Stock Patents (Class 148/400)
  • Patent number: 11830814
    Abstract: Provided are a wiring material for a semiconductor device, the wiring material including a boride-based compound containing boron and at least one metal selected from elements of Groups 2 to 14, a wiring for a semiconductor device including the same, and a semiconductor device including the wiring containing the wiring material.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: November 28, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joungeun Yoo, Youngjae Kang, Duseop Yoon
  • Patent number: 11817364
    Abstract: Embodiments include semiconductor packages and methods of forming such packages. A semiconductor package includes a die on a package substrate, an integrated heat spreader (IHS) on the package substrate and above the die, and a solder thermal interface material (STIM) coupling the die to the IHS. The semiconductor package includes a low-temperature solder (LTS) paste comprising an alloy of tin and bismuth (Bi), and the LTS paste on a bottom surface of the package substrate having a ball grid array. The LTS paste may have a weight percentage of Bi greater than 35% and a melting point less than or equal to a melting point of the STIM, where the STIM includes indium. The weight percentage of Bi may be between approximately 35% to 58%. The semiconductor package may include a solder ball coupling the LTS paste on the package substrate to the LTS paste on a second package substrate.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: November 14, 2023
    Assignee: Intel Corporation
    Inventors: Rajasekaran Swaminathan, Mukul Renavikar
  • Patent number: 11807940
    Abstract: A plated steel material comprising a steel base material and an Al—Zn—Mg-based plating layer formed on a surface of the steel base material, wherein the plating layer has a predetermined chemical composition, and in a surface structure of the plating layer, there is, by area ratio, 2.0% or more of an acicular Al—Zn—Si—Ca phase.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: November 7, 2023
    Inventors: Takuya Mitsunobu, Takehiro Takahashi, Jun Maki
  • Patent number: 11613791
    Abstract: The invention relates to a method for coating a steel sheet or steel strip to which an aluminium-based coating is applied in a dip-coating process and the surface of the coating is freed of a naturally occurring aluminium oxide layer. In order to provide a low-cost method for coating steel sheets or steel strips that makes the steel sheets or steel strips outstandingly suitable for the production of components by means of press hardening and for the further processing thereof, it is proposed that transition metals or transition metal compounds are subsequently deposited on the freed surface of the coating to form a top layer. The invention also relates to a method for producing press-hardened components from the aforementioned steel sheets or steel strips with an aluminium-based coating.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: March 28, 2023
    Assignee: Salzgitter Flachstahl GmbH
    Inventors: Frank Beier, Kerstin Körner, Marc Debeaux
  • Patent number: 11603592
    Abstract: A surface treatment agent capable of forming a hexavalent chromium-free chemical conversion coating that can provide an excellent corrosion-resistant coating on various metallic materials; a metallic material having a surface treatment coating obtained therefrom; and a method of producing the same.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: March 14, 2023
    Assignee: Nihon Parkerizing Co., Ltd.
    Inventors: Yusuke Yamamoto, Satoshi Kawabe
  • Patent number: 11339451
    Abstract: A low-cost and high-formability 1180 MPa grade cold-rolled annealed dual-phase steel plate and a manufacturing method thereof are provided. The dual-phase steel plate has the following chemical composition by mass percentages: C: 0.1%-0.125%, Si: 0.4%-0.8%, Mn: 2.6%-2.9%, Al: 0.01%-0.05%, Nb: 0.01%-0.03%, and Ti: 0.01%-0.03%, the remainder being Fe and unavoidable impurities. By reasonable design of alloy elements and manufacturing processes, the dual-phase steel plate of the invention achieves a strength of 1180 MPa grade at a low cost, obtains a fine and uniform martensite-ferrite dual-phase structure that ensures excellent elongation rate and cold bending performance, and has good formability. The dual-phase steel plate has a yield strength of more than 850 MPa, a tensile strength of more than 1180 MPa, an elongation rate of 8% or more, and a parameter (R/t), characterizing the 90-degree cold bending performance, of 2.5 or less.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: May 24, 2022
    Assignee: BAOSHAN IRON & STEEL CO., LTD.
    Inventors: Peng Xue, Xiaodong Zhu, Wei Li
  • Patent number: 11285569
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: March 29, 2022
    Assignees: Henkel AG & Co. KGaA, Heraeus Duetschland GmbH & Co. KG, Alpha Assembly Solutions Inc.
    Inventors: Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Hamilton Steen, Klaus Muller, Werner Kruppa, Mathias Nowottnick, Klaus Wittke
  • Patent number: 11141787
    Abstract: The present disclosure provides for a method of making a part using powder metallurgy and material extrusion. The method includes forming a mold of a first material using material extrusion. The method includes depositing a second material within the mold. The second material is deposited as a powder. The method includes compacting the second material within the mold, and heating the mold and the second material within the mold. During the heating, the mold is separated from the material by melting, evaporating, or burning of the first material, and the second material is sintered. Also provided for are parts made by the method and a system for making such parts. The system includes a material extrusion head and a powder deposition head. Each head is articulable along three axes.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: October 12, 2021
    Inventors: Srinand Karuppoor, Manuel Marya
  • Patent number: 11097338
    Abstract: The invention is directed to the interventionless activation of wellbore devices using dissolving and/or degrading and/or expanding structural materials. Engineered response materials, such as those that dissolve and/or degrade or expand upon exposure to specific environment, can be used to centralize a device in a wellbore.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: August 24, 2021
    Assignee: Terves, LLC
    Inventor: Andrew J. Sherman
  • Patent number: 11090768
    Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: August 17, 2021
    Inventors: Pritha Choudhury, Morgana De Avila Ribas, Sutapa Mukherjee, Anil Kumar, Siuli Sarkar, Ranjit Pandher, Ravi Bhatkal, Bawa Singh
  • Patent number: 11052637
    Abstract: A structure containing a Sn layer or a Sn alloy layer includes a substrate, a Sn layer or Sn alloy layer formed above the substrate, and an under barrier metal formed between the substrate and the Sn layer or Sn alloy layer in the form of a single metal layer containing any one of Fe, Co, Ru and Pd, or an alloy layer containing two or more of Fe, Co, Ru and Pd.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: July 6, 2021
    Inventors: Shoya Iuchi, Masaru Hatabe, Takahiro Tanaka, Fuka Yamaoka
  • Patent number: 10781658
    Abstract: A method for operating in a borehole comprises disposing in a downhole environment a system comprising a tubular having a passage and a first restriction positioned inside the tubular; engaging a restrictor with the first restriction to block the passage; injecting a treatment fluid into the tubular, the treatment fluid comprising an invert emulsion, a carboxylic acid ester, or a combination comprising at least one of the foregoing; and degrading and removing the first restriction.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: September 22, 2020
    Inventors: Deepak Kumar, Anil Sadana, Michael Johnson
  • Patent number: 10738560
    Abstract: A sealing system for a flow channel includes a mandrel, a swellable element disposed about the mandrel, and a degradable polymeric element disposed on a surface of the swellable element and configured to delay swelling of the swellable element. The degradable polymeric element comprises one or more of the following: polyurethane; cured cyanate ester; an epoxy; polyimide; unsaturated polyester; or nylon.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: August 11, 2020
    Inventors: Ping Duan, Anil Sadana, Wayne Furlan
  • Patent number: 10731233
    Abstract: A composition for bonding includes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass %. A contained amount of nickel in mass % is less than or equal to a product of 2.8 multiplied by a term that is the contained amount of germanium in mass % to the power of 0.3.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: August 4, 2020
    Assignee: AGC Inc.
    Inventors: Minoru Yamada, Atsushi Yamada, Koichi Shibuya, Shinya Kikugawa, Keisuke Hanashima
  • Patent number: 10727194
    Abstract: To provide a lead-free solder the heat resistance temperature of which is high and thermal conductive property of which are not changed in a high temperature range. A semiconductor device of the present invention includes a solder material containing more than 5.0% by mass and 10.0% by mass or less of Sb and 2.0 to 4.0% by mass of Ag, and the remainder consisting of Sn and inevitable impurities, and a bonding layer including the solder material, which is formed between a semiconductor element and a substrate electrode or a lead frame.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: July 28, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Hirohiko Watanabe, Shunsuke Saito, Yoshitaka Nishimura, Fumihiko Momose
  • Patent number: 10625377
    Abstract: A bonding member having a container between a first foil and a second foil. The container includes metal particles having a melting point higher than a melting point of the first foil and a melting point of the second foil, a film material in which the metal particles are dispersed, and intermetallic compounds formed by a reaction between the first foil or the second foil and the metal particles. The first foil and the metal particles are bonded with the intermetallic compound interposed therebetween, and the second foil and the metal particles are bonded with the intermetallic compound interposed therebetween.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: April 21, 2020
    Inventor: Seitaro Washizuka
  • Patent number: 10625336
    Abstract: A castable, moldable, or extrudable structure using a metallic base metal or base metal alloy. One or more insoluble additives are added to the metallic base metal or base metal alloy so that the grain boundaries of the castable, moldable, or extrudable structure includes a composition and morphology to achieve a specific galvanic corrosion rates partially or throughout the structure or along the grain boundaries of the structure. The insoluble additives can be used to enhance the mechanical properties of the structure, such as ductility and/or tensile strength. The insoluble particles generally have a submicron particle size. The final structure can be enhanced by heat treatment, as well as deformation processing such as extrusion, forging, or rolling, to further improve the strength of the final structure as compared to the non-enhanced structure.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: April 21, 2020
    Assignee: Terves, LLC
    Inventors: Andrew Sherman, Brian Doud, Nicholas Farkas
  • Patent number: 10415109
    Abstract: A workpiece for an induction hardening is provided. The workpiece has a first inclined surface, a second inclined surface, and a connecting surface connecting the first inclined surface and the second inclined surface on a side toward which the first inclined surface and the second inclined surface approach each other. The connecting surface has a recessed portion. A hardened layer formed at the first inclined surface and another hardened layer formed at the second inclined surface do not overlap each other at the recessed portion.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: September 17, 2019
    Assignee: NETUREN CO., LTD.
    Inventor: Yutaka Kiyosawa
  • Patent number: 10240022
    Abstract: A component can include a degradable polymeric material that includes a thermoplastic elastomeric matrix and alloy particles disposed at least in part within the matrix where the alloy particles include aluminum and one or more metals selected from a group of alkali metals, alkaline earth metals, group 12 transition metals, and basic metals having an atomic number equal to or greater than 31.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: March 26, 2019
    Assignee: Schlumberger Technology Corporation
    Inventors: Indranil Roy, Shitong S. Zhu, Miranda Amarante
  • Patent number: 10208560
    Abstract: A pressure disintegrable device includes a first volume that further includes a first portion and a second portion. The first portion is adapted to transmit a pressure applied to the first volume to a second portion disposed on the first portion. The second portion is adapted to decrease a melting point thereof as the transmitted pressure increases beyond a predetermined pressure. The pressure disintegrable device may also include a layer disposed on the first volume that is adapted to create a seal between the first volume and an external structure.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: February 19, 2019
    Inventor: Manuel P. Marya
  • Patent number: 10195698
    Abstract: A lead-free, tin-based solder alloy contains about 0.6 to about 0.8 wt % copper, about 2.8 to about 3.2 wt % silver, about 2.8 to about 3.2 wt % bismuth, about 0.5 to about 0.7 wt % antimony, about 0.04 to about 0.07 wt % nickel, and about 0.007 to about 0.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: February 5, 2019
    Assignee: AIM Metals & Alloys Inc.
    Inventors: Mehran Maalekian, Karl Seelig
  • Patent number: 10167537
    Abstract: An electronic apparatus includes: a first electronic component including a first electrode; solder on the first electrode; and a phase containing In, Ag, and Cu, the phase being dispersed and included in the solder. And a method for manufacturing an electronic apparatus, the method includes: forming solder on a first electrode of a first component, the solder including a phase containing In, Ag, and Cu, the phase being dispersed in the solder.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: January 1, 2019
    Inventors: Taiki Uemura, Kozo Shimizu, Seiki Sakuyama
  • Patent number: 10039194
    Abstract: A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: July 31, 2018
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: Jeffery Serre, Alan Lenef, Adam Scotch
  • Patent number: 10017840
    Abstract: A copper alloy of the present invention contains 5.00 to 8.00 atomic percent of Zr and includes Cu and a Cu—Zr compound, and two phases of the Cu and the Cu—Zr compound form a mosaic-like structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 ?m or less are dispersed. This copper alloy is formed by a manufacturing method including a sintering step of performing spark plasma sintering on a Cu—Zr binary system alloy powder at a temperature of 0.9 Tm ° C. or less (Tm(° C.): melting point of the alloy powder) by supply of direct-currant pulse electricity, the Cu—Zr binary system alloy powder having an average grain diameter of 30 ?m or less and a hypoeutectic composition which contains 5.00 to 8.00 atomic percent of Zr. The Cu—Zr compound may include at least one of Cu5Zr, Cu9Zr2, and Cu8Zr3.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: July 10, 2018
    Assignees: NGK Insulators, Ltd., Tohoku University
    Inventors: Takashi Goto, Hisamichi Kimura, Akihisa Inoue, Naokuni Muramatsu
  • Patent number: 10010979
    Abstract: A solder paste for soldering micro components which suppress electro-migration is provided. The solder paste comprising: a powdered Pb-free soldering alloy comprising Cu of 0.1˜3.0 wt. % and In of 0.5˜8.0 wt. % simultaneously in addition to Sn; and a pasty or liquid flux; the powdered Pb-free soldering alloy and the pasty or liquid flux being mixed; whereby effectively suppressing electro-migration occurring at a solder bonding portion. It is possible to add Ag, Sb, Ni, Co, Fe, Mn and Cr as a strength improvement element, Bi and Zn as a melting point drop element and P, Ga and Ge as an anti-oxidant element to the powdered Pb-free soldering alloy.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: July 3, 2018
    Assignee: Nihon Almit Co., Ltd.
    Inventors: Tadashi Sawamura, Takeo Igarashi, Yukio Maeda, Kazuhiko Kaneko
  • Patent number: 9993996
    Abstract: This invention provides liquid-metal-based thixotropic fluids that, upon solidification with or without a mold, provide metal-matrix composite materials. The fluid is a liquid metal with dispersed solid particles, which can move substantially relative to one another. The liquid is essentially continuous; the solid is substantially discontinuous. The liquid substantially occupies the separation among the solid particles and essentially occupies a portion of the separation. The portion consists of a plurality of regions. Each region is in contact with the surface of a particle. This invention also provides a laminate consisting of metal-matrix composite layers that are essentially parallel and bonded to one another. This invention further provides a method of making a metal-based structure in the absence of a mold, with relevance to three-dimensional metal printing.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: June 12, 2018
    Inventor: Deborah Duen Ling Chung
  • Patent number: 9987710
    Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temperatures. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: 10-70 mass % of a powdered intermetallic compound comprising copper and tin and 30-90 mass % of a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: June 5, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Motoki Koroki, Shunsaku Yoshikawa, Sakie Okada, Taro Itoyama, Hideyuki Komuro, Naoko Hirai, Keitaro Shimizu
  • Patent number: 9981348
    Abstract: A solder alloy is substantially Ag-free and has desirable neat-resistance fatigue characteristics in a high-temperature environment as high as 150° C., even when used for soldering of electronic components having no leads. The solder alloy contains Sb, In, Cu, and Bi, and Sn accounting for the remainder, and satisfies the following formulae: 0.5?[Sb]?1.25 0.66[Sb]+4.16?[In]?6.0 0.5?[Cu]?1.2 0.1?[Bi]?0.5, wherein [Sb], [In], [Cu], and [Bi] represent the contents of Sb, In, Cu, and Bi, respectively, in mass %.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: May 29, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kiyohiro Hine, Akio Furusawa, Hidetoshi Kitaura
  • Patent number: 9965117
    Abstract: A display apparatus includes a first substrate on which a display area is defined; a second substrate facing the first substrate and including a touch screen layer on a surface thereof; and a sealing portion between the first substrate and the second substrate, and bonding the first substrate and the second substrate to each other. The sealing portion is formed around the display area, and the touch screen layer includes a plurality of sensing patterns and a plurality of bonding pad portions electrically connected to the plurality of sensing patterns. Each of the bonding pad portions includes a pad electrode electrically connected to the plurality of sensing patterns and a cover portion surrounding a part of the pad electrode, and the cover portion is opaque and is formed to overlap the sealing portion.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: May 8, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hun Kim, Hyojeong Kwon, Wonkyu Choe
  • Patent number: 9950496
    Abstract: A multi-layer preform sheet having at least a first layer and a second layer, the first layer being composed of a solder material that contains an intermetallic compound, and the second layer containing a first metal having a melting point of 300° C. or above, and a second metal capable of forming an intermetallic compound with the first metal.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: April 24, 2018
    Assignee: Napra Co., Ltd.
    Inventors: Shigenobu Sekine, Chihiro Shimaya
  • Patent number: 9737947
    Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: August 22, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Rickie C. Lake, William M. Hiatt
  • Patent number: 9731369
    Abstract: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: August 15, 2017
    Assignee: Intel Corporation
    Inventors: Ting Zhong, Rajashree Raji Baskaran, Aleksandar Aleks Aleksov
  • Patent number: 9656351
    Abstract: Provided is a solder material that has a high melting point and exhibits superior mechanical characteristics, and therefore can form a connecting portion with high heat-resistant reliability.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: May 23, 2017
    Assignee: Hiroshima University
    Inventors: Kazuhiro Matsugi, Kenichiro Suetsugu
  • Patent number: 9640283
    Abstract: Nuclear reactor systems and methods are described having many unique features tailored to address the special conditions and needs of emerging markets. The fast neutron spectrum nuclear reactor system may include a reactor having a reactor tank. A reactor core may be located within the reactor tank. The reactor core may include a fuel column of metal or cermet fuel using liquid sodium as a heat transfer medium. A pump may circulate the liquid sodium through a heat exchanger. The system may include a balance of plant with no nuclear safety function. The reactor may be modular, and may produce approximately 100 MWe.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: May 2, 2017
    Assignee: Advanced Reactor Concepts LLC
    Inventor: Leon C. Walters
  • Patent number: 9522220
    Abstract: A bioerodible endoprosthesis includes a bioerodible magnesium alloy including between 50 weight percent and 92 weight percent magnesium, at least 5.5 weight percent in sum of one or more elements selected from the group consisting of Ho, Er, Lu, Tb and Tm, and at least 2.0 weight percent in sum of one or more elements selected from the group consisting of Y, Nd and Gd. The bioerodible magnesium alloy has a microstructure including equiaxed Mg-rich solid solution-phase grains having an average grain diameter of less than or equal to 15 microns and second-phase precipitates and/or ceramic nanoparticles in grain boundaries between the equiaxed Mg-rich solid solution-phase grains. The secondary-phase precipitates or ceramic nanoparticles have an average longest dimension of 2.0 micron or less. The microstructure can be produced by one or more equal-channel high-strain processes.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: December 20, 2016
    Assignee: Boston Scientific SciMed, Inc.
    Inventor: Jacob Drew Edick
  • Patent number: 9511415
    Abstract: A forming method of a metal plate includes press-forming the metal plate with a die, and processing the press-formed metal plate by incremental-forming.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 6, 2016
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Kiyoshi Nonomura, Koji Kurozumi, Koji Inoue, Hiroyuki Horiuchi
  • Patent number: 9464198
    Abstract: A conductive paste providing an intended conductive pattern having high linearity and having no disconnection, short circuits, or the like even in the case of performing gravure offset printing with a gravure plate having a bezel pattern. A conductive paste for bezel-pattern printing performed by a gravure offset printing process includes conductive metal particles (A); an organic compound (B) that is solid at 50° C. and has a boiling point of more than 300° C. at normal pressure; an organic compound (C) that is liquid at 50° C. and has a boiling point of more than 300° C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170° C. to 300° C. at normal pressure. A method for forming a conductive pattern by a gravure offset printing process employs the above-described conductive paste.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: October 11, 2016
    Assignee: DIC Corporation
    Inventors: Yasuhiro Sente, Tsutomu Kanno, Tomoko Okamoto, Yoshinori Katayama
  • Patent number: 9463532
    Abstract: A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell “glued” around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150° C.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: October 11, 2016
    Assignee: Sandia Corporation
    Inventors: Timothy J. Boyle, Ping Lu, Paul T. Vianco, Michael E. Chandross
  • Patent number: 9328411
    Abstract: Provided is a method of producing an ytterbium sputtering target, wherein an ytterbium target material having Vickers hardness (Hv) of the material surface of 15 or more and 40 or less is prepared in advance, and a surface of the ytterbium target material having the foregoing surface hardness is subject to final finish processing by way of machining. With the ytterbium sputtering target, present invention aims to remarkably reduce the irregularities (gouges) on the target surface after the final finish processing of the target material, and to inhibit the generation of particles during sputtering.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: May 3, 2016
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Shiro Tsukamoto
  • Patent number: 9109275
    Abstract: Provided is a galvanized steel sheet having a tensile strength of 770 MPa or more including a steel sheet portion, and a plated layer formed on the surface of the steel sheet portion, in which the plated layer is a galvanized plated layer or an galvannealed plated layer, the steel sheet portion has a soft layer that directly adjoins the interface with the plated layer and an inside layer that is other than the soft layer, the thickness D of soft layer is 0.001% to 5% of thickness t of the steel sheet portion, and, when the hardness of the soft layer measured by nano-indentation method is indicated by H1, and the representative hardness of the steel sheet portion measured by the nano-indentation method is indicated by Ha in cross section that goes along the thickness direction of the steel sheet portion, H1 is 5% to 75% of Ha.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: August 18, 2015
    Inventors: Yasuhide Morimoto, Nobuhiro Fujita, Akihiro Miyasaka, Kazuhiko Honda, Masafumi Azuma, Noriyuki Suzuki, Toshiki Nonaka
  • Publication number: 20150083280
    Abstract: A shaped metal casting made in an aggregate mold comprises fine solidification microstructure that is finer than the solidification microstructure of an analogous metal casting made from conventional molding processes. The solidification microstructure may be up to five times finer than the solidification microstructure of a conventionally prepared casting. In preferred embodiments, as a result of directional solidification, the fine solidification microstructure is substantially continuous from a distal end of the casting to a proximal end of the casting, and exhibits greatly enhanced soundness. Because of the control of the uniformity of freezing of the casting, its properties are substantially uniform.
    Type: Application
    Filed: November 26, 2014
    Publication date: March 26, 2015
    Applicant: ALOTECH LTD. LLC
    Inventors: John R. Grassi, John Campbell, J. Fred Major
  • Patent number: 8968494
    Abstract: The present invention provides a high-strength galvanized steel sheet having excellent ductility, stretch flangeability, and fatigue resistance, and a method for manufacturing the same. A high-strength galvannealed steel sheet having excellent formability and fatigue resistance is characterized in that the steel sheet is composed of steel having a composition containing, by % by mass, C: 0.05% to 0.3%, Si: 0.5% to 2.5%, Mn: 1.0% to 3.5%, P: 0.003% to 0.100%, S: 0.02% or less, Al: 0.010% to 0.1%, and the balance including iron and unavoidable impurities, and the steel sheet has a microstructure containing 50% or more of ferrite, 5% to 35% of martensite, and 2% to 15% of pearlite in terms of an area ratio, the martensite having an average gain size of 3 ?m or less and an average distance of 5 ?m or less between adjacent martensite grains.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: March 3, 2015
    Assignee: JFE Steel Corporation
    Inventors: Tatsuya Nakagaito, Yoshiyasu Kawasaki, Shinjiro Kaneko, Saiji Matsuoka, Yoshitsugu Suzuki
  • Patent number: 8943686
    Abstract: A method for coupling ends of two insulated conductors includes coupling a core of a first insulated conductor to a core of a second insulated conductor. Exposed portions of the cores are located inside a box with an open top. Electrically insulating powder material is placed into the box and a first plunger is inserted through the open top of the box to compact the powder material. Additional electrically insulating powder material is placed into the box and a second plunger is inserted through the open top of the box to compact the powder material into compacted powder material that surrounds the exposed portions of the cores. The compacted powder material is formed into a substantially cylindrical shape. A sleeve is placed over the compacted powder material and coupling the sleeve to the jackets of the insulated conductors.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: February 3, 2015
    Assignee: Shell Oil Company
    Inventors: Carrie Elizabeth Hartford, David Stuart Morgan
  • Patent number: 8911662
    Abstract: A powder for use in the powder metallurgical manufacture of components is provided. Particularly the subject matter concerns an iron or iron based powder intended for the powder metallurgical manufacturing of components. It is especially suitable for manufacturing of components wherein self-lubricating properties are desired. The subject matter further relates to a method of manufacturing a component from said powder and an accordingly produced component. A diffusion-bonded powder comprising iron or iron-based particles, and particles diffusion-bonded to the iron or iron-based particles is provided. The said particles diffusion-bonded to the iron or iron-based particles may comprise an alloy of Cu and 5% to 15% by weight of Sn. A component is provided which is at least partly formed from such a diffusion-bonded powder.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: December 16, 2014
    Assignee: Hoganas AB
    Inventor: Mats Larsson
  • Patent number: 8888932
    Abstract: A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided. The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: November 18, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
  • Patent number: 8845826
    Abstract: A Sn—Ag—Cu—Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder contains Ag: 2.8-4 mass %, Bi: 1.5-6 mass %, Cu: 0.8-1.2 mass %, and a remainder of Sn.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: September 30, 2014
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yuji Kawamata, Minoru Ueshima, Tomu Tamura, Kazuhiro Matsushita, Masashi Sakamoto
  • Publication number: 20140283952
    Abstract: A method of processing a metal for improved damping of a metal part is provided. The method comprises placing the metal part inside a current carrying coil and closing a circuit for to apply current to the coil, thus producing a magnetic field in the metal part. Thereafter, the circuit is opened for a time and then the circuit is closed a second time to apply a second current to the coil. The circuit is then opened a second time and the metal part is removed from the current carrying coil.
    Type: Application
    Filed: June 10, 2011
    Publication date: September 25, 2014
    Inventors: Jason Paul Mitchick, Raju Karthik, Mauricio Gonzalez-Rocha, Jerzy Hieronim Sokolowski
  • Patent number: 8834747
    Abstract: Compositions containing tin nanoparticles and electrically conductive particles are described herein. The tin nanoparticles can have a size below about 25 nm so as to make the compositions fusable at temperatures below that of bulk tin (m.p.=232° C.). Particularly, when the tin nanoparticles are less than about 10 nm in size, the compositions can have a fusion temperature of less than about 200° C. The compositions can contain a whisker suppressant to inhibit or substantially minimize the formation of tin whiskers after tin nanoparticle fusion. In some embodiments, the compositions contain tin nanoparticles, electrically conductive particles comprising copper particles, and a whisker suppressant comprising nickel particles. Methods for using the present compositions are also described herein. The present compositions can be used as a lead solder replacement that allows rework to be performed.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: September 16, 2014
    Assignee: Lockheed Martin Corporation
    Inventor: Alfred A. Zinn
  • Patent number: 8831166
    Abstract: Zirconium-based metal alloy compositions comprise zirconium, a first additive in which the permeability of hydrogen decreases with increasing temperatures at least over a temperature range extending from 350° C. to 750° C., and a second additive having a solubility in zirconium over the temperature range extending from 350° C. to 750° C. At least one of a solubility of the first additive in the second additive over the temperature range extending from 350° C. to 750° C. and a solubility of the second additive in the first additive over the temperature range extending from 350° C. to 750° C. is higher than the solubility of the second additive in zirconium over the temperature range extending from 350° C. to 750° C. Nuclear fuel rods include a cladding material comprising such metal alloy compositions, and nuclear reactors include such fuel rods. Methods are used to fabricate such zirconium-based metal alloy compositions.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: September 9, 2014
    Assignee: Battelle Energy Alliance, LLC
    Inventor: Robert Dominick Mariani
  • Publication number: 20140174610
    Abstract: A tubular hollow member to which torsion about a center line is applied is characterized in performing a partial heat treatment on part of a peripheral wall of the hollow member to make the hardness of an outer portion of the peripheral wall greater than the hardness before heating and greater than the hardness of an inner portion of the peripheral wall, and reduce a residual stress of the inner portion of the peripheral wall.
    Type: Application
    Filed: April 23, 2012
    Publication date: June 26, 2014
    Inventors: Takeshi Edahiro, Norifumi Akutagawa, Kyotaro Yamane, Teruhisa Hiraoka, Kazumi Yasuda, Shigeaki Ando, Masaru Hashimoto, Yuichi Ando, Tetsuya Tsuruta