Abstract: A method of manufacturing an electronic device includes the steps of providing a conductive carrier with at least one electronic element disposed thereon, picking up the at least one electronic element, setting the conductive carrier to have a ground voltage at least in the step of picking up the at least one electronic element, and transferring the at least one electronic element to a target substrate.

Abstract: In a method of manufacturing a display apparatus, the method includes: preparing a support substrate; forming a metal oxide layer on a surface of the support substrate, the metal oxide layer comprising first charges; forming a debonding layer on a surface of the metal oxide layer, the debonding layer comprising second charges opposite to the first charges; forming a flexible substrate on a surface of the debonding layer; forming a display element and a thin film encapsulation layer on a surface of the flexible substrate, the display element comprising a thin film transistor and an organic light-emitting diode; and isolating the flexible substrate from the support substrate.

Abstract: A bonding apparatus according to the present embodiment includes a first holder and a second holder. The first holder holds a first substrate. The second holder sucks a second substrate, opposes the second substrate to the first substrate, and bonds the second substrate to the first substrate. A first ring stage is provided on an outer circumference of the first holder and allows a first ring member provided on an outer edge of the first substrate to be mounted thereon. A second ring stage is provided on an outer circumference of the second holder and allows a second ring member provided on an outer edge of the second substrate to be mounted thereon. A first heater is provided in the first ring stage. A second heater is provided in the second ring stage.

Abstract: A method for forming semiconductor devices includes attaching a glass structure to a wide band-gap semiconductor wafer having a plurality of semiconductor devices. The method further includes forming at least one pad structure electrically connected to at least one doping region of a semiconductor substrate of the wide band-gap semiconductor wafer, by forming electrically conductive material within at least one opening extending through the glass structure.

Abstract: A mobile electrostatic carrier (MESC) provides a structural platform to temporarily bond a semiconductive wafer and can be used to transport the semiconductive wafer or be used to perform manufacturing processes on the semiconductive wafer. The MESC uses a plurality of electrostatic field generating (EFG) circuits to generate electrostatic fields across the MESC that allow the MESC to bond to compositional impurities within the semiconductive wafer. A dielectric thin film is superimposed across the bonding surface of MESC in order to adjust the relative permittivity between the semiconductive wafer to the MESC. This adjustment in the relative permittivity allows the MESC to further adhere the semiconductive wafer to the MESC.

Abstract: A method of making an absorbent composite that includes a first fabric, a second fabric, and particles positioned between the two fabrics and absorbent articles made from the absorbent composite. The particles are secured between the two fabric using adhesive, thermal plastic or combinations thereof. The fabrics are bonded together in a manner that limits particle movement between the fabrics. The bond pattern may define pockets or other shapes. In applications in which the bond pattern forms pockets, the particles may be positioned in the pockets. The particles may be SAP particles or other particles with advantageous properties.

Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; forming a first device material over the carrier substrate; and after forming the first device material over the carrier substrate, transforming the first device material into a second device material. Meanwhile, the transforming the first device material into the second device material can include: causing a cationic exchange in the first device material; and causing an anionic exchange in the first device material. The causing the cationic exchange in the first device material and the causing the anionic exchange in the first device material can occur approximately simultaneously. Other embodiments of related methods and systems are also disclosed.

Abstract: A disposable undergarment including an absorbent core assembly and methods of making the same is disclosed. The undergarment includes a chassis holding the core assembly. The chassis includes a front section, a crotch section and a rear section. The core assembly is located in the crotch section, with portions of it extending into the front and rear sections. A large plurality of closely spaced elastic threads extends across the full width of the undergarment in the front and rear sections. The elastic threads are broken in the areas of the core assembly. The core assembly includes a first section of a slow acting but high absorbency SAP in pockets thereof and an underlying second section of a fast acting but lower absorbency SAP in pockets thereof.

Abstract: A method of printing three-dimensional parts with an electrophotography-based additive manufacturing system, with a part material including a composition having an engineering-grade thermoplastic material and a charge control agent. The part material is provided in a powder form having a controlled particle size, and is configured for use in the electrophotography-based additive manufacturing system having a layer transfusion assembly for printing the three-dimensional parts in a layer-by-layer manner.

Abstract: In 3-D printing a platen moves toward an intermediate transfer belt (ITB) to have a sheet positioned on the platen contact the ITB to electrostatically transfer a layer of different materials to the sheet, and then the platen moves to a heater to join the layer to the sheet. This processing is repeated to have the sheet repeatedly contact the ITB (with intervening heating at the heater) to successively form layers of the materials on the sheet. The sheet having the layers thereon moves to a rinsing station, where a liquid is applied to dissolve the sheet and leave a freestanding stack of the layers. The freestanding stack is fed to a platform to successively form a 3-D structure of freestanding stacks of the layers. Light and/or heat are applied to the 3-D structure to bond the freestanding stacks to one another on the platform.

Abstract: In 3-D printing a platen moves toward an intermediate transfer belt (ITB) to have a sheet positioned on the platen contact the ITB to electrostatically transfer a layer of different materials to the sheet, and then the platen moves to a stabilization station to join the layer to the sheet. This processing is repeated to have the sheet repeatedly contact the ITB (with intervening stabilization at the stabilization station) to successively form layers of the materials on the sheet. The freestanding stack is fed to a platform to successively form a 3-D structure of freestanding stacks of the layers. Heat and/or pressure and/or light are applied to the 3-D structure to bond the freestanding stacks to one another through the sheets of collapsible media on the platform.

Abstract: A method of controlling the orientation of glass or plastic reinforcing fibers in an injection molded polymeric/fiber article including the step of applying a high electric field to at least a portion of the mold cavity during the injection of the fiber/polymer mix and during a setup or packing time preceding the ejection of the article from the mold.

Abstract: A Thumbtrap is an ipad accessory, that enhances individual and multi-player game play. It is a non-permanent, reusable vinyl cling that sticks to the smooth glass screen of the ipad without use of adhesives. When placed over an onscreen game control button, a Thumbtrap acts like a small fence that prevents the thumb drift that inevitably occurs during intense game play, and guides the thumb into specified zones over an onscreen button for better button contact accuracy. Thumbtraps can be used with several existing ipad games.

Abstract: A system and method for clamping wafers together in alignment using pressure. The system and method involves holding a first wafer and a second wafer together in alignment using a wafer clamp within an ambient environment maintained at a first pressure and creating a second pressure at least partially around and between the first wafer and the second wafer held together by the wafer clamp, wherein the first pressure is greater than the second pressure. The first wafer and the second wafer are clamped together in alignment using a pneumatic force created by a pressure differential between the first pressure and the second pressure.

Abstract: Disclosed are a supporting substrate for manufacturing a flexible information display device capable of easily separating the flexible information display device from the supporting substrate without deforming or damaging the flexible information display device, a manufacturing method thereof, and a flexible information display device manufactured thereby. The supporting substrate for manufacturing a flexible information display device includes: a coating layer formed therein with a plurality micro-protrusions formed on the supporting substrate; and a temporary bonding/debonding layer formed on the coating layer and including an adhesive material mechanically interlocked with and bonded to the supporting substrate through Van der Waals bonding force.

Abstract: The invention relates to a method for depositing one- or two-dimensional fiber structures in order to form a two- or three-dimensional fiber structure, in particular a fiber structure in the form of a fiber-reinforced plastic (FRP) or FRP semi-finished product, using a production machine including at least one depositing device and at least one fiber support. The one- or two-dimensional fiber structures have at least one unidirectional fiber layer. The depositing device deposits the one- or two-dimensional fiber structures onto the fiber support in a depositing direction in a controlled manner such that the fiber directions of the deposited one- or two-dimensional fiber structures assume an angle ?>20°, preferably ?>60°, and a maximum of ?=90°, relative to the depositing direction. The one- or two-dimensional fiber structures are deposited on the fiber support in a substantially tension-free manner with respect to the fiber direction of the fiber structures.

Abstract: A method for controlling a contact angle between a glue and a surface of a substrate during manufacture of microchip packages is disclosed. The method includes applying a glue to a surface of a substrate, and placing an electrode in electrical connection with the glue. A potential difference is applied between the electrode and the substrate. The potential difference is applied across the glue and causes a contact angle between the glue and the surface of the substrate to be altered.

Abstract: A portable electronic device housing portion is applied to a cover glass. The cover glass is heated to generate ionic conductivity therein and the method includes anodic bonding the cover glass to the housing portion. Cooling the assembly induces compressive stress within the cover glass to increase its tensile strength. The process which seals the cover glass to the housing also strengthens the cover glass.

Abstract: Providing a method for manufacturing a package capable of achieving reliable anodic bonding between the bonding material and a base board wafer even when the bonding material having a large resistance value is used. Providing a method for manufacturing a package by anodically bonding a bonding material, which is fixed in advance to an inner surface of a lid board wafer made of an insulator, to an inner surface of a base board wafer made of an insulator, the method including an anodic bonding step where an auxiliary bonding material serving as an anode is disposed on an outer surface of the lid board wafer, a cathode is disposed on an outer surface of the base board wafer, and a voltage is applied between the auxiliary bonding material and the cathode, wherein the auxiliary bonding material is made of a material that causes an anodic bonding reaction between the auxiliary bonding material and the lid board wafer in the anodic bonding step.

Abstract: An adhesive assembly includes a film having a top and bottom surface. An activatable adhesive is disposed on the bottom surface of the film. A release liner is applied to a surface of the adhesive, opposite the film. The release liner and the activatable adhesive being configured to electrostatically charge the activatable adhesive upon removal of the release liner from the adhesive.

Abstract: A light output device has scattering regions fabricated on an LED array using a self-aligned process, during which the light of each LED (10) is used to control the deposition process of scattering particles (22) on a photo-sensitive layer (20).

Abstract: This present invention provides a masking method for locally treating surface of a workpiece by masking the workpiece. The workpiece has a targeting treatment area and a non-targeting treatment area. The masking method includes: covering a fixture on the non-targeting treatment area of the workpiece to expose the targeting treatment area of the workpiece; by using an adsorbing force existing between the fixture and the workpiece, getting the fixture to closely contact with the non-targeting treatment area of the workpiece and to make an end edge of the fixture correspond to the edge of the targeting treatment area of the workpiece, wherein the adsorbing force is a vacuum adsorbing force or a static electric adsorbing force. Thereby the surface treatment only effects in an area within the range of the targeting treatment area of the workpiece so as to reduce the treatment defect.

Abstract: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.

Abstract: MEMS and microelectronic devices and fabrication methods feature providing a first material including a glass, providing a second material having an elastic modulus greater than the elastic modulus of silicon, causing the second material to have a surface with a RMS surface roughness of greater than 0.001 ?m and less than approximately 0.15 ?m, contacting the surface of the second material to a surface of the first material, and applying a voltage between the first and second materials to cause an anodic bond to form.

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

Abstract: There is provided a powdery adhesive that is used for adhesion between a metal plate and a porous material. The powdery adhesive includes at least thermosetting adhesive particles and an anti-rust filler. A content of the anti-rust filler is 0.1 to 1.0 part by mass with respect to 100 parts by mass of the thermosetting adhesive particles. The anti-rust filler may be at least one of phosphate and molybdate.

Abstract: A manufacturing method of a hermetic container includes steps of bonding a frame member to a first substrate, by pressing the first substrate and the second substrate to each other by an electrostatic force generated between a first electrode and a second electrode by applying a potential difference between the first electrode and the second electrode, and softening and melting the bonding material. Additional steps include cooling and solidifying the bonding material by simultaneously heating the bonding material with a local heating unit and moving the local heating unit, and increasing the potential difference between the first electrode and a segment of the second electrode, which is in a position at which the segment is heated by the local heating unit.

Abstract: When a base substrate where through electrodes are formed is anodically bonded to a lid substrate that includes a bonding film formed on the entire lower surface thereof, a method of manufacturing a piezoelectric vibrator includes a superimposing process for superimposing the lid substrate on the base substrate so that a piezoelectric vibrating reed is received in a cavity, after bonding the piezoelectric vibrating reed to the upper surface of the base substrate; a setting process for placing a dummy member, which is made of a material in which ions can be transferred at a bonding temperature, on an electrode plate, and placing the superimposed substrates on the dummy member so that the base substrate faces the dummy member; and an applying process for applying a bonding voltage between the electrode plate and the bonding film after heating the dummy member and the substrates up to the bonding temperature.

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

Abstract: A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

Abstract: Provided are aligned carbon nanotubes for a fuel cell having a large surface area, a nanocomposite that includes the aligned carbon nanotubes loaded with highly dispersed nanoparticles of a metallic catalyst, methods of producing the carbon nanotubes and the nanocomposite, and a fuel cell including the nanocomposite. In the nanocomposite, nanoparticles of the metallic catalyst are uniformly distributed on external walls of the nanotubes. A fuel cell including the nanocomposite exhibits better performance.

Abstract: A functional element including a substrate having a principal surface, a groove portion (a first groove portion, a second groove portion) disposed on the principal surface, and a fixed electrode section (a first fixed electrode finger, a second fixed electrode finger) laid across the groove portion on the substrate, wherein, in the groove portion, a raised portion formed by using at least one of the substrate and the fixed electrode section is provided in a position overlapping with the fixed electrode section in a plan view, the raised portion has a bonded surface (an end face), a wiring line (a first wiring line, a second wiring line) is disposed on the bonded surface, and the substrate and the fixed electrode section are connected with the wiring line sandwiched between the substrate and the fixed electrode section.

Abstract: The present invention relates to a plastics material component for an aircraft, comprising (i) a substrate, which comprises one or more thermosetting plastics materials, and (ii) one or more layers which are applied to the substrate, at least one layer S1 comprising mica.

Abstract: The invention overcomes the limitations described for the bonding of structured layers by providing a method for selectively reducing the bonding of materials. In its most generic form, the invention uses a bonding technique in combination with a printing method for modifying or covering at least one portion of a surface to either fully or partially prevent localised bonding. The structuring process may act upon the layers either before or after the bonding of the layers. The invention overcomes the limitations described in the application of affinity chromatography by providing a planar substrate with discrete optical detection flow cells that contain porous material and have connecting microchannels for fluid delivery and/or removal, and a method for making the same.

Abstract: Methods and apparatus provide for: disposing an intermediate layer formed from at least one of: a metal, a conductive oxide, and combined layers of the metal and the conductive oxide, on one of a first material layer and a second material layer; and coupling the first and second material layers together via an anodic bond between the intermediate layer and the other of the first and second material layers.

Abstract: An object of the present invention is to improve the fluidity of a thermosetting powder adhesive and clear the blocking with a powder adhesive in a constant amount supplying apparatus or a delivery pathway. The present invention has attained the object by a powder adhesive containing a thermosetting adhesive particle and an inorganic filler present on the surface of the thermosetting adhesive particle.

Abstract: A method of making a scouring material comprises the steps of: 1) forming a three-dimensional nonwoven web of natural fibres contacted with dry particulate material that includes fusible binder particles, 2) exposing the web to conditions that cause the binder particles to form a flowable liquid binder, and then solidifying the liquid binder to form bonds between the fibres of the web and thereby provide a pre-bonded web and 3) applying abrasive particles to the pre-bonded web and bonding the abrasive particles to the fibres of the pre-bonded web by at least a make-coat resin to provide the scouring material.

Abstract: A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.

Abstract: A method for joining at least two members of a lithographic apparatus is disclosed. The method includes providing a first member, providing a second member, direct-bonding the first member and the second member to form a direct-bond, and anodically bonding the first member and the second member. At least one of the members includes ultra low expansion glass and/or ultra low expansion glass ceramics.

Abstract: A composition of particles referred to as hot-melt, self-adhesive particles (10, 20), is made from a fusible thermoplastic material suitable for sticking parts together and having spikes (21) and/or barbs (11, 22) which can be hooked to the surface of at least one part to be stuck, in particular to the fibers of at least one surface of the parts to be stuck. A sticking method using such a composition is also described.

Abstract: A wafer is provided that is stacked on and anodically bonded to another wafer to form a plurality of package products each having a cavity in which an operation piece is contained between the wafers. The wafers has a product area in which a plurality of concave portions are formed each of which will be part of the cavity when stacked on the another wafer, and grooves or slits are formed extending from the central portion in radial direction to the outside in radial direction of the wafer and reaching the outside of the product area.

Abstract: A method for fabricating a nonwoven structure is disclosed. The method comprises: forming a nonwoven layer of polymer fibers on the collector liquid surface, transferring the layer to a solid surface, and repeating the formation and the transfer in a layerwise manner. The method is generally effected by spinning liquefied polymer, in particular by employing electrostatic or hydrostatic forces. The nonwoven structure formed comprises of plurality of nonwoven layers: the average thickness of the nonwoven structure is at least 0.5 mm and the structure has an overall porosity of at least 90%. The nonwoven structure an be used in forming a scaffold for tissue engineering, in particular a cell-scaffold composition, suitable for implanting in a patient, wherein at least one cell population is seeded on at least one of the plurality of layers.

Abstract: The disclosure describes the use of electrostatics to in-mold labeling wherein a label is secured to a mandrel with an axis-defining body, a first end, a distal end, a set of ionizing electrodes disposed about the body, near the distal end, and in a plane perpendicular to the axis. When the mandrel is positioned in a mold cavity, the label is released and a varying voltage applied to the electrodes to form a substantially uniform and ring-like source of ionizing current. The ionizing current progressively pins the label against the die as the mandrel is withdrawn from the die until substantially the entire label is pinned. The ionizing current may then be ended and the mandrel removed so that an article may then be formed into the label.

Abstract: A method for gluing microcomponents to a substrate (1) during the production of microsystem components includes the steps of applying a reactive or non-reactive hot melt type adhesive (5) to the microcomponent (18) and/or the substrate (1), heating the hot melt type adhesive (5), and placing the microcomponent (18) onto the substrate (1). The hot melt type adhesive (5) is on the contact surfaces between the microcomponent (18) and the substrate (1) during and after gluing.

Abstract: A piezoresistive sensor device and a method for making a piezoresistive device are disclosed. The sensor device comprises a silicon wafer having piezoresistive elements and contacts in electrical communication with the elements. The sensor device further comprises a contact glass coupled to the silicon wafer and having apertures aligned with the contacts. The sensor device also comprises a non-conductive frit for mounting the contact glass to a header glass, and a conductive non-lead glass frit disposed in the apertures and in electrical communication with the contacts. The method for making a piezoresistive sensor device, comprises bonding a contact glass to a silicon wafer such that apertures in the glass line up with contacts on the wafer, and filling the apertures with a non-lead glass frit such that the frit is in electrical communication with the contacts.

Abstract: The invention relates to a method for the manufacture of a sensor element and to a sensor element. In the method, both surfaces of a sensor film are provided with metallic electrodes. The sensor element is produced by cutting it from a larger amount of sensor element material. In the manufacture of the sensor element material, the electrodes are produced as a continuous process from roll to roll and the sensor element material is formed by laminating as a continuous process from roll to roll. At least the signal electrode consists of repeated electrode patterns (41) which are at least partially connected to each other via one or more narrow connecting strips (42), and a sensor element of a desired length and/or shape is produced by cutting the material across the region of the connecting strips.

Abstract: An apparatus (e.g. a shape memory device) that includes a nano-particle layer, a linking agent layer, and a shape memory layer. An electrode for heating shape memory material during shape transitions of the shape memory layer may include the nano-particle layer and the linking agent layer. The nano-particle layer may include conductive nano-size particles (e.g. gold clusters having a diameter less than 100 nanometers or less than 50 nanometers). The electrode may be substantially resilient to deformation of the shape memory material due to individual bonding of individual particles of the nano-particle layer to the shape memory layer and/or the linking agent layer.

Abstract: System and methods offset mechanism elements during fabrication of Micro-Electro-Mechanical Systems (MEMS) devices. An exemplary embodiment applies a voltage across an offset mechanism element and a bonding layer of a MEMS device to generate an electrostatic charge between the offset mechanism element and the bonding layer, wherein the electrostatic charge draws the offset mechanism element to the bonding layer. The offset mechanism element and the bonding layer are then bonded.

Abstract: The invention relates to a novel gas filter structure, a filtering method and a method of producing the filter structure. The structure according to the invention comprises a planar, porous isolation material layer (12) having two opposing surfaces. According to the invention both surfaces of the isolation material layer (12) comprise a porous conductive layer (14, 16) comprising a porous filtering matrix treated with a conductive material. The conductive material consists of a material different from the support matrix. By means of the conductive layers it is possible to create in the isolation material an electric field that considerably improves the filtering efficiency of the isolation material, especially for small particles.

Abstract: A bonding device for manufacturing a liquid crystal display device includes a bonding chamber for bonding first and second substrates and an ionizing device for introducing ionized gas or air into the bonding chamber.