Abstract: The invention provides, in one embodiment, a portable wash basin assembly for cleaning a tool. The portable wash basin assembly includes a wash basin having a base and at least one sidewall that extends upward from the base to an upper edge, and a plurality of recesses located at the upper edge of the wash basin. The wash basin is configured to support the tool in a first orientation in which a first portion of the tool can be supported within one of the recesses and a second portion of the tool can be supported upon the base, and a second orientation, in which the tool can be supported within two of the recesses on the wash basin.

Abstract: The present invention discloses a robot that moves on a surface. The robot includes a casing, a moving unit coupled to the casing, and a suction disk coupled to the casing. The casing, the suction disk and the surface are configured to form an airtight space. The robot further includes an air extraction module and a spray module. The air extraction module is disposed in the casing and is in communication with the airtight space, and the air extraction module is configured to generate a negative pressure in the airtight space. The spray module is coupled to the casing and configured to spray a liquid onto the surface.

Abstract: A piping system is provided, connecting a plurality of scrubbers which are disposed on a supporting structure, including a collecting pipe and a drain pipe. The collecting pipe has a main body and a plurality of protrusions, wherein the main body has an outer surface and a first central axis. The protrusions are protruding from the outer surface, and the first central axis is perpendicular to the supporting structure. The collecting pipe communicates with the scrubbers via the protrusions. The drain pipe is disposed under the supporting structure and has a second central axis, wherein the collecting pipe is extended through the supporting structure and connects to the drain pipe, and the first central axis is perpendicular to the second central axis.

Abstract: According to one embodiment, there is provided a cleaning apparatus including a substrate cleaner and a member cleaner. The substrate cleaner has a substrate cleaning member placed over a first region to be opposite a substrate and a second region different from the first region. The member cleaner is placed adjacent to the second region.

Abstract: A method and apparatus capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning. A substrate is held in a horizontal posture by a spin chuck and rotated about a vertical axis by a rotation motor, and when an outlet of the nozzle is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle has started to move, only one dried core is produced in the vicinity of the center of the substrate, and thus production of not less than two dried cores in the vicinity of the center of the substrate is prevented. The dried region is spread all over the surface of the substrate.

Abstract: Wafer carrier washing and drying apparatus and method, especially useful for the semiconducting industry.

Abstract: A center feed system allows residual byproduct to be injected into a vessel from within the center of the vessel. The center feed system can include an inlet sleeve that is attached to the vessel and a retractable injection nozzle that extends into the vessel to inject residual byproduct into the vessel and that retracts into the inlet sleeve after injecting the residual byproduct. A retractable injection nozzle may include one or more openings that each includes an insert that can be removed from the opening. The inserts can therefore be replaced to customize the functionality of the nozzle or to replace the inserts when they have become worn.

Abstract: A method capable of eliminating occurrence of a development failure when a DI water discharge nozzle 20 is scanned to dry a substrate by spinning is provided. A substrate W is held in a horizontal posture by a spin chuck 10 and rotated about a vertical axis by a rotation motor 14, and when an outlet of the nozzle 20 is scanned from a position opposed to a center of the substrate W to a position opposed to a circumferential edge while a cleaning solution being discharged, immediately after the nozzle 20 has started to move, only one dried core is produced in the vicinity of the center of the substrate W, and thus production of not less than two dried cores in the vicinity of the center of the substrate W is prevented. The dried region is spread all over the surface of the substrate W.

Abstract: Provided is a method for cleaning an ion implanted resist layer or a substrate after an ashing process. A duty cycle for turning on and turning off flows of a treatment liquid in two or more nozzles is generated. The substrate is exposed to the treatment liquid comprising a first treatment chemical, the first treatment chemical with a first film thickness, temperature, total flow rate, and first composition. A portion of a surface of the substrate is concurrently irradiated with UV light while controlling the selected plurality of cleaning operating variables in order to achieve the two or more cleaning objectives. The cleaning operating variables comprise two or more of the first temperature, first composition, first film thickness, UV wavelength, UV power, first process time, first rotation speed, duty cycle, and percentage of residue removal.

Abstract: A method for cleaning a substrate includes supplying to a substrate a film-forming processing liquid which includes a volatile component and forms a film on the substrate, vaporizing the volatile component in the film-forming processing liquid such that the film-forming processing liquid solidifies or cures on the substrate and forms a processing film on the substrate, supplying to the substrate having the processing film a strip-processing liquid which strips the processing film from the substrate, and supplying to the processing film formed on the substrate a dissolving-processing liquid which dissolves the processing film after the supplying of the strip-processing liquid.

Abstract: A system and method are provided for washing, sanitizing, drying, and refilling beverage bottles, such as beer growlers. The sanitizing system is either built into a counter or may be built into a portable cart. The sanitizing system organizes a wash, rinse, sanitizing, and carbon dioxide nozzles in order of use within a drain basin, so that the operator can quickly and reliably move from one nozzle at an organized cleaning station. Further, the container can be dried, filled, and chilled by the carbon dioxide nozzle, so that the refilled beer can be protected by a head of carbon dioxide, preventing oxidation. Using the present sanitizing system and method thoroughly cleans and sanitizes the beverage container, preventing adulteration of the refilled beverage.

Abstract: An apparatus for treating a wafer-shaped article, comprises a spin chuck for holding a wafer-shaped article in a predetermined orientation, at least one upper nozzle for dispensing a treatment fluid onto an upwardly facing surface of a wafer-shaped article when positioned on the spin chuck, and at least one lower nozzle arm comprising a series of lower nozzles extending from a central region of the spin chuck to a peripheral region of the spin chuck. The series of nozzles comprises a smaller nozzle in a central region of the spin chuck and a larger nozzle in a peripheral region of the spin chuck. In the method according to the invention, a heated liquid is supplied through the series of nozzles so as to supply more heat to peripheral regions of a wafer than to central regions.

Abstract: A dishwasher for crockery or utensils, which is designed as a box-type dishwasher or as a conveyor dishwasher, wherein the dishwasher (1) has at least one wash tank (12), for accommodating a treatment fluid (20), and at least one final-rinse system, for supplying a final-rinse fluid (42). In order for it to be possible for expensive wash chemicals to be dispensed with for the most part, the dishwasher (1) also has a treatment-fluid generator (100) with at least one electrolysis device (109), wherein the treatment-fluid generator (100) is, or can be, connected to the wash tank (12) and is designed to supply an alkaline solution in the wash tank (12) of the dishwasher (1) by electrolysis.

Abstract: A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off a liquid remaining on the substrate, and a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate.

Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.

Abstract: The liquid processing apparatus includes: a liquid supply mechanism; a supply line connected to the liquid supply mechanism, the supply line having a discharge opening for discharging a temperature-regulated liquid; a processing unit supporting the discharge opening of the supply line; a return line configured to return the liquid supplied to the supply line to the liquid supply mechanism; and a liquid-supply switching valve configured to switch between supply of the liquid, which is used in a processing of an object to be processed in the processing unit, and stoppage of the liquid supply. The liquid-supply switching valve is disposed on the supply line on a route of the liquid returning from the supply line to the liquid supply mechanism through the return line.

Abstract: A method of cleaning a semiconductor substrate includes forming a water repellant protection film using a chemical liquid including a silane coupling agent on a surface of the semiconductor substrate; substituting the chemical liquid including the silane coupling agent with an alcohol; substituting the alcohol with a diluted alcohol; and substituting the diluted alcohol with pure water.

Abstract: A substrate processing apparatus includes a first gas supply system provided with a source gas supply control unit; a second gas supply system provided with a reactive gas supply control unit; a third gas supply system provided with a cleaning gas supply control unit; a shower head unit including a buffer chamber connected to the gas supply systems and a dispersion plate installed at a downstream side of the buffer chamber; a substrate support installed at a downstream side of the dispersion plate and electrically grounded; a process chamber accommodating the substrate support; a plasma generation unit including a power supply and a switch configured to switch plasma generation between the buffer chamber and the process chamber; and a control unit configured to control the source gas supply control unit, the reactive gas supply control unit and the plasma generation unit.

Abstract: A cleaning liquid and a gas are discharged in sequence to a central portion of a substrate while the substrate is being rotated, and after nozzles that discharge them are moved to a peripheral edge side of the substrate, discharge of the cleaning liquid is switched to a second cleaning liquid nozzle set at a position deviated from a movement locus of the first cleaning liquid nozzle. Both of the nozzles are moved toward the peripheral edge side of the substrate while discharging the cleaning liquid and discharging the gas so that a difference between a distance from the discharge position of the second cleaning liquid nozzle to the central portion of the substrate and a distance from the discharge position of the gas nozzle to the central portion of the substrate gradually decreases.

Abstract: A wafer cleaning method includes dispensing liquid chemicals at two flow rates to start a chemical reaction, with the second flow rate being lower than the first. The method also includes dispensing liquid waters at two flow rates to stop a chemical reaction, with the second flow rate being lower than the first.

Abstract: The present invention provides a gas-liquid two-phase atomizing cleaning device. The cleaning device comprises a gas-liquid two-phase atomizing spray head. The spray head is a double jacket structure and comprises a nozzle, a rotating arm, a gas guide tube and a liquid guide tube; wherein the nozzle is connected with the rotating arm, the gas guide tube and the liquid guide tube are fixed to the rotating arm, the gas guide tube and the liquid guide tube are both provided with pneumatic valves.

Abstract: An article of manufacture suitable for cleaning the top of a vehicle, comprising: at least one blower: and a support for said blower, wherein said support positions the blower to blow snow or debris from the top of a vehicle. This invention improves on prior art by using blowers to remove snow from large vehicles.

Abstract: A method for cleaning a component of a nitride semiconductor manufacturing apparatus to which has adhered deposits containing nitride semiconductor comprises a step for chemically treating the component of the nitride semiconductor manufacturing apparatus with a cleaning gas containing a chlorine-based gas, and a step for removing the deposits from the component of the nitride semiconductor manufacturing apparatus by spraying with a sublimable solid substance.

Abstract: There is provided a substrate processing apparatus including: a substrate holder configured to hold a substrate on which a resist pattern is formed; a rinse solution supply unit configured to supply a rinse solution onto the substrate held by the substrate holder; a vapor supply unit configured to supply vapor of a first processing solution, which hydrophobicizes the resist pattern, onto the substrate on which the rinse solution is supplied from the rinse solution supply unit; and a rinse solution removing unit configured to remove the rinse solution from the substrate in an atmosphere including the vapor of the first processing solution supplied from the vapor supply unit.

Abstract: The present invention is a method of cleaning a substrate, comprising cleaning at least one surface of a substrate located in a liquid by injecting pressurized cleaning liquid containing bubbles or cleaning particles from a injection nozzle to at least one surface of the substrate.

Abstract: In an example embodiment, a linear wet system includes a carrier and a proximity head in a chamber. The proximity head includes three sections in a linear arrangement. The first section suctions liquid from the upper surface of a semiconductor wafer as the wafer is transported by the carrier under the proximity head. The second section is configured to cause a film (or meniscus) of cleaning foam which is a non-Newtonian fluid to flow onto the upper surface of the wafer. The third section is configured to cause a film of rinsing fluid to flow onto the upper surface of the wafer as the wafer is carried under the proximity head. The third section is defined partially around the second section and up to the first section, so that the third section and the first section create a confinement of the cleaning foam with respect to the chamber.

Abstract: A dishwasher including a control device in which a wash program is stored to control a wash cycle for cleaning items to be washed. A water inlet device has a hot-water valve to take in hot water from an external hot-water supply and a cold-water valve to take in cold water from an external cold-water supply. The wash program has a wash step including an intake phase for taking in water via the water inlet device and a spraying phase for spraying the items to be washed with washing liquor containing the water that has been taken in via the water inlet device. The wash program includes a first phase of the intake phase during which the hot water is taken in via the hot-water valve and during which the temperature of the hot water that has been taken is measured by a temperature sensor.

Abstract: In a method for manufacturing a printed circuit board, a substrate, including a number of plated through holes (PTHs) is provided. Each of the PTHs has an electrically conductive layer plated on its inner wall and includes an electrically connecting portion and a stub. A protective layer is formed on a surface of the substrate adjacent to the stub. An etching device, including an upper plate and a number of spray tubes corresponding to the PTHs, is provided. Each of the spray tubes includes a protruding portion beyond the upper plate. The substrate is arranged in such a manner that the protective layer is in contact with the upper plate and the protruding portions are received in the stubs. After that, the protruding portions spray an etchant to etch and remove the electrically conductive layer of the stubs, and the protective layer is removed.

Abstract: A substrate processing apparatus includes a chamber configured to dispose a substrate to be processed with a substrate holder, a spin chuck to rotate the substrate, a gas discharging head configured to discharge a dehumidified gas to the substrate, a processing liquid supply nozzle, an IPA supply nozzle, and a driving device configured to move the gas discharging head between a retreat position of an upper part of the chamber and an approach position near the substrate. In particular, the gas discharging head is positioned at the approach position when the IPA is supplied to the substrate so that the dehumidified gas is supplied from the gas discharging head to the substrate when the IPA is supplied to the substrate.

Abstract: A substrate processing apparatus which holds and rotates a substrate substantially horizontally; having a control unit which controls a rinsing liquid supply mechanism for supplying a rinsing liquid onto the substrate; a gas knife mechanism that sprays gas onto the substrate to form a gas spraying zone and scans the entire substrate without rotating the substrate; a rinsing liquid mechanism for supplying a rinsing liquid onto the substrate at its area downstream from the gas spraying zone; and a drying unit for drying the substrate by rotating the substrate.

Abstract: A control system for multiple sterilization chambers for the sterilization of medical and other instruments interact with a common vacuum pump, steam generator and ozone generator via a common controller. Instead of placing all instruments of one type in one large chamber and running one generic sterilization program followed by another such program, instruments may be grouped by the type of sterilization program needed and the sterilization programs may be run using a single pump and a single ozone generator fed into multiple sterilization chambers controlled by the controller. One smaller and less expensive vacuum pump and ozone generator may be sufficient to sterilize large amounts of medical equipment present in the total assembly of chambers. The controller may run sterilization programs in parallel fully or overlapping partially in time. Control valves governing flow passage of air, steam and ozone in and out of the chambers are also controlled by the controller.

Abstract: A liquid processing apparatus including: a second housing; a first housing capable of being brought into contact with the second housing; a holding part configured to hold an object to be processed; a rotation driving part configured to rotate the object to be processed held by the holding part; front-side process-liquid supply nozzle configured to supply a process liquid onto a peripheral portion of a front surface of the object to be processed held by the holding part; and a storage part disposed on a side of a rear surface of the object to be processed held by the holding part, the storage part being configured to store the process liquid having been passed through the object to be processed. The respective first housing and the second housing can be moved in one direction, so that the first housing and the second housing can be brought into contact and separated from each other.

Abstract: A liquid treatment method including: retaining a substrate with a treatment target surface being set as a lower surface, and rotating the substrate; supplying DIW (deionized water) to the lower surface of the substrate, thereby performing a rinsing process to the substrate; and thereafter supplying a mist containing IPA (isopropyl alcohol) and N2 gas, thereby substituting the IPA for the DIW. The supplying of the mist is performed using a nozzle positioned below the substrate, the nozzle comprising a plurality of ejection ports which are arrayed between a position opposing a central portion of the substrate and a position opposing a peripheral portion of the substrate.

Abstract: In order to produce a particularly efficient device for deburring and/or cleaning a work piece that is dipped in a fluid medium comprising a fluid discharge device for producing a high pressure fluid jet, it is proposed that the device should comprise a gas discharge device for the production of a gas flow which at least partially envelops the fluid jet.

Abstract: A substrate holder is defined to support a substrate. A rotating mechanism is defined to rotate the substrate holder. An applicator is defined to extend over the substrate holder to dispense a cleaning material onto a surface of the substrate when present on the substrate holder. The applicator is defined to apply a downward force to the cleaning material on the surface of the substrate. In one embodiment the cleaning material is gelatinous.

Abstract: A laundry treatment machine and a washing method therefor are provided. During a rinsing operation, the laundry treatment machine may rotate a drum while supplying fluid into the drum. In addition, the laundry treatment machine may control a fluid circulation device to circulate the fluid, and thus, to spray the circulated fluid into the drum during the rotation of the drum. The drum realizes at least one of first through fourth motions. The laundry treatment machine may perform various rinsing operations in consideration of the fluid level in a tub.

Abstract: A substrate processing system which enables a minute piece of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied.

Abstract: A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.

Abstract: With the waste container washing system described herein, the waste container can be moved into a washing compartment of the washing vehicle for washing thereof; in a first washing phase, the waste container can be exposed to a plurality of water jets of grey water pumped from a grey water reservoir; and in a second washing phase, the waste container can be exposed to a plurality of clean water pumped from a clean water reservoir. The water used in the first and/or second washing phase can be collected and stored in the grey water reservoir. Other improvements, such as a double-action pump for the two phases, a filtering system for grey water, a container movement system and path, and methods are also described.

Abstract: A washing/drying machine according to the present invention is capable of efficiently performing a drying operation to reduce a drying period. The washing/drying machine includes a tank (11) for storing used water, and the water is circulated from the tank (11) for dehumidification of air circulated through a drying air duct (20). Since the water is circulated from the tank (11), a great amount of water can be supplied as dehumidification water for higher dehumidification efficiency. The amount of the circulated water (the amount of cooling water (dehumidification water)) is reduced in a first half of a drying process, and increased in a second half of the drying process. As a result, the drying efficiency is improved during the drying operation, thereby reducing the drying period.

Abstract: A dishwasher comprising a tub at least partially defining a treating chamber in which liquid may be sprayed from at least one sprayer for the treating of dishes within the treating chamber. A liquid recirculation system may be provided for recirculating the sprayed liquid back to the at least one sprayer. An ozone generator may be provided in communication with the treating chamber to supply ozone to the treating chamber.

Abstract: Provided are a substrate liquid processing apparatus, a substrate liquid processing method, and a computer readable storage medium having a substrate liquid processing program stored therein that can prevent the occurrence of the electrostatic breakdown caused by the discharge of electric charges in a substrate. The substrate liquid processing apparatus processes a circuit-forming surface of the substrate with a chemical liquid. Furthermore, prior to processing the substrate with the chemical liquid, the substrate liquid processing apparatus performs an anti-static process for an surface opposite to the circuit-forming surface of the substrate by an anti-static liquid, thereby emitting the electric charges on the substrate.

Abstract: The present invention describes a drying system for a dishwasher having a washing tub (2). The drying system comprises: a first fan (3) for propelling a first air stream through the washing tub (2) to an air transporting space (9) situated in the dishwasher outside the washing tub (2), wherein the first air stream is propelled in such a way that humidity in the washing tub (2) is absorbed by the first air stream and propelled to the air transporting space (9); and a second fan (4) for propelling a second air stream received from an area outside the dishwasher to the air transporting space (9). The drying system is further arranged such that the first and the second air streams are mixed in the air transporting space (9), and in that the mixed air stream is propelled to an exhaust opening (10) leading out from the dishwasher. Thereby, an efficient drying process can be achieved wherein air leaving the dishwasher has an appropriate temperature and humidity.

Abstract: A cleaning system which includes an enclosure and having a door with a transparent window. The door is opened and closed to load and unload products to be cleaned. An operator puck on the outside of the enclosure couples magnetically to another actuator puck on the inside of the enclosure. This coupling allows an operator to move and direct the inside puck to actuate spray or air blast functions, without opening the enclosure. The outside operator puck includes one or more switches which turn on the various electronic components such as the liquid pump, light, or air blast valve. The cleaning system enables a user to efficiently direct cleaning action to parts inside to minimize the cleaning time, and to prevent exposure of chemicals. The cleaning fluid is cycled out of the enclosure continuously, and into a “trap” box, through a pump and back into the cleaner box in a closed loop cycle.

Abstract: In one embodiment, a method for cleaning a showerhead electrode my include sealing a showerhead electrode within a cleaning assembly such that a first cleaning volume is formed on a first side of the showerhead electrode and a second cleaning volume is formed on a second side of the showerhead electrode. An acidic solution can be loaded into the first cleaning volume on the first side of the showerhead electrode. The first cleaning volume on the first side of the showerhead electrode can be pressurized such that at least a portion of the acidic solution flows through one or more of the plurality of gas passages of the showerhead electrode. An amount of purified water can be propelled through the second cleaning volume on the second side of the showerhead electrode, and into contact with the second side of the showerhead electrode.

Abstract: An electronic material cleaning system includes a chemical cleaning means, a wet cleaning means and a single-wafer cleaning apparatus. The chemical cleaning means comprises a functional chemical storage tank and an electrolytic reaction apparatus connected to the functional chemical storage tank via a concentrated sulfuric acid electrolysis line. The functional chemical storage tank can supply a functional chemical to the single-wafer cleaning apparatus via a functional chemical supply line. The wet cleaning means comprises a pure water supply line, a nitrogen gas supply line connected to a nitrogen gas source and an internal mixing type two-fluid nozzle connected respectively to the pure water supply line and the nitrogen gas supply line. Droplets generated from a nitrogen gas and ultrapure water can be sprayed from the tip of the two-fluid nozzle.

Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus includes a first chamber through which a substrate is conveyed, a second chamber where an oxide film formed on the substrate conveyed from the first chamber is removed; and a third chamber that discharges the substrate conveyed from the second chamber to the outside after rinsing the substrate, wherein the first chamber and the third chamber are disposed on top and on bottom.

Abstract: A device to provide improved anti-smudging, better gripping and longer shelf-life to products and surfaces includes an electric superheated steam generator and an electric low-ion plasma generator to provide superheated steam and low-ion plasma to the surfaces of products including plastics. One embodiment envisions the superheated steam generator and the low-ion plasma generator being contained in a housing while another embodiment anticipates a conveyor means positioned in front of the superheated steam generator and the low-ion plasma generator. A method for the improving of anti-smudging, gripping and shelf-life for properties includes the application of superheated steam and low-ion plasma by means of a superheated steam generator and a low-ion plasma generator to products for specific periods of time and at specific distances to attain desired surface and bulk properties. The superheated steam and low-ion plasma may be applied individually, simultaneously or sequentially.

Abstract: A fluid separation apparatus suitable for separating a mixed fluid with different properties and capable of separating a complex fluid mixture efficiently is provided. The fluid separation apparatus includes a sampling entrance, a first separation column, a second separation column, a bypass line, a detector and a guide multi-channel valve. A mixed fluid flows into the first separation column via the sampling entrance. The second separation column is connected to the first separation column in series and connected to the bypass line in parallel. The detector is connected to the second separation column and the bypass line. The guide multi-channel valve has different modes to control a flow-through status and a closed status between the first separation column and the second separation column, between the first separation column and the bypass line, between the second separation column and the detector, and between the bypass line and the detector.

Abstract: A liquid treatment method including: retaining a substrate with a treatment target surface being set as a lower surface, and rotating the substrate; supplying DIW (deionized water) to the lower surface of the substrate, thereby performing a rinsing process to the substrate; and thereafter supplying a mist containing IPA (isopropyl alcohol) and N2 gas, thereby substituting the IPA for the DIW. The supplying of the mist is performed using a nozzle positioned below the substrate, the nozzle comprising a plurality of ejection ports which are arrayed between a position opposing a central portion of the substrate and a position opposing a peripheral portion of the substrate.