Abstract: A method for manufacturing a highly productive key pad with rigid resin key top, wherein the key top adhesion surface 2, 6 of the key pad 1, 5 or a portion thereof is surface altered by at least one method selected from short wavelength UV irradiation treatment, corona discharge treatment, flame treatment and plasma treatment and can be adhered with reactive hardening resin 3, 7 such as urethane base resin, epoxy base resin, amino base resin, acrylic base resin, cyanoacrylate base resin and photo reactive hardening resin, thereby reducing adhesion operation time, without fear of dislocation during the adhesion.

Abstract: The method of attaching one or more plastic parts made from polypropylene to a glass container by means of an adhesive includes, prior to applying the adhesive over a portion of a surface of the one or more plastic parts in order to attach the plastic part or parts to the glass container, activating at least that portion of the surface, either by treating that portion of the surface with a low pressure plasma, preferably generated in a natural gas/air mixture at from 10 to 500 Pa, or by treating that portion of the surface with a flame from a gas burner. The one or more glass parts include a plastic handle and/or plastic lip member with a circumferential groove engageable with the upper edge of the glass container, especially a coffee container.

Abstract: A lens, having an optical power surface, which may have multiple radii portions or aspherical portions as well as spherical portions, is molded in a coined old. A pair of core pins, positioned within the mold cavity during the lens forming process, will produce a pair of haptic-mounting holes within the lens. As the lenses are subsequently tumbled to remove flash, indentations will form adjacent to the haptic-mounting holes. These indentations allow for tangential attachment of the haptic to the lens which, in turn, enables maximum flexibility without exceeding the width of the optic.

Abstract: A thin film bonding method for bonding a thin film to an target surface by using an adhesive agent includes the steps of: applying the adhesive agent on the target surface and mounting the thin film on the adhesive agent; applying a a fluid pressure on the target surface and the thin film from a central portion to an circumference according to lapse of time, so as to allow the thin film and the target surface to be bonded partially; and hardening the adhesive agent. The compressive force using the fluid having a magnetic force in the thin film bonding proceeds in a spiral form from the central portion to the circumference of the disk according to lapse of time, so that the air trap existing in the adhesive agent can be effectively removed, and thus, the flatness of the disk can be prevented from degradation due to the air trap.

Abstract: A supporting substrate for mounting a semiconductor bare chip thereon has a surface provided with electrode pads thereon and bumps on the electrode pads. A sealing resin film is selectively formed on the surface of the supporting substrate, except cover the bumps, and further the sealing resin film has at least a thermosetting property. The electrode pads of the above supporting substrate and the bumps of the semiconductor bare chip are bonded by a thermo-compression bonding method whereby the sealing between the supporting substrate and the semiconductor bare chip is simultaneously conducted.

Abstract: Process for manufacturing metallic strip for packaging comprising strip steel covered on at least one of its faces with a coating containing a sub-layer of tin and an external film of polymer, according to which:

Abstract: A process for adhering a layer of organic paint to the surface of a glass sheet, and the products produced thereby. The process comprises applying a layer of a water-based silicate paint to the surface of the glass sheet, heating to cure the paint, forming the glass sheet into a shape, sensitizing the water based paint with a layer of silane material, applying a layer of organic paint over the layer of sensitized water-based silicate paint, and curing the organic paint to provide organic paint adhered to the glass surface.

Abstract: A surface covering has a base to which is laminated a rigid vinyl film. The film is precoated with an electron beam cured wearlayer. The preferred wearlayer composition is a polymerizable organic urethane-polyester wearlayer coating. The coated printed film is prepared by application of a polyester urethane acrylate composition to a printed sheet of rigid vinyl film and the coating is exposed to a low accelerating energy Electro-curtain to form an abrasion resistant topcoat with no apparent degradation of printed rigid vinyl film.

Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Abstract: A method for manufacturing an optical fiber array by connecting bare fibers to connection elements in a facing arrangement, comprising a step of aligning a plurality of bare fibers using a bare-fiber guide; a step of bringing a flat member into contact with the aligned bare fibers, tacking the bare fibers onto the flat member by direct or indirect bonding means while keeping the bare fibers sandwiched between the bare-fiber guide and the flat member, and separating the bare fibers and the bare-fiber guide thereafter; and a step of forming a coating of uncured material on the external peripheral surfaces of the tacked bare fibers and on the flat member exposed between the bare fibers, curing this material, and bonding the bare fibers to the flat member. This method dispenses with the need to provide a bare fiber guide member and allows manufacturing costs to be reduced.

Abstract: This invention relates to a decorative package comprising a package having adhered thereto a label comprising a transparent polymer sheet, and at least one dye containing layer is on each side of said sheet, wherein there are at least four separate dye containing layers and the dye containing layers comprise at least four spectrally distinct colors.

Abstract: The invention provides an adhesive formulation for tacking and holding a nozzle plate in alignment on a semiconductor chip for an ink jet pen of an ink jet printer. The adhesive formulation includes a multifunctional epoxy material, a difunctional epoxy material, a fumed silica viscosity control agent, an imidazole-based thermal initiator and a mixed aryl sulfonium salt photoinitiator. Use of the adhesive formulation enables a nozzle plate to be assembled to a semiconductor chip with while substantially maintaining critical alignment between the nozzle plate and semiconductor chip.

Abstract: A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction.

Abstract: To provide a decorative sheet which has a three-dimensional decorative effect and, in addition, is free from separation of a decorated area upon being exposed to abrasion or impact conditions. A decorative sheet comprising: a substrate (1) formed of a transparent resin composition; and, laminated thereon in the following order, a color layer (2), an expandable layer (3), and a pressure-sensitive adhesive layer (5).

Abstract: A method of bonding a component to glass comprising disposing a pressure-sensitive adhesive sheet material between said component and said glass so that said adhesive sheet material is adhered to said component and said glass, wherein said adhesive sheet material comprises the photopolymerization reaction product of starting materials comprising: (a) a monomeric mixture or partially prepolymerized syrup comprising at least one acrylic acid ester of an alkyl alcohol and at least one copolymerizable monomer; (b) an epoxy resin or a mixture of epoxy resins, (c) a heat-activatable hardener for the epoxy resin or mixture of epoxy resins, (d) a photoinitiator, and (e) a pigment.

Abstract: A method for aligning a lenticular sheet, in accordance with the present invention, includes applying curable adhesive to a surface and placing a lenticular sheet over the curable adhesive on the surface. The adhesive is cured at a first end portion of the lenticular sheet such that the first end portion is aligned with a first reference position. A temperature of the lenticular sheet is adjusted to align a second end portion of the lenticular sheet with a second reference position. Remaining portions of adhesive are cured to secure the lenticular sheet.

Abstract: The invention relates to a process for manufacturing an unfinished rubber piece for a vehicle tire that includes providing a plurality of tire components composed of unvulcanized rubber mixtures, and treating a surface of at least one of the plurality of tire components with a plasma and/or a flame to increase the adhesiveness of the surface. The unvulcanized rubber mixtures may include partially embedded reinforcing members.

Abstract: The present invention is directed to a method for the lamination of metals, and especially copper, to the surfaces of fluoropolymers at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of a metal (e.g. copper) in the presence of a functional monomer. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The so-laminated fluoropolymer-metal interfaces exhibit T-peel strengths of no less than 8 N/cm and delaminate via cohesive failure inside the fluoropolymer.

Abstract: In a method of connecting a first and a second silicon wafer, the first silicon wafer is first provided with a polyimide layer on a main surface thereof. Subsequently, a plasma-induced reaction between the polyimide layer and water is performed. A plasma-induced reaction is also performed between a main surface of the second silicon wafer and chlorine. The main surface of the second silicon wafer is then subjected to a treatment with hydrolyzed triethoxysilylpropanamine. Following this, the surfaces of the two silicon wafers, which have been subjected to the plasma-induced reactions, are joined together so as connect the silicon wafers permanently.

Abstract: A lenticular lens sheet for use as a rear projection screen, comprises a base lenticular lens sheet having a surface provided with a plurality of lenticular elements, and a surface diffusing part having minute diffusing elements. The surface diffusing part is combined with the base lenticular lens sheet by laminating a plastic film having one surface provided with the minute diffusing elements to the base lenticular lens sheet so that the minute diffusing elements lie on the surfaces of the lenticular elements or by embossing the minute diffusing elements in the surfaces of the lenticular elements of the base lenticular lens sheet with an embossing plastic film having a surface of a shape complementary to the minute diffusing elements.

Abstract: An optical disc and its manufacturing method in which humps may be prohibited from being formed on an outer rim area of the disc to assure optimum surface properties of a light transmitting layer of the disc to contribute to further increase in recording capacity. On a substrate 2 of an optical disc 1 are sequentially formed a recording portion 6 and a light transmitting layer 5. The light falls on the light transmitting layer 5 to record and/or reproduce information signals for a signal recording area 6a of the substrate 2. The radial distance D from the outermost rim of the substrate 2 to the signal recording area 6a is selected to be larger than the radial width L of a hump 5a formed on the outer rim of the light transmitting layer 5. The hump 5a has a height h from the surface of the light transmitting layer 5 not larger than 70 &mgr;m.

Abstract: To produce a conductive epoxy resin composition with improvement in the characteristics of rapid-curability, heat resistance and moisture resistance, adhesion reliability, storage properties and low-temperature curability that can be used effectively for production of conductive adhesive films. The conductive epoxy resin composition comprises an alicyclic epoxy resin, optional diols, a styrenic thermoplastic elastomer with an epoxy group in the molecule, an ultraviolet activated cationic polymerization catalyst, an optional tackifier having an aromatic ring in the molecule, and conductive particles.

Abstract: The invention is directed to a process for the preparation of polymer laminated base paper, said process comprising laminating a base paper web on at least one side thereof with at least one polymer layer by extrusion-coating at a coating speed of 300 m/min or more, wherein the said base paper web is heated prior to laminating.

Abstract: A sealant application method for applying a first sealant as a preliminary sealant to a second sealant as a subsequent sealant, comprising the steps of subjecting a surface of the first sealant to an electric discharge treatment; and applying the second sealant directly to or through a primer to the first sealant after the electric discharge treatment. The first sealant preliminarily applied is first subjected to the electric discharge treatment to thereby reform the surface of the first sealant into an optimum-condition, thereby ensuring strong adhesion of the second sealant to the first sealant.

Abstract: A method of applying an edge electrode pattern to a touch screen panel including printing an edge electrode pattern on decal paper; applying a cover coat over the electrode pattern; removing the decal paper; and transferring the edge electrode pattern to a touch screen panel. A decal to be used in accordance with this method.

Abstract: A laminate comprising an ion conductive material having excellent ion conductivity at room temperature or at lower temperatures, a small water content, sufficiently high mechanical strength and storage stability to allow for handling the ion conductive material in practice, and a form which is easily integrated into an electrochemical element or electrochemical devices. Also disclosed is a production method thereof, and a method of producing a battery, a capacitor or an electrochemical element or apparatus using the laminate. The laminate comprises an intermediate layer of an ion conductive material having on the upper and lower portions thereof outer layers having an ion conductivity lower than that of the intermediate layer. Furthermore, at least one of the outer layers is a layer comprising a non electron-conductive material.

Abstract: Disclosed is a process for bonding a first article to a second article which comprises (a) providing a first article comprising a polymer having photosensitivity-imparting substituents; (b) providing a second article comprising metal, plasma nitride, silicon, or glass; (c) applying to at least one of the first article and the second article an adhesion promoter selected from silanes, titanates, or zirconates having (i) alkoxy, aryloxy, or arylalkyloxy functional groups and (ii) functional groups including at least one photosensitive aliphatic >C═C< linkage; (d) placing the first article in contact with the second article; and (e) exposing the first article, second article, and adhesion promoter to radiation, thereby bonding the first article to the second article with the adhesion promote. In one embodiment of the present invention, the adhesion promoter is employed in microelectrical mechanical systems such as thermal ink jet printheads.

Abstract: A process for producing an IC chip having a protective layer is provided. The process comprises attaching an adhesive sheet comprising a base material and a layer of a curable resin disposed on one face of the base material to at least one face of an IC chip attached to a circuit substrate under pressure in a manner such that the layer of a curable resin contacts the face of the IC chip and curing the layer of a curable resin.

Abstract: A multi-layer recording medium including a light-transmitting substrate, a first information recording layer formed on the substrate, an intermediate layer at least part of which is formed of a photo-curable resin film, and which is formed on the first information recording layer, a second information recording layer formed on a surface of the intermediate layer opposite to the surface facing the first information signal layer, and a protective layer formed on the second information signal layer. A method for producing such multi-layer recording medium is also disclosed.

Abstract: Photosensitive resin is applied to an internal conductive pattern layer (2) as well as to an inside layer which has a hole (3a) filled with conductive paste (3b). A hole (4a) communicating to the internal conductive pattern layer (2) by exposure and development is formed. Then, metal plated film (6a) is formed on the surface of the photosensitive resin (4) including the hole (4a). Metal plated film (6a) is processed into an external conductive pattern layer (6a). This manufacturing method can increase the wiring density on the external conductive pattern layer (6), and thus a multilayer printed wiring board of increased wiring density can be obtained.

Abstract: A hot-melt adhesive composition, which has a high curing rate, requires no water for a curing reaction or no solvent for the formation of a film, has good storage stability, and is suitable for adhering electronic parts or producing integrated circuit (IC) packages is provided. Specifically, a thermosetting hot-melt adhesive composition comprising a polyethylene copolymer having epoxy groups in a molecule as an epoxy component, which further comprises a cationic polymerization catalyst, is provided herein. Also disclosed are heat-bonding film adhesives and adhering methods using the hot-melt adhesive composition.

Abstract: The invention provides a mounting structure of an electronic part comprising an electronic part element (3) in association with a terminal electrode (5) and mounted on a substrate (7) via an adhesive (11) characterized in that a functional group having a nucleophilic substituting property is on a surface of said terminal electrode (5) and said terminal electrode (5) is bonded to said adhesive (11) by interatomic bonding. The invention also provide a method of mounting the electronic part. Bonding strength between the electronic part and the substrate is provided by not only mechanical bonding but also chemical bonding.

Abstract: Electrically conductive polymer bumps are formed in electrical connection with circuitry supported by a first substrate. The polymer bumps are bonded with a conductive adhesive to circuitry supported by a second substrate, with the conductive adhesive being in electrical connection with the circuitry supported by the second substrate. Prior to said bonding, an effective amount of ultraviolet radiation is impinged onto the polymer bumps to enhance adhesion of the bumps with the conductive adhesive and electrical conduction between the circuitry of the first substrate and the circuitry of the second substrate. In one implementation, ultraviolet radiation of at least 340 nm is impinged onto conductive polymer bumps prior to subsequent bonding. In one implementation, ultraviolet radiation is impinged onto conductive polymer bumps for a time period less than one minute prior to subsequent bonding.

Abstract: In the method of bonding two parts (1,2) together a positioning device (3) accurately positions the two parts (1,2) relative to each other and a comparatively slower hardening adhesive layer (4) is applied between the two parts (1,2) to bond the two parts (1,2) together. After the adhesive layer (4) is applied and the parts positioned, a faster hardening UV adhesive (5) is applied on adjacent edge regions of the two parts (1,2) over an edge of the slower hardening adhesive layer (4), so that the faster hardening UV adhesive (5) is accessible for UV irradiation. Subsequently the faster hardening UV adhesive (5) is hardened with the UV radiation and the positioning device (3) is removed from the parts (1,2) which are held fixed in a provisional manner. Then the slower hardening adhesive layer (4) is hardened preferably in an oven that can be used for a large number of similar pairs of parts.

Abstract: A method and means for bonding an object to a surface use emitted light from a chemiluminescent source to cure a photo-curable adhesive. This non-electrical source of light cures different photo-curable adhesives which can be tuned to different wavelengths of light emitted by different chemiluminescent sources. The curing is relatively quick and requires no electrical lighting in a wide range of environmental conditions, including under water and in air, with little or no ancillary support. An inexpensive and expendable photo-curable adhesive system is provided which is greatly simplified as compared to electrically powered curing systems.

Abstract: A method is provided for fusion-splicing with a laser beam at least two optical components to a different optical component, the different optical component (e.g., an optical element such as a lens) having a surface that has a comparatively larger cross-sectional area than a surface of the other optical components (e.g., at least two optical fibers).

Abstract: A method and apparatus for applying an extrudable material to a substrate, in which a concentrated light beam is directed onto the substrate before or after the application of the extrudable material. The energy of the beam is concentrated on the substrate surface, wherein it is subsequently transferred to the extrudable material deposited on its surface, thereby increasing the temperature and lowering the viscosity of the closely situated material so as to facilitate material penetration into the substrate. This method allows the use of illumination of modest energy density, of wavelengths absorbed by the extrudable material, or of such cross-sectional extent that it may not be transmitted through the extrusion device by which the extrudable material is deposited.

Abstract: A radiation curable precursor coating composition for the preparation of a non-blocking, heat activatable adhesive includes a curable acrylic material, a curable elastomeric material, and a hydrocarbon tackifier material having a softening temperature ranging from approximately 50° C. to approximately 200° C., wherein when the acrylic material and the elastomeric material are cured, the coating composition is non-blocking at room temperature, but when the coating composition is heated to a temperature above both the softening temperature of the hydrocarbon tackifier and the Tg of the coating composition, the coating composition becomes adhesive.

Abstract: A method of preparing a vehicle panel assembly for attaching the panel to a vehicle is disclosed which provides a “ready-to-install” panel assembly. The panel assembly includes first and second spaced sides, with the bead of heat activated adhesive provided on the second side of the panel. The panel and bead are heated preferably by applying shortwave and longwave infrared radiation, with the shortwave infrared radiation being applied to an adhesive free side of the panel to heat the panel and, thereby, indirectly heat the bead of the heat activated adhesive. The longwave infrared radiation is applied to the adhesive side of the panel to directly heat the bead and thereby activate the adhesive. The ready-to-install adhesive may be applied on or adjacent to a gasket, such as a polyvinyl chloride (PVC) molding, a urethane molding, or the like.

Abstract: A rapid and precise cementing of components to a surface is achieved using a specially modified cement on an epoxy base in that the parts to be cemented are precisely aligned at the cemented location, are fixed with UV light and are subsequently thermally hardened.

Abstract: There are described novel adhesives, which are capable of being “switched” form a tack to a non-tacky state. Such switchable adhesives are especially advantageous when used in medical dressings, and therefore, novel medical dressings comprising a switchable adhesive layer, a removable light occlusive layer and an intermediate transparent or translucent layer are also described.

Abstract: This invention relates to pressure sensitive adhesives, and processes of preparing such adhesives, comprising random star polymers which are crosslinked by reaction with multifunctional crosslinking agent. These adhesives can be used in coated articles.

Abstract: A panel which comprises a substrate of transparent or translucent material having applied to one or both sides a design superimposed on, or forming part of, an opaque pattern so that the design on one side of the panel cannot be seen from the other side. This is a Reissue of a Patent which was the subject of a Reexamination Certificate No. B1 4,673,609, dated Jul. 25, 1995, Request No. 90/003,201, Sep. 21, 1993.