processing apparatus includes a liquid processing unit for processing a substrate by immersing the substrate in stored purified water, a drying unit arranged above the liquid processing unit and configured to dry the substrate, a substrate transfer apparatus for transferring the substrate between the liquid processing unit and drying unit, a fluid supply mechanism for supplying a fluid mixture containing vapor or mist of purified water and vapor or mist of a volatile organic solvent to the drying unit, and a controller for controlling the supply of the fluid mixture.

Abstract: A surface of a substrate can be dried cleanly after liquid-processed by a liquid processing method and a liquid processing apparatus. The liquid processing method includes forming a liquid film of a rinse solution on an entire surface of a substrate having thereon a hydrophobic region by supplying, onto a central portion of the surface of the substrate, the rinse solution for rinsing a chemical liquid supplied on the substrate at a first flow rate while rotating the substrate at a first rotation speed; forming a stripe-shaped flow of the rinse solution on the surface of the substrate by breaking the liquid film formed on the entire surface of the substrate; and moving a discharge unit configured to supply the rinse solution toward a periphery of the substrate until the stripe-shaped flow of the rinse solution is moved outside the surface of the substrate.

Abstract: A plurality of reagent dispensing tips (15) are inserted through frustoconical openings (28) in a cover (16) of a cleaning chamber in the form of intersecting axial bores (14) and sprayed with wash fluid from spray passages (34) in the peripheral wall (20) of the cover (16). Wash fluid from the spray passages (34) and flowing through the reagent dispensing tips (15), if hollow, can be drained from the cleaning chamber through a drain port (42). Air is drawn through the frustoconical openings (28) around the reagent dispensing tips (15) into the cleaning chamber, through filter element (64) and from a waste chamber (50) by a vacuum source (78) to remove wash fluid from and otherwise dry the reagent dispensing tips (15).

Abstract: The Furniture Pad Folding Machine is a dry cleaning machine that is multi-faceted; it can clean and disinfect furniture pads and the machine has the ability to fold furniture pads. The machine is portable and can function on the moving truck and at the warehouse.