Abstract: A frame is for a remotely operated vehicle. Several frame elements provide a carcass formed of a buoyant material. The frame elements are provided by a curable material having been arranged on the surfaces of the carcass, forming a rigid shell around the carcass. A method of constructing a frame is for a remotely operated vehicle. Several frame elements provide a carcass formed of a buoyant material. The method comprises: forming several core elements of a buoyant material; forming a carcass by joining the core elements together; applying a curable material to the surface of the carcass; and forming several mounts integrated into the curable material, for vehicle components.

Abstract: A method for producing a floor panel comprising a carrier board, a cork layer, a primer and a decorative layer is disclosed. To achieve qualitatively improved decorative layers, a method is disclosed in which the cork layer is applied to the carrier board, in which, in order to form the primer, a coating system having a proportion of volatile components is applied to the cork layer, and in which the decorative layer is printed onto the primer.

Abstract: Laminates are described having a durable outer film surface for use in making lightweight liquidproof articles of apparel, such as outerwear garments. A method of making the laminate and a lightweight outerwear garment having an abrasion resistant exterior film surface is described.

Abstract: A biosensor according to the present invention includes a first base material having an insulating surface; an adhesive layer located on the insulating surface of the first base material; and an electrode system and wiring sections fixed to the first base material via the adhesive layer. The electrode system includes top electrode layers and bottom electrode layers, and the bottom electrode layers are formed of a material having a higher conductivity than that of the top electrode layers; the electrode system includes a working electrode and a counter electrode, and also includes an enzyme reaction section located on the working electrode, the enzyme reaction section containing an enzyme and an electron acceptor; and the bottom electrode layers and the wiring sections are integral with each other.

Abstract: Methods and apparatus for forming interconnects on the surfaces of three dimensional substrates, including ophthalmic devices incorporating one or more electrical components may be utilized to provide high quality electrical and mechanical connections.

Abstract: A gas turbine blade may have a bond coat applied to its surface. A porous substrate may be applied to the bond layer and one or more protective layers may be applied to the bond layer such that the fiber mesh is embedded between the bond layer and the protective layer to prevent creep.

Abstract: A dielectric material layer is deposited on exposed surfaces of a bonded structure that includes a first substrate and a second substrate. The dielectric material layer is formed on an exposed planar surface of a second substrate and the entirety of peripheral sidewalls of the first and second substrates. The dielectric material layer can be formed by chemical vapor deposition, atomic layer deposition, or plasma induced deposition. Further, the dielectric material layer seals the entire periphery of the interface between the first and second substrates. If a planar portion of the dielectric material layer can be removed by planarization to facilitate thinning of the bonded structure, the remaining portion of the dielectric material layer can form a dielectric ring.

Abstract: A manufacturing method of a package carrier is provided. A supporting board having an upper surface which a patterned circuit layer formed thereon is provided. A portion of the upper surface is exposed by the patterned circuit layer. An insulating layer and a conducting layer located at a first surface of the insulating layer are laminated onto the patterned circuit layer. The patterned circuit layer and the exposed portion of the upper surface are covered by the insulating layer. Plural conductive connection structures are formed on the patterned circuit layer. Plural of pads respectively connecting the conductive connection structures and exposing a portion of the first surface of the insulating layer is defined by patterning the conductive layer. The supporting board is removed so as to expose a second surface of the insulating layer. The second surface and a bonding surface of the patterned circuit layer are coplanar.

Abstract: A fluid storage vessel can include an expanded polystyrene (EPS) core formed into an integrated unit so that it can reliably withstand the hydrostatic pressures of large volumes of water (or other liquids). The EPS core can be wrapped with a high tensile strength material to accommodate performance under full volume loads. The vessel can be coated on the exterior and/or interior with a fiber reinforced cementitious composite. A vessel can optionally include thermostatically controlled heaters for use in cold environments.

Abstract: A thermal head including: a laminated substrate including a support substrate and an upper substrate at least one of which has a recess formed in a surface thereof; a heat generating resistor formed on a surface of the upper substrate in the laminated substrate at a position opposed to the recess; and a pair of electrode portions connected to each of both ends of a heat generating resistor, wherein the laminated substrate further includes: an intermediate metal layer sandwiched between the support substrate and the upper substrate and bonded thereto in a laminated state; and a surrounding metal layer formed of a metal material, the surrounding metal layer provided in contact with the intermediate metal layer and formed from a surface of the support substrate extending in a thickness direction thereof to a surface thereof opposite to a portion bonded to the upper substrate.

Abstract: Disclosed herein are a common mode filter and a method for manufacturing the same. The common mode filter includes a first insulator sheet; a first circuit layer having a first-layered first coil and a first-layered second coil alternately and separately arranged; a second insulator sheet laminated on the first circuit layer; and a second circuit layer having a second-layered first coil and a second-layered second coil alternately and separately arranged, the second-layered first coil being connected to the first-layered first coil and the second-layered second coil being connected to the first-layered second coil through the plurality of penetration holes.

Abstract: Lamination packs of a controlled height are produced in that laminations are punched with a tool and glue is applied partially onto at least one of an upper surface and a lower surface of each of the laminations without the application device that applies the glue contacting the laminations. Several of the laminations are then assembled to a lamination pack. Height of the lamination packs is controlled by interrupting the application of glue for certain laminations so that between some of the laminations that are stacked for assembling a lamination pack there is no glue.

Abstract: A method for fabricating lenticulars includes applying (104) a rubbing layer on a lenticular structure. The rubbing layer is baked (106) on the lenticular structure before installation of the lenticular structure on a plate. After baking, the lenticular structure is applied (110) to the plate.

Abstract: A control module for a motor vehicle having a base plate and electronic modules situated thereon is described. The electronic modules are encapsulated and the insulating compound which protects against environmental influences and is used for this purpose is a distance away from the edge of the base plate over the entire circumference.

Abstract: An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes.

Abstract: A method for making a film/board laminate for use in pilfer resistant packaging includes providing a non-treated paperboard substrate, adhering a single ply of an oriented film to the substrate, the oriented film being applied at an orientation angle to the board between but not equal to zero degrees and 180 degrees such that a film to substrate adhesion is about 0.5 pli to 1.4 pli, and applying a heat seal layer to the film.

Abstract: A packaging substrate device includes: a first laminate including a first ceramic substrate and a first copper pattern disposed on an upper surface of the first ceramic substrate; and a second laminate disposed over the first copper pattern and including a second ceramic substrate, a second copper pattern that is disposed on an upper surface of the second ceramic substrate, and a through hole extending through the second ceramic substrate and the second copper pattern to expose a copper portion of the first copper pattern. A light emitting semiconductor die can be mounted on the copper portion within the through hole. Efficient heat dissipation can be achieved through the first laminate.

Abstract: A repulpable moisture resistant poultry box having a composite structure with a fluted medium, a top backing board secured to one side of the fluted medium and a bottom backing board secured to the other side of the fluted medium. The backing boards and the fluted medium are impregnated with a hydrogenated triglyceride. The backing boards each have an outer surface coated with PET to provide moisture resistance repulpable and recyclable box.

Abstract: Disclosed herein is a method of manufacturing a build-up printed circuit board (PCB), the method including: providing a first resin substrate; forming a roughness by coating an epoxy emulsion solution on a surface of the first resin substrate; and providing a core layer by forming a core circuit layer on the first resin substrate on which the roughness is formed. According to the present invention, roughness of a substrate can be formed in an environment-friendly and economical way by introducing a process of coating epoxy emulsion on a resin substrate. Further, a highly reliable fine circuit can be implemented by enhancing an adhesive bond between a build-up board material and a metal circuit layer.

Abstract: An embodiment of the invention provides a method for forming an electronic device package, which includes providing a carrier substrate having an upper surface and an opposite lower surface; forming a cavity from the upper surface of the carrier substrate; disposing an electronic device having a conducting electrode in the cavity; forming a filling layer in the cavity, wherein the filling layer surround the electronic device; thinning the carrier substrate from the lower surface to a predetermined thickness; forming at least a through-hole in the electronic device or the in the carrier substrate; and forming a conducting layer over a sidewall of the through-hole, wherein the conducting layer electrically connects to the conducting electrode.

Abstract: A phosphor-containing cured silicone that is a cured silicone which has a structure represented by general formulae (1) and/or (2) and also has units selected from general formulae (3) and/or (4), the phosphor-containing cured silicone includes a phosphor and particles having units selected from general formulae (3) and/or (4): wherein R1 to R3 are each a hydrogen atom, a methyl group, an ethyl group or a propyl group; X represents a methylene group, a dimethylene group or a trimethylene group, and may be the same or different; and R4 to R6 are each a substituted or unsubstituted monovalent hydrocarbon group, and may be the same or different. An object of the present invention is to provide a cured silicone in which a phosphor is uniformly dispersed, the cured silicone is characterized in that a silicone material has good thermal resistance and lightfastness.

Abstract: A fire barrier laminate comprising: at least one fire barrier layer directly or indirectly coated onto at least one first polymeric flame propagation resistant film layer; at least one second film layer proximate to the fire barrier layer opposite the first polymeric flame propagation resistant film layer; at least one scrim layer disposed: (i) between the fire barrier layer and the first polymeric flame propagation resistant film layer; and/or (ii) between the fire barrier layer and the second film layer; and/or (iii) proximate to the first polymeric flame propagation resistant film layer opposite the fire barrier layer; and/or (iv) proximate to the second film layer opposite the fire barrier layer; wherein the fire barrier layer comprises inorganic fibers, at least one inorganic platelet material, optionally at least one organic binder and/or inorganic binder, and optionally at least one functional filler.

Abstract: The present disclosure relates to the preparation of composite moulds and methods of preparing the same, wherein the composite moulds may be prepared exclusive or inclusive of a plug. Certain composites comprise a substrate, a structural laminate, and a syntactic foam moulding product.

Abstract: A method is proposed for producing a composite material plate (2) equipped with decorative elements (1). To provide advantageous conditions, firstly a carrier plate (3) is equipped with a resin layer (4), after which the decorative elements (1) arranged on a support layer (5) are immersed with the support layer (5) by a desired amount (h) into the resin layer (4), and the support layer (5), in particular a carrier film, and optionally the carrier plate (3) are detached after curing of the resin layer (4) from the decorative elements (1), which are held in the now cured resin layer (4).

Abstract: A method for fabricating a packaging substrate includes: stacking two metal layers; encapsulating the two metal layers with assistant dielectric layers; forming built-up structures on the assistant dielectric layers, respectively; and separating the built-up structures along the interface between the two metal layers so as to form two packaging substrates. Owing to the adhesive characteristic of the assistant dielectric layers, the two metal layers are unlikely to separate from each other during formation of the built-up structures. But after portions of the dielectric layer around the periphery of the metal layers are cut and removed, the two metal layers can be readily separated from each other. The two metal layers can be patterned to form wiring layers, metal bumps, or supporting structures to avoid waste of materials. A packaging substrate and a fabrication method thereof are provided.

Abstract: The steps of a method for fabricating a proximity sensing module that is adapted to be attached to a mobile device, include: (a) patterning an upper conductive film to form a patterned conductive film which includes an upper connective pad that is adapted to be electrically connected to a respective contact on a circuit board of the mobile device, and an induced circuit pattern that is electrically connected to the upper connective pad; (b) adhering an adhesive sheet to the patterned conductive film; and (c) forming a through hole in the adhesive sheet such that the upper connective pad is exposed from the through hole.

Abstract: An optical detection sensor and method of forming same. The optical detection sensor be a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object.

Abstract: Frontplane articles are described utilizing laminated glass substrates, for example, ion-exchanged glass substrates, with flexible glass and with opto-electronic devices which may be sensitive to alkali migration are described along with methods for making the articles.

Abstract: Various embodiments of this disclosure concern a lead end having an inner support. Such a lead can include a first end, a second end, a main body, and a plurality of exposed electrical elements on each of the lead ends. A metal support can be contained within the first end, the metal support comprising a plurality of longitudinal members and a plurality of cross members between the longitudinal members, the metal support having an interior space. The first lead end can further include polymer fill within the interior space of the metal support and encapsulating at least a substantial portion of the metal support, the polymer fill defining at least some of the exterior surface of the first end between the exposed electrical elements of the first end.

Abstract: Disclosed herein are an asymmetrical multilayer substrate, an RF module, and a method for manufacturing the asymmetrical multilayer substrate. The asymmetrical multilayer substrate includes a core layer, a first pattern layer formed on one side of the core layer and including a first signal line pattern, a second pattern layer formed on the other side and including a second metal plate and a second routing line pattern, a first insulating layer thinner than the core layer formed on the second pattern layer and including a first via, and a third pattern layer formed on the first insulating layer and including a third signal line pattern, wherein an impedance transformation circuit including an impedance load and a parasitic capacitance load on the transmission line is formed for impedance matching in signal transmission between the signal line patterns formed in the upper and lower side directions of the core layer.

Abstract: The present invention is directed towards a paper-based composite packaging structure comprising a paper layer and a filler layer which may be laminated or otherwise adhered to the paper layer. In certain embodiments, the filler layer comprises a polymer or bio-based polymer. An optional barrier layer may be deposited on to one side of the paper layer or filler layer as desired to provide functional barrier characteristics. The composite paper-based film structure(s) may comprise additional layers such as one or more optional primer layers, adhesive layers, ink layers, and/or sealant layers that can be incorporated into the composite film structure as desired to enable the required functional characteristics of the composite film structure described herein. The paper-based composite packaging structure is substantially compostable and/or recyclable as both the paper and the bio-based polymer filler layers will break down under composting conditions and/or meet standardized recyclability requirements.

Abstract: Embodiments relate to the design and use of a low profile ablation catheter with a liquid core for use in laser ablation removal of arterial plaque blockages to restore blood flow.

Abstract: Disclosed painted roof coverings and related methods of manufacturing such painted roof coverings that use a color coating over the roof coverings instead of embedded pre-colored rock granules on the exposed surface of the roof coverings. By painting a roof covering with a color coating, any kind of top surfacing material, such as rock, plastic, mineral, man-made, or organic granules, may be used in place of the pre-colored rock granules. In some embodiments, it is desirable to size the top surfacing material to provide adequate UV protection and coverage to the weatherproofing asphalt material located below the top surfacing material. Further, the color of the shingles may be accurately matched between batches of shingles, between manufacturing facilities, and even between manufacturers. In addition, designs may be painted on the surface of the roof covering, which was previously impossible using pre-colored granules.

Abstract: A composite sheet for a backlight unit using a printless light guide plate in a liquid crystal display television, which includes a first prism sheet positioned directly on the printless light guide plate, a second prism sheet having a prism pattern formed in a direction orthogonal to a direction of a prism pattern of the first prism sheet, and a protective sheet, where ribs of the first prism sheet are adhered to the lower surface of the second prism sheet, and ribs of the second prism sheet are adhered to the lower surface of the protective sheet. A method of manufacturing the composite sheet for a backlight unit is also provided.

Abstract: A fire barrier laminate including: at least one non-fibrous fire barrier layer directly or indirectly coated onto at least one first polymeric flame propagation resistant film layer; at least one second film layer proximate to the non-fibrous fire barrier layer opposite the first polymeric flame propagation resistant film layer; at least one scrim layer disposed: (i) between the non-fibrous fire barrier layer and the first polymeric flame propagation resistant film layer; and/or (ii) between the non-fibrous fire barrier layer and the second film layer; and/or (iii) proximate to the first polymeric flame propagation resistant film layer opposite the non-fibrous fire barrier layer; and/or (iv) proximate to the second film layer opposite the non-fibrous fire barrier layer. Also, a method of making the fire barrier laminate.

Abstract: There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin.

Abstract: Provided are a substrate with built-in electronic component and a method for manufacturing the same. The method for manufacturing a substrate with built-in electronic component includes: forming conductive temporary bumps which penetrate and protrude through a prepreg sheet; mounting and attaching an electronic component on the protruding temporary bumps; forming an embedded substrate by laminating other prepreg sheet on the attached electronic component layer, laminating a metal sheet on a bottom of a laminate or on a bottom and top of the laminate, and pressing the prepreg sheets and the metal sheet; forming contact grooves by removing partial regions of the metal sheet and by removing the temporary bumps exposed by the removal of the metal sheet regions; and filling the contact grooves with a conductive metal and forming a circuit pattern.

Abstract: The process for producing an organic EL panel according to the present invention is a process for producing an organic electroluminescent panel by forming an organic electroluminescent element on an ultrathin glass plate by vacuum deposition method, including forming electrodes on the ultrathin glass plate, by temporarily fixing the ultrathin glass plate to a supporting plate via a double-sided adhesive tape having a thermal release adhesive layer formed at least on one face of the base material layer, containing heat-expandable microspheres that start expansion and/or foaming at temperature higher than the vacuum deposition temperature.

Abstract: A method for making a conductive film includes: providing a carbon nanotube film defining a plurality of holes therein; attaching the carbon nanotube film on a substrate; adjusting a temperature of the carbon nanotube film in a range from about 7° C. to about 9° C.; dropping and rubbing a nanoparticle aqueous solution in the carbon nanotube film, the nanoparticles aqueous solution containing a plurality of nanoparticles; and adjusting the temperature of the carbon nanotube film in a range from about 24° C. to about 26° C. and drying the carbon nanotube film to obtain the conductive film on the substrate.

Abstract: A method of making a laminated touch fastener includes introducing a flexible substrate to a resin applicator, applying flowable resin to a limited region of a surface of the substrate, and molding the applied resin to form a plurality of defined structures extending from a layer of the applied resin. The substrate surface, as the substrate is introduced to the resin applicator, has a surface characteristic that varies across the surface. The surface includes both a first region and a second region adjacent the first region, the surface characteristic varying to a greater degree within the second region than within the first region. The flowable resin may be applied within the first region such that an edge of the resin layer is disposed within, and adjacent an exposed portion of, the first region of the substrate surface.

Abstract: The present invention discloses a covering for placement on a surface, such as a wall on the inside of a house, for reduction or prevention of a singularity or a plurality of emissions, such as harmful emissions, released from the surface. The covering comprises a trapping agent and a carrier for retaining and supporting the trapping agent, such that the trapping agent can trap the singularity or plurality of emissions without being released from the carrier. The trapping agent is a substantially irreversible trapping agent independently selected from one or several of the group consisting of absorbing agents and adsorbing agents, such that the trapping agent is capable of fully or partly trapping the singularity or plurality of emissions substantially irreversibly by absorption or adsorption, or a combination of absorption and adsorption. The covering may further comprise a semi-permeable barrier. Methods for use and manufacturing of the covering are also disclosed.

Abstract: A composite material able to dissipate the kinetic energy of a moving object comprising a layer of ballistic material bonded to a layer of porous matrix material which is impregnated with shear thickening fluid.

Abstract: There is described a labelling machine for applying a plurality of labels to a respective plurality of articles; the machine comprises a conveying device movable along a given path (P) and having a plurality of operating units for receiving and retaining the articles to be labelled, feeding means for feeding the labels to the operating units, application means for applying the labels to the articles, and a marking unit (100) arranged upstream from the conveying device and comprising means (101) for marking a surface of each label with a mark (M) univocally associable with the corresponding operating unit by which said label shall be received and processed.

Abstract: A radiation source for emitting infrared electromagnetic radiation and having at least one source element. The radiation source is characterized by features including that: the source element is embodied in the form of a silicon carbide fiber; the source element is coated at least sectionally with a metal coating, via which the source element can be heated; and the metal coating heats the source element at least at times in such a manner that the source element emits infrared radiation at least at times. A method for the manufacture of a radiation source is likewise claimed relevant.

Abstract: A method for manufacturing a transparent conductive film that can reduce a heating time of crystallizing an amorphous layer containing an indium-based complex oxide is provided. The method for manufacturing a transparent conductive film according to the present invention includes a first step of laminating an amorphous layer formed of an indium-based complex oxide on a first side of a film base material having a thickness of 10 to 50 ?m, a second step of forming a transparent conductive layer by heating the film base material on which the amorphous layer is laminated to 160° C. or above to crystallize the amorphous layer during a process of conveying the film base material from a feed roller and taking up the film base material on a take-up roller, and a third step of forming an adhesive layer on a second side of the film base material.

Abstract: A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.

Abstract: A microfilter comprising a polymer layer formed from epoxy-based photo-definable dry film, and a plurality of apertures each extending through the polymer layer. A method of forming a microfilter is also disclosed. The method includes providing a first layer of epoxy-based photo-definable dry film disposed on a substrate, exposing the first layer to energy through a mask to form a pattern, defmed by the mask, in the first layer of dry film, forming, from the exposed first layer of dry film, a polymer layer having a plurality of apertures extending therethrough, the plurality of apertures having a distribution defined by the pattern, and removing the polymer layer from the substrate.

Abstract: A reusable vacuum bag for processing parts is made by encapsulating a generally rigid frame within a flexible diaphragm.

Abstract: A photographic print media comprising: a transparent synthetic organic polymeric layer adjacent and affixed to an opaque or semi-transparent translucent synthetic organic polymeric layer host to light scattering whitening particulate and diffused dyestuff. The invention as disclosed provides for a novel new method of creating and displaying digital images in a media that provides for photographic quality full color images to be printed with translucency and the ability to view the image from both sides.

Abstract: A reinforcing drywall tape and a method of making the same, the tape having a greige combined with a laid scrim constructed in situ on the greige and bonded to the greige by a resin coating, and a pressure sensitive adhesive fully covering an inward facing surface of the greige wherein the greige is adapted for adherence to drywall sections.