Abstract: A strong silicide joint between silicon carbide and a metal is resistant to fracture even at high temperature. A method for manufacturing the silicide joint is also provided. This method includes the steps of: bringing a silicon carbide-based member into contact with a Kovar (Fe—Ni—Co alloy) member; and thermally joining the silicon carbide-based member to the Kovar member.

Abstract: A fusion-bonded body which includes a fusion-bonded part obtained by fusion-bonding to each other a first part to be fusion-bonded which comprises a first thermoplastic resin and first carbon fibers and a second part to be fusion-bonded which comprises a second thermoplastic resin and second carbon fibers. Also provided is a method for producing the fusion-bonded body which comprises a fusion-bonding step in which the first part to be fusion-bonded is brought into close contact with the second part to be fusion-bonded, an electric current is caused to flow through the two parts to generate heat and melt the first thermoplastic resin and second thermoplastic resin, and the molten resins are solidified to form a fusion-bonded part.

Abstract: A fusible completion plug and method for its use includes a cylindrical plug body having a lower portion that includes a fusible element in communication with an electric power supply. The completion plug also includes an elastomeric seal that provides for a temporary seal. A pressure balancing port and equalization valve are provided to relieve the differential pressure across the completion plug as the plug is positioned in place. The pressure equalization valve also includes a fusible element for fusing the valve within the port, thereby preventing a leak path through the plug body. A blind flange may be installed above the completion plug in case the plug fusion fails. The blind flange may be a traditional blind flange or may be a fusible blind flange.

Abstract: A metal-resistant radio frequency tag that has a broader band pass band (frequency versus communication range) characteristic compared to conventional techniques is achieved. For this purpose, the radio frequency tag according to the present invention includes a first resonator pattern, the first resonator pattern including a chip connecting section to which a chip is to be connected, and an inductance section that is capable of adjusting an impedance matching with the chip; and a second resonator pattern that is fed through electromagnetic induction coupling via the inductance section.

Abstract: A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating.

Abstract: A method of fusing thermoplastics components (12, 14) together comprises positioning an electrically conductive member (20) between opposing surfaces (16, 18) of two thermoplastic components to be fused together. The electrically conductive member comprises one or more perforations or spaces between solid material of the member. An electric current is caused to flow in the member so as to heat the member and melt at least some plastics material adjacent the opposing surfaces. The melted plastics material penetrates the perforations or spaces in the electrically conductive member, whereby melted plastics material from each component mixes so as to fuse the components.

Abstract: The invention relates to a method for the manufacture of a sensor element and to a sensor element. In the method, both surfaces of a sensor film are provided with metallic electrodes. The sensor element is produced by cutting it from a larger amount of sensor element material. In the manufacture of the sensor element material, the electrodes are produced as a continuous process from roll to roll and the sensor element material is formed by laminating as a continuous process from roll to roll. At least the signal electrode consists of repeated electrode patterns (41) which are at least partially connected to each other via one or more narrow connecting strips (42), and a sensor element of a desired length and/or shape is produced by cutting the material across the region of the connecting strips.

Abstract: A stable and high quality circuit forming substrate is provided even when the work size is increased in the circuit forming substrate. In a stacking step, prepregs that are B stage substrate materials, are arranged lined with respect to a first metal foil, and stacked on the first metal foil. A C stage substrate material is stacked on the B stage substrate materials. Further, the prepregs that are two or more B stage substrate materials, are stacked on the C stage substrate material and a second metal foil is stacked thereon.

Abstract: A flexible electro-optic display comprises a layer of solid electro-optic material; a backplane comprising at least one electrode arranged to apply an electric field to the layer of electro-optic material; and an adhesive layer disposed between the layer of electro-optic material and the backplane and adhesively securing the layer of electro-optic material to the backplane, the adhesive layer having a storage modulus (G?) of at least about 104 Pascals at 10?3 Hz and 70° C.

Abstract: A technique for bonding a glass plate to an insulating material or a nonoxidized semiconductor substrate such as SiC without a bonding agent is provided. A metallized layer is formed on the insulating material or the nonoxidized semiconductor substrate such as SiC serving as a first substrate, and the metallized layer of the first substrate is bonded to a second glass substrate, which serves as a second substrate and contains ions capable of being diffused by a voltage, by anodic bonding.

Abstract: A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.

Abstract: A contact for an electrical test comprises a first area to be bonded to a board, a second area extending in the right-left direction from the lower end portion of the first area, a third area projecting downward from the tip end portion of the second area, and a low light reflective film having lower light reflectance than that of the first area. The third area has a probe tip to be contacted an electrode of an electronic device. The low light reflective film is formed on a surface of at least the bonding part of the first area to the board and its proximity.

Abstract: An airtight container manufacturing method capable of effectively utilizing an energy beam and improving a “takt time” as acquiring desired bonding intensity is provided. That is, a first bonding material is arranged between a first plate structure and a frame, a second bonding material is arranged between a second plate structure and the frame. The energy beam is irradiated to the first bonding material through the first plate structure to bond the first plate structure and the frame. The energy beam is irradiated to the second bonding material through the frame so that the beam transmits through the first plate structure and the surface of the frame on the side of the first plate structure, to bond the second plate structure and the frame. Such bonding processes are performed after an arrangement step.

Abstract: An anisotropic conductive film is provided which can provide high bonding strength and good conduction reliability when anisotropic conductive bonding is made under the compression bonding conditions of a compression bonding temperature of at most 130° C. for a compression bonding time of at most 3 seconds. The anisotropic conductive film contains a polymerizable acrylic compound, a film-forming rein, conductive particles, and a polymerization initiator. The polymerization initiator contains two types of organic peroxides that do not produce oxygen gas resulting from the decomposition thereof and have different one-minute half-life temperatures. Of the two types of organic peroxides, one organic peroxide that has a higher one-minute half-life temperature produces benzoic acid or a derivative thereof when it decomposes.

Abstract: Electrically conductive workpieces with facing surfaces are bonded with an adhesive that is filled with conductive metal particles that are reactive with the surfaces of the workpieces. In the bonding process the surfaces are coated with the adhesive, pressed together and an electric current passed between them to momentarily melt the conductive particles. The molten droplets agglomerate and wet the facing surfaces. When the molten clusters re-solidify, electrically conductive paths are formed between the workpieces. For example, the practice is useful for bonding ferrous-based or aluminum-based alloy sheets, strips or plates in making products such as bipolar plates for fuel cells.

Abstract: Resin-impregnated carbon fiber composites containing metal inserts. Carbon fibers or a carbon fiber preform are bonded to a metal structural member. Once the carbon fiber-metal bond is established, the fiber-metal assembly or hybrid preform is impregnated with resin, to form an article in which bonding between the metal structural member and the composite remainder of the article is greatly enhanced. In a process embodiment, a metal insert, e.g. a steel insert, is provided in contact with particulate carbide-forming metal, e.g. titanium, and with carbon fiber segments. Then an electric current is passed through the carbide-forming metal particles and carbon fibers to heat them to a temperature above the melting point of the carbide-forming metal. This initiates an exothermic reaction, which forms liquid phase metal carbide. Subsequently the liquid phase metal carbide is cooled and solidified, thereby bonding the carbon fiber segments to the metal insert.

Abstract: A method of forming an exterior surface protective structure (12) for an aircraft (10) includes uniting a loaded surfacer (52) having a carrier (51) to a hybrid prepreg substrate (32). The prepreg substrate (32) includes a carbon fabric (44) with an integral conductive component (48) having conductivity with in a metal conductivity range and is united to a base substrate (30). The loaded surfacer (52) and the prepreg substrate (32) are cured, which includes interfacially adhering matter between the loaded surfacer (52) and the prepreg substrate (32). A protective fabric system (12) for an exterior (14) of an aircraft (10) includes the base substrate (30). The hybrid prepreg substrate (32) is coupled to the base substrate (30). The loaded surfacer (52) with the carrier (51) is interfacially adhered to the prepreg substrate (32).

Abstract: A fastening device for fastening a small component, in particular a stud provided with an adhesive flange, to a mounting surface using a heat-activated adhesive that creates an adhesive bond between the component and the mounting surface, has an induction coil to heat the component and/or the adhesive and a holding mechanism which holds the component while the fastening device moves to the bonding position. On the side facing the mounting surface is a bearing surface for the component toward which the component can be brought from outside. The holding device can be advanced to the component by the induction coil and has an electromagnet for generating a holding force that is directed toward the bearing surface.

Abstract: When resin members (3, 4) are fusion-bonded to each other by electric-conduction heating, a net-form or pattern-form metal wire (2) as a resistance heating element is disposed at a joint portion of the resin members (3, 4), and a metal wire (2) is heated by electric conduction for fusion-bonding the abutting resin members (3, 4) at temperatures sufficient for fusion-bonding with the resin members kept abutting against each other. A production method for a resin-processed product that can increase the strength of the joint portions between resin members, is free from carbon generation and short-circuiting during the electric conduction of a built-in resistance heating element (heating element), and is simple to produce while hardly being affected by environmental temperatures.

Abstract: Method of joining carbon-carbon composite pieces together, e.g. in the refurbishment of aircraft brake discs.

Abstract: A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed over the first conductive layer. A second conductive layer is formed over the lower surface of the second ceramic component. The second ceramic component is stacked over the first ceramic component wherein the second conductive layer on the second ceramic component opposes the intermediate film on the first component. The first and second ceramic components are anodically bonded together.

Abstract: A process by which high frequency printed wiring board construction can be fabricated using smooth copper surfaces. A conductive, thin film polymer is plated on smooth copper surfaces of a core lamination. The polymer can be selected from a group of materials consisting of polypyrrole, polyaniline, polythiophene, and combinations thereof. The conductive polymer promotes adhesion between the resin polymer of the laminate and the smooth copper surfaces.

Abstract: A method is described for splicing together overlapping ends of first and second lengths of photographic film strips of common film strip width, comprising positioning a bonding element between an overlapping end of the first length of photographic film and a corresponding overlapped end of the second length of photographic film, and heating the bonding element to effect an adhesive bond between such film ends, wherein the bonding element comprises an induction heating receptive support and thermoplastic adhesive layers on each side of the support, and wherein the heating of the bonding element is performed by induction heating. The present invention allows for the preparation of photographic film splices, consisting of either homogeneous or dissimilar film bases, using a bonding element and induction heating to provide smooth yet strong splices. In particular, the invention enables successful splicing of acetate support (e.g., cellulose triacetate (CTA)) based films and polyester support (e.g.

Abstract: A macroencapsulation container having in combination an inner container member with an inner lid member and an inner body member, and an outer container member with an outer lid member and an outer body member, the inner container member being composed of a thermoplastic polymer material that can be thermo-welded or thermo-bonded to itself by melting. The outer container is composed of a metal. At least one electric resistance wire is embedded in or mounted onto the inner lid member along the area of contact with the inner body member, such that the inner lid member may be thermo-bonded to the inner body member to create an integral, one-piece inner container member encapsulating any material or containers disposed within.

Abstract: A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

Abstract: This invention relates to a method of fabricating a bonded product comprising at least two components that are bonded together, the method comprising the steps of: a) bringing the components together; and b) heating the components; wherein at least one of the components comprises a nanomaterial and wherein steps (a) and (b) are performed in such a manner that the components are bonded together by heating at least part of the nanomaterial. The method allows the components to be welded together at lower temperatures than for prior art methods. The method also provides a more reliable form of bonding and improves the strength of the bond formed.

Abstract: A controller is used with an anodic bonding system that has a charge flowpath for supplying charge to bond materials together. The controller includes a switch and a circuit. The switch is configured to control a flow of the charge through the charge flowpath. The circuit is configured to monitor a rate of the flow, use the rate to determine an amount of the charge supplied for bonding, and based on the amount or rate, operate the switch to control the flow.

Abstract: The piezo-composite curved actuator of the present invention comprises a piezoelectric layer (10), a lightweight fiber-reinforced lower composite layer (20) with a high CTE (coefficient of thermal expansion) and a low modulus, which is placed under the piezoelectric layer, a lightweight fiber-reinforced upper composite layer (30) with a low CTE and a high modulus, which is placed on the piezoelectric layer, and an insulator layer (23) placed between the piezoelectric layer and the upper composite layer. The piezo-composite curved actuator may further comprise an insulator layer (24) placed on the upper composite layer. Also, the piezo-composite curved actuator may further comprise insulator layers (22) placed between the insulator layer (23) and the lower composite layer (20) at the both sides of the piezoelectric layer (10).

Abstract: A method is provided for accelerating the curing of an adhesive at a bondline while bonding structures using a fabric heater. The method comprises applying an electrically conductive fabric heater between structures to be bonded to which a layer of adhesives is applied to the bonding surfaces of the structures. Once the adhesive layers and fabric heater are applied to the bondline, pressure is applied and the heater is energized to produce heat uniformly throughout the bondline at the curing temperature of the adhesive so that the adhesive is evenly or symmetrically cured. After curing the adhesive, the heater remains sandwiched at the bondline to act as a reinforcing fabric.

Abstract: A resin composition for high-frequency bonding with a dielectric loss tangent of 0.03 or higher at a frequency of 40 MHz, containing a thermoplastic resin having a melting point of 80° C. to 200° C. in an amount of 70% to 99% by volume, based on the total volume of the composition, and a conductive material having a volume resistivity of 10−2 &OHgr;.cm or lower in an amount of 30% to 1% by volume, based on the total volume of the composition.

Abstract: A method of making a single crystal GaN boule, comprising contacting a GaN seed wafer with a GaN source environment under process conditions including a thermal gradient in the GaN source environment producing growth of gallium nitride on the GaN seed wafer, thereby forming the GaN boule. The GaN source environment in various implementations includes gallium melt in an ambient atmosphere of nitrogen or ammonia, or alternatively, supercritical ammonia containing solubilized GaN. The method produces single crystal GaN boules >10 millimeters in diameter, of device quality suitable for production of GaN wafers useful in the fabrication of microelectronic, optoelectronic and microelectromechanical devices and device precursor structures therefor.

Abstract: An ultra-thin flexible expanded graphite heating high resistance element is produced by a method including the steps of providing a flexible expanded graphite sheet having a surface adhered to a substrate; pulling apart the sheet and the substrate with a force sufficient to separate the adhered flexible expanded graphite sheet into a removed layer and a remainder layer adhered to the substrate; and optionally repeating the foregoing steps until the remainder layer has a thickness of about 0.01 mils to about 2 mils. A resistance heater for high voltage applications is also provided.

Abstract: A method for fastening a flat strip lamella (10) to the surface of a building component (12). According to the inventive method, the face (14) of the flat strip lamella (10) is pressed against the surface of the building using an adhesive coating (16) consisting of a reaction resin applied in a paste-like consistency (16) and hardened to form an adhesive joint. The flat strip lamella (10) comprises a plurality of carbon fibers which are embedded in a binder matrix (28) and placed parallel to each other in a longitudinal direction. In order to increase the speed at which the adhesive coating hardens, the invention provides that an electrical current flows through least one part of the carbon fibers (26), heating the flat strip lamella (10) which in turn heats the adhesive coating (16).

Abstract: Methods and systems for selectively connecting and disconnecting conductors in a fabric are disclosed. First and second conductors are integrated into a fabric such that the conductors intersect at a crossover point. The conductors are bonded to each other at the crossover point to improve AC and DC characteristics. Disconnect areas may be provided near the crossover point to allow selective disconnection of the conductors from the crossover point.

Abstract: An electron-emitting device comprises an electroconductive film including an electron-emitting region and a pair of electrodes for applying a voltage to the electroconductive film. The electron-emitting region is formed by applying a film of organic substance to the electroconductive film, carbonizing the organic substance by electrically energizing the electroconductive film, and forming a fissure or fissures in the electroconductive film prior to the carbonization. The electron-emitting device constitutes an electron source having a plurality of electron-emitting devices, and further an image-forming device comprising an electron source and an image-forming member arranged in an envelope.

Abstract: Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure. Plasma may be used to treat a surface of the release layer or the dielectric film to produce a plasma-treated surface to lower the peel strength of any film or layer bound to the plasma-treated surface.

Abstract: A satisfactory bonding is implemented at low cost. In a step, a resin layer is formed on a bonding surface side of a silicon wafer on which portion are formed electro-thermal transducers. In a later step, the silicon wafer and another silicon wafer are aligned and fixed temporarily, then the atmosphere is set at a pressure of 10−3 mbar or lower and the temperature is set at 300° C. or higher, and voltage is applied across the both wafers while pressure is applied to the wafers. When the value of an electric current flowing across the wafers has reached a level of a certain current value or lower, the application of the voltage is stopped and the atmosphere is opened to the atmospheric pressure while reducing the temperature.

Abstract: Disclosed is a process of forming a prepreg material having substantially no voids. According to the process of the invention, the reinforcing material is heated to a temperature above the temperature of the impregnating resin. The prepreg formed has substantially no voids and does not require lengthy consolidation when formed into useful articles.

Abstract: We have developed a method of anodic bonding which directs cations to a location within a bonding structure which is away from critical bonding surfaces. This prevents the formation of compounds comprising the cations at the critical bonding surfaces. The anodic bonding electrode contacts are made in a manner which concentrates the cations and compounds thereof in a portion of the bonded structure which can be removed, or cleaned to remove the compounds from the structure. A device formed from the bonded structure contains minimal, if any, of the cation-comprising compounds which weaken bond strength within the structure. In the alternative, the cations and compounds thereof are directed to a portion of the bonding structure which does not affect the function of a device which includes the bonded structure.

Abstract: Provided are a process and an apparatus for producing gypsum boards, both of which feature minimized occurrence of defective products and especially excellent continuous productivity and superb efficiency. Making use of the facts that lining paper sheets for gypsum boards are insulators and a gypsum slurry held between the lining paper sheets is a good electrical conductor, a detection of an electric current flowing between an upper forming unit and a lower forming unit or a like method makes it possible to promptly detect any localized tearing which may occur in the overlay paper and/or underlay paper due to an undesired object or the like mixed in during continuous production of gypsum boards and moreover, to readily remove the undesired object or the like as a cause for the tearing without stopping the production of gypsum boards while preventing the localized tearing from spreading over the entire width of the paper.

Abstract: In a method for making a hybrid leaf spring at least one layer of composite material is provided and a metal primary leaf. The layer of composite material and metal primary leaf are positioned adjacent one another in a mold having an interior cavity defined by at least one cavity wall. A layer of adhesive material is located between and in engagement with the layer of composite material and the metal primary leaf. The adhesive is cured by controllably heating the metal primary leaf so that energy in the form of heat is conducted therefrom into the adhesive layer bonding said metal primary leaf and layer of composite material together.

Abstract: A method of attaching a component onto a microbench includes laying the component in a groove in the substrate, and locally deforming a portion of the groove, to thereby hold the component in the groove. Preferably, the microbench is a silicon substrate used for MEMs-type structures in the fiber optics industry. In particular, the method is used for securing an optical fiber in a groove, DRI etched from a silicon substrate, before or after the fiber is aligned with other optical components, i.e. lenses, lasers etc. The local deformation is done using a laser welding device selected to be effective in locally melting the substrate while leaving the component relatively undamaged.

Abstract: A method of fitting pull-off tabs (2), made of heat-seal material, to strip packaging material (4) having a number of through openings (3) and covered, on the opposite side to that to which the tabs (2) are fitted, with at least a first and a second lamination layer (10, 11, 12, 9) made respectively of heat-seal material and electrically conducting material and covering the openings (3); the method including the step of joining each tab (2) to the packaging material (4) at a respective opening (3) by simultaneously performing hot-plate sealing and induction sealing operations. (FIG.

Abstract: An elongate metal body, for instance an aluminium rod, with a chosen cross-sectional form manufactured by extrusion. It is a first object of the invention to make an elongate metal body stiffer and stronger without this entailing an increase in weight. In respect of this objective the metal body according to the invention has the feature that the body has at least one cavity extending at least to a considerable degree in longitudinal direction, in which cavity is received a pre-manufactured elongate reinforcing rod, of which at least the ends are coupled to the body in force-transmitting manner.

Abstract: Methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer on substrate, and then forming a conductive laminate on the release layer. After the release layer is formed, the conductive laminate can be easily separated by the substrate to eventually form a flexible circuit structure.

Abstract: A method, a system and a product made therefrom including the steps of providing electrically non-conductive pieces or fragments, causing at least a portion of the electrically non-conductive pieces or fragments to become temporarily electrically conductive, combining adhesive which sets when sufficient heat is applied thereto with the temporarily electrically conductive pieces or fragments, and applying voltage across the temporarily electrically conductive pieces or fragments and adhesive combination so as to produce an electric current through the temporarily electrically conductive pieces or fragments which, in turn, generates heat within the temporarily electrically conductive pieces or fragments and adhesive combination.

Abstract: A process for producing a liquid crystal device principally includes the steps of: disposing a pair of substrates each provided with an electrode with a spacing therebetween, and filling a chiral smectic liquid crystal in the spacing between the pair of substrates so as to be supplied with a voltage via the pair of electrodes. The pair of substrates are provided with anti-parallel uniaxial aligning axes so that the liquid crystal is placed in an alignment state exhibiting a pretilt angle of at least 4 degrees at a boundary thereof with at least one of the substrates. The liquid crystal has a phase transition series of Iso-Ch-SmC* or Iso-SmC* on temperature decrease. The process further includes a step of heating the liquid crystal disposed between the substrates to a temperature assuming Iso or Ch and then cooling the liquid crystal to a temperature assuming SmC*; and a step of applying an initial electric field having an effective voltage (Erms.) at a temperature assuming SmC* for at least 1 sec.

Abstract: The invention concerns a process for leak proof connection of branch lines such as house lines (1) to main lines such as rehabilitated sewer pipes (2). A lining hose (4) with a flat textile material such as nonwoven fabric, woven cloth, knit fabric, mesh fabric or laminate, which can be soaked in curable liquid resin, is introduced into the feeder line before or after soaking with a resin and its other, collar-shaped expanded end is bonded in the inside of the main line by means of a ring-formed fitting (5) to form a leak proof seal. The ring-formed fitting (5) consists of thermoplastic (7) on one side and of a flat textile material (8) such as nonwoven fabric, woven cloth, knit fabric, mesh fabric or laminate on the other. The ring-formed fitting (5) is welded with the inner thermoplastic surface (6) of the main line, while the flat textile material (8) of the ring-formed fitting (5) is connected with the collar-shaped, expanded end of the lining hose (4) by gluing.

Abstract: A method of attaching to a rubber molded part a strip having an acrylic polymer adhesive on one side, including the step of applying radio frequency energy to the rubber molded part to generate heat therein and to cause the acrylic polymer adhesive to melt bond to the rubber molded part. The acrylic polymer is an acrylic-silane interpolymer of primarily acrylic ester monomer interacted with an organosilane, which interpolymer has a Tg of −10° to 80° C. The rubber molded part includes radio frequency sensitive material to facilitate bonding to the acrylic polymer adhesive during application of the radio frequency energy thereto. Desirably, the strip also includes a pressure sensitive adhesive on its other side for securing the rubber part to a component of an automobile or other vehicle by applying pressure to the rubber part. The strip may include an acrylic foam core between the acrylic polymer adhesive and the pressure sensitive adhesive.

Abstract: The deposition strength is enhanced in the thermally deposited portion of thermoplastic resin molded product. In addition, in the test for obtaining the deposition strength, the shape and dimensions that can reach the purposed deposition strength is defined. If the annular groove (21) for fixing the heating element (30) is installed to the periphery of the deposited portion of lower case (20) and the annular rib (11) is fitted into the annular groove (21) is installed to the deposited portion of upper case (10) and if the diameter of heating element (30) to be used is considered to be D, then (a) the interval L between both the lateral walls in the annular groove 21 shall be set to 1.3 D L 1.6 D (b) the wall thickness T of annular rib shall be set to 1.1 D T 1.2 D (c) the height A of outside lateral wall in the annular groove shall be set to A 2 D (d) the height B of inside lateral wall in the annular groove shall be set to B 2 D, and (e) the height H of annular rib shall be set to H A.