Stock Patents (Class 148/400)
  • Patent number: 10039194
    Abstract: A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: July 31, 2018
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: Jeffery Serre, Alan Lenef, Adam Scotch
  • Patent number: 10017840
    Abstract: A copper alloy of the present invention contains 5.00 to 8.00 atomic percent of Zr and includes Cu and a Cu—Zr compound, and two phases of the Cu and the Cu—Zr compound form a mosaic-like structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 ?m or less are dispersed. This copper alloy is formed by a manufacturing method including a sintering step of performing spark plasma sintering on a Cu—Zr binary system alloy powder at a temperature of 0.9 Tm ° C. or less (Tm(° C.): melting point of the alloy powder) by supply of direct-currant pulse electricity, the Cu—Zr binary system alloy powder having an average grain diameter of 30 ?m or less and a hypoeutectic composition which contains 5.00 to 8.00 atomic percent of Zr. The Cu—Zr compound may include at least one of Cu5Zr, Cu9Zr2, and Cu8Zr3.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: July 10, 2018
    Assignees: NGK Insulators, Ltd., Tohoku University
    Inventors: Takashi Goto, Hisamichi Kimura, Akihisa Inoue, Naokuni Muramatsu
  • Patent number: 10010979
    Abstract: A solder paste for soldering micro components which suppress electro-migration is provided. The solder paste comprising: a powdered Pb-free soldering alloy comprising Cu of 0.1˜3.0 wt. % and In of 0.5˜8.0 wt. % simultaneously in addition to Sn; and a pasty or liquid flux; the powdered Pb-free soldering alloy and the pasty or liquid flux being mixed; whereby effectively suppressing electro-migration occurring at a solder bonding portion. It is possible to add Ag, Sb, Ni, Co, Fe, Mn and Cr as a strength improvement element, Bi and Zn as a melting point drop element and P, Ga and Ge as an anti-oxidant element to the powdered Pb-free soldering alloy.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: July 3, 2018
    Assignee: Nihon Almit Co., Ltd.
    Inventors: Tadashi Sawamura, Takeo Igarashi, Yukio Maeda, Kazuhiko Kaneko
  • Patent number: 9993996
    Abstract: This invention provides liquid-metal-based thixotropic fluids that, upon solidification with or without a mold, provide metal-matrix composite materials. The fluid is a liquid metal with dispersed solid particles, which can move substantially relative to one another. The liquid is essentially continuous; the solid is substantially discontinuous. The liquid substantially occupies the separation among the solid particles and essentially occupies a portion of the separation. The portion consists of a plurality of regions. Each region is in contact with the surface of a particle. This invention also provides a laminate consisting of metal-matrix composite layers that are essentially parallel and bonded to one another. This invention further provides a method of making a metal-based structure in the absence of a mold, with relevance to three-dimensional metal printing.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: June 12, 2018
    Inventor: Deborah Duen Ling Chung
  • Patent number: 9987710
    Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temperatures. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: 10-70 mass % of a powdered intermetallic compound comprising copper and tin and 30-90 mass % of a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: June 5, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Motoki Koroki, Shunsaku Yoshikawa, Sakie Okada, Taro Itoyama, Hideyuki Komuro, Naoko Hirai, Keitaro Shimizu
  • Patent number: 9981348
    Abstract: A solder alloy is substantially Ag-free and has desirable neat-resistance fatigue characteristics in a high-temperature environment as high as 150° C., even when used for soldering of electronic components having no leads. The solder alloy contains Sb, In, Cu, and Bi, and Sn accounting for the remainder, and satisfies the following formulae: 0.5?[Sb]?1.25 0.66[Sb]+4.16?[In]?6.0 0.5?[Cu]?1.2 0.1?[Bi]?0.5, wherein [Sb], [In], [Cu], and [Bi] represent the contents of Sb, In, Cu, and Bi, respectively, in mass %.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: May 29, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kiyohiro Hine, Akio Furusawa, Hidetoshi Kitaura
  • Patent number: 9965117
    Abstract: A display apparatus includes a first substrate on which a display area is defined; a second substrate facing the first substrate and including a touch screen layer on a surface thereof; and a sealing portion between the first substrate and the second substrate, and bonding the first substrate and the second substrate to each other. The sealing portion is formed around the display area, and the touch screen layer includes a plurality of sensing patterns and a plurality of bonding pad portions electrically connected to the plurality of sensing patterns. Each of the bonding pad portions includes a pad electrode electrically connected to the plurality of sensing patterns and a cover portion surrounding a part of the pad electrode, and the cover portion is opaque and is formed to overlap the sealing portion.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: May 8, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hun Kim, Hyojeong Kwon, Wonkyu Choe
  • Patent number: 9950496
    Abstract: A multi-layer preform sheet having at least a first layer and a second layer, the first layer being composed of a solder material that contains an intermetallic compound, and the second layer containing a first metal having a melting point of 300° C. or above, and a second metal capable of forming an intermetallic compound with the first metal.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: April 24, 2018
    Assignee: Napra Co., Ltd.
    Inventors: Shigenobu Sekine, Chihiro Shimaya
  • Patent number: 9737947
    Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: August 22, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Rickie C. Lake, William M. Hiatt
  • Patent number: 9731369
    Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: August 15, 2017
    Assignee: Intel Corporation
    Inventors: Ting Zhong, Rajashree Raji Baskaran, Aleksandar Aleks Aleksov
  • Patent number: 9656351
    Abstract: Provided is a solder material that has a high melting point and exhibits superior mechanical characteristics, and therefore can form a connecting portion with high heat-resistant reliability.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: May 23, 2017
    Assignee: Hiroshima University
    Inventors: Kazuhiro Matsugi, Kenichiro Suetsugu
  • Patent number: 9640283
    Abstract: Nuclear reactor systems and methods are described having many unique features tailored to address the special conditions and needs of emerging markets. The fast neutron spectrum nuclear reactor system may include a reactor having a reactor tank. A reactor core may be located within the reactor tank. The reactor core may include a fuel column of metal or cermet fuel using liquid sodium as a heat transfer medium. A pump may circulate the liquid sodium through a heat exchanger. The system may include a balance of plant with no nuclear safety function. The reactor may be modular, and may produce approximately 100 MWe.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: May 2, 2017
    Assignee: Advanced Reactor Concepts LLC
    Inventor: Leon C. Walters
  • Patent number: 9522220
    Abstract: A bioerodible endoprosthesis includes a bioerodible magnesium alloy including between 50 weight percent and 92 weight percent magnesium, at least 5.5 weight percent in sum of one or more elements selected from the group consisting of Ho, Er, Lu, Tb and Tm, and at least 2.0 weight percent in sum of one or more elements selected from the group consisting of Y, Nd and Gd. The bioerodible magnesium alloy has a microstructure including equiaxed Mg-rich solid solution-phase grains having an average grain diameter of less than or equal to 15 microns and second-phase precipitates and/or ceramic nanoparticles in grain boundaries between the equiaxed Mg-rich solid solution-phase grains. The secondary-phase precipitates or ceramic nanoparticles have an average longest dimension of 2.0 micron or less. The microstructure can be produced by one or more equal-channel high-strain processes.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: December 20, 2016
    Assignee: Boston Scientific SciMed, Inc.
    Inventor: Jacob Drew Edick
  • Patent number: 9511415
    Abstract: A forming method of a metal plate includes press-forming the metal plate with a die, and processing the press-formed metal plate by incremental-forming.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 6, 2016
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Kiyoshi Nonomura, Koji Kurozumi, Koji Inoue, Hiroyuki Horiuchi
  • Patent number: 9463532
    Abstract: A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell “glued” around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150° C.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: October 11, 2016
    Assignee: Sandia Corporation
    Inventors: Timothy J. Boyle, Ping Lu, Paul T. Vianco, Michael E. Chandross
  • Patent number: 9464198
    Abstract: A conductive paste providing an intended conductive pattern having high linearity and having no disconnection, short circuits, or the like even in the case of performing gravure offset printing with a gravure plate having a bezel pattern. A conductive paste for bezel-pattern printing performed by a gravure offset printing process includes conductive metal particles (A); an organic compound (B) that is solid at 50° C. and has a boiling point of more than 300° C. at normal pressure; an organic compound (C) that is liquid at 50° C. and has a boiling point of more than 300° C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170° C. to 300° C. at normal pressure. A method for forming a conductive pattern by a gravure offset printing process employs the above-described conductive paste.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: October 11, 2016
    Assignee: DIC Corporation
    Inventors: Yasuhiro Sente, Tsutomu Kanno, Tomoko Okamoto, Yoshinori Katayama
  • Patent number: 9328411
    Abstract: Provided is a method of producing an ytterbium sputtering target, wherein an ytterbium target material having Vickers hardness (Hv) of the material surface of 15 or more and 40 or less is prepared in advance, and a surface of the ytterbium target material having the foregoing surface hardness is subject to final finish processing by way of machining. With the ytterbium sputtering target, present invention aims to remarkably reduce the irregularities (gouges) on the target surface after the final finish processing of the target material, and to inhibit the generation of particles during sputtering.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: May 3, 2016
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Shiro Tsukamoto
  • Patent number: 9109275
    Abstract: Provided is a galvanized steel sheet having a tensile strength of 770 MPa or more including a steel sheet portion, and a plated layer formed on the surface of the steel sheet portion, in which the plated layer is a galvanized plated layer or an galvannealed plated layer, the steel sheet portion has a soft layer that directly adjoins the interface with the plated layer and an inside layer that is other than the soft layer, the thickness D of soft layer is 0.001% to 5% of thickness t of the steel sheet portion, and, when the hardness of the soft layer measured by nano-indentation method is indicated by H1, and the representative hardness of the steel sheet portion measured by the nano-indentation method is indicated by Ha in cross section that goes along the thickness direction of the steel sheet portion, H1 is 5% to 75% of Ha.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: August 18, 2015
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Yasuhide Morimoto, Nobuhiro Fujita, Akihiro Miyasaka, Kazuhiko Honda, Masafumi Azuma, Noriyuki Suzuki, Toshiki Nonaka
  • Publication number: 20150083280
    Abstract: A shaped metal casting made in an aggregate mold comprises fine solidification microstructure that is finer than the solidification microstructure of an analogous metal casting made from conventional molding processes. The solidification microstructure may be up to five times finer than the solidification microstructure of a conventionally prepared casting. In preferred embodiments, as a result of directional solidification, the fine solidification microstructure is substantially continuous from a distal end of the casting to a proximal end of the casting, and exhibits greatly enhanced soundness. Because of the control of the uniformity of freezing of the casting, its properties are substantially uniform.
    Type: Application
    Filed: November 26, 2014
    Publication date: March 26, 2015
    Applicant: ALOTECH LTD. LLC
    Inventors: John R. Grassi, John Campbell, J. Fred Major
  • Patent number: 8968494
    Abstract: The present invention provides a high-strength galvanized steel sheet having excellent ductility, stretch flangeability, and fatigue resistance, and a method for manufacturing the same. A high-strength galvannealed steel sheet having excellent formability and fatigue resistance is characterized in that the steel sheet is composed of steel having a composition containing, by % by mass, C: 0.05% to 0.3%, Si: 0.5% to 2.5%, Mn: 1.0% to 3.5%, P: 0.003% to 0.100%, S: 0.02% or less, Al: 0.010% to 0.1%, and the balance including iron and unavoidable impurities, and the steel sheet has a microstructure containing 50% or more of ferrite, 5% to 35% of martensite, and 2% to 15% of pearlite in terms of an area ratio, the martensite having an average gain size of 3 ?m or less and an average distance of 5 ?m or less between adjacent martensite grains.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: March 3, 2015
    Assignee: JFE Steel Corporation
    Inventors: Tatsuya Nakagaito, Yoshiyasu Kawasaki, Shinjiro Kaneko, Saiji Matsuoka, Yoshitsugu Suzuki
  • Patent number: 8943686
    Abstract: A method for coupling ends of two insulated conductors includes coupling a core of a first insulated conductor to a core of a second insulated conductor. Exposed portions of the cores are located inside a box with an open top. Electrically insulating powder material is placed into the box and a first plunger is inserted through the open top of the box to compact the powder material. Additional electrically insulating powder material is placed into the box and a second plunger is inserted through the open top of the box to compact the powder material into compacted powder material that surrounds the exposed portions of the cores. The compacted powder material is formed into a substantially cylindrical shape. A sleeve is placed over the compacted powder material and coupling the sleeve to the jackets of the insulated conductors.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: February 3, 2015
    Assignee: Shell Oil Company
    Inventors: Carrie Elizabeth Hartford, David Stuart Morgan
  • Patent number: 8911662
    Abstract: A powder for use in the powder metallurgical manufacture of components is provided. Particularly the subject matter concerns an iron or iron based powder intended for the powder metallurgical manufacturing of components. It is especially suitable for manufacturing of components wherein self-lubricating properties are desired. The subject matter further relates to a method of manufacturing a component from said powder and an accordingly produced component. A diffusion-bonded powder comprising iron or iron-based particles, and particles diffusion-bonded to the iron or iron-based particles is provided. The said particles diffusion-bonded to the iron or iron-based particles may comprise an alloy of Cu and 5% to 15% by weight of Sn. A component is provided which is at least partly formed from such a diffusion-bonded powder.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: December 16, 2014
    Assignee: Hoganas AB
    Inventor: Mats Larsson
  • Patent number: 8888932
    Abstract: A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided. The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: November 18, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
  • Patent number: 8845826
    Abstract: A Sn—Ag—Cu—Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder contains Ag: 2.8-4 mass %, Bi: 1.5-6 mass %, Cu: 0.8-1.2 mass %, and a remainder of Sn.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: September 30, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
  • Publication number: 20140283952
    Abstract: A method of processing a metal for improved damping of a metal part is provided. The method comprises placing the metal part inside a current carrying coil and closing a circuit for to apply current to the coil, thus producing a magnetic field in the metal part. Thereafter, the circuit is opened for a time and then the circuit is closed a second time to apply a second current to the coil. The circuit is then opened a second time and the metal part is removed from the current carrying coil.
    Type: Application
    Filed: June 10, 2011
    Publication date: September 25, 2014
    Inventors: Jason Paul Mitchick, Raju Karthik, Mauricio Gonzalez-Rocha, Jerzy Hieronim Sokolowski
  • Patent number: 8834747
    Abstract: Compositions containing tin nanoparticles and electrically conductive particles are described herein. The tin nanoparticles can have a size below about 25 nm so as to make the compositions fusable at temperatures below that of bulk tin (m.p.=232° C.). Particularly, when the tin nanoparticles are less than about 10 nm in size, the compositions can have a fusion temperature of less than about 200° C. The compositions can contain a whisker suppressant to inhibit or substantially minimize the formation of tin whiskers after tin nanoparticle fusion. In some embodiments, the compositions contain tin nanoparticles, electrically conductive particles comprising copper particles, and a whisker suppressant comprising nickel particles. Methods for using the present compositions are also described herein. The present compositions can be used as a lead solder replacement that allows rework to be performed.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: September 16, 2014
    Assignee: Lockheed Martin Corporation
    Inventor: Alfred A. Zinn
  • Patent number: 8831166
    Abstract: Zirconium-based metal alloy compositions comprise zirconium, a first additive in which the permeability of hydrogen decreases with increasing temperatures at least over a temperature range extending from 350° C. to 750° C., and a second additive having a solubility in zirconium over the temperature range extending from 350° C. to 750° C. At least one of a solubility of the first additive in the second additive over the temperature range extending from 350° C. to 750° C. and a solubility of the second additive in the first additive over the temperature range extending from 350° C. to 750° C. is higher than the solubility of the second additive in zirconium over the temperature range extending from 350° C. to 750° C. Nuclear fuel rods include a cladding material comprising such metal alloy compositions, and nuclear reactors include such fuel rods. Methods are used to fabricate such zirconium-based metal alloy compositions.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: September 9, 2014
    Assignee: Battelle Energy Alliance, LLC
    Inventor: Robert Dominick Mariani
  • Publication number: 20140174610
    Abstract: A tubular hollow member to which torsion about a center line is applied is characterized in performing a partial heat treatment on part of a peripheral wall of the hollow member to make the hardness of an outer portion of the peripheral wall greater than the hardness before heating and greater than the hardness of an inner portion of the peripheral wall, and reduce a residual stress of the inner portion of the peripheral wall.
    Type: Application
    Filed: April 23, 2012
    Publication date: June 26, 2014
    Applicants: FUJI GIKEN CO., LTD., Y-TEC CORPORATION
    Inventors: Takeshi Edahiro, Norifumi Akutagawa, Kyotaro Yamane, Teruhisa Hiraoka, Kazumi Yasuda, Shigeaki Ando, Masaru Hashimoto, Yuichi Ando, Tetsuya Tsuruta
  • Publication number: 20140158423
    Abstract: A solder alloy includes Sn, optional Ag, Cu, and Al wherein the solder alloy composition together with the solder alloy superheat temperature and rapid cooling rate from the superheat temperature are controlled to provide a dispersion of fine hard Cu—Al intermetallic particles in an as-solidified solder alloy microstructure wherein the particles are retained even after multiple solder reflow cycles often used in modern electronic assembly procedures to provide a particle strengthening to the solder joint microstructure as well as exert a grain refining effect on the solder joint microstructure, providing a strong, impact- and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
    Type: Application
    Filed: February 6, 2014
    Publication date: June 12, 2014
    Applicant: Iowa State University Research Foundation, Inc.
    Inventors: Iver E. Anderson, Kathlene N. Lindley
  • Patent number: 8734603
    Abstract: The invention relates to a method for producing a friction element (3) comprising the steps: providing a metal main body (10), hardening the main body (10) on at least part of its surface (11, 12) in a salt bath, wherein the salt bath hardening is the final method step, and no further processing of the hardened surface (11, 12) is performed. Furthermore, the invention relates to a friction element produced according to this method and a friction component comprising the latter.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: May 27, 2014
    Assignee: Miba Frictec GmbH
    Inventors: Zisis Tsioptsias, Gerhard Hartner
  • Patent number: 8668785
    Abstract: Provided is a method of producing high purity ytterbium, wherein the high purity ytterbium is obtained by reducing crude ytterbium oxide in a vacuum with reducing metals composed of metals having a low vapor pressure, and selectively distilling ytterbium. Additionally provided are methods of achieving the high purification of ytterbium which has a high vapor pressure and is hard to refine in a molten state, and high purity ytterbium obtained thereby. Further provided is technology for efficiently and stably obtaining a sputtering target made of high purity material ytterbium, and a thin film for metal gates containing high purity material ytterbium.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: March 11, 2014
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Yuichiro Shindo, Kazuto Yagi
  • Publication number: 20140060708
    Abstract: High modulus turbine shafts and high modulus cylindrical articles are described as are the process parameters for producing these shafts and cylindrical articles. The shafts/articles have a high Young's modulus as a result of having high modulus <111> crystal texture along the longitudinal axis of the shaft/article. The shafts are produced from directionally solidified seeded <111> single crystal cylinders that are axisymmetrically hot worked before a limited recrystallization process is carried out at a temperature below the recrystallization temperature of the alloy. The disclosed process produces an intense singular <111> texture and results in shaft or cylindrical article with a Young's modulus that is at least 40% greater than that of conventional nickel or iron alloys or conventional steels.
    Type: Application
    Filed: August 28, 2012
    Publication date: March 6, 2014
    Applicant: United Technologies Corporation
    Inventors: Dilip M. Shah, Herbert A. Chin, John Joseph Marcin, Paul L. Reynolds, Gabriel L. Suciu, Paul D. Genereux, Carl E. Kelly
  • Publication number: 20140065485
    Abstract: A complex alloy of at least three phases comprising a composite alloy composed of an Si single phase and an Si—Al-M alloy phase, and an L phase offers a negative electrode material. M is an element selected from transition metals and metals of Groups 4 and 5, and L is In, Sn, Sb, Pb or Mg. The negative electrode material provides a lithium ion battery with a high capacity and long life. The material itself is highly conductive and increases the energy density per volume of a lithium ion battery.
    Type: Application
    Filed: September 5, 2013
    Publication date: March 6, 2014
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naofumi Shinya, Takehisa Minowa
  • Patent number: 8663401
    Abstract: Compositions, apparatus incorporating a composition, and methods of use are described, one composition embodiment consisting essentially of one or more reactive metals in major proportion, and one or more alloying elements in minor proportion, with the provisos that the composition is high-strength, controllably reactive, and degradable under defined conditions. Compositions of the invention may exist in a variety of morphologies, including a reactive metal or degradable alloy processed into an alloy of crystalline, amorphous or mixed structure that may constitute the matrix of other composition, for instance a composite. Methods of using apparatus comprising a composition, particularly in oilfield operations are also described (e.g. flow and displacement control, sensors, actuators). This abstract allows a searcher or other reader to quickly ascertain the subject matter of the disclosure. It will not be used to interpret or limit the scope or meaning of the claims.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: March 4, 2014
    Assignee: Schlumberger Technology Corporation
    Inventors: Manuel P. Marya, Rashmi B. Bhavsar, Gary L. Rytlewski
  • Publication number: 20140027023
    Abstract: The invention relates to the manufacture of tanks from one ore more metal plates using a friction stir welding process The metal plate or plates is first formed into a tubular shape with one pair of opposite edges facing one another to form a longitudinal joint line, the opposite edges then being friction stir welded together. At least a part of the friction stir welded region is cold worked and subsequently the tube is heat treated at a temperature above the recrystallisation temperature.
    Type: Application
    Filed: October 3, 2013
    Publication date: January 30, 2014
    Applicant: LUXFER GROUP LIMITED
    Inventor: Kjeld Johansen
  • Patent number: 8603265
    Abstract: There are provided an Ni-based alloy high-chrome steel structure and its manufacturing method capable of joining Ni-based alloys and high-chrome steels by welding, and performing suitable heat treatment, thereby maintaining the strength in the joints.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: December 10, 2013
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Shin Nishimoto, Takashi Nakano, Yoshinori Tanaka, Tatsuaki Fujikawa, Kenji Kawasaki, Yoshikuni Kadoya, Ryuichi Yamamoto, Yuichi Hirakawa, Takashi Shige
  • Publication number: 20130312878
    Abstract: An electrically conductive GaAs crystal has an atomic concentration of Si more than 1×1017 cm?3, wherein density of precipitates having sizes of at least 30 nm contained in the crystal is at most 400 cm?2. In this case, it is preferable that the conductive GaAs crystal has a dislocation density of at most 2×10?2 cm2 or at least 1×10?3 cm2.
    Type: Application
    Filed: July 29, 2013
    Publication date: November 28, 2013
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takashi SAKURADA, Tomohiro KAWASE
  • Publication number: 20130306195
    Abstract: The sublimation capability of a porous metal plate used in a sublimator is maintained by heating the porous metal plate at an elevated temperature in a flowing stream of oxygen for an extended period of time to form an oxidized surface. A short chain molecule, such as citric acid, is attached to the oxidized surface having multiple functional carboxylate groups and no hydrophobic tail.
    Type: Application
    Filed: May 17, 2012
    Publication date: November 21, 2013
    Applicant: Hamilton Sundstrand Space Systems International, Inc.
    Inventors: John W. Steele, William F. Oehler, Tony Rector
  • Patent number: 8562755
    Abstract: A lead-free solder composition including about 90% to about 99% by weight of a lead-free tin solder based on the total weight of the lead-free solder composition and about 1% to about 10% by weight of a polyhedral oligomeric silsesquioxane based on the total weight of the lead-free solder composition.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: October 22, 2013
    Assignee: Lockheed Martin Corporation
    Inventors: Gregory T. Daly, Gary H. Yan
  • Publication number: 20130269837
    Abstract: A composition for diffusion surface alloying of ferrocarbon alloys with chromium, consisting essentially of, by weight, about 25%-40% ferrochromium; about 54%-74% aluminum oxide or mixtures of aluminum oxide, silicon oxide and magnesium oxide in a weight ratio of about 3:2:1; about 1%-3% ammonium chloride; and a reducing agent consisting essentially of about 0.1%-3% aluminum, about 0.1%-2% silicon, about 0.1%-1.5% magnesium, or about 0.1%-3% of a mixture of aluminum, silicon and magnesium in a weight ratio of about 3:2:1. A method for diffusion surface alloying of a ferrocarbon workpiece with chromium, comprising providing the above composition; exposing the workpiece to the composition; and heating the workpiece and composition for sufficient time and temperature to form a chromium containing diffusion layer on the surface of the workpiece.
    Type: Application
    Filed: April 17, 2012
    Publication date: October 17, 2013
    Inventors: Lidiya Omovna CHUNYAYEVA, Oleg Nikolayevich CHUNYAYEV, Leonid Leonidovich TOVAZHNYANSKYY
  • Patent number: 8545942
    Abstract: The present invention relates a method for producing clathrate compounds, comprising producing a homogeneous melt containing the desired elements in the desired ratio, and subsequently solidifying said melt to obtain the clathrate compound by quickly cooling the melt.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: October 1, 2013
    Assignee: Technische Universitä Wien
    Inventors: Andrey Prokofiev, Silke Bühler-Paschen, Herbert Sassik, Stefan Laumann, Peter Pongratz
  • Publication number: 20130248052
    Abstract: A binding agent includes 3-glycidyloxypropyltrimethoxysilane, ethanol, isopropyl alcohol, alkylphenol ethoxylate, acetic acid and sodium dodecylbenzenesulfonate. The surface treatment method using the binding agent and articles manufactured by the method is also provided.
    Type: Application
    Filed: June 27, 2012
    Publication date: September 26, 2013
    Applicants: FIH (Hong Kong) Limited, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: XU LIU, DA-HUA CAO
  • Publication number: 20130233456
    Abstract: The invention relates to a monolithic titanium alloy (M) comprising, in a temperature range (?T) and at atmospheric pressure: an outer peripheral zone consisting of a micro-structure (m1) having a modulus of elasticity (E1) and possessing superelastic properties in said range (?T), and a core consisting of a microstructure (m2) having a modulus of elasticity (E2), and possessing elastic properties in said range (?T); said microstructures (m1) and (m2) being different from one another, and said modulus of elasticity (E1) being lower than said modulus of elasticity (E2).
    Type: Application
    Filed: November 4, 2011
    Publication date: September 12, 2013
    Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Frédéric Prima, Sophie Nowak
  • Patent number: 8530088
    Abstract: A method of preparing nanoparticles includes using low-temperature plasma and a pulsed second process gas. Nanoparticles having uniform sizes and nanoparticles having a core-shell structure may be formed. A lithium battery includes an electrode that includes the nanoparticles.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: September 10, 2013
    Assignee: Samsung Electronics Co., Ltd. and Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Jin-hwan Park, Tae-sung Kim, Kwang-su Kim
  • Publication number: 20130216857
    Abstract: A metal alloy for use in a wire included in an electrochemical cell is disclosed having an amorphous structure, microcrystalline grains, or grains that are sized less than about one micron. In various embodiments, the microcrystalline grains are not generally longitudinally oriented, are variably oriented, or are randomly oriented. In some embodiments, the microcrystalline grains lack uniform grain size or are variably sized. In some embodiments, the microcrystalline grains have an average grain size of less than or equal to 5 microns. In some embodiments, the metal alloy lacks long-range crystalline order among the microcrystalline grains. In some embodiments, the wire is used in a substrate used in the electrochemical cell. In some embodiments, the metal alloy is formed using a co-extrusion process comprising warming up the metallic alloy and applying pressure and simultaneously passing a core material through a die to obtain a composite structure.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 22, 2013
    Applicant: Energy Power Systems, LLC
    Inventors: Subhash K. DHAR, Fabio ALBANO, Erik W. ANDERSON, Srinivasan VENKATESAN
  • Patent number: 8500925
    Abstract: The invention relates to a method for producing monotectic alloys with finely dispersed and homogeneously distributed second phase particles from two or more starting metals or alloys, in which the two or more metals or alloys are melted together or separately and the two or more, practically immiscible liquid metallic alloys are mixed to disperse the alloy of lower volume ratio with the other alloy of higher volume ratio, then the system is cooled below the eutectic temperature. The characteristic feature of the method is that at least one of the starting alloys contains stabilizing solid particles.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: August 6, 2013
    Assignees: Kutatási Közalapítvány Nanotechnológiai Kutatóintézete
    Inventors: György Kaptay, István Budai
  • Patent number: 8491774
    Abstract: Tin and tin alloy deposits which are substantially free of certain crystal planes or equivalents thereof inhibit or prevent whisker formation. The tin or tin alloy deposits which are free of these crystal planes and inhibit or prevent whisker formation may be deposited by electroplating. Tin alloys include tin/copper, tin/nickel, tin/silver, tin/bismuth, tin/zinc and tin/antimony. The tin and tin alloy baths used to deposit the tin and tin alloys may be acidic or alkaline.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: July 23, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: André Egli
  • Publication number: 20130180629
    Abstract: Provided is a manufacturing apparatus for an automobile part, comprising: a conveying path (20) for transferring an outer joint member (10) which is made of a metal and has an outer surface coated with a coating agent after induction quenching; and high-frequency induction coils (21, 22) arranged along an automobile part transferring direction of the conveying path (20), for simultaneously performing tempering of the outer joint member (10) and baking of the coating agent.
    Type: Application
    Filed: September 1, 2011
    Publication date: July 18, 2013
    Inventor: Shintaro Suzuki
  • Publication number: 20130133791
    Abstract: Disclosed herein is a method for decarburization of a rotor forging. In one aspect, a location for applying a weld prep to a rotor forging is identified. The rotor forging is decarburized at the identified location of the weld prep to attain a predetermined carbon content.
    Type: Application
    Filed: November 28, 2011
    Publication date: May 30, 2013
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Andrew Batton Witney, Lyle B. Spiegel
  • Patent number: 8430977
    Abstract: The present invention relates to a hollow drilling steel rod including a stem portion and a thread portion positioned at an end portion in an axial direction with respect to the stem portion, the hollow drilling steel rod being constituted of a steel having a specific composition described in the present specification, in which the thread portion includes a thread having been subjected to a high frequency quenching, and the thread portion and the stem portion separate from each other have been joined by a friction welding.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: April 30, 2013
    Assignee: Mitsubishi Materials Corporation
    Inventors: Masaya Hisada, Yoneo Hiwasa, Satoshi Nagase, Noritaka Takahata