Abstract: An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Cu, further contains Fe, and is in contact with the resin and the magnetic metal powder.

Abstract: Disclosed is a high-strength free-cutting leadless copper alloy with excellent machinability and corrosion-resistance. The free-cutting leadless copper alloy contains 58 to 70 wt % of copper (Cu), 0.5 to 2.0 wt % of tin (Sn), 0.1 to 2.0 wt % of silicon (Si), a balance amount of zinc (Zn), and inevitable impurities but does not contain lead.

Abstract: Provided is a high-strength steel sheet having a tensile strength (TS) of 750 MPa or more and excellent in ductility and stretch flangeability, in which the steel sheet has a predetermined chemical composition and a microstructure containing, in area ratio, ferrite: 50% to 90%, quenched martensite: 1% to 8%, tempered martensite: 3% to 40%, and retained austenite: 6% to 15%, the quenched martensite has an average grain size of 2.5 ?m or less, the quenched martensite has an average circularity index of 0.50 or more, the circularity index being defined as 4 ?M/D2, where D is a perimeter of the quenched martensite and M is an area of the quenched martensite, and the steel sheet has a ratio of an area ratio of the quenched martensite fM to a total area ratio of the quenched martensite and the tempered martensite fM+TM, fM/fM+TM, of 50% or less.

Abstract: Alloy on the basis of copper, zinc, nickel, lead and manganese having properties of resistance to corrosion, notably to inks and gel-inks. The inventive alloy can have a mono-phased alpha structure and a bi-phased alpha-beta structure and is especially suited to the production of tips and reservoirs for writing implements.

Abstract: The disclosure is directed to a method of forming high-aspect-ratio metallic glass articles that are substantially free of defects and cosmetic flaws by means of rapid capacitive discharge forming. Metallic glass alloys that are stable against crystallization for at least 100 ms at temperatures where the viscosity is in the range of 100 to 104 Pa-s are considered as suitable for forming such high-aspect-ratio articles.

Abstract: A method of forming a bulk metallic glass is provided. The method includes overheating the alloy melt to a temperature above a threshold temperature, Ttough, associated with the metallic glass demonstrating substantial improvement in toughness compared to the toughness demonstrated in the absence of overheating the melt above Tliquidus, and another threshold temperature, TGFA, associated with the metallic glass demonstrating substantial improvement in glass-forming ability compared to the glass-forming ability demonstrated in the absence of overheating the melt above Tliquidus. After overheating the alloy melt to above Ttough and TGFA, the melt may be cooled and equilibrated to an intermediate temperature below both Ttough and TGFA but above Tliquidus, and subsequently quenched at a high enough rate to form a bulk metallic glass.

Abstract: Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selected from 0.01% to 1.3% of Sn, 0.005% to 0.2% of Mg, 0.01% to 5% of Zn, 0.01% to 0.5% of Mn, and 0.001% to 0.3% of Cr, with the remainder being copper and inevitable impurities. The average size of crystal grains is 10 ?m or less, the standard deviation ? of crystal grain size satisfies the condition: 2?<10 ?m, and the number of dispersed precipitates lying on grain boundaries and having a grain size of from 30 to 300 nm is 500 or more per millimeter.

Abstract: A copper alloy includes Si to facilitate deoxidation, and can be easily manufactured even when including elements such as Cr or Sn. The copper alloy has high conductivity and high workability without negatively affecting the tensile strength. The copper alloy contains 0.2 to 0.4 wt % of Cr, 0.05 to 0.15 wt % of Sn, 0.05 to 0.15 wt % of Zn, 0.01 to 0.30 wt % of Mg, 0.03 to 0.07 wt % of Si, with the remainder being Cu and inevitable impurities. A method for manufacturing the copper alloy includes obtaining a molten metal having the described composition; obtaining an ingot; heating the ingot at a temperature of 900-1000° C. to perform a hot rolling process; cold rolling; performing a first aging process at a temperature of 400-500° C. for 2 to 8 hours; cold rolling; and performing a second aging process at a temperature of 370-450° C. for 2 to 8 hours.

Abstract: A copper alloy sheet material, having a composition containing any one or both of Ni and Co in an amount of 0.5 to 5.0 mass % in total, and Si in an amount of 0.3 to 1.5 mass %, with the balance of copper and unavoidable impurities, wherein an area ratio of cube orientation {0 0 1} <1 0 0> is 5 to 50%, according to a crystal orientation analysis in EBSD measurement.

Abstract: Copper alloys exhibiting enhanced oxidation resistance are provided by adding an amount of sulfur that is effective to enhance oxidative resistance. Such sulfur addition can be achieved by combining elemental forms of copper and sulfur and heating the mixture to form a molten alloy, or by forming a sulfur-rich pre-mix that is added to a base alloy composition. Forming a pre-mix provides improved homogeneity and distribution of the sulfur predominantly in the form of a metal sulfide.

Abstract: The invention relates to a copper-tin multicomponent bronze consisting of (in % by weight): 0.5 to 14.0% Sn, 0.01 to 8.0% Zn, 0.01 to 0.8% Cr, 0.05 to 2.0% Al, 0.01 to 2.0% Si, optionally in addition up to a maximum of 0.1 to 3.0% Mn and optionally in addition up to a maximum of 0.08% P and optionally in addition up to a maximum of 0.08% S, remainder copper and unavoidable impurities, wherein, in the structure, silicides and/or chromium particles are deposited, which are surrounded by a tin film in the form of a highly tin-containing accumulation. A further aspect of the invention relates to a process for producing strips, plates, bolts, wires, rods, tubes and profiles of the copper-tin multicomponent bronze according to the invention, and also to a use.

Abstract: The present invention relates to an electrode composed of an Al-M-Cu based alloy, to a process for preparing the Al-M-Cu based alloy, to an electrolytic cell comprising the electrode the use of an Al-M-Cu based alloy as an anode and to a method for extracting a reactive metal from a reactive metal-containing source using an Al-M-Cu based alloy as an anode.

Abstract: A dezincification-resistant copper alloy and a method for producing a product comprising the same are proposed by the present invention. The dezincification-resistant alloy of the present invention comprises 59.5 to 64 wt % of copper (Cu); 0.1 to 0.5 wt % of bismuth (Bi); 0.08 to 0.16 wt % of arsenic (As); 5 to 15 ppm of boron (B); 0.3 to 1.5 wt % of tin (Sn); 0.1 to 0.7 wt % of zirconium (Zr); less than 0.05 wt % of lead (Pb); and zinc (Zn) in balance. The dezincification-resistant copper alloy of the present invention has excellent casting properties, good toughness and machinability, and can be corrosion-resistant. Thus, the alloy can reduce dezincification on the surfaces thereof.

Abstract: Copper alloys, methods for producing copper alloys, and copper tubes are provided. The copper alloys include an alpha solid solution formed from phosphorous deoxidized copper and at least one trace element comprising tin. The content of tin ranges from about 0.1% to about 2.0% by weight of the copper alloy. The trace element can further include zinc in an amount from about 0.05% to about 1.0% by weight of the copper alloy. The copper alloys have an increased tensile strength due to the strengthening effect by the alpha solid solution formed by phosphorous deoxidized copper and tin as the trace element, and accordingly a copper tube made from the copper alloy has a significantly improved pressure resistance.

Abstract: The present invention provides a lead-free free-cutting aluminum brass alloy and its manufacturing method. The alloy comprises: 57.0˜63.0 wt % Cu, 0.3˜0.7 wt % Al, 0.1˜0.5 wt % Bi, 0.2˜0.4 wt % Sn, 0.1˜0.5 wt % Si, 0.01˜0.15 wt % P, at least two elements selected from the group of 0.01-0.15 wt % Mg, 0.0016-0.0020 wt % B, and 0.001-0.05 wt % rare earth elements and the balance being Zn and unavoidable impurities. The inventive alloy has excellent castability, weldability, cuttability and corrosion resistance. It is suitable for low pressure die casting, gravity casting, horizontal continuous casting, forging and extrusion. Its metal material cost is lower than bismuth brass. It is particularly applicable for components used in drinking water supply systems and other structural components. It is a new environmentally-friendly free-cutting aluminum brass alloy.

Abstract: The present invention provides a thermoelectric material and a method of manufacturing it. The thermoelectric material contains a half-Heusler compound including a composition represented by: (Ti1-aAa)1+x(Ni1-bBb)1+y(Sn1-cCc) where 0?a<0.1, 0?b<0.1 and 0?c<0.1; ?0.1?x?0.2 and 0<y?0.2; A is one or more elements selected from the group consisting of group IIIa elements, group IVa elements (excluding Ti), group Va elements and rare earth elements; B is one or more elements selected from the group consisting of group VIIIa elements (excluding Ni) and group Ib elements; and C is one or more elements selected from the group consisting of group IIIb elements, group IVb elements (excluding Sn) and group Vb elements, wherein amounts of Zr substitution and Hf substitution at Ti sites of the half-Heusler compound are less than 1 at %, respectively.

Abstract: Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quenched in water, to be solution treated. Subsequently, the materials are heated at a temperature of 500° C. for five hours for aging, and then are cooled at a cooling rate in a range of 10 to 50° C. per hour until the materials are cooled to a temperature of 380° C.

Abstract: A Sn-containing copper alloy, contains Sn: 0.01 to 16 mass %, Zr: 0.001 to 0.049 mass %, P: 0.01 to 0.25 mass %, and Cu: remainder; satisfying f0=[Cu]?0.5[Sn]?3[P]=61 to 97, f1=[P]/[Zr] 0.5 to 100, f2=3[Sn]/[Zr]=30 to 15000 and f3=3[Sn]/[P]=3 to 2500 (the content of element ‘a’ is represented as [a] mass %). ? and ?-phases and/or ?-phase are included and the total content of the ? and ?-phases and/or ?-phase reaches 90% or more by area ratio, and the mean grain size of the macrostructure during melt-solidification is 300 ?m or less.

Abstract: In Cu-based bulk amorphous matrix composite materials, comprising a Cu-based amorphous alloy containing high fusion point element(s) selected from a group of Ta, W or combination thereof, wherein the high fusion point element(s) has(have) a shape of crystalline grain and is(are) dispersed around a Cu-based amorphous matrix. Cu-based bulk amorphous matrix composite materials have the composition expressed as the following Chemical formula 1; CuaZrbTicRd??[Chemical formula 1] where R is Ta, W or combination thereof, a, b, c and d are atomic weight ratio, a+b+c+d equals 100, a, b, c, and d have the range of 45?a?65, 10?b?35, 5?c?30, and 5?d?10, respectively.

Abstract: A copper alloy of superior flex durability is provided that is suitable for the conducting members of flexible printed circuits. This is a copper alloy where the integrated intensity ratio I{200}/I{111} found by x-ray diffraction of the rolled surface is 1.5 or less. Examples of its specific chemical composition are: a composition where, in percent by weight, Fe: 0.045-0.095%, P: 0.010-0.030%, the sum of all elements other than Fe, P and Cu is less than 1% and the balance is Cu, and a composition where, in percent by weight, Ni: 0.5-3.0%,Sn: 0.5-2.0%, P: 0.03-0.10%, the sum of all elements other than Ni, Sn, P and Cu is less than 1% and the balance is Cu. The copper alloy has a conductivity of 85% IACS or greater.

Abstract: It is an object to provide an inexpensive alloy for heat dissipation having a small thermal expansion coefficient as known composite materials, a large thermal conductivity as pure copper, and excellent machinability and a method for manufacturing the alloy. In particular, since various shapes are required of the alloy for heat dissipation, a manufacturing method by using a powder metallurgy method capable of supplying alloys for heat dissipation, the manufacturing costs of which are low and which take on various shapes, is provided besides the known melting method. The alloy according to the present invention is a Cu—Cr alloy, which is composed of 0.3 percent by mass or more, and 80 percent by mass or less of Cr and the remainder of Cu and incidental impurities and which has a structure in which particulate Cr phases having a major axis of 100 nm or less and an aspect ratio of less than 10 are precipitated at a density of 20 particles/?m2 in a Cu matrix except Cr phases of 100 nm or more.

Abstract: Sputtering targets and methods of making sputtering targets are described. The method includes the steps of: providing a sputtering metal workpiece made of a valve metal; transverse cold-rolling the sputtering metal workpiece to obtain a rolled workpiece; and cold-working the rolled workpiece to obtain a shaped workpiece. The sputtering targets exhibits a substantially consistent grain structure and/or texture on at least the sidewalls.

Abstract: Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quenched in water, to be solution treated. Subsequently, the materials are heated at a temperature of 500° C. for five hours for aging, and then are cooled at a cooling rate in a range of 10 to 50° C. per hour until the materials are cooled to a temperature of 380° C.

Abstract: In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is carried out at 450 to 500° C., and the formed article is obtained by precipitation strengthening. In addition, in the aforementioned copper base alloy, molten material comprising a copper base alloy containing Ag in the amount of 3 to 8.5% is solidified by casting, and the solidified article or the hot worked article thereof is subjected to an aging treatment for precipitation and a thermomechanical treatment using forging or rolling, and the casting is obtained by forming the material into a specific shape and carrying out precipitation strengthening.

Abstract: The present invention provides for Cu—Zn—Al(6%) alloy and an improved process to lower the martensitic transformation temperature, by a low temperature re-betatising treatment from 110° C. to 30° C. i.e. a lowering of 80° C. wherein previously high temperature betatised material has been subjected to re-betatising at lower temperature in order to utilize the material suitably.

Abstract: Method for producing platinum/copper alloys which envisages the steps of melting platinum and copper parts and/or powders in a predetermined ratio in a controlled atmosphere, keeping the fusion product at the melting temperature for a given time period and subjecting the fusion product thus obtained to heat treatment so as to produce a platinum/copper alloy which is devoid of phase separation products and can be easily worked in the manner of a gold alloy.

Abstract: A metallic nanowire having an aspect ratio of at least 100 and a diameter less than 200 nanometers composed of at least one of bismuth, indium, tin, lead, zinc, antimony and alloys of the same and a method of making the same from a thin film composite.

Abstract: A wire rod comprising high-purity copper having a total unavoidable impurity content of not more than 1 ppm by mass and, added to the high-purity copper, 1.0 to 5.0% by mass of silver having a purity of not less than 99.99% by mass is drawn to an ultrafine copper alloy wire with a diameter of not more than 0.08 mm. According to this constitution, since the content of foreign matter, causative of breaking of wires, in a base material has been minimized, excellent wire drawability and bending properties can be realized. Further, since silver is used as an additive element, the ultrafine copper alloy wire possesses excellent tensile strength. This constitution can further realize a stranded copper alloy wire conductor, and an extrafine coaxial cable possessing excellent tensile strength, wire drawability, and bending properties.

Abstract: The invention refers to batch casting, semi-continuous casting or continuous casting and rolling of copper, providing the addition of lead or refining the melt copper or the melt microalloyed copper to a lead content equal to or higher than 200 weight ppm. This minimizes the number of pores and defects, decreasing the number of incidences or breaks during casting and in service. However, it does not reduce the electrical conductivity. The addition of lead allows the cast and roll of copper microalloyed with elements such as S, Se, As, Sb, Bi, Sn, Zn, Ni, Fe, Ag and Te, in concentrations of the order of tens of weight ppm. The copper microalloys manufactured in this way have annealing temperatures and strain strengths higher than those obtained from the equivalent tough-pitch copper or the equivalent microalloyed copper with lead content lower than 15-20 weight ppm.

Abstract: The invention encompasses a method of forming a metallic article. An ingot of metallic material is provided, and such ingot has an initial thickness. The ingot is subjected to hot forging. The product of the hot forging is quenched to fix an average grain size of less than 250 microns within the metallic material. The quenched material can be formed into a three dimensional physical vapor deposition target. The invention also includes a method of forming a cast ingot. In particular aspects, the cast ingot is a high-purity copper material. The invention also includes physical vapor deposition targets, and magnetron plasma sputter reactor assemblies.

Abstract: As a raw material of a copper base alloy containing at least one of 0.2 to 12 wt % of tin and 8 to 45 wt % of zinc, at least one of a copper base alloy having a large surface area and containing carbon on the surface thereof, a copper base alloy having a liquidus line temperature of 1050° C. or less, a copper base alloy surface-treated with tin, and a copper base alloy containing 20 to 1000 ppm of carbon, is used for obtaining a copper base alloy having an excellent hot workability. If necessary, when the raw material of the copper base alloy is melted, the material of the copper base alloy may be coated with a solid material containing 70 wt % or more of carbon, or 0.005 to 0.5 wt % of a solid deoxidizer having a stronger affinity with O than C with respect to the weight of the molten metal may be added to the molten metal.

Abstract: The invention relates to a Cu—Al—Ni—Fe alloy containing from 3 to 6 wt % aluminum, from 3 to 6.5 wt % nickel, from 1 to 4.5 wt % iron, from 0.1 to 1 wt % silicon, from 0.1 to 1 wt % manganese and from 0.05 to 1 wt % tin, the other chemical elements having contents by weight of less than 1%, and the balance is copper.

Abstract: An unwrought continuous cast Cu—Ni—Sn spinodal alloy and a method for producing the same is disclosed. The Cu—Ni—Sn spinodal alloy is characterized by an absence of discontinuous &ggr;′ phase precipitate at the grain boundaries, ductile fracture behavior during tensile testing, high strength, excellent wear and corrosion resistance, superior bearing properties, and contains from about 8-16 wt. % nickel, from about 5-8 wt. % tin, and a remainder copper.

Abstract: Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied.

Abstract: In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is carried out at 450 to 500° C., and the formed article is obtained by precipitation strengthening. In addition, in the aforementioned copper base alloy, molten material comprising a copper base alloy containing Ag in the amount of 3 to 8.5% is solidified by casting, and the solidified article or the hot worked article thereof is subjected to an aging treatment for precipitation and a thermomechanical treatment using forging or rolling, and the casting is obtained by forming the material into a specific shape and carrying out precipitation strengthening.

Abstract: A continuously cast copper ingot is made by a procedure in which turbulence is imparted to the metal/solid interface during the casting operation. The ingot is then hot worked to form a billet having a smaller average grain size and a larger diameter than possible in the past. The billet is especially useful for making electroplating anodes used in the damascene process for making copper interconnects in silicon wafers.

Abstract: The present invention relates to structures within an x-ray device including an x-ray can, an x-ray can window frame insert, a rotor sleeve, and a bearing support assembly for a rotor structure. The various structures are fabricated from a chromium alloy of copper that is essentially oxygen free copper having a minor amount of chromium, the combination of which imparts desirable qualities to the x-ray device structures, including efficient heat sink and emissivity qualities that are beneficial in an x-ray device environment. In one preferred embodiment of the present invention, oxygen free high conductivity (OFHC) copper is melted in an RF furnace in the presence of a minor amount of chromium and is either ingot cast or powder metallurgically cast into a desired article and further fabricated into a finished article.

Abstract: A method for manufacturing casting molds, in particular continuous casting molds which are used with an electromagnetic rabbling mechanism in the continuous casting of steel, is provided. The method comprises selecting a specified age-hardenable copper alloy to have a Ni content from 0.1 to 2.0% which allows the electrical conductivity of the copper alloy to be adjusted from 80 to 35 IACS. The method further comprises melting, casting, hot-rolling, solution heat treating and rapidly cooling the copper alloy, followed by age-hardening, wherein the mold has a tensile strength of at least 430 N/mm2, is highly thermally conductive and exhibits low magnetic field damping. A method of using an age-hardenable copper alloy is also provided.

Abstract: Sputtering targets and methods of making sputtering targets are described. The method includes the steps of: providing a sputtering metal workpiece made of a valve metal; transverse cold-rolling the sputtering metal workpiece to obtain a rolled workpiece; and cold-working the rolled workpiece to obtain a shaped workpiece. The sputtering targets exhibits a substantially consistent grain structure and/or texture on at least the sidewalls.

Abstract: A copper alloy sliding material which can bring about superior resistance to fatigue as well as good anti-seizure property without containing any Pb. The copper alloy sliding material is made to have the structure in which both of the hard copper alloy phase and the soft copper alloy phase coexist in a mixture state. On the surface of the sliding material, the soft copper alloy phase comes to have a shape more concave than that of the hard copper alloy phase when receiving a load or when being in a sliding wear relation, in which concave portions is retained lubricant with the result that the anti-seizure property is enhanced. Further, since the soft phase and the hard phase are made of the same copper alloy, the wettability thereof becomes good, and Ni and etc. contained in the hard copper alloy phase are diffused into the soft copper alloy phase, so that the hardness of the boundary portion defined between the phases come to be gradually varied.

Abstract: A method of making rhodium (Rh) lead layers for a read sensor comprises a first step of obliquely ion beam sputtering the rhodium (Rh) lead layer followed by a second step of annealing. This method results in rhodium (Rh) lead layers which have reduced stress and less resistance, making them highly desirable for lead layers of a sensor in a read head.

Abstract: An unwrought continuous cast Cu—Ni—Sn spinodal alloy and a method for producing the same is disclosed. The Cu—Ni—Sn spinodal alloy is characterized by an absence of discontinuous &ggr;′ phase precipitate at the grain boundaries, ductile fracture behavior during tensile testing, high strength, excellent wear and corrosion resistance, superior bearing properties, and contains from about 8-16 wt. % nickel, from about 5-8 wt. % tin, and a remainder copper.

Abstract: In the present invention, forming is carried out by employing casting to rapidly solidify molten material comprising a copper base alloy containing 3 to 20% Ag (mass % hereinafter), 0.5 to 1.5% Cr and 0.05 to 0.5% Zr. Next, an aging treatment for precipitation is carried out at 450 to 500° C., and the formed article is obtained by precipitation strengthening. In addition, in the aforementioned copper base alloy, molten material comprising a copper base alloy containing Ag in the amount of 3 to 8.5% is solidified by casting, and the solidified article or the hot worked article thereof is subjected to an aging treatment for precipitation and a thermomechanical treatment using forging or rolling, and the casting is obtained by forming the material into a specific shape and carrying out precipitation strengthening.

Abstract: A carbide dispersed, strengthened copper alloy includes copper as a major constituent, carbide particles, and a dispersing agent. The carbide particles consist of one or more carbides selected from chromium carbide, tungsten carbide, molybdenum carbide, and tantalum carbide. The dispersing agent consists of one or more elements selected from magnesium, chromium, silicon, and aluminum.

Abstract: A recycling process for zinc-rich solid waste containing zinc oxide, Cu oxides and impurities normally present in brass, in which a mixture is formed containing the waste with a finely divided solid reducing agent and a binder, and the mixture is compacted as agglomerates with open pores. The agglomerates are added into a treatment reactor containing a bath of liquid copper or brass metal, in which the zinc and copper oxides are reduced, to obtain in the treatment reactor after the reduction, a new brass in liquid form and a new waste. The new liquid brass is transferred into a fusion and casting furnace, in which its composition is optionally adjusted, and the new liquid brass is cast to form a product. Any waste present in the treatment reactor and the casting furnace are recycled using this process.

Abstract: The present invention relates to copper-magnesium-phosphorous alloys. In a first embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, silver in an amount from about 0.001 to about 0.1% by weight, iron in an amount from about 0.01 to about 0.25% by weight, and the balance copper and inevitable impurities. Preferably, the magnesium to phosphorous ratio is greater than 1.0. In a second embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, optionally silver in an amount from about 0.001 to about 0.1% by weight, at least one element selected from the group consisting of nickel, cobalt, and mixtures thereof in an amount from about 0.

Abstract: A process for the treatment of brass components to reduce leachable lead therefrom when the component is exposed to water in which the brass component is first treated with an aqueous caustic solution to remove some of the leachable lead therefrom. Thereafter, the brass component is leached to remove excess caustic and then contacted with a water soluble carboxylic acid to remove most of the remaining leachable lead. It has been found that the efficiency of the process can be significantly enhanced through the use of ultrasonic agitation to ensure intimate contact between the treating solutions and the brass component. In the practice of the invention, the amount of lead removed is sufficient to meet the most stringent regulatory requirements for water quality.

Abstract: A high-temperature, nickel-free alloy, in particular for spectacle frames, jewelry, etc. With the following composition in percentages by weight:Zn 3.0-7.0%Mn 8.0-13.0%Fe 0.5-3.5%Al 4.5-8.00Cu the remainder.

Abstract: Machinable lead free brasses for potable water applications are provided wherein a combination of bismuth and selenium are substituted in the alloy for lead and the bismuth and selenium are added to the alloy in the form of an additive product comprising bismuth selenide. A method of making the brasses which meets environmental and safety regulations is also provided. The bismuth selenide is preferably made by sintering particles of bismuth and selenium in a Bi/Se weight ratio of about 1.8 or greater and fusing the sinter.

Abstract: A method for treating bronze or brass fixtures containing lead with a cupric acetate solution is described. The treatment results in decreased amounts of lead in subsequent use. A preferred embodiment uses about 0.01 M cupric acetate at pH4.