Abstract: A gold alloy having, expressed by weight, about 24.5 to 25.5% Au, about 19.0 to 23.0% Ag, about 43.0 to 47.0% Cu, about 6.0 to 10.0% Zn, about 0.05 to 0.30% Si, and about 0.005 to 0.03% Ir. Alternatively, a alloy having, expressed by weight, about 16-17% Au, about 19-23% Ag, about 50-55% Cu, about 6-10% Zn, about 0.05-0.30% Si, and about 0.005-0.03% Ir.

Abstract: A high strength titanium copper alloy consists of Ti at 2.0% by mass or more to 3.5% by mass or less; the balance of copper and inevitable impurities; an average grain size of 20 ?m or less; and a 0.2% proof stress expressed by “b” of 800 N/mm2 or more. The alloy further comprises a bending radius ratio (bending radius/sheet thickness) not causing cracking as expressed by “a” by a W-bending test in a transverse direction to a rolling direction, wherein “a” and “b” satisfy a?0.

Abstract: A copper alloy sheet has a chemical composition containing 0.7 to 4.0 wt % of Ni, 0.2 to 1.5 wt % of Si, and the balance being copper and unavoidable impurities, the copper alloy sheet having a crystal orientation which satisfies I{200}/I0{200}?1.0, assuming that the intensity of X-ray diffraction on the {200} crystal plane on the surface of the copper alloy sheet is I{200} and that the intensity of X-ray diffraction on the {200} crystal plane of the standard powder of pure copper is I0{200}, and which satisfies I{200}/I{422}?15, assuming that the intensity of X-ray diffraction on the {422} crystal plane on the surface of the copper alloy sheet is I{422}.

Abstract: A method for laser welding a pair of overlapping metal members together and a weld joint produced by the method. At least one of the metal members has a protective metal coating. The method includes applying a thin layer of an alloying agent on at least one of the metal members between the metal members, melting the protective metal coating and the alloying agent to form an alloy that is disposed between the overlapping members with zero gap, welding the overlapping metal members together to form a weld, and controlling the amount of the alloying agent such that the extended solid solubility of the alloying agent in the weld is not exceeded.

Abstract: A member for water works is proposed in which the content of lead is limited to a very small values while maintaining its mechanical properties, castability, machinability, pressure resistance, etc. to levels equivalent to those of conventional copper alloys containing lead. A copper alloy is produced which contains not less than 2.0% by weight and not more than 5.9% by weight of tin, not less than 1.5% by weight and not more than 5.0% by weight of nickel, not less than 5.0% by weight and not more than 12.1% by weight of zinc, not less than 0.4% by weight and not more than 3.3% by weight of bismuth, and not less than 0.009% by weight and not more than 0.15% by weight of phosphorus, the balance being copper and impurities.

Abstract: A copper alloy material has a rolled surface having a plurality of crystal faces parallel to the rolled surface. The crystal faces includes at least one crystal face selected from a group consisted of {011}, {1nn} (n is an integer, n?1), {11m} (m is an integer, m?1), {023}, {012}, and {135}. Diffraction intensities of the crystal faces in an inverse pole figure obtained by crystal diffraction measurement of the rolled surface as a reference satisfy the relationships of: {011}>{155}>{133}, {011}>{023}>{012}, and {011}>{135}>{112}.

Abstract: This invention relates to group IB-IIIA. VIA quaternary or higher alloys. More particularly, this invention relations to group IB-IIIA-VIA quaternary or pentenary alloys which are suitable for use as semiconductor films. More specifically, the invention relates to quaternary or pentenary alloys which are substantially homogeneous and are characterized by an x-ray diffraction pattern (XRD) having a main [112] peak at a 2? angle (2?(112)) of from 26° to 28° for Cu radiation at 40 kV, wherein a glancing incidence x-ray diffraction pattern (GIXRD) for a glancing angle of from 0.2° to 10° reflects an absolute shift in the 2?(112) angle of less than 0.06°.

Abstract: The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones.

Abstract: Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent sprig-back resistance. The copper alloy sheet material has a composition containing, by mass, from 1.0 to 5.0% of Ti, and optionally containing at least one of at most 0.5% of Fe, at most 1.0% of Co and at most 1.5% of Ni, and further optionally containing at least one of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V in an amount within a suitable range, with the balance of Cu and inevitable impurities, and having a crystal orientation satisfying the following expression (1) and preferably also satisfying the following expression (2). The mean crystal grain size of the material is controlled to be from 10 to 60 ?m. I{420}/I0{420}>1.0 ??(1) I{220}/I0{220}?3.

Abstract: A lead-free free-cutting copper-antimony alloy comprises in percentage by weight: 55 to 65% Cu, 0.3 to 2.0% Sb, 0.2 to 1.0% Mn, at least two elements selected from the group of Ti, Ni, B, Fe, Se, Mg, Si, Sn, P and rare-earth metal in amount of 0.1-1.0%, as well as balance Zn and unavoidable impurities. The brass alloys according to the present invention possess superior cutting property, weldability, corrosion resistance, dezincification resistance and high-temperature-oxidation resistance, and are suitable for use in drinking-water installations, domestic appliances, toy for children, fastener, etc. The process for producing such alloys is also proposed.

Abstract: A copper alloy material for electric/electronic parts, which is produced by the steps containing: finish rolling a copper alloy at a reduction ratio of 40% or less, subjecting the copper alloy finish-rolled to a heat treatment under the conditions at a temperature from 500° C. to 800° C. for a time period from 1 second to 100 seconds by means of a continuous annealing line, and strain relief annealing the copper alloy heat-treated under the conditions at a temperature from 400° C. to 600° C. for a time period from 30 seconds to 1000 seconds, wherein the copper alloy material for electric/electronic parts has rates of dimensional changes before and after the strain relief annealing in both directions parallel to and perpendicular to the rolling direction within the range from ?0.02% to +0.02%.

Abstract: In the present invention, there is provided a fabrication method of a material having an ultrafine grained structure characterized by including a step of providing a metal or an alloy having a stacking fault energy no greater than 50 mJ/mm2 and a step of introducing deformation twins having a twin interval no greater than 200 nm into structures of the metal or the alloy by processing the metal or the alloy. Further, according to this method, a material having an ultrafine grained structure characterized in that twins are included in a crystal structure and the twins have a twin interval no greater than 200 nm.

Abstract: An age-hardening copper alloy made of—as expressed in each case in weight %—0.4% to a maximum of 2% cobalt which is partially replaceable by nickel, 0.1% through 0.5% beryllium, optionally 0.03% through 0.5% zirconium, 0.005% through 0.1% magnesium and possibly a maximum of 0.15% of at least one element from the group including niobium, manganese, tantalum, vanadium, titanium, chromium, cerium and hafnium. The remainder is copper inclusive of production-conditioned impurities and usual processing additives. This copper alloy is used as the material for producing casting molds, in particular for the sleeves of continuous casting rolls as components of a two-roll casting installation.

Abstract: A lead-free copper alloy based on Cu—Zn—Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities.

Abstract: This copper alloy contains at least zirconium in an amount of not less than 0.005% by weight and not greater than 0.5% by weight, includes a first grain group including grains having a grain size of not greater than 1.5 ?m, a second grain group including grains having a grain size of greater than 1.5 ?m and less than 7 ?m, the grains having a form which is elongated in one direction, and a third grain group including grains having a grain size of not less than 7 ?m, and also the sum of ? and ? is greater than ?, and ? is less than ?, where ? is a total area ratio of the first grain group, ? is a total area ratio of the second grain group, and ? is a total area ratio of the third grain group, based on a unit area, and ?+?+?=1.

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, from 0.5% to 1.5% of silicon, and the balance is copper and inevitable impurities. Further, the total nickel plus cobalt content is from 1.7% to 4.3%, the ratio of nickel to cobalt is from 1.01:1 to 2.6:1, the amount of (Ni+Co)/Si is between 3.5 and 6, the electrical conductivity is in excess of 40% IACS and the yield strength is in excess of 95 ksi. An optional inclusion is up 1% of silver. A process to manufacture the alloy includes the sequential steps of (a). casting; (b). hot working; (c). solutionizing; (d). first age annealing; (e). cold working; and (f). second age annealing wherein the second age annealing temperature is less than the first age annealing temperature.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: A copper base alloy suitable for use as a material for a sliding member used under severe sliding conditions such as a floating bush bearing of a turbocharger used in automobiles is disclosed. The alloy comprises, by mass %, 15 to 25% Zn, 4.2 to 10% Di, 2 to 7% Mn, 1 to 3% Si and balance of Cu and unavoidable impurities, the alloy having a structure of which matrix is composed of ?-single phase, wherein a eutectic structure of the ?-phase and an Mn—Si compound and Bi particle are distributed throughout the matrix.

Abstract: Copper alloy having the basic composition Cu—Zn—Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0?0.25X+Y?8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting and cooling over the range from the liquidus line to 600° C. at a rate of at least 50° C./min; the ingot is hot rolled at a temperature not higher than 900° C. and then subjected to repeated cycles of cold rolling and annealing at 300-650° C. to control the size of crystal grains, thereby producing a rolled strip having a 0.2% yield strength of at least 600 N/mm2, a tensile strength of at least 650 N/mm2, an electrical conductivity of at least 20% IACS, a Young's modulus of no more than 120 kN/mm2 and a percent stress relaxation of no more than 20%.

Abstract: The invention includes a physical vapor deposition target composed of a face centered cubic unit cell metal or alloy and having a uniform grain size less than 30 microns, preferably less than 1 micron; and a uniform axial or planar <220> texture. Also described is a method for making sputtering targets. The method can comprise billet preparation; equal channel angular extrusion with a prescribed route and number of passes; and cross-rolling or forging subsequent to the equal channel angular extrusion.

Abstract: The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at least about 10 percent each of (111), (200), (220) and (311). In addition, the sputter target has a grain size of less than about 10 ?m for improving sputter uniformity and reducing sputter target arcing.

Abstract: The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu—Zr alloy having a diameter of 0.1 ?m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm2.

Abstract: Oxidation resistant and burn resistant copper metal matrix composites are described. The copper metal matrix composites include matrix alloys which contain about 2.5 to about 6 weight percent aluminum, about 3 to about 30 weight percent of nickel or zinc, or a combination of about 30 to about 50 weight percent of nickel and zinc, with the balance being copper. Additionally, minor amounts of silicon, chromium, and titanium may also be present in the matrix alloy. The copper alloy matrix is optionally reinforced with about 15 to about 70 volume percent of ceramic particulates, whiskers or fibers.

Abstract: A turbocharger for an internal combustion engine, in which a bearing having excellent abrasion resistance without generating a black corrosion product in a high-temperature oil environment is provided. As bearing materials of a turbocharger, a copper alloy material containing, as main components, Cu, Zn, Al, Mn, and Si is employed. The elongating direction of an Mn—Si compound crystallized in the alloy material is set to the axial direction of a rotary shaft with respect to a radial bearing and is set to the direction perpendicular to the rotary shaft with respect to a thrust bearing.

Abstract: A brass is a base material, and a material containing Mn and Si is cast to make a ring material. Ametallic structure in the cross section of the ring material is under a condition where an intermetallic compound Mn5Si3 is uniformly and finely scattered and precipitated in the base material (brass composed of &agr;- and &bgr;-phase). A machined retainer provided by matching said material has an excellent sizing precision, sound affect resistance.

Abstract: The present invention relates to a die-casting brass alloy having a dezincification resistance, which is lower than 100 &mgr;m for a separate value according to British Standard BS 2872 in a die-casting condition (i.e. without a subsequent phase transforming heat treatment). The alloy according to the invention is characterized by the following composition: Cu: 63.6 weight-% Pb: 1.8 weight-% Si: 0.73 weight-% Al: 0.07 weight-% As: 0.06 weight-% Ni: 0.2 weight-% Sn: 0.3 weight-% Fe: 0.25 weight-% B: 8 ppm Other impurities: max. 0.3 weight-% Zn: remainder.

Abstract: A phosphorized copper anode used for electroplating, including: 20-800 ppm of phosphorus; between 0.1 and less than 2 ppm of oxygen, and the balance being high purity copper having a purity of 99.9999% by mass or higher, wherein the average grain size of the copper anode after recrystallization is in the range between about 10 and 50 &mgr;m.

Abstract: Disclosed is a lead-free copper alloy with superior properties as compared to currently available lead-free copper alloys which can be produced at lower costs than currently available lead-free copper alloys. The lead-free copper alloy uses a novel combination of tin, nickel and zinc along with selenium and bismuth to avoids the problems associated with leaded copper alloys, while maintaining physical properties comparable to traditional leaded copper alloys. In one embodiment, the lead-free copper alloy described contains from about 7.5 to 10.0 percent by weight zinc, from about 0.8 to 1.5 percent by weight nickel, from about 1.6 to 2.2 percent by weight bismuth, from about 0.04 to 0.35 percent by weight selenium, from about 2.2 to 3.0 percent by weight tin and up to about 0.3 percent by weight iron (maximum), the balance, apart from impurities, being copper. In an alternate embodiment, the lead-free copper alloy described contains from about 5 to 7.5 percent by weight zinc, from about 1.0 to 1.

Abstract: The material for a metal strip for manufacturing electrical contact component parts has, expressed in percent by weight, the following composition: nickel (Ni) 0.5-3.5% silicon (Si) 0.08-1.0%  tin (Sn) 0.1-1.0% zinc (Zn) 0.1-1.0% zirconium (Zr) 0.005-0.2%  silver (Ag) 0.02- 0.5%  The remainder is copper and includes impurities caused by smelting.

Abstract: An ingot of a copper-base alloy containing a total of 0.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from about 1.0 to about 15% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is carried out at 450 to 500° C., and the formed article is obtained by precipitation strengthening. In addition, in the aforementioned copper base alloy, molten material comprising a copper base alloy containing Ag in the amount of 3 to 8.5% is solidified by casting, and the solidified article or the hot worked article thereof is subjected to an aging treatment for precipitation and a thermomechanical treatment using forging or rolling, and the casting is obtained by forming the material into a specific shape and carrying out precipitation strengthening.

Abstract: A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.

Abstract: The invention is directed to a method for providing a corrosion inhibiting aqueous solution which includes zinc orthophosphate where the zinc orthophosphate is solubilized. The invention is directed to a method of making a substantially contaminant-free, concentrated aqueous solution of zinc orthophosphate from zinc metal or zinc oxide and aqueous phosphoric acid.

Abstract: A copper-based alloy includes one base phase selected from the group consisting of &agr; phase, &agr;+&bgr; phase, and &agr;+&bgr;+&ggr; phase, a component having a lower melting point than the base phase, and a component for dispersing the base phase and the low melting component to uniformly disperse the low melting component and improve the copper-based alloy in machinability. A method for producing the copper alloy in the form of a bar or plate includes the steps of compounding raw materials in predetermined ratios thereby obtaining a mixture, fusing the mixture thereby obtaining a melt, continuously casting the melt into a cast billet, or rolling the cast billet thereby obtaining a shaped mass, heat-treating the shaped mass, drawing or rolling the heat-treated shaped mass thereby obtaining a plastic mass, and subjecting the plastic mass to a heat-treatment of air cooling or furnace cooling.

Abstract: A copper alloy of high strength and high electroconductivity which is excellent in characteristics such as strength, electroconductivity and bending formability required as copper alloys for use in electric and electronic parts such as lead frames, terminals and connectors, as well as excellent in the characteristics such as softening resistance, shearing formability. Ag plating property and soldering wettability, the copper alloy comprising: Ni: 0.1 to 1.0% (means mass % here and hereinafter), Fe: 0.01 to 0.3%, P: 0.03 to 0.2%, Zn: 0.01 to 1.5%, Si: 0.01% or less; and Mg: 0.001% or less; in which the relation between the P content and the Si content satisfies the relation: P content/Si content≧10, and the relation for the Ni content, the Fe content and the P content can satisfy following relations: 5≦(Ni content+Fe content)/P content≦7 4≦Ni content/Fe content≦9.

Abstract: The free-cutting copper alloy according to the present invention contains a greatly reduced amount of lead in comparison with conventional free-cutting copper alloys, but provides industrially satisfactory machinability. The free-cutting alloys comprise 69 to 79 percent, by weight, of copper, 2.0 to 4.0 percent, by weight, of silicon, 0.02 to 0.4, by weight, of lead, and the remaining percent, by weight, of zinc.

Abstract: A lead-free free-cutting copper alloy having 69 to 79 percent, by weight, of copper; greater than 3 percent, by weight, of silicon; and a remaining percent, by weight, of zinc. The alloy preferable has greater than 3.0 percent and less than or equal to 4.0 percent, by weight, of silicon; and at least one element selected from among 0.02 to 0.4 percent, by weight, of bismuth, 0.02 to 0.4 percent, by weight, of tellurium, and 0.02 to 0.4 percent, by weight, of selenium. The alloy also preferable has at least one element selected from among 0.3 to 3.5 percent, by weight, of tin, 1.0 to 3.5 percent, by weight, of aluminum, and 0.02 to 0.25 percent, by weight, of phosphorus. In further embodiments, the alloy has at least one element selected from among 0.02 to 0.15 percent, by weight, of antimony, and 0.02 to 0.15 percent, by weight, of arsenic.

Abstract: The present invention provides a method and apparatus for forming a copper layer on a substrate, preferably using a sputtering process. The sputtering process involves bombarding a conductive member of enhanced hardness with ions to dislodge the copper from the conductive member. The hardness of the target may be enhanced by alloying the copper conductive member with another material and/or mechanically working the material of the conductive member during its manufacturing process in order to improve conductive member and film qualities. The copper may be alloyed with magnesium, zinc, aluminum, iron, nickel, silicon and any combination thereof.

Abstract: The invention is directed to a method for providing a corrosion inhibiting aqueous solution which includes zinc orthophosphate where the zinc orthophosphate is solubilized. The invention is directed to a method of making a substantially contaminant-free, concentrated aqueous solution of zinc orthophosphate from zinc metal or zinc oxide and aqueous phosphoric acid.

Abstract: A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1.8%-3.0% iron, 0.01%-1.0% zinc, 0.001 %-0.25% phosphorus, 0.1 %-0.35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.

Abstract: A sliding bearing having improved seizure resistance has the following structure: (a) A bearing layer (2). It comprises a copper alloy containing in a Cu matrix Ag, Sn, Sb, In, Mn, Fe, Bi, Zn, Ni and/or Cr. (b) A first sub-layer (3) of the bearing layer (2). First sub-layer (3) contains concentrated element, hexagonal compound or eutectic of said element(s). (c) A second sub-layer (2a) in which said element in essential solid-solution state. (d) Metal backing (1).

Abstract: A nickel-free white copper alloy represented by the general formula: CuaZnbMncAld or CuaZnbMncAldXe, wherein X is at least one element selected from the group consisting of Si, Ti and Cr; b, c, d and e are 0.5≦b<5, 7≦c≦17, 0.5≦d≦4 and 0<e≦0.3 in terms of % by weight; a is the balance, the alloy incidentally including unavoidable elements. The alloy is free from allergic problems, which may be caused by nickel, and has excellent strength, hardness, ductility, workability and corrosion resistance, suitable for use in elements, sliders, stoppers or the like for slide fasteners, or accessories such as metallic buttons, fasteners or the like for clothes.

Abstract: Copper alloy having the basic composition Cu—Zn—Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0≦0.25X+Y≦8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting and cooling over the range from the liquidus line to 600° C. at a rate of at least 50° C./min; the ingot is hot rolled at a temperature not higher than 900° C. and then subjected to repeated cycles of cold rolling and annealing at 300-650° C. to control the size of crystal grains, thereby producing a rolled strip having a 0.2% yield strength of at least 600 N/mm2, a tensile strength of at least 650 N/mm2, an electrical conductivity of at least 20% IACS, a Young's modulus of no more than 120 kN/mm2 and a percent stress relaxation of no more than 20%.

Abstract: A low friction, wear-resistant pin for a cam follower roller useful in the injector and valve trains of internal combustion engines, particularly diesel engines, to enhance cam durability and life is provided. The material selected for the pin, which is selected for its wear resistance, its corrosion resistance, its low friction, and its ability to embed hard debris and other oil contaminants without scuffing, has been demonstrated to improve cam life dramatically. A preferred roller pin material that achieves this objective is a copper-based alloy, most preferably a leaded manganese silicon bronze.

Abstract: There is provided a tin brass alloy having a grain structure that is refined by the addition of controlled amounts of both zinc and iron. Direct chill cast alloys containing from 1% to 4%, by weight of tin, from 0.8% to 4% of iron, from an amount effective to enhance iron initiated grain refinement to 35% of zinc and the remainder copper and inevitable impurities are readily hot worked. The zinc addition further increases the strength of the alloy and improves the bend formability in the "good way", perpendicular to the longitudinal axis of a rolled strip. Certain of the grain refined brass alloys are useful as semisolid forming feedstock.

Abstract: A leadframe of a single frame structure for supporting leads on IC chips. The leadframe is made of a high-strength, high-electroconductivity copper alloy. The copper alloy is produced by preparing an ingot of a copper alloy of 0.05-0.40 wt. % Fe, 0.05-0.40 wt. % Ni, 0.01-0.30 wt. % P, and optionally a total of 0.03-0.50 wt. % of either Sn or Zn or both and a total of 0.05-0.50 wt. % of at least one element of Ag, Co, B, Mn, Cr, Si, Ti and Zr, with the balance being Cu and incidental impurities, heating the ingot to 800 to 950.degree. C. and hot working the ingot to a reduction ratio of 50% or more, quenching the hot worked material from 600.degree. C. or above down to 300.degree. C. or below at a cooling rate of at least 1.degree. C./seconds, heat treating the quenched material at 380 to 520.degree. C. for 60-600 minutes without cold working, and subsequently carrying out cold working and heat treating at 450.degree. C.

Abstract: A corrosion-resistant copper material has a surface layer of a copper alloy containing 10-50 at % (i.e. % by atom) of silicon and of 10-1,000 .ANG. thick. It is produced simply by annealing a copper material containing 0.01-5 at % of silicon at 100-600.degree. C. in a hydrogen-containing gas. Because of its excellent resistance to surface corrosion due to heat and aging, the resulting copper material lends itself well to automotive and electrical applications requiring heat resistance, and is also suitable for use in electrical wire and in leadframes for semiconductor devices.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 0.1 to about 1.5% by weight, phosphorous in an amount from about 0.01 to about 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, zinc in an amount from about 1.0 to about 15% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: Copper alloy foils are provided having far greater strength and heat resistance than conventional copper foils, and having better productivity, are characterized by a composition comprising, all by weight, from 0.01 to 0.4% Cr, from 0.01 to 0.25% Zr, from 0.02 to 2.0% Zn; and when necessary from 0.05 to 1.8% Fe and from 0.05 to 0.8% Ti; and when further necessary one or more elements selected from the group consisting of Ni, Sn, In, Mn, P, Mg, Al, B, As, Cd, Co, Te, Ag, and Hf in a total amount of from 0.005 to 1.5%; the balance being copper and unavoidable impurities. Inclusions in the copper foil not larger than 10 .mu.m in size, and the inclusions between 0.5 and 10 .mu.m in size number less than 100 pieces/mm.sup.2.