Punching And Bonding Pressure Application By Punch Patents (Class 156/261)
  • Patent number: 5437828
    Abstract: A plurality of shapes each having a fundamental construction of a flange are vacuum formed on a continuous sheet of thermoplastic resin. When blanking each of the formed shapes out of the resin sheet into an individual flange, a spool core is placed coaxially with the formed shape placed in the blanking position. The flange just blanked out of the resin sheet is moved in the blanking direction toward the spool core, to be fit on the spool core. The shapes are formed in a double line along the resin sheet, and thereafter, the resin sheet is slit along the longitudinal direction into two sheet branches each having the formed shapes arranged in a single line. The back side surfaces of the two sheet branches are opposed to each other, and the spool core is disposed between the sheet branches and oriented in a direction perpendicular to the back side surfaces of the sheet branches. The formed shapes are blanked out of the sheet branches in opposite directions toward opposite ends of the spool core.
    Type: Grant
    Filed: June 24, 1993
    Date of Patent: August 1, 1995
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Makoto Shimizu, Mituru Suzuki, Susumu Sato, Koichi Takahashi, Toshiro Esaki
  • Patent number: 5431763
    Abstract: A linerless labeling system which utilizes a transparent or opaque paper or plastic film substrate. The substrate is provided in web roll form and is printed on one side with an image overcoated with an adhesive. The opposite surface has release characteristics. When applied, the web is fed across an anvil plate. A die engages the anvil plate, cuts the label from the web which label is then transferred to the surface of an item such as a plastic container.
    Type: Grant
    Filed: November 19, 1992
    Date of Patent: July 11, 1995
    Assignee: Boss Systems, L.L.C.
    Inventor: Franklin C. Bradshaw
  • Patent number: 5421949
    Abstract: The invention relates to a method and an apparatus for applying flat punched elements in the desired position to the surface of a carrier material, the elements being present in multiple copies on a sheet. The multiple copies are fed to an applying device and positioned therein. At the same time as individual elements are separated out or punched, these elements are fixed in position with respect to the carrier material.
    Type: Grant
    Filed: July 7, 1993
    Date of Patent: June 6, 1995
    Assignee: GAO Gesellschaft fur Automation und Organisation GmbH
    Inventors: Joachim Hoppe, Yahya Haghiri-Tehrani, Eugen Neumann
  • Patent number: 5325583
    Abstract: There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns are transferred onto a thermoplastic resin, without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method.
    Type: Grant
    Filed: October 8, 1992
    Date of Patent: July 5, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Seizaburo Shimizu, Osamu Sasaki, Akira Yoshizumi, Hideo Ohta
  • Patent number: 5314552
    Abstract: A method of providing an assembly of thermoplastic parts, which are separable upon the application of a predetermined force, includes assembling at least two thermoplastic parts in an overlapping relation and using an ultrasonically resonant horn for cutting a plug from the wall thickness of the first part and welding the plug to the underlying second part, whereby the upper portion of the plug remains surrounded by the wall of the aperture produced responsive to the cutting of the plug. Responsive to the application of a predetermined breakaway force effective on the plug, the plug breaks away from its attachment to the second part, causing the parts to become separable. The cross-sectional area of the plug is selected to meet a predetermined breakaway force requirement.
    Type: Grant
    Filed: December 17, 1992
    Date of Patent: May 24, 1994
    Assignee: Branson Ultrasonics Corporation
    Inventor: Thomas B. Sager
  • Patent number: 5314558
    Abstract: A cassette reel in use for a video tape cassette including a hub and an upper flange made of a transparent plate which is provided with an annular groove on one side surface of the upper flange and a foil deposited on the surface of the upper flange which is surrounded by the annular groove, so that the foil can be cut clearly and then deposited on the face of the upper flange which is surrounded by the annular groove by hot stamp with a clear outer profile, whereby decorative effects can be obtained by the foil covering the internal construction of the hub and when the cassette reel is used for a video tape cassette, the commercial value of the video tape cassette can be elevated.
    Type: Grant
    Filed: June 8, 1993
    Date of Patent: May 24, 1994
    Assignee: Sony Corporation
    Inventors: Kiyoshi Urayama, Kazuo Ozawa
  • Patent number: 5310586
    Abstract: A honeycomb structure includes at least two corrugated strips having major flat surfaces extending angularly between opposed strip edges. The strips are offset relative to each other and joined together to define a series of cells extending between the strip edges along axes which are oriented at an angle other than normal to the strip edges. Each of the major flat surfaces includes a central depressed portion forming a matching sub-flat surface which is parallel to and connected to the major flat surface by sidewalls which may be substantially perpendicular to the major flat surface. Abutting undepressed portions of the major flat surfaces of adjacent strips and abutting sub-flat surfaces of adjacent strips are joined together so that the strips form a series of I-beams disposed one to a cell.
    Type: Grant
    Filed: February 5, 1993
    Date of Patent: May 10, 1994
    Assignee: Eldim, Inc.
    Inventor: Stephen J. Mullen
  • Patent number: 5310442
    Abstract: A single wafer transport mechanism takes a semiconductor wafer out of a cassette loader, and transports the wafer to a single wafer positioning mechanism for placing the wafer in position. When applying a protective adhesive tape to a surface of the wafer, the transport mechanism transports the wafer placed in position to a tape applying mechanism. When removing the protective tape from the wafer surface, the transport mechanism transports the wafer to a tape removing mechanism which removes the protective tape from the wafer surface by using a remover adhesive tape having a strong adhesion. The wafer having the protective tape applied thereto or stripped of the protective tape is transported back to a cassette by the wafer transport mechanism.
    Type: Grant
    Filed: May 7, 1992
    Date of Patent: May 10, 1994
    Assignee: Nitto Denko Corporation
    Inventor: Minoru Ametani
  • Patent number: 5283949
    Abstract: Methods of producing a printed circuit board having a desired conductive pattern thereon provide the upper surface of a substrate board with raised portions having trenches therebetween. The raised portions, which define a desired conductive pattern, are then treated to form conductors thereon. In a first method, the resin used in the laminant forming the substrate board includes a hard particulate filler such as glass beads that are exposed at the raised portions of the substrate surface following grinding. Conductive metal is then welded onto the exposed filler to form a desired conductive layer over the raised portions. In a second method, the resin of the laminant forming the substrate board includes conductive metallic powder, such that burnishing of the raised portions forms conductors at the raised portions.
    Type: Grant
    Filed: November 3, 1992
    Date of Patent: February 8, 1994
    Inventor: Peter L. Jurisich
  • Patent number: 5272800
    Abstract: A method and apparatus for forming and attaching a preform to a metallic workpiece, particularly an epoxy preform for use in electronic packages. The epoxy preform is stamped from a strip and maintained in an upper die assembly. The metallic workpiece is indexed underneath the upper die assembly whereupon the epoxy preform is deposited onto the metallic workpiece and the metallic workpiece removed from underneath the upper die assembly.
    Type: Grant
    Filed: July 1, 1991
    Date of Patent: December 28, 1993
    Assignee: Olin Corporation
    Inventors: James F. Rooney, Won G. Park
  • Patent number: 5269872
    Abstract: An apparatus prints the necessary attribute on an identity tag immediately before a cut wiring cable is inserted thereinto, and automatically attaching the printed identity tag to the wiring cable. An identity tag attaching apparatus attaches an identity tag which represents the attribute of a cable to the cable.
    Type: Grant
    Filed: January 15, 1993
    Date of Patent: December 14, 1993
    Assignee: Okuma Corporation
    Inventor: Yoshinori Ueda
  • Patent number: 5252167
    Abstract: The invention relates to a method and an apparatus for applying flat punched elements in the desired position to the surface of a carrier material, the elements being present in multiple copies on a sheet. The multiple copies are fed to an applying device and positioned therein. At the same time as individual elements are separated out or punched, these elements are fixed in position with respect to the carrier material.
    Type: Grant
    Filed: April 23, 1990
    Date of Patent: October 12, 1993
    Assignee: GAO Gesellschaft fur Automation und Organisation mbH
    Inventors: Joachim Hoppe, Yahya Haghiri-Tehrani, Eugen Neumann
  • Patent number: 5231756
    Abstract: A process for manufacturing a multi-layer lead frame for a semiconductor device comprises two metal plains being adhered to each other via an insulation piece. An insulation strip is punched to cut the insulation piece, which is preliminary adhered to a metal strip. The metal strip is then punched to cut and remove the metal plane, which is then laminated and heat-pressed to another metal strip. After completely adhered, the other metal strip is punched to remove a multi-layer lead frame.
    Type: Grant
    Filed: October 13, 1992
    Date of Patent: August 3, 1993
    Assignees: Shinko Electric Industries Co., Ltd., Intel Corp.
    Inventors: Masakuni Tokita, Akira Kobayashi, Shinichi Yamakawa, Mitsuharu Shimizu, Norihiro Masuda
  • Patent number: 5188694
    Abstract: Disclosed herein is a sheet perforating apparatus comprising a sheet transfer mechanism; a perforating section for boring at least one filing hole in a sheet being transferred; and a sticking section for sticking a reinforcing pad on the sheet about the periphery of the filing hole. The perforating section comprises a punch cutter for boring the filing hole in the sheet transferred.
    Type: Grant
    Filed: September 13, 1991
    Date of Patent: February 23, 1993
    Assignee: Sun Seiki Co., Ltd.
    Inventors: Yoshisuke Hashida, Hideo Takaoka, Yoshiharu Kamei
  • Patent number: 5118370
    Abstract: An LSI chip has Al bumps transferred from an Al-containing foil and formed thereon by ultrasonic bonding. The LSI chip is thereafter mounted on a circuit board by an adhesive containing fine metallic particles dispersed or arranged uniformly, an insulative adhesive with high fluidity or ultrasonic bonding.
    Type: Grant
    Filed: March 18, 1991
    Date of Patent: June 2, 1992
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Kazuhito Ozawa
  • Patent number: 5055155
    Abstract: A method and apparatus for laminating flexible magnetic segments onto the plastic substrates, such as during the in-line production of shower curtains and/or curtain liners. The apparatus, which is configured for use with typical shower curtain and/or shower curtain liner producing machines, includes a substantially planar upper work surface for receiving the plastic substrate and at least one applicator unit located adjacent the work surface which automatically laminates a flexible magnetic strip and a plastic cover patch onto the curtain. Three applicator units are preferably utilized, with one such unit substantially aligned with the center of the curtain and the remaining two units being located along the longitudinal edges thereof. In operation, a thin, flexible plastic film is unwound onto an assembly table whereupon it is stopped at a predetermined position.
    Type: Grant
    Filed: October 12, 1989
    Date of Patent: October 8, 1991
    Assignee: Texstyle, Inc.
    Inventors: Wayne E. Crotty, Harold J. Phelps
  • Patent number: 4985105
    Abstract: A taping apparatus for adhering taping members to a lead frame, comprising: a die having a punch for cutting a heat-adherent tape to form individual taping members. The taping member is moved and pushed against a surface of a heater block on which a lead frame is rested and heated, so that the taping member is heated and adhered to the lead frame. The tape is intermittently fed along the passage in synchronization with an operation of the die, and before punching slack is provided in the tape.
    Type: Grant
    Filed: January 22, 1990
    Date of Patent: January 15, 1991
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Norihiro Masuda
  • Patent number: 4961807
    Abstract: A method of and apparatus for producing a grinding tool which includes a several grinding sheets radially arranged on a disk. The disk, having a hole in its center and adhesive along a circumferential edge portion of its upper surface, is provided on a receiving seat. A plurality of grinding belts distributed about the periphery of the receiving seat are directed radially inward toward the center of the disk so as to cover the adhesive and such that adjacent side edges of forward ends of the belts overlap each other, each of the overlapping belt ends having a grinding particle surface on a same side thereof facing away from the adhesive. A pressing plate is directed downward against the respective belt ends on the adhesive layer to adhere the respective belt ends to the disk. A cutting tool having a circumferential cutting edge is provided below and somewhat radially outward of the circumferentially edge of the disk.
    Type: Grant
    Filed: December 19, 1988
    Date of Patent: October 9, 1990
    Inventor: Hirokazu Ichiguchi
  • Patent number: 4946534
    Abstract: A process for the preparation of a magnetic recording disk comprises the steps of providing a magnetic recording layer on a surface of a nonmagnetic support, punching the nonmagnetic support together with the magnetic recording layer into a disk having a circular hole in its central portion, and fitting mechanical members including a center core made of a synthetic resin into the hole of the support. The nonmagnetic support having the magnetic recording layer and at least the center core of the mechanical members are subjected to heat treatment independently prior to fitting the mechanical members including the center core into the hole of the support.
    Type: Grant
    Filed: April 20, 1988
    Date of Patent: August 7, 1990
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Kunihiko Honda, Tadashi Ishiguro, Masaaki Fujiyama
  • Patent number: 4909893
    Abstract: This invention relates to a perforator for paper perforations, more particularly to a perforator with accessories for feeding adhesive strip to be cut and pushed to attach on a paper to be perforated, and the paper together with the attachments are further perforated so that a perforated paper with reinforcing attachments can be obtained.
    Type: Grant
    Filed: December 13, 1988
    Date of Patent: March 20, 1990
    Inventor: Chin-Piao Lee
  • Patent number: 4906314
    Abstract: A process for simultaneously applying precut protective swatches of precured polymer film to each semiconductor die on a wafer, whereby an indexed greater-than wafer-width strip of precured polyimide film having a heat-attach adhesive on its lower surface is die punched to remove essentially half of the scrap film, material between each of the individual portions on the film which dimensionally correspond to the areas of individual dies on a silicon wafer requiring protection. Each punched area corresponds to areas on the wafer die matrix that are to remain unprotected. Following this first punching, a strip of dimensionally-stable backing paper coated with heat-release adhesive is bonded to the upper surface of the polyimide strip in the region which will become matrices of swatches. The double layer strip is then subjected to second die-punch process which removes the remaining scrap film material between the individual swatches.
    Type: Grant
    Filed: December 30, 1988
    Date of Patent: March 6, 1990
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Alan G. Wood
  • Patent number: 4900386
    Abstract: In order to produce labels incorporating electrical oscillating circuits, certain parts of the circuits are initially punched out of a center area of a metal web covered by an adhesive. Thereafter the center area is covered by an insulating material web for handling stability in order to thereafter punch out the part of the circuit to be located at the outer web area. A covering foil is laminated onto the metal web and the parts of the circuits to be located at the reverse side are applied onto the insulating material web and connected electrically to the remainder of the circuit. This allows an economical and yet precise mass production of labels, for instance for a use in article safeguarding and controlling systems.
    Type: Grant
    Filed: May 20, 1988
    Date of Patent: February 13, 1990
    Assignee: Durgo AG
    Inventor: Poul Richter-Jorgensen
  • Patent number: 4863551
    Abstract: A marking apparatus is disclosed for cutting a piece out of an adhesive tape and simultaneously attaching the same onto and individual slide fastener which has been found defective during the travel of a continuous slide fastener chain. The apparatus is operatively associated with a detecting device which controls the operation of an air cylinder so that a cutting punch is reciprocated toward and away from an anvil and a support mandrel.
    Type: Grant
    Filed: August 5, 1988
    Date of Patent: September 5, 1989
    Assignee: Yoshido Kogyo K.K.
    Inventor: Toyosaku Ogura
  • Patent number: 4853169
    Abstract: In the method of making hollow plastic articles wherein a label is positioned in each of a plurality of spaced partible molds in a predetermined array, preforms are positioned in each set of partible molds and the molds are closed and the preforms are blown outwardly to the confines of the molds to apply the label to the resultant hollow plastic article, the method which comprises providing labels on a roll of labels, successively die cutting the labels from the web of the roll and simultaneously delivering each label directly to an endless vacuum conveyor, indexing the endless vacuum conveyor to provide an array of labels on the conveyor which corresponds in spacing to the spacing of the array of molds, engaging the array of labels on the conveyor and removing them from the conveyor and depositing the array of labels in the array of molds.
    Type: Grant
    Filed: June 22, 1987
    Date of Patent: August 1, 1989
    Assignee: Owens-Illinois Plastic Products Inc.
    Inventor: Ronald S. Kaminski
  • Patent number: 4846915
    Abstract: An apparatus which coacts with a fitment application machine to index a die cut fitment web for precise registration and sealing of fitments to carton die cut areas. The apparatus includes an indexing wheel which has a plurality of circumferentially spaced indentations which engage void areas in the web defined by the fitments upon their removal. A gear and rack assembly intermittently rotate the indexing wheel advancing the web through the fitment application machine for sealing operations. Precise adjustment and indexing of the web is effected by a locating pin which engages corresponding bores in the indexing wheel to lock the wheel at defined pre-set circumferential positions.
    Type: Grant
    Filed: March 8, 1988
    Date of Patent: July 11, 1989
    Assignee: International Paper Company
    Inventors: Donald E. Keeler, Edward Bombolevich, Michael Sinocchi
  • Patent number: 4826561
    Abstract: A hole puncher and reinforcer for locating a length of adhesive tape in overlying relation to a sheet of paper, for punching a hole in the tape and paper, and for shearing and pressing the tape in position as a reinforcement for the punched holes. The device includes a plurality of spaced apart first disks operative to engage the adhesive side of the tape and pull it off a supply roll. A similar set of disks rotatable at a peripheral speed faster than that of the first disks engages the tape and directs it through a tape feed passage defined in part by thin fingers. The placement and rotation of the two sets of disks, and the presence of the fingers, enables advancement of the tape to the punch, shear and pressure mechanism without sticking or gumming.
    Type: Grant
    Filed: June 10, 1987
    Date of Patent: May 2, 1989
    Assignee: The Reinforcer, Inc.
    Inventor: William Carroll
  • Patent number: 4793393
    Abstract: Process for producing a veneer workpiece in the form of a flat plate or the like with a preferably, at least partly wooden base layer, optionally in the form of a base veneer constituted by several individual layers, a face veneer having at least one wooden face veneer layer and a cutout passing through the base layer and the face veneer, in which the base layer and the face veneer are preferably glued together by means of a synthetic resin adhesive, which produces the cutout passing through the base layer and the face veneer and finally the circumferential wall or walls thereof are covered with face veneer material, characterized in that the gluing of the base layer and the face veneer to form a solid workpiece, the formation of the cutout or cutouts and the covering of the circumferential wall thereof with the face veneer in a single pressure punching process, the face veneer layer being pressed through from the surface of the veneer workpiece into the cutout or cutouts, while covering the circumferential w
    Type: Grant
    Filed: October 14, 1987
    Date of Patent: December 27, 1988
    Inventor: Peter Pelz
  • Patent number: 4786342
    Abstract: A method is provided for producing a ceramic substrate with at least one surface having sufficient smoothness to allow for placement of fine line electrical circuitry. A ceramic powder is placed in a die. A ceramic tape is formed having one surface with a desired degree of smoothness. A portion of the tape is placed into the die with the surface opposite the smooth surface in contact with the ceramic powder. The powder and tape are dry pressed to form an integral ceramic green body with a smooth surface. The green body can be sintered to form a sintered smooth-surfaced ceramic substrate. The smooth-faced ceramic substrate can be formed with the smooth face countersunk or with edges pulled back. A ceramic substrate can be formed with a conductive material between the cast tape layer and the base layer. A ceramic tape cast on a smooth carrier such as polyvinyl butyral and a method for producing such cast tape is also disclosed.
    Type: Grant
    Filed: November 10, 1986
    Date of Patent: November 22, 1988
    Assignee: Coors Porcelain Company
    Inventors: James E. Zellner, Robert M. Martin
  • Patent number: 4753702
    Abstract: A method and apparatus are disclosed for sticking ornamental pieces onto a web of material in which the web and a sticking head are positioned relative to each other so that each ornamental piece can be placed on the web by the sticking head at a predetermined position. The sticking head has a cutting edge for cutting each article before it is pressed against the web. An ornamental piece cut from a tape of material by the cutting edge and attached to the lower side of the sticking head is positioned and stuck onto the web so as to achieve a desired pattern on the web. The web and the sticking head are positioned relative to each other at each position to which an ornamental piece should be stuck in order to achieve the desired pattern on the web. Each ornamental piece may be cut out from a tape of material having a hot-melt layer, which is heated by an element opposite the sticking head when the piece is stuck onto the surface of the web.
    Type: Grant
    Filed: March 14, 1983
    Date of Patent: June 28, 1988
    Assignee: Jacob Schlaepfer & Co., AG
    Inventor: Akira Kurihara
  • Patent number: 4752351
    Abstract: A motorless Velcro tape feed and cut assembly acting as a slave unit which cooperates with the horn of an ultrasonic welding machine. When the horn is brought down to carry out a welding action, it then depresses the spring-biased operating block of the assembly, causing it to shift downwardly from its normally raised position above a base plate to a final position adjacent to the base plate, the block returning to its raised position when the horn is retracted. Anchored on the base plate and projecting thereabove is an anvil which telescopes within an open-ended anvil channel in the block, the length of the anvil being such that in the final position of the block its head is then in operative relation to the horn to effect welding of a Velcro component onto a fabric lying on the upper face of the block.
    Type: Grant
    Filed: August 24, 1987
    Date of Patent: June 21, 1988
    Inventor: Audrey T. Lunt
  • Patent number: 4746387
    Abstract: A metallic closure for a cylindrical, rectangular or square container comprising a central panel which has a portion thereof adapted for attaching the closure to the end of a container to close the end. The panel has an opening therein and the portion of the metal adjacent the opening is rolled so that the end thereof engages under the inner surface of the panel in a smooth roll such that the free edge is not directly exposed to the contents in the container on which the closure is placed. A composite panel including a layer of plastic is bonded to the central panel and the outer surface of the central panel by heat fusion of plastic. The composite panel includes a tab that is formed integrally thereof and initially is folded back upon itself bringing the surfaces of the tab which bear the plastic into contact so that the two portions of the tab are bonded to one another to provide a double strength tab.
    Type: Grant
    Filed: May 18, 1987
    Date of Patent: May 24, 1988
    Inventors: Philip M. Wright, Donald Didier
  • Patent number: 4701236
    Abstract: The method and arrangement according to the invention utilize an adhesive tape (1) covered with a protective layer (2) provided with openings (4).This tape is glued on a film (5) carrying contact metallizations (8) and integrated circuit chips (6) electrically connected to the said metallizations. The tape is glued on the film in such a manner that its openings (4) correspond to the positions of the integrated circuit chips (6). Subsequently, a coating varnish is applied by pulverization to the film and then the protective layer is removed with the varnish covering it. Vignettes slightly larger than the said openings are then cut in the film in such a manner that an adhesive ring is left around the integrated circuit chips. Each vignette is finally arranged in a recess ad hoc (12) of a card (10).
    Type: Grant
    Filed: April 3, 1986
    Date of Patent: October 20, 1987
    Assignee: U.S. Philips Corporation
    Inventor: Gerard Vieilledent
  • Patent number: 4625498
    Abstract: A method and apparatus for applying and sealing recessed membranes to containers in a single operation. The membranes are partially cut from a continuous flexible web of film material and remain on the web due to thin necks of film material that are left after the cutting operation. An applicator head is carried on a power cylinder and acts to detach the membranes from the web, to apply the membranes to the containers at recessed locations, and to heat seal the marginal portions of the membranes to the container rims. The applicator head includes a vacuum head which attracts the membranes by suction and a sealing head which heat seals the membranes to the containers. The vacuum head has a tapered vacuum surface which properly centers the membranes and assists in expelling air from the containers before the heat seal is effected. The vacuum head is spaced from the heated sealing head to minimize the heat transfer and may be additionally cooled by a fluid cooling system.
    Type: Grant
    Filed: March 25, 1985
    Date of Patent: December 2, 1986
    Assignee: Sealright Co., Inc.
    Inventor: Jack D. Parsons
  • Patent number: 4624809
    Abstract: The invention provides method and apparatus for forming upper stops of a concealed type slide fastener. A concealed type slide fastener comprises a pair of fastener stringers each consisting of a fastener tape having a turn-up along one side thereof and fastener elements of thermoplastic resin secured to the turn-up. Portions of the elements are fused to form upper stops. In the method and apparatus of the invention, a pair of spaced projections are formed on a base and placed with respect to fastener stringers of a slide fastener or continuous fastener chain so that the projections pass between the stringers. The fastener elements are urged toward the projections while portions of the projections engage the arrest the element-mounting-side margins of the tapes to expose the interengaging heads of the elements so that only the interengaging heads are fused.
    Type: Grant
    Filed: October 22, 1984
    Date of Patent: November 25, 1986
    Assignee: Yoshida Kogyo K.K.
    Inventor: Yoshitaka Iimura
  • Patent number: 4581096
    Abstract: A tape applying device for punching an annular piece out of an adhesive tape and applying the annular piece of adhesive tape to the inner leads of a lead frame having leads which extend outwardly therefrom in four general directions includes an inner pattern punch disposed along the direction of the travel of the adhesive tape on one surface side thereof and an outer pattern punch disposed along the direction of the travel of the adhesive tape on the same side as the inner punch on the downstream side relative to the inner punch. The outer pattern punch is provided with a press mechanism for applying under pressure the annularly shaped piece of the adhesive tape to the inner leads of the lead frame.
    Type: Grant
    Filed: August 8, 1984
    Date of Patent: April 8, 1986
    Assignee: Sumitomo Metal Mining Company Limited
    Inventor: Fumio Sato
  • Patent number: 4557782
    Abstract: A plurality of pins (14) are placed on a carrier (12) in a spaced, parallel arrangement and held in place by an adhesive-backed strip (13). Thereafter tabs (39) are formed in the strip (13) and are pressed into pockets (41) of the carrier (12) as the pockets are being formed. This enhances the securance of the strip (13) with the carrier (12) and holds the pins (14) in the spaced, parallel arrangement.
    Type: Grant
    Filed: November 10, 1983
    Date of Patent: December 10, 1985
    Assignee: AT&T Technologies, Inc.
    Inventor: Robert R. Swanson
  • Patent number: 4552600
    Abstract: The present invention is directed to a method and apparatus for manufacturing a tray having an integral purge juice trap. A particularly important step in the method is adhering a border area of a perforated thermoplastic sheet to a raised shoulder area of a tray. Preferably, this step is accomplished simultaneously with the step of perforating the thermoplastic sheet. A preferred method for adhering the border area to the shoulder area is heat sealing.
    Type: Grant
    Filed: November 23, 1982
    Date of Patent: November 12, 1985
    Assignee: W. R. Grace & Co., Cryovac Div.
    Inventors: Stanislaus J. Laiewski, Thomas A. Hessen, Thomas R. Hardy, Allie F. Gilvin
  • Patent number: 4541559
    Abstract: A method of making electrical connections between metal foils laminated to opposing surfaces of a flexible insulating layer, such as may be configured with spiral patterns in the respective metal foils to form inductive-capacitive circuits useful as detectable markers in RF antipilferage systems, and wherein an electrical connection is provided between the opposing foils by first extruding the laminate to shear the insulating layer and to contact the opposing metal foils in the vicinity of the sheared insulator layer and by subsequently forcing the extrusion back into a substantially planar relationship relative to the remainder of the laminate.
    Type: Grant
    Filed: November 16, 1983
    Date of Patent: September 17, 1985
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Philip W. O'Brien
  • Patent number: 4539058
    Abstract: A method and apparatus for forming multilayer ceramic substrates from large area ceramic green sheets, each having an array of layer sites thereon, by serially aligning each individual layer site with respect to a die cavity and punching the aligned layer site into the die cavity to thereby stack the requisite number of aligned layer sites. Individual layer site alignment ensures that each layer site is aligned with respect to the die cavity so that the dimensional tolerances between layer sites on the large area green sheet are eliminated. Thus, as large a green sheet as is cost effective may be employed, notwithstanding the fact that dimensional distortions on the large area green sheet would preclude alignment of corresponding layer site vias on superimposed large area green sheets.
    Type: Grant
    Filed: December 12, 1983
    Date of Patent: September 3, 1985
    Assignee: International Business Machines Corporation
    Inventors: Allan C. Burgess, Robert A. Magee, George E. Melvin
  • Patent number: 4516319
    Abstract: To reduce the breakdown potential magnitude between the output tip surface of an ignition distributor rotor output segment and each of the output terminals of the distributor cap, the rotor output segment is made of a low thermally conductive material 0.1 mm to 1.00 mm thick, and a layer of a silicone dielectric material such as a silicone plate, viz., a plate including at least a sheet of silicone varnish-containing glass cloth, is secured to at least a portion of at least one of the top and bottom surface areas of the rotor output segment.
    Type: Grant
    Filed: October 17, 1983
    Date of Patent: May 14, 1985
    Assignees: Nissan Motor Co., Ltd., Hitachi, Ltd.
    Inventors: Masazumi Sone, Iwao Imai, Hiromitsu Nagae
  • Patent number: 4397706
    Abstract: Disclosed is a method for making articles comprised of a body portion of an elastomeric material having a liner of an inert material covering at least a portion of the peripheral surface of said body portion including the steps of bonding a layer of elastomeric material to one face of a layer of the inert material, positioning the bonded layers in a mold cavity with the layer of inert material contacting at least a portion of the surface of a mold cavity, adding additional amounts of uncured elastomeric material to the mold cavity and curing the elastomeric materials. Also disclosed herein is a system and apparatus for making molded articles as well as the molded articles produced thereby.
    Type: Grant
    Filed: March 22, 1982
    Date of Patent: August 9, 1983
    Assignee: The West Company
    Inventors: Roland M. Allen, Andrew J. Kalocai
  • Patent number: 4394710
    Abstract: A circuit board assembly wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without severing the switch material.
    Type: Grant
    Filed: January 4, 1982
    Date of Patent: July 19, 1983
    Assignee: GTE Products Corporation
    Inventors: Boyd G. Brower, David R. Broadt, John W. Shaffer
  • Patent number: 4389271
    Abstract: A method and system for making molded articles including a disc from a laminated sheet comprising a layer of elastomeric material and a layer of inert material consisting of the steps of partially cutting at least one disc from sheet material, positioning the sheet over a transfer plate with the partially cut disc in registry with an opening in the transfer plate, severing the disc from the sheet to the opening in the transfer plate, positioning the transfer plate over a mold having at least one cavity therein and transferring the disc from the transfer plate to the bottom of the mold cavity.
    Type: Grant
    Filed: March 2, 1982
    Date of Patent: June 21, 1983
    Assignee: The West Company
    Inventors: Walter V. Shandy, Jospeh M. Voytilla
  • Patent number: 4378069
    Abstract: A plastic laminated pouch, suitable for containing food, beverages or other pourable contents, with an integrally formed generally cylindrical pour spout. Application of force directed radially inwardly upon the sidewalls of the pour spout causes the top of the spout to fracture generally along lines of reduced structural integrity provided thereon, permitting the contents of the pouch to be easily and neatly emptied therethrough.
    Type: Grant
    Filed: April 21, 1981
    Date of Patent: March 29, 1983
    Assignee: Magna Technologies, Inc.
    Inventor: Gino Franco
  • Patent number: 4333784
    Abstract: A machine for producing weatherproofed multi leaf shipping labels including means for holding a pre-printed form web, means for relieving successive portions of the web longitudinally thereof, means for applying top and bottom sheets to the web, means for encapsulating the web between the successive relieved portions of the web by pressure bonding the top and bottom sheets in face contact with each other at successive relieved portions of the web, and receiving means including means for delivering the encapsulated web to the receiving means and also the method for producing weatherproofed shipping labels.
    Type: Grant
    Filed: March 20, 1980
    Date of Patent: June 8, 1982
    Inventor: Hubert McCarthy
  • Patent number: 4325771
    Abstract: A circuit board assembly and method of making wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without serving the switch material.
    Type: Grant
    Filed: March 19, 1980
    Date of Patent: April 20, 1982
    Assignee: GTE Products Corporation
    Inventors: Boyd G. Brower, David R. Broadt, John W. Shaffer
  • Patent number: 4320572
    Abstract: A photoflash device circuit board assembly including a dielectric substrate and at least one switching element and conductor die-stamped therein. To assure that the delicate switch is not severed by the die's cutting edge during die-stamping, a relief means (e.g., slot) is provided within the substrate so that a segment of the switch can be aligned therewith. As an alternative, it is taught to provide stepped portions within the die's cutting edge to align with preselected portions of the switch and thus prevent total severance thereof.
    Type: Grant
    Filed: March 19, 1980
    Date of Patent: March 23, 1982
    Assignee: GTE Products Corporation
    Inventors: Boyd G. Brower, John W. Shaffer
  • Patent number: 4313995
    Abstract: There is disclosed a method for producing an electrical circuit board comprising the steps of selectively treating a portion of a conductive metal sheet in a pattern substantially corresponding to a predetermined printed circuit configuration and in a manner which renders the pattern portion of the sheet essentially adherent to a resin, placing the treated pattern portion of the sheet in direct contact with a layer of resin on the surface of an insulating substrate to form an assembly, uniformly heating the assembly to an elevated temperature to selectively bond the substrate to the treated pattern portion of the sheet, cutting the sheet along the perimeter of the pattern portions and stripping the non-pattern portions of the sheet from the substrate to form a circuit board.
    Type: Grant
    Filed: April 20, 1977
    Date of Patent: February 2, 1982
    Assignee: Fortin Laminating Corporation
    Inventor: Joseph A. Delgadillo
  • Patent number: 4289565
    Abstract: An apparatus disclosed comprises a manual hole punch which is modified to provide reinforcing rings for punched holes during the punching operation. The modified hole punch includes a tape dispenser mounted at one end of the punch to dispense perforated tape, one side of which has an adhesive applied thereto. The modified hole punch aligns dispensed perforated tape both longitudinally and laterally so that when a piece of paper is inserted within the hole punch, punching units of the hole punch punch holes through the paper and through designated portions of the tape. Simultaneously, staple-shaped cutting members which are mounted on their associated punching elements of the punching units to move therewith, cut through the paper and through portions of the tape between the perforations in the tape to separate the reinforcing rings from the remainder of the tape. The cut tape is collected on a tape collector mounted at the opposite end of the hole punch.
    Type: Grant
    Filed: March 31, 1980
    Date of Patent: September 15, 1981
    Inventor: Harold B. Wilkins
  • Patent number: 4289568
    Abstract: A machine for applying particularly configured pieces of thermally-activated tape to a heated substrate, such as a continuous strip of lead frames, it is capable of long term, high speed operation without becoming fouled with tape pieces or residual adhesive. A drop-through die assembly to blank the tape pieces is mounted for reciprocal movement to and from the metal strip normally supported in spaced relation beneath the assembly. Cooling fluid is circulated through the die and stripper plate of the die assembly for dissipating heat generated in the punch during the blanking operation. This cooling feature together with the normally spaced arrangement of the die assembly and the heated substrate, serves to maintain the temperature of the punch well below the activating temperature of the tape, whereby the tendency of the punch to collect a build-up of adhesive and tape pieces is virtually eliminated.
    Type: Grant
    Filed: June 4, 1979
    Date of Patent: September 15, 1981
    Assignee: Arnold Engineering Company
    Inventors: Alex Trotsky, Alan Brimmer