With Direct Application Of Electrical, Magnetic, Or Radiant Energy To Work Patents (Class 156/272.2)
  • Patent number: 10377925
    Abstract: The present invention relates to an adhesive material, especially an electrically and/or thermally and/or radiation-curing or curable adhesive material, having at least one adhesive constituent and/or adhesive matrix, and moreover having at least one additive in the form of a carbon material, especially based on carbon nanomaterials and/or carbon micromaterials, present in the adhesive constituent and/or adhesive matrix. The invention further relates to a method for producing, activating and/or curing an adhesive material. Finally the invention also relates to a method for adhesively bonding two substrates.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: August 13, 2019
    Assignee: FUTURECARBON GMBH
    Inventors: Tim Schubert, Tomas Meinen, Christian Zenkel
  • Patent number: 10347468
    Abstract: A chamber has an upper housing and a lower housing and receives a reaction gas. A first plasma source includes electron beam sources providing electron beams into the upper housing to generate an upper plasma. A second plasma source includes holes generating a lower plasma within the holes connecting the upper housing and the lower housing. Radicals of the upper plasma, radicals of the lower plasma, and ions of the lower plasma are provided, through the holes, to the lower housing so that the lower housing has radicals and ions at a predetermined ratio of the ions to the radicals in concentration. The second plasma source divides the chamber into the upper housing and the lower housing. A wafer chuck is positioned in the lower housing to receive a wafer.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: July 9, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yeongkwang Lee, Sunggil Kang, Sang Ki Nam, Kwangyoub Heo, Kyuhee Han
  • Patent number: 10336923
    Abstract: Provided is a pressure sensitive adhesive polymer comprising adhesive polymerscrosslinked with a crosslinker that includes a photoresponsive group. Also provided is a method for preparing a pressure sensitive adhesive polymer comprising: polymerizing an vinyl monomer and photoresponsive crosslinker with two acryl end groups.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: July 2, 2019
    Assignee: The University of Akron
    Inventors: Abraham Joy, Ali Dhinojwala, Kaushik Mishra
  • Patent number: 10329460
    Abstract: An adhesive composition for joining optical components is described. The adhesive composition comprises at least one epoxy resin, a visible light photoinitiating system comprising at least one of a cationic photoinitiator and a sensitizer, a polyol and at least 50 wt. % of a nanoparticle filler. The visible light photoinitiating system includes at least one of a cationic photoinitiator and a sensitizer and the nanoparticle filler comprises a first nanoparticle having a first nominal size and a second nanoparticle having a second size. The adhesive composition has a refractive index between 1.44 and 1.47 and a dn/dT of less than ?2E?4 when cured.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: June 25, 2019
    Assignee: 3M Innovative Properties Company
    Inventors: Wendy L. Thompson, Wayne S. Mahoney, Donald K. Larson, Daniel J. Treadwell
  • Patent number: 10314362
    Abstract: Waterproof, breathable socks, booties, shoe inserts, and footwear assemblies containing the shoe inserts are provided. The booties and shoe inserts may include a laminate comprising a seamless extensible film, such as a polyurethane film, and at least one textile. The bootie is suitable for a range of sizes and shoe shapes. The bootie may shrink to fit, or, alternatively, be stretched to fit, an asymmetrical last having a desired size to form a shoe insert. A bootie having a seamless extensible film eliminates the need to have multiple sizes of shoe inserts correlating to particular shoe sizes. In embodiments where the polyurethane film is seamless and continuous, the shoe insert eliminates the need for a waterproof seam tape, which is conventionally used to make shoe inserts waterproof. Methods of forming the socks, booties, and shoe inserts are also provided.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: June 11, 2019
    Assignees: W. L. Gore & Associates, Inc., W. L. Gore & Associates GmbH
    Inventors: John E. Bacino, Norman E. Clough, Orlando Collazo, Stane Nabernik, Franz J. Shelley
  • Patent number: 10307582
    Abstract: Fluid flow conduits and apparatus and methods for joining the conduits, preferably in a sterile manner, are disclosed. Each conduit has a polymeric open end that is sealed by a sealing member that may include a heating element. The polymeric end material is melted, the sealing members are moved to expose the melted open ends of the conduits and the ends are brought together to form a fused or welded connection between the conduits.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: June 4, 2019
    Assignee: Fenwal, Inc.
    Inventors: Christopher Wegener, Kyungyoon Min, Mark Brierton, Benjamin Kusters, James Madsen, William H. Cork
  • Patent number: 10290520
    Abstract: A method for laminating glass panels includes (1) providing a TFT substrate and a CF substrate to be laminated, in which the CF substrate is coated with a seal resin and the TFT substrate carries liquid crystal dropped thereon; (2) aligning and laminating the TFT substrate and the CF substrate in a vacuum environment to complete a lamination process; (3) applying UV light to transmit through the TFT substrate for carrying out UV curing of the seal resin interposed between the CF substrate and the TFT substrate so as to complete a UV curing process; and (4) removing the laminated CF substrate and the TFT substrate that have been subjected to the UV curing process out of the vacuum environment.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: May 14, 2019
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Tao Ma, Tao Song, Ming Liu, Guodong Zhao
  • Patent number: 10239115
    Abstract: A method for joining at least two parts to be joined which are arranged so as to overlap at least in a joining zone is disclosed using a joining element which is fed to the joining zone in a joining direction and which is designed so as to be free of undercuts at least in a shaft when seen opposite the joining direction. At least one first part to be joined that interacts first with the joining element in the joining direction, is punched by means of the joining element, and the joining element is pressed into a second part to be joined without punching through the second part. The shaft of the joining element is designed so as to be free of undercuts after being pressed into the second part to be joined and is arranged so as to contact the first and the second part to be joined with a radially applied force in a form-fit-free manner at least when seen opposite the joining direction.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: March 26, 2019
    Assignee: AUDI AG
    Inventors: Norbert Hornbostel, Frank Barkhausen, Heiko Hellmeier
  • Patent number: 10196184
    Abstract: A self-aligning, pivotally engaging container sealing device is provided. The device comprises a base, a sealing head including an upper die member pivotally mounted relative to the base, and a lower die member supported by the base for free pivotal and vertical movement relative thereto. The lower die member is biased generally upwardly by a spring or other biasing mechanism, while permitted to tilt substantially freely about a generally horizontal axis. The device may be manually actuated by pivotally lowering the sealing head to operatively engage the die members. Initial contact by the descending upper die member on a part of the lower die member impels the lower die member to tilt into parallel alignment with the upper die member, before any significant force from the biasing member is transmitted through the lower die member to the upper die member to clamp and form a seal between a container flange and container cover located between the upper and lower die members.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: February 5, 2019
    Assignee: A-American Machine & Assembly Co.
    Inventor: Mark E. Keller
  • Patent number: 10183839
    Abstract: A method for manufacturing a flexible composite belt or cable, in the method, one or more parallel reinforced plastic profiles (11) are manufactured by pultrusion, continuous lamination or other continuous method. After surface treatment, the reinforced plastic profiles (11) are guided at a short distance from one another to coating treatment, which is carried out by extrusion or lamination or pultrusion. In the coating treatment, the reinforced plastic profiles are enveloped with a coating material (12) improving wear resistance which joins the reinforced plastic profiles (11) together and forms the coating of a finished belt or cable (10). Finally, the finished belt or cable (10) is wound on a reel.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: January 22, 2019
    Assignee: Exel Composites Oyj
    Inventors: Juha Honkanen, Kim Sjödahl, Vesa Korpimies
  • Patent number: 10150278
    Abstract: A device and a method allow for adhering sealing tape to open end of a multilayer sheet, usable at the production line and at the installation site. The device comprise means for applying pressure and heat onto the sealing tape and cutting blades for removing protruding edges of the sealing tape after it was adhered. The method comprise providing of a sealing tape, attaching and adhering the sealing tape to an open end of a multi-wall sheet by means of heat and/or pressure and adhesive and removal of protruding edges using cutting blades.
    Type: Grant
    Filed: January 1, 2014
    Date of Patent: December 11, 2018
    Assignee: PALRAM INDUSTRIES (1990) LTD
    Inventor: Reuven Hugi
  • Patent number: 10145745
    Abstract: To facilitate the anodic bonding of individual layers without precipitation of movable ions in a three-layer structure interposing a glass substrate such as a silicon-glass-silicon structure, an anodic bonding condition for a sensor chip and a glass substrate in a secondary anodic bonding process is made weaker than an anodic bonding condition for a silicon tube and the glass substrate in a primary anodic bonding process. The secondary anodic bonding process is completed before movable ions in the glass substrate that have been attracted to a part of the glass substrate close to a cathode in the primary anodic bonding process reach a bonded surface between the glass substrate and the silicon tube in the secondary anodic bonding process.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: December 4, 2018
    Assignee: Azbil Corporation
    Inventor: Kouji Yuuki
  • Patent number: 10141487
    Abstract: A cover for a light emitter having one or more light emitting devices includes a glass plate, a frame made of metal having an opening smaller than the glass plate, and a low melting glass having a lower melting point than the glass plate, the glass plate being sealed to the frame with the low melting glass to close the opening, wherein the frame has an encircling step, and the encircling step includes a placement face situated at a recessed position relative to an upper surface of the frame and a wall face, wherein the wall face includes first wall faces situated at opposite ends of each inner side of the encircling step and a second wall face situated between the first wall faces, and the second wall face includes a face extending at a smaller inclination angle than the first wall faces with respect to the placement face.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: November 27, 2018
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Makoto Kubota
  • Patent number: 10115496
    Abstract: A composition for preparing an electrically conductive composite includes, based on the total weight of the composition: about 37 weight percent to about 84 weight percent of an epoxy; about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; and about 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler. Also composites prepared therefrom and an electronic device including the same.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: October 30, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Soichiro Mizusaki, Sang Eui Lee, Won Suk Chang, In Taek Han
  • Patent number: 10099458
    Abstract: The disclosure relates to reversible bonded structural joints using active adhesive compositions that can allow for dis-assembly, repair, and re-assembly. The disclosure is particularly directed to the adhesive composition material, irrespective of the type of the substrate(s) being joined. The adhesive composition can include any thermoplastic adhesive material that can be remotely activated for targeted heating of just the adhesive composition (e.g., and not the surrounding substrates being joined) via the inclusion of electromagnetically excitable particles in the adhesive composition. The substrates can be any metal material, any composite material, any hybrid material, or otherwise. The disclosed adhesive compositions allow for recyclability of parts at the end of their lifetime and repair/replacement of parts during their lifetime.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: October 16, 2018
    Assignee: BOARD OF TRUSTEES OF MICHIGAN STATE UNIVERSITY
    Inventors: Mahmoodul Haq, Lawrence T. Drzal, Ermias G. Koricho
  • Patent number: 10103355
    Abstract: When attaching a substrate with an EL element formed thereon and a transparent sealing substrate, the periphery of a pixel portion is surrounded with a first sealing agent that maintains a gap between the two pieces of substrates, an entire surface of the pixel portion is covered with a second transparent sealing agent so that the two pieces of substrate is fixed with the first sealing agent and the second sealing agent. Consequently, the EL element can be encapsulated by curing the first sealing agent and the second sealing agent without enclosing a drying agent and doing damage to the EL element due to UV irradiation even when a sealing device only having a function of UV irradiation is used.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: October 16, 2018
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Tomoyuki Kurihara
  • Patent number: 10086562
    Abstract: A resin member contains a thermoplastic resin and is bonded to another resin member by ultrasonic welding. The resin member includes: a melting start portion to which contact pressure is applied during the ultrasonic welding; a groove unit that is formed around a periphery of the melting start portion; and at least one wall that is formed so as to cross a direction from the melting start portion toward an outside and partitions the groove unit.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: October 2, 2018
    Assignee: SUBARU CORPORATION
    Inventor: Tsubasa Ono
  • Patent number: 10035303
    Abstract: A method for joining a first and a second component, at least one of which comprises a fiber-reinforced plastics material. The components are arranged in relation to one another in such a way that a gap region remains between the first and the second component. The gap region is filled, at least in portions, with an uncured plastics material filler in which nanoparticles are dispersed. Energy is introduced locally into the nanoparticles in order to cure the plastics material filler. In another aspect, the invention provides a device for joining two components.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: July 31, 2018
    Assignee: Airbus Operations GmbH
    Inventors: Karsten Litzenberger, Klaus Edelmann, Matthias Schweim, Rainer Schildt
  • Patent number: 10025184
    Abstract: A liquid photocurable resin composition contains a (meth)acrylate oligomer component, an alkyl (meth)acrylate monomer component, and a photopolymerization initiator component. The (meth)acrylate oligomer component contains at least one oligomer selected from the group consisting of a polyurethane (meth)acrylate oligomer, a polyisoprene (meth)acrylate oligomer, a polybutadiene (meth)acrylate oligomer, and a polyether (meth)acrylate oligomer that have a weight average molecular weight of 1,000 to 200,000. The photopolymerization initiator contains a molecule cleavage-type photoradical polymerization initiator and a hydrogen-abstracting photoradical polymerization initiator at a ratio by mass of 10:1 to 10:35. The cured resin that is obtained by photoradical polymerization of the photocurable resin composition has a glass transition temperature of ?40 to 20° C. when the composition is cured at a curing ratio of the outermost surface of more than 90%.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: July 17, 2018
    Assignee: DEXERIALS CORPORATION
    Inventors: Mizuki Iwata, Takeshi Uematsu, Kazuhito Kawabata, Naoki Hayashi
  • Patent number: 10004840
    Abstract: The invention relates to a blood filter, a system comprising a blood filter and the use of a blood filter or system for the removal of substances from whole blood or blood components. According to the invention, a blood filter comprises an inlet (2), an outlet (3) and at least first fibers disposed between the inlet (2) and the outlet (3) for filtering a fluid being communicated between the inlet (2) and the outlet (3), wherein each of the first fibers comprises at least one groove extending in the longitudinal direction of the fiber.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: June 26, 2018
    Assignee: FRESENIUS HEMOCARE ITALIA S.R.L.
    Inventors: Laura Zambianchi, Serena Borghi, Giorgio Mari
  • Patent number: 9978619
    Abstract: A substrate processing apparatus includes a carrier block, an end block for returning a substrate picked up from the carrier block to the carrier block, and a middle block. The middle block includes a plurality of first processing modules stacked one above another, each being configured to process the picked-up substrate and directed to the end block or the substrate returning from the end block to the carrier block; a first transfer mechanism for vertically moving to transfer the substrate that is transferred from one of the carrier and end blocks to the middle block, to a respective one of the first processing modules, and delivering the substrate to the other of the carrier and end blocks; and a second transfer mechanism for transferring the substrate from the other of the carrier and end blocks to the one thereof, without passing through the plurality of first processing modules.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: May 22, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Terutaka Yamaoka, Naoki Tajima, Koji Motoi
  • Patent number: 9969152
    Abstract: In a method of producing a glass substrate including a laminate preparing step of laminating a glass film 1 having flexibility and a support glass 2 supporting the same, to prepare a laminate 3; a process step of forming an organic EL device 4 on the glass film 1 in the laminate 3, involving heating; and a peeling step of peeling off the glass film 1 on which the organic EL device 4 is formed from the support glass 2 to obtain a glass substrate 5, a heating step of heating the glass film 1 and the support glass 2 is executed before execution of the laminate preparing step, and the glass film 1 and the support glass 2 are laminated in the condition that they are heated at the time of execution of the laminate preparing step.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: May 15, 2018
    Assignees: Nippon Electric Glass Co., Ltd., Industrial Technology Research Institute
    Inventors: Yasuo Yamazaki, Takahide Fujii, Chun-Hsien Chien, Chia-Sheng Huang, Ting-Yu Ke, Hsin-Yun Hsu
  • Patent number: 9960122
    Abstract: A composite device includes a substrate and a mounted component mounted on a surface of, or inside, the substrate. The substrate includes a first thermoplastic resin layer. A surface of the mounted component includes a second thermoplastic resin layer that includes a same or a similar material as that of the first thermoplastic resin layer. A bonding layer that bonds the second thermoplastic resin layer and the first thermoplastic resin layer together is provided between the second thermoplastic resin layer and the first thermoplastic resin layer.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: May 1, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Noboru Kato
  • Patent number: 9945707
    Abstract: The purpose of the present invention is to provide a flow sensor that makes it possible to detect temperature abnormalities that the flow sensor has been exposed to and the time history of the flow sensor in a high-temperature environment from an externally visible cover material and that uses a cover material for which the laser welding quality can be guaranteed through visual inspection when the sensor is delivered as a product and even if the sensor is used in an abnormal state. A flow sensor provided with a housing, a cover, a circuit chamber that houses a wiring portion sealed between the housing and the cover, and an auxiliary passage through which the liquid to be sensed flows, wherein: a joint portion formed on the housing and a joint portion formed on the inner surface of the cover are joined together through the laser welding; the main material of the cover is a crystalline resin; the cover includes an amorphous alloy; and the cover is made to have a natural color.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: April 17, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Arai, Shigeharu Tsunoda, Shinobu Tashiro, Akira Uenodan, Shinya Igarashi
  • Patent number: 9929124
    Abstract: A method for bonding a first substrate with a second substrate by means of a connecting layer that is arranged between the substrates and that is comprised of a connecting material with the following steps: applying the connecting material to the first substrate and/or the second substrate in liquid form, and distributing the connecting material between the substrates by bringing the substrates closer and as a result forming the shape of the connecting layer with a thickness t.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: March 27, 2018
    Assignee: EV GROUP E. THALLNER GMBH
    Inventor: Jurgen Burggraf
  • Patent number: 9911595
    Abstract: Methods and apparatuses for selectively depositing silicon nitride on silicon surfaces relative to silicon oxide surfaces and selectively depositing silicon nitride on silicon oxide surfaces relative to silicon surfaces are provided herein. Methods involve exposing the substrate to an alkene which is selectively reactive with the silicon surface to block the silicon surface by forming an organic moiety on the silicon surface prior to depositing silicon nitride selectively on silicon oxide surfaces using thermal atomic layer deposition. Methods involve exposing the substrate to an alkylsilylhalide which is selectively reactive with the silicon oxide surface to block the silicon oxide surface by forming an organic moiety on the silicon oxide surface prior to depositing silicon nitride selectively on silicon surfaces using thermal atomic layer deposition.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: March 6, 2018
    Assignee: Lam Research Corporation
    Inventors: David Charles Smith, Dennis M. Hausmann
  • Patent number: 9902107
    Abstract: In a method for producing a thermoplastic film having a three-dimensionally textured, embossed surface, the film is subjected prior to a subsequent shaping kind of processing step to electron-beam crosslinking, which differently crosslinks the individual surface-area regions of the film, so that the regions that undergo greater degrees of drawing out during deforming have different degrees of crosslinking than their neighboring regions.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: February 27, 2018
    Assignee: Benecke-Kaliko AG
    Inventor: Juergen Buehring
  • Patent number: 9892943
    Abstract: The present invention provides a method for laminating glass panels and a vacuum lamination device using the method. The method includes (1) providing a TFT substrate (240) and a CF substrate (220) to be laminated, the CF substrate (220) being coated with a seal resin (204), the TFT substrate (240) carrying liquid crystal (402) dropped thereon; (2) aligning and laminating the TFT substrate (240) and the CF substrate (220) in a vacuum environment to complete a lamination process; (3) applying UV light to transmit through the TFT substrate (240) for carrying out UV curing of the seal resin (204) interposed between the CF substrate (220) and the TFT substrate (240) so as to complete a UV curing process; (4) removing the laminated CF substrate (220) and the TFT substrate (240) that have been subjected to the UV curing process out of the vacuum environment.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: February 13, 2018
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Tao Ma, Tao Song, Ming Liu, Guodong Zhao
  • Patent number: 9853133
    Abstract: A multilayer composite structure and a method of preparing a multilayer composite structure are provided. The multilayer composite structure comprises a semiconductor handle substrate having a minimum bulk region resistivity of at least about 500 ohm-cm; a silicon dioxide layer on the surface of the semiconductor handle substrate; a carbon-doped amorphous silicon layer in contact with the silicon dioxide layer; a dielectric layer in contact with the carbon-doped amorphous silicon layer; and a semiconductor device layer in contact with the dielectric layer.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: December 26, 2017
    Assignee: SunEdison Semiconductor Limited (UEN201334164H)
    Inventors: Shawn George Thomas, Qingmin Liu
  • Patent number: 9844831
    Abstract: A resistance spot welding system can join two polymeric workpieces and includes a power supply. The power supply has a positive terminal and a negative terminal. The resistance spot welding system further includes a welding electrode assembly electrically connected to the power supply. The welding electrode assembly includes a housing, a first electrically conductive pin and a second electrically conductive pin. The first and second electrically conductive pins both protrude from the housing. The first electrically conductive pin is electrically connected to the positive terminal of the power supply, and the second electrically conductive pin is electrically connected to the negative terminal of the power supply. The second electrically conductive material is electrically insulated from the first electrically conductive pin. The first and second electrically conductive pins are at least partly made of a material having a hardness ranging between 50 HRC and 70 HRC.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: December 19, 2017
    Assignee: GM Global Technology Operations LLC
    Inventors: Guoxian Xiao, Pei-Chung Wang, Jorge F. Arinez, Joseph Clifford Simmer
  • Patent number: 9829452
    Abstract: Various examples are provided for corrosion detection in structural tendons. In one example, among others, a method includes injecting current through a portion of a tendon assembly including a tendon at least partially encased in grout, where the current is injected through the portion of the tendon assembly via contact points on a surface of the grout. A potential across the portion of the grout surface is measured and a condition of the tendon can be based at least in part upon the current and the potential. In another example, a system includes supply electrodes to inject current into grout surrounding a tendon via contact with a surface of the grout, sensor electrodes to measure a potential difference between the supply electrodes, and an impedance detection device to determine an impedance of the tendon based at least in part upon the injected current and the potential difference.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: November 28, 2017
    Assignee: UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.
    Inventors: Mark E. Orazem, Yu-Min Chen, Christopher Alexander
  • Patent number: 9790381
    Abstract: An active energy ray curable composition is provided. The active energy ray curable composition includes polymerizable compounds including a first monofunctional monomer having a polar group, a second monofunctional monomer having no polar group, and a polyfunctional monomer. The homopolymer of each of the first monofunctional monomer and the second monofunctional monomer has a glass transition temperature of 50° C. or more. The first monofunctional monomer and the second monofunctional monomer account for 50% by mass or more of the polymerizable compounds in total, and the polyfunctional monomer accounts for 30% by mass or less of the polymerizable compounds.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: October 17, 2017
    Assignee: Ricoh Company, Ltd.
    Inventors: Manabu Arita, Mie Yoshino
  • Patent number: 9791338
    Abstract: Disclosed is to a pressure sensor including: a metal diaphragm configured to have a pressure sensing part disposed thereover; a first support configured to be coupled with the metal diaphragm; a first printed circuit board configured to be disposed over the pressure sensing part while being supported to the first support and electrically connected to the pressure sensing part; a connector configured to have a lower portion press-fitted with the first printed circuit board; a second printed circuit board configured to be electrically connected to the first printed circuit board through the connector while being press-fitted with an upper portion of the connector and supported by the connector; a second support configured to be disposed over the second printed circuit board; and a spring electrode configured to have an upper end protruding upward of the second support and have a lower end connected to the second printed circuit board.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: October 17, 2017
    Assignee: MANDO CORPORATION
    Inventor: Gon Jae Lee
  • Patent number: 9783865
    Abstract: A thermal-assisted method deforms plastically a high-strength material using a high-intensive heat source. The high-strength material may be a cold-rolled sheet aluminum of strength greater than 300 megapascal (MPa) or a cold-rolled sheet steel of strength greater than 1000 MPa. The cold-rolled sheet metal is heated just before bending to a temperature near or above the critical temperature for the material and is followed by rapid quenching after bending.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: October 10, 2017
    Assignee: GM Global Technology Operations LLC
    Inventors: Anil K. Sachdev, John E. Carsley, Stuart J. Brown, Louis J. Conrad
  • Patent number: 9777202
    Abstract: A composition includes methyl methacrylate MMA, at least one elastomer or a core-shell polymer, and at least one radical former, as an adhesive, sealant or coaling for gluing, sealing or coaling substrates containing plasticized PVC.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: October 3, 2017
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Heinz Meier, Markus Haufe, Josef Lussi, Elyes Jendoubi, Wilfried Carl
  • Patent number: 9772487
    Abstract: Techniques and architectures involving fabricating a display panel, such as an electro-wetting display panel include laminating a first support plate and a second support plate together to form a laminated display panel. The laminated display panel includes an ultra-violet (UV) light curable seal disposed between the first support plate and the second support plate proximate to edges of the laminated display panel. After conveying the laminated display panel to a UV light curing station, pressurized air, gas or fluid is applied to the laminated display panel to produce a pressure on the UV light curable seal between the first support plate and the second support plate. While applying the pressurized air, gas or fluid, the laminated display panel is exposed to UV light to cure the seal.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: September 26, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Hermanus Johannes Jansen, Jeroen Cornelis van der Gaag
  • Patent number: 9728504
    Abstract: A method is provided for fabricating an interconnect structure. The method includes providing a substrate; and forming a first conductive layer; and forming a sacrificial layer on the substrate and the first conductive layer. The method also includes forming an opening exposing a surface of the first conductive layer in the sacrificial layer; and forming a catalyst layer on the exposed portion of the surface of the first conductive layer and a top surface of the sacrificial layer. Further, the method includes forming carbon nanotube bundles perpendicular to the surface of the substrate on the catalyst layer; and removing the sacrificial layer and the carbon bundles on the sacrificial layer. Further, the method also includes forming a first dielectric material layer covering top surfaces of the carbon nanotube bundles and a portion the surface of the substrate without carbon nanotubes to seal the carbon nanotube bundles in a space.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: August 8, 2017
    Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventor: Deyuan Xiao
  • Patent number: 9718240
    Abstract: An exemplary method of, for instance, forming a baffle or reinforcer includes extruding an expandable material to have a particular cross-sectional profile, inserting the expandable material into a molding tool, cutting the expandable material to a predetermined length within the molding tool, and overmolding a carrier material onto a portion of the expandable material within the molding tool.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: August 1, 2017
    Assignee: SIKA TECHNOLOGY AG
    Inventor: Vincent Belpaire
  • Patent number: 9714365
    Abstract: Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: July 25, 2017
    Assignee: Avery Dennison Corporation
    Inventors: Michael Zajaczkowski, Michael T. Waterman, Kyle R. Heimbach, Eric L. Bartholomew, Brandon S. Miller
  • Patent number: 9666763
    Abstract: Transparent glass-to-glass hermetic seals are formed by providing a low melting temperature sealing glass along a sealing interface between two glass substrates and irradiating the interface with laser radiation. Absorption by the sealing glass and induced transient absorption by the glass substrates along the sealing interface causes localized heating and melting of both the sealing glass layer and the substrate materials, which results in the formation of a glass-to-glass weld. Due to the transient absorption by the substrate material, the sealed region is transparent upon cooling.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 30, 2017
    Assignee: Corning Incorporated
    Inventors: Stephan Lvovich Logunov, Mark Alejandro Quesada
  • Patent number: 9643165
    Abstract: A method of synthesizing a doped carbon composite includes preparing a solution having a carbon source material and a heteroatom containing additive, evaporating the solution to yield a plurality of powders, and subjecting the plurality of powders to a heat treatment for a duration of time effective to produce the doped carbon composite.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: May 9, 2017
    Assignee: BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS
    Inventor: Tito Viswanathan
  • Patent number: 9570633
    Abstract: A semiconductor package includes a substrate, at least one support, a cover, and a plate. The substrate has at least one light sensor or thermal sensor, a first surface, and a second surface opposite to the first surface. The light sensor or the thermal sensor is disposed on the first surface. The second surface has an opening to expose the light sensor (or the thermal sensor). The support is disposed on the first surface. The cover is disposed on the support, such that the cover is above the light sensor (or the thermal sensor) to form a first space between the cover and the light sensor (or the thermal sensor). The plate is placed on the second surface to cover the opening, such that a second space is formed between the plate and the light sensor (or the thermal sensor).
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: February 14, 2017
    Assignee: XINTEC INC.
    Inventor: Chien-Hung Liu
  • Patent number: 9545782
    Abstract: A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: January 17, 2017
    Assignee: The Boeing Company
    Inventors: Moushumi Shome, Adriana Willempje Blom, Sahrudine Apdalhaliem, Waeil M. Ashmawi
  • Patent number: 9539575
    Abstract: A reaction plate includes a welded plastics planar laminate consisting of an aperture plate and a film, the aperture plate having at least one planar surface and a plurality of apertures in the planar surface of the apertured plate and the film being attached to the planar surface of the apertured plate around the or each aperture by welding. The welding is preferably laser or transmission welding. A method of forming such reaction plates using diode laser welding. An apparatus is provided for handling such reaction plates including performing polymerase chain reactions (PCRs) or primer extensions therewith.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: January 10, 2017
    Assignee: LGC Genomics Limited
    Inventors: Richard Geoffrey Icke, Brian George Bryden
  • Patent number: 9539758
    Abstract: A frictional weld joint couples together first and second body portions of an article. The first body portion has a first nominal wall thickness and a first joint surface. The second body portion has a second nominal wall thickness and a second joint surface. A total bead height is defined between the joint surfaces. A first bead extends from the first joint surface defining a first bead height. A second bead extends from the second joint surface and is coupled to the first bead. A final second bead height is defined between the first bead and the second joint surface. A ratio of the first bead height to the final second bead height is of from about 0.40 to about 1.70. A ratio of the total bead height to at least one of the first and second nominal wall thicknesses is equal to or less than 6.00.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: January 10, 2017
    Assignee: BASF SE
    Inventors: Ankur Bhosale, Prasanna Kondapalli, William J. McMaster
  • Patent number: 9539174
    Abstract: Containers and components thereof for use in the medical industry and methods to manufacture the same are described. An example tab for use with a medical container includes opposing sheets sealed to define an open ended chamber into which a port is to be at least partially positioned. The port is to enable access to the medical container. The tab includes a tear seal defined by each of the opposing sheets and a first guide positioned on a first side of each of the tear seals. The tab includes a second guide positioned on a second side of each of the tear seals, wherein the first and second guides are to enable a tear to propagate substantially between the guides and adjacent the tear seals.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: January 10, 2017
    Assignee: Fenwal, Inc.
    Inventors: Craig Sandford, Anthony Oleskiewicz
  • Patent number: 9498923
    Abstract: The invention relates to a method for treating a fiber-plastic composite of a rotor blade, comprising the steps of: providing the fiber-plastic composite to be treated at the rotor blade; preparing a local working area of the fiber-plastic composite; providing a fiber-matrix composite comprising a UV-curable matrix material and a fiber material; applying the fiber-matrix composite onto the local working area of the fiber-plastic composite; and curing the matrix material. The invention provides for the curing of the matrix material to take place with the help of UV radiation.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: November 22, 2016
    Assignee: Wobben Properties GmbH
    Inventor: Ingo Hesse
  • Patent number: 9498918
    Abstract: A process for embossing a structure in an embossing material that is applied on a substrate comprising the steps of embossing the embossing material by an embossing die and hardening the embossing material, wherein at least the substrate and/or the embossing die and/or at least one heating layer arranged between the substrate and the embossing material and/or between the embossing die and the embossing material are irradiated by means of microwaves for hardening the embossing material.
    Type: Grant
    Filed: September 18, 2012
    Date of Patent: November 22, 2016
    Assignee: EV GROUP E. THALLNER GMBH
    Inventor: Dominik Treiblmayr
  • Patent number: 9487958
    Abstract: A composite engineered wood material piece, such as a floor board or wood material sheet, is comprised of a thin top quality wood material layer bonded onto a high density fiber board (HDF) material which is itself bonded onto a thick bottom substrate oriented strand board (OSB) material layer. The OSB material layer has its particle orientation in the top surface disposed parallel to the grain orientation in the top quality wood material layer. The HDF layer resists to the stress exhibited in the top layer and acts has a transition layer to secure the top layer to the bottom layer. It also strengthens the composite floor board or wood material sheet.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: November 8, 2016
    Assignee: BOA-FRANC S.E.N.C.
    Inventor: François Roy
  • Patent number: 9469068
    Abstract: A method of doping a substrate with dielectric dopant particles. The substrate, comprising an organic polymer, is exposed to a first layer comprising a first plurality of dielectric dopant particles. The organic polymer has a thermal conductivity that is less than 5 Wm?1K?1 and a lossiness that is less than a lossiness of the first plurality of dielectric dopant particles. The substrate and first layer are irradiated by an energy source operating at an operating frequency. During the irradiation, the first plurality of dielectric dopant particles of the first layer diffuses into the organic polymer of the substrate. Irradiation continues for a first desired time to achieve a first desired depth of penetration of the first plurality of dielectric dopant particles into the organic polymer.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: October 18, 2016
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventor: Jeffery R. Owens