Direct Application Of Vacuum Or Fluid Pressure During Bonding Patents (Class 156/285)
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Patent number: 8591689Abstract: A method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device. The method coat surface regions of functional patterns arranged on a substrate and/or of surface regions of semiconductor chips arranged on the substrate. An insulation is to be effectively adapted in its properties to different requirements of functional patterns and/or electronic components. Film regions are laminated on surface regions in such a way that the properties of the plastics material of the film regions are adapted to the function of the film. This adaptation is individual and selective. Various films are used. The method is suitable in particular for coating or packaging electronic components or active and passive devices.Type: GrantFiled: December 20, 2006Date of Patent: November 26, 2013Assignee: Siemens AktiengesellschaftInventors: Jörg Naundorf, Karl Weidner, Hans Wulkesch
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Patent number: 8591678Abstract: A vacuum forming machine includes a holder arranged to hold a decorative sheet, upper and lower boxes separated by the decorative sheet and the holder, a pressure reducer arranged to reduce pressures inside the upper and lower boxes, a first valve arranged to adjust a degree of pressure reduction inside the upper box, a second valve arranged to adjust a degree of pressure reduction inside the lower box, a heater arranged to heat the decorative sheet, a temperature information collector arranged to collect temperature information about the temperature of the decorative sheet, and a controller programmed to control opening/closing operations of the first and second valves by reference to the temperature information while the pressure reducer is operating.Type: GrantFiled: December 23, 2009Date of Patent: November 26, 2013Assignee: Yamaha Hatsudoki Kabushiki KaishaInventor: Yasuo Suzuki
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Publication number: 20130306237Abstract: A jig for fixing laminated materials, a system for manufacturing bonded laminated materials, and a method of manufacturing bonded laminated materials are provided at a good yield factor and to efficiently manufacture the bonded laminated materials that are pressed and bonded after being laminated without a misalignment of the membranes or deformation of the laminated materials or any deficiency in bonding at the interface. The bonded laminated materials are manufactured by storing materials made of laminated membranes (W) in a housing space (S) formed by a first sheet-shaped member (12), a second sheet-shaped member (22), and a sealing member (30), exhausting the housing space (S) to sandwich the laminated membranes (W) between the first and second sheet-shaped members (12, 22) to fix them, and pressing and bonding them by hot-pressing rollers (51) and cold-pressing rollers (52) of a machine (50) for manufacturing the bonded laminated materials while they are fixed.Type: ApplicationFiled: January 5, 2012Publication date: November 21, 2013Inventors: Masahiko Nagasaka, Shogo Nakajima, Takayuki Nozawa, Osamu Sugino, Ikuto Mishima
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Publication number: 20130309455Abstract: A method for manufacturing a lining element is provided. The method comprises laying a textile membrane onto a positive molding tool, applying first fibers and a matrix material onto at least one first region of the textile membrane for creating a semi-finished product of a framework supported textile, providing at least one sealing element along outer edges of the molding tool, covering the textile membrane and the at least one sealing element in an air tight manner by a covering means, evacuating the space between the molding tool and the covering means and curing the matrix material by heating the semi-finished product. Thereby, a lining element with a low weight and at the same time a sufficient directional stability is provided that furthermore allows to easily recycle the components of the lining element.Type: ApplicationFiled: May 16, 2013Publication date: November 21, 2013Inventors: Stefan FRANK, Tina JOERN
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Publication number: 20130309096Abstract: A method for bonding additional parts to a composite-material turbomachine part in a thermostatic oven includes a step of placing this composite-material turbomachine part equipped with the additional parts on a rigid support that cannot deform at the operating temperature and pressure and that is configured to espouse the desired final shape of the composite-material turbomachine part. The composite-material turbomachine part equipped with these additional parts is covered with a vacuum bag. The edges of this vacuum bag are sealed with respect to the non-deformable rigid support. A vacuum of determined pressure is applied to the vacuum bag. The determined operating pressure is applied to the vacuum bag in order to hold the composite-material turbomachine part equipped with these additional parts firmly against the non-deformable rigid support, the whole entity thus formed is heated to the operating temperature in the thermostatic oven for a determined time.Type: ApplicationFiled: May 13, 2013Publication date: November 21, 2013Inventor: SNECMA
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Publication number: 20130306236Abstract: To provide a curable resin composition for forming a seal part, which is capable of easily forming a continuous seal part and which is capable of maintaining the shape of the seal part during a period of from immediately after the formation of an uncured seal part until a liquid material is supplied to a region enclosed by the seal part and the seal part is cured, and a laminate which has minimal defects and whereby a resin layer interposed between first and second plates can be made thick. One having a viscosity of from 500 to 3,000 Pa·s at 25° C. is used as the curable resin composition for forming a seal part to form an uncured seal part 12 enclosing the periphery of a liquid material (curable resin composition 14 for forming a resin layer) interposed between a first plate (display device 50) and a second plate (transparent plate 10).Type: ApplicationFiled: July 24, 2013Publication date: November 21, 2013Applicant: Asahi Glass Company, LimitedInventors: Satoshi NIIYAMA, Hiroshige Ito, Naoko Aoki, Yoshinobu Kadowaki, Yukio Tsuge
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Patent number: 8585856Abstract: A fabrication process using an integrated form includes assembling at least two independent sections of composite laminate about a form, such that at least a portion of the sections overlap. A bonding agent is applied between the sections, at the overlap, and the form and laminate assembly are vacuum-bagged. The bag is sealed around a vent in the form, and about the laminate assembly. A vacuum is applied within the bag, to bond the sections, and the bagged assembly is autoclaved, to cure the bonded laminate sections. The vent allows equalization of autoclave pressures within and outside of the form, to prevent crushing or deformation of the form during cure. The form becomes an integral and permanent part of the final composite product.Type: GrantFiled: May 13, 2010Date of Patent: November 19, 2013Assignee: Textron Innovations Inc.Inventors: Richard Boone, John W. Gallman
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Publication number: 20130295811Abstract: Provided are: a carbon fiber bundle which has a large value of single-fiber fineness and excellent productivity and which, despite this, contains few interlaced single fibers therein and has excellent spreadability; and precursor fibers which are suitable for use in producing the carbon fiber bundle. The precursor fibers are a carbon-fiber-precursor acrylic fiber bundle which comprises a polyacrylonitrile copolymer comprising 95-99 mol % acrylonitrile units and 1-5 mol % hydroxyalkyl (meth)acrylate units and which has a single-fiber fineness of 1.5-5.0 dtex. In the acrylic fiber bundle, the cross-section of each single fiber which is perpendicular to the fiber axis has a shape that has a roundness of 0.9 or less.Type: ApplicationFiled: October 13, 2011Publication date: November 7, 2013Applicant: MITSUBISHI RAYON CO., LTD.Inventors: Yuusuke Shinmen, Norifumi Hirota, Atsushi Nakajima, Naoki Aoyama, Naomasa Matsuyama, Takeshi Nii, Akiyoshi Kogame, Yasuyuki Fujii, Yoshiko Irie, Harumi Matsuda, Takayuki Kiriyama, Teppei Miura, Takuya Teranishi, Shouhei Mori, Manabu Kaneko, Kiharu Numata, Masahiro Ichino, Shigekazu Takeda, Takayuki Kobayashi, Toshiyuki Itou, Masahiro Hata, Hiroyuki Nakao, Kenichi Watanabe
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Patent number: 8574387Abstract: A method of applying graphics to a set of articles with a graphic transfer assembly is disclosed. The method includes a step of selecting an article from a set of articles comprising different types of articles. After selecting a last that may be associated with the article, the last may be attached to a last assembly of the graphic transfer assembly. With the article attached to the graphic transfer assembly, a deformable membrane may apply graphics to curved portions of the article. A protective member can be used to protect a portion of the article during the graphic transfer process.Type: GrantFiled: March 7, 2012Date of Patent: November 5, 2013Assignee: Nike, Inc.Inventors: N. Scot Hull, Elizabeth Langvin
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Patent number: 8574391Abstract: The invention relates to a method for joining precured stringers to at least one structural component of an aircraft or spacecraft. A vacuum arrangement required for the joining is produced in two parts. In a first step, each precured stringer is covered in advance by a covering vacuum film. The stringers prepared in this manner are arranged on the structural component. Vacuum film strips are subsequently arranged in each case on adjacent stringers and over an intermediate space between the adjacent stringers. With the use of a vacuum sealing means, the vacuum film strips and the covering vacuum films 8 form a continuous vacuum arrangement. The stringers are subsequently joined under pressurization to the structural component with the use of this vacuum arrangement.Type: GrantFiled: September 26, 2007Date of Patent: November 5, 2013Assignee: Airbus Operations GmbHInventors: Peter Sander, Hans Marquardt, Hauke Lengsfeld
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Patent number: 8568551Abstract: A pre-patterned layup kit with layup patterned to accommodate an airframe topological feature, trimmed to fit a preselected target region of a layup structure, and conformed to the target region contour. The kit can be fabricated in advance of airframe manufacture and stored until use. The kit includes a flexible carrier upon which the layup is laid, and a release layer between the layup and the carrier. The layup has multiple laminae oriented to an carrier indexing element, and indexed to the target region thereby. A kit manufacturing method includes preparing the laminae constituent of the layup, preparing the carrier, and laying down the laminae on the carrier to make the kit. The kit can be compacted, inspected, and prepared for storage. The layup can be fabricated of a pre-patterned lamina or multiple laminae that are shaped and trimmed to accommodate an airframe topological feature.Type: GrantFiled: May 22, 2007Date of Patent: October 29, 2013Assignee: The Boeing CompanyInventors: Joseph D. Brennan, George D. Hempstead, Darrell D. Jones, Matthew K. Lum, Peter D. McCowin, Terrence J. Rowe, Hugh R. Schlosstein
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Patent number: 8569436Abstract: An extrudable polyvinyl chloride composition comprising from 80 to 99.9 percent by weight polyvinyl chloride for use in extruding a first part and a second part, wherein a fusion joint between the first extruded part and the second extruded part is formed by: A) composition at least a portion of a first terminal edge of the first extruded part and a first terminal edge of the second extruded part; B) engaging the melted terminal edges; and C) maintaining pressure between the engaged terminal edges to create a fused joint having a strength that is at least 50% of the tensile strength of the extruded part as measured by ASTM D638-2a. The extruded parts can be pipe sections.Type: GrantFiled: August 27, 2012Date of Patent: October 29, 2013Assignee: Underground Solutions Technologies Group, Inc.Inventors: Mark A. Smith, Thomas Marti, Bryan St. Onge, Henri St. Onge
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Publication number: 20130276961Abstract: A pressure vessel for containing materials under elevated pressures includes a metal liner and an adhesive layer, applied to the outer surface of the metal liner, where the adhesive layer is treated with a vacuum bag in order to secure the adhesive lo the outer surface of the liner. An overwrap layer is applied on top of the adhesive on the outer surface of the metal finer, where the overwrap layer is formed by winding a filamentary material around the liner, such that the filamentary material adheres to the adhesive forming an overwrap layer on the outer surface of the metal liner, forming the pressure vessel.Type: ApplicationFiled: June 11, 2013Publication date: October 24, 2013Inventor: Kirk Sneddon
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Patent number: 8561619Abstract: An artificial nail or tip arrangement and method of making the same are provided. The arrangement includes a body having a concave lower surface with a shape corresponding to a natural nail. The arrangement also includes an adhesive layer having a first surface and an opposing second surface. The first surface adheres to the concave lower surface of the body and the second surface is provided to adhere to the natural nail when applied thereto. The arrangement further includes a removable layer that covers the second surface of the adhesive layer, and which is removable to expose the second surface of the adhesive layer for application to the natural nail. The removable layer is provided with a plurality of slits so that a surface of the removable layer remains smooth after adherence of the first surface of the adhesive layer with the concave lower surface of the body.Type: GrantFiled: February 9, 2011Date of Patent: October 22, 2013Assignee: Kiss Nail Products, Inc.Inventor: Kyu Sang Han
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Patent number: 8557082Abstract: A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time, and then a resistive layer is farmed on the dielectric layer, and a protective layer is formed over the resistive layer.Type: GrantFiled: July 18, 2007Date of Patent: October 15, 2013Assignee: Watlow Electric Manufacturing CompanyInventors: Angie Privett, Roger Brummell, Larry Forbis
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Patent number: 8556617Abstract: For manufacture of fiber-reinforced components, a positionable base frame is used on which a controllable holding device is provided for gripping and holding at least one reinforced fiber layer. A draping device is provided on the base frame, using which the reinforced fiber layer may be draped onto a mold core via the application of a vacuum.Type: GrantFiled: July 7, 2009Date of Patent: October 15, 2013Assignee: Broetje Automation GmbHInventors: Raphael Reinhold, Stefan Juergens
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Publication number: 20130264724Abstract: The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.Type: ApplicationFiled: November 3, 2011Publication date: October 10, 2013Applicant: Tesa SEInventors: Klaus Telgenbüscher, Judith Grünauer, Jan Ellinger
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Publication number: 20130267089Abstract: A method for filling through hole interconnects in a substrate used in the manufacture of electronic devices uses a film filler material. The film comprises a resin matrix filled with conductive and/or dielectric particles, and can be a single or multi-layer film. The method comprises providing a substrate for an electronic device having one or more through hole interconnects; providing a film comprising at least one film filler material for the through hole interconnects; deposing the film filler material over the substrate; and pressing the film filler material into the through hole interconnects.Type: ApplicationFiled: March 14, 2013Publication date: October 10, 2013Applicant: HENKEL CORPRATIONInventors: Daniel Maslyk, George Carson, Raj Peddi
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Publication number: 20130255877Abstract: Systems and methods of applying a decorating film to a substrate that reduce the occurrence of wrinkling of the decorating film during application of the film to the substrate and ensure a more uniform transfer of a pattern or image on the decorating film to the substrate. The same systems and methods can be used to apply a decorating film that laminates to a substrate. Systems of and methods for cooling a decorating chamber and removing the used decorating film from the substrate after a transfer of an image or pattern from the decorating film to the substrate.Type: ApplicationFiled: February 7, 2013Publication date: October 3, 2013Applicant: FLEXTRONICS AP, LLCInventors: Spring Wu, Banghong Hu, Oliver Ren, Charles Raymon Hill
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Patent number: 8545660Abstract: A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.Type: GrantFiled: March 20, 2012Date of Patent: October 1, 2013Assignee: GTAT CorporationInventors: Steven M. Zuniga, Robert D. Tolles, Derek G. Aqui, Andrew J. Nagengast, Anthony J. Senn, Keenan Leon Guerrero
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Patent number: 8545663Abstract: In a process for manufacturing a semiconductor device comprising heating a wiring board on which a chip and an uncured adhesive layer are laminated for curing the adhesive layer, the improvement includes performing a statically pressurizing step before the adhesive layer is cured, in which step the wiring board on which the chip and the uncured adhesive layer are laminated is subjected to a static pressure greater than atmospheric pressure by not less than 0.05 MPa. According to the process, voids are easily eliminated irrespective of the design of the wiring board, and the adhesive is prevented from curling up on the chip.Type: GrantFiled: August 8, 2007Date of Patent: October 1, 2013Assignee: Lintec CorporationInventors: Osamu Yamazaki, Isao Ichikawa, Naoya Saiki
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Publication number: 20130240115Abstract: Disclosed are embodiments related to chip pressing devices. One such chip pressing device includes a bottom portion and a top portion, which is configured to be attached to or separated from the bottom portion, and has a compartment portion, an upper chamber, and a lower chamber, wherein the upper chamber is spaced apart from the lower chamber by the compartment portion. The upper chamber has one or more gas passages, the lower chamber has one or more gas inlets and one or more gas outlets, and the compartment portion has one or more through-holes. One or more pressing heads movably fit into the through-holes; one or more gas pressure sources connected to at least one of the gas passages of the upper chamber, wherein the upper chamber is pressurized, and one or more heated gas sources are connected to the one or more gas inlets of the lower chamber.Type: ApplicationFiled: August 14, 2012Publication date: September 19, 2013Applicant: Ableprint Technology Co., Ltd., a Taiwan CorporationInventor: Chih-Horng Horng
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Publication number: 20130240140Abstract: A process and a laminating device for producing a microfluidic device are proposed, wherein a film is pressed onto a carrier under the effect of heat and thereby attached to it. During the attachment the film is lifted by the blowing in of gas on the carrier side to prevent it adhering in a non-attachment region and is vented on the remote side. The device is compressed between a holder and a thermode of the laminating device during the lamination. An elastic intermediate layer is arranged in each case between the device and the holder and between the device and the thermode, for evening out the contact pressure and obtaining uniform attachment of the film to the carrier.Type: ApplicationFiled: August 30, 2011Publication date: September 19, 2013Inventors: Dirk Kurowski, Paul Oliver
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Publication number: 20130244441Abstract: A method of forming an elastomeric sheet adhesive bond between mating surfaces of an electrode and a backing member to accommodate stresses generated during temperature cycling due to mismatch in coefficients of thermal expansion. The elastomeric sheet comprises a thermally conductive silicone adhesive able to withstand a high shear strain of ?300% in a temperature range of room temperature to 300° C. such as heat curable high molecular weight dimethyl silicone with fillers. Installation can be manually, manually with installation tooling, or with automated machinery.Type: ApplicationFiled: March 14, 2013Publication date: September 19, 2013Applicant: LAM RESEARCH CORPORATIONInventors: Dean Jay Larson, Tom Stevenson, Victor Wang
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Patent number: 8535467Abstract: The invention relates to a process for the manufacture of an antiballistic article comprising the steps of forming a stack of sheets by stacking 2 or more sheets, each sheet comprising one or more mono-layers of anti-ballistic fibers and optionally a thermoplastic binder, followed by subjecting the stack of sheets to a reduced atmospheric pressure environment; and while maintaining the reduced atmospheric pressure environment, consolidating said stack of sheets to a pressure of at least 10 MPa at an elevated temperature. The invention also relates to an anti-ballistic article.Type: GrantFiled: April 1, 2009Date of Patent: September 17, 2013Assignee: DSM IP Assets B.V.Inventors: Hen H. Hoefnagels, Albert A. Vunderink
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Publication number: 20130233478Abstract: Methods of forming a collapsible mandrel are disclosed herein. An example method disclosed herein includes forming a layup on a substrate by providing a first layer of rubber, positioning a reinforcement strip on the first layer of rubber, providing first and second release films in spaced apart from each other adjacent the reinforcement strip to expose a portion of the reinforcement strip, providing a second layer of rubber overlying the exposed portion of the reinforcement strip, and laminating the first and second layers of rubber to the reinforcement strip. The release films to prevent the first and second layers of rubber from adhering to each other and the reinforcement strip such that non-adhered ends of the first and second layers of rubber and the reinforcement strip define flaps. The method includes placing the layup in a cavity of a mold forming part of a tool assembly, consolidating the layup when the layup is in the cavity of the mold, and curing the layup to form the collapsible mandrel.Type: ApplicationFiled: April 23, 2013Publication date: September 12, 2013Applicant: The Boeing CompanyInventors: Michael A. Lee, John D. Morris
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Patent number: 8529726Abstract: A method for producing a hollow product comprises a film arrangement step wherein a film is arranged on a fiber layer; a molded body arrangement step wherein a molded body having a recess is arranged on the film after the film after the film arrangement step in such a manner that the opening of the recess faces the film; the gas present between the fiber layer and the film is evacuated; the gas present between the film and the molded body is evacuated; a film-molded body bonding step wherein the film and the molded body are bonded together after the step of gas evacuation from between the film and the molded body; and a fiber layer-film bonding step wherein the fiber layer and the film are bonded together after the step of gas evacuation from between the fiber layer and the film.Type: GrantFiled: December 8, 2009Date of Patent: September 10, 2013Assignee: Nippi CorporationInventors: Terukuni Fukuoka, Keiichi Hosoda
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Publication number: 20130228276Abstract: A method for manufacturing a cover plate and a method for manufacturing an encapsulated LED using the cover plate are disclosed. The cover plate is manufactured by the following steps: mixing uncured acryl and fluorescent powder, defoaming, inject-molding and curing. The cover plate can be used for manufacturing an encapsulated LED, which can avoid or minimize the fluorescent powder being heated or being eroded by moisture, and can keep stability of the fluorescent powder, thereby increasing service life of the encapsulated LED.Type: ApplicationFiled: November 10, 2010Publication date: September 5, 2013Inventor: Kuo-Kuang Chang
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Publication number: 20130228754Abstract: A method of preparing an organic light-emitting device having excellent sealing characteristics against external environment and flexibility.Type: ApplicationFiled: September 7, 2012Publication date: September 5, 2013Inventor: Jin-Woo Park
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Publication number: 20130230684Abstract: A vacuum insulation material includes a plurality of convex protrusions provided on a surface of a core material that is present inside of the bent vacuum insulation material when it is used in a bent state, and so that the core material on which the convex protrusions are provided in advance is inserted into an outer covering material and vacuum-sealed with the outer covering material. By reducing a contact area between the convex protrusions and an inner side surface of the outer covering material in contact with the surface on which the convex protrusions are provided, it is possible to reduce a frictional force between the core material and the outer covering material.Type: ApplicationFiled: April 18, 2013Publication date: September 5, 2013Applicant: Mitsubishi Electric CorporationInventors: Toshio SHINOKI, Shunkei SUZUKI
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Publication number: 20130228275Abstract: A method of processing a patch includes mounting the patch on a surface of a caul plate having at least one suction hole, and drawing a vacuum through the suction hole to maintain the patch in contact with the caul plate.Type: ApplicationFiled: April 19, 2013Publication date: September 5, 2013Applicant: The Boeing CompanyInventors: Megan N. Watson, Mary H. Vargas, Joel P. Baldwin
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Publication number: 20130230714Abstract: A novel vacuum forming technique is disclosed whereby unique leather-plastic sandwich materials may be formed into arbitrary shapes using a molding technique having similarities to the vacuum thermoforming and leather molding processes. The leather itself may be softened before applying a vacuum forming step by means of soaking in warm water. The vacuum step removes the water thus hardening the material.Type: ApplicationFiled: December 31, 2012Publication date: September 5, 2013Inventor: Roy LIRAN
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Patent number: 8524025Abstract: A mandrel for manufacturing a unitary seamless section of an aircraft fuselage comprises a thin lay-up mandrel element disposed onto the outer shell surface of an inner mandrel shell, forming a mandrel with a substantially continuous lay-up surface. A unitary pre-cured section of an aircraft fuselage is formed by laying up a plurality of resin impregnated skin fibers onto the mandrel's lay-up surface while the mandrel rotates.Type: GrantFiled: September 25, 2012Date of Patent: September 3, 2013Assignee: The Boeing CompanyInventors: Doan D. Pham, Mark W. Tollan
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Patent number: 8524369Abstract: The present invention provides a method for laminating a decorative metal film on a resin base material with excellent adhesion to the resin base material and with a sufficient gloss imparted to the decorative metal film, and a resin base material having a decorative metal film. The method laminates a polymeric planarizing film on the resin base material using a vapor deposition polymerization method, and then laminates the decorative metal film on the planarizing film.Type: GrantFiled: October 17, 2008Date of Patent: September 3, 2013Assignee: Ulvac, Inc.Inventors: Hagane Irikura, Daisuke Omori, Kaori Motegi, Ken Momono, Yusuke Hashimoto
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Patent number: 8524023Abstract: Methods and systems for an armor system are provided. The system includes a first face sheet and a shaped preform extending from the first face sheet. The preform includes a first edge proximate the first face sheet, a sidewall extending from the first edge to a flange extending substantially perpendicularly from the sidewall. The preform circumscribes an area of the first face sheet. The system also includes a tile of armor material complementarily-shaped to fit within the area circumscribed by the preform. The tile is positioned within the preform such that at least a portion of the tile is between the first face sheet and the flange. The system includes a second face sheet covering the preform and the tile on a side opposite from the first face sheet.Type: GrantFiled: June 29, 2010Date of Patent: September 3, 2013Assignee: The Boeing CompanyInventor: Roger W. Engelbart
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Patent number: 8524028Abstract: An example method of sealing a laminate assembly includes preloading a laminate assembly having a plurality of laminations, pressurizing the laminate assembly, and pressurizing an enclosed volume disposed adjacent an end portion of the laminate assembly to hold the laminations in sealed positions.Type: GrantFiled: August 25, 2009Date of Patent: September 3, 2013Assignee: Hamilton Sundstrnad Space Systems International, Inc.Inventors: Robert G. Barnett, Jorge E. Hidalgo
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Publication number: 20130220537Abstract: A method of forming a fan blade includes the step of applying an adhesive layer around a leading edge of a fan blade body. The adhesive layer includes an adhesive film supported by a scrim cloth, and the adhesive layer contacts a portion of an inner surface of the fan blade body and a portion of an outer surface of the fan blade body. A leading edge sheath is positioned relative to the fan blade body such that a first flank and a second flank of the leading edge sheath is positioned over the portion of the inner surface and the portion of an outer surface, respectively, of the fan blade body. Pressure is applied to the first flank and the second flank of the leading edge sheath to secure the leading edge sheath to the blade body and curing the adhesive film.Type: ApplicationFiled: February 29, 2012Publication date: August 29, 2013Inventor: Michael Parkin
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Publication number: 20130220538Abstract: A dunnage platform is in the general shape of a rectangular slab with legs extending form one side. The dunnage platform is made from an expanded polystyrene core. A chemical combination process is used to chemically combine portion of the core proximal to its surface with high impact polystyrene. In a first of two parts of the combination process, the core is placed in a forming mold with one of its two sides and two thirds of its thickness extending therefrom. A heated sheet of high impact polystyrene is brought into contact with the portion of the core extending from the mold. In a similar manner, the other of the two sides of the core is made to extend from the forming mold for contact with a heated sheet of high impact polystyrene.Type: ApplicationFiled: April 6, 2013Publication date: August 29, 2013Applicant: AIRDEX INTERNATIONAL, INC.Inventor: AIRDEX INTERNATIONAL, INC.
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Publication number: 20130220539Abstract: A film-forming apparatus (100) and method capable of film lamination with superior evenness and good followability regardless of the size, shape and number of articles being laminated.Type: ApplicationFiled: October 26, 2011Publication date: August 29, 2013Applicant: 3M INNOVATIVE PROPERTIES COMPANYInventors: Takashi Takenouchi, Hideki Serizawa
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Publication number: 20130223037Abstract: A base member includes a mounting area where an electronic component can be mounted and a ring-shaped sealing surface surrounding the area as the area is viewed in a plan view. A sealing member is fixed on the sealing surface. A through-hole portion which is a recess partitioned by a wall surface of the sealing member and which connects the mounting area and an outer peripheral side of the sealing surface as viewed in a plan view is provided on the sealing surface. A manufacturing method for an electronic device using this base member is also provided.Type: ApplicationFiled: February 22, 2013Publication date: August 29, 2013Applicant: SEIKO EPSON CORPORATIONInventor: SEIKO EPSON CORPORATION
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Publication number: 20130220536Abstract: A method of forming a fan blade includes the steps of applying an adhesive to an inner surface of a cover and moving a toothed instrument along the inner surface of the cover to spread the adhesive over the inner surface of the cover to form a plurality of rows of adhesive on the inner surface of the cover. The method further includes the steps of applying the inner surface of the cover to a fan blade body and curing the adhesive to secure the cover to the fan blade body.Type: ApplicationFiled: February 29, 2012Publication date: August 29, 2013Inventors: Michael Parkin, Christopher J. Hertel
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Publication number: 20130213570Abstract: There is provided a manufacturing method for a composite body of a continuous sheet associated with an absorbent article, the composite body being manufactured by attaching a single-cut sheet to the continuous sheet at a predetermined attachment pitch.Type: ApplicationFiled: August 22, 2011Publication date: August 22, 2013Inventors: Miwa Iida, Osamu Ishikawa
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Patent number: 8512502Abstract: Plastic microfluidic structures having a substantially rigid diaphragm that actuates between a relaxed state wherein the diaphragm sits against the surface of a substrate and an actuated state wherein the diaphragm is moved away from the substrate. As will be seen from the following description, the microfluidic structures formed with this diaphragm provide easy to manufacture and robust systems, as well readily made components such as valves and pumps.Type: GrantFiled: July 23, 2012Date of Patent: August 20, 2013Assignee: Rheonix, Inc.Inventors: Lincoln C. Young, Peng Zhou
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Patent number: 8512505Abstract: Implementations of the present invention relate aesthetically pleasing decorative architectural resin panels having a thin or brittle veneer layer, such as thinly sliced natural wood or stone. In particular, at least one implementation includes a flat or curved decorative resin panel made with a natural wood veneer layer whose structural integrity has been maintained despite being subject to various heats and pressures. The resulting resin panel is at least partially translucent, and allows for a unique display both of the resin sheets used to form the panel and of the thin wood materials encapsulated therein. Additional implementations relate to the use of other brittle veneer layers, such as translucent stone, translucent metals, or the like, which also provide unique, decorative architectural, aesthetic features.Type: GrantFiled: February 11, 2010Date of Patent: August 20, 2013Assignee: 3form, Inc.Inventors: Ruben Suare, Kriby V. Rea, Raymond L. Goodson, R. Talley Goodson
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Publication number: 20130208239Abstract: A process for manufacturing a polarized optical device and the resulting optical device. In the process, an optical device is coated with an adhesive. A PVA polarizing film is moistened to render it formable. The PVA polarizing film is laminated on to the adhesive coating so that the PVA polarizing film forms to the shape of the optical device. The film, adhesive, device ensemble is then heat annealed. The PVA polarizing film is then contacted with a boric acid solution to crosslink the PVA so that it can withstand use and further processing. A polarized optical device includes an adhesive disposed between an optical base element and a PVA polarizing film.Type: ApplicationFiled: February 15, 2012Publication date: August 15, 2013Inventors: Peiqi Jiang, Bruce Keegan
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Publication number: 20130207131Abstract: An organic light-emitting display device including a substrate; a sealing sheet, which covers the substrate; a getter, which is interposed between at least a portion of the substrate and the sealing sheet; and an adhesive layer comprising an adhesive, which bonds the sealing sheet onto the substrate, wherein a getter-housing groove is in surfaces of the sealing sheet and the adhesive layer facing the substrate, and the getter is located in the getter-housing groove.Type: ApplicationFiled: August 16, 2012Publication date: August 15, 2013Inventor: Ho-Young Jeong
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Patent number: 8507097Abstract: A multilayer film comprises a layer consisting essentially of a fluorinated copolymer resin and a layer consisting essentially of an ethylene copolymer ionomer blend. The ethylene copolymer ionomer blend, or the product of crosslinking the blend, can be used as an encapsulant layer for solar cells, and the multilayer film is useful as a component of photovoltaic modules. Methods for preparing the multilayer films and the photovoltaic modules are also described.Type: GrantFiled: December 21, 2010Date of Patent: August 13, 2013Assignee: E I du Pont de Nemours and CompanyInventors: Penny L. Perry, George Wyatt Prejean, Sam Louis Samuels
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Publication number: 20130199721Abstract: A consolidation device has a dispensing assembly configured to dispense a composite precursor material onto a surface of a mould, and a first nozzle assembly configured to direct a fluid stream onto the free surface of the dispensed composite precursor material. The use of a fluid flow to consolidate the dispensed composite precursor material onto the surface of the mould makes the device simpler, more cost effective and causes less damage to the surface of the composite article.Type: ApplicationFiled: January 23, 2013Publication date: August 8, 2013Applicant: ROLLS-ROYCE PLCInventor: Rolls-Royce PLC
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Publication number: 20130203218Abstract: A composite is produced by providing a first and a second joining partner, a connecting means, a sealing means, a reactor having a pressure chamber, and a heating element. The two joining partners and the connecting means are arranged in the pressure chamber such that the connecting means is situated between the first joining partner and the second joining partner. A gas-tight region is then produced, in which the connecting means is arranged. Afterward, a gas pressure of at least 20 bar is produced in the pressure chamber outside the gas-tight region. The gas pressure acts on the gas-tight region and presses the first joining partner, the second joining partner and the connecting means together. The joining partners and the connecting means are then heated by means of the heating element to a predefined maximum temperature of at least 210° C. and then cooled.Type: ApplicationFiled: August 10, 2012Publication date: August 8, 2013Applicant: INFINEON TECHNOLOGIES AGInventors: Reinhold Bayerer, Olaf Hohlfeld
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Publication number: 20130199701Abstract: An optical waveguide is provided comprising a non-solid core layer surrounded by a solid-state material, wherein light can be transmitted with low loss through the non-solid core layer. A vapor reservoir is in communication with the optical waveguide. One implementation of the invention employs a monolithically integrated vapor cell, e.g., an alkali vapor cell, using anti-resonant reflecting optical waveguides, or ARROW waveguides, on a substrate.Type: ApplicationFiled: January 30, 2013Publication date: August 8, 2013Applicants: BRIGHAM YOUNG UNIVERSITY, THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: The Regents of the University of California, Brigham Young University