Abstract: A three-dimensional object is manufactured by filling and hardening a powder material around a core. A powder material is first filled and layered around the core, and a beam is then selectively irradiated on the layer of powder material to form a hardened layer united with the core. These steps are repeated to form a plurality of hardened layers around the core, thereby manufacturing the three-dimensional object having the core embedded therein.

Abstract: An object of the present invention is to completely cure a resin composition highly capable of screening energy radiation, such as a carbon fiber-reinforced composite material (CFRP), simply by exposing the resin composition to UV radiation in the presence of a specific photopolymerization initiator system (reaction catalyst system) comprising at least two components. To this end, the present invention provides a resin curing method wherein, when a resin composition is exposed to energy radiation typified by UV radiation, another kind of first energy than the energy from an energy radiation source is autogenously generated within the resin, and the same kind of second energy is successively generated by the autogenously generated energy, so that the resin composition is cured by means of the first and second energies, or both the first and second energies and the energy from the energy radiation source, whether or not the resin composition contains a substance capable of screening energy radiation.

Abstract: Reinforcing sheets that exhibit improved adhesion to cold and/or oily substrates have an adhesive layer that contains an epoxy-terminated adduct of an epoxy resin and a rubber that contains a low amount of a nitrile monomer.

Abstract: Thin film-like material that has printability, that can have unique surface patterns of various kinds, and that can have a design having an effect that has been never produced, and process of producing it are provided. The thin film-like material has a laminated structure in which an adhesive layer and a metal thin layer are laid in this order on the entire surface or parts of the surface of one or each of opposite sides of a base material A surface of the metal thin layer is formed by transfer process as a smooth surface having a mirror pattern, a surface having a mat pattern, a surface having a hairline pattern, a surface having an embossed pattern, a surface having a hologram pattern or a surface having two or more of those patterns combined appropriately.

Abstract: To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.

Abstract: A mounting method of a semiconductor element capable of joining an electrode of a semiconductor element and a circuit board at high reliability. The method includes a step of forming an external electrode terminal by filling a hole formed in circuit board with a conductive paste, a step of positioning the external electrode terminal and a protruding bump formed on an electrode of a semiconductor, and a step of pressing the semiconductor element to contact between the conductive paste in the hole and the protruding bump thereby electrically connecting the electrode of the semiconductor element and the external electrode terminal of the circuit board. An adhesive sheet of a thermosetting resin, a thermoplastic resin, or a mixed thermosetting and thermoplastic resin may be disposed on the circuit board where the bump breaks through the sheet to contact the paste.

Abstract: A method of sealing body parts such as an edge fold of a motor vehicle component, for example a door, a rear or front flap or a sliding roof panel, includes a two-step pre-cross-linking of the sealing composition in the rough body part. In a first step the surface of a UV-active sealing composition is pre-cross-linked by UV irradiation, and in a second step immediately following, the edge fold adhesive and the sealing composition are hardened by thermal action. The edge-sealed body parts produced by the method are transportable and are of visually and functionally satisfactory quality after passing through cleaning baths and after thermal hardening in a KTL kiln. Since the sealing is carried out in the rough body part rather than during the coating process, the method provides a substantial potential cost saving.

Abstract: An electronic device, such as an integrated circuit, hybrid circuit or a transistor, is enclosed within an electronic package or module so as to be protected from contaminants and the external environment. An electronic device is enclosed within a package or module having a lid or cover that is sealed with an adhesive preform that has been pre-applied onto the bonding areas of the lid. The adhesive preforms are formed of a wet adhesive with gaps and are B-staged or dried to form dry solid adhesive preforms through chemical cross-linking or solvent removal. Both the lids and the adhesive preforms are formed of electrically insulating or of electrically conductive materials. The lids and adhesive preforms are attached to the electronic package or module by bonding the adhesive preforms at temperatures that are substantially lower than those at which the soldering of conventional lids is typically performed, and the adhesive flows to close the gaps.

Abstract: A method for grounding reinforcement (12) and composites (17) on a calender line reduces static build up on the composite (17), and makes it possible to subject a wire reinforced composite to electron beam processing (EBP). The method employs a slip ring (36) attached to rolls which contact composite (17) on the calender (11), and reinforcement (12) before it reaches the calender (11), wherein the slip ring (36) rotates with the rolls while the rolls are working polymer into the reinforcement, and a terminal (34) connected to the slip ring (36) remains stationary, and the terminal (34) is attached to ground (27). The method effectively grounds the composite as well as the reinforcement to prevent electrical discharge during EBP.

Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.

Abstract: A method for manufacturing an optical fiber array by connecting bare fibers to connection elements in a facing arrangement, comprising a step of aligning a plurality of bare fibers using a bare-fiber guide; a step of bringing a flat member into contact with the aligned bare fibers, tacking the bare fibers onto the flat member by direct or indirect bonding means while keeping the bare fibers sandwiched between the bare-fiber guide and the flat member, and separating the bare fibers and the bare-fiber guide thereafter; and a step of forming a coating of uncured material on the external peripheral surfaces of the tacked bare fibers and on the flat member exposed between the bare fibers, curing this material, and bonding the bare fibers to the flat member. This method dispenses with the need to provide a bare fiber guide member and allows manufacturing costs to be reduced.

Abstract: The invention provides an adhesive formulation for tacking and holding a nozzle plate in alignment on a semiconductor chip for an ink jet pen of an ink jet printer. The adhesive formulation includes a multifunctional epoxy material, a difunctional epoxy material, a fumed silica viscosity control agent, an imidazole-based thermal initiator and a mixed aryl sulfonium salt photoinitiator. Use of the adhesive formulation enables a nozzle plate to be assembled to a semiconductor chip with while substantially maintaining critical alignment between the nozzle plate and semiconductor chip.

Abstract: A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction.

Abstract: A method of bonding a component to glass comprising disposing a pressure-sensitive adhesive sheet material between said component and said glass so that said adhesive sheet material is adhered to said component and said glass, wherein said adhesive sheet material comprises the photopolymerization reaction product of starting materials comprising: (a) a monomeric mixture or partially prepolymerized syrup comprising at least one acrylic acid ester of an alkyl alcohol and at least one copolymerizable monomer; (b) an epoxy resin or a mixture of epoxy resins, (c) a heat-activatable hardener for the epoxy resin or mixture of epoxy resins, (d) a photoinitiator, and (e) a pigment.

Abstract: A method for aligning a lenticular sheet, in accordance with the present invention, includes applying curable adhesive to a surface and placing a lenticular sheet over the curable adhesive on the surface. The adhesive is cured at a first end portion of the lenticular sheet such that the first end portion is aligned with a first reference position. A temperature of the lenticular sheet is adjusted to align a second end portion of the lenticular sheet with a second reference position. Remaining portions of adhesive are cured to secure the lenticular sheet.

Abstract: Disclosed is a process for bonding a first article to a second article which comprises (a) providing a first article comprising a polymer having photosensitivity-imparting substituents; (b) providing a second article comprising metal, plasma nitride, silicon, or glass; (c) applying to at least one of the first article and the second article an adhesion promoter selected from silanes, titanates, or zirconates having (i) alkoxy, aryloxy, or arylalkyloxy functional groups and (ii) functional groups including at least one photosensitive aliphatic >C═C< linkage; (d) placing the first article in contact with the second article; and (e) exposing the first article, second article, and adhesion promoter to radiation, thereby bonding the first article to the second article with the adhesion promote. In one embodiment of the present invention, the adhesion promoter is employed in microelectrical mechanical systems such as thermal ink jet printheads.

Abstract: A method is disclosed for establishing heat treatment of a weld or glue connection between two mutually adjacent surfaces of components, for instance tubes, using respectively an adhesive material, for instance plastic, more particularly epoxy resin. Heat is supplied around or close to the weld surfaces for connecting. In order to measure the correct quantity of supplied heat and prior to the heat supply, a test loop (10) is arranged around the weld. The loop is provided with a temperature-sensitive interrupter (13) and an electric fuse (14) connected in parallel thereto. A predetermined time after the interrupter has responded as a result of the correct temperature being reached, a current surge is passed through the safety fuse in the loop, so that it is possible to determine precisely whether the welding has been carried out for a sufficiently long time and with sufficient heat.

Abstract: Methods are provided for the fabrication of polymeric microchannel structures having enclosed microchannels of capillary dimension. The microchannel structures are constructed of a base plate and a cover, sealed together. Microchannel structures having walls of a plastic material are formed in a generally planar surface of at least the base plate. The cover has at least one generally planar surface, and the microchannel structures are enclosed by bonding the planar surfaces of the cover and the base plate together. In some embodiments the surfaces of the cover and base plate are both of plastic material, and are directly thermally bonded. In some embodiments a bonding material is applied to one of the surface prior to bringing the surfaces together. Suitable bonding materials are disclosed.