With Direct Application Of Electrical, Magnetic, Or Radiant Energy To Work Patents (Class 156/272.2)
  • Patent number: 10730270
    Abstract: The present disclosure provides a metallized polyethylene laminate comprising: an outer polyethylene layer; a metallized acid copolymer layer; an inner polyethylene layer in contact with the metallized acid copolymer layer; and optionally an extruded polyethylene layer; and a sealant layer of polyethylene.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: August 4, 2020
    Assignee: Essel Propack Ltd.
    Inventors: Mrinal Kanti Banerjee, Chandrashekhar Ramchandra Abhyankar
  • Patent number: 10707048
    Abstract: According to one embodiment, provided is a deflection sensitivity calculation method for calculating deflection sensitivity of a deflector in an electron beam irradiation apparatus that irradiates an irradiation object on a stage with an electron beam by causing the deflector to deflect the electron beam, the deflection sensitivity calculation method including: irradiating an area that covers an adjustment plate with an electron beam by scanning a deflection parameter that controls deflection of the deflector in a predetermined width; detecting a current value detected from the adjustment plate; forming an image corresponding to the detected current value, a number of pixels of the image being known; calculating the number of pixels of a portion corresponding to the adjustment plate in the formed image; and calculating the deflection sensitivity of the deflector.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: July 7, 2020
    Assignee: EBARA CORPORATION
    Inventor: Ryo Tajima
  • Patent number: 10684501
    Abstract: A manufacturing system for manufacturing a laminated body by coating a first panel with an adhesive in a first working region and bonding the first panel coated with the adhesive and a second panel in a second working region includes a first conveying device in the first working region for conveying the first panel and the second panel, a coating device in the first working region for coating, with the adhesive, the first panel, a bonding device in the second working region for bonding the first panel and the second panel, and a second conveying device in the second working region for conveying the first panel and the second panel to the bonding device. The first conveying device and the second conveying device convey the first panel and the second panel to be bonded to each other as a set.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: June 16, 2020
    Assignee: HIRATA CORPORATION
    Inventors: Akinori Tashima, Itsuo Fujiwara
  • Patent number: 10656470
    Abstract: According to one embodiment, a display device includes a first substrate, a second substrate, an adhesive, an electro-optical layer, a terminal portion, and a reflective material. The first substrate is attached to the second substrate with the adhesive. The terminal portion is provided in the first substrate. The reflective material contains in the adhesive. The second substrate has flexibility. The terminal portion is provided on an external side in comparison with the adhesive as seen in plan view.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: May 19, 2020
    Assignee: Japan Display Inc.
    Inventor: Toshiyuki Higano
  • Patent number: 10641703
    Abstract: Disclosed is a method of enhancing absorption spectral signals of a biological sample in a terahertz waveband in which the biological sample are embedded and supported with black silicon. In the method, the biological sample are filled between the surface micro-nano structures of a black silicon material and then freeze-dried. When the terahertz wave is incident upon the black silicon material, multiple reflections will occur between the micro-nano structures, so that the terahertz wave passes through the biological sample multiple times to increase the distance of interaction between the terahertz waves and the biological sample, allowing for enhanced absorption spectral signals of the biological sample and improved identifiability of the biological sample. The method is simple and easy to implement and low in cost.
    Type: Grant
    Filed: June 30, 2018
    Date of Patent: May 5, 2020
    Assignee: University of Shanghai for Science and Technology
    Inventors: Yan Peng, Tengfei Zhang, Yiming Zhu, Bowei Xu, Wanqing Chen, Binbin Qi, Xiuping Zhang
  • Patent number: 10611122
    Abstract: The present disclosure provides a process. In an embodiment, the process includes A. providing a fitment with a base, the base comprising an ethylene/?-olefin multi-block copolymer; B. placing the base between two opposing multilayer films, each multilayer film having a respective seal layer comprising an olefin-based polymer; C. flat sealing the base to each multilayer film with opposing heated flat seal bars, the flat sealing forming opposing seal joints at the flattened base ends; and D. point sealing the opposing seal joints with opposing curved seal bars.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: April 7, 2020
    Assignee: Dow Global Techologies LLC
    Inventors: Marcos Franca, Bruno Rufato Pereira, Raimund Gerstner
  • Patent number: 10570015
    Abstract: Techniques for minimizing loss of volatile components during thermal processing of kesterite films are provided. In one aspect, a method for annealing a kesterite film is provided. The method includes: placing a cover over the kesterite film; and annealing the cover and the kesterite film such that, for an entire duration of the annealing, the cover is at a temperature T1 and the kesterite film is at a temperature T2, wherein the temperature T1 is greater than or equal to the temperature T2. Optionally, during a cool down segment of the annealing, conditions can be reversed to have the temperature T1 be less than the temperature T2. A solar cell and method for formation thereof using the present annealing techniques are also provided.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: February 25, 2020
    Assignee: International Business Machines Corporation
    Inventor: Teodor K. Todorov
  • Patent number: 10559992
    Abstract: Provided is a stator provided with a high withstand voltage insulating system operable at a high drive voltage without increasing the thickness of a slot insulating paper, and a rotary electric machine incorporating the stator. A stator of a rotary electric machine according to the present invention includes a stator core in which a plurality of slots is formed, a stator coil to be inserted into the slot, and an insulating paper to be inserted into the slot, and insulating the stator coil and the stator core, wherein the insulating paper includes a first insulating paper portion arranged adjacent to the stator core at an outside of an end surface in an axial direction of the slot and at least a second insulating paper portion arranged between the first insulating paper portion and the stator coil, and the insulating paper forms a resin reservoir portion in which an insulating resin is arranged, between the first insulating paper portion and the second insulating paper portion.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: February 11, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventor: Genzo Iwaki
  • Patent number: 10541270
    Abstract: The array of diodes comprises a matrix plane of diodes arranged according to columns in a first direction and according to rows in a second direction orthogonal to the first direction. The said diodes comprise a cathode region of a first type of conductivity and an anode region of a second type of conductivity, the said cathode and anode regions being superposed and disposed on an insulating layer situated on top of a semiconductor substrate.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: January 21, 2020
    Assignee: STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Francesco La Rosa, Stephan Niel, Arnaud Regnier
  • Patent number: 10542625
    Abstract: A wiring substrate includes a first wiring layer; a first insulation layer including a reinforcement material and a first opening extending through the reinforcement material and exposing a partial region of an upper surface of the first wiring layer, in which an end of the reinforcement material projects in the first opening; a second insulation layer not including a reinforcement material, covering an upper surface of the first insulation layer, a wall surface of the first opening, and a first part of the partial region and an entire surface of the reinforcement material projecting in the first opening, and including a second opening exposing a second part of the partial region; and a second wiring layer including a wiring portion formed on an upper surface of the second insulation layer and a via portion formed in the second opening and connecting the wiring portion to the first wiring layer.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: January 21, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Takayuki Ota
  • Patent number: 10525525
    Abstract: A method of preparing a casting article for use in manufacturing a gas turbine engine part according to an exemplary aspect of the present disclosure includes, among other things, communicating a powdered material to an additive manufacturing system and preparing a casting article that includes at least one trunk and a skin core that extends from the at least one trunk out of the powdered material.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: January 7, 2020
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Tracy A. Propheter-Hinckley, Dominic J. Mongillo, Jr., Benjamin T. Fisk
  • Patent number: 10525644
    Abstract: Wood-type golf clubs and/or golf club heads include: (a) a golf club head base member including a face member having a ball striking face; and (b) a polymeric body member engaged with the golf club head base member, wherein the polymeric body member is formed via a rotational molding process (or other centrifugal force inducing molding process) and/or engaged with the golf club head base member via a rotational molding process (or other centrifugal force inducing molding process). The polymeric body member forms at least a portion of a crown member of the club head in some structures.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: January 7, 2020
    Assignee: Karsten Manufacturing Corporation
    Inventors: John T. Stites, Gary G. Tavares, Todd A. Waatti
  • Patent number: 10522332
    Abstract: A chamber has an upper housing and a lower housing and receives a reaction gas. A first plasma source includes electron beam sources providing electron beams into the upper housing to generate an upper plasma. A second plasma source includes holes generating a lower plasma within the holes connecting the upper housing and the lower housing. Radicals of the upper plasma, radicals of the lower plasma, and ions of the lower plasma are provided, through the holes, to the lower housing so that the lower housing has radicals and ions at a predetermined ratio of the ions to the radicals in concentration. The second plasma source divides the chamber into the upper housing and the lower housing. A wafer chuck is positioned in the lower housing to receive a wafer.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: December 31, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yeongkwang Lee, Sunggil Kang, Sang Ki Nam, Kwangyoub Heo, Kyuhee Han
  • Patent number: 10488435
    Abstract: A support guide is provided for supporting a delicate heating wire in a failure test. The support guide includes a body formed of a heat resistant, non-conductive material. The body has a threaded surface configured to receive and support the delicate heating wire in a coiled form. Also provided is a failure testing method using the heat resistant, non-conductive threaded support guide.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: November 26, 2019
    Assignees: BSH Home Appliance Corporation, BSH Hausgeräte GmbH
    Inventors: Robert Jones, Shaun Jones
  • Patent number: 10486390
    Abstract: The present disclosure provides a process. In an embodiment, the process includes A. providing a fitment with a base, the base comprising an ethylene/?-olefin multi-block copolymer; B. placing the base between two opposing multilayer films, each multilayer film having a respective seal layer comprising an olefin-based polymer; C. flat sealing the base to each multilayer film with opposing heated flat seal bars, the flat sealing forming opposing seal joints at the flattened base ends; and D. point sealing the opposing seal joints with opposing curved seal bars.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: November 26, 2019
    Assignee: Dow Global Techologies LLC
    Inventors: Marcos Franca, Bruno Rufato Pereira
  • Patent number: 10457404
    Abstract: A system and method for anti-icing and de-icing an aircraft are provided. The system includes an electrically conductive coating, an electrical circuit having one or more electrical leads, a control unit, a plurality of temperature sensors connected to the control unit, and a plurality of ice detector sensors connected to the plurality of temperature sensors and the control unit. A process for anti-icing and de-icing an aircraft is also provided that includes applying electrically conductive coating under the skin of an airplane surface and attaching electrical wiring or metal strips to the skin of the airplane surface, and directing electricity to the electrical wiring or metal strips.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: October 29, 2019
    Inventor: Wan Tony Chee
  • Patent number: 10457838
    Abstract: Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: October 29, 2019
    Assignee: Avery Dennison Corporation
    Inventors: Michael Zajaczkowski, Michael T. Waterman, Kyle R. Heimbach, Eric L. Bartholomew, Brandon S. Miller
  • Patent number: 10442144
    Abstract: Wood-type golf clubs and/or golf club heads include: (a) a golf club head base member including a face member having a ball striking face; and (b) a polymeric body member engaged with the golf club head base member, wherein the polymeric body member is formed via a rotational molding process (or other centrifugal force inducing molding process) and/or engaged with the golf club head base member via a rotational molding process (or other centrifugal force inducing molding process). The polymeric body member forms at least a portion of a crown member of the club head in some structures.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: October 15, 2019
    Assignee: Karsten Manufacturing Corporation
    Inventors: John T. Stites, Gary G. Tavares, Todd A. Waatti
  • Patent number: 10399614
    Abstract: A motor vehicle tail gate panel has one side facing the inside of the motor vehicle and one side facing the outside of the motor vehicle and including a box having an adhesion area on the side facing the outside of the motor vehicle for adhering a glass to the surface of the box. The box extends beyond the adhesion area on the side opposite this area so as to form at least one section that is visible from the outside of the motor vehicle, and the section has a shape that enhances the aerodynamics of the motor vehicle. As a result, additional spoilers may not be needed, which improves productivity and reduces production costs. Example embodiments also relate to a motor vehicle that includes the tail gate panel.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: September 3, 2019
    Assignee: Compagnie Plastic Omnium
    Inventors: Pascal Depardon, Bertrand Hache
  • Patent number: 10392504
    Abstract: This disclosure relates to reactive epoxy compounds that have high water solubility. The reactive epoxy compounds are obtained by mixing an epoxy resin having at least two epoxy groups per molecule with a carboxyl group-containing compound obtained by reacting a polyetheramine comprising a primary amine and an acid anhydride derived from a polyvalent carboxylic acid. This disclosure also relates to waterborne epoxy resin composition comprising core-shell type epoxy resin particles dispersed in a solvent, wherein the particles are formed by an epoxy resin encapsulated in the reactive epoxy compounds of the present invention. The waterborne epoxy resin composition is low in volatile organic compounds (“VOC”).
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: August 27, 2019
    Assignee: Chang Chun Plastics Co., LTD.
    Inventors: Liang-Hsing Liu, Ying-Jui Lin, Yung-Sheng Lin, I-Chiang Lai, Kuen-Yuan Hwang, Yi-Sern Wong
  • Patent number: 10377925
    Abstract: The present invention relates to an adhesive material, especially an electrically and/or thermally and/or radiation-curing or curable adhesive material, having at least one adhesive constituent and/or adhesive matrix, and moreover having at least one additive in the form of a carbon material, especially based on carbon nanomaterials and/or carbon micromaterials, present in the adhesive constituent and/or adhesive matrix. The invention further relates to a method for producing, activating and/or curing an adhesive material. Finally the invention also relates to a method for adhesively bonding two substrates.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: August 13, 2019
    Assignee: FUTURECARBON GMBH
    Inventors: Tim Schubert, Tomas Meinen, Christian Zenkel
  • Patent number: 10347468
    Abstract: A chamber has an upper housing and a lower housing and receives a reaction gas. A first plasma source includes electron beam sources providing electron beams into the upper housing to generate an upper plasma. A second plasma source includes holes generating a lower plasma within the holes connecting the upper housing and the lower housing. Radicals of the upper plasma, radicals of the lower plasma, and ions of the lower plasma are provided, through the holes, to the lower housing so that the lower housing has radicals and ions at a predetermined ratio of the ions to the radicals in concentration. The second plasma source divides the chamber into the upper housing and the lower housing. A wafer chuck is positioned in the lower housing to receive a wafer.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: July 9, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yeongkwang Lee, Sunggil Kang, Sang Ki Nam, Kwangyoub Heo, Kyuhee Han
  • Patent number: 10336923
    Abstract: Provided is a pressure sensitive adhesive polymer comprising adhesive polymerscrosslinked with a crosslinker that includes a photoresponsive group. Also provided is a method for preparing a pressure sensitive adhesive polymer comprising: polymerizing an vinyl monomer and photoresponsive crosslinker with two acryl end groups.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: July 2, 2019
    Assignee: The University of Akron
    Inventors: Abraham Joy, Ali Dhinojwala, Kaushik Mishra
  • Patent number: 10329460
    Abstract: An adhesive composition for joining optical components is described. The adhesive composition comprises at least one epoxy resin, a visible light photoinitiating system comprising at least one of a cationic photoinitiator and a sensitizer, a polyol and at least 50 wt. % of a nanoparticle filler. The visible light photoinitiating system includes at least one of a cationic photoinitiator and a sensitizer and the nanoparticle filler comprises a first nanoparticle having a first nominal size and a second nanoparticle having a second size. The adhesive composition has a refractive index between 1.44 and 1.47 and a dn/dT of less than ?2E?4 when cured.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: June 25, 2019
    Assignee: 3M Innovative Properties Company
    Inventors: Wendy L. Thompson, Wayne S. Mahoney, Donald K. Larson, Daniel J. Treadwell
  • Patent number: 10314362
    Abstract: Waterproof, breathable socks, booties, shoe inserts, and footwear assemblies containing the shoe inserts are provided. The booties and shoe inserts may include a laminate comprising a seamless extensible film, such as a polyurethane film, and at least one textile. The bootie is suitable for a range of sizes and shoe shapes. The bootie may shrink to fit, or, alternatively, be stretched to fit, an asymmetrical last having a desired size to form a shoe insert. A bootie having a seamless extensible film eliminates the need to have multiple sizes of shoe inserts correlating to particular shoe sizes. In embodiments where the polyurethane film is seamless and continuous, the shoe insert eliminates the need for a waterproof seam tape, which is conventionally used to make shoe inserts waterproof. Methods of forming the socks, booties, and shoe inserts are also provided.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: June 11, 2019
    Assignees: W. L. Gore & Associates, Inc., W. L. Gore & Associates GmbH
    Inventors: John E. Bacino, Norman E. Clough, Orlando Collazo, Stane Nabernik, Franz J. Shelley
  • Patent number: 10307582
    Abstract: Fluid flow conduits and apparatus and methods for joining the conduits, preferably in a sterile manner, are disclosed. Each conduit has a polymeric open end that is sealed by a sealing member that may include a heating element. The polymeric end material is melted, the sealing members are moved to expose the melted open ends of the conduits and the ends are brought together to form a fused or welded connection between the conduits.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: June 4, 2019
    Assignee: Fenwal, Inc.
    Inventors: Christopher Wegener, Kyungyoon Min, Mark Brierton, Benjamin Kusters, James Madsen, William H. Cork
  • Patent number: 10290520
    Abstract: A method for laminating glass panels includes (1) providing a TFT substrate and a CF substrate to be laminated, in which the CF substrate is coated with a seal resin and the TFT substrate carries liquid crystal dropped thereon; (2) aligning and laminating the TFT substrate and the CF substrate in a vacuum environment to complete a lamination process; (3) applying UV light to transmit through the TFT substrate for carrying out UV curing of the seal resin interposed between the CF substrate and the TFT substrate so as to complete a UV curing process; and (4) removing the laminated CF substrate and the TFT substrate that have been subjected to the UV curing process out of the vacuum environment.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: May 14, 2019
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Tao Ma, Tao Song, Ming Liu, Guodong Zhao
  • Patent number: 10239115
    Abstract: A method for joining at least two parts to be joined which are arranged so as to overlap at least in a joining zone is disclosed using a joining element which is fed to the joining zone in a joining direction and which is designed so as to be free of undercuts at least in a shaft when seen opposite the joining direction. At least one first part to be joined that interacts first with the joining element in the joining direction, is punched by means of the joining element, and the joining element is pressed into a second part to be joined without punching through the second part. The shaft of the joining element is designed so as to be free of undercuts after being pressed into the second part to be joined and is arranged so as to contact the first and the second part to be joined with a radially applied force in a form-fit-free manner at least when seen opposite the joining direction.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: March 26, 2019
    Assignee: AUDI AG
    Inventors: Norbert Hornbostel, Frank Barkhausen, Heiko Hellmeier
  • Patent number: 10196184
    Abstract: A self-aligning, pivotally engaging container sealing device is provided. The device comprises a base, a sealing head including an upper die member pivotally mounted relative to the base, and a lower die member supported by the base for free pivotal and vertical movement relative thereto. The lower die member is biased generally upwardly by a spring or other biasing mechanism, while permitted to tilt substantially freely about a generally horizontal axis. The device may be manually actuated by pivotally lowering the sealing head to operatively engage the die members. Initial contact by the descending upper die member on a part of the lower die member impels the lower die member to tilt into parallel alignment with the upper die member, before any significant force from the biasing member is transmitted through the lower die member to the upper die member to clamp and form a seal between a container flange and container cover located between the upper and lower die members.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: February 5, 2019
    Assignee: A-American Machine & Assembly Co.
    Inventor: Mark E. Keller
  • Patent number: 10183839
    Abstract: A method for manufacturing a flexible composite belt or cable, in the method, one or more parallel reinforced plastic profiles (11) are manufactured by pultrusion, continuous lamination or other continuous method. After surface treatment, the reinforced plastic profiles (11) are guided at a short distance from one another to coating treatment, which is carried out by extrusion or lamination or pultrusion. In the coating treatment, the reinforced plastic profiles are enveloped with a coating material (12) improving wear resistance which joins the reinforced plastic profiles (11) together and forms the coating of a finished belt or cable (10). Finally, the finished belt or cable (10) is wound on a reel.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: January 22, 2019
    Assignee: Exel Composites Oyj
    Inventors: Juha Honkanen, Kim Sjödahl, Vesa Korpimies
  • Patent number: 10150278
    Abstract: A device and a method allow for adhering sealing tape to open end of a multilayer sheet, usable at the production line and at the installation site. The device comprise means for applying pressure and heat onto the sealing tape and cutting blades for removing protruding edges of the sealing tape after it was adhered. The method comprise providing of a sealing tape, attaching and adhering the sealing tape to an open end of a multi-wall sheet by means of heat and/or pressure and adhesive and removal of protruding edges using cutting blades.
    Type: Grant
    Filed: January 1, 2014
    Date of Patent: December 11, 2018
    Assignee: PALRAM INDUSTRIES (1990) LTD
    Inventor: Reuven Hugi
  • Patent number: 10145745
    Abstract: To facilitate the anodic bonding of individual layers without precipitation of movable ions in a three-layer structure interposing a glass substrate such as a silicon-glass-silicon structure, an anodic bonding condition for a sensor chip and a glass substrate in a secondary anodic bonding process is made weaker than an anodic bonding condition for a silicon tube and the glass substrate in a primary anodic bonding process. The secondary anodic bonding process is completed before movable ions in the glass substrate that have been attracted to a part of the glass substrate close to a cathode in the primary anodic bonding process reach a bonded surface between the glass substrate and the silicon tube in the secondary anodic bonding process.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: December 4, 2018
    Assignee: Azbil Corporation
    Inventor: Kouji Yuuki
  • Patent number: 10141487
    Abstract: A cover for a light emitter having one or more light emitting devices includes a glass plate, a frame made of metal having an opening smaller than the glass plate, and a low melting glass having a lower melting point than the glass plate, the glass plate being sealed to the frame with the low melting glass to close the opening, wherein the frame has an encircling step, and the encircling step includes a placement face situated at a recessed position relative to an upper surface of the frame and a wall face, wherein the wall face includes first wall faces situated at opposite ends of each inner side of the encircling step and a second wall face situated between the first wall faces, and the second wall face includes a face extending at a smaller inclination angle than the first wall faces with respect to the placement face.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: November 27, 2018
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Makoto Kubota
  • Patent number: 10115496
    Abstract: A composition for preparing an electrically conductive composite includes, based on the total weight of the composition: about 37 weight percent to about 84 weight percent of an epoxy; about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; and about 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler. Also composites prepared therefrom and an electronic device including the same.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: October 30, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Soichiro Mizusaki, Sang Eui Lee, Won Suk Chang, In Taek Han
  • Patent number: 10103355
    Abstract: When attaching a substrate with an EL element formed thereon and a transparent sealing substrate, the periphery of a pixel portion is surrounded with a first sealing agent that maintains a gap between the two pieces of substrates, an entire surface of the pixel portion is covered with a second transparent sealing agent so that the two pieces of substrate is fixed with the first sealing agent and the second sealing agent. Consequently, the EL element can be encapsulated by curing the first sealing agent and the second sealing agent without enclosing a drying agent and doing damage to the EL element due to UV irradiation even when a sealing device only having a function of UV irradiation is used.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: October 16, 2018
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Tomoyuki Kurihara
  • Patent number: 10099458
    Abstract: The disclosure relates to reversible bonded structural joints using active adhesive compositions that can allow for dis-assembly, repair, and re-assembly. The disclosure is particularly directed to the adhesive composition material, irrespective of the type of the substrate(s) being joined. The adhesive composition can include any thermoplastic adhesive material that can be remotely activated for targeted heating of just the adhesive composition (e.g., and not the surrounding substrates being joined) via the inclusion of electromagnetically excitable particles in the adhesive composition. The substrates can be any metal material, any composite material, any hybrid material, or otherwise. The disclosed adhesive compositions allow for recyclability of parts at the end of their lifetime and repair/replacement of parts during their lifetime.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: October 16, 2018
    Assignee: BOARD OF TRUSTEES OF MICHIGAN STATE UNIVERSITY
    Inventors: Mahmoodul Haq, Lawrence T. Drzal, Ermias G. Koricho
  • Patent number: 10086562
    Abstract: A resin member contains a thermoplastic resin and is bonded to another resin member by ultrasonic welding. The resin member includes: a melting start portion to which contact pressure is applied during the ultrasonic welding; a groove unit that is formed around a periphery of the melting start portion; and at least one wall that is formed so as to cross a direction from the melting start portion toward an outside and partitions the groove unit.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: October 2, 2018
    Assignee: SUBARU CORPORATION
    Inventor: Tsubasa Ono
  • Patent number: 10035303
    Abstract: A method for joining a first and a second component, at least one of which comprises a fiber-reinforced plastics material. The components are arranged in relation to one another in such a way that a gap region remains between the first and the second component. The gap region is filled, at least in portions, with an uncured plastics material filler in which nanoparticles are dispersed. Energy is introduced locally into the nanoparticles in order to cure the plastics material filler. In another aspect, the invention provides a device for joining two components.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: July 31, 2018
    Assignee: Airbus Operations GmbH
    Inventors: Karsten Litzenberger, Klaus Edelmann, Matthias Schweim, Rainer Schildt
  • Patent number: 10025184
    Abstract: A liquid photocurable resin composition contains a (meth)acrylate oligomer component, an alkyl (meth)acrylate monomer component, and a photopolymerization initiator component. The (meth)acrylate oligomer component contains at least one oligomer selected from the group consisting of a polyurethane (meth)acrylate oligomer, a polyisoprene (meth)acrylate oligomer, a polybutadiene (meth)acrylate oligomer, and a polyether (meth)acrylate oligomer that have a weight average molecular weight of 1,000 to 200,000. The photopolymerization initiator contains a molecule cleavage-type photoradical polymerization initiator and a hydrogen-abstracting photoradical polymerization initiator at a ratio by mass of 10:1 to 10:35. The cured resin that is obtained by photoradical polymerization of the photocurable resin composition has a glass transition temperature of ?40 to 20° C. when the composition is cured at a curing ratio of the outermost surface of more than 90%.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: July 17, 2018
    Assignee: DEXERIALS CORPORATION
    Inventors: Mizuki Iwata, Takeshi Uematsu, Kazuhito Kawabata, Naoki Hayashi
  • Patent number: 10004840
    Abstract: The invention relates to a blood filter, a system comprising a blood filter and the use of a blood filter or system for the removal of substances from whole blood or blood components. According to the invention, a blood filter comprises an inlet (2), an outlet (3) and at least first fibers disposed between the inlet (2) and the outlet (3) for filtering a fluid being communicated between the inlet (2) and the outlet (3), wherein each of the first fibers comprises at least one groove extending in the longitudinal direction of the fiber.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: June 26, 2018
    Assignee: FRESENIUS HEMOCARE ITALIA S.R.L.
    Inventors: Laura Zambianchi, Serena Borghi, Giorgio Mari
  • Patent number: 9978619
    Abstract: A substrate processing apparatus includes a carrier block, an end block for returning a substrate picked up from the carrier block to the carrier block, and a middle block. The middle block includes a plurality of first processing modules stacked one above another, each being configured to process the picked-up substrate and directed to the end block or the substrate returning from the end block to the carrier block; a first transfer mechanism for vertically moving to transfer the substrate that is transferred from one of the carrier and end blocks to the middle block, to a respective one of the first processing modules, and delivering the substrate to the other of the carrier and end blocks; and a second transfer mechanism for transferring the substrate from the other of the carrier and end blocks to the one thereof, without passing through the plurality of first processing modules.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: May 22, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Terutaka Yamaoka, Naoki Tajima, Koji Motoi
  • Patent number: 9969152
    Abstract: In a method of producing a glass substrate including a laminate preparing step of laminating a glass film 1 having flexibility and a support glass 2 supporting the same, to prepare a laminate 3; a process step of forming an organic EL device 4 on the glass film 1 in the laminate 3, involving heating; and a peeling step of peeling off the glass film 1 on which the organic EL device 4 is formed from the support glass 2 to obtain a glass substrate 5, a heating step of heating the glass film 1 and the support glass 2 is executed before execution of the laminate preparing step, and the glass film 1 and the support glass 2 are laminated in the condition that they are heated at the time of execution of the laminate preparing step.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: May 15, 2018
    Assignees: Nippon Electric Glass Co., Ltd., Industrial Technology Research Institute
    Inventors: Yasuo Yamazaki, Takahide Fujii, Chun-Hsien Chien, Chia-Sheng Huang, Ting-Yu Ke, Hsin-Yun Hsu
  • Patent number: 9960122
    Abstract: A composite device includes a substrate and a mounted component mounted on a surface of, or inside, the substrate. The substrate includes a first thermoplastic resin layer. A surface of the mounted component includes a second thermoplastic resin layer that includes a same or a similar material as that of the first thermoplastic resin layer. A bonding layer that bonds the second thermoplastic resin layer and the first thermoplastic resin layer together is provided between the second thermoplastic resin layer and the first thermoplastic resin layer.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: May 1, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Noboru Kato
  • Patent number: 9945707
    Abstract: The purpose of the present invention is to provide a flow sensor that makes it possible to detect temperature abnormalities that the flow sensor has been exposed to and the time history of the flow sensor in a high-temperature environment from an externally visible cover material and that uses a cover material for which the laser welding quality can be guaranteed through visual inspection when the sensor is delivered as a product and even if the sensor is used in an abnormal state. A flow sensor provided with a housing, a cover, a circuit chamber that houses a wiring portion sealed between the housing and the cover, and an auxiliary passage through which the liquid to be sensed flows, wherein: a joint portion formed on the housing and a joint portion formed on the inner surface of the cover are joined together through the laser welding; the main material of the cover is a crystalline resin; the cover includes an amorphous alloy; and the cover is made to have a natural color.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: April 17, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Satoshi Arai, Shigeharu Tsunoda, Shinobu Tashiro, Akira Uenodan, Shinya Igarashi
  • Patent number: 9929124
    Abstract: A method for bonding a first substrate with a second substrate by means of a connecting layer that is arranged between the substrates and that is comprised of a connecting material with the following steps: applying the connecting material to the first substrate and/or the second substrate in liquid form, and distributing the connecting material between the substrates by bringing the substrates closer and as a result forming the shape of the connecting layer with a thickness t.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: March 27, 2018
    Assignee: EV GROUP E. THALLNER GMBH
    Inventor: Jurgen Burggraf
  • Patent number: 9911595
    Abstract: Methods and apparatuses for selectively depositing silicon nitride on silicon surfaces relative to silicon oxide surfaces and selectively depositing silicon nitride on silicon oxide surfaces relative to silicon surfaces are provided herein. Methods involve exposing the substrate to an alkene which is selectively reactive with the silicon surface to block the silicon surface by forming an organic moiety on the silicon surface prior to depositing silicon nitride selectively on silicon oxide surfaces using thermal atomic layer deposition. Methods involve exposing the substrate to an alkylsilylhalide which is selectively reactive with the silicon oxide surface to block the silicon oxide surface by forming an organic moiety on the silicon oxide surface prior to depositing silicon nitride selectively on silicon surfaces using thermal atomic layer deposition.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: March 6, 2018
    Assignee: Lam Research Corporation
    Inventors: David Charles Smith, Dennis M. Hausmann
  • Patent number: 9902107
    Abstract: In a method for producing a thermoplastic film having a three-dimensionally textured, embossed surface, the film is subjected prior to a subsequent shaping kind of processing step to electron-beam crosslinking, which differently crosslinks the individual surface-area regions of the film, so that the regions that undergo greater degrees of drawing out during deforming have different degrees of crosslinking than their neighboring regions.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: February 27, 2018
    Assignee: Benecke-Kaliko AG
    Inventor: Juergen Buehring
  • Patent number: 9892943
    Abstract: The present invention provides a method for laminating glass panels and a vacuum lamination device using the method. The method includes (1) providing a TFT substrate (240) and a CF substrate (220) to be laminated, the CF substrate (220) being coated with a seal resin (204), the TFT substrate (240) carrying liquid crystal (402) dropped thereon; (2) aligning and laminating the TFT substrate (240) and the CF substrate (220) in a vacuum environment to complete a lamination process; (3) applying UV light to transmit through the TFT substrate (240) for carrying out UV curing of the seal resin (204) interposed between the CF substrate (220) and the TFT substrate (240) so as to complete a UV curing process; (4) removing the laminated CF substrate (220) and the TFT substrate (240) that have been subjected to the UV curing process out of the vacuum environment.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: February 13, 2018
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventors: Tao Ma, Tao Song, Ming Liu, Guodong Zhao
  • Patent number: 9853133
    Abstract: A multilayer composite structure and a method of preparing a multilayer composite structure are provided. The multilayer composite structure comprises a semiconductor handle substrate having a minimum bulk region resistivity of at least about 500 ohm-cm; a silicon dioxide layer on the surface of the semiconductor handle substrate; a carbon-doped amorphous silicon layer in contact with the silicon dioxide layer; a dielectric layer in contact with the carbon-doped amorphous silicon layer; and a semiconductor device layer in contact with the dielectric layer.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: December 26, 2017
    Assignee: SunEdison Semiconductor Limited (UEN201334164H)
    Inventors: Shawn George Thomas, Qingmin Liu
  • Patent number: 9844831
    Abstract: A resistance spot welding system can join two polymeric workpieces and includes a power supply. The power supply has a positive terminal and a negative terminal. The resistance spot welding system further includes a welding electrode assembly electrically connected to the power supply. The welding electrode assembly includes a housing, a first electrically conductive pin and a second electrically conductive pin. The first and second electrically conductive pins both protrude from the housing. The first electrically conductive pin is electrically connected to the positive terminal of the power supply, and the second electrically conductive pin is electrically connected to the negative terminal of the power supply. The second electrically conductive material is electrically insulated from the first electrically conductive pin. The first and second electrically conductive pins are at least partly made of a material having a hardness ranging between 50 HRC and 70 HRC.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: December 19, 2017
    Assignee: GM Global Technology Operations LLC
    Inventors: Guoxian Xiao, Pei-Chung Wang, Jorge F. Arinez, Joseph Clifford Simmer