Subsequent To Bonding Patents (Class 156/280)
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Publication number: 20150062838Abstract: This disclosure is directed to a system for attaching devices to flexible substrates. A device may be coupled to a flexible substrate in a manner that prevents adhesive from contacting conductive ink while the adhesive is harmful. If conductive epoxy is used to anchor conductive pads in the device to the flexible substrate, conductive epoxy may be applied beyond the edge of the device over which conductive ink may be applied to make electrical connections. Holes may also be formed in the flexible substrate allowing conductive epoxy to be exposed on a surface of the flexible substrate opposite to the device location, the conductive ink connections being made on the opposite surface. The conductive ink may also be applied directly to the conductive pads when extended beyond the device's edge. The flexible substrate may be pre-printed with circuit paths, the conductive ink coupling the device to the circuit paths.Type: ApplicationFiled: September 4, 2013Publication date: March 5, 2015Applicant: OSRAM SYLVANIA Inc.Inventors: Richard S. Speer, David Hamby, Adam M. Scotch
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Patent number: 8963019Abstract: A circuit board and a manufacturing method thereof are provided. According to the method, a dielectric layer is formed on a dielectric substrate, and the dielectric layer contains active particles. A surface treatment is performed on a surface of the dielectric first conductive layer is formed on the activated surface of the dielectric layer. A conductive via is formed in the dielectric substrate and the dielectric layer. A patterned mask layer is formed on the first conductive layer, in which the patterned mask layer exposes the conductive via and a part of the first conductive layer. A second conductive layer is formed on the first conductive layer and conductive via exposed by the patterned mask layer. The patterned mask layer and the first conductive layer below the patterned mask layer are removed.Type: GrantFiled: August 9, 2012Date of Patent: February 24, 2015Assignee: Unimicron Technology Corp.Inventors: Cheng-Po Yu, Shang-Feng Huang, Chang-Ming Lee, Young-Sheng Bai
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Publication number: 20150050158Abstract: A blade for a gas turbine engine comprises a blade portion having a first end and a second end and an engagement portion including a first surface coupled to the second end of the blade portion and a second surface coupled to the second end of the blade portion, the first and second surfaces arranged to extend divergently away from one another. The engagement portion is adapted for coupling to a wheel included in a gas turbine engine wheel.Type: ApplicationFiled: December 23, 2013Publication date: February 19, 2015Inventors: David J. Thomas, Richard C. Uskert, Adam L. Chamberlain, Matthew Peter Basiletti
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Publication number: 20150047697Abstract: Flexible transparent conductive films, flexible OPV devices, and semitransparent flexible OPV devices, and methods for the fabrication of flexible transparent conductive films, and the use of those films in fabricating flexible OPV devices, and semitransparent flexible OPV devices are presented. High-throughput and low-cost fabrication options also allow for economical production.Type: ApplicationFiled: June 27, 2014Publication date: February 19, 2015Applicant: NEW ENERGY TECHNOLOGIES, INC.Inventors: John Anthony CONKLIN, Scott Ryan HAMMOND
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Publication number: 20150047085Abstract: A method for fabricating organic photovoltaic-based electricity-generating military pilot equipment, including flight suits, helmets, helmet visors, and related equipment is described. In particular, a method for fabricating such equipment utilizing lamination of highly flexible organic photovoltaic films is described. High-throughput and low-cost fabrication options also allow for economical production.Type: ApplicationFiled: June 27, 2014Publication date: February 19, 2015Applicant: NEW ENERGY TECHNOLOGIES, INC.Inventors: John Anthony CONKLIN, Scott Ryan HAMMOND
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Publication number: 20150040388Abstract: A dielectric layer is directly applied onto the surface of a heat sink part. For example, the composition for making the dielectric layer may be made into a paste or ink and then printed as a paste or ink, or applied with some other equivalent method, such as a lamination technique. The electrical circuit traces are then printed in a similar fashion onto the dielectric layer in the required pattern for whatever circuitry is to be applied. That circuitry (e.g., circuit elements) is then attached to the electrical traces as needed for the particular application.Type: ApplicationFiled: March 20, 2013Publication date: February 12, 2015Applicant: Applied Nanotech Holdings, Inc.Inventors: Nan Jiang, Zvi Yaniv, James P. Novak, Xueping Li
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Publication number: 20150033878Abstract: The invention relates to a method for producing a pressure sensor, comprising the following steps: assembling a support substrate with a deformable membrane on which strain gauges have been deposited, wherein the deformable membrane comprises a thinned area at the centre thereof, the support substrate is disposed on top of the deformable membrane, the support substrate comprises an upper surface and a lower surface in contact with the deformable membrane, and the support substrate also comprises lateral recesses arranged on top of the strain gauges and a central recess arranged on top of the thinned area of the membrane, so as to obtain a micromechanical structure; and, once the assembly has been obtained, depositing, in a single step, at least one conductive material on the upper surface of the support and in the lateral recesses of the support, said conductive material extending into the recesses in order to be in contact with the strain gauges so as to form electrical contacts in contact with the strain gaType: ApplicationFiled: March 6, 2013Publication date: February 5, 2015Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE LABORATOIRE D'ANALYSE ET D'ARCHITInventors: Sebastiano Brida, Jean-Francois Le Neal
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Patent number: 8945332Abstract: A marine grade, exterior composite finish flooring comprised of a plurality of synthetic wood strips, evenly spaced and joined with a silicone adhesive. The fabrication process involves coating a board with a masking agent and then sawing the board into strips so that the masking agent is only on the tops of the strips and not on the edges. Then adhering the strips to a substrate to achieve proper spacing and orientation. A silicone adhesive caulk is then pressed into the joints and allowed to partially cure. The caulk stuck on the surface of the boards is easily removed as a result of the masking agent. Completed panels are then adhered to a subfloor, for example on the deck of a boat for a durable and aesthetically pleasing deck surface.Type: GrantFiled: September 13, 2012Date of Patent: February 3, 2015Inventor: Francisco Bogan
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Publication number: 20150027627Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.Type: ApplicationFiled: October 14, 2014Publication date: January 29, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yang Je LEE, Jae Ho SHIN, Dek Gin YANG
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Publication number: 20150022984Abstract: An embedded printed circuit board and a method of manufacturing the same. The embedded printed circuit board includes: an insulating layer on which a cavity is formed; a chip mounted on the cavity; and a circuit layer formed on the insulating layer, wherein the insulating layer is made of photosensitive compositions including photosensitive monomer and photoinitiator. As a result, the cavity can be formed by selectively using only the insulating layer, thereby making it possible to secure a degree of freedom in the design of the embedded printed circuit board.Type: ApplicationFiled: September 24, 2014Publication date: January 22, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyungmi JUNG, Jaechoon Cho, Choonkeun Lee, Taesung Jeong, Seungeun Lee, Jinsun Park, Yeena Shin
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Publication number: 20150021395Abstract: Present embodiments of the disclosure are directed to a tag, such as an RFID tag, a system including the RFID tag and techniques for installing the RFID tag onto the surface of a tool. The RFID tag is coupled to an outer surface of a tool via an adhesive and/or coating that acts to retain the tag. The RFID tag is coated with a thin protective coating or casing material that may be disposed about a circumference of the RFID tag. The tool upon which the RFID tag is coupled may include oilfield casing, drilling tubulars, production tubing, liners, flow irons, transportation pipeline, and other equipment where tags are advantageously installed onto the surface of materials and still survive severe use environments.Type: ApplicationFiled: October 9, 2014Publication date: January 22, 2015Inventors: Ian Rex Binmore, Cain Perez Pacheco
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Publication number: 20150014672Abstract: A composite substrate includes a moisture-proof substrate, and a resin substrate pasted on a surface of the moisture-proof substrate. The resin substrate is formed to be smaller than the moisture-proof substrate in planar view. An end side of the resin substrate is an inclined face that is inclined inward. In an organic electroluminescence device, an organic light-emitting multilayer provided on a surface of the resin substrate is sealed with a sealing member. A moisture-proof film coats at least part of the surface of the resin substrate in which no lead-out electrode is formed.Type: ApplicationFiled: February 7, 2013Publication date: January 15, 2015Inventors: Kazuyuki Yamae, Shintaro Hayashi, Yuko Suzuka, Yoshiharu Sanagawa, Masuyuki Ota, Hitomichi Takano, Nobuhiro Ie, Yoshikazu Kuzuoka
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Publication number: 20150005602Abstract: The present disclosure provides a method including forming a polymer layer defining a side of an eye-mountable device. The method may also include providing an adhesive in a ring-shaped pattern on a ring-shaped substrate or on the first polymer layer. The method may also include providing the ring-shaped substrate on the first polymer layer in a predetermined rotational orientation. The method may also include applying a force to one or more of the ring-shaped substrate and the polymer layer to adhere the first polymer layer to the ring-shaped substrate. The method may also include curing the ring-shaped substrate and the first polymer layer.Type: ApplicationFiled: June 28, 2013Publication date: January 1, 2015Inventors: Jeffrey George Linhardt, Zenghe Liu
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Publication number: 20140374153Abstract: A PCB includes at least three single layer circuit boards laminated together. The single layer circuit boards include two outer circuit boards and at least one inner circuit board. Each single layer circuit board includes a dielectric layer and a conductive layer on a surface of the dielectric layer. The dielectric layer is selected from a material of thermoplastic resin. Each single layer circuit board defines at least one blind hole passing through the dielectric layer and is ended at the conductive layer. Each blind hole is filled with a filler material electrically connected to the conductive layer. The conductive layer of the at least one inner circuit board forms a first conductive circuit pattern, and the conductive layers of the outer circuit boards each form a second conductive circuit pattern. The second conductive circuit pattern is electrically connected to the first conductive circuit pattern by the filler material.Type: ApplicationFiled: January 8, 2014Publication date: December 25, 2014Applicants: ZHEN DING TECHNOLOGY CO., LTD., FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.Inventors: YU-HSIEN LEE, FU-WEI ZHONG, RUI-WU LIU
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Publication number: 20140367036Abstract: Methods for forming a graft copolymer of a poly(vinylidene fluoride)-based polymer and at least one type of electrically conductive polymer, wherein the electrically conductive polymer is grafted on the poly(vinylidene fluoride)-based polymer are provided. The methods comprise a) irradiating a poly(vinylidene fluoride)-based polymer with a stream of electrically charged particles; b) forming a solution comprising the irradiated poly(vinylidene fluoride)-based polymer, an electrically conductive monomer and an acid in a suitable solvent; and c) adding an oxidant to the solution to form the graft copolymer. Graft copolymers of a poly(vinylidene fluoride)-based polymer and at least one type of electrically conductive polymer, wherein the electrically conductive polymer is grafted on the poly(vinylidene fluoride)-based polymer, nanocomposite materials comprising the graft copolymer, and multilayer capacitors comprising the nanocomposite material are also provided.Type: ApplicationFiled: December 7, 2012Publication date: December 18, 2014Applicant: Nanyang Technological UniversityInventors: Pooi See Lee, Vijay Kumar, Meng-Fang Lin
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Patent number: 8911583Abstract: The present patent application relates to a wafer support arrangement, comprising a wafer (1), a support layer system (5, 6) and a separating layer (4), which is arranged between the support layer system (5, 6) and the wafer (1), wherein the support layer system (5, 6) (i) comprises a support layer (6) and (ii) a layer (5) from a through hardened, partially hardened or hardenable elastomer material on the separating layer side or consists of these two layers and wherein the separating layer (4) (iii) is a plasma polymer layer and (iv) the adhesive bond between the support layer system (5, 6) and the separating layer (4), after the elastomer material has through hardened, is greater than the adhesive bond between the wafer (1) and the separating layer (4).Type: GrantFiled: March 1, 2007Date of Patent: December 16, 2014Assignee: Thin Materials AGInventor: Andreas Jakob
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Publication number: 20140360759Abstract: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and form a distance between adjacent first and third mounting pads which is greater than a distance between adjacent first mounting pads.Type: ApplicationFiled: June 3, 2014Publication date: December 11, 2014Applicant: IBIDEN CO., LTD.Inventors: Masatoshi Kunieda, Makoto Terui, Asuka Il, Yoshinori Shizuno
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Publication number: 20140355112Abstract: A projection screen has a gold coated projection receiving surface that reflects light. The projection screen includes a support structure and an adhesive layer on top of the support structure. A fiber support is adhered to the support structure using the adhesive layer. A chalk and adhesive layer is applied on to the fiber support and a clay and adhesive layer is applied on to chalk and adhesive layer. A gold layer is applied to the clay and adhesive layer. A light or a portion thereof passes through each of the multiple ordered layers, including the gold layer, the clay and adhesive layer, the chalk and adhesive layer and reflects back a lustrous, iridescent image that has motion and depth qualities with transmuted color characteristics.Type: ApplicationFiled: January 10, 2013Publication date: December 4, 2014Inventor: Joseph L. RAMIREZ-DELTON
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Publication number: 20140338832Abstract: A method for producing a silicon foam using dissimilar materials is disclosed. The method includes partially melting one side of a polyurethane foam using a torch to give the one side adhesiveness, attaching a non-woven fabric to the one side of the polyurethane foam having the adhesiveness, pressing a composite foam of the polyurethane foam and the non-woven fabric using a pressure roller to easily bond them, producing a breathable composite foam having dissimilar materials of the polyurethane foam and the non-woven fabric, impregnating the composite foam having the dissimilar materials with a silicon solution, pressing the composite foam using a pressure roller to control an amount of the silicon solution impregnating the composite foam, and hot-air drying the composite foam while the composite foam passes through a dryer.Type: ApplicationFiled: June 9, 2013Publication date: November 20, 2014Inventors: Bo Hwan KIM, II Hwan Kim
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Publication number: 20140336072Abstract: A platform for biological assays includes a base substrate providing structural support to the platform, at least one surface of the base substrate coated with position markers, a first deformable layer positioned on top of the base substrate, and a second deformable layer positioned on top of the first deformable layer, the second deformable layer embedded with deformation markers.Type: ApplicationFiled: November 16, 2012Publication date: November 13, 2014Inventors: Ramaswamy Krishnan, Allen Ehrlicher, James Butler, David A. Weitz, Jeffrey J. Fredberg, Chan Young Park
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Publication number: 20140331793Abstract: A strain sensor provided with a substrate that has flexibility; a carbon nanotube (CNT) film that is provided on the surface of the substrate and that has a plurality of CNT fibers oriented in one direction; and a pair of electrodes that are arranged at both ends in the orientation direction of the CNT fibers in the CNT film; in which the CNT film has a plurality of CNT fiber bundles that consist of the plurality of CNT fibers, and a resin layer that covers the peripheral surface of the plurality of the CNT fiber bundles and joins with the surface of the substrate.Type: ApplicationFiled: May 9, 2014Publication date: November 13, 2014Applicants: Yamaha Corporation, NATIONAL UNIVERSITY CORPORATION SHIZUOKA UNIVERSITYInventors: KATSUNORI SUZUKI, Shingo Sakakibara, Koji Yataka, Yasuro Okumiya, Masahiro Sugiura, Yoku Inoue
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Publication number: 20140335337Abstract: A high strength transparent plastic sheet in accordance with the present invention comprises: a transparent substrate layer; a first and a second adhesive layers respectively formed on both sides of the transparent substrate layer; a first and a second heat-resistant resin layer respectively formed on an outer surface of the first and second coating layer; and a first and a second hard coating layer respectively formed on an outer surface of the first and second resin layer.Type: ApplicationFiled: December 6, 2012Publication date: November 13, 2014Inventors: Eung Kee Lee, Min Hee Lee, Chang Hak Shin, Ku Il Park
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Patent number: 8882954Abstract: The present invention relates to a method of manufacturing a rigid-flexible printed circuit board including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.Type: GrantFiled: February 20, 2013Date of Patent: November 11, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yang Je Lee, Jae Ho Shin, Dek Gin Yang
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Publication number: 20140329064Abstract: The present invention relates to a laminate panel (40; 40?; 40?; 40??) with a carrier layer (41; 41?; 41?; 41??) of wood or wood-based material, in which at least the upper side has a decoration and a layer of a cured resin (46; 46?; 46?; 46??). The rear side of the laminate panel (40; 40?; 40?; 40??) is provided with a paperless counteracting layer of a cured counteracting material (45; 45?; 45?; 45??).Type: ApplicationFiled: October 21, 2011Publication date: November 6, 2014Inventors: Dieter Döhring, Hans Schäfer
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Patent number: 8876998Abstract: Disclosed is a method for manufacturing a flexible device comprising: forming an adhesive layer on a support substrate; adhering a flexible substrate onto the adhesive layer; forming a device layer on the flexible substrate; and separating the support substrate from the flexible substrate, wherein the adhesive layer comprises a self-assembled monolayer (SAM).Type: GrantFiled: June 8, 2011Date of Patent: November 4, 2014Assignee: LG Display Co., Ltd.Inventors: Jong Hyun Park, Chang Dong Kim, Gee Sung Chae, Juhn Suk Yoo, Soo Young Yoon, Soon Wook Cha, Won Bong Jang, Jae Kyung Choi
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Publication number: 20140318689Abstract: A method of making a coated polymer-matrix composite (PMC) having high-temperature oxidation protection includes bonding a first surface of a flexible sublayer that is free of water to a first surface of a dry PMC substrate having a first coefficient of thermal expansion. The flexible sublayer includes an electrically conductive material in an effective amount to enable electrical conductivity of the flexible sublayer, and includes a low-modulus-of-elasticity material. The method includes heating the bonded flexible sublayer and the PMC substrate, and bonding a first surface of an oxygen-impervious, dense barrier-coating layer to a second surface of the flexible sublayer to form the coated PMC having high-temperature oxidation protection.Type: ApplicationFiled: July 7, 2014Publication date: October 30, 2014Inventor: Thomas Karl Tsotsis
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Publication number: 20140318846Abstract: A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening.Type: ApplicationFiled: April 22, 2014Publication date: October 30, 2014Applicant: NGK Spark Plug Co., Ltd.Inventors: Takahiro HAYASHI, Makoto WAKAZONO, Takeshi TOYOSHIMA, Makoto NAGAI, Makoto ORIGUCHI
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Publication number: 20140322523Abstract: An example provides an apparatus including a substrate, a metal layer, and an adhesive layer adhered between the substrate and the metal layer, the adhesive layer comprising indium oxide, tin oxide, gallium oxide, indium-tin oxide, indium-gallium oxide, tin-gallium oxide, or indium-tin-gallium oxide.Type: ApplicationFiled: April 30, 2013Publication date: October 30, 2014Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LPInventors: James Elmer Abbott, JR., Peter Mardilovich, Randy Hoffman
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Publication number: 20140319972Abstract: An example provides an apparatus including a substrate, a metal layer, and an adhesive layer adhered between the substrate and the metal layer, the adhesive layer comprising zinc-gallium oxide, zinc-indium oxide, zinc-gallium-tin oxide, or zinc-indium-tin oxide.Type: ApplicationFiled: April 30, 2013Publication date: October 30, 2014Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LPInventor: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP
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Publication number: 20140323314Abstract: An oxide superconductor wire includes: a tape-shaped oxide superconductor laminate that is formed by providing an intermediate layer on a front surface side of a metal tape-shaped substrate, providing an oxide superconductor layer on the intermediate layer, and providing a protective layer on the oxide superconductor layer; and a coating member that includes a metal tape and a low melting point metal layer, in which the metal tape has a wider width than that of the oxide superconductor laminate and covers the protective layer surface of the oxide superconductor laminate, both side surfaces of the oxide superconductor laminate, and both end portions of a substrate back surface side in a width direction thereof, and both end portions of the metal tape in a width direction thereof are provided to cover both the end portions of the substrate back surface.Type: ApplicationFiled: May 19, 2014Publication date: October 30, 2014Applicant: FUJIKURA LTD.Inventor: Tetsuo TAKEMOTO
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Publication number: 20140313436Abstract: A touch-sensing liquid crystal panel and a fabrication method thereof are provided. The touch-sensing liquid crystal panel includes a color filter substrate, a transistor substrate, and a sensing matrix. In the fabrication method, at first, a first glass substrate is provided. Then, color filters and a common electrode are disposed on a first surface of the first glass substrate to form a color filter substrate. Thereafter, a transistor substrate is combined with the color filter substrate. Then, the glass substrates of the color filter substrate and the transistor substrate are slimed. Thereafter, a sensing layer is formed on a second surface of the first glass substrate, wherein the second surface is opposite to the first surface. Then, the sensing layer is baked to enable a sheet resistance of the sensing matrix to be equal to or less than 30 ohm/square. Thereafter, the sensing layer is patterned.Type: ApplicationFiled: January 15, 2014Publication date: October 23, 2014Applicant: HannStar Display CorporationInventors: Hsu-Ho WU, Ping-Yuan SU, Yu-Cheng LIN, Hsing-Ying LEE, Kun-Hua TSAI
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Patent number: 8864926Abstract: An impact resistant door skin, a door including the same, and a method of manufacturing an impact resistant door skin from a pre-formed door skin are provided. The method includes the steps of providing at least one preformed door skin and applying adhesive to a rear side of the at least one preformed door skin. A fiberglass mesh mat is pressed onto the rear side of the at least one preformed door skin. Then, chopped glass fibers coated with adhesive are sprayed onto the rear side of the at least one preformed door skin using a chopper gun to form a layer of chopped glass fibers on the fiberglass mesh mat. The performed door skin may be a molded door skin having at least one recessed panel formed therein.Type: GrantFiled: August 31, 2012Date of Patent: October 21, 2014Assignee: Masonite CorporationInventors: James Pfau, Stephen Hart, James Bryant
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Patent number: 8852705Abstract: Packaging produced from a thermoplastic film of which the ends are placed so that they abut, said film being composed of several layers, including at least a first weldable layer and a second layer of which the butt-welding is only partial or non-existent, and at least one thin strip covering said ends and being directly attached to one of the faces of the second layer, the difference in the melting point between the first layer and the other layer or layers being greater than 20° C.Type: GrantFiled: April 6, 2007Date of Patent: October 7, 2014Assignee: Aisapack Holding S.A.Inventors: Jacques Thomasset, Stéphane Mathieu
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Patent number: 8852295Abstract: A secondary battery includes: an electric cell layer including a stack structure sequentially including: a positive electrode layer, a separator layer, and a negative electrode layer having an electrolyte higher in conductivity than an electrolyte of at least one of the separator layer and the positive electrode layer.Type: GrantFiled: May 10, 2013Date of Patent: October 7, 2014Assignee: Nissan Motor Co., Ltd.Inventors: Yasunari Hisamitsu, Hideaki Horie, Taketo Kaneko, Osamu Shimamura
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Publication number: 20140292147Abstract: An ultrasonic probe including an acoustic module including a transducer layer to generate an ultrasonic wave, a matching layer to reduce an acoustic impedance difference between the transducer layer and a subject, and a backing layer to absorb a ultrasonic wave generated from the transducer layer and proceeding toward a rear, and a plurality of lens layers configured to focus a ultrasonic wave proceeding toward a front of the transducer layer, and each including a different physical property, so that the reception of the ultrasonic wave signal is improved while maintaining wear resistance characteristic and chemical resistance characteristic, as well as the stability with respect to withstanding voltage.Type: ApplicationFiled: February 10, 2014Publication date: October 2, 2014Applicant: SAMSUNG MEDISON CO., LTD.Inventor: Soo Jin KIM
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Publication number: 20140295190Abstract: A backer sheet comprising a natural fiber and impregnated with a water-based acrylate resin is thermofused with a wood cellulose sheet impregnated with the same or different water-based acrylate resin to provide a continuous laminate. The acrylate resin diffuses into the pores of the natural fiber backer sheet and the wood cellulose sheet during impregnation. Heat and pressure are used to thermofuse the backer sheet and the wood cellulose sheet to form the laminate, and the sheets are permanently bonded after thermofusion. Advantageously, the thermofused laminate is free of volatile organic compounds and formaldehyde emissions. A topcoat or an iron oxide layer can be applied to the wood cellulose sheet after impregnating the wood cellulose sheet with the acrylate resin. A design can be transferred to the surface of the laminate or sheets using techniques such as dye sublimation or direct printing.Type: ApplicationFiled: March 26, 2014Publication date: October 2, 2014Inventors: Joseph Macedo, Millie Graves
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Publication number: 20140292460Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a ferrite-organic body; an internal electrode laminated on the ferrite-organic body along a thickness direction of the ferrite-organic body to have a multilayer structure; a metal-organic body constituting a device body with the ferrite-organic body by covering the ferrite-organic body; and an external electrode covering the device body to be electrically connected to the internal electrode.Type: ApplicationFiled: November 15, 2013Publication date: October 2, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Yoon KIM, Myeong Gi KIM, Il Jin PARK, Jin Woo HAHN, Min Kyoung CHEON
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Publication number: 20140291011Abstract: An electronic device includes a substrate and a lid bonded on the substrate with a resin layer to seal an inside of the lid. The resin layer is formed at a part of the substrate to which the lid is mounted. A part where the lid is bonded on the substrate with resin layer forms a sealing portion. A glass layer is formed so as to cover the sealing portion.Type: ApplicationFiled: March 27, 2014Publication date: October 2, 2014Applicant: NIHON DEMPA KOGYO CO., LTD.Inventors: MASAHIRO YOSHIMATSU, RYOICHI ICHIKAWA, YASUSHI YAMAMOTO
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Publication number: 20140291151Abstract: The invention relates to a method of producing solid oxide fuel cells (SOFC) having a cathode-electrolyte-anode unit supported by a metal substrate. It is the object of the invention in this respect to provide solid oxide fuel cells which achieve an increased strength, improved temperature change resistance, a secure bonding of films forming the cathode-electrolyte-anode unit and can be produced free of distortion and reproducibly. In the method in accordance with the invention, a film forming the anode is first wet chemically applied to a surface of a porous metallic substrate as a carrier of the cathode-electrolyte-anode unit. An element which has already been sintered gas tight in advance and which forms the electrolyte is then placed on or applied a really to this film forming the anode and at a first thermal treatment up to a maximum temperature of 1250° C.Type: ApplicationFiled: September 23, 2011Publication date: October 2, 2014Applicants: Technische Universitat Dresden, Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.Inventors: Mihails Kusnezoff, Nikolai Trofimenko, Egle Dietzen, Chriffe Belda
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Patent number: 8845845Abstract: A carbon fiber tubular pole and method of construction thereof. The pole includes a left in place lightweight mandrel, preferably formed of tubular polyvinylchloride or cardboard, which substantially reduces cost of manufacture. Moreover, an outer tubular glass fiber sleeve over a tubular carbon fiber sleeve resin saturated through and through maintains the aesthetic appearance of the black carbon fiber while substantially strengthening the end product. A second outer layer of a mixture of resin and colloidal silica over the cured resin layer adds shine and increases smoothness.Type: GrantFiled: December 16, 2011Date of Patent: September 30, 2014Inventors: Nanette L. Hultgren, Steven C. Austin
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Patent number: 8846153Abstract: Methods of making a reinforcement mesh, and an architectural molding reinforced by the mesh. The mesh is adhered by an adhesive to the architectural molding. In the mesh, weft yarns bend relative to warp yarns to conform to and against a curved profile of the architectural molding, and the warp yarns are unbent and adhered against the molding.Type: GrantFiled: October 27, 2009Date of Patent: September 30, 2014Assignee: Saint-Gobain ADFORS Canada, Ltd.Inventor: Mark Joseph Newton
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Publication number: 20140262011Abstract: In accordance with one embodiment of the present invention, the invention comprises a continuous structural composite preform wet out system and method which takes as an input pre-formed structural composite structures with a structural foam core, passes these structures through a wetting system which may comprise sprayers, brushes, a die or dies, or other wetting means; applies a cure process such as ultraviolet light, heat, curing agent or other cure method, and produces a completed, cured structural composite structure such as a beam or panel for use in any structure as desired by the user. The improved structural composite wet out system of the invention provides run rate, ease of use, structure efficiency and handling advantages over the pultrusion systems of the prior art by achieving higher production rates, the ability to use light cure resins and the ability to produce composite structures of non-uniform cross-section.Type: ApplicationFiled: March 15, 2014Publication date: September 18, 2014Inventors: Scott Lewit, Ronnal P. Reichard
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Publication number: 20140262212Abstract: A new resin blend is disclosed, which may be referred to as a hybrid resin. The resin blend includes an effective amount of benzoxazine resin or benzoxazine derivative mixed with at least one of epoxy resin, phenolic resins and other thermosetting polymers at varying ratios. The new resin blend has enhanced hot/wet performance in down hole frac and bridge plug applications in a cost effective manner with ease of processing.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Applicant: CCDI COMPOSITES, INC.Inventor: Dennis Sherlin
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Publication number: 20140263059Abstract: The invention is directed to a method and a device for separating plasma from whole blood. The method combines size exclusion filtration through a separation membrane and erythrocyte (RBC) agglutination.Type: ApplicationFiled: March 10, 2014Publication date: September 18, 2014Inventors: Lawrence J. Burg, Russel Rines, Aravind Srinivasan
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Publication number: 20140272296Abstract: A structural member includes a simulated surface appearance. The structural member includes a substrate, plural intermediate layers, and a top coat. The plural intermediate layers are applied over at least one surface of the substrate, with at least some of the plural intermediate layers configured to cooperate with each other to provide a simulated appearance for the structural member. The top coat is applied outward of the plural intermediate layers. The top coat is relatively thin and is configured for use with exterior applications. The top coat includes a base configured for UV resistance and an additive configured to provide abrasion resistance.Type: ApplicationFiled: March 14, 2013Publication date: September 18, 2014Applicant: Illinois Tool Works, Inc.Inventors: Roger A. Fahlsing, Alan Robert Kauman
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Publication number: 20140261969Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes.Type: ApplicationFiled: June 3, 2014Publication date: September 18, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Jun ADACHI, Jun URAKAWA, Issei YAMAMOTO
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Publication number: 20140272446Abstract: In one aspect, articles are described herein comprising wear-resistant claddings. An article described herein, in some embodiments, comprises a metallic substrate and a cladding adhered to the substrate, the cladding including a metal matrix composite layer comprising at least one hard particle tile having a pore structure infiltrated with matrix metal or matrix alloy. Infiltration of the pore structure of the hard particle tile by the matrix metal or alloy can render the tile fully dense or substantially fully dense.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: Kannametal Inc.Inventors: Qingjun Zheng, Yixiong Liu, Robert J. Vasinko, Joel Thomas Dawson, Michael J. Meyer
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Publication number: 20140251990Abstract: A method includes wrapping one or more pieces of fabric around at least one piece of shape memory material. The method also includes attaching outer edges of the one or more pieces of fabric to other portions of the one or more pieces of fabric. The method further includes depositing liquid-impervious material onto the one or more pieces of fabric to form free-standing flexible walls and a floor of a containment structure. The floor is formed seamlessly with the walls. The wrapping could include attaching a bottom of the at least one piece of shape memory material to the one or more pieces of fabric at locations spaced apart from the outer edges of the one or more pieces of fabric. The wrapping could also include attaching sides of the at least one piece of shape memory material to the one or more pieces of fabric.Type: ApplicationFiled: May 22, 2014Publication date: September 11, 2014Applicant: TitanLiner, Inc.Inventor: Joshua D. Hopkins
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Publication number: 20140254112Abstract: A multi-layered film includes: a plate-like flexible base member; first inorganic members that are each plate-like and arranged on the base member in separation from each other in a direction parallel to a main surface of the base member; a first organic member provided on the base member so as to be positioned between each adjacent two first inorganic members and surround each first inorganic member; a second inorganic member that covers an upper surface and lateral surfaces of the first organic member; and a second organic member that is provided on or above the first inorganic members, and is surrounded by the second inorganic member. Each lateral surface portion of the second inorganic member covering a corresponding lateral surface of the first organic member is thinner than each first inorganic member and each upper surface portion of the second inorganic member covering a corresponding portion of the upper surface.Type: ApplicationFiled: February 28, 2014Publication date: September 11, 2014Applicant: PANASONIC CORPORATIONInventors: Kenji OKUMOTO, Arinobu KANEGAE
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Publication number: 20140238594Abstract: A method of manufacturing a colorless transparent polyimide film having reinforced glass fabric for flexible displays, suitable for use in increasing optical transmittance of a polyimide substrate having reinforced glass fabric for flexible displays. This method enables the glass fabric and the colorless transparent polyimide film to be matched in refractive index when the glass fabric is reinforced in the colorless transparent polyimide film to enhance thermal and mechanical properties of a substrate for flexible displays, thus satisfying high optical transparency and optical transmittance of 85% or more, required of a substrate for flexible displays, and thereby the colorless transparent polyimide film having reinforced glass fabric can be used as a substrate for flexible displays.Type: ApplicationFiled: February 27, 2014Publication date: August 28, 2014Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: CHOON SUP YOON, SEUNG HYUN OH