Abstract: A method for producing an Fe-based nanocrystalline alloy ribbon, the method including a step of supplying a molten Fe-based alloy onto a rotating chill roll, and rapidly solidifying the molten Fe-based alloy that has been supplied onto the chill roll, thereby obtaining an Fe-based amorphous alloy ribbon having a free solidified surface and a roll contact surface, and a step of heat-treating the Fe-based amorphous alloy ribbon, thereby obtaining an Fe-based nanocrystalline alloy ribbon; wherein an outer peripheral part of the chill roll is composed of a Cu alloy, and a thermal conductivity of the outer peripheral part is from 70 W/(m·K) to 225 W/(m·K).

Abstract: A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer substantially replicates the cube texture of the metal foil M. The process further includes electroplating a non-epitaxial layer of an alloy on the epitaxial layer. The process further includes separating the electroplated alloy from the cube textured metal foil M to obtain an electro-formed alloy with one cube textured surface.

Abstract: A method for producing an Fe-based nanocrystalline alloy ribbon, the method including a step of supplying a molten Fe-based alloy onto a rotating chill roll, and rapidly solidifying the molten Fe-based alloy that has been supplied onto the chill roll, thereby obtaining an Fe-based amorphous alloy ribbon having a free solidified surface and a roll contact surface, and a step of heat-treating the Fe-based amorphous alloy ribbon, thereby obtaining an Fe-based nanocrystalline alloy ribbon; wherein an outer peripheral part of the chill roll is composed of a Cu alloy, and a thermal conductivity of the outer peripheral part is from 70 W/(m·K) to 225 W/(m·K).

Abstract: A copper alloy for valve seats, and more particularly a copper alloy for valve seats with improved wear resistance, contains 12 to 24% by weight of Ni, 2 to 4% by weight of Si, 7 to 13% by weight of Cr, 20 to 35% by weight of Fe, and a balance of Cu and other impurities.

Abstract: Disclosed is a method of producing a copper alloy sheet material, wherein the copper alloy sheet material contains nickel (Ni) 0.5 to 1.5% by weight; cobalt (Co) 0.3 to 1.5% by weight; silicon (Si) 0.35 to 0.8% by weight; chromium (Cr) 0.05 to 0.5% by weight; a balance amount of copper (Cu); and inevitable impurities. Further, disclosed is a copper alloy sheet material produced using the method.

Abstract: The invention is a precipitation-strengthened copper alloy, including the following components in percentage by weight: 80 wt %-95 wt % of Cu, 0.05 wt %-4.0 wt % of Sn, 0.01 wt %-3.0 wt % of Ni, 0.01 wt %-1.0 wt % of Si, and the balance of Zn and unavoidable impurities. According to the invention, the comprehensive performance of the alloy is improved by solution strengthening and precipitation strengthening; while the strength of the matrix is improved, the electrical conductivity of the alloy is hardly affected, the bending workability meets the requirements, and the stress relaxation resistance comparable to that of tin phosphor bronze is achieved. The comprehensive performance of the alloy of the invention is superior to that of the tin phosphor bronze C51900. Furthermore, the alloy of the invention is low in raw material cost, has obvious advantages in welding and plating.

Abstract: A method of casting an article includes forming a melt comprising copper, introducing manganese into the melt to produce a copper-manganese alloy, and casting the copper-manganese alloy in a mold to form the article. The carbon and oxygen contents of the copper-manganese alloy are controlled in order to control the formation of graphite, manganese carbide, and/or manganese oxide particles within the article. Copper-manganese alloys containing carbon are also provided, as well as articles made therefrom in cast or wrought form.

Abstract: A method of producing a copper alloy material for automobile and electrical and electronic components. The copper alloy material produced by the method exhibits superior tensile strength, spring limit, electrical conductivity and bendability.

Abstract: There is provided a bonding wire that improves bonding reliability of a ball bonded part and ball formability and is suitable for on-vehicle devices. The bonding wire for a semiconductor includes a Cu alloy core material, and a Pd coating layer formed on a surface of the Cu alloy core material, and is characterized in that the Cu alloy core material contains Ni, a concentration of Ni is 0.1 to 1.2 wt. % relative to the entire wire, and a thickness of the Pd coating layer is 0.015 to 0.150 ?m.

Abstract: A wear-resistant member production method includes: forming a clad layer by moving, relative to a substrate while feeding cladding powder onto the substrate and melting it using a local heating device; and cutting the clad layer. The cladding powder includes matrix powder containing a copper-based alloy, and hard powder including, as a hard phase, a silicide containing one or more elements selected from Cr, Fe, Co, Ni, and Cu, and one or more elements selected from Mo, W, and Nb. The hard powder includes first hard powder and second hard powder. The second hard powder is fed, separately from the first hard powder, to a melt pool formed by melting the first hard powder and the matrix powder, such that at least part of the second hard powder remains unmelted within the clad layer.

Abstract: A sputtering target is provided for forming a protective film which is used for forming a protective film on a single surface or both surfaces of a Cu wiring film, the sputtering target including 5 to 15 mass % of Ni or Ni and Al in total (where the Ni content is 0.5 mass % or higher); 0.1 to 5.0 mass % of Mn; 0.5 to 7.0 mass % of Fe; and a balance including Cu and inevitable impurities.

Abstract: Provided is a copper-base alloy with excellent wear resistance. The wear-resistant copper-base alloy includes, by mass %: 5.0 to 30.0% nickel; 0.5 to 5.0% silicon; 3.0 to 20.0% iron; less than 1.0% chromium; less than or equal to 5.0% niobium; less than or equal to 2.5% carbon; 3.0 to 20.0% of at least one element selected from the group consisting of molybdenum, tungsten, and vanadium; 0.5 to 5.0% manganese and/or 0.5 to 5.0% tin; balance copper; and inevitable impurities, and has a matrix and hard particles dispersed in the matrix, when niobium is contained, the hard particles contain niobium carbide and at least one compound selected from the group consisting of Nb—C—Mo, Nb—C—W, and Nb—C—V around the niobium carbide, and when niobium is not contained, the hard particles contain at least one compound selected from the group consisting of molybdenum carbide, tungsten carbide, and vanadium carbide.

Abstract: An electrically conductive wire for deep water transmission includes a first wire portion and a second wire portion. The first wire portion makes up one end of the wire, and is formed from a first metal. The second wire portion is formed from a second metal. The first metal has a higher ultimate tensile strength than the second metal. The first wire portion is used to support the weight of the second wire portion, thereby allowing the electrically conductive wire to be used in underwater or subsea power cables which may be freely suspended from their origin for providing electricity to electrical devices located in deep water or ultra-deep water.

Abstract: An electrically conductive wire for deep water transmission includes a first wire portion and a second wire portion. The first wire portion makes up one end of the wire, and is formed from a first metal. The second wire portion is formed from a second metal. The first metal has a higher ultimate tensile strength than the second metal. The first wire portion is used to support the weight of the second wire portion, thereby allowing the electrically conductive wire to be used in underwater or subsea power cables which may be freely suspended from their origin for providing electricity to electrical devices located in deep water or ultra-deep water.

Abstract: A Cu—Ni—Si—Co system alloy having an improved spring bending elastic limit is provided. The alloy is a copper alloy for electronic materials, which contains 1.0% to 2.5% by mass of Ni, 0.5% to 2.5% by mass of Co, and 0.3% to 1.2% by mass of Si, with the balance being Cu and unavoidable impurities, wherein from the results obtainable by an X-ray diffraction pole figure analysis using a rolled surface as a base, among the diffraction peak intensities of the {111}Cu plane with respect to the {200}Cu plane obtained by ? scanning at ?=35°, the peak height at a ? angle of 90° of the copper alloy is at least 2.5 times the peak height of a standard copper powder.

Abstract: An electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance is made from a copper alloy containing 1.5 to 4.0 percent by mass of Ni, Si satisfying a Ni/Si mass ratio of 4.0 to 5.0, 0.01 to 1.3 percent by mass of Sn, and the remainder composed of copper and incidental impurities, wherein the average crystal grain size is 5 to 20 ?m, the standard deviation of the crystal grain size satisfies 2?<10 ?m, and the proportion of the number of particles having a particle diameter of 90 to 300 nm in Ni—Si dispersed particles having a particle diameter of 30 to 300 nm is 20% or more, where the particles are observed in a cross-section defined by a direction perpendicular to a sheet surface and a direction parallel to a rolling direction.

Abstract: The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.

Abstract: This invention provides a copper alloy sheet material containing, in mass %, Ni: 0.7%-4.2% and Si: 0.2%-1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, Co: 2.0% or less, and Fe: 1.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): I{420}/I0{420}>1.0??(1), where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I0{420} is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.

Abstract: There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface.

Abstract: Provided is a copper-based sliding material including a steel back-metal layer and a Cu alloy layer. The Cu alloy layer contains, by mass %, 10 to 30% of Bi, 0.5 to 5% of an inorganic compound, and the balance being Cu and inevitable impurities. The Cu alloy layer may further contain 0.5 to 5% of Sn and/or at least one element selected from the group consisting of Ni, Fe, P and Ag in a total amount of 0.1 to 10%. The inorganic compound has an average particle size of 1 to 5 ?m and a specific gravity of 70 to 130% relative to the specific gravity of Bi. Bi phase is formed in the Cu alloy layer in an average particle size of 2 to 15 ?m, and the Bi phase is dispersed in the Cu alloy layer and isotropic.

Abstract: A copper alloy material for electrical and electronic components and a method of preparing the same are disclosed. In particular, a copper alloy material with excellent mechanical strength characteristics, high electrical conductivity, and high thermal stability as a material for information transmission and electrical contact of connectors or the like for home appliances and automobiles, including semiconductor lead frames and a method of preparing the same are disclosed.

Abstract: The present disclosure relates to ultra high strength wrought copper-nickel-tin alloys and processes for improving the yield strength of the copper-nickel-tin alloy such that the resulting 0.2% offset yield strength is at least 175 ksi. The alloy includes about 14.5 wt % to about 15.5% nickel, about 7.5 wt % to about 8.5% tin, and the remaining balance is copper. The steps include cold working the copper-nickel-tin alloy wherein the alloy undergoes between 50%-75% plastic deformation. The alloy is heat treated at elevated temperatures between about 740° F. and about 850° F. for a time period of about 3 minutes to 14 minutes.

Abstract: Compositions containing tin nanoparticles and electrically conductive particles are described herein. The tin nanoparticles can have a size below about 25 nm so as to make the compositions fusable at temperatures below that of bulk tin (m.p.=232° C.). Particularly, when the tin nanoparticles are less than about 10 nm in size, the compositions can have a fusion temperature of less than about 200° C. The compositions can contain a whisker suppressant to inhibit or substantially minimize the formation of tin whiskers after tin nanoparticle fusion. In some embodiments, the compositions contain tin nanoparticles, electrically conductive particles comprising copper particles, and a whisker suppressant comprising nickel particles. Methods for using the present compositions are also described herein. The present compositions can be used as a lead solder replacement that allows rework to be performed.

Abstract: A copper base alloy achieves a breakthrough electrical conductor product of strength, flexure and conductivity of minimal inverse in relationship of at least 85% IACS electrical conductivity while providing an 80 to 85 ksi tensile strength, an increase of at least 33% in strength compared to prior art and is made from an alloy containing 0.2-0.5 w/o chromium, 0.02-0.20 w/o silver and 0.04-0.16 w/o of a third metallic component selected from tin, magnesium and tin/magnesium together.

Abstract: A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1}<3 4 6> is within 30° is 60 % or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material.

Abstract: Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 ?m or less, the standard deviation ? of crystal grain size satisfies the condition: 2?<10 ?m, and the number of dispersed precipitates lying on grain boundaries and having a grain size of from 30 to 300 nm is 500 or more per millimeter.

Abstract: A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis, wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.

Abstract: A copper alloy sheet material, having a composition containing any one or both of Ni and Co in an amount of 0.5 to 5.0 mass % in total, and Si in an amount of 0.3 to 1.5 mass %, with the balance of copper and unavoidable impurities, wherein an area ratio of cube orientation {0 0 1} <1 0 0> is 5 to 50%, according to a crystal orientation analysis in EBSD measurement.

Abstract: A brazing alloy including copper (Cu), phosphorus (P), and strontium (Sr) and any one element of indium (In), boron (B), silver (Ag), tin (Sn), cesium (Cs), germanium (Ge), and nickel (Ni). The brazing alloy includes 5.0 to 7.5 wt % of phosphorus (P) and 0.1 to 5.0 wt % of strontium (Sr) and the remainder is composed of copper (Cu). The brazing alloy includes copper (Cu), phosphorus (P), and strontium (Sr) unlike the existing alloy element. The brazing alloy further includes, as alloy components, one or more elements of indium (In), boron (B), silver (Ag), and tin (Sn). The brazing alloy includes no silver (Ag) or the silver (Ag) content is reduced compared to an existing brazing alloy containing silver (Ag).

Abstract: A copper alloy for an electric device contains Mg in a range of 1.3 atomic % or more and less than 2.6 atomic %, Al in a range of 6.7 atomic % or more and 20 atomic % or less, and the balance substantially consisting of Cu and unavoidable impurities. A method of producing a copper alloy includes: performing heating of a copper material to a temperature of not lower than 500° C. and not higher than 1000° C.; performing quenching to cool the heated copper material to 200° C. or lower with a cooling rate of 200° C./min or more; and performing working of the cooled copper material, wherein the copper material is composed of a copper alloy containing Mg in a range of 1.3 atomic % or more and less than 2.6 atomic %, Al in a range of 6.7 atomic % or more and 20 atomic % or less.

Abstract: A silicon bearing, copper-nickel corrosion resistant and gall resistant alloy with the following weight percentage range is disclosed: Ni=10-40; Fe=1-10; Si=0.5-2.5; Mn=3-15; Sn=0-3; Cu=Balance. Embodiments of the alloy may be used in various sliding applications, such as bearings, bushings, gears and guides. The alloy is particularly suited for use in parts used in food processing equipment.

Abstract: The invention provides Cu—Ni—Si—Co alloys having excellent strength, electrical conductivity, and press-punching properties. In one aspect, the invention is a copper alloy for electronic materials, containing 1.0 to 2.5 mass % of Ni, 0.5 to 2.5 mass % of Co, and 0.30 to 1.2 mass % of Si, the balance being Cu and unavoidable impurities, wherein the copper alloy for electronic material has a [Ni+Co+Si] content in which the median value ? (mass %) satisfies the formula 20 (mass %)???60 (mass %), the standard deviation ? (Ni+Co+Si) satisfies the formula ? (Ni+Co+Si)?30 (mass %), and the surface area ratio S (%) satisfies the formula 1%?S?10%, in relation to the compositional variation and the surface area ratio of second-phase particles size of 0.1 ?m or greater and 1 ?m or less when observed in a cross section parallel to a rolling direction.

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.

Abstract: Disclosed is a Cu—Co—Si-based copper alloy for electronic materials, which is capable of achieving high levels of strength, electrical conductivity, and also anti-setting property; and contains 0.5 to 3.0% by mass of Co, 0.1 to 1.0% by mass of Si, and the balance of Cu and inevitable impurities; wherein out of second phase particles precipitated in the matrix a number density of the particles having particle size of 5 nm or larger and 50 nm or smaller is 1×1012 to 1×1014 particles/mm3, and a ratio of the number density of particles having particle size of 5 nm or larger and smaller than 10 nm relative to the number density of particles having particle size of 10 nm or larger and 50 nm or smaller is 3 to 6.

Abstract: A copper alloy for an electronic device containing Mg in a range of 2.6 atomic % or more and 9.8 atomic % or less, Al in a range of 0.1 atomic % or more and 20 atomic % or less, and the balance substantially consisting of Cu and unavoidable impurities.

Abstract: The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities. The copper alloy comprising: small particles of Ni—Si compound having a particle size of equal to or greater than 0.01 ?m and smaller than 0.3 ?m; and large particles of Ni—Si compound having a particle size of equal to of greater than 0.3 ?m and smaller than 1.5 ?m. The number density of the small particles is 1 to 2000 pieces/?m2 and the number density of the large particles is 0.05 to 2 pieces/?m2.

Abstract: The present invention relates to a copper alloy having particular benefits for electronic parts and a method for making the same. The alloy having the composition of 0.05 wt % of Fe, 0.025˜0.15 wt % P, 0.01˜0.25 wt % Cr, 0.01˜0.15 wt %, Si 0.01˜0.25 wt % Mg, and the balance of Cu and minor impurities. The method of making the copper alloy includes: forming the molten alloy, casting to obtain an ingot, hot rolling the ingot at 850˜1,000° C., cooling, cold rolling the hot rolled product (after cooling the same), annealing the cold rolled product at 400˜600° C. for 1˜10 hours, intermediate rolling the annealed product with a reduction ratio of 30˜70%, heat treating the intermediate rolled product at 500˜800° C. for 30˜600 seconds, and finishing rolling the heat treated product with a reduction ratio of 20˜40%.

Abstract: The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5?Ni/Co?about 2.

Abstract: A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities, wherein R{200} is 0.3 or more, in which the R{200} is a proportion of a diffraction intensity from a {200} plane of the following diffraction intensities and is represented by R{200}=I{200}/(I{111}+I{200}+I{220}+I{311}), I{111} is a diffraction intensity from a {111} plane, I{200} is a diffraction intensity from a {200} plane, I{220} is a diffraction intensity from a {220} plane, and I{311} is a diffraction intensity from a {311} plane, each at the material surface.

Abstract: A mechanical structure is provided with a crystalline superelastic alloy that is characterized by an average grain size and that is characterized by a martensitic phase transformation resulting from a mechanical stress input greater than a characteristic first critical stress. A configuration of the superelastic alloy is provided with a geometric structural feature of the alloy that has an extent that is no greater than about 200 micrometers and that is no larger than the average grain size of the alloy. This geometric feature is configured to accept a mechanical stress input.

Abstract: The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.

Abstract: The present invention relates to an electrode composed of an Al-M-Cu based alloy, to a process for preparing the Al-M-Cu based alloy, to an electrolytic cell comprising the electrode the use of an Al-M-Cu based alloy as an anode and to a method for extracting a reactive metal from a reactive metal-containing source using an Al-M-Cu based alloy as an anode.

Abstract: A copper alloy material has a rolled surface having a plurality of crystal faces parallel to the rolled surface. The crystal faces includes at least one crystal face selected from a group consisted of {011}, {1nn} (n is an integer, n?1), {11m} (m is an integer, m?1), {023}, {012}, and {135}. Diffraction intensities of the crystal faces in an inverse pole figure obtained by crystal diffraction measurement of the rolled surface as a reference satisfy the relationships of: {011}>{155}>{133}, {011}>{023}>{012}, and {011}>{135}>{112}.

Abstract: The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5 -about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09 -about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5?Ni/Co?about 2, and wherein Pc is equal to or less than about 15/1000 ?m2, or Pc/P is equal to or less than about 0.

Abstract: There is provided a copper alloy sheet including 1.0 to 3.5 mass % Ni, 0.5 to 2.0 mass % Co, and 0.3 to 1.5 mass % Si, a Co/Ni mass ratio being 0.15 to 1.5, an (Ni+Co)/Si mass ratio being 4 to 7, and a balance being composed of Cu and an unavoidable impurity, wherein in observation results of a crystal grain boundary property and crystal orientation by EBSP measurement, a density of twin boundaries among all crystal grain boundaries is 40% or more and an area ratio of crystal grains with Cube orientation is 20% or more, on a rolled surface.

Abstract: Disclosed is a Ni—Si—Co copper alloy that is suitable for use for various kinds of electronic parts and has particularly good uniform plating adhesion properties. The copper alloy for electronic materials comprises Ni: 1.0-2.5 mass %, Co: 0.5-2.5 mass % and Si: 0.3-1.2 mass % and the remainder is made of Cu and unavoidable impurities. For the copper alloy for electronic materials, the mean crystal size, at the plate thickness center, is 20 ?m or less, and there are five or fewer crystal particles that contact the surface and have a long axis of 45 ?m or greater per 1 mm rolling direction length. The copper alloy may comprise a maximum of 0.5 mass % Cr and may comprise a maximum in total of 2.0 mass % of one, two or more selected from a group comprising Mg, P, As, Sb, Be, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag.

Abstract: A copper alloy strip material for electrical/electronic equipment includes a copper alloy containing 2.0 to 5.0 mass % Ni, 0.43 to 1.5 mass % Si, and a remaining component formed of Cu and an unavoidable impurity. Three types of intermetallic compounds A, B, and C comprising Ni and Si in a total amount of 50 mass % or more are contained. The intermetallic compound A has a compound diameter of 0.3 ?m to 2 ?m, the intermetallic compound B has a compound diameter of 0.05 ?m to less than 0.3 ?m, and the intermetallic compound C has a compound diameter of more than 0.001 ?m to less than 0.05 ?m.

Abstract: In a Cu—Bi based sintered alloy, to which hard particles, such as Fe3P, are added, the main constituent components of the microstructure are a Cu matrix, Bi phase and the hard particles. In the sintering method of the present invention, the flow of the Bi phase is suppressed to as low level as possible. The novel structure is that the contact between the Bi phase and hard particles is kept to a low ratio. A lead-free bearing used for a fuel injection pump according to the present invention contains from 1 to 30 mass % of Bi and from 0.1 to 10 mass % of hard particles having from 10 to 50 ?m of the average particle diameter, the balance being Cu and unavoidable impurities. The properties of the main component phases are utilized at a high level such that the sliding properties are equivalent to those of a Pb containing Cu-based sintered alloy.

Abstract: A copper alloy material for an electric/electronic part, containing Co 0.5 to 2.5 mass % and Si 0.1 to 1.0 mass %, at a ratio of Co/Si of 3 to 5 in terms of mass ratio, with the balance of Cu and inevitable impurities, which is obtained by subjecting to a solution treatment at a temperature (° C.) from 800° C. to 960° C. and lower than ?122.77X2+409.99X+615.74, in which X represents the Co content in mass %.

Abstract: While securing the building-up ability and crack resistance, to provide a build-up wear-resistant copper alloy and valve seat. The build-up wear-resistant copper alloy and valve seat are characterized by having a composition of nickel: 5.0-24.5%, iron: 3.0-20.0%, silicon: 0.5-5.0%, boron: 0.05-0.5%, chromium: 0.3-5.0%, one member or two members or more selected from the group consisting of molybdenum, tungsten and vanadium: 3.0-20.0%, by weight %, and the balance being copper and inevitable impurities.