Abstract: A CMOS process is described which is particularly suited for forming dynamic memory cells. The cells are formed in an n-well and a single plate member formed from a first layer of polysilicon is used for the entire array. Unique etching of the first polysilicon layer prevents stringers from occurring when the second layer of polysilicon is deposited. A tri-layer dielectric is used for the capacitors in the array. Novel "rear-end" processing is disclosed using a phosphorus doped glass.
Type:
Grant
Filed:
July 2, 1984
Date of Patent:
August 27, 1985
Assignee:
Intel Corporation
Inventors:
Mark T. Bohr, Ken K. Yu, Leo D. Yau, Shyam G. Garg